WO2014048539A1 - Procédé et dispositif de découpe par sublimation d'une pièce métallique - Google Patents

Procédé et dispositif de découpe par sublimation d'une pièce métallique Download PDF

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Publication number
WO2014048539A1
WO2014048539A1 PCT/EP2013/002641 EP2013002641W WO2014048539A1 WO 2014048539 A1 WO2014048539 A1 WO 2014048539A1 EP 2013002641 W EP2013002641 W EP 2013002641W WO 2014048539 A1 WO2014048539 A1 WO 2014048539A1
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WO
WIPO (PCT)
Prior art keywords
laser beam
kerf
workpiece
cutting
cut
Prior art date
Application number
PCT/EP2013/002641
Other languages
German (de)
English (en)
Inventor
Andreas Popp
Original Assignee
Trumpf Werkzeugmaschinen Gmbh + Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Werkzeugmaschinen Gmbh + Co. Kg filed Critical Trumpf Werkzeugmaschinen Gmbh + Co. Kg
Publication of WO2014048539A1 publication Critical patent/WO2014048539A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a method for vapor pressure cutting of a metallic workpiece by means of a laser beam.
  • the invention also relates to an apparatus for vapor pressure cutting of a metallic workpiece, comprising: a machining head for moving a laser beam relative to the workpiece over the workpiece surface along a cutting contour and for focusing the laser beam at a focus position, and a control unit for controlling repeated movement of the laser beam along the
  • the laser beam is usually moved by moving a laser processing head over the workpiece.
  • the laser beam is focused on the workpiece to be machined, wherein the machining head is usually close to the surface of the workpiece to be machined.
  • the workpiece is melted by the energy or power of the laser radiation.
  • the formed melt is expelled downwards out of the kerf by means of cutting gas emerging from the nozzle of the machining head.
  • This process also referred to as vapor-pressure cutting, is carried out at comparatively high relative speeds between the laser beam and the workpiece to be machined (i.e., high feed rates), since high relative feed rates cause the feed rate to increase
  • the laser beam is typically moved over the workpiece using scanner optics.
  • the processing head or scanner head because of the unnecessary cutting gas in be positioned relatively large distance from the workpiece, which is also referred to as remote cutting.
  • vapor pressure removal cutting is generally not sufficient to drive off a desired cutting contour once and for all to effect complete cutting of the workpiece at the cutting contour. Therefore, the laser beam is repeatedly moved through the scanner optics along the desired cutting contour, so that a successive workpiece removal takes place until the workpiece is severed.
  • the lasers used for the vapor pressure cutting are usually in the
  • Laser radiation required which can be achieved for example by means of a disk laser or a fiber laser.
  • expelled melt typically comes to rest in the immediate vicinity of the cutting edge on top of the workpiece and solidifies there. This causes the formation of a generally undesirable burr on the workpiece surface.
  • the processing parameters of the process for example the
  • Modified processing parameters of the first phase to achieve a remelting and / or a material removal at the edges of the kerf.
  • From DE 101 33 341 A1 is also a method for the automated production of a groove-shaped cut in the surface of a hard material, such as
  • bone tissue known.
  • Cutting depths should be used according to the teaching specified therein, a laser beam, which is automatically refocused to the appropriate depth of cut.
  • Widening of the cut is proposed widen the width of the cut by a movement of the focus vertically to the cutting axis, for example, by the beam is repeatedly adjusted when repeatedly sweeping the cutting contour perpendicular to a cutting axis.
  • EP 1 353 773 B1 is a method for laser milling with pulsed
  • Laser sources have become known. By laser milling holes can be introduced into a workpiece, which may have different shape.
  • the holes are made by repeatedly removing workpiece material in multiple layers or ablation steps.
  • the diameter of the ablation during the removal of a respective layer takes place according to a given specification, which takes into account the outer diameter of the hole and the angle of the inner contour of the hole to the workpiece surface.
  • US 7 194 803 B2 discloses the introduction of a micro-topography into a surface of a sealing ring by means of a pulsed laser without formation of melt.
  • a laser beam is used, which repeatedly removes material along a beam path in order to increasingly increase the depth of the structure to be introduced.
  • vapor pressure erosion cutting is used so far only for relatively thin workpieces.
  • the limit for the use of vapor pressure cutting is currently, for example, when using a 5 kW Grundmode- laser with sheet thicknesses of about 2 mm.
  • a method for vapor pressure cutting of a metallic workpiece comprising: generating a kerf in the workpiece by moving a focused laser beam and the workpiece relative to each other along a cutting contour, wherein
  • Cutting edge edge portions of the cutting surface remain, on which formed workpiece melt is generated when creating the other kerf.
  • a step-shaped or terraced kerf cross-section is achieved.
