WO2014047985A1 - Earphone sheath shaping mould assembly - Google Patents

Earphone sheath shaping mould assembly Download PDF

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Publication number
WO2014047985A1
WO2014047985A1 PCT/CN2012/082974 CN2012082974W WO2014047985A1 WO 2014047985 A1 WO2014047985 A1 WO 2014047985A1 CN 2012082974 W CN2012082974 W CN 2012082974W WO 2014047985 A1 WO2014047985 A1 WO 2014047985A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal ring
earphone
mold
assembly according
earphone sleeve
Prior art date
Application number
PCT/CN2012/082974
Other languages
French (fr)
Chinese (zh)
Inventor
曹斌华
Original Assignee
东莞市瑞昶塑胶泡棉有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞市瑞昶塑胶泡棉有限公司 filed Critical 东莞市瑞昶塑胶泡棉有限公司
Publication of WO2014047985A1 publication Critical patent/WO2014047985A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating

Definitions

  • the utility model relates to the technical field of moulds, in particular to an earphone sleeve fixing mould component.
  • Headphones have been widely used in our daily life. Listening to music, voice calls, English listening tests, noise reduction, ear safety protection, etc. are all inseparable from headphones.
  • In-ear headphones generally use in-ear earphones to avoid the earphone casing. The hard object directly contacts the ear to cause discomfort to the user, and other earphones are generally equipped with a earphone sleeve on the earphone casing.
  • Chinese Patent Application No. 200920052185.5 discloses a headphone sleeve production mold assembly, which solves the positioning problem in the manufacturing process of some earphone sleeves, but the metal ring used in the mold assembly has no protrusions, the mold frame has no positioning column, and no groove. Position, no formwork cover, no cover through hole, can not meet the needs of making other special earphone sets.
  • the purpose of the utility model is to provide an earphone sleeve fixing mold assembly for the deficiencies of the prior art, and the utility model solves the problem that the surface of the earphone sleeve is easy to wrinkle and high loss in the process of manufacturing the earphone sleeve, and can improve the productivity and the yield rate. .
  • an earphone sleeve fixing mold assembly of the present invention comprises a high frequency hot press and a mold assembly, and the mold assembly comprises a pressing plate, a core, a metal ring, a mold frame and a cover plate, and the cover plate is arranged
  • the metal ring is sleeved in the mold frame, the core is disposed in the metal ring, and the pressure plate is disposed above the mold frame and detachably connected to the high frequency hot press.
  • the mold frame is provided with a first slot for accommodating the metal ring.
  • the cover plate is provided with a cover through hole.
  • the cover is detachably connected to the mold base.
  • the first slot is provided with a positioning post corresponding to the inner hole of the earphone sleeve semi-finished product, and the core is provided with a through hole corresponding to the positioning post.
  • the metal ring is provided with a plurality of protrusions which are annularly arranged along the outer side of the metal ring.
  • the outer side of the metal ring is provided with two sets of annular array of protrusions.
  • the shape of the core and the metal ring is annular, circular, elliptical or square.
  • the pressure plate is provided with a second slot for accommodating the positioning post.
  • the utility model has the beneficial effects that: the earloop material of the earphone sleeve is first placed in the first slot, the metal ring of the wrapped material is sleeved in the first slot of the mold frame, and then the earphone sleeve material is sleeved on the positioning pillar.
