WO2014046772A1 - Heat sinking and electromagnetic shielding structures - Google Patents

Heat sinking and electromagnetic shielding structures Download PDF

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Publication number
WO2014046772A1
WO2014046772A1 PCT/US2013/050737 US2013050737W WO2014046772A1 WO 2014046772 A1 WO2014046772 A1 WO 2014046772A1 US 2013050737 W US2013050737 W US 2013050737W WO 2014046772 A1 WO2014046772 A1 WO 2014046772A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
electronic device
device defined
fence
metal heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2013/050737
Other languages
French (fr)
Inventor
Dominic Dolci
James G. SMEENGE
Vinh Diep
Chiew-Siang Goh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apple Inc
Original Assignee
Apple Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apple Inc filed Critical Apple Inc
Publication of WO2014046772A1 publication Critical patent/WO2014046772A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • This relates generally to electronic devices and, more particularly, to radio-frequency shielding and thermal management structures for components in electronic devices.
  • Electronic devices often contain components such as radio-frequency transmitters and other circuits that use electromagnetic interference (EMI) shielding
  • Electromagnetic interference shielding structures may help prevent radio-frequency signals that are generated by one component from disrupting the
  • structures may be formed from metal shielding cans
  • a typical shielding has an inner metal fence and an outer metal lid structure.
  • heat sink structures may be thermally coupled to the exterior of an electromagnetic shielding can.
  • a thermally conductive elastomeric pad may be interposed between the integrated circuit and the shielding can to fill air gaps between the integrated circuit and the shielding can and another thermally conductive elastomeric pad may be interposed between the shielding can and the heat sink.
  • An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are sensitive to electromagnetic interference.
  • Metal heat spreading structures can be configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding.
  • the electronic components are mounted to a dielectric substrate using solder.
  • the dielectric substrate using solder.
  • substrate is formed from a rigid or flexible printed circuit or other dielectric material.
  • Each metal fence has an opening that overlaps a respective one of the components.
  • conductive structure such as an elastomeric gap filler pad is mounted in each opening.
  • the metal heat spreading structures are electrically shorted to each fence structure using a conductive gasket that surrounds the gap filler pad in that fence. This allows the metal heat spreading
  • Heat from the components travels through the gap filler pads on the components to the metal heat spreading structure.
  • the heat spreading structure may laterally spread and dissipate the heat.
  • a heat spreading structure may be mounted directly over a component.
  • sidewall portions of the heat spreading structure are shorted to traces on the substrate.
  • a recess in the heat spreading structure is configured to receive the component.
  • a gap filler or other thermally conductive structure is interposed between the component and the upper surface of the recess.
  • FIG. 1 is a perspective view of an illustrative electronic device of the type that may be provided with electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
  • FIG. 2 is an exploded perspective view of an illustrative electronic device with electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
  • FIG. 3 is a cross-sectional side view of electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
  • FIG. 4 is a cross-sectional side view of an electronic device having a housing in which
  • electromagnetic interference shielding and thermal management structures have been installed in accordance with an embodiment.
  • FIG. 5 is a cross-sectional side view of an electronic device having a housing that is used in forming electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
  • FIG. 6 is an exploded rear perspective view of an illustrative electronic device with electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
  • FIG. 7 is a cross-sectional side view of electromagnetic interference shielding and thermal management structures that have been coupled to a printed circuit substrate and that include a recess for
  • FIG. 8 is a cross-sectional side view of electromagnetic interference shielding and thermal management structures that have been coupled to a metal fence structure on a printed circuit substrate in accordance with an embodiment.
  • An electronic device may be provided with electronic components such as integrated circuits. These components may be provided with electromagnetic signals.
  • interference and heat sinking structures sometimes referred to as heat spreading structures, heat spreaders, heat spreader structures, or thermal management
  • FIG. 1 An illustrative electronic device is shown in FIG. 1.
  • Electronic device 10 of FIG. 1 has openings 14 in housing 12. Openings 14 form connector ports for connectors such as Ethernet plugs, Universal Serial Bus connectors, power connectors, audio jacks, and other connectors.
  • Housing 12 which may sometimes be referred to as an enclosure or case, may be formed of plastic, glass, ceramics, fiber composites, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.
  • Housing 12 may be formed using a unibody configuration in which some or all of housing 12 is machined or molded as a single structure or can be formed using multiple
  • structures e.g., an internal frame structure, one or more structures that form exterior housing surfaces, etc.
  • Electronic device 10 of FIG. 1 is a set-top box that provides video signals to a television or other display. If desired, electronic device 10 may be
  • portable devices somewhat smaller portable devices such as wrist-watch devices, pendant devices, or other wearable or miniature devices, gaming equipment, tablet computers, notebook computers, desktop computers, televisions, computer monitors, computers integrated into computer displays, wireless access points, or other electronic equipment .
  • the use of a set-top box form factor in implementing device 10 is merely illustrative.