  • This kerf cross-section has, between two kerfs produced in successive steps, an edge-side section (corresponding to the horizontal section of a (stair) step) on which the workpiece melt can be deposited, ie the cutting base remaining on a respective edge-side section forms a storage place for Workpiece melt, which is formed or expelled during the production of a further kerf in a subsequent step.
  • a further advantage of the method according to the invention is that the melt ejection or the burr formation on the upper side of the workpiece to be separated is comparatively small, since most of the melt ejection is deposited on the marginal sections of a respective cutting substrate and not on the workpiece surface itself.
  • Focus diameter of e.g. 92 pm and a sheet thickness of 2 mm by introducing a first and second kerf already to achieve a separation of the sheet.
  • Focus diameter of e.g. 92 pm and a sheet thickness of 2 mm by introducing a first and second kerf already to achieve a separation of the sheet.
  • the first kerf When cutting a workpiece with a thickness of three or more Cut lines must be introduced, is basically to be considered that the first kerf must have a minimum width, which allows the successive production of further kerfs to form a marginal portion of the respective remaining Thomasgroundes.
  • the minimum width of the first kerf can be selected from machining parameters of the laser and the
  • the processing parameters include, for example, properties of the material to be cut (e.g., properties of the material to be cut (e.g., properties of the material to be cut).
  • Absorptivity, surface condition, thickness, thermal conductivity if appropriate, the laser power, the focus diameter, the feed rate and the resulting penetration depth of the laser beam (with appropriate
  • Workpiece is completely severed, typically has a width, as in the single (or possibly repeated) moving the laser beam and the
  • Workpiece is generated relative to each other along the cutting contour without transverse offset.
  • the width of this kerf is greater than that
  • Workpiece introduced kerfs have a greater width than the last kerf and are generated by the introduction of several parallel staggered cuts or movements between the workpiece and the laser beam.
  • a transverse offset in repeatedly moving the laser beam and the workpiece relative to each other along the sectional contour is smaller than a focus diameter of the laser beam, i. the repeated movement is overlapping.
  • the transverse offset is between one third and two thirds, in particular at about half of the focus diameter of
  • the kerf is produced at a first focus position in the propagation direction of the laser beam and Generating the further kerf takes place at a second, different from the first focus position in the propagation direction of the laser beam.
  • Focusing device e.g. a focusing lens, done to the workpiece. If the tracking of the focus position is carried out at large sheet thicknesses without the introduction of kerf-shaped kerfs, the laser becomes
  • the further kerf is produced centrally in the (previous) kerf.
  • a symmetrical kerf cross-section results with equally large edge-side sections for depositing the workpiece melt on both sides of the plane of symmetry. This leads to a typical identical quality of the cut surfaces on the formed during the cutting of the workpiece workpiece parts.
  • the kerfs have a
  • Laser beam corresponds. With an intersection depth that is on the order of one to three Rayleighinn of the laser beam used, the vapor pressure and the induced by the jet feed melt dynamics is typically able to expel the workpiece melt from the respective kerf.
  • the (radially acting) kinetic energy of the workpiece melt produced by the evaporation is in this case greater than the potential energy which must be applied to overcome this depth of cut, so that the
  • the Rayleigh length is the distance along the optical axis (propagation direction) of the laser beam, after which the cross-sectional area of the laser beam doubles from its focus position.
  • a variant of the method is preferred in which a width of an edge-side section of the remaining cut surface is less than the focus diameter of the laser beam used (see above), for example, if the additional kerf is offset transversely to the preceding kerf by approximately half the focus diameter. At a width of a peripheral portion, which is within this interval, on the one hand, the amount of workpiece melt, the
  • the width of the peripheral portions is so small that usually no reworking of the cut must be made.
  • the focused laser beam with a power density of at least 1 x 10 7 W / cm 2 at the focus position and a feed rate between 150 m / min and 1200 m / min is directed to the surface of the workpiece to be machined.
  • a second aspect of the invention is realized in a device for
  • Control unit is designed or programmed to move the laser beam by means of the machining head during repeated movement along the cutting contour transverse to the cutting contour or transverse to the feed direction so that a transverse offset of the laser beam is smaller than the focus diameter of the laser beam.
  • Control unit uses for this purpose on a stored in the control unit machining program, which is processed during the vapor pressure Abtragbodies. It is favorable if the control unit controls the processing head or the corresponding optics so that the focused laser beam with a power density of at least 1 ⁇ 10 7 W / cm 2 at the Focusing position and a feed rate between 150 m / min and 1200 m / min is directed to the surface of the workpiece to be machined.
