WO2014034468A1

WO2014034468A1 - Transparent conductive element and manufacturing method thereof, input device, electronic device, and method of forming conductive unit

Info

Publication number: WO2014034468A1
Application number: PCT/JP2013/072131
Authority: WO
Inventors: 井上　純一
Original assignee: デクセリアルズ株式会社
Priority date: 2012-08-31
Filing date: 2013-08-20
Publication date: 2014-03-06
Also published as: JP2014048952A

Abstract

This transparent conductive element is easily formed by printing, and is provided with a substrate having a surface, and transparent conductive units and transparent insulating units alternately disposed planarly on the surface. The transparent conductive units and transparent insulating units include multiple conductive unit elements provided two-dimensionally in a first direction and a second direction of the substrate surface.

Description

Transparent conductive element and method for manufacturing the same, input device, electronic device, and method for forming conductive part

The present technology relates to a transparent conductive element and a manufacturing method thereof, an input device, an electronic device, and a method of forming a conductive portion. Specifically, the present invention relates to a transparent conductive element in which transparent conductive portions and transparent insulating portions are alternately provided on a substrate surface in a planar manner.

In recent years, there have been an increasing number of cases where capacitive touch panels are mounted on mobile devices such as mobile phones and portable music terminals. In the capacitive touch panel, a transparent conductive film provided with a patterned transparent conductive layer on the substrate film surface is used.

Patent Document 1 proposes a transparent conductive sheet having the following configuration. The transparent conductive sheet includes a conductive pattern layer formed on the base sheet and an insulating pattern layer formed on a portion of the base sheet where the conductive pattern layer is not formed. The conductive pattern layer has a plurality of minute pinholes, and the insulating pattern layer is formed into a plurality of islands by narrow grooves.

JP 2010-157400 A

In recent years, it has been desired to produce a thin film such as a transparent conductive layer or a metal layer having a minute pattern as described above by a printing method. In order to meet such a demand, it is desirable that the minute pattern can be easily formed by a printing method.

Therefore, an object of the present technology is to provide a transparent conductive element that can be easily formed by a printing method, a manufacturing method thereof, an input device, an electronic device, and a method for forming a conductive portion.

In order to solve the above-mentioned problem, the first technique is:
A substrate having a surface;
With transparent conductive parts and transparent insulating parts provided alternately on the surface in a plane,
The transparent conductive portion and the transparent insulating portion are transparent conductive elements including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction on the surface.

The second technology is
A substrate having a first surface and a second surface;
A transparent conductive portion and a transparent insulating portion provided alternately in a plane on the first surface and the second surface,
The transparent conductive portion and the transparent insulating portion are an input device including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction of the first surface and the second surface.

The third technology is
A first transparent conductive element;
A second transparent conductive element provided on the surface of the first transparent conductive element,
The first transparent conductive element and the second transparent conductive element are
A substrate having a surface;
With transparent conductive parts and transparent insulating parts provided alternately on the surface in a plane,
The transparent conductive portion and the transparent insulating portion are an input device including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction on the surface.

The fourth technology is
A transparent conductive element having a substrate having a first surface and a second surface, and transparent conductive portions and transparent insulating portions provided alternately in a plane on the first surface and the second surface;
The transparent conductive portion and the transparent insulating portion are electronic devices including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction of the first surface and the second surface.

The fifth technology is
A first transparent conductive element;
A second transparent conductive element provided on the surface of the first transparent conductive element,
The first transparent conductive element and the second transparent conductive element are
A substrate having a surface;
With transparent conductive parts and transparent insulating parts provided alternately on the surface in a plane,
The transparent conductive portion and the transparent insulating portion are electronic devices including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction on the surface.

The sixth technology is
Transparent conductive provided alternately in a plane on the surface of the substrate by printing conductive ink on the surface of the substrate and forming conductive part elements two-dimensionally in the first direction and the second direction of the surface of the substrate. And a transparent insulating element manufacturing method including forming a transparent insulating part.

The seventh technology is
This is a method for forming a conductive portion, which includes printing a conductive ink on a surface of a substrate by a microdroplet coating method and forming a plurality of conductive portion elements on the surface of the substrate in a one-dimensional or two-dimensional manner.

In the present technology, since the plurality of conductive part elements are two-dimensionally provided in the first direction and the second direction on the substrate surface, the conductive part elements can be easily produced by a printing method.

In the present technology, since the transparent conductive portion and the transparent insulating portion are alternately provided on the surface of the base material, the difference in reflectance between the region where the transparent conductive portion is provided and the region where the transparent conductive portion is not provided Can be reduced. Therefore, visual recognition of the pattern of a transparent conductive part can be suppressed.

As described above, according to the present technology, it is possible to provide a transparent conductive element that can be easily formed by a printing method.

FIG. 1 is a cross-sectional view illustrating a configuration example of the information input device according to the first embodiment of the present technology. FIG. 2A is a plan view illustrating a configuration example of the first transparent conductive element according to the first embodiment of the present technology. FIG. 2B is a cross-sectional view taken along line AA shown in FIG. 2A. FIG. 3A is a plan view illustrating a configuration example of the transparent electrode portion of the first transparent conductive element according to the first embodiment of the present technology. 3B is a cross-sectional view taken along line AA shown in FIG. 3A. FIG. 3C is a plan view illustrating a configuration example of the transparent insulating portion of the first transparent conductive element according to the first embodiment of the present technology. FIG. 3D is a cross-sectional view along the line AA shown in FIG. 3C. FIG. 4A is a schematic diagram illustrating an arrangement example of conductive part elements in a transparent electrode part. FIG. 4B is a schematic diagram illustrating an arrangement example of conductive part elements in the transparent insulating part. FIG. 5A is a plan view illustrating an example of a shape pattern of a boundary portion. FIG. 5B is a cross-sectional view taken along line AA shown in FIG. 5A. FIG. 6A is a schematic diagram illustrating a first arrangement example of conductive part elements in a boundary part. FIG. 6B is a schematic diagram illustrating a second arrangement example of the conductive element at the boundary. FIG. 7A is a plan view illustrating a configuration example of a second transparent conductive element according to the first embodiment of the present technology. FIG. 7B is a cross-sectional view taken along line AA shown in FIG. 7A. 8A to 8C are process diagrams for explaining an example of the manufacturing method of the first transparent conductive element according to the first embodiment of the present technology. FIG. 9 is a flowchart for explaining a random pattern generation algorithm. 10A to 10D are schematic diagrams for explaining a random pattern generation algorithm. FIG. 11A and FIG. 11B are schematic diagrams showing the relationship between the size of dots (squares) constituting the grid and the conductive part elements. FIG. 12A is a schematic diagram illustrating a configuration example of an apparatus main body of a micro droplet application system. 12B is a schematic diagram enlarging a main part related to the droplet application of FIG. 12A. 13A to 13D are schematic diagrams showing an operation example of the application needle of the micro droplet application system. FIG. 13E is a schematic diagram showing droplets formed on the surface to be coated by the steps of FIGS. 13A to 13D. FIG. 14 is a schematic diagram illustrating the movement until a droplet ejected from an inkjet nozzle reaches a coating target. FIG. 15A is a plan view illustrating an example of a droplet formed by inkjet. FIG. 15B is a sectional view taken along line AA shown in FIG. 15A. FIG. 15C is a plan view showing an example of a droplet formed by a needle-type dispenser. FIG. 15D is a cross-sectional view taken along line AA shown in FIG. 15C. 16A to 16D are cross-sectional views illustrating modifications of the first transparent conductive element according to the first embodiment of the present technology. FIG. 17A and FIG. 17B are cross-sectional views illustrating modifications of the first transparent conductive element according to the first embodiment of the present technology. FIG. 18A is a plan view illustrating a configuration example of a transparent electrode portion of the first transparent conductive element according to the second embodiment of the present technology. FIG. 18B is a cross-sectional view along the line AA shown in FIG. 18A. FIG. 18C is a plan view illustrating a configuration example of the transparent insulating portion of the first transparent conductive element. FIG. 18D is a cross-sectional view taken along line AA shown in FIG. 18C. FIG. 19A is a plan view illustrating an example of a shape pattern of a boundary portion. FIG. 19B is a cross-sectional view along the line AA shown in FIG. 19A. FIG. 20A is a plan view illustrating a configuration example of the first transparent conductive element according to the third embodiment of the present technology. 20B is a cross-sectional view taken along the line AA shown in FIG. 20A. FIG. 21A is a plan view illustrating a configuration example of the first transparent conductive element according to the fourth embodiment of the present technology. FIG. 21B is a cross-sectional view along the line AA shown in FIG. 21A. FIG. 22A is a plan view illustrating a configuration example of the first transparent conductive element according to the fifth embodiment of the present technology. FIG. 22B is a cross-sectional view along the line AA shown in FIG. 22A. FIG. 23A is a plan view illustrating a configuration example of the first transparent conductive element according to the sixth embodiment of the present technology. FIG. 23B is a cross-sectional view along the line AA shown in FIG. 23A. FIG. 24A is a schematic diagram illustrating an example of a grid having two types of dot sizes. FIG. 24B is a schematic diagram illustrating an example of a transparent electrode portion formed using a grid having two types of dot sizes. FIG. 24C is a schematic diagram illustrating an example of a transparent insulating portion formed using a grid having two types of dot sizes. FIG. 25A is a schematic diagram illustrating an example of a grid having three types of dot sizes. FIG. 25B is a schematic diagram illustrating an example of a transparent electrode portion formed using a grid having three types of dot sizes. FIG. 25C is a schematic diagram illustrating an example of a transparent insulating portion formed using a grid having three types of dot sizes. FIG. 26A is a schematic diagram illustrating an example of a grid in which the dot shape is a parallelogram shape. FIG. 26B is a schematic diagram illustrating an example of a transparent electrode portion formed using a grid in which the dot shape is a parallelogram shape. FIG. 26C is a schematic diagram illustrating an example of a transparent insulating portion formed using a grid in which the dot shape is a parallelogram shape. FIG. 27A is a plan view illustrating a configuration example of the first transparent conductive element according to the ninth embodiment of the present technology. FIG. 27B is a plan view illustrating a configuration example of the second transparent conductive element according to the ninth embodiment of the present technology. FIG. 28 is a cross-sectional view illustrating a configuration example of an information input device according to the tenth embodiment of the present technology. FIG. 29A is a plan view illustrating a configuration example of an information input device according to an eleventh embodiment of the present technology. FIG. 29B is a cross-sectional view along the line AA shown in FIG. 29A. FIG. 30A is an enlarged plan view showing the vicinity of the intersection C shown in FIG. 29A. FIG. 30B is a cross-sectional view along the line AA shown in FIG. 30A. FIG. 31 is an enlarged plan view showing the region R shown in FIG. 29A. FIG. 32A is an external view illustrating an example of a television device as an electronic apparatus. FIG. 32B is an external view illustrating an example of a notebook personal computer as an electronic apparatus. FIG. 33A is an external view illustrating an example of a mobile phone as an electronic apparatus. FIG. 33B is an external view illustrating an example of a tablet computer as an electronic device. FIG. 34 is a diagram illustrating changes in sheet resistance with respect to ejection time.