  • FIG. 2 An exploded perspective view of device 10 is shown in FIG. 2. As shown in FIG. 2, device 10 has housing base structure 16. Housing structure 16 has sidewall portions 46 that surround recessed rear portion 44. Housings with other shapes and sizes may be used for device 10 if desired.
  • Components 20 are mounted on dielectric
  • Components 20 may include integrated circuits, discrete components such as resistors,
  • Examples of integrated circuits that may be used in forming components 20 include memory circuits, clock circuits, display driver circuits, radio-frequency integrated circuits such a radio-frequency transceiver circuitry associated with cellular telephone
  • radio-frequency transceiver circuitry associated with wireless local area network (WLAN) communications
  • WLAN wireless local area network
  • satellite navigation system integrated circuits such as a Global Positioning System receiver
  • wireless radio-frequency transceiver circuitry for WLAN Wireless Local Area Network
  • Substrate 18 may be a printed circuit board, a flexible printed circuit such as a printed circuit formed from a flexible sheet of polyimide or a layer of other polymer material, a rigid printed circuit board formed from fiberglass-filled epoxy or other printed circuit board substrate material, a dielectric such as plastic, glass, or ceramic, or other insulating material. Configurations in which dielectric substrate 18 is a printed circuit are sometimes described herein as an example.
  • Components 20 are soldered on printed circuit substrate 18 using solder.
  • Fences 26 have leg portions 24 that are soldered to printed circuit substrate 22 using solder on solder pads 22.
  • Fences 26 are formed from metal. Other types of materials may be used to form fences if desired.
  • Fences 26 have openings 28. Openings 28 overlap components 20 and have shapes and sizes that are configured to expose upper surfaces 48 of components 20.
  • Thermally conductive elastomeric pads 30, which may sometimes be referred to as gap-filling pads or gap pads, have shapes such as rectangular shapes that are configured to be received within openings 28.
  • Elastomeric pads 30 are formed from elastomeric polymer material filled with thermally conductive material such as metal particles. During operation of device 10, thermally conductive pads 30 are compressed between upper surfaces 48 of components 20 and the lower surface of structures
  • Structures 36 are formed from metal and are therefore thermally and electrically conductive.
  • structures 36 are formed from aluminum. Examples of other materials that may be used in forming structures 36 include stainless steel and carbon- fiber composites or other fiber-based composites.
  • Conductive structures such as conductive gaskets 32 are used to couple fences 26 to metal structure 36.
  • Conductive gaskets 32 have shapes that are configured to match the outlines of fences 26.
  • Conductive gaskets 32 may, as an example, have rectangular ring shapes with outlines that match the rectangular outlines of fences 26 and openings 34 that match the shape of gap pads 30 and openings 28. Examples of materials that may be used in forming conductive gaskets 26 include compressible
  • conductive foam e.g., conductive foam, conductive adhesive, and conductive fabric (e.g., fabric formed from thin metal wires and/or plastic wires coated with metal) .
  • conductive fabric e.g., fabric formed from thin metal wires and/or plastic wires coated with metal
  • metal structures 36 are sufficiently thermally conductive to spread and help dissipate heat, metal structures 36 may sometimes be referred to as metal heat spreader structures, metal thermal management
  • Metal heat sink structures are structures, or metal heat sink structures.
  • Metal heat sink structures are structures, or metal heat sink structures.
  • structures 36 can be configured to mate with structures 16 so that structures 36 and 16 form some or all of a metal housing for device 10 (i.e., so that structures 36 and 16 form housing 12 of FIG. 1) .
  • optional housing structure 38 can be configured to mate with structures 16.
  • Optional housing structures 38 may be formed from plastic, metal, or other materials and may have a shape that covers metal structure 36. In configurations in which housing structures 38 and structure 16 form housing 12 in this way, housing structures 38 can be provided with a recess or other shape that receives heat spreader 36.
  • electromagnetic shielding functions are provided by the metal of fences 26, conductive gasket structures 32, and the metal of structures 36.
  • Ground plane metal e.g., ground traces
  • Thermal conduction is provided by gap pads 30 and metal structure 36.
  • Metal structure 36 therefor serves both as an electromagnetic shielding structure that prevents interference from disruption device operation and as a heat sink that dissipates heat from underlying components 20.
  • a cross-sectional view of device 10 of FIG. 2 taken along line 40 and viewed in direction 42 is shown in FIG. 3.
  • vertically extending leg portions 24 of fence 26 are soldered to metal solder pads 54 on substrate 18 using solder 56.
  • Electrical component 20 e.g., an integrated circuit
  • Metal structure 36 of FIG. 3 is formed from aluminum and has a thin insulating coating.
  • Coating 36C in the FIG. 3 example is formed from aluminum oxide.
  • metal structure 36 may be formed from materials other than aluminum, if desired.
  • insulating coating 36C is removed (e.g., by laser etching or other suitable removal techniques) from regions 52 on the underside of metal structure 36. Because regions 52 are free of insulating material (i.e., because regions 52 are associated with exposed metal) , conductive gasket 32 electrically shorts fence 26 to metal structures 36. This allows metal structures 36 (in combination with fence 26 and, if desired, traces 60) to form an electromagnetic
  • Gap filler pad 30 is compressed between upper surface 48 of component 20 and the opposing lower surface of metal structure 36. This provides a thermal path between component 20 and structure 36.
