200945918 九、發明說明： 【發明所屬之技術領域】 本發明係錢-種耳機套及難程，特職指-種可提高發 泡材質感及光滑觸感之耳機套製造方法，及利用該方法製成之發 泡材耳機套。 【先前技術】 按’數位音樂已是二十-世紀最重要關雜技術，使得音 樂的儲存與減有了無_可能，伴隨之數位音樂播放器更是目 前世界主要·電子域，且近料猶是人手-機的手機或是 ΜP 3等，更絲響了人們的日常生活，其中最受使用者重視的 部份就在於其耳機_放音f財戴之舒雜，尤其以耳塞式耳 機又更是眾所要求的部份。 ❹ μ然，習知耳機絲美觀與倾耳機之揚聲H，遂於揚聲器外 加"又,、套蓋’但該套蓋大都岭膠所製’⑦雜然有之柔軟 度，卻也时膠本身細刚性問題，而形妨具有潰縮空間 、特丨&致配戴時會壓迫外耳道問題，長時間配戴則易造成耳 生疼痛*舒適問題，且不具潰縮空間特性時，更受限於每 ^耳道孔大小差異’ *無法與耳壁㈣、祕接觸，導致使用 一，聽音料’亦會混雜由卿套蓋與耳壁未服貼縫隙進入 而影響輸出之音質或音量最佳化享受缺失，甚至，無潰 孔材料屬性’職易@身體動作過大，導 5 200945918 致掉落等困擾；其中以台灣專利第5 〇 〇 2 8 4號與第M2 5 3 17 6號’即為上述碎膠材質耳機套蓋存在之技術課題。 針對上述石夕膠耳機套存在之技術缺失，創作人亦曾思及將市 面上之發泡材耳塞技術，運用於套接耳機使用之耳機套；就目前 而言，發泡材耳塞相較於矽膠耳機套，有其較大潰縮空間之材料 特性，讓耳塞套人耳道内時，可舰倍之潰縮效能 ’使每個人配200945918 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a money-type earphone cover and a difficult-to-use, special-purpose finger-making method for manufacturing a earphone cover capable of improving a foaming material feeling and a smooth touch feeling, and using the method Made of foam material earphone cover. [Prior Art] According to 'digital music, it is the most important technology in the 20th century, which makes the storage and reduction of music impossible. The digital music player is the world's main electronic domain. It is still a hand-machine phone or a ΜP 3, etc., which makes people's daily life more mellow. The most important part of the user's attention lies in its headphones _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is also a part of the public's request. ❹ 然然, I know the earphone silk is beautiful and the headphone's Yang H, 遂 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器 扬声器The rubber itself has the problem of fine rigidity, and the shape has the space of collapse, special features and the pressure of the external auditory canal. When worn for a long time, it is easy to cause ear pain* comfort problem, and when there is no space characteristic, it is more Limited by the difference in the size of each ear canal hole * can not be contacted with the ear wall (four), secret, resulting in the use of one, listening to the material 'will also be mixed by the cover of the cover and the ear wall is not attached to the gap to affect the output of the sound quality or The volume is optimized to enjoy the lack of, even, the material property of the hole-free material is 'professional @ body movement is too large, the guide 5 200945918 caused by falling and other troubles; among them, Taiwan patents No. 5 〇〇 2 8 4 and M2 5 3 17 6 No. ' is the technical subject of the above-mentioned broken rubber earphone cover. In view of the lack of technology in the above-mentioned Shishijiao earphone sets, the creators have also thought of applying the foam earplug technology on the market to the earphone sets used for socket headphones; for the moment, the foam earplugs are compared with Silicone earphone cover has the material characteristics of its large crushing space, so that when the earplug is placed in the ear canal, the performance of the ship can be reduced.