Embodiments of the present technology will be described in the following order with reference to the drawings.
1. First embodiment (example of transparent electrode portion and transparent insulating portion in which conductive portion elements are provided randomly)
2. Second embodiment (an example of a transparent electrode part and a transparent insulating part in which conductive part elements are regularly provided)
3. Third embodiment (an example of a transparent electrode portion that is a continuous film and a transparent insulating portion in which conductive portion elements are randomly provided)
4). Fourth embodiment (an example of a transparent electrode portion that is a continuous film and a transparent insulating portion in which conductive portion elements are regularly provided)
5. Fifth embodiment (an example of a transparent electrode portion in which conductive portion elements are randomly provided and a transparent insulating portion in which conductive portion elements are regularly provided)
6). Sixth embodiment (an example of a transparent electrode part in which conductive part elements are regularly provided and a transparent insulating part in which conductive part elements are provided randomly)
7). Seventh Embodiment (Example of Transparent Electrode Part and Transparent Insulating Part Having Conductive Part Elements of Multiple Sizes)
8). Eighth embodiment (example in which the arrangement direction of the conductive part elements is in an oblique crossing relationship)
9. Ninth Embodiment (Example in which a transparent electrode portion having a shape in which pad portions are connected) is provided
10. Tenth embodiment (example in which transparent electrode portions are provided on both surfaces of a base material)
11. Eleventh embodiment (example in which transparent electrode portions are provided to intersect one main surface of a substrate)
12 Twelfth embodiment (application example to electronic equipment)

<1. First Embodiment>
[Configuration of information input device]
FIG. 1 is a cross-sectional view illustrating a configuration example of the information input device according to the first embodiment of the present technology. As shown in FIG. 1, the information input device 10 is provided on the display surface of a display device 4 which is an example of an electronic device. The information input device 10 is bonded to the display surface of the display device 4 by, for example, a bonding layer 5.

(Display device)
The display device 4 to which the information input device 10 is applied is not particularly limited. For example, a liquid crystal display, a CRT (Cathode Ray Tube) display, a plasma display panel (PDP), electroluminescence ( Various display devices such as an electro luminescence (EL) display and a surface-conduction electron-emitter display (SED) can be used.

(Information input device)
The information input device 10 is a so-called projected capacitive touch panel, and includes a first transparent conductive element 1 and a second transparent conductive element provided on the surface of the first transparent conductive element 1. 2, and the first transparent conductive element 1 and the second transparent conductive element 2 are bonded together via a bonding layer 6. Moreover, you may make it further provide the optical layer 3 on the surface of the 2nd transparent conductive element 2 as needed.

(First transparent conductive element)
FIG. 2A is a plan view illustrating a configuration example of the first transparent conductive element according to the first embodiment of the present technology. FIG. 2B is a cross-sectional view taken along line AA shown in FIG. 2A. As shown in FIGS. 2A and 2B, the first transparent conductive element 1 includes a substrate 11 having a surface and a transparent conductive layer 12 provided on the surface. Here, two directions that are orthogonally crossed in the plane of the substrate 11 are defined as an X-axis direction (first direction) and a Y-axis direction (second direction).

The transparent conductive layer 12 includes a transparent electrode part (transparent conductive part) 13 and a transparent insulating part 14. The transparent electrode portion 13 is an X electrode portion that extends in the X-axis direction. The transparent insulating portion 14 is a so-called dummy electrode portion, is an insulating portion that extends in the X-axis direction and is interposed between the transparent electrode portions 13 to insulate between the adjacent transparent electrode portions 13. These transparent electrode portions 13 and transparent insulating portions 14 are provided on the surface of the base material 11 so as to be alternately adjacent in a plane in the Y-axis direction. 2A and 2B, the first region R ₁ indicates the formation region of the transparent electrode portion 13, and the second region R ₂ indicates the formation region of the transparent insulating portion 14.

(Transparent electrode part, transparent insulation part)
The shape of the transparent electrode portion 13 is preferably appropriately selected according to the screen shape, the drive circuit, and the like, and examples thereof include a linear shape and a shape in which a plurality of rhombus shapes (diamond shapes) are linearly connected. In particular, it is not limited to these shapes. 2A and 2B illustrate a configuration in which the shape of the transparent electrode portion 13 is a linear shape. The resistance (surface resistance) of the transparent electrode portion 13 is preferably 1.0 × 10 ⁵ Ω / □ or less, more preferably 1.0 × 10 ⁴ Ω / □ or less. The resistance (surface resistance) of the transparent insulating portion 14 is preferably in the range of 10 ⁶ Ω / □ or more, more preferably 10 ⁸ Ω / □ or more.

FIG. 3A is a plan view showing a configuration example of the transparent electrode portion of the first transparent conductive element. 3B is a cross-sectional view taken along line AA shown in FIG. 3A. The transparent electrode portion 13 is a transparent conductive layer 12 formed such that a plurality of conductive portion elements 13 a are randomly arranged two-dimensionally in the X-axis direction and the Y-axis direction on the surface of the substrate 11. In this way, the formation of moire can be suppressed by forming the plurality of conductive part elements 13a at random. In adjacent rows, conductive part elements 13a adjacent in the X-axis direction and conductive part elements 13a adjacent in the Y-axis direction are connected.

The plurality of conductive part elements 13a are formed, for example, connected in the X-axis direction or separated from each other. The plurality of conductive portion elements 13a are formed, for example, connected in the Y-axis direction or separated from each other. The transparent conductive portion 13b of the transparent electrode portion 13 is formed by the conductive portion elements 13a formed so as to be connected or separated from each other. That is, the transparent conductive portion 13b is formed by one or a plurality of conductive portion elements 13a. In the adjacent row, it is preferable that the conductive portion elements 13a in the oblique direction with respect to the X-axis direction or the Y-axis direction are connected to each other. As a result, in order to reduce the coverage difference of the transparent conductive material between the transparent electrode portion 13 and the transparent insulating portion 14, even when the ratio of the conductive portion element 13a of the transparent electrode portion 13 is reduced, the X-axis direction Alternatively, a conductive path oblique to the Y-axis direction can be ensured. That is, a low surface resistance can be maintained.

More specifically, the transparent electrode portion 13 is a transparent conductive layer 12 formed by randomly separating a plurality of hole portions 13c, and the transparent conductive portion 13b is interposed between adjacent hole portions 13c. Yes. The shape of the hole 13 c changes randomly on the surface of the substrate 11. The transparent conductive part 13b has, for example, a transparent conductive material as a main component. The conductivity of the transparent electrode portion 13 is obtained by the transparent conductive portion 13b.

FIG. 4A is a schematic diagram showing an example of arrangement of conductive part elements in a transparent electrode part. In the arrangement example shown in FIG. 4A, the conductive part elements 13a adjacent to each other in the X-axis direction in the adjacent row and the conductive part elements 13a adjacent to each other in the Y-axis direction are connected to each other. The conductive part elements 13a adjacent to each other in a direction oblique to the direction are also connected. Here, the oblique directions with respect to the X-axis direction or the Y-axis direction are specifically directions of 45 degrees, 135 degrees, 225 degrees, and 315 degrees.

In addition, arrangement | positioning of the electroconductive part element 13a in the transparent electrode part 13 is not limited to the above-mentioned example. For example, the conductive part elements 13a adjacent to each other in the X-axis direction in the adjacent column and the conductive part elements 13a adjacent to each other in the Y-axis direction are connected to each other, whereas the X-axis direction or the Y-axis direction in the adjacent line is connected. Thus, the conductive portion elements 13a adjacent in the oblique direction may be separated from each other by the hole portion 13c.

FIG. 3C is a plan view showing a configuration example of the transparent insulating portion of the first transparent conductive element. FIG. 3D is a cross-sectional view along the line AA shown in FIG. 3C. The transparent insulating portion 14 is a transparent conductive layer formed such that a plurality of conductive portion elements 14a are randomly arranged two-dimensionally in the X-axis direction and the Y-axis direction on the substrate surface. In this way, the formation of moire can be suppressed by randomly forming the plurality of conductive portion elements 14a. In adjacent rows, conductive part elements 14a adjacent in the X-axis direction and conductive part elements 14a adjacent in the Y-axis direction are connected.

The plurality of conductive part elements 14a are formed, for example, connected in the X-axis direction or separated from each other. The plurality of conductive part elements 14a are formed, for example, connected in the Y-axis direction or separated from each other. The island portion 14b of the transparent insulating portion 14 is formed by the conductive portion elements 14a formed so as to be connected or separated from each other. In adjacent rows, it is preferable that the conductive portion elements 14a in the oblique direction with respect to the X-axis direction or the Y-axis direction are separated from each other. Thereby, in order to reduce the coverage difference of the transparent conductive material between the transparent electrode portion 13 and the transparent insulating portion 14, even when the ratio of the conductive portion element 14a of the transparent insulating portion 14 is increased, the X-axis direction Alternatively, the conductive paths oblique to the Y axis direction can be reduced. That is, a high surface resistance (insulating property) can be maintained.

More specifically, the transparent insulating portion 14 is composed of a plurality of island portions 14b separated by a separation portion 14c. The plurality of island portions 14b are formed on the surface of the base material 11 in a random pattern. The island part 14b is formed by one conductive part element 14a or a plurality of connected conductive part elements 14a. The island portions 14b are electrically insulated by the separation portion 14c. The shape of the island part 14 b changes randomly on the surface of the base material 11. The island part 14b has, for example, a transparent conductive material as a main component.

FIG. 4B is a schematic diagram illustrating an arrangement example of the conductive element in the transparent insulating part. In the arrangement example shown in FIG. 4B, the conductive part elements 14 a adjacent to each other in the X-axis direction in the adjacent row and the conductive part elements 14 a adjacent to each other in the Y-axis direction are connected to each other. The conductive portion elements 14a adjacent to each other in an oblique direction with respect to the direction are also connected. Here, the oblique directions with respect to the X-axis direction or the Y-axis direction are specifically directions of 45 degrees, 135 degrees, 225 degrees, and 315 degrees.