  • Gap pad 30 has a relatively high thermal conductivity.
  • the high thermal conductivity of gap pad 30 e.g., 0.3 W/mK or more, 1 W/mK or more, or 2.5 W/mK or more
  • Lines 62 show how the heat that has been spread throughout structure 36 in this way dissipates outwards into the surrounding environment.
  • Structure 36 therefore serves not only as an
  • electromagnetic interference shield for component 20 but also serves as a heat sinking structure for component 20.
  • the configuration used for the metal structures of FIG. 3 therefore integrates thermal management features and electromagnetic shielding.
  • housing 12 may be formed from structures that are separate from metal structure 36.
  • FIG. 4 This type of configuration is shown in FIG. 4. As shown in FIG. 4, multiple components 20 may be mounted on substrate 18. Housing 12 of FIG. 4 includes upper
  • Upper structure 38 and lower structure 16 are formed from a material such as metal, plastic, or fiber-based composite material (as examples) .
  • Metal structure 36 overlaps one or more components 20.
  • Upper housing structure 38 serves as a cover that overlaps and covers the upper surface of metal structure 36.
  • Upper housing structure 38 of FIG. 4 also have sidewalls that cover the edges of device 10 and that mate with the peripheral edges of lower housing structure 16.
  • housing 12 is formed from metal structure 36 and structure 16.
  • Metal structure 36 has sidewall portions 36W that serve as housing sidewalls.
  • Metal structure 36 mates with housing structure 16 along the lower edges of sidewalls 36W. Because no separate housing structure is used to cover the exposed upper surface of metal structure 36 in the configuration of FIG. 5, heat 62 may be radiated directly into the surrounding environment from metal structure 36 without passing through intermediate housing structures .
  • FIG. 6 is an exploded rear perspective view of device 10 (with lower housing portion 16 removed) in a configuration in which screws 90 are used to attach substrate 18 to device 10.
  • Substrate 18 has screw holes 92 through which the shafts of screws 90 pass.
  • Screws 96 are used to attach metal structure 36 to housing structure 38.
  • Screws 96 have threaded holes 94 that are configured to receive the threaded shafts of screws 90.
  • Portions 36C of metal structure 36 are coated with an insulating coating such as aluminum oxide, but portions 52 are free of insulating coating.
  • Housing 38 of FIG. 6 contains components 98 in addition to the components that are covered with metal structure 36.
  • metal structure 36 may be mounted directly to substrate 18. This type of configuration is shown in FIG. 7. As shown in FIG. 7, metal structure 36 has one or more recesses (cavities) such as recess 100 that are configured to receive components such as
  • Thermally conductive gap filler pad 30 is coupled between component 20 and the inner surface of recess 100 to transfer heat from component 20 to metal structure 36 during operation.
  • Portions 36V of metal structure 36 form sidewalls that help enclose and electromagnetically shield component 20.
  • conductive structures 104 are coupled between metal structures 36 (i.e., portions 36V) and traces 102.
  • Conductive structures 104 may be formed from conductive adhesive, conductive fabric (e.g., metal wool or plastic fibers covered with metal) , conductive foam, conductive elastomeric material, other compressible conductive materials, solder, welds, metal springs, or combinations of these structures.
  • Metal structure 36 is formed from a metal such as aluminum and is covered with an insulating coating such as aluminum oxide. Portion 52 of metal structure 36 is free of aluminum to allow metal structure 36 to be electrically shorted to metal traces such as metal trace 102 through conductive structures 104.
  • FIG. 8 is a cross-sectional side view of device
  • Component 20 may protrude into a recess in the lower portion of metal structure 36 or may lie flush with the lower surface of metal structure 36.
  • a thermally conductive gap filler pad (see, e.g., pad 30 of FIG. 2) is interposed between component 20 and metal structure 36 to enhance thermal conductivity.
  • Metal protrusions 108 are interposed between component 20 and metal structure 36 to enhance thermal conductivity.
  • an electronic device that includes a dielectric substrate, at least one electrical component mounted on the
  • a metal heat spreader structure that is configured to dissipate heat from the electrical component and that is configured to serve as part of an electromagnetic interference shield for the electrical component .
  • the electronic device includes a metal fence surrounding the electrical component where the metal heat spreader
  • the electronic device includes a conductive gasket that is interposed between the metal heat spreader structure and the metal fence and that electrically shorts the metal structure to the metal frame.
  • the conductive gasket includes a conductive material selected from the group consisting of conductive foam, conductive fabric, and conductive adhesive.
  • the metal heat spreader structure includes aluminum coated with aluminum oxide, where the aluminum has an exposed portion that is free of the aluminum oxide, and the conductive gasket electrically shorts the metal frame to the exposed portion .
  • the electronic device includes a thermally conductive
  • the metal heat spreader structure is configured to form an exterior surface of a housing for the electronic device.
  • the electronic device includes a housing structure that covers the metal heat spreader structure.