  • the mold cover is closed, and then the core is placed. After the final plate is connected with the high frequency machine, the pressure is directed to the mold frame. After the pressing is completed, the semi-finished product is taken out and the next process is performed.
  • Figure 1 is a schematic view of the structure of the present invention.
  • Figure 2 is a schematic view of the exploded structure of the present invention.
  • Figure 3 is a schematic view of the structure of the mold frame of the present invention.
  • Figure 4 is a schematic view showing the structure of the cover of the present invention.
  • Figure 5 is a schematic view showing the structure of the core of the present invention.
  • Figure 6 is a schematic view of the metal ring structure of the present invention.
  • Figure 7 is a right side view of the metal ring of the present invention.
  • Figure 8 is a schematic view showing the structure of the pressure plate of the present invention.
  • the mold assembly includes a press plate 4, a core 2, a metal ring 3, a mold frame 1 and a cover plate 5, and the cover plate 5 is disposed on the mold.
  • the metal ring 3 is sleeved in the mold base 1
  • the core 2 is disposed in the metal ring 3
  • the pressure plate 4 is disposed above the mold frame 1 and a high-frequency hot press Removable connection.
  • the mold frame 1 is provided with a first slot 12 for accommodating the metal ring 3.
  • the earphone sleeve bottom material is placed in the first slot 12, and the metal ring 3 of the wrapped material is sleeved.
  • the cover plate 13 is closed, and then the core 2 is placed.
  • the pressure plate 4 is connected to the high frequency machine and pressed toward the mold frame 1. After the pressing is completed, the semi-finished product is taken out, and the next process is performed.
  • the cover plate 5 is provided with a cover through hole 54.
  • the cover plate 13 is detachably connected to the mold frame 1.
  • the first slot 12 is provided with a positioning post 11 corresponding to the inner hole of the earphone sleeve
  • the core 2 is provided with a through hole 21 corresponding to the positioning post 11, and the metal ring is 3 Socketed in the mold base 1, put the earphone cover material, and then put the core 2 into the metal ring 3, and the positioning post 11 passes through the through hole 21 to prevent the core 2 from shifting during hot pressing.
  • the metal ring 3 is provided with a plurality of protrusions 31, and the plurality of protrusions 31 are arranged along the outer side of the metal ring 3 in an annular array, and the earphone sleeve material is sleeved according to the corresponding opening surface of the material surface.
  • the protrusion 31 on the metal ring 3, the opening position of the surface of the earphone cover material is corresponding to the protrusion 31 and is cut in advance, so as to effectively control the wrinkles on the surface of the earphone cover, and at the same time reduce the loss and improve Capacity and promote the beauty of the product.
  • the outer side of the metal ring 3 is provided with two sets of annular array of protrusions 31, which reduces wrinkles, reduces losses, and increases productivity during the manufacturing process of the earphone sleeve.
  • the shape of the core 2 and the metal ring 3 is annular, circular, elliptical or square, and the core 2 and the metal ring 3 have corresponding shapes.
  • the pressure plate 4 is provided with a second slot 41 for accommodating the positioning post 11.
  • the pressure plate 4 is pressed against the mold frame 1, and the positioning column 11 is received in the second slot 41.