In addition, the example of arrangement | positioning of the electroconductive part element 14a in the transparent insulation part 14 is not limited to the above-mentioned example. For example, the adjacent conductive elements 14a adjacent to each other in the X-axis direction or the Y-axis direction in the adjacent row are connected to each other, whereas the adjacent conductive portions adjacent to each other in the oblique direction with respect to the X-axis direction or the Y-axis direction in the adjacent row The elements 14a may be separated from each other by an island portion 14b.

4A and 4B show examples of the transparent electrode portion 13 and the transparent insulating portion 14 when the

conductive portion elements

13a and 14a are formed by the ink jet printing method. When the

conductive part elements

13a and 14a are formed by the ink jet printing method, the

conductive part elements

13a and 14a have a circular shape, a substantially circular shape, an elliptical shape, a substantially elliptical shape, or the like.

Whether or not the ink jet printing method is used to form the

conductive portion elements

13a and 14a can be confirmed as follows. That is, whether the transparent electrode portion 13 and the transparent insulating portion 14 are observed with a microscope or the like, and whether the shape of the conductive portion element 13a and the conductive portion element 14a includes an arc shape, a substantially arc shape, an elliptic arc shape, a substantially elliptic arc shape, or the like. Determine whether or not. If any of these shapes is included in the shape of the conductive part element 13a and the conductive part element 14a, it can be assumed that the ink jet printing method is used to form the conductive part element 13a and the conductive part element 14a.

As the shape of the

conductive part elements

13a and 14a, for example, a dot shape can be used. As the dot shape, for example, a circular shape, a substantially circular shape, an elliptical shape, or a substantially elliptical shape can be used. Different shapes may be adopted for the conductive element 13a and the conductive element 14a. Here, the substantially circular shape means a circle in which some distortion is given to a perfect circle (perfect circle) defined mathematically. The almost elliptical shape means an ellipse in which some distortion is given to a mathematically defined complete ellipse, and the elliptical shape includes, for example, an ellipse and an egg shape.

It is preferable that the conductive part element 13a and the conductive part element 14a have a size that cannot be visually recognized. Moreover, you may make it employ | adopt a magnitude | size different with the electroconductive part element 13a and the electroconductive part element 14a.

The

conductive part elements

13a and 14a are formed by printing a conductive composition such as a conductive ink on the surface of the substrate 11, and drying and / or firing. Printing (drawing) of the conductive composition is performed based on, for example, a random pattern created in advance.

It is preferable that the hole 13c and the island 14b have a size that cannot be visually recognized. Specifically, the size of the hole 13c and the island 14b is preferably 100 μm or less, more preferably 60 μm or less. Here, the size (diameter) means the maximum length of the passing lengths of the hole portion 13c and the island portion 14b. When the size of the hole 13c and the island part 14b is 100 μm or less, the visual recognition of the hole 13c and the island part 14b by visual observation can be suppressed.

In the first region R _1, for example, while the plurality of holes 13c becomes the exposed region of the substrate surface, a transparent conductive portion 13b interposed between adjacent holes 13c of the substrate surface covered region It becomes. On the other hand, in the second region R ₂ , the plurality of island portions 14 b serve as the covering region of the base material surface, whereas the separated portions 14 c interposed between the adjacent island portions 14 b and the exposed region of the base material surface Become.

The average ratio P1 of the conductive part elements 13a per unit section of the transparent electrode part 13 is preferably 50 [%] ≦ P1, more preferably 60 [%] ≦ P1, and further preferably 70 [%] ≦ P1. Satisfies. This is because, by satisfying the relationship of 50 [%] ≦ P1, an increase in the electrical resistance of the transparent electrode portion 13 can be suppressed and the function of the transparent electrode portion 13 as an electrode can be improved.

The average ratio P2 of the conductive part elements 14a per unit section of the transparent insulating part 14 is preferably P2 <50 [%], more preferably P2 <40 [%], and further preferably P2 <30 [%]. Satisfies. This is because, by satisfying the relationship of P2 <50 [%], it is possible to suppress a decrease in the electrical resistance of the transparent insulating portion 14 and improve the function of the transparent insulating portion 14 as an insulating portion.

The difference ΔP (= P1−P2) between the average ratio P1 of the conductive part elements 13a per unit section of the transparent electrode section 13 and the average ratio P2 of the conductive section elements 14a per unit section of the transparent insulating section 14 is preferably ΔP ≦ 30 [%], more preferably ΔP ≦ 20 [%], and still more preferably ΔP ≦ 10 [%]. By satisfying this relationship, when the transparent electrode portion 13 and the transparent insulating portion 14 are visually compared, the transparent conductive layer 12 is covered in the same manner in the first region R ₁ and the second region R _2. Therefore, the visual recognition of the transparent electrode portion 13 and the transparent insulating portion 14 can be suppressed.

The average ratio P1 of the conductive part elements 13a per unit section of the transparent electrode part 13 can be obtained as follows.
First, an image of the transparent electrode portion 13 is taken with a microscope. Next, a 100 × 100 grid (unit section) is set on the photographed image, and it is determined whether or not the conductive portion element 13a is formed at each dot (square) position constituting the grid. The number n of dots on which 13a is formed is counted. Here, a section in which a 100 × 100 grid is set is referred to as a unit section. Next, the ratio p of the conductive part element 13a is obtained using the following formula.
p = (n / N) × 100
n: Number of dots in which the conductive element 13a is formed among the dots constituting the 100 × 100 grid N: Sum of the dots constituting the 100 × 100 grid

This process is performed at 10 locations arbitrarily selected from the transparent electrode portion 13, and the ratios p1, p2,..., P10 of the conductive portion elements 13a per unit section of the transparent electrode portion 13 are obtained. Next, the average number P1 of the conductive portion elements 13a per unit section of the transparent electrode portion 13 is obtained by simply averaging (arithmetic average) the number of dots obtained as described above.
The average ratio P2 of the conductive part elements 14a per unit section of the transparent insulating section 14 can also be obtained in the same manner as the average ratio P1 of the conductive section elements 13a per unit section of the transparent electrode section 13 described above.

(Boundary part)
FIG. 5A is a plan view illustrating an example of a shape pattern of a boundary portion. FIG. 5B is a cross-sectional view taken along line AA shown in FIG. 5A. A random shape pattern is preferably provided at the boundary between the transparent electrode portion 13 and the transparent insulating portion 14. Thus, by providing a random shape pattern at the boundary part, the visual recognition of the boundary part can be suppressed. Here, the boundary portion indicates a region between the transparent electrode portion 13 and the transparent insulating portion 14, and the boundary L indicates a boundary line that separates the transparent electrode portion 13 and the transparent insulating portion 14. . Depending on the shape pattern of the boundary portion, the boundary L may be a virtual line instead of a solid line.

FIG. 6A is a schematic diagram illustrating a first arrangement example of conductive part elements in a boundary part. It is preferable that the conductive part elements 13a and the conductive part elements 14a are randomly arranged at the boundary part between the transparent electrode part 13 and the transparent insulating part 14 in the extending direction of the boundary part. When such an arrangement is adopted, the conductive part elements 13a are arranged so as to be in contact with or overlap the boundary L on the transparent electrode part 13 side, for example. Further, the conductive portion elements 14a are arranged so as to be in contact with or overlap the boundary L on the transparent insulating portion 14 side, for example.

Note that the arrangement of the conductive part elements 13a and the conductive part elements 14a at the boundary is not limited to a random arrangement, and the conductive part elements 13a and the conductive part elements 14a are regularly arranged only at the boundary part. Also good.

As shown in FIG. 6B, the hole 13c and the island 14b at the boundary L may be arranged in synchronization with the extending direction of the boundary L. Further, at the boundary L, the conductive portion element 13a and the conductive portion element 14a, or the hole 13c and the separation portion 14c may be arranged in synchronization with the extending direction of the boundary L.

(Base material)
As the substrate 11, for example, a transparent inorganic substrate or plastic substrate can be used. As the shape of the base material 11, for example, a transparent film, sheet, substrate or the like can be used. Examples of the inorganic base material include quartz, sapphire, glass, and clay film. As a material for the plastic substrate, for example, a known polymer material can be used. Specific examples of known polymer materials include triacetyl cellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyamide (PA), and aramid. , Polyethylene (PE), polyacrylate, polyether sulfone, polysulfone, polypropylene (PP), diacetyl cellulose, polyvinyl chloride, acrylic resin (PMMA), polycarbonate (PC), epoxy resin, urea resin, urethane resin, melamine resin , Cycloolefin polymer (COP), cycloolefin copolymer (COC) and the like. The thickness of the plastic substrate is preferably 3 to 500 μm from the viewpoint of productivity, but is not particularly limited to this range.

(Transparent conductive layer)
As the material of the transparent conductive layer 12, for example, one or more selected from the group consisting of electrically conductive metal oxide materials, metal materials, carbon materials, conductive polymers, and the like can be used. Examples of the metal oxide material include indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, gallium-added zinc oxide, silicon-added zinc oxide, and zinc oxide. -Tin oxide system, indium oxide-tin oxide system, zinc oxide-indium oxide-magnesium oxide system, and the like. As the metal material, for example, metal nanoparticles, metal wires, and the like can be used. Specific examples of such materials include copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel, titanium, bismuth, Examples thereof include metals such as antimony and lead, and alloys thereof. Examples of the carbon material include carbon black, carbon fiber, fullerene, graphene, carbon nanotube, carbon microcoil, and nanohorn. As the conductive polymer, for example, substituted or unsubstituted polyaniline, polypyrrole, polythiophene, and one or two (co) polymers selected from these can be used.

(Second transparent conductive element)
FIG. 7A is a plan view illustrating a configuration example of a second transparent conductive element according to the first embodiment of the present technology. FIG. 7B is a cross-sectional view taken along line AA shown in FIG. 7A. As shown in FIGS. 7A and 7B, the second transparent conductive element 2 includes a substrate 21 having a surface and a transparent conductive layer 22 provided on the surface. Here, two directions orthogonal to each other in the plane of the substrate 21 are defined as an X-axis direction and a Y-axis direction.