  • the metal fence has an opening over the electrical component and the thermally conductive elastomeric gap filler pad is
  • the electronic device includes solder pads on the dielectric substrate and solder with which the metal fence is
  • the dielectric substrate includes holes; the electronic device further includes screws with which the substrate is attached to the metal heat spreader structure.
  • the metal fence includes protruding portions that contact the metal heat spreader structure.
  • the metal heat spreader structure has a recess that is configured to receive at least part of the electrical component.
  • the dielectric substrate includes a printed circuit.
  • the component includes a radio-frequency transceiver
  • integrated circuit includes a substrate to which the integrated circuit is mounted, a metal heat spreading structure having a recess that covers the integrated circuit, at least one metal trace on the substrate, and solder that solders the metal heat
  • the apparatus includes a thermally conductive elastomeric gap filler pad interposed between the integrated circuit and the metal heat spreading structure.
  • the metal heat spreading structure includes aluminum coated with aluminum oxide and a portion of the aluminum oxide is removed to form an aluminum-oxide-free region that is soldered to the metal trace with the solder.
  • the substrate includes a printed circuit and the integrated circuit includes a radio-frequency transceiver.
  • an electronic device in accordance with an embodiment, includes a printed circuit having solder pads, an integrated circuit mounted on the printed circuit, a metal fence structure soldered to the solder pads, the metal fence structure has an opening that overlaps the integrated circuit, a thermally conductive layer of material in the opening that contacts the
  • the integrated circuit includes a radio-frequency transceiver
  • the metal heat sink structure includes aluminum covered at least partly with an insulating coating, and a portion of the aluminum is free of the insulating coating and is electrically shorted to the metal fence structure.
  • the electronic device includes a compressible conductive gasket interposed between the portion of the aluminum that is free of the insulating coating and the metal fence structure .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)

Abstract

An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.

Description

Heat Sinking and Electromagnetic Shielding Structures
This application claims priority to United
States patent application No. 13/623,436 filed September 20, 2012, is hereby incorporated by reference herein in its entirety.
Background
This relates generally to electronic devices and, more particularly, to radio-frequency shielding and thermal management structures for components in electronic devices.
Electronic devices often contain components such as radio-frequency transmitters and other circuits that use electromagnetic interference (EMI) shielding
structures. Electromagnetic interference shielding structures may help prevent radio-frequency signals that are generated by one component from disrupting the
operation of another component that is sensitive to radio- frequency interference. Electromagnetic shielding
structures may be formed from metal shielding cans
soldered to printed circuit boards. A typical shielding has an inner metal fence and an outer metal lid structure.
The operation of integrated circuits such as radio-frequency transmitters and other circuitry tends to generate heat. To properly dissipate heat that is
generated during operation, heat sink structures may be thermally coupled to the exterior of an electromagnetic shielding can. To ensure satisfactory heat transfer from a shielded integrated circuit to a heat sink, a thermally conductive elastomeric pad may be interposed between the integrated circuit and the shielding can to fill air gaps between the integrated circuit and the shielding can and another thermally conductive elastomeric pad may be interposed between the shielding can and the heat sink. The use of multiple thermally conductive paths and
separate heat sink and electromagnetic interference shielding structures tends to make designs of this type complex and costly and may reduce the efficacy of the overall structure in removing heat from a component during operation .
It would therefore be desirable to be able to provide improved ways in which to provide components in electronic devices with heat sinking and electromagnetic interference shielding structures. Summary
An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are sensitive to electromagnetic interference. Metal heat spreading structures can be configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding.
The electronic components are mounted to a dielectric substrate using solder. The dielectric
substrate is formed from a rigid or flexible printed circuit or other dielectric material. Metal fence
structures are soldered to the substrate over the
components. Each metal fence has an opening that overlaps a respective one of the components. A thermally
conductive structure such as an elastomeric gap filler pad is mounted in each opening.
The metal heat spreading structures are electrically shorted to each fence structure using a conductive gasket that surrounds the gap filler pad in that fence. This allows the metal heat spreading
structure to serve as part of an electromagnetic
interference shield.
Heat from the components travels through the gap filler pads on the components to the metal heat spreading structure. The heat spreading structure may laterally spread and dissipate the heat.
If desired, a heat spreading structure may be mounted directly over a component. In this type of configuration, sidewall portions of the heat spreading structure are shorted to traces on the substrate. A recess in the heat spreading structure is configured to receive the component. A gap filler or other thermally conductive structure is interposed between the component and the upper surface of the recess.
Further features, their nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments.
Brief Description of the Drawings
FIG. 1 is a perspective view of an illustrative electronic device of the type that may be provided with electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
FIG. 2 is an exploded perspective view of an illustrative electronic device with electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
FIG. 3 is a cross-sectional side view of electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
FIG. 4 is a cross-sectional side view of an electronic device having a housing in which
electromagnetic interference shielding and thermal management structures have been installed in accordance with an embodiment.