戴時更服貼、及長時間配戴更舒適性等突出性優點；但實際經創 作人研究發現，現有發泡材耳塞仍有以下之缺失存在： 一、發泡材製成之耳轴意’雖可改善上财職詩在之 缺點’但’發泡材質於發泡過程中，受其材料雜、發泡溫度、 材料财齡比解諸翔素，導致發珊無法直接於模 ，可配合耳機套塞之結構造形，故為何市面上已 ===見内部形成預設結構_^^^ ρ為目别業界遭遇之技術瓶頸。 泡後:耳::多=耳塞優異之數倍溃縮空間特性，全賴以發 及賜:然-發泡材耳塞卻也嶋 破損兩大問題，二來，多孔 ^成外觀美感破壞及結構易 著，造成表_負面鱗，觸境巾之灰塵附 或沾附耳勒之耳垢時，卿成事倍=表面附著灰塵’ 三、承上，鏗於發泡 ·困擾。 材耳塞多孔質袓輪表面存在之多項技術 200945918 課題，遂有表面形成自結皮之發泡材耳塞，'發泡材耳塞表面之自 結皮，固然具有遮掩表面孔隙效果，但自結皮之概念卻無法真正 達到表面孔隙完全消除效果，以致近看或用手觸摸表面時仍可 感受到表面局部位置有粗糙感現象；再者，自結皮容易於耳塞反 覆使用一段時間後，產生剝離現象，進而影響耳塞之觀瞻。 四、又，習知一般耳塞結構，其貼附耳道之耳筒中央，皆會 開設-貫綠之錢’飢道軌·音量續ώ，相對也會導 ❹致喊時’耳垢由該開魏道進人囤積、阻塞，招致音量輸出功 率降低窘境。 至於，其它有關文獻上之相關研究，對用於耳機套之裝置， 雖有不同之設計及應用考量，未見該技術領域有關於塗覆上一ρ U (POLYURETHANES)薄膜層製程概念被討論。 【發明内容】 © 本發明主要訴求乃提供一種具P U (POLYURETHANES)樹脂薄 膜層包覆發泡材本體之耳機套，與該種耳機套之製造方法，其步 驟包括： (a)備置一成形模具’並將成形模具之公模凸體及一母模表 面塗佈不發泡樹脂； (b)將預先調配好之發泡材原料注入母模； (c)將公、母模合模’並依預設時間及溫度進行發泡； (d)開模’取出發泡成型之耳機套，即可令發泡成型之耳機套 200945918 表面’一體成型包覆有具動性之樹脂薄膜層。 其中，為使發泡後之耳機套不會產生破壞美觀之黃變問題， 該公模表面喷塗之樹脂膜，係不發泡之不黃變 (POLYURETHANES)樹脂，母模表面同樣採不發泡之不黃變p u (POLYURETHANES)樹脂者。 以及利用上揭製造方法所製成之耳機套，該耳機套包括一可 與耳機相互套塞之發泡材本體，該本體表面則一體成型及包覆該 ❹ 本體之不發泡樹脂薄膜層。 藉由上述製造方法製成之發泡材耳機套，預期達到之主要目 的：耳機套利用發泡材質為主體，因其材質特性柔軟度高，且其 可壓縮帥遠大於轉三倍’且表面包ftpu細旨細層強化物 性’故不易因碰撞播壓而造成結構碎損。 本發明另一目的，乃在於提供一種一體成型包覆本體之pu (POLYURETHANES)樹脂薄膜層，利用該p u (亂麗£獵順)樹 薄膜層為不發泡、不黃變p U (p〇LYURETHANES)樹脂，及結合特 殊發泡材配方及發泡率之製程控制，使該P U (p〇LYURETHANES) 樹脂薄膜層，可-體發泡成形包覆於耳機套本體表面，不僅能有 效掩蔽發泡材發泡後表面形成之多孔狀態樣，且因一體發泡成型 造就兩者錄_合’舰P U⑽麵thmes)麟薄膜層不 因輕S遭受外力破壞就脫落，更讓成品表面狄來更有質感，觸 摸時光滑表面有較佳的觸感，亦不易有耳垢髒污附著。 200945918 =發明又另—目的：係於耳機套輪出音量之開放孔道 -與P U (P0LY臓通腦)樹脂薄膜 成 則具備防止耳垢由開放孔道進入、囤積阻塞音量二 藉共振薄棋薄而油特性，_讓音錄出之歧產生力;;振= 此放大整雖料量’及提昇輸A音質絲。 而該pit (P0LYURETHANES)樹脂薄膜層，可採用不黃變特性 Ο ^得薄膜層混合多樣色料發泡，讓發騎耳機套可提供消 費者更多顏色選擇機會。 1本發明之耳絲可改善習知發泡财美觀之多氣泡孔狀，且 體成型之人體工學設計，使得其整體具有良好質感。 【實施方式】 有關本發明耳機套製造流程，包括模具塗佈樹脂、注入發泡 材原料、合模熱壓發泡、開模冷卻成型等步驟，至於前述各步驟 程之詳細過程，兹辅以第一至五圖說明之，一種耳機套之製造 方法’該製程步驟如下： (a)備置一成形模具，並將成形模具之公模3 0及一母模4 於該么模3 0之凸體3 1，及母模4 0表面塗佈一不發泡樹 脂2 0 ; (b) 將預先調配好之發泡材原料A注入母模4 0 ; (c) 將公、母模3 〇、4 〇合模，並依預設時間及溫度進行發 200945918 (d)開模，取出發泡成型之耳機套χ，即可令發泡材耳機套工 表面一體成型包覆一樹脂薄膜層。 如第一、二圖所示，其中該公模3 〇表面垂直凸設之凸體3 ;1，除單一直徑實施方式外，亦得如圖所揭之具兩種直徑圓柱構 成之階級狀凸體31，母模40相對階級狀之凸體3 i表面，則 凹設一深度略大於階級狀之凸體31長度之u形凹槽4χ，凹槽 41中央並微凸出一凸部4 2，其中如第三圖所示，將不發泡樹 ❿ 脂20喷塗在階級狀凸體31及凹槽41表面。 復，如第四、五圖所示，待該不發泡樹脂2 〇冷卻成型後， 將該發泡材原料A注入母模4 0内，將公、母模3 〇、4 0合模、 熱壓’並依預設時間及溫度進行發泡’待該預設時間後，則進行 開模並取出發泡成型之耳機套1成品（第六圖所示）。 另’該公、母模3 0、4 0表面預先喷塗之不發泡樹脂2 〇， 經發明人多次試驗結果發現，結合不黃變p u (polyurethanes) ® 樹脂為最佳實施態樣。 其中該PU (POLYURETHANES)樹脂是熱固性樹脂，其發泡方 式為成型時化學反應產生的氣體造成的發泡生產過程是以聚酯或 是聚醚型的多元醇與二異氰酸酯，加水和催化劑反應其聚合物的 形成’是由水與異氰酸基反應聯結時產生二氧化碳來發泡，當然 也能由發泡劑，例如三氟甲垸等揮發性氣體發泡。The wearer wears more attention, and wears more comfortable for a long time; but the actual research by the creator found that the existing foam earplugs still have the following defects: First, the earrings made of foam material 'Although it can improve the shortcomings of Shangcai's poems, but 'foaming material' in the foaming process, due to its material miscellaneous, foaming temperature, and material age, it can't be directly affected by the mold. With the structure of the earphone plug, so why the market has === see the internal formation of the default structure _^^^ ρ is the technical bottleneck encountered