The transparent conductive layer 22 includes a transparent electrode part (transparent conductive part) 23 and a transparent insulating part 24. The transparent electrode portion 23 is a Y electrode portion that extends in the Y-axis direction. The transparent insulating portion 24 is a so-called dummy electrode portion, is an insulating portion that extends in the Y-axis direction and is interposed between the transparent electrode portions 23 to insulate between the adjacent transparent electrode portions 23. . These transparent electrode portions 23 and transparent insulating portions 24 are provided on the surface of the base material 11 so as to be alternately adjacent in a plane in the X-axis direction. The transparent electrode portion 13 and the transparent insulating portion 14 included in the first transparent conductive element 1 and the transparent electrode portion 23 and the transparent insulating portion 24 included in the second transparent conductive element 2 are, for example, orthogonal to each other. . 7A and 7B, the first region R ₁ indicates a region for forming the transparent electrode portion 23, and the second region R ₂ indicates a region for forming the transparent insulating portion 24.
The second transparent conductive element 2 is the same as the first transparent conductive element 1 except for the above.

(Optical layer)
The optical layer 3 is, for example, a protective layer for suppressing change with time. The material of the optical layer 3 is not particularly limited as long as it is transparent, but examples thereof include UV (ultraviolet) curable resins, thermosetting resins, and thermoplastic resins. Specifically, acrylic resin, urethane resin, polyester resin, polyester polyurethane resin, epoxy resin, urea resin, melamine resin, cycloolefin polymer (COP), cycloolefin copolymer (COC), ethyl cellulose, polyvinyl alcohol (PVA), silicone Well-known materials, such as resin, are mentioned.

[Method for producing transparent conductive element]
Next, an example of a method for manufacturing the first transparent conductive element 1 configured as described above will be described with reference to FIGS. 8A to 8C. Note that the second transparent conductive element 2 can be manufactured in substantially the same manner as the first transparent conductive element 1, and therefore the description of the method for manufacturing the second transparent conductive element 2 is omitted.

(Preparation of conductive ink)
First, a conductive ink in which a metal filler is dispersed in a solvent is prepared. Here, the resin material (binder) is added to the solvent together with the metal filler. Moreover, you may make it mix the dispersing agent for improving the dispersibility of a metal filler, and the other additive for improving adhesiveness and durability as needed.

As the dispersion method, stirring, ultrasonic dispersion, bead dispersion, kneading, homogenizer treatment, etc. can be preferably applied.

The metal filler is mainly composed of a metal material. As the metal material, for example, at least one selected from the group consisting of Ag, Au, Ni, Cu, Pd, Pt, Rh, Ir, Ru, Os, Fe, Co, and Sn can be used.

Examples of the shape of the metal filler include a spherical shape, an ellipsoidal shape, a needle shape, a plate shape, a scale shape, a tube shape, a fiber shape, a rod shape (rod shape), and an indefinite shape. It is not a thing. Here, the fiber shape includes a wire shape. Hereinafter, the wire-like metal filler is referred to as “metal wire”. Two or more kinds of metal fillers having the above shapes may be used in combination. Here, the spherical shape includes not only a true spherical shape but also a substantially spherical shape in which the true spherical shape is slightly flattened or distorted. The ellipsoidal shape includes not only a strict ellipsoidal shape but also an almost ellipsoidal shape in which the strict ellipsoidal shape is slightly flattened or distorted.

The metal filler surface is preferably modified with a colored compound. By modifying the surface of the metal filler with a colored compound, light incident on the surface of the metal filler is absorbed by the colored compound. Therefore, irregular reflection of light on the surface of the metal filler can be suppressed.
The colored compound is adsorbed on the surface of the metal filler, for example. Here, the adsorption means a phenomenon that remains on the surface of the metal filler or in the vicinity thereof. The adsorption may be chemical adsorption or physical adsorption, or a combination thereof. Chemisorption means adsorption that occurs with chemical bonds such as covalent bonds, ionic bonds, metal bonds, coordinate bonds, and hydrogen bonds between the surface of the metal filler and the colored compound. Physical adsorption means adsorption caused by interaction such as van der Waals force, electrostatic attraction, magnetic force and the like.

The colored compound preferably covers the surface of the metal filler at a monomolecular level. Thereby, the fall of the transparency with respect to visible light can be suppressed. In addition, the amount of the colored compound used can be minimized.

It is preferable that the colored compound is unevenly distributed on the surface of the metal filler. Thereby, the fall of the transparency with respect to visible light can be suppressed. In addition, the amount of the colored compound used can be minimized.

It is preferable that the colored compound has an absorption ability to absorb light in the visible light region. Here, the visible light region is a wavelength band of approximately 360 nm or more and 830 nm or less.

The colored compound has, for example, a chromophore R having absorption in the visible light region and a functional group X adsorbed on the metal filler. The colored compound has, for example, a structure represented by the general formula [RX]. The structure of the colored compound is not limited to the structure represented by this general formula. For example, the number of functional groups X is not limited to one, and can be two or more.

Of these, the chromophore [R] is, for example, at least one selected from the group consisting of an unsaturated alkyl group, an aromatic ring, a heterocyclic ring, and a metal ion. Specific examples of such chromophore [R] include nitroso group, nitro group, azo group, methine group, amino group, ketone group, thiazolyl group, naphthoquinone group, stilbene derivative, indophenol derivative, diphenylmethane derivative, anthraquinone derivative. , Triarylmethane derivatives, diazine derivatives, indigoid derivatives, xanthene derivatives, oxazine derivatives, phthalocyanine derivatives, acridine derivatives, thiazine derivatives, sulfur atom-containing compounds, metal ion-containing compounds, and the like. In addition, as the chromophore [R], at least one selected from the group consisting of the chromophores exemplified above and compounds containing the same can be used. From the viewpoint of improving the transparency of the transparent conductive layer 12, it is preferable to use at least one selected from the group consisting of cyanine, quinone, ferrocene, triphenylmethane and quinoline as the chromophore [R]. From the viewpoint of improving the transparency of the transparent conductive layer 12, the chromophore [R] is at least one selected from the group consisting of a Cr complex, a Cu complex, an azo group, an indoline group, and a compound containing the same. It is also preferable to use.

The functional group [X] bonded to the metal constituting the metal filler is, for example, a sulfo group (including a sulfonate salt), a sulfonyl group, a sulfonamide group, a carboxylic acid group (including a carboxylate salt), an amino group, an amide group, Examples thereof include phosphoric acid groups (including phosphates and phosphate esters), phosphino groups, silanol groups, epoxy groups, isocyanate groups, cyano groups, vinyl groups, thiol groups, carbinol groups, and hydroxyl groups. Such functional group [X] should just exist in at least 1 in a colored compound. From the viewpoint of suppressing the decrease in conductivity due to the adsorption of the colored compound, the functional group [X] is preferably a carboxylic acid group, a phosphoric acid group or the like, and more preferably a carboxylic acid group.

The functional group [X] may be an atom capable of coordinating to the metal constituting the metal filler. Such atoms are, for example, N (nitrogen), S (sulfur), O (oxygen), and the like. When the functional group [X] is these atoms, the functional group [X] may constitute a part of the chromophore [R], and the colored compound is a compound having a heterocyclic ring.

Examples of the colored compound as described above include dyes such as acid dyes and direct dyes. As an example of a more specific dye, as a dye having a sulfo group, Nippon Kayaku Co., Ltd. Kayakalan Bordeaux BL, Kayakalan Brown GL, Kayakalan Gray BL167, Kayakalan Yellow GL143, Kayakalan Black 2RL, Kayakalan Black BGL, Kayakalan Orange RL Examples include Kayaru Cupro Green G, Kayaru Supra Blue MRG, Kayaru Supra Scarlet BNL200, and Lanyl Olive BG manufactured by Taoka Chemical Industry Co., Ltd. Other examples include Kayallon Polyester Blue 2R-SF, Kayallon Microester Red AQ-LE, Kayalon Polyester Black ECX300, and Kayalon Microester Blue AQ-LE manufactured by Nippon Kayaku Co., Ltd. Examples of the dye having a carboxyl group include dyes for dye-sensitized solar cells. Ru complexes N3, N621, N712, N719, N749, N773, N790, N820, N823, N845, N886, N945, K9, K19 , K23, K27, K29, K51, K60, K66, K69, K73, K77, Z235, Z316, Z907, Z907Na, Z910, Z991, CYC-B1, HRS-1, As organic dyes, Anthocyanine, WMC234, WMC236, WMC239 , WMC273, PPDCA, PTCA, BBAPDC, NKX-2311, NKX-2510, NKX-2553 (Hayashibara), NKX-2554 (Hayashibara), NKX-2569, NKX-2586, NKX-2587 (( Hayashibara), NKX-267 (Hayashibara), NKX-2697, NKX-2753, NKX-2883, NK-5958 (Hayashibara), NK-2684 (Hayashibara), Eosin Y, Mercurochrome, MK-2 (Soken Chemicals), D77, D102 (Mitsubishi Paper), D120, D131 (Mitsubishi Paper), D149 (Mitsubishi Paper), D150, D190, D205 ( Mitsubishi Paper Mills), D358 (Mitsubishi Paper Mills), JK-1, JK-2, 5, ZnTPP, H2TC1PP, H2TC4PP Phthalocyanine Dye (Zinc
phtalocyanine-2,9,16,23-tetra-carboxylic acid), 2- [2 '-(zinc9', 16 ', 23'-tri-tert-butyl-29H, 31H-phthalocyanyl)] succinic acid, Polythiohene Dye (TT-1), Pendant type polymer, Cyanine Dye (P3TTA, C1-D, SQ-3, B1).

In addition, as the colored compound, a colored compound used as a paint can also be used. For example, Opera Red, Permanent Scarlet, Carmine, Violet, Lemon Yellow, Permanent Yellow Deep, Sky Blue, Permanent Green manufactured by Turner Color Co., Ltd. List light, permanent green middle, burnt schener, yellow ocher, permanent orange, permanent lemon, permanent red, viridian (Hugh), cobalt blue (Hugh), Prussian blue (Hugh), jet black, permanent scarlet and violet Can do. Also, for example, Bright Red, Cobalt Blue Hue, Ivory Black, Yellow Ocher, Permanent Green Light, Permanent Yellow Light, Burnt Senna, Ultramarine Deep, Vermillion Hugh and Permanent Green, which are colored compounds manufactured by Holbein Industry Co., Ltd. Etc. can also be used. Among these colored compounds, permanent scarlet, violet and jet black (Turner Color Co., Ltd.) are preferable.