FIG. 5 is a cross-sectional side view of an electronic device having a housing that is used in forming electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
FIG. 6 is an exploded rear perspective view of an illustrative electronic device with electromagnetic interference shielding and thermal management structures in accordance with an embodiment.
FIG. 7 is a cross-sectional side view of electromagnetic interference shielding and thermal management structures that have been coupled to a printed circuit substrate and that include a recess for
accommodating a component in accordance with an
embodiment .
FIG. 8 is a cross-sectional side view of electromagnetic interference shielding and thermal management structures that have been coupled to a metal fence structure on a printed circuit substrate in accordance with an embodiment.
Detailed Description
An electronic device may be provided with electronic components such as integrated circuits. These components may be provided with electromagnetic
interference and heat sinking structures (sometimes referred to as heat spreading structures, heat spreaders, heat spreader structures, or thermal management
structures) . An illustrative electronic device is shown in FIG. 1. Electronic device 10 of FIG. 1 has openings 14 in housing 12. Openings 14 form connector ports for connectors such as Ethernet plugs, Universal Serial Bus connectors, power connectors, audio jacks, and other connectors. Housing 12, which may sometimes be referred to as an enclosure or case, may be formed of plastic, glass, ceramics, fiber composites, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.
Housing 12 may be formed using a unibody configuration in which some or all of housing 12 is machined or molded as a single structure or can be formed using multiple
structures (e.g., an internal frame structure, one or more structures that form exterior housing surfaces, etc.).
Electronic device 10 of FIG. 1 is a set-top box that provides video signals to a television or other display. If desired, electronic device 10 may be
implemented using other types of equipment such as
cellular telephones, media players, other handheld
portable devices, somewhat smaller portable devices such as wrist-watch devices, pendant devices, or other wearable or miniature devices, gaming equipment, tablet computers, notebook computers, desktop computers, televisions, computer monitors, computers integrated into computer displays, wireless access points, or other electronic equipment . The use of a set-top box form factor in implementing device 10 is merely illustrative.
An exploded perspective view of device 10 is shown in FIG. 2. As shown in FIG. 2, device 10 has housing base structure 16. Housing structure 16 has sidewall portions 46 that surround recessed rear portion 44. Housings with other shapes and sizes may be used for device 10 if desired.
Components 20 are mounted on dielectric
substrate 18. Components 20 may include integrated circuits, discrete components such as resistors,
capacitors, and inductors, connectors, and other
circuitry. Examples of integrated circuits that may be used in forming components 20 include memory circuits, clock circuits, display driver circuits, radio-frequency integrated circuits such a radio-frequency transceiver circuitry associated with cellular telephone
communications, radio-frequency transceiver circuitry associated with wireless local area network (WLAN) communications, satellite navigation system integrated circuits such as a Global Positioning System receiver, wireless radio-frequency transceiver circuitry for
Bluetooth® communications, processors, power amplifiers, timing circuits, wireless circuits, and other circuitry. Substrate 18 may be a printed circuit board, a flexible printed circuit such as a printed circuit formed from a flexible sheet of polyimide or a layer of other polymer material, a rigid printed circuit board formed from fiberglass-filled epoxy or other printed circuit board substrate material, a dielectric such as plastic, glass, or ceramic, or other insulating material. Configurations in which dielectric substrate 18 is a printed circuit are sometimes described herein as an example.
Components 20 are soldered on printed circuit substrate 18 using solder. Fences 26 have leg portions 24 that are soldered to printed circuit substrate 22 using solder on solder pads 22. Fences 26 are formed from metal. Other types of materials may be used to form fences if desired. Fences 26 have openings 28. Openings 28 overlap components 20 and have shapes and sizes that are configured to expose upper surfaces 48 of components 20.
Thermally conductive elastomeric pads 30, which may sometimes be referred to as gap-filling pads or gap pads, have shapes such as rectangular shapes that are configured to be received within openings 28. Elastomeric pads 30 are formed from elastomeric polymer material filled with thermally conductive material such as metal particles. During operation of device 10, thermally conductive pads 30 are compressed between upper surfaces 48 of components 20 and the lower surface of structures
36. Structures 36 are formed from metal and are therefore thermally and electrically conductive. With one
illustrative configuration, structures 36 are formed from aluminum. Examples of other materials that may be used in forming structures 36 include stainless steel and carbon- fiber composites or other fiber-based composites.
Conductive structures such as conductive gaskets 32 are used to couple fences 26 to metal structure 36. Conductive gaskets 32 have shapes that are configured to match the outlines of fences 26. Conductive gaskets 32 may, as an example, have rectangular ring shapes with outlines that match the rectangular outlines of fences 26 and openings 34 that match the shape of gap pads 30 and openings 28. Examples of materials that may be used in forming conductive gaskets 26 include compressible
materials such as conductive foam, conductive adhesive, and conductive fabric (e.g., fabric formed from thin metal wires and/or plastic wires coated with metal) .
