CN204948310U - A kind of earphone covers die assembly - Google Patents
A kind of earphone covers die assembly Download PDFInfo
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- CN204948310U CN204948310U CN201520648915.3U CN201520648915U CN204948310U CN 204948310 U CN204948310 U CN 204948310U CN 201520648915 U CN201520648915 U CN 201520648915U CN 204948310 U CN204948310 U CN 204948310U
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- upper mold
- mold core
- die
- earphone covers
- die cavity
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- 239000002184 metal Substances 0.000 claims abstract description 12
- 238000007906 compression Methods 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007373 indentation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
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Abstract
The utility model relates to technical field of mold, refers in particular to a kind of earphone covers die assembly; Include upper mold core and die shoe, the top of described upper mold core is provided with outer convex edge, and described die shoe is provided with the die cavity suitable with upper mold core, and when the lower end of upper mold core is inserted in die cavity, described outer convex edge is connected to the upper surface of die shoe; The arranged outside of described die shoe has removable and for compressing earphone covers metal collar.First earphone covers material is put into die cavity, then upper mold core is inserted in die cavity, then metal collar is placed on the outside of die shoe, earphone covers homogenize material is made to be distributed in the inner surface of metal collar, to reduce earphone covers fold, improve operating speed, to reduce product rejection rate, make earphone covers finished product more attractive in appearance simultaneously.
Description
Technical field
The utility model relates to technical field of mold, refers in particular to a kind of earphone covers die assembly.
Background technology
Earphone has been widely applied in the middle of our daily life, listens to the music, voice call, English Listening Comprehension examination, noise reduction, ear's security protection etc. all be unable to do without earphone, in outdoor, various English Listening Comprehension examination etc., all can't do without earphone at home.Consider from health during wear headphones and comfort angle, generally can overlap earphone covers on earphone.
Earphone covers generally adopts earphone covers production mould to manufacture, process of the manufacturing more complicated of earphone covers, and process portion needs to rely on the knowhow of workman to control.If mould improper use, easily there is fold in the earphone covers surface of producing, and loss is higher.In order to overcome the such problem of fold, prior art, in earphone covers manufacturing process, uses rubber ring to be locked on the outside of production mould, although can reduce earphone covers surface fold, makes earphone covers surface more smooth attractive in appearance; But rubber ring easily occurs aging after used a period of time, cause product quality unstable, production cost increases relatively, causes certain difficulty to the operation of manufacturing enterprise.
Utility model content
The utility model provides a kind of earphone covers die assembly for the problem of prior art.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of earphone covers die assembly, include upper mold core and die shoe, the top of described upper mold core is provided with outer convex edge, and described die shoe is provided with the die cavity suitable with upper mold core, when the lower end of upper mold core is inserted in die cavity, described outer convex edge is connected to the upper surface of die shoe; The arranged outside of described die shoe has removable and for compressing earphone covers metal collar.
Wherein, the middle part of described die cavity is provided with at least one lead, and described upper mold core corresponds to described lead and is provided with guide through hole, and when the lower end of upper mold core is inserted in die cavity, described lead penetrates in guide through hole.
As preferably, the middle part of described die cavity is arranged at intervals with two leads side by side, described lead and die shoe one-body molded.
Wherein, the lower surface of described outer convex edge is provided with several and compresses projection, and the top of described die shoe is provided with the breach suitable with compressing projection, and when the lower end of upper mold core is inserted in die cavity, described compression projection snaps in corresponding indentation, there.
Wherein, described upper mold core offers two semi-circular cavity.
Wherein, the shape of described die cavity is circular, oval or square.
The beneficial effects of the utility model:
A kind of earphone covers die assembly that the utility model provides, include upper mold core and die shoe, the top of described upper mold core is provided with outer convex edge, and described die shoe is provided with the die cavity suitable with upper mold core, when the lower end of upper mold core is inserted in die cavity, described outer convex edge is connected to the upper surface of die shoe; The arranged outside of described die shoe has removable and for compressing earphone covers metal collar.First earphone covers material is put into die cavity, then upper mold core is inserted in die cavity, then metal collar is placed on the outside of die shoe, earphone covers homogenize material is made to be distributed in the inner surface of metal collar, to reduce earphone covers fold, improve operating speed, to reduce product rejection rate, make earphone covers finished product more attractive in appearance simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of earphone covers die assembly of the utility model.
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of a kind of earphone covers die assembly of the utility model.
Reference numeral in Fig. 1 to Fig. 2 comprises:
1-upper mold core, 2-die shoe
3-outer convex edge, 4-die cavity
5-metal collar, 6-lead
7-guide through hole, 8-compression projection
9-breach, 10-semi-circular cavity.
Embodiment
For the ease of the understanding of those skilled in the art, be further described the utility model below in conjunction with embodiment and accompanying drawing, the content that execution mode is mentioned is not to restriction of the present utility model.Below in conjunction with accompanying drawing, the utility model is described in detail.