  • control unit is designed or programmed to move the laser beam with the aid of the machining head relative to the workpiece surface such that the generation of the kerf at a first focus position in the propagation direction of the.
  • Laser beam takes place and generating the further kerf at a second, different from the first focus position in the propagation direction of the laser beam, wherein the distance of the first focus position to the second focus position in
  • Propagation direction of the laser beam is preferably between 1 times and 6 times the Rayleigh length of the laser beam.
  • the distance between the respective focus positions typically corresponds to the kerf depth (i.e., 1 times to 3 times the Rayleigh length), but may also be twice the amount, i.e., 2 times. between 2 times and 6 times the Rayleigh length.
  • the apparatus additionally comprises a laser for generating the laser beam with a beam parameter product of 0.3 mm mrad to 3 mm mrad.
  • a laser for generating the laser beam with a beam parameter product of 0.3 mm mrad to 3 mm mrad.
  • Fig. 2a, b are schematic representations of two process steps of a
  • FIG. 3 shows a schematic representation of a thick workpiece severed by means of the method described with reference to FIGS. 2a, b, and FIG
  • Fig. 4 is a schematic representation of a scanner device for
  • Fig. 1a shows a cutting treatment with a conventional vapor pressure Abtragschneidmaschine on a comparatively thick to be cut metallic workpiece 1, which has a thickness D of about 2 mm in the present example.
  • a focused laser beam 2 is moved along a feed direction Y of an XYZ coordinate system relative to the workpiece 1, whereby a kerf 4 with a cutting base 5 and lateral flanks 4a, b is produced.
  • the workpiece 1 is to be cut with a straight cut, i. the cutting contour to be formed runs along the feed direction Y (and over a predetermined cutting length).
  • Fig. 1b the workpiece 1 of Fig. 1a is shown at a later time, in which the laser beam 2 has been moved several times along the feed direction to increase the depth of the kerf 4. Since the thickness D of the to be cut
  • Laser beam 2 decreases on the cutting surface 5, whereby the vapor pressure is reduced. This can lead to a complete cessation of the vapor pressure cutting process.
  • the maximum achievable cutting depth T is limited by the effects described above, so that with the conventional vapor pressure cutting only workpieces 1 with a certain maximum thickness (typically 1 mm max) can be severed.
  • FIG. 2a shows a first method step of an improved vapor pressure removal cutting method in which a first, wide (initial) kerf 9 in a workpiece 1 by moving a focused laser beam 2 and the workpiece 1 relative to each other along a sectional contour (corresponding to the feed direction, Y- Direction) is generated.
  • the kerf 9 has a kerf depth T, which is typically between one and three times the Rayleigh length. This ensures that at the feed rates which are generally set during the vapor pressure cutting, the resulting vapor pressure and the melt dynamics induced by the feed are sufficient
  • the total width B1 of the first kerf 9 is wider than a width B3, which is obtained by moving the laser beam 2 one or more times along the
  • Feed direction Y or the sectional contour without lateral offset i.e., at the same position X transverse to the feed direction Y.
  • the laser beam 2 and the workpiece 1 are reciprocated relative to each other not only repeatedly along the feeding direction Y, but moreover, the position of the laser beam 2 in the X direction, i. offset transversely to the feed direction Y.
  • the laser beam 2 is first moved in the feed direction Y relative to the workpiece 1, whereby a kerf of width B3
  • Feed direction 3 (in Fig. 2a in the X direction) offset and again in
  • Feed direction Y parallel to the previous cut process (dashed laser beam 2 right next to it).
  • the kerf 9 has grown to the kerf width B4.
  • the movement of the laser beam 2 along the feed direction Y and the displacement of the laser beam 2 transversely to the feed direction Y or the parallel offset can be repeated until a predetermined total width B1 of the first kerf 9 is reached (see.
  • the transverse offset Q of the laser beam 2 (in the X-direction in FIG. 2a) is smaller than the cutting width B2 (the single-sectional width) generated by the laser beam 2 when moved once and is in particular smaller than a focal diameter dF of the laser beam 2, wherein typical values between about one third and two thirds, preferably at half the focus diameter dF of the laser beam 2 are.
  • Cross-offset Q is an overlap between successive movements of the laser beam 2 in the Y direction generated, which ensures that no protruding Burrs remain at the cutting base 5, so that a more uniform
  • Fig. 2b is a second step of the vapor pressure Abtragschneidmaschines
  • Laser beam 2 along the feed direction Y is generated.
  • the second kerf 10 is arranged centrally in comparison to the first kerf 9, whereby the entire kerf cross-section runs symmetrically to a median plane.
  • lateral flanks 9a, b of the first kerf 9 are offset with respect to lateral flanks 10a, b of the second kerf 10 so that edge-side sections 11a, b remain on a remaining cutting base 5 of the first kerf , which are used for depositing workpiece melt during the
  • the edge-side portions 1 1 a, b of the remaining Thomasgrundes 5 are the same size.
  • the depth of cut T of the second kerf 10 is chosen so that a melt ejection without sticking to the lateral flanks 10a, b is possible.