Because metal structures 36 are sufficiently thermally conductive to spread and help dissipate heat, metal structures 36 may sometimes be referred to as metal heat spreader structures, metal thermal management
structures, or metal heat sink structures. Metal
structures 36 can be configured to mate with structures 16 so that structures 36 and 16 form some or all of a metal housing for device 10 (i.e., so that structures 36 and 16 form housing 12 of FIG. 1) . If desired, optional housing structure 38 can be configured to mate with structures 16. Optional housing structures 38 may be formed from plastic, metal, or other materials and may have a shape that covers metal structure 36. In configurations in which housing structures 38 and structure 16 form housing 12 in this way, housing structures 38 can be provided with a recess or other shape that receives heat spreader 36.
When assembled to form device 10,
electromagnetic shielding functions are provided by the metal of fences 26, conductive gasket structures 32, and the metal of structures 36. Ground plane metal (e.g., ground traces) in substrate 18 and/or metal in housing portion 16 may also be used in forming electromagnetic shielding functions. Thermal conduction is provided by gap pads 30 and metal structure 36. Metal structure 36 therefor serves both as an electromagnetic shielding structure that prevents interference from disruption device operation and as a heat sink that dissipates heat from underlying components 20. A cross-sectional view of device 10 of FIG. 2 taken along line 40 and viewed in direction 42 is shown in FIG. 3. As shown in FIG. 3, vertically extending leg portions 24 of fence 26 are soldered to metal solder pads 54 on substrate 18 using solder 56. Electrical component 20 (e.g., an integrated circuit) is soldered to metal solder pads 22 on substrate 18 using solder 50.
Metal structure 36 of FIG. 3 is formed from aluminum and has a thin insulating coating. Coating 36C in the FIG. 3 example is formed from aluminum oxide.
Other insulating coatings may be formed on metal structure 36 and metal structure 36 may be formed from materials other than aluminum, if desired.
To ensure that metal structure 36 is
electrically connected to gasket 32 and fence 26 (and, if desired, to internal metal traces such as metal ground traces 60 in substrate 18), insulating coating 36C is removed (e.g., by laser etching or other suitable removal techniques) from regions 52 on the underside of metal structure 36. Because regions 52 are free of insulating material (i.e., because regions 52 are associated with exposed metal) , conductive gasket 32 electrically shorts fence 26 to metal structures 36. This allows metal structures 36 (in combination with fence 26 and, if desired, traces 60) to form an electromagnetic
interference shield for component 20.
Gap filler pad 30 is compressed between upper surface 48 of component 20 and the opposing lower surface of metal structure 36. This provides a thermal path between component 20 and structure 36. Gap pad 30 has a relatively high thermal conductivity. The high thermal conductivity of gap pad 30 (e.g., 0.3 W/mK or more, 1 W/mK or more, or 2.5 W/mK or more) allows heat to flow from component 20 to structure 36 in vertical dimension Z and to spread laterally outward in the X-Y plane of FIG. 3, as illustrated by lines 58. Lines 62 show how the heat that has been spread throughout structure 36 in this way dissipates outwards into the surrounding environment.
Structure 36 therefore serves not only as an
electromagnetic interference shield for component 20, but also serves as a heat sinking structure for component 20. The configuration used for the metal structures of FIG. 3 therefore integrates thermal management features and electromagnetic shielding.
If desired, housing 12 may be formed from structures that are separate from metal structure 36.
This type of configuration is shown in FIG. 4. As shown in FIG. 4, multiple components 20 may be mounted on substrate 18. Housing 12 of FIG. 4 includes upper
structure 38 and lower structure 16. Upper structure 38 and lower structure 16 are formed from a material such as metal, plastic, or fiber-based composite material (as examples) . Metal structure 36 overlaps one or more components 20. Upper housing structure 38 serves as a cover that overlaps and covers the upper surface of metal structure 36. Upper housing structure 38 of FIG. 4 also have sidewalls that cover the edges of device 10 and that mate with the peripheral edges of lower housing structure 16.
In the illustrative configuration of FIG. 5, housing 12 is formed from metal structure 36 and structure 16. Metal structure 36 has sidewall portions 36W that serve as housing sidewalls. Metal structure 36 mates with housing structure 16 along the lower edges of sidewalls 36W. Because no separate housing structure is used to cover the exposed upper surface of metal structure 36 in the configuration of FIG. 5, heat 62 may be radiated directly into the surrounding environment from metal structure 36 without passing through intermediate housing structures .
FIG. 6 is an exploded rear perspective view of device 10 (with lower housing portion 16 removed) in a configuration in which screws 90 are used to attach substrate 18 to device 10. Substrate 18 has screw holes 92 through which the shafts of screws 90 pass. Screws 96 are used to attach metal structure 36 to housing structure 38. Screws 96 have threaded holes 94 that are configured to receive the threaded shafts of screws 90. Portions 36C of metal structure 36 are coated with an insulating coating such as aluminum oxide, but portions 52 are free of insulating coating. When substrate 18 is screwed into place on metal structure 52, gasket structures 32 are compressed against bare metal portion 52 of metal
structure 36. Housing 38 of FIG. 6 contains components 98 in addition to the components that are covered with metal structure 36.