A kind of earphone covers die assembly provided by the utility model, include upper mold core 1 and die shoe 2, the top of described upper mold core 1 is provided with outer convex edge 3, described die shoe 2 is provided with the die cavity 4 suitable with upper mold core 1, when the lower end of upper mold core 1 is inserted in die cavity 4, described outer convex edge 3 is connected to the upper surface of die shoe 2; The arranged outside of described die shoe 2 has removable and for compressing earphone covers metal collar 5.In the utility model, the middle part of described die cavity 4 is provided with at least one lead 6, and described upper mold core 1 corresponds to described lead 6 and is provided with guide through hole 7, and when the lower end of upper mold core 1 is inserted in die cavity 4, described lead 6 penetrates in guide through hole 7.As preferably, the middle part of described die cavity 4 is arranged at intervals with two leads 6 side by side, and described lead 6 is one-body molded with die shoe 2, and described lead 6 makes accurate positioning between upper mold core 1 and die shoe 2.
In use, first earphone covers material is put into die cavity 4, then upper mold core 1 is led by lead 6, and upper mold core 1 can be made to slide up and down along lead 6, realizes assembling and the demoulding of this earphone covers die assembly.When upper mold core 1 is inserted in die cavity 4, then metal collar 5 is placed on the outside of die shoe 2, make earphone covers homogenize material be distributed in the inner surface of metal collar 5, to reduce earphone covers fold, raising operating speed, reduction product rejection rate, make earphone covers finished product more attractive in appearance simultaneously.
In the utility model, the lower surface of described outer convex edge 3 is provided with several and compresses projection 8, the top of described die shoe 2 is provided with the breach 9 suitable with compressing projection 8, and when the lower end of upper mold core 1 is inserted in die cavity 4, described compression projection 8 snaps in corresponding breach 9 place; When smooth earphone covers, upper mold core 1 can not produce relative movement by die shoe 2 relatively, ensures that earphone covers is smooth; When cutting earphone covers, earphone covers finished product is more attractive in appearance.
In the utility model, on the basis ensureing upper mold core 1 overall construction intensity, described upper mold core 1 offers two semi-circular cavity 10, two semi-circular cavity 10 effectively alleviate the weight of upper mold core 1, and define between two semi-circular cavity 10 and be convenient to, with the hand-held lath of holding with a firm grip got, make to carry out like a cork assembling and stripping operation.
In the utility model, the shape of described die cavity 4 is circular, oval or square, adapts to earphone covers product diversity needs in market.
The above, it is only the utility model preferred embodiment, not any pro forma restriction is done to the utility model, although the utility model with preferred embodiment openly as above, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when utilizing the technology contents of above-mentioned announcement or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solutions of the utility model content, any simple modification that above embodiment is done is referred to according to the utility model technology, equivalent variations and modification, all belong in the scope of technical solutions of the utility model.
Claims (6)
1. an earphone covers die assembly, it is characterized in that: include upper mold core and die shoe, the top of described upper mold core is provided with outer convex edge, and described die shoe is provided with the die cavity suitable with upper mold core, when the lower end of upper mold core is inserted in die cavity, described outer convex edge is connected to the upper surface of die shoe; The arranged outside of described die shoe has removable and for compressing earphone covers metal collar.
2. a kind of earphone covers die assembly according to claim 1, it is characterized in that: the middle part of described die cavity is provided with at least one lead, described upper mold core corresponds to described lead and is provided with guide through hole, and when the lower end of upper mold core is inserted in die cavity, described lead penetrates in guide through hole.
3. a kind of earphone covers die assembly according to claim 2, is characterized in that: the middle part of described die cavity is arranged at intervals with two leads side by side, described lead and die shoe one-body molded.
4. a kind of earphone covers die assembly according to claim 1, it is characterized in that: the lower surface of described outer convex edge is provided with several and compresses projection, the top of described die shoe is provided with the breach suitable with compressing projection, when the lower end of upper mold core is inserted in die cavity, described compression projection snaps in corresponding indentation, there.
5. a kind of earphone covers die assembly according to claim 1, is characterized in that: described upper mold core offers two semi-circular cavity.
6. a kind of earphone covers die assembly according to claim 1, is characterized in that: the shape of described die cavity is for circular, oval or square.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520648915.3U CN204948310U (en) | 2015-08-26 | 2015-08-26 | A kind of earphone covers die assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520648915.3U CN204948310U (en) | 2015-08-26 | 2015-08-26 | A kind of earphone covers die assembly |
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Publication Number | Publication Date |
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CN204948310U true CN204948310U (en) | 2016-01-06 |
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CN201520648915.3U Active CN204948310U (en) | 2015-08-26 | 2015-08-26 | A kind of earphone covers die assembly |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109016548A (en) * | 2018-07-16 | 2018-12-18 | 东莞富采包装制品有限公司 | A kind of production line with shell earphone covers |
-
2015
- 2015-08-26 CN CN201520648915.3U patent/CN204948310U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109016548A (en) * | 2018-07-16 | 2018-12-18 | 东莞富采包装制品有限公司 | A kind of production line with shell earphone covers |
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Address after: 523000 Room 208, Building 1, No. 19, Sanjiang Industrial Park Road, Hengli Town, Dongguan City, Guangdong Province Patentee after: Kusen Electronics Technology Co.,Ltd. Address before: Dongguan Kusen Electronic Technology Co., Ltd., Weixing Road, Libian Village, Chashan Town, Dongguan City, Guangdong Province, 523000 Patentee before: DONGGUAN KUSEN ELECTRONIC TECHNOLOGY CO.,LTD. |