by the industry. After the bubble: ear:: more = earplugs excellent several times the space characteristics of the collapse, relying on the hair and the gift: the - foam earplugs but also damage the two major problems, second, the porous ^ into the appearance of aesthetic damage and structure Easy to wear, resulting in a table _ negative scales, when the dust of the contact towel attached or adhered to the earwax of the ear, the case of Qing Cheng times = surface attached to the dust 'three, bearing, smashing foaming trouble. A variety of techniques existed on the surface of the porous ear cups 200945918. The surface of the foamed earplugs with self-skinning on the surface, the self-skinning of the surface of the foamed earplugs, although it has the effect of covering the surface pores, but self-skinning The concept can not really achieve the complete elimination of the surface pores, so that when the surface is touched or touched by hand, the local position of the surface can still be felt rough; in addition, the self-skinning is easy to use after the earplug is used for a period of time, and the peeling phenomenon occurs. , which in turn affects the perspective of earplugs. Fourth, in addition, the general earplug structure, which is attached to the center of the ear canal of the ear canal, will open - the green money 'hungry track · volume continued, the relative will also lead when shouting 'earwax from the Wei Weidao People hoard and block, causing the volume output power to drop. As for other relevant research in the literature, although there are different designs and application considerations for the device for the earphone sleeve, it is not known that the technical concept of coating a ρ U (POLYURETHANES) film layer is discussed. SUMMARY OF THE INVENTION The main claim of the present invention is to provide a headphone cover with a PU (POLYURETHANES) resin film layer coated foam body, and a method for manufacturing the earphone cover, the steps of which include: (a) preparing a forming mold 'The surface of the male mold of the forming mold and the surface of a master mold are coated with a non-foamed resin; (b) the raw material of the foam material prepared in advance is injected into the master mold; (c) the male and female molds are clamped' Foaming according to the preset time and temperature; (d) Opening the mold 'Removing the foamed earphone sleeve, the foam-formed earphone sleeve 200945918 surface is integrally molded with a dynamic resin film layer. In order to prevent the yellowing of the earphone cover after foaming, the resin film sprayed on the surface of the male mold is a non-foaming non-yellowing (POLYURETHANES) resin, and the surface of the mother mold is also not taken. The bubble is not yellow pu (POLYURETHANES) resin. And an earphone cover made by the above-mentioned manufacturing method, the earphone cover comprising a foam body which can be plugged with the earphone, the body surface integrally forming and covering the non-foamed resin film layer of the