Abstract

An earphone sheath shaping mould assembly comprises a high frequency hot press machine and a mould assembly. The mould assembly comprises a pressure plate (4), a mould kernel (2), a metal ring (3), a mould base (1), and a cover plate (5). The cover plate (5) is disposed above the mould base (1), the metal ring (3) is fitted into the mould base (1), the mould kernel (2) is arranged in the metal ring (3), and the pressure plate (4) is disposed above the mould base (1) and is detachably connected to the high frequency hot press machine. The earphone sheath shaping mould assembly resolves the problems of earphone sheath surface crumpling and high loss during the existing earphone sheath manufacturing process and can improve the productivity and yield.

Description

耳机套定型模具组件  Headphone sleeve shaping mold assembly
技术领域 Technical field
本实用新型涉及模具技术领域， 尤其涉及耳机套定型模具组件。  The utility model relates to the technical field of moulds, in particular to an earphone sleeve fixing mould component.
背景技术 Background technique
耳机已经被广泛地应用到我们的日常生活当中， 听音乐、 语音通话、 英语听力考试、 降噪、 耳部安全防护等等都离不开耳机， 入耳式耳机一般 用入耳式耳塞来避免耳机外壳之硬物直接与耳部接触造成使用者不适， 其 他耳机一般会在耳机外壳上装配有耳机套。  Headphones have been widely used in our daily life. Listening to music, voice calls, English listening tests, noise reduction, ear safety protection, etc. are all inseparable from headphones. In-ear headphones generally use in-ear earphones to avoid the earphone casing. The hard object directly contacts the ear to cause discomfort to the user, and other earphones are generally equipped with a earphone sleeve on the earphone casing.
中国专利申请号 200920052185.5公布了一种耳机套生产模具组件， 解 决了部份耳机套制作过程中的定位问题， 但是该模具组件所用的金属环无 凸起物、 其模架无定位柱、 无槽位、 无模架盖板、 无盖板通孔， 无法满足 制作其它特殊耳机套的需求。  Chinese Patent Application No. 200920052185.5 discloses a headphone sleeve production mold assembly, which solves the positioning problem in the manufacturing process of some earphone sleeves, but the metal ring used in the mold assembly has no protrusions, the mold frame has no positioning column, and no groove. Position, no formwork cover, no cover through hole, can not meet the needs of making other special earphone sets.
实用新型内容 Utility model content
本实用新型的目的在于针对现有技术的不足提供一种耳机套定型模具 组件， 本实用新型解决现有耳机套制作过程中耳机套表面容易皱折及高损 耗的问题并可提高产能及良品率。  The purpose of the utility model is to provide an earphone sleeve fixing mold assembly for the deficiencies of the prior art, and the utility model solves the problem that the surface of the earphone sleeve is easy to wrinkle and high loss in the process of manufacturing the earphone sleeve, and can improve the productivity and the yield rate. .
为实现上述目的， 本实用新型的一种耳机套定型模具组件， 包括高周 波热压机及模具组件， 所述模具组件包括压板、 模芯、 金属环、 模架及盖 板， 所述盖板设置于模架的上方， 所述金属环套接于所述模架内， 所述模 芯安置于金属环内， 所述压板设置于所述模架的上方与高周波热压机可拆 卸连接。 作为优选， 所述模架设置有容置金属环的第一槽位。 In order to achieve the above object, an earphone sleeve fixing mold assembly of the present invention comprises a high frequency hot press and a mold assembly, and the mold assembly comprises a pressing plate, a core, a metal ring, a mold frame and a cover plate, and the cover plate is arranged The metal ring is sleeved in the mold frame, the core is disposed in the metal ring, and the pressure plate is disposed above the mold frame and detachably connected to the high frequency hot press. Preferably, the mold frame is provided with a first slot for accommodating the metal ring.
作为优选， 所述盖板设置有盖板通孔。  Preferably, the cover plate is provided with a cover through hole.
作为优选， 所述盖板与模架可拆卸连接。  Preferably, the cover is detachably connected to the mold base.