Furthermore, edible colored compounds can also be used as the colored compounds. For example, edible red No. 2 amaranth, edible red No. 3 erythrosin, edible red No. 102 New Coxin, edible red No. 104 Phloxine manufactured by Daiwa Kasei Co., Ltd. Food Red 105 Rose Bengal, Food Red 106 Acid Red, Food Blue 1 Brilliant Blue, Food Red 40 Allura Red, Food Blue 2 Indigo Carmine, Red 226 Helidon Pink CN, Red 227 First Acid Magenta Red No. 230 eosin YS, green No. 204 pyranin conc, orange No. 205 orange II, blue No. 205 alphazurin, purple No. 401 arizurol purple and black No. 401 naphthol blue black. Natural colored compounds can also be used, such as High Red G-150 (water-soluble grape skin pigment), Cochineal Red AL (water-soluble / cochineal pigment), High Red MC (produced by Daiwa Kasei Co., Ltd.). Water-soluble / cochineal dye), High Red BL (water-soluble / beet red), Daiwamonas LA-R (water-soluble / Benicouji dye), High Red V80 (water-soluble, purple potato dye), Annatto N2R-25 (water dispersibility) Anato dye), Annatto WA-20 (water-soluble anato-anato dye), high orange SS-44R (water dispersible, low-viscosity product, red pepper dye), high orange LH (oil-soluble red pepper dye), high green B (Water-soluble and green colorant formulation), high green F (water-soluble and green colorant formulation), high blue AT (water-soluble and colorant formulation) Chinese pear pigment), Himelon P-2 (water-soluble, green colorant formulation), High Orange WA-30 (water-dispersible, red pepper pigment), High Red RA-200 (water-soluble, red radish pigment), High Red CR -N (water-soluble, red cabbage dye), high red EL (water-soluble, elderberry dye), high orange SPN (water-dispersible, red pepper dye), and the like.

The colored compound can be adsorbed to each metal constituting the metal filler from the compounds represented by the above general formula [RX], and is used as a solvent used in the manufacturing process of the transparent conductive layer 12. It is preferable to select and use a compound that can be dissolved at a concentration.

Whether or not the surface of the metal filler is modified with a colored compound can be confirmed as follows. First, the transparent conductive layer containing the metal filler to be confirmed is immersed in a solution capable of etching a known metal for about several hours to several tens of hours to extract the metal filler and the modified compound modified on the surface thereof. Next, the extract component is concentrated by removing the solvent from the extract by heating or reducing the pressure. At this time, if necessary, separation by chromatography may be performed. Next, the modified compound can be identified by conducting a gas chromatograph (GC) analysis of the concentrated extracted component described above and confirming the molecule of the modified compound and fragments thereof. Moreover, a modified compound can also be identified by NMR analysis by using a deuterium substitution solvent for extraction of a modified compound.

It is preferable to use a solvent that can disperse a metal filler. For example, water, alcohol (eg, methanol, ethanol, n-propanol, i-propanol, n-butanol, i-butanol, sec-butanol, tert-butanol, etc.), anone (eg, cyclohexanone, cyclopentanone), amide (eg, N, N-dimethylformamide: DMF), sulfide (for example, dimethylsulfoxide: DMSO) and the like can be used alone or in combination of two or more.

In order to control the evaporation rate of the solvent, a high boiling point solvent may be further included. Examples of the high boiling point solvent include butyl cellosolve, diacetone alcohol, butyl triglycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monobutyl ether. , Diethylene glycol monoethyl ether, diethylene glycol monomethyl ether diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, propylene glycol monobutyl ether, propylene glycol isopropyl ether, dipropylene glycol isopropyl ether, triplicate Propylene glycol isopropyl ether, methyl glycol. These high boiling solvents may be used alone or in combination.

The resin material is a so-called binder material, and can be widely selected and used from known transparent natural polymer resins or synthetic polymer resins. Even a thermoplastic resin is a thermosetting resin or a photocurable resin. It may be. Examples of the thermoplastic resin include polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polymethyl methacrylate, nitrocellulose, chlorinated polyethylene, chlorinated polypropylene, vinylidene fluoride, ethyl cellulose, and hydroxypropyl methyl cellulose. Examples of the heat (light) curable resin that is cured by heat, light, electron beam, and radiation include silicon resins such as melamine acrylate, urethane acrylate, isocyanate, epoxy resin, polyimide resin, and acrylic-modified silicate.

In addition, surfactants, viscosity modifiers, dispersants, curing accelerating catalysts, plasticizers, and stabilizers such as antioxidants and sulfidizing agents are added to the resin material as necessary. Also good.

(Printing process)
Next, as shown in FIG. 8A, conductive ink is printed (drawn) on the first region R ₁ on the surface of the substrate 11. Thereby, the droplets 33a of the conductive ink, coating two-dimensionally at random in the X-axis direction of the surface of the substrate 11 in the first region R ₁ (first direction) and the Y-axis direction (second direction) Is done.

Next, as shown in FIG. 8B, conductive ink is printed (drawn) on the second region R ₂ on the surface of the substrate 11. Thereby, the droplets 33a of the conductive ink, coating two-dimensionally at random in the X-axis direction of the surface of the substrate 11 in the second region R ₂ (first direction) and the Y-axis direction (second direction) Is done.

Repeat the above region _{R 1} and the region _{R 2} of the printing process. As the printing method, for example, a relief printing method, an offset printing method, a gravure printing method, an intaglio printing method, a rubber plate printing method, an ink jet printing method, a micro contact printing method, a screen printing method, or the like can be used. Among the methods, it is preferable to use an ink jet printing method. This is because there is no need to produce a plate and printing on demand is possible. 8A and 8B show an example in which conductive ink is printed (drawn) on the surface of the substrate 11 by applying the conductive ink from the nozzles 33 by the ink jet printing method.

The printing (drawing) of the conductive ink is performed based on, for example, a random pattern generated in advance. Specifically, the random pattern is stored in advance as a raster image in which white dots and black dots are arranged in a random pattern, and conductive ink is printed (drawn) based on the raster image. The details of the algorithm for creating a raster image in which white dots and black dots are arranged in a random pattern will be described later.

It is preferable to select the printing resolution according to the printing method. For example, in the inkjet printing method, the resolution (Dots 決め Per Inch (dpi)) must be determined from the size of one dot depending on the performance, and drawing is required.

Table 1 shows an example of the relationship between the size of one dot and the resolution.

(Drying process)
Next, the conductive ink printed on the surface of the substrate 11 is dried. Next, the dried conductive ink is baked as necessary. As a result, the first region R ₁ and the second region R ₂ are randomly arranged two-dimensionally in the X-axis direction (first direction) and Y-axis direction (second direction) of the surface of the base material 11. Conductive element 13a is formed. By the formation of the conductive portion element 13a, the transparent electrode portions 13 and the transparent insulating portions 14 provided alternately on the surface of the base material 11 in a plane are formed.

(Optical layer forming process)
Next, the optical layer 3 is formed on the transparent electrode portion 13 and the transparent insulating portion 14 as necessary. As a method for forming the optical layer, for example, a coating method or a printing method can be used. Examples of the coating method include a micro gravure coating method, a wire bar coating method, a direct gravure coating method, a die coating method, a dip method, a spray coating method, a reverse roll coating method, a curtain coating method, a comma coating method, a knife coating method, or a spin coating method. A coating method or the like can be used. As a printing method, for example, a relief printing method, an offset printing method, a gravure printing method, an intaglio printing method, a rubber plate printing method, an ink jet printing, a micro contact printing or a screen printing method can be used.
Thus, the first transparent conductive element 1 shown in FIGS. 2A and 2B is obtained.

[Raster image creation algorithm]
Hereinafter, a raster image creation algorithm will be described with reference to FIG.
First, when the dot size and the overall size are set in step S1, a grid in which the overall size is divided in units of the set dot size is created in step S2 as shown in FIG. 10A. In the printing process described above, conductive ink is printed (drawn) at the position of each dot of the grid to form the

conductive portion elements

13a and 14a. The dots constituting the grid are rectangular, but when conductive ink is printed (drawn) by the ink jet printing method, the

conductive portion elements

13a and 14a are circular, almost circular, or elliptic as described above. Since the shape is almost elliptical, both shapes are different.

Next, in step S3, as shown in FIG. 10B, an address (n ₁ , n ₂ ) is set to each dot of the created grid. Here, n ₁ is an address in the row direction (X-axis direction (first direction)), and n ₂ is an address in the column direction (Y-axis direction (second direction)). Next, when the ratio p of dots forming the conductive element is set in step S4, the address (n ₁ , n ₂ ) is set to the initial address (1, 1) in step S5. Here, the dot ratio p is a numerical value of 0 or more and 100 or less. In the following description, “%” may be added to the dot ratio p.

Here, the ratio p of the dots forming the conductive part element is the ratio of the dots forming the conductive part element among all the dots constituting the entire size (that is, the ratio of the dots for printing (drawing) the conductive ink). Show. The ratio p of dots forming the conductive part element corresponds to the above-described average ratio P1 of the conductive part element 13a and average ratio P2 of the conductive part element 14a. When generating a random pattern for forming the transparent electrode portion 13, the dot ratio p is preferably 50 ≦ p [%], more preferably 60 ≦ p [%], and still more preferably 70 ≦ p [%]. %] Is set. On the other hand, when generating a random pattern for forming the transparent insulating portion 14, the dot ratio p is preferably p <50 [%], more preferably p <40 [%], and still more preferably p <. Set within the range of 30 [%].

The difference Δp (= p1−p2) between the dot ratio p1 of the random pattern for forming the transparent electrode portion 13 and the dot ratio p2 of the random pattern for forming the transparent insulating portion 14 is preferably Δp ≦ It is set within the range of 30 [%], more preferably Δp ≦ 20 [%], and still more preferably Δp ≦ 10 [%].

Next, in step S6, a dot of 0 or more and 100 or less is set for the dot of the address (n ₁ , n ₂ ) (hereinafter referred to as “set address”) set in step S5, step S12 or step S13. A random number Nr is generated. As an algorithm for generating the random number Nr, for example, Mersenne twister (MT) can be used. Next, in step S7, it is determined whether or not the random number Nr generated in step S6 is less than or equal to the dot ratio p set in step S4 (Nr ≦ p).

Table 2 shows the relationship between the random number Nr and the print information (binary information).

When the random number Nr is equal to or less than the dot ratio p, in step S8, as shown in FIG. 10C, the dot at the set address (n ₁ , n ₂ ) is set to print. On the other hand, if the random number Nr is larger than the proportion P of the conductive part elements, the dot at the set address (n ₁ , n ₂ ) is not printed in step S8 as shown in FIG. 10C (hereinafter referred to as “non-printing”). )).