If desired, metal structure 36 may be mounted directly to substrate 18. This type of configuration is shown in FIG. 7. As shown in FIG. 7, metal structure 36 has one or more recesses (cavities) such as recess 100 that are configured to receive components such as
component 20. Thermally conductive gap filler pad 30 is coupled between component 20 and the inner surface of recess 100 to transfer heat from component 20 to metal structure 36 during operation.
Portions 36V of metal structure 36 form sidewalls that help enclose and electromagnetically shield component 20. To electrically couple metal structure 36 to metal traces in substrate 18 such as metal trace (solder pad) 102 and internal traces 60 (e.g., ground traces) , conductive structures 104 are coupled between metal structures 36 (i.e., portions 36V) and traces 102. Conductive structures 104 may be formed from conductive adhesive, conductive fabric (e.g., metal wool or plastic fibers covered with metal) , conductive foam, conductive elastomeric material, other compressible conductive materials, solder, welds, metal springs, or combinations of these structures. Metal structure 36 is formed from a metal such as aluminum and is covered with an insulating coating such as aluminum oxide. Portion 52 of metal structure 36 is free of aluminum to allow metal structure 36 to be electrically shorted to metal traces such as metal trace 102 through conductive structures 104.
FIG. 8 is a cross-sectional side view of device
10 in a configuration of the type shown in FIG. 7 where metal structure 36 contacts protruding portions 108 of fence 26. Component 20 may protrude into a recess in the lower portion of metal structure 36 or may lie flush with the lower surface of metal structure 36. A thermally conductive gap filler pad (see, e.g., pad 30 of FIG. 2) is interposed between component 20 and metal structure 36 to enhance thermal conductivity. Metal protrusions 108
(e.g., metal spring structures) may be located no more than a quarter of a wavelength apart at radio-frequency operating frequencies of interest, to ensure that fence 26 and metal structure 36 provide satisfactorily shielding for electromagnetic interference. If desired, protrusions 108 may be supplemented by or replaced by conductive structures such as conductive adhesive, conductive fabric, conductive foam, conductive elastomeric material, other compressible conductive materials, solder, welds, or combinations of these materials. In accordance with an embodiment, an electronic device is provided that includes a dielectric substrate, at least one electrical component mounted on the
dielectric substrate, and a metal heat spreader structure that is configured to dissipate heat from the electrical component and that is configured to serve as part of an electromagnetic interference shield for the electrical component .
In accordance with another embodiment, the electronic device includes a metal fence surrounding the electrical component where the metal heat spreader
structure is shorted to the metal fence.
In accordance with another embodiment, the electronic device includes a conductive gasket that is interposed between the metal heat spreader structure and the metal fence and that electrically shorts the metal structure to the metal frame.
In accordance with another embodiment, the conductive gasket includes a conductive material selected from the group consisting of conductive foam, conductive fabric, and conductive adhesive.
In accordance with another embodiment, the metal heat spreader structure includes aluminum coated with aluminum oxide, where the aluminum has an exposed portion that is free of the aluminum oxide, and the conductive gasket electrically shorts the metal frame to the exposed portion .
In accordance with another embodiment, the electronic device includes a thermally conductive
elastomeric gap filler pad interposed between the
component and the metal heat spreader structure.
In accordance with another embodiment, the metal heat spreader structure is configured to form an exterior surface of a housing for the electronic device.
In accordance with another embodiment, the electronic device includes a housing structure that covers the metal heat spreader structure.
In accordance with another embodiment, the metal fence has an opening over the electrical component and the thermally conductive elastomeric gap filler pad is
received within the opening.
In accordance with another embodiment, the electronic device includes solder pads on the dielectric substrate and solder with which the metal fence is
soldered to the solder pads.
In accordance with another embodiment, the dielectric substrate includes holes; the electronic device further includes screws with which the substrate is attached to the metal heat spreader structure.
In accordance with another embodiment, the metal fence includes protruding portions that contact the metal heat spreader structure.
In accordance with another embodiment, the metal heat spreader structure has a recess that is configured to receive at least part of the electrical component.
In accordance with another embodiment, the dielectric substrate includes a printed circuit.
In accordance with another embodiment, the component includes a radio-frequency transceiver
integrated circuit.
In accordance with an embodiment, apparatus for heat sinking and electromagnetically shielding an
integrated circuit is provided that includes a substrate to which the integrated circuit is mounted, a metal heat spreading structure having a recess that covers the integrated circuit, at least one metal trace on the substrate, and solder that solders the metal heat
spreading structure to the metal trace.
In accordance with another embodiment, the apparatus includes a thermally conductive elastomeric gap filler pad interposed between the integrated circuit and the metal heat spreading structure.
In accordance with another embodiment, the metal heat spreading structure includes aluminum coated with aluminum oxide and a portion of the aluminum oxide is removed to form an aluminum-oxide-free region that is soldered to the metal trace with the solder.
In accordance with another embodiment, the substrate includes a printed circuit and the integrated circuit includes a radio-frequency transceiver.