作为优选， 所述第一槽位设置有与耳机套半成品内孔相对应的定位柱， 所述模芯开设有与所述定位柱相对应的通孔。  Preferably, the first slot is provided with a positioning post corresponding to the inner hole of the earphone sleeve semi-finished product, and the core is provided with a through hole corresponding to the positioning post.
作为优选， 所述金属环设置有若干个凸起物， 该若干个凸起物沿所述 金属环外侧面环形阵列。  Preferably, the metal ring is provided with a plurality of protrusions which are annularly arranged along the outer side of the metal ring.
作为优选， 所述金属环的外侧面设置有两组环形阵列的凸起物。  Preferably, the outer side of the metal ring is provided with two sets of annular array of protrusions.
作为优选， 所述模芯、 金属环的形状为环状、 圆形、 椭圆形或方形。 作为优选， 所述压板开设有容置定位柱的第二槽位。  Preferably, the shape of the core and the metal ring is annular, circular, elliptical or square. Preferably, the pressure plate is provided with a second slot for accommodating the positioning post.
本实用新型的有益效果： 先将耳机套扣底材料放入第一槽位， 再将包 好材料的金属环套接于模架的第一槽位， 然后在定位柱上套入耳机套材料， 闭合模架盖板， 再放入模芯， 最后压板与高周波机连接后、 压向模架方向； 压制完成后， 取出半成品， 再进行下一道工序。  The utility model has the beneficial effects that: the earloop material of the earphone sleeve is first placed in the first slot, the metal ring of the wrapped material is sleeved in the first slot of the mold frame, and then the earphone sleeve material is sleeved on the positioning pillar. The mold cover is closed, and then the core is placed. After the final plate is connected with the high frequency machine, the pressure is directed to the mold frame. After the pressing is completed, the semi-finished product is taken out and the next process is performed.
附图说明 DRAWINGS
图 1为本实用新型结构示意图。  Figure 1 is a schematic view of the structure of the present invention.
图 2为本实用新型分解结构示意图。  Figure 2 is a schematic view of the exploded structure of the present invention.
图 3为本实用新型模架结构示意图。  Figure 3 is a schematic view of the structure of the mold frame of the present invention.
图 4为本实用新型盖板的结构示意图。  Figure 4 is a schematic view showing the structure of the cover of the present invention.
图 5为本实用新型模芯结构示意图。  Figure 5 is a schematic view showing the structure of the core of the present invention.
图 6为本实用新型金属环结构示意图。  Figure 6 is a schematic view of the metal ring structure of the present invention.
图 7为本实用新型金属环右视图。 图 8为本实用新型压板结构示意图。 Figure 7 is a right side view of the metal ring of the present invention. Figure 8 is a schematic view showing the structure of the pressure plate of the present invention.
附图标记包括：  The reference numerals include:
1一模架 11 定位柱 12—第一槽位 2—模芯 21—通孔 3—金 属环 31 凸起物 4一压板 41一第二槽位 5—盖板  1 a mold base 11 positioning post 12—first slot 2—core 21—through hole 3—metal ring 31 protrusion 4 a pressure plate 41 a second slot 5—cover
54—盖板通孔。  54—Cover through hole.
具体实施方式 detailed description
以下结合附图对本实用新型进行详细的描述。  The present invention will be described in detail below with reference to the accompanying drawings.
如图 1至图 8所示， 包括高周波热压机及模具组件,所述模具组件包括 压板 4、 模芯 2、 金属环 3、 模架 1及盖板 5， 所述盖板 5设置于模架 1的 上方， 所述金属环 3套接于所述模架 1内， 所述模芯 2安置于金属环 3内， 所述压板 4设置于所述模架 1的上方与高周波热压机可拆卸连接。  As shown in FIGS. 1 to 8, a high-frequency hot press and a mold assembly are included. The mold assembly includes a press plate 4, a core 2, a metal ring 3, a mold frame 1 and a cover plate 5, and the cover plate 5 is disposed on the mold. Above the frame 1, the metal ring 3 is sleeved in the mold base 1, the core 2 is disposed in the metal ring 3, and the pressure plate 4 is disposed above the mold frame 1 and a high-frequency hot press Removable connection.