FIG. 10C shows an example in which dots set for printing are represented by “black dots” and dots set for non-printing are represented by “white dots”. FIG. 10C shows an example in which any one of print information (binary information “print” and “non-print”) is set for each dot in the order indicated by the arrows. Is an example, and the order of setting print information is not limited to this example.

Next, in step S10, the address n ₁ determines whether the maximum value N ₁ of the row address direction. If the address n ₁ is the maximum value N ₁ , the process proceeds to step S11. On the other hand, if the address _{n 1} is not the maximum value _{N 1} in step S12, increments the address _{n 1,} the process returns to step S6.

In step S11, the address n ₂ determines whether the maximum value N ₂ of the column address. If the address n ₂ is not the maximum value N ₂ , the address n ₂ is incremented in step S14, and the process returns to step S6. On the other hand, when the address n ₂ is the maximum value N ₂ , as shown in FIG. 10D, print information (binary information) is set for all the dots constituting the grid, and white dots and black dots are set. A raster image arranged in a random pattern is completed, and the process proceeds to step S14. Next, in step S14, the raster image (binary image) may be stored in the storage unit.

In the above-described printing process, the raster image is read from the storage unit, and the inkjet head is sequentially moved to the position on the transparent conductive layer 12 corresponding to each dot of the raster image, while the inkjet head is based on the printing information of the raster image. Conductive ink is applied from

Specifically, conductive ink is applied from the inkjet head at a position on the substrate 11 corresponding to a dot (for example, “black dot”) set for printing a raster image. On the other hand, the conductive ink is not applied from the inkjet head at a position on the substrate 11 corresponding to a dot (for example, “white dot”) set to non-printing of the raster image. As a result, a print pattern corresponding to the random pattern of white dots and black dots of the raster image is formed on the surface of the substrate 11. In the above description of the operation control of the inkjet head, the example in which the inkjet head is moved to all of the printing position and the non-printing position has been described. However, the operation control of the inkjet head is not limited to this example. For example, the operation control of the ink jet head may be performed so that the ink jet head sequentially moves only to the printing position.

FIG. 11A and FIG. 11B are schematic diagrams showing the relationship between the size of dots (squares) constituting the grid and the conductive part elements. As shown in FIG. 11A, when the periphery (for example, the circumference) of the conductive element is positioned outside the corner of the square dot, the conductive element 13a adjacent in the X-axis direction or the Y-axis direction in the adjacent example. In addition, in the adjacent example, the conductive part elements 13a adjacent in the oblique direction with respect to the X-axis direction or the Y-axis direction are also connected. On the other hand, as shown in FIG. 11B, when the circumference of the conductive element (for example, the circumference) is located on the inner side than the corner of the square dot, the adjacent example is inclined with respect to the X axis direction or the Y axis direction. The conductive part elements 13a adjacent in the direction are not connected to each other and are separated from each other.

[Applying conductive ink using micro droplet application system]
The method for printing the conductive ink is not limited to the above example, and a fine droplet coating method may be used. Hereinafter, an example of application of conductive ink by a micro droplet application system will be described.

FIG. 12A is a schematic diagram illustrating a configuration example of an apparatus main body of a micro droplet application system. 12B is a schematic diagram enlarging a main part related to the droplet application of FIG. 12A. As the micro droplet application system, for example, a needle dispenser manufactured by Applied Micro System Co., Ltd. can be used. Such needle type dispensers are described in, for example, Japanese Patent Application Laid-Open Nos. 2011-173029 and 2011-174907.

The apparatus main body 100 of the needle type dispenser includes an XY stage unit 101, a coarse movement stage unit 102, a fine movement stage unit 103, a pipette holding member 104, a glass pipette (a liquid reservoir) 105, and an application needle (needle) 106. And have. The coarse movement stage unit 102 and the fine movement stage unit 103 constitute a Z stage (Z-axis actuator). The minimum resolution of the Z stage is 0.25 [μm], and the repeat positioning accuracy is within ± 0.3 [μm]. In addition, the apparatus main body 100 of a needle type dispenser is controlled by the control part which abbreviate | omitted illustration.

On the XY stage unit 101, a base material 11 that is a target for applying conductive ink is placed. The XY stage unit 101 moves the base material 11 placed on the upper surface thereof in the X-axis direction and the Y-axis direction. Thereby, the location which apply | coats the conductive ink on XY plane of the base material 11 can be positioned. The minimum resolution of the XY stage unit 101 is 0.25 [μm], and the repeat positioning accuracy is within ± 0.3 [μm].

The fine movement stage unit 103 and the pipette holding member 104 are attached to the coarse movement stage unit 102. The coarse movement stage unit 102 slides with a rough degree in the approach or separation direction, that is, in the Z-axis direction with respect to the surface of the base material 11 to be coated. Therefore, fine movement stage portion 103 and pipette holding member 104 slide in the Z-axis direction as coarse movement stage portion 102 slides. Further, the pipette holding member 104 holds a glass pipette 105. The glass pipette 105 is a hollow structure and extends in the Z-axis direction. Accordingly, the glass pipette 105 moves in the Z-axis direction in which the glass pipette 105 extends as the coarse movement stage unit 102 slides in the Z-axis direction.

The fine movement stage unit 103 slides with a fine degree in the Z-axis direction. The fine movement stage 103 is attached with a coating needle 106 extending in the Z-axis direction. Accordingly, the application needle 106 can be moved in the Z-axis direction with a fine degree as the fine movement stage 103 slides in the Z-axis direction.

Glass is used for the glass pipette 105, for example. The tip of the glass pipette 105 faces the surface to be coated. The inner diameter of the tip of the glass pipette 105 is, for example, 200 [μm]. A coating liquid 107 is filled in the hollow glass pipette 105. The coating liquid 107 is held in the glass pipette 105 by surface tension. Here, the coating liquid 107 is a conductive ink that is a conductive composition. For example, tungsten is used for the application needle 106. The application needle 106 moves in the Z-axis direction so as to penetrate through the glass pipette 105. The tip of the application needle 106 faces the surface to be applied. When the application needle 106 passes through the glass pipette 105, the droplet attached to the tip of the application needle 106 adheres to the surface of the substrate 11 to be applied, thereby forming a droplet 108 on the surface of the substrate 11. . The application needle 106 has a replaceable structure, and the tip diameter can be arbitrarily selected, for example, 10 [μm] or 100 [μm]. That is, the application needle 106 can be selected in accordance with the desired dot diameter.

13A to 13D are schematic diagrams showing an operation example of the application needle of the micro droplet application system. FIG. 13E is a schematic diagram showing droplets formed on the surface to be coated by the steps of FIGS. 13A to 13D. As described above, the application needle 106 moves with the sliding movement of the fine movement stage unit 103 (see FIG. 12A).

The glass pipette 105 is filled with a coating liquid 107. First, as shown in FIG. 13A, the tip of the application needle 106 is positioned above the liquid surface of the application liquid 107. The tip of the application needle 106 is movable in a direction that can approach and separate from the surface of the substrate 11 that is the application target. Next, as shown in FIG. 13B, the tip of the application needle 106 is positioned in the application liquid 107. Next, as shown in FIG. 13C, the tip of the application needle 106 is moved below the glass pipette 105. At this time, a part of the application liquid 107 adheres as a droplet 109 to the tip of the application needle 106. Next, as shown in FIG. 13D, the application needle 106 is further moved downward so that the droplet 109 of the application liquid 107 adhering to the tip of the application needle 106 contacts the surface of the substrate 11. Transfer. As a result, droplets 108 are formed on the surface of the substrate 11. Thereafter, the application needle 106 is raised and the tip of the application needle 106 is moved into the application liquid 107 of the glass pipette 105.

As shown in FIG. 13E, the droplet 108 formed on the surface of the substrate 11 has a droplet diameter D and a thickness t. The approximate minimum dimensions of the droplet 108 that can be formed are a droplet diameter D of 5 [μm] and a thickness t of 1 [μm]. In addition, in the needle type dispenser, not only dots (stipling) but also line drawing is possible. And the phenomenon which the edge and thickness which arise with an inkjet become uneven state does not occur easily with a needle type dispenser.

In the jet dispenser and the pneumatic dispenser, the minimum amount of liquid that can be applied is 1,000 [pl]. On the other hand, with a needle-type dispenser, a minute amount of 1 [pl] can be applied. 1 [pl] corresponds to 5 [μm] as the coating diameter. On the other hand, in an inkjet, a low-viscosity coating liquid of 1 to 15 [mPa · s] is preferable, and it is impossible to apply a high-viscosity liquid. On the other hand, with a needle-type dispenser, it is possible to apply a low to high viscosity liquid such as 1 to 350,000 [mPa · s]. In this way, a highly viscous liquid that cannot be applied by inkjet can be applied at the picoliter level by a needle dispenser. Therefore, a free paint design is possible with the needle-type dispenser having these characteristics. Specifically, not only a liquid with a high content of organic solvent but also a liquid with a high content of resin or the like can be used. In addition, liquids with increased functional groups can be used to improve adhesion. In addition, the thermosetting resin can be replaced with a UV curable resin, which is advantageous including tact. Furthermore, the cost can be reduced by increasing the range of selection of the liquid to be used.

FIG. 14 shows the movement until the droplets ejected from the inkjet nozzles land on the application target. The flight path of the droplet 108 ejected from the inkjet nozzle 33 is bent due to the influence of the airflow, the electric charge, and the like, and the landing deviation e is generated from a desired output position.

FIG. 15A is a plan view showing an example of a droplet formed by inkjet. FIG. 15B is a sectional view taken along line AA shown in FIG. 15A. FIG. 15C is a plan view showing an example of a droplet formed by a needle-type dispenser. FIG. 15D is a cross-sectional view taken along line AA shown in FIG. 15C. As shown in FIGS. 15A and 15B, for example, a droplet called an ink jet formed on the substrate 11 has a phenomenon called non-uniform film thickness called coffee ring. On the other hand, as shown in FIG. 15C and FIG. 15D, for example, a coffee ring is unlikely to occur in the droplet 108 to which a high-viscosity liquid is transferred by a needle-type dispenser formed on the transparent conductive layer 12.

[effect]
In the first embodiment, a plurality of conductive part elements 13a and conductive part elements 14a are randomly arranged on the surface of the base material 11 in a two-dimensional manner in the X-axis direction and the Y-axis direction of the base material surface. The

conductive part elements

13a and 14a can be easily manufactured by the method, particularly the ink jet printing method and the microdroplet coating method.