body. The foaming earphone sleeve made by the above manufacturing method is expected to achieve the main purpose: the earphone sleeve is made of a foamed material as a main body, because the material property is high in softness, and the compressible handsomeness is greater than three times of the turn' and the surface The package ftpu is designed to fine-tune the physical properties, so it is not easy to cause structural damage due to collisional pressure. Another object of the present invention is to provide a pu (POLYURETHANES) resin film layer integrally formed with a cover body, and use the pu (unbelievable) tree film layer to be non-foaming and non-yellowing p U (p〇 LYURETHANES resin, combined with special foaming material formulation and foaming process control, enables the PU (p〇LYURETHANES) resin film layer to be coated on the surface of the earphone sleeve body, which can effectively mask the hair The porous state of the surface formed by the foaming of the foam material, and the formation of the two foams due to the integral foaming molding _ _ 'ship P U (10) surface thmes) lin film layer does not fall off due to the external force of light S, and let the surface of the finished product It has a more textured texture, and the smooth surface has a better touch when touched, and it is not easy to have earwax and dirt. 200945918=Invention and another--Objective: The open hole of the volume of the earphone sleeve--with PU (P0LY臓 brain) resin film is formed to prevent the ear wax from entering through the open channel, hoarding the blocking volume, and borrowing the resonance thin and thin oil Characteristics, _ let the sound of the difference in the recording force;; vibration = this enlarges the entire amount of material and enhances the A-quality sound. The pit (P0LYURETHANES) resin film layer can be made of a non-yellowing property Ο ^ to obtain a film layer mixed with various color materials, so that the riding earphone cover can provide consumers with more color selection opportunities. 1 The ear wire of the invention can improve the multi-bubble hole shape of the conventional foaming beauty, and the ergonomic design of the body molding makes the overall good texture. [Embodiment] The manufacturing process of the earphone cover of the present invention includes the steps of mold coating resin, injecting foam material, mold hot pressing foaming, mold opening cooling molding, etc., and the detailed process of each of the foregoing steps is supplemented by The first to fifth figures illustrate a method for manufacturing a headphone sleeve. The process steps are as follows: (a) A forming mold is prepared, and a male mold 30 and a female mold 4 of the forming mold are convex to the mold. The body 3 1 and the mother mold 40 are coated with a non-foamed resin 20; (b) the pre-mixed foam material A is injected into the master mold 40; (c) the male and female molds 3, 4 〇 〇 mold, and according to the preset time and temperature to send 200945918 (d) mold opening, take out the foam