CN202911149U - Earphone sleeve shaping mould assembly - Google Patents
Earphone sleeve shaping mould assembly Download PDFInfo
- Publication number
- CN202911149U CN202911149U CN2012205070350U CN201220507035U CN202911149U CN 202911149 U CN202911149 U CN 202911149U CN 2012205070350 U CN2012205070350 U CN 2012205070350U CN 201220507035 U CN201220507035 U CN 201220507035U CN 202911149 U CN202911149 U CN 202911149U
- Authority
- CN
- China
- Prior art keywords
- becket
- earphone covers
- mould
- mould bases
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
Abstract
The utility model relates to the technical field of moulds, in particular to an earphone sleeve shaping mould assembly. The sleeve shaping mould assembly comprises a high-frequency hot press and a mould, wherein components of the mould consist of a pressure plate, a mould core, a metal ring, a mould frame and a cover plate; the cover plate is arranged above the mould frame; the metal ring is sleeved in the mould frame; the mould core is positioned in the metal ring; and the pressure plate is arranged above the mould frame and detachably connected to the high-frequency hot press. The earphone sleeve shaping mould assembly provided by the utility model solves the problems that the surface of an earphone sleeve has high probability of being folded and the loss is high in a conventional earphone sleeve manufacturing process, and can improve productivity and yield.
Description
Technical field
The utility model relates to technical field of mold, relates in particular to earphone covers shaper assembly.
Background technology
Earphone has been widely applied in the middle of our daily life, listen to the music, voice call, English Listening Comprehension examination, noise reduction, ear's security protection etc. all be unable to do without earphone, In-Ear Headphones is generally avoided the hard thing of earphone outer covering directly to contact with ear with built-in earplug and is caused user's discomfort, and other earphones generally can be equipped with earphone covers at earphone outer covering.
Chinese patent application numbers 200920052185.5 has been announced a kind of earphone covers production mould assembly, solved the orientation problem in the part earphone covers manufacturing process, but the used becket of this die assembly without locating dowel, slotless position, without the mould bases cover plate, without the cover plate through hole, can't satisfy the demand of making other special headphones cover without protrusion, its mould bases.
Summary of the invention
The purpose of this utility model is to provide a kind of earphone covers shaper assembly for the deficiencies in the prior art, and the problem of the easy fold in earphone covers surface and high loss also can improve production capacity and yields in the existing earphone covers manufacturing process of the utility model solution.
For achieving the above object, a kind of earphone covers shaper assembly of the present utility model, comprise high frequency hot press and mould, described die assembly comprises pressing plate, core rod, becket, mould bases and cover plate, described cover plate is arranged at the top of mould bases, described metal ring is connected in the described mould bases, and described core rod is placed in the becket, and top and high frequency hot press that described pressing plate is arranged at described mould bases removably connect.
As preferably, described mould bases is provided with the first groove position of accommodating becket.
As preferably, described cover plate is provided with the cover plate through hole.
As preferably, described cover plate and mould bases removably connect.
As preferably, described the first groove position is provided with the locating dowel corresponding with earphone covers semi-finished product endoporus, and described core rod offers the through hole corresponding with described locating dowel.
As preferably, described becket is provided with several protrusions, and these several protrusions are along described becket lateral surface annular array.
As preferably, the lateral surface of described becket is provided with the protrusion of two groups of annular arrays.
As preferably, described core rod, becket be shaped as ring-type, circle, ellipse or square.
As preferably, described pressing plate offers the second groove position of accommodating locating dowel.
The beneficial effects of the utility model: first earphone hitch bottom material is put into the first groove position, the metal ring that to wrap again material is connected to the first groove position of mould bases, then be inserted in the earphone covers material in locating dowel, closed mould bases cover plate, put into core rod, last pressing plate is connected afterwards, presses to the mould bases direction with cycle machine again; After compacting is finished, take out semi-finished product, carry out again next process.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model decomposition texture schematic diagram.
Fig. 3 is the utility model die carrier structure schematic diagram.