Conductive portion elements 14a adjacent in the X-axis direction, and by connecting the conductive portion elements 14a adjacent in the Y-axis direction, an electric path is formed in the first region R _1, the first region R ₁ The transparent conductive layer 12 can function as the transparent electrode portion 13.

Since the planarly alternately provided with a transparent electrode 13 and the transparent insulating portion 14 on the substrate surface, the first region R ₁ and the transparent electrode portions 13 are not provided to the transparent electrode portions 13 is provided Thus, the difference in reflectance from the region R ₂ can be reduced. Further, since the provided conductive portion elements 13a to the transparent electrode 13, the first region R ₁ and the reflectance difference between the second region R ₂ can be further reduced. Therefore, the visual recognition of the pattern of the transparent electrode part 13 can be suppressed.

When a random pattern is created using a raster image, a random pattern matching a printing method, particularly an ink jet printing method can be formed. Inkjet printing is on-demand printing, so there is no need to produce a plate, and feedback such as trial design becomes easy. Further, the ink jet printing method is suitable for use in a small amount and a variety of products, and is suitable for use as a touch panel of a mobile device in which product changes are remarkable.

∙ When conductive ink is printed by the micro droplet application method (micro droplet application system), it can be applied to the desired output position with high accuracy. Furthermore, when a high-viscosity paint is used, the coffee ring phenomenon caused by the paint drying can be suppressed.

(Modification)
Hereinafter, modifications of the first embodiment will be described.

(Hard coat layer)
As shown in FIG. 16A, a hard coat layer 61 may be provided on at least one of the two surfaces of the first transparent conductive element 1. Thereby, when using a plastic base material for the base material 11, the damage of the base material 11 in a process, chemical-resistance provision, and precipitation of low molecular weight substances, such as an oligomer, can be suppressed. As the hard coat material, it is preferable to use an ionizing radiation curable resin that is cured by light or electron beam, or a thermosetting resin that is cured by heat, and a photosensitive resin that is cured by ultraviolet rays is most preferable. As such a photosensitive resin, for example, acrylate resins such as urethane acrylate, epoxy acrylate, polyester acrylate, polyol acrylate, polyether acrylate, and melamine acrylate can be used. For example, a urethane acrylate resin is obtained by reacting a polyester polyol with an isocyanate monomer or a prepolymer, and reacting the resulting product with an acrylate or methacrylate monomer having a hydroxyl group. The thickness of the hard coat layer 61 is preferably 1 μm to 20 μm, but is not particularly limited to this range.

The hard coat layer 61 is formed as follows. First, a hard coat paint is applied to the surface of the substrate 11. The coating method is not particularly limited, and a known coating method can be used. Known coating methods include, for example, micro gravure coating method, wire bar coating method, direct gravure coating method, die coating method, dip method, spray coating method, reverse roll coating method, curtain coating method, comma coating method, knife coating. Method, spin coating method and the like. The hard coat paint contains, for example, a resin raw material such as a bifunctional or higher functional monomer and / or oligomer, a photopolymerization initiator, and a solvent. Next, if necessary, the solvent is volatilized by drying the hard coat paint applied to the surface of the substrate 11. Next, the hard coat paint on the surface of the substrate 11 is cured by, for example, ionizing radiation irradiation or heating. Note that the hard coat layer 61 may be provided on at least one of the two surfaces of the second transparent conductive element 2 in the same manner as the first transparent conductive element 1 described above.

(Optical adjustment layer)
As shown in FIG. 16B, it is preferable to interpose an optical adjustment layer 62 between the base material 11 and the transparent conductive layer 12 of the first transparent conductive element 1. Thereby, the invisibility of the pattern shape of the transparent electrode part 13 can be assisted. The optical adjustment layer 62 is composed of, for example, a laminate of two or more layers having different refractive indexes, and the transparent conductive layer 12 is formed on the low refractive index layer side. More specifically, as the optical adjustment layer 62, for example, a conventionally known optical adjustment layer can be used. As such an optical adjustment layer, for example, those described in JP-A-2008-98169, JP-A-2010-15861, JP-A-2010-23282, and JP-A-2010-27294 are used. be able to. In addition, like the first transparent conductive element 1 described above, the optical adjustment layer 62 may be interposed between the base material 21 and the transparent conductive layer 22 of the second transparent conductive element 2.

(Adhesion auxiliary layer)
As shown in FIG. 16C, it is preferable to provide a close adhesion auxiliary layer 63 as a base layer of the transparent conductive layer 12 of the first transparent conductive element 1. Thereby, the adhesiveness of the transparent conductive layer 12 with respect to the base material 11 can be improved. Examples of the material of the adhesion auxiliary layer 63 include polyacrylic resins, polyamide resins, polyamideimide resins, polyester resins, and hydrolysis and dehydration condensation products of metal element chlorides, peroxides, alkoxides, and the like. Etc. can be used.

Instead of using the adhesion auxiliary layer 63, a discharge treatment in which a surface on which the transparent conductive layer 12 is provided is irradiated with glow discharge or corona discharge may be used. Moreover, you may use the chemical treatment method processed with the acid or alkali on the surface in which the transparent conductive layer 12 is provided. Moreover, after providing the transparent conductive layer 12, you may make it improve contact | adherence by a calendar process. Note that, in the second transparent conductive element 2 as well, the adhesion auxiliary layer 63 may be provided in the same manner as the first transparent conductive element 1 described above. Moreover, you may make it perform the process for the above-mentioned adhesive improvement.

(Shield layer)
As shown in FIG. 16D, it is preferable to provide a shield layer 64 on the first transparent conductive element 1. For example, a film provided with the shield layer 64 may be bonded to the first transparent conductive element 1 via a transparent adhesive layer. In addition, when the X electrode and the Y electrode are formed on the same surface side of the single substrate 11, the shield layer 64 may be directly formed on the opposite side. As the material of the shield layer 64, the same material as that of the transparent conductive layer 12 can be used. As a method for forming the shield layer 64, a method similar to that for the transparent conductive layer 12 can be used. However, the shield layer 64 is used in a state where it is formed on the entire surface of the substrate 11 without patterning. By forming the shield layer 64 on the first transparent conductive element 1, noise caused by electromagnetic waves emitted from the display device 4 can be reduced, and the position detection accuracy of the information input device 10 can be improved. Note that, similarly to the first transparent conductive element 1 described above, a shield layer 64 may be provided on the second transparent conductive element 2.

(Antireflection layer)
As shown in FIG. 17A, it is preferable to further provide an antireflection layer 65 on the first transparent conductive element 1. The antireflection layer 65 is provided, for example, on the main surface opposite to the side on which the transparent conductive layer 12 is provided, of both main surfaces of the first transparent conductive element 1.

As the antireflection layer 65, for example, a low refractive index layer or a moth-eye structure can be used. When a low refractive index layer is used as the antireflection layer 65, a hard coat layer may be further provided between the base material 11 and the antireflection layer 65. Note that, similarly to the first transparent conductive element 1 described above, the second transparent conductive element 2 may be further provided with an antireflection layer 65.

FIG. 17B is a cross-sectional view showing an application example of the first transparent conductive element 1 and the second transparent conductive element 2 provided with the antireflection layer 65. As shown in FIG. 17B, the first transparent conductive element 1 and the second transparent conductive element 2 have a main surface on the side where the antireflection layer 65 is provided, of the two main surfaces. It arrange | positions on the display apparatus 4 so as to oppose a surface. By adopting such a configuration, the light transmittance from the display surface of the display device 4 can be improved, and the display performance of the display device 4 can be improved.

<2. Second Embodiment>
[Configuration of transparent conductive element]
(Transparent electrode part, transparent insulation part)
FIG. 18A is a plan view illustrating a configuration example of the transparent electrode portion of the first transparent conductive element. FIG. 18B is a cross-sectional view along the line AA shown in FIG. 18A. The transparent electrode portion 13 is a transparent conductive layer 12 formed such that a plurality of conductive portion elements 13a are regularly arranged two-dimensionally in the X-axis direction and the Y-axis direction on the surface of the substrate 11. In adjacent rows, conductive part elements adjacent in the X-axis direction and conductive part elements adjacent in the Y-axis direction are connected.

More specifically, the transparent electrode portion 13 is a transparent conductive layer 12 regularly formed with a plurality of hole portions 13c spaced apart, and the transparent conductive portion 13b is interposed between adjacent hole portions 13c. ing. The shape of the hole 13 c regularly changes on the surface of the base material 11.

FIG. 18C is a plan view illustrating a configuration example of the transparent insulating portion of the first transparent conductive element. FIG. 18D is a cross-sectional view taken along line AA shown in FIG. 18C. The transparent insulating part 14 is a transparent conductive layer formed such that a plurality of conductive part elements 14a are regularly arranged two-dimensionally in the X-axis direction and the Y-axis direction on the surface of the substrate. In adjacent rows, conductive part elements adjacent in the X-axis direction and conductive part elements adjacent in the Y-axis direction are connected.

More specifically, the transparent insulating portion 14 is composed of a plurality of island portions 14b separated by a separation portion 14c. The island part 14b is formed by one conductive part element 14a or a plurality of connected conductive part elements 14a. The shape of the island portion 14 b regularly changes on the surface of the base material 11.

(Boundary part)
FIG. 19A is a plan view illustrating an example of a shape pattern of a boundary portion. FIG. 19B is a cross-sectional view along the line AA shown in FIG. 19A. A regular shape pattern is preferably provided at the boundary between the transparent electrode portion 13 and the transparent insulating portion 14. In this way, by providing a regular shape pattern at the boundary part, the visual recognition of the boundary part can be suppressed.

It is preferable that the conductive part elements 13a and the conductive part elements 14a are regularly arranged in the boundary part between the transparent electrode part 13 and the transparent insulating part 14 in the extending direction of the boundary part. The arrangement of the conductive part elements 13a and the conductive part elements 14a at the boundary is not limited to the regular arrangement, and the conductive part elements 13a and the conductive part elements 14a may be randomly arranged only at the boundary part. Good.

[Method for producing transparent conductive element]
Except for performing printing (drawing) of conductive ink based on a rule pattern generated in advance, it is the same as in the first embodiment. For example, the regular pattern is stored in advance in the storage unit as a raster image in which white dots and black dots are arranged in a regular pattern, and conductive ink is printed (drawn) based on the raster image.

In the second embodiment, other than the above are the same as in the first embodiment.