molding of the headset χ, you can make the foam material headset surface is integrally molded with a resin film layer. As shown in the first and second figures, the convex body 3; 1 in which the surface of the male mold 3 is vertically protruded, in addition to the single diameter embodiment, also has a class-like convex shape composed of two diameter cylinders as shown in the figure. The body 31, the surface of the convex body 3 i of the mother mold 40 is recessed, and a U-shaped groove 4 深度 having a depth slightly larger than the length of the convex body 31 of the class shape is recessed, and a convex portion 4 2 is slightly convex at the center of the groove 41. Here, as shown in the third figure, the non-foaming tree resin 20 is sprayed on the surface of the class-like convex body 31 and the groove 41. Further, as shown in the fourth and fifth figures, after the non-foamed resin 2 is cooled and molded, the foamed material A is injected into the master mold 40, and the male and female molds 3, 40 are closed. Hot pressing 'and foaming according to preset time and temperature' After the preset time, mold opening and taking out the finished foamed earphone cover 1 (shown in Figure 6). In addition, the non-foamed resin 2 预先 pre-sprayed on the surface of the male and female molds 30 and 40 was found to be the best embodiment by combining the non-yellowing p u (polyurethanes) ® resin. The PU (POLYURETHANES) resin is a thermosetting resin, and the foaming process is a foaming production process caused by a gas generated by a chemical reaction during molding, which is a reaction of a polyester or a polyether polyol with a diisocyanate, adding water and a catalyst. The formation of the polymer 'is foamed by the generation of carbon dioxide when the water is combined with the isocyanate group, and can of course be foamed by a blowing agent such as a volatile gas such as trifluoromethane.
本發明藉由上述步驟，即可利用表面包覆PU 200945918 (POLYURETHANES)樹脂薄膜層之發泡材本體，以構成一具高柔軟 度、數倍潰縮空間、及防污兼強化音波共振功效之耳機套工。 透過上述製作方法可成形一耳機套i，請參閱第七、八圖， 該耳機套1包括一可與耳機相互套塞之發泡材本體i 〇，該本體 1〇表面則一體成型包覆一不發泡樹脂薄膜層2 01 ;其中，該 本體10係由一平面部21及圓弧部2 2構成之子彈形發泡結構 體，該子彈形本體平面部21朝内凹設一預設深之套合孔2 3， © BI弧部2 2自表面朝内開設-連通套合孔2 3之開放狀孔道2 4 ’該孔徑小於套合孔2 3之孔道2 4，對應圓弧部2 2之開放 端’則形成有封閉用之共振薄膜層25，該共振薄膜層25並和 本體10表面包覆之不發泡樹脂薄膜層一體成型。 其中本體表面之不發泡樹脂薄膜層2〇 i，其包覆平面部2 1及圓弧部2 2者皆為不發泡、不黃變之p u (polyurethanes) 树知，甚至，該套合孔2 3及孔道2 4表面，亦因公模3 〇之凸 ©體3 1表面預先喷塗*發泡、不黃^pu樹脂細，而受到該不 發泡、不黃變P U (POLYURETHANES)樹脂完全包覆。 上述透過模具塗佈不發泡樹脂2 〇、注入發泡材原料入、合 模熱壓成形、開模冷卻成型等步驟製程，不僅可令pu (POLYURETHANES)樹脂薄膜層2 〇工，一體成型包覆發泡材本體丄 0之結合牢雖優勢，該製程轉特殊之發泡材料 ，配合經 °十异所得之精準發鮮參數控制，令發泡材直接於模具内單次發 11 200945918 泡出，具套合孔2 3、孔道2 4等結構造形之耳機套1。 本發明藉由預先於模具之公、母模3 0、4 0上塗佈不發泡 PU樹脂，讓模具表面形成一薄膜層外皮，更因該不發泡樹脂2 〇具有高度強韌性，使得於隨後注入經由特殊比例調配之發泡材 原料A ’進行發泡過程中，因該外層之不發泡樹脂可2 〇有效避 免發泡材1 〇過度發泡膨脹、外露，且透過p U (POLYURETHANES) 樹脂薄膜層包覆，使成品完全看不到習知發泡材料產品之多氣孔 〇 缺陷’而呈現更高質感及光滑觸感之發泡材耳機套2，並藉由該 不發泡P U (POLYURETHANES)樹脂薄膜層2 0 1，增加該發泡材 耳機套1之韌性強度，該P U (POLYURETHANES)樹脂薄臈層的配 方可靈活分配比重，且彈性發泡率都能調整，於製作過程中亦較 耐高溫，因此本發明結合該PU (POLYURETHANES)樹脂薄膜層係 為一大進步性技術。 ©另外，關於本體1〇表面包覆之不發泡樹脂薄膜層2〇 則可利用表面光滑之不發泡樹脂薄膜層2◦1，降低耳垢、灰塵 附著問題外，縱然表面尚附著少量耳垢、灰塵，亦可發揮事半功 倍之輕鬆清除優勢，不僅如此，孔道2 4特別形成與本體1 〇表 面不發泡樹脂薄膜層2 〇1，一體成型之封閉用共振薄膜層2 5 ’更可防止耳垢、髒汙等進入孔道、囤積之間題； 最特別的是，該共振薄膜層2 5係由公模3 〇階級狀凸體3 1頂面’與母模4〇凹槽4：[底端凸部42間，未接觸距離所控 12 200945918 制之極薄卻賦有極大勃性特色，故由耳機輸出元件2 (第八圖） 輸出之9波’得穿過絲薄膜層2 5輸出聲音不受限制，同時又 藉其勒性與輸出之音波產生共振效果，讓輸出之音量 輪出；加上’本案耳機套之本體！ Q材潰性極佳之發泡材，而 得與耳道之壁面緊密貼觸，令配戴本案耳機套工之耳機（圖未 示）’得以較小輸出功率獲得更大輸出音量效果，讓使用者獲得 如臨演唱現場之真實感。 , 〇 更重要的-點，係本創作之耳機套，係利用高潰縮空間之發 泡材料發泡成型，故可充份细發崎之雜，產生較大壓縮變 形功效’讓耳機套符合不同孔道大小之使用者配戴，同時，配戴 時亦可與耳道孔更為服貼，以獲得配戴舒適性，以及防止外界雜 音進入耳道孔，進而干擾耳機之音量輸出及音質享受效果者。 由上所述者僅為用以轉本發明之較佳實施例，並非企圖據 〇以對本發明做任何形式上之限制，是以，凡有在相同之發明精神 下所做有關本發明任何修部或變更者，皆仍應包括在本發明意圖 保護之範嗨内。 綜上所述，本個套及絲造錄，整體實用性及成本 效益上’確實是完全符合產業上發展所f，且所揭1:之結構發明 亦是具有前所未有的鑛構造，所以其具有「新穎性」應無疑慮， 又本發明得大幅提昇習知產品之效能，因此亦具有「進步性」，其 π全符合_專利法有關發明專利之申請要件的規定，乃依法提 200945918 起專利申請，並敬請鈞局早日審查，並賜准專利，至感德便。 200945918 【圖式簡單說明】 第一圖係本發明耳機套之製造模具剖面圖。 第二圖係本發明耳機套及其製造流程之模具實施作動圖（一）。 第二圖係本發明耳機套及其製造流程之模具實施作動圖（二）。 第四圖係本發明耳機套及其製造流程之模具實施作動圖（三）。 第五圖係本發料絲及其製造流程之模具實施雜圖⑻。 第六圖係本發明耳機套成品剖面示意圖。 〇第七圖係本發明耳機套之局部_立體外觀圖。 第八圆係第七圖之耳機套與耳機輸出元件套接剖面示意圖。 【主要元件符號說明】According to the above steps, the foam body of the PU 200945918 (POLYURETHANES) resin film layer can be coated with a surface to form a high softness, several times of collapse space, and antifouling and enhanced sound wave resonance. Headset work. The earphone cover i can be formed by the above manufacturing method. Referring to the seventh and eighth figures, the earphone cover 1 includes a foam body i 可 which can be plugged with the earphone, and the surface of the body 1 is integrally formed with a cover. The non-foamed resin film layer 201; wherein the body 10 is a bullet-shaped foam structure composed of a flat portion 21 and a circular arc portion 22, and the bullet-shaped body flat portion 21 is recessed inwardly by a predetermined depth The sleeve hole 2 3, © BI arc portion 2 2 opens from the surface inwardly - connects the open hole 2 3 of the open hole 2 4 'the hole diameter is smaller than the hole 2 4 of the sleeve hole 23, corresponding to the arc portion 2 The open end of 2 is formed with a resonance thin film layer 25 for sealing, and the resonant film layer 25 is integrally molded with a non-foamed resin film layer coated on the surface of the body 10. The non-foamed resin film layer 2〇i on the surface of the body, which covers the flat portion 2 1 and the circular arc portion 2 2 is a non-foaming, non-yellowing pu (polyurethanes) tree, and even the sleeve The surface of the hole 2 3 and the hole 2 4 is also pre-sprayed by the surface of the convex body 3 of the male mold 3*, which is foamed, not yellow, and the resin is fine, and is subjected to the non-foaming, non-yellowing PU (POLYURETHANES) The resin is completely coated. The above-mentioned process of applying the non-foamed resin 2 透过 through the mold, injecting the foam material into the mold, hot-pressing the mold, and cooling the mold, and the like, can not only complete the pu (POLYURETHANES) resin film layer 2, and integrally form the package. Although the combination of the foamed foam body 丄0 is strong, the