Fig. 4 is the structural representation of the utility model cover plate.
Fig. 5 is the utility model mold insert structure schematic diagram.
Fig. 6 is the utility model becket structural representation.
Fig. 7 is the utility model becket right view.
Fig. 8 is the utility model pressure plate structure schematic diagram.
Reference numeral comprises:
1-mould bases, 11-locating dowel, 12-the first groove position 2-core rod, 21-through hole, 3-becket, 31-protrusion, 4-pressing plate, 41-the second groove position 5-cover plate, 54-cover plate through hole.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
Extremely shown in Figure 8 such as Fig. 1, comprise high frequency hot press and mould, described die assembly comprises pressing plate 4, core rod 2, becket 3, mould bases 1 and cover plate 5, described cover plate 5 is arranged at the top of mould bases 1, described becket 3 is socketed in the described mould bases 1, described core rod 2 is placed in the becket 3, and top and high frequency hot press that described pressing plate 4 is arranged at described mould bases 1 removably connect.
Present embodiment pressing plate 4 is pressed to described mould bases 1 direction with after cycle machine is connected by cover plate 5.
In the present embodiment, described mould bases 1 is provided with the first groove position 12 of accommodating becket 3, first earphone hitch bottom material is put into the first groove position 12, the becket 3 that to wrap again material is socketed on the first groove position 12 of mould bases, and closure flap 13 is put into core rod 2 again, last pressing plate 4 with press to mould bases 1 direction after cycle machine is connected, after compacting is finished, take out semi-finished product, carry out again next process.
In the present embodiment, described cover plate 5 is provided with cover plate through hole 54.
In the present embodiment, described cover plate 13 removably connects with mould bases 1.
In the present embodiment, described the first groove position 12 is provided with the locating dowel 11 corresponding with earphone covers semi-finished product endoporus, described core rod 2 offers the through hole 21 corresponding with described locating dowel 11, becket 3 is socketed in the mould bases 1, put into the earphone covers material, again core rod 2 is put into becket 3, locating dowel 11 passes from through hole 21, core rod 2 skews when preventing hot pressing.
In the present embodiment, described becket 3 is provided with several protrusions 31, these several protrusions 31 are along described becket 3 lateral surface annular arrays, the earphone covers material is overlapped protruded object 31 to the becket 3 by opening position corresponding to material surface, its surperficial opening position of earphone covers material is corresponding with protruded object 31 and cuts in advance, can effectively control like this earphone covers surface fold, can reduce the wastage, improve simultaneously production capacity and promote that product is attractive in appearance.
In the present embodiment, the lateral surface of described becket 3 is provided with the protrusion 31 of two groups of annular arrays, makes to reduce fold in the earphone covers manufacturing process, reduce the wastage, improve production capacity.
In the present embodiment, described core rod 2, becket 3 be shaped as ring-type, circle, ellipse or square, described core rod 2 and becket 3 are corresponding shapes.
In the present embodiment, described pressing plate 4 offers the second groove position 41 of accommodating locating dowel 11, and in the time of work, pressing plate 4 is pressed to mould bases 1, and locating dowel 11 is placed in the second groove position 41.
Above content only is preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (1)
1. earphone covers shaper assembly, comprise high frequency hot press and mould, it is characterized in that: described die assembly comprises pressing plate (4), core rod (2), becket (3), mould bases (1) and cover plate (5), described cover plate (5) is arranged at the top of mould bases (1), described becket (3) is socketed in the described mould bases (1), described core rod (2) is placed in the becket (3), and top and high frequency hot press that described pressing plate (4) is arranged at described mould bases (1) removably connect.
2. earphone covers shaper assembly according to claim 1, it is characterized in that: described mould bases (1) is provided with the first groove position (12) of accommodating becket (3).
3. earphone covers shaper assembly according to claim 1, it is characterized in that: described cover plate (5) is provided with cover plate through hole (54).
4. earphone covers shaper assembly according to claim 1 is characterized in that: described cover plate (5) removably connects with mould bases (1).