本实施例压板 4与高周波机连接后， 通过盖板 5压向所述模架 1方向。 本实施例中， 所述模架 1设置有容置金属环 3的第一槽位 12， 先将耳 机套扣底材料放入第一槽位 12， 再将包好材料的金属环 3套接于模架的第 一槽位 12， 闭合盖板 13， 再放入模芯 2， 最后压板 4与高周波机连接后压 向模架 1方向， 压制完成后， 取出半成品， 再进行下一道工序。  After the pressure plate 4 of the embodiment is connected to the high frequency machine, it is pressed toward the mold frame 1 by the cover plate 5. In this embodiment, the mold frame 1 is provided with a first slot 12 for accommodating the metal ring 3. First, the earphone sleeve bottom material is placed in the first slot 12, and the metal ring 3 of the wrapped material is sleeved. In the first slot 12 of the mold frame, the cover plate 13 is closed, and then the core 2 is placed. Finally, the pressure plate 4 is connected to the high frequency machine and pressed toward the mold frame 1. After the pressing is completed, the semi-finished product is taken out, and the next process is performed.
本实施例中， 所述盖板 5设置有盖板通孔 54。  In this embodiment, the cover plate 5 is provided with a cover through hole 54.
本实施例中， 所述盖板 13与模架 1可拆卸连接。  In this embodiment, the cover plate 13 is detachably connected to the mold frame 1.
本实施例中， 所述第一槽位 12设置有与耳机套半成品内孔相对应的定 位柱 11， 所述模芯 2开设有与所述定位柱 11相对应的通孔 21， 将金属环 3 套接于模架 1内， 放入耳机套材料， 再将模芯 2放入金属环 3内， 定位柱 11从通孔 21穿出， 防止热压时模芯 2偏移。 本实施例中， 所述金属环 3设置有若干个凸起物 31， 该若干个凸起物 31沿所述金属环 3外侧面环形阵列， 将耳机套材料按材料表面对应的开口 位套至金属环 3上的凸状物 31， 耳机套材料其表面的开口位是与凸状物 31 对应的并且事先裁剪好的,这样既能有效控制耳机套表面的皱折、 同时能降 低损耗、 提高产能及促进产品美观。 In this embodiment, the first slot 12 is provided with a positioning post 11 corresponding to the inner hole of the earphone sleeve, and the core 2 is provided with a through hole 21 corresponding to the positioning post 11, and the metal ring is 3 Socketed in the mold base 1, put the earphone cover material, and then put the core 2 into the metal ring 3, and the positioning post 11 passes through the through hole 21 to prevent the core 2 from shifting during hot pressing. In this embodiment, the metal ring 3 is provided with a plurality of protrusions 31, and the plurality of protrusions 31 are arranged along the outer side of the metal ring 3 in an annular array, and the earphone sleeve material is sleeved according to the corresponding opening surface of the material surface. The protrusion 31 on the metal ring 3, the opening position of the surface of the earphone cover material is corresponding to the protrusion 31 and is cut in advance, so as to effectively control the wrinkles on the surface of the earphone cover, and at the same time reduce the loss and improve Capacity and promote the beauty of the product.
本实施例中，所述金属环 3的外侧面设置有两组环形阵列的凸起物 31， 使耳机套制作过程中减少皱折、 降低损耗、 提高产能。  In this embodiment, the outer side of the metal ring 3 is provided with two sets of annular array of protrusions 31, which reduces wrinkles, reduces losses, and increases productivity during the manufacturing process of the earphone sleeve.
本实施例中， 所述模芯 2、 金属环 3的形状为环状、 圆形、 椭圆形或方 形， 所述模芯 2与金属环 3是相对应的形状。  In this embodiment, the shape of the core 2 and the metal ring 3 is annular, circular, elliptical or square, and the core 2 and the metal ring 3 have corresponding shapes.
本实施例中， 所述压板 4开设有容置定位柱 11的第二槽位 41， 工作的 时候， 压板 4压向模架 1， 定位柱 11容置于第二槽位 41内。  In this embodiment, the pressure plate 4 is provided with a second slot 41 for accommodating the positioning post 11. When working, the pressure plate 4 is pressed against the mold frame 1, and the positioning column 11 is received in the second slot 41.
以上内容仅为本实用新型的较佳实施例， 对于本领域的普通技术人员， 依据本实用新型的思想， 在具体实施方式及应用范围上均会有改变之处， 本说明书内容不应理解为对本实用新型的限制。  The above content is only a preferred embodiment of the present invention, and those skilled in the art will have a change in the specific embodiment and application scope according to the idea of the present invention. The content of the present specification should not be understood as Limitations on the present invention.