process is transferred to a special foaming material, and the precision freshening parameters obtained by the different temperatures are controlled, so that the foamed material is directly sent to the mold in a single time 11 200945918 The earphone cover 1 has a structure such as a sleeve hole 2 3 and a hole channel 2 4 . In the present invention, the non-foamed PU resin is coated on the male and female molds 30, 40 in advance, so that the surface of the mold forms a film outer skin, and the non-foamed resin 2 has high toughness. In the subsequent foaming process by injecting the foam material A' through special proportioning, the non-foamed resin of the outer layer can effectively prevent the foaming material 1 from excessive foaming, swelling, and permeation through p U ( POLYURETHANES) The resin film layer is coated to make the finished product completely invisible to the multi-hole defects of the conventional foam material product, and the foamed material earphone cover 2 with higher texture and smooth touch is obtained by the non-foaming PU ( POLYURETHANES) Resin film layer 2 0 1. Increase the toughness of the foamed earphone sleeve 1. The formulation of the PU (POLYURETHANES) resin thin layer can flexibly distribute the specific gravity, and the elastic foaming rate can be adjusted during the production process. It is also more resistant to high temperatures, so the present invention incorporates the PU (POLYURETHANES) resin film layer as a progressive technology. © In addition, the non-foamed resin film layer 2〇 coated on the surface of the main body 1 can use the non-foamed resin film layer 2◦1 having a smooth surface to reduce the problem of ear wax and dust adhesion, even if a small amount of earwax adheres to the surface. Dust can also be used to remove the advantage with less effort. In addition, the channel 24 is specially formed with the non-foamed resin film layer 2 〇1 on the surface of the body 1 , and the closed resonance film layer 2 5 ' can prevent earwax, Dirty and other problems enter the tunnel, hoarding; most particularly, the resonant film layer 25 is from the male mold 3 〇 class-like convex body 3 1 top surface 'and the female mold 4 〇 groove 4: [bottom end convex Part 42, untouched distance controlled 12 200945918 The system is extremely thin but has a great bosom characteristic, so the output of the headphone output component 2 (the eighth figure) 9 waves 'pass through the silk film layer 2 5 output sound is not Restriction, at the same time by its character and the output of the sound wave to produce a resonance effect, let the output volume turn out; plus the body of the headset case! Q material is excellent in foaming material, and it has close contact with the wall surface of the ear canal, so that the earphones (not shown) equipped with the earphones of this case can achieve greater output volume effect with smaller output power. The user gets the realism of the live concert. , 〇 More important - the point is the earphone sleeve of this creation, which