  • the cut joint depth T of the second kerf 10 can be selected to be slightly larger than the kerf depth T of the first kerf 9 (unlike in FIG. 2b).
  • width B of a peripheral portion 1 1 a, b transverse to the feed direction Y is equal to or less than the focus diameter of the laser beam 2, which is
  • the focus of the laser beam 2 is from a first focus position Fi in the propagation direction (negative Z direction), which is used for the Generating the first kerf 9 is used for generating the second kerf 10 on a second, shifted in the direction of workpiece 1 (deeper) focal position F 2 changed or tracked to ensure a high laser beam intensity at the Abtragsort at both kerfs 9, 10.
  • the distance between the first focus position Fi and the second focus position F 2 may be, for example, between 1 times (or 2 times) and 3 times (or 6 times) the
  • a total kerf or an overall section 9, 10 is introduced into the workpiece 1, wherein two step joints 9, 10 are sufficient to the workpiece 1 with the thickness of approx. 2 mm to cut. If the method steps according to FIG. 2 a and FIG. 2 b are repeated, thicker metal workpieces 1 can be cut through without the vapor pressure removal cutting process coming to a standstill, as shown in FIG. 1 b.
  • b is also the workpiece melt ejection, which occurs in the generation of the first kerf 9 on the top 7 of the workpiece 1, with increasing thickness D of
  • FIG. 3 shows a cross-section of a further workpiece 1 with a comparatively large thickness D of approximately 3 mm, wherein in the workpiece 1 a first, a second and a third kerf 9, 10, 12 according to the embodiment shown in FIG. b illustrated method has been generated.
  • the workpiece 1 from the laser beam 2 in two workpiece part 1 a, b is severed, i. it is just the last remaining remainder of the workpiece material on the underside of the workpiece 1 is removed.
  • FIG. 4 shows a scanner device 13 as part of a laser processing machine, with which the improved method can be carried out.
  • the interaction of the scanner mirrors 20, 21 with a F / theta lens 14 attached to the scanner device 13 makes it possible to adjust the focus of the laser beam 2 in order to produce a sectional contour 3 in two mutually perpendicular directions (X-).
  • X- mutually perpendicular directions
  • Y-direction over the workpiece 1 to move.
  • the workpiece 1 may be stationary or possibly with the aid of a non-illustrated
  • Workpiece support in one or two directions are moved in a plane parallel to the workpiece top 7.
  • the feed direction corresponds to the direction of the cut contour, but it is understood that curved cutting contours 3 with a variable feed direction can also be realized with the method described above , as indicated in Fig. 4, wherein a plurality of parallel offset to produce a wide kerf
  • Scanner device 13, more specifically, the machining head 19, can further be used to change the position of the focus of the laser beam 2 in the propagation direction (Z direction) perpendicular to the workpiece surface 7 and the top of the
  • plate-shaped workpiece to be moved, for example by means of a direction indicated by a double arrow conventional drive 15 or by means of a robot.
  • the scanner device 13 comprises an optical fiber for supplying radiation from a laser source 24, from which a high-energy divergent laser beam 2a
  • Beam output (> 1 kW) and a beam parameter product between about 0.3 mm mrad and about 3.0 mm mrad emerges, which extends in the vertical direction (Z direction) and by means of a collimating lens 17 in a further vertical
  • collimated laser beam 2b is transformed.
  • Laser beam 2b is deflected at a deflection mirror 18 by 90 ° from the vertical direction in the horizontal direction and enters via an entrance aperture in the
  • the collimated laser beam 2b first strikes a planar X-scanner mirror 20, which deflects the beam in the X-direction onto a planar Y-scanner mirror 21, which deflects the beam further in the Y-direction.
  • the X-scanner mirror 20 and the Y-scanner mirror 21 are attached to galvanometers and can be rotated. The position of the axis of rotation of the galvanometer determines the deflection angle of the respective scanner mirror 20, 21 and thus the position of the laser beam 2 on the workpiece 1.
  • the collimated laser beam 2b exits the scanner head 19 through a
  • Control unit 25 also elsewhere in the scanner device 13th
  • the control unit 25 controls the movement of the laser beam 2 over the surface 7 of the workpiece 1 to the desired
  • control unit 25 resorts to a machining program to which the control unit 25, e.g. has access via a data interface (not shown).
  • the control unit 25 is
  • Scanner mirror 20, 21 suitable controls and / or the displacement of the
  • Processing head 19 by means of the drive 15 and a robot causes.
  • the adjustment of the focus position described above can also be done by the
  • Control unit 25 may be made, for example by this a drive 15 controls to reduce the distance between the machining head 19 and the workpiece 1.
  • the focused laser beam 2 should have a power density of at least 1 ⁇ 10 7 W / cm 2 at the focus position.
  • Typical feed rates are between about 150 m / min and about 1200 m / min wherein the feed rate depends inter alia on the type of material to be cut. It is understood that the workpieces to be cut are generally plate-shaped, so that the cut contour (straight or curved) is typically in a plane. In principle, however, it is also possible to use the method described above to cut in curved