In accordance with an embodiment, an electronic device is provided that includes a printed circuit having solder pads, an integrated circuit mounted on the printed circuit, a metal fence structure soldered to the solder pads, the metal fence structure has an opening that overlaps the integrated circuit, a thermally conductive layer of material in the opening that contacts the
integrated circuit, and a metal heat sink structure that contacts the thermally conductive layer of material.
In accordance with another embodiment, the integrated circuit includes a radio-frequency transceiver, the metal heat sink structure includes aluminum covered at least partly with an insulating coating, and a portion of the aluminum is free of the insulating coating and is electrically shorted to the metal fence structure.
In accordance with another embodiment, the electronic device includes a compressible conductive gasket interposed between the portion of the aluminum that is free of the insulating coating and the metal fence structure .
The foregoing is merely illustrative and various modifications can be made by those skilled in the art without departing from the scope and spirit of the
described embodiments. The foregoing embodiments may be implemented individually or in any combination.

Claims

What is Claimed is:
1. An electronic device, comprising:
a dielectric substrate;
at least one electrical component mounted on the dielectric substrate; and
a metal heat spreader structure that is configured to dissipate heat from the electrical component and that is configured to serve as part of an
electromagnetic interference shield for the electrical component .
2. The electronic device defined in claim 1 further comprising:
a metal fence surrounding the electrical component, wherein the metal heat spreader structure is shorted to the metal fence.
3. The electronic device defined in claim 2 further comprising a conductive gasket that is interposed between the metal heat spreader structure and the metal fence and that electrically shorts the metal structure to the metal frame.
4. The electronic device defined in claim 3 wherein the conductive gasket comprises a conductive material selected from the group consisting of:
conductive foam, conductive fabric, and conductive
adhesive .
5. The electronic device defined in claim 3 wherein the metal heat spreader structure comprises aluminum coated with aluminum oxide, wherein the aluminum has an exposed portion that is free of the aluminum oxide, and wherein the conductive gasket electrically shorts the metal frame to the exposed portion.
6. The electronic device defined in claim 5 further comprising a thermally conductive elastomeric gap filler pad interposed between the component and the metal heat spreader structure.
7. The electronic device defined in claim 6 wherein the metal heat spreader structure is configured to form an exterior surface of a housing for the electronic device .
8. The electronic device defined in claim 6 further comprising a housing structure that covers the metal heat spreader structure.
9. The electronic device defined in claim 6 wherein the metal fence has an opening over the electrical component and wherein the thermally conductive elastomeric gap filler pad is received within the opening.
10. The electronic device defined in claim 2 further comprising solder pads on the dielectric substrate and solder with which the metal fence is soldered to the solder pads.
11. The electronic device defined in claim 2 wherein the dielectric substrate comprises holes, the electronic device further comprising screws with which the substrate is attached to the metal heat spreader
structure .
12. The electronic device defined in claim 2 wherein the metal fence comprises protruding portions that contact the metal heat spreader structure.
13. The electronic device defined in claim 2 wherein the metal heat spreader structure has a recess that is configured to receive at least part of the
electrical component.
14. The electronic device defined in claim 2 wherein the dielectric substrate comprises a printed circuit .
15. The electronic device defined in claim 1 wherein the component comprises a radio-frequency
transceiver integrated circuit.
16. Apparatus for heat sinking and
electromagnetically shielding an integrated circuit, comprising :
a substrate to which the integrated circuit is mounted;
a metal heat spreading structure having a recess that covers the integrated circuit;
at least one metal trace on the substrate; and
solder that solders the metal heat
spreading structure to the metal trace.
17. The apparatus defined in claim 16 further comprising :
a thermally conductive elastomeric gap filler pad interposed between the integrated circuit and the metal heat spreading structure.
18. The apparatus defined in claim 17 wherein the metal heat spreading structure comprises aluminum coated with aluminum oxide and wherein a portion of the aluminum oxide is removed to form an aluminum-oxide-free region that is soldered to the metal trace with the solder .
19. The apparatus defined in claim 18 wherein the substrate comprises a printed circuit and wherein the integrated circuit comprises a radio-frequency
transceiver .
20. An electronic device, comprising:
a printed circuit having solder pads;
an integrated circuit mounted on the printed circuit;
a metal fence structure soldered to the solder pads, wherein the metal fence structure has an opening that overlaps the integrated circuit;
a thermally conductive layer of material in the opening that contacts the integrated circuit; and
a metal heat sink structure that contacts the thermally conductive layer of material.
21. The electronic device defined in claim 20 wherein the integrated circuit comprises a radio-frequency transceiver, wherein the metal heat sink structure
comprises aluminum covered at least partly with an
insulating coating, and wherein a portion of the aluminum is free of the insulating coating and is electrically shorted to the metal fence structure.
22. The electronic device defined in claim 21 further comprising a compressible conductive gasket interposed between the portion of the aluminum that is free of the insulating coating and the metal fence structure .
PCT/US2013/050737 2012-09-20 2013-07-16 Heat sinking and electromagnetic shielding structures Ceased WO2014046772A1 (en)

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US20140078677A1 (en) 2014-03-20

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