5. earphone covers shaper assembly according to claim 2, it is characterized in that: described the first groove position (12) is provided with the locating dowel (11) corresponding with earphone covers semi-finished product endoporus, and described core rod (2) offers the through hole (21) corresponding with described locating dowel (11).
6. earphone covers shaper assembly according to claim 1, it is characterized in that: described becket (3) is provided with several protrusions (31), and these several protrusions (31) are along described becket (3) lateral surface annular array.
7. earphone covers shaper assembly according to claim 6, it is characterized in that: the lateral surface of described becket (3) is provided with the protrusion (31) of two groups of annular arrays.
8. earphone covers shaper assembly according to claim 1 is characterized in that: described core rod (2), becket (3) be shaped as ring-type, circle, ellipse or square.
9. earphone covers shaper assembly according to claim 1, it is characterized in that: described pressing plate (4) offers the second groove position (41) of accommodating locating dowel (11).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205070350U CN202911149U (en) | 2012-09-29 | 2012-09-29 | Earphone sleeve shaping mould assembly |
| PCT/CN2012/082974 WO2014047985A1 (en) | 2012-09-29 | 2012-10-15 | Earphone sheath shaping mould assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205070350U CN202911149U (en) | 2012-09-29 | 2012-09-29 | Earphone sleeve shaping mould assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202911149U true CN202911149U (en) | 2013-05-01 |
Family
ID=48159490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205070350U Expired - Lifetime CN202911149U (en) | 2012-09-29 | 2012-09-29 | Earphone sleeve shaping mould assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202911149U (en) |
| WO (1) | WO2014047985A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014047986A1 (en) * | 2012-09-29 | 2014-04-03 | 东莞市瑞昶塑胶泡棉有限公司 | Sole leather pressing mould assembly of earphone sheath |
| CN110650396A (en) * | 2019-09-18 | 2020-01-03 | 东莞富采包装制品有限公司 | Ear muff ironing machine for headset |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1805610A (en) * | 2006-01-24 | 2006-07-19 | 深圳市龙岗区坪地中心全宏塑胶五金电子厂 | Fallout preventive and bonding-free earphone shield and forming method |
| TW200945918A (en) * | 2008-04-25 | 2009-11-01 | Kwan Chieh Co Ltd | Earphones cover and manufacturing method thereof |
| TWM341372U (en) * | 2008-04-25 | 2008-09-21 | Kwan Chieh Co Ltd | Earphone cover and mold for forming the same |
| CN201423530Y (en) * | 2009-03-06 | 2010-03-17 | 曹斌华 | Production mold kit for earphone sleeves |
| CN202911131U (en) * | 2012-09-29 | 2013-05-01 | 东莞市瑞昶塑胶泡棉有限公司 | Earphone sleeve bottom skin pressing mould assembly |
-
2012
- 2012-09-29 CN CN2012205070350U patent/CN202911149U/en not_active Expired - Lifetime
- 2012-10-15 WO PCT/CN2012/082974 patent/WO2014047985A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014047986A1 (en) * | 2012-09-29 | 2014-04-03 | 东莞市瑞昶塑胶泡棉有限公司 | Sole leather pressing mould assembly of earphone sheath |
| CN110650396A (en) * | 2019-09-18 | 2020-01-03 | 东莞富采包装制品有限公司 | Ear muff ironing machine for headset |
| CN110650396B (en) * | 2019-09-18 | 2020-09-22 | 东莞富采包装制品有限公司 | Ear muff ironing machine for headset |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014047985A1 (en) | 2014-04-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 523000 Guangdong city of Dongguan province Chashan millet Bian Cun Wei Xing Lu Patentee after: DONGGUAN KUSEN ELECTRONIC TECHNOLOGY CO.,LTD. Address before: 523770 Guangdong province Dongguan city Dalang town Fumin Road, No. 16 South Dongguan Ruichang plastic foam Co. Ltd. Patentee before: DONGGUAN WAYCHANCE PLASTIC FOAM Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130501 |