Abstract

L'invention concerne un procédé de découpe par sublimation d'une pièce métallique (1), comprenant les étapes suivantes : création d'une saignée (9) dans la pièce en déplaçant un rayon laser focalisé (2) et la pièce (1) l'un par rapport à l'autre en suivant un contour de découpe et, pour agrandir une largeur (B1) de la saignée (9), en déplaçant à plusieurs reprises le rayon laser (2) et la pièce (1) l'un par rapport à l'autre de manière décalée transversalement au contour de découpe (3) le long dudit contour de découpe (3) ; ainsi que création d'au moins une autre saignée (10) ayant une largeur (B2) réduite dans un fond de découpe (5) de la saignée (9) en déplaçant le rayon laser (2) focalisé et la pièce (1) l'un par rapport à l'autre le long du contour de découpe. Entre des flancs latéraux (9a, 9b) de la saignée (9) et des flancs latéraux (10a, 10b) décalés transversalement de l'autre saignée (10), il subsiste des segments marginaux (11a, 11b) du fond de découpe (5) sur lesquels se dépose la matière fondue formée lors de la création de l'autre saignée (10). L'invention concerne également un dispositif servant à mettre en œuvre le procédé.
PCT/EP2013/002641 2012-09-28 2013-09-03 Procédé et dispositif de découpe par sublimation d'une pièce métallique WO2014048539A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012217766.3 2012-09-28
DE102012217766.3A DE102012217766B4 (de) 2012-09-28 2012-09-28 Verfahren und Vorrichtung zum Dampfdruck-Abtragschneiden eines metallischen Werkstücks

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WO2014048539A1 true WO2014048539A1 (fr) 2014-04-03

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CN106653689A (zh) * 2016-12-26 2017-05-10 中国电子科技集团公司第五十五研究所 一种双脉冲频率激光分离复合SiC的方法
CN111151892A (zh) * 2018-11-08 2020-05-15 中国科学院西安光学精密机械研究所 一种无锥度激光切割方法
WO2020225448A1 (fr) * 2019-05-08 2020-11-12 Wsoptics Technologies Gmbh Procédé d'usinage par faisceau d'une pièce
CN113646124A (zh) * 2019-02-25 2021-11-12 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
TWI834247B (zh) 2022-08-11 2024-03-01 大陸商業成光電（深圳）有限公司 雷射切割方法

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DE102021211177A1 (de) 2021-10-04 2023-04-06 Volkswagen Aktiengesellschaft Verfahren zur Herstellung von Elektroden für Akkumulatorzellen, Vorrichtung zur Herstellung von Elektroden für Akkumulatorzellen und Akkumulator

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CN106653689A (zh) * 2016-12-26 2017-05-10 中国电子科技集团公司第五十五研究所 一种双脉冲频率激光分离复合SiC的方法
CN106653689B (zh) * 2016-12-26 2019-09-10 中国电子科技集团公司第五十五研究所 一种双脉冲频率激光分离复合SiC的方法
CN111151892A (zh) * 2018-11-08 2020-05-15 中国科学院西安光学精密机械研究所 一种无锥度激光切割方法
CN113646124A (zh) * 2019-02-25 2021-11-12 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN113646124B (zh) * 2019-02-25 2022-09-27 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
WO2020225448A1 (fr) * 2019-05-08 2020-11-12 Wsoptics Technologies Gmbh Procédé d'usinage par faisceau d'une pièce
CN113874157A (zh) * 2019-05-08 2021-12-31 Ws光学技术有限责任公司 用于工件的射束加工的方法
TWI834247B (zh) 2022-08-11 2024-03-01 大陸商業成光電（深圳）有限公司 雷射切割方法

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