is made of foamed material with high collapse space, so it can be filled with fine and sturdy, resulting in large compression deformation effect. Users of different tunnel sizes can wear it at the same time. When wearing, it can be more suitable for the ear canal to obtain wearing comfort and prevent external noise from entering the ear canal hole, thereby disturbing the volume output and sound quality of the earphone. Effect. The above description is only for the preferred embodiment of the invention, and is not intended to limit the invention in any way, so that any modification of the invention is made in the spirit of the same invention. The Department or the changer should still be included in the scope of the intention of the present invention. In summary, this set of silk and silk records, the overall practicality and cost-effectiveness is indeed fully in line with the industrial development, and the structural invention disclosed in the first is also an unprecedented mineral structure, so it has "Newty" should be taken care of, and the invention can greatly enhance the efficiency of the conventional products, and therefore has "progressiveness". The π is in full compliance with the requirements of the patent law relating to the application requirements of the invention patents, and is based on the law of 200945918. Apply, and I would like to ask the bureau to review it as soon as possible and grant a patent. 200945918 [Simplified description of the drawings] The first figure is a sectional view of a manufacturing mold of the earphone cover of the present invention. The second figure is a mold implementation diagram (1) of the earphone sleeve of the present invention and its manufacturing process. The second figure is a mold implementation diagram (2) of the earphone sleeve of the present invention and the manufacturing process thereof. The fourth figure is a mold implementation diagram (3) of the earphone sleeve of the present invention and the manufacturing process thereof. The fifth figure is a mold implementation diagram (8) of the present hairline and its manufacturing process. The sixth figure is a schematic cross-sectional view of the finished earphone cover of the present invention. 〇The seventh figure is a partial appearance view of the earphone cover of the present invention. The eighth circle is the schematic diagram of the sleeve of the headphone sleeve and the headphone output component of the seventh figure. [Main component symbol description]
1 -- 本體 2 1-2 3- 2 5- 3 1 —— 4 1 — ~~ 2 0 1- 一一耳機套 0------ —平面部 —套合孔 —共振薄膜層 —凸體 ~~~凹槽 —不發泡樹脂薄臈層 耳機輪出元件 2 〇 ~~ 不發泡樹脂 2 2 ~~ 圓弧部 2 4- --——孔道 3 0- ----公模 4 0- ----母模 4 2- -----凸部 —發泡材原科 151 -- body 2 1-2 3- 2 5- 3 1 —— 4 1 — ~~ 2 0 1- one earphone cover 0------ —planar part—sleeve hole—resonant film layer—convex Body ~~~ Groove - non-foamed resin thin layer earphone wheel out element 2 〇~~ non-foamed resin 2 2 ~~ arc part 2 4- --- hole 3 0- ---- public mode 4 0- ----Master 4 2- -----Protruding - Foaming material original 15