Claims

权 利 要 求 书 Claim
1. 耳机套定型模具组件，包括高周波热压机及模具组件， 其特征在于: 所述模具组件包括压板（4)、模芯（2)、金属环（3)、模架（1)及盖板（5)， 所述盖板 （5) 设置于模架 （1) 的上方， 所述金属环 （3) 套接于所述模架1. A headphone sleeve sizing mold assembly, comprising a high frequency hot press and a mold assembly, characterized in that: the mold assembly comprises a pressure plate (4), a core (2), a metal ring (3), a mold frame (1) and a cover a plate (5), the cover plate (5) is disposed above the mold frame (1), and the metal ring (3) is sleeved on the mold frame
(1) 内， 所述模芯 （2) 安置于金属环 （3) 内， 所述压板 （4) 设置于所 述模架 （1) 的上方与高周波热压机可拆卸连接。 (1) The mold core (2) is disposed in the metal ring (3), and the pressure plate (4) is disposed above the mold base (1) and detachably connected to the high frequency hot press.
2. 根据权利要求 1所述的耳机套定型模具组件， 其特征在于： 所述模 架 （1) 设置有容置金属环 （3) 的第一槽位 （12)。  2. The earphone sleeve setting die assembly according to claim 1, wherein: the mold frame (1) is provided with a first slot (12) for accommodating the metal ring (3).
3. 根据权利要求 1所述的耳机套定型模具组件， 其特征在于： 所述盖 板 （5) 设置有盖板通孔 （54)。  3. The earphone sleeve setting die assembly according to claim 1, wherein: the cover plate (5) is provided with a cover through hole (54).
4. 根据权利要求 1所述的耳机套定型模具组件， 其特征在于： 所述盖 板 （5) 与模架 （1) 可拆卸连接。  4. The earphone sleeve setting die assembly according to claim 1, wherein: the cover plate (5) is detachably coupled to the mold frame (1).
5. 根据权利要求 1所述的耳机套定型模具组件， 其特征在于： 所述第 一槽位 （12) 设置有与耳机套半成品内孔相对应的定位柱 （11)， 所述模芯 The earphone sleeve setting die assembly according to claim 1, wherein: the first slot (12) is provided with a positioning post (11) corresponding to the inner hole of the earphone sleeve semi-finished product, the core
(2) 开设有与所述定位柱 （11) 相对应的通孔 （21)。 (2) A through hole (21) corresponding to the positioning post (11) is opened.
6.根据权利要求 1 所述的耳机套定型模具组件， 其特征在于： 所述金 属环 （3) 设置有若干个凸起物 （31)， 该若干个凸起物 （31) 沿所述金属 环 （3) 外侧面环形阵列。  The earphone sleeve setting die assembly according to claim 1, wherein: the metal ring (3) is provided with a plurality of protrusions (31) along which the plurality of protrusions (31) are Ring (3) Outer side annular array.
7. 根据权利要求 6所述的耳机套定型模具组件， 其特征在于： 所述金 属环 （3) 的外侧面设置有两组环形阵列的凸起物 （31)。  7. The earphone sleeve setting die assembly according to claim 6, wherein: the outer side of the metal ring (3) is provided with two sets of annular array of protrusions (31).
8.根据权利要求 1所述的耳机套定型模具组件， 其特征在于：所述模芯 (2)、 金属环 （3) 的形状为环状、 圆形、 椭圆形或方形。 The earphone sleeve setting die assembly according to claim 1, wherein the core (2) and the metal ring (3) are annular, circular, elliptical or square.
9. 根据权利要求 1所述的耳机套定型模具组件， 其特征在于： 所述压 板 （4) 开设有容置定位柱 (11)的第二槽位 （41 )。 9. The earphone sleeve setting die assembly according to claim 1, wherein: the pressure plate (4) is provided with a second slot (41) for accommodating the positioning post (11).
PCT/CN2012/082974 2012-09-29 2012-10-15 Earphone sheath shaping mould assembly WO2014047985A1 (en)

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Publication number Priority date Publication date Assignee Title
CN202911131U (en) * 2012-09-29 2013-05-01 东莞市瑞昶塑胶泡棉有限公司 Earphone sleeve bottom skin pressing mould assembly
CN110650396B (en) * 2019-09-18 2020-09-22 东莞富采包装制品有限公司 Ear muff ironing machine for headset

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TWM341372U (en) * 2008-04-25 2008-09-21 Kwan Chieh Co Ltd Earphone cover and mold for forming the same
TW200945918A (en) * 2008-04-25 2009-11-01 Kwan Chieh Co Ltd Earphones cover and manufacturing method thereof
CN201423530Y (en) * 2009-03-06 2010-03-17 曹斌华 Production mold kit for earphone sleeves
CN202911131U (en) * 2012-09-29 2013-05-01 东莞市瑞昶塑胶泡棉有限公司 Earphone sleeve bottom skin pressing mould assembly

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Publication number Priority date Publication date Assignee Title
CN1805610A (en) * 2006-01-24 2006-07-19 深圳市龙岗区坪地中心全宏塑胶五金电子厂 Fallout preventive and bonding-free earphone shield and forming method
TWM341372U (en) * 2008-04-25 2008-09-21 Kwan Chieh Co Ltd Earphone cover and mold for forming the same
TW200945918A (en) * 2008-04-25 2009-11-01 Kwan Chieh Co Ltd Earphones cover and manufacturing method thereof
CN201423530Y (en) * 2009-03-06 2010-03-17 曹斌华 Production mold kit for earphone sleeves
CN202911131U (en) * 2012-09-29 2013-05-01 东莞市瑞昶塑胶泡棉有限公司 Earphone sleeve bottom skin pressing mould assembly

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