<3. Third Embodiment>
[Configuration of transparent conductive element]
(Transparent electrode part, transparent insulation part)
FIG. 20A is a plan view illustrating a configuration example of the first transparent conductive element. 20B is a cross-sectional view taken along the line AA shown in FIG. 20A. As shown in FIGS. 20A and 20B, the transparent electrode portion 13 is provided with a plurality of conductive portion elements 13a continuously on the surface of the base material 11 in the _first region (electrode region) R1, and covers the surface. This is a transparent (continuous film) transparent conductive portion 13b. However, the first region (electrode area) R ₁ and the boundary portion between the second region (insulating region) R ₂ shall be excluded. The transparent conductive portion 13b, which is a continuous film, preferably has a substantially uniform film thickness. On the other hand, as shown in FIGS. 20A and 20B, the transparent insulating portion 14 has the same configuration as the transparent insulating portion 14 in the first embodiment.

(Boundary part)
A random shape pattern is preferably provided at the boundary between the transparent electrode portion 13 and the transparent insulating portion 14. Thus, by providing a random shape pattern at the boundary part, the visual recognition of the boundary part can be suppressed.

It is preferable that the conductive part elements 14a are randomly arranged in the boundary part between the transparent electrode part 13 and the transparent insulating part 14 in the extending direction of the boundary part. When such an arrangement is employed, the conductive part elements 14a are arranged so as to be in contact with or overlap the boundary L on the transparent insulating part 14 side, for example. In addition, the arrangement | sequence of the electroconductive part element 14a in a boundary part is not limited to a random arrangement | sequence, You may make it arrange | position the electroconductive part element 14a regularly only in a boundary part.

In the third embodiment, other than the above are the same as in the first embodiment.

<4. Fourth Embodiment>
[Configuration of transparent conductive element]
(Transparent electrode part, transparent insulation part)
FIG. 21A is a plan view illustrating a configuration example of the first transparent conductive element. FIG. 21B is a cross-sectional view along the line AA shown in FIG. 21A. As shown in FIGS. 21A and 21B, the transparent electrode portion 13 has the same configuration as the transparent electrode portion 13 in the third embodiment. On the other hand, as shown in FIGS. 21A and 21B, the transparent insulating portion 14 has the same configuration as the transparent insulating portion 14 in the second embodiment.

(Boundary part)
A regular shape pattern is preferably provided at the boundary between the transparent electrode portion 13 and the transparent insulating portion 14. In this way, by providing a regular shape pattern at the boundary part, the visual recognition of the boundary part can be suppressed.

It is preferable that the conductive portion elements 14a are regularly arranged in the boundary portion between the transparent electrode portion 13 and the transparent insulating portion 14 in the extending direction of the boundary portion. When such an arrangement is employed, the conductive part elements 14a are arranged so as to be in contact with or overlap the boundary L on the transparent insulating part 14 side, for example. In addition, the arrangement | sequence of the electroconductive part element 14a in a boundary part is not limited to a regular arrangement | sequence, You may make it arrange | position the electroconductive part element 14a at random only in a boundary part.

In the fourth embodiment, other than the above are the same as in the second embodiment.

<5. Fifth Embodiment>
[Configuration of transparent conductive element]
(Transparent electrode part, transparent insulation part)
FIG. 22A is a plan view showing a configuration example of the first transparent conductive element. FIG. 22B is a cross-sectional view along the line AA shown in FIG. 22A. As shown in FIGS. 22A and 22B, the transparent electrode portion 13 has the same configuration as the transparent electrode portion 13 in the first embodiment. On the other hand, as shown in FIGS. 22A and 22B, the transparent insulating portion 14 has the same configuration as the transparent insulating portion 14 in the second embodiment.

Conductive element 13a is randomly arranged at the boundary between transparent electrode part 13 and transparent insulating part 14 in the extending direction of the boundary part, and conductive element 14a is regularly arranged. Is preferred. When such an arrangement is employed, the conductive part elements 13a are arranged so as to be in contact with or overlap the boundary L on the transparent electrode part 13 side, for example. Further, the conductive portion elements 14a are arranged so as to be in contact with or overlap the boundary L on the transparent insulating portion 14 side, for example.

In addition, the arrangement | sequence of the electroconductive part element 13a in a boundary part is not limited to a random arrangement | sequence, You may make it arrange | position the electroconductive part element 13a regularly only in a boundary part. Further, the arrangement of the conductive part elements 14a in the boundary part is not limited to the regular arrangement, and the conductive part elements 14a may be randomly arranged only in the boundary part.

In the fifth embodiment, other than the above are the same as in the first embodiment.

<6. Sixth Embodiment>
[Configuration of transparent conductive element]
(Transparent electrode part, transparent insulation part)
FIG. 23A is a plan view showing a configuration example of the first transparent conductive element. FIG. 23B is a cross-sectional view along the line AA shown in FIG. 23A. As shown in FIGS. 23A and 23B, the transparent electrode portion 13 has the same configuration as the transparent electrode portion 13 in the second embodiment. On the other hand, as shown in FIGS. 23A and 23B, the transparent insulating portion 14 has the same configuration as the transparent insulating portion 14 in the first embodiment.

Conductive element 13a is regularly arranged at the boundary between transparent electrode 13 and transparent insulating part 14 in the extending direction of the boundary, and conductive element 14a is randomly arranged. Is preferred. When such an arrangement is employed, the conductive part elements 13a are arranged so as to be in contact with or overlap the boundary L on the transparent electrode part 13 side, for example. Further, the conductive portion elements 14a are arranged so as to be in contact with or overlap the boundary L on the transparent insulating portion 14 side, for example.

Note that the arrangement of the conductive portion elements 13a at the boundary is not limited to a regular arrangement, and the conductive portion elements 13a may be randomly arranged only at the boundary. Further, the arrangement of the conductive part elements 14a in the boundary part is not limited to a random arrangement, and the conductive part elements 14a may be regularly arranged only in the boundary part.

In the sixth embodiment, other than the above are the same as in the first embodiment.

<7. Seventh Embodiment>
The seventh embodiment is different from the first embodiment in that the

conductive portion elements

13a and 14a having two or more sizes are provided. In order to form the

conductive part elements

13a and 14a having two or more types of sizes, for example, the dot size of the grid may be set to two or more types.

FIG. 24A shows an example of a grid having two types of dot sizes. 24B and 24C show examples of the transparent electrode portion 13 and the transparent insulating portion 14 formed using this grid, respectively. The transparent electrode portion 13 and the transparent insulating portion 14 have two types of

conductive portion elements

13a and 14a.

FIG. 25A shows an example of a grid having three types of dot sizes. FIG. 25B and FIG. 25C show examples of the transparent electrode portion 13 and the transparent insulating portion 14 formed using this grid, respectively. The transparent electrode portion 13 and the transparent insulating portion 14 have three types of

conductive portion elements

13a and 14a.

<8. Eighth Embodiment>
In the eighth embodiment, the X-axis direction (first direction) and the Y-axis direction (second direction) are in a diagonally crossing relationship, and the conductive element 13a in the X-axis direction and the Y-axis direction in this relationship 14a is different from the first embodiment in that it is formed so as to be randomly arranged two-dimensionally. In order to form the

conductive element

13a, 14a in the X-axis direction (first direction) and the Y-axis direction (second direction) that are in an oblique intersection relationship, for example, the grid dot shape is a parallelogram shape or the like. You can do it.

FIG. 26A shows an example of a grid in which the dot shape is a parallelogram shape. FIG. 26B and FIG. 26C show examples of the transparent electrode portion 13 and the transparent insulating portion 14 formed using this grid, respectively.

<9. Ninth Embodiment>
[Configuration of transparent conductive element]
FIG. 27A is a plan view illustrating a configuration example of the first transparent conductive element according to the ninth embodiment of the present technology. FIG. 27B is a plan view illustrating a configuration example of the second transparent conductive element according to the ninth embodiment of the present technology. The ninth embodiment is the same as the first embodiment except for the configuration of the transparent electrode portion 13, the transparent insulating portion 14, the transparent electrode portion 23, and the transparent insulating portion 24.

The transparent electrode portion 13 includes a plurality of pad portions (unit electrode bodies) 13m and a plurality of connecting portions 13n that connect the plurality of pad portions 13m. The connection part 13n is extended in the X-axis direction, and connects the edge parts of the adjacent pad part 13m. The pad portion 13m and the connecting portion 13n are integrally formed.

The transparent electrode portion 23 includes a plurality of pad portions (unit electrode bodies) 23m and a plurality of connecting portions 23n that connect the plurality of pad portions 23m to each other. The connecting portion 23n extends in the Y-axis direction, and connects the ends of the adjacent pad portions 23m. The pad part 23m and the connecting part 23n are integrally formed.

As the shapes of the pad portion 13m and the pad portion 23m, for example, a diamond shape (diamond shape), a polygonal shape such as a rectangle, a star shape, a cross shape, or the like can be used. However, the shape is not limited to these shapes. .

Although the rectangular shape can be adopted as the shape of the connecting portion 13n and the connecting portion 23n, the shape of the connecting portion 13n and the connecting portion 23n may be any shape as long as the adjacent pad portions 13m and the pad portions 23m can be connected to each other. The shape is not particularly limited to a rectangular shape. Examples of shapes other than the rectangular shape include a linear shape, an oval shape, a triangular shape, and an indefinite shape.

In the ninth embodiment, other than the above are the same as in the first embodiment.

[effect]
According to the ninth embodiment, the same effects as those of the first embodiment can be obtained.

<10. Tenth Embodiment>
[Configuration of information input device]
FIG. 28 is a cross-sectional view illustrating a configuration example of an information input device according to the tenth embodiment of the present technology. The information input device 10 according to the tenth embodiment includes a transparent conductive layer 12 on one main surface (first main surface) of a base material 21, and transparent conductivity on the other main surface (second main surface). It differs from the information input device 10 according to the first embodiment in that the layer 22 is provided. The transparent conductive layer 12 includes a transparent electrode part and a transparent insulating part. The transparent conductive layer 22 includes a transparent electrode part and a transparent insulating part. The transparent electrode portion of the transparent conductive layer 12 is an X electrode portion that extends in the X-axis direction, and the transparent electrode portion of the transparent conductive layer 22 is a Y electrode portion that extends in the Y-axis direction. Therefore, the transparent electrode portions of the transparent conductive layer 12 and the transparent conductive layer 22 are in a relationship orthogonal to each other.

In the tenth embodiment, other than the above are the same as in the first embodiment.

[effect]
According to the tenth embodiment, the following effects can be further obtained in addition to the effects of the first embodiment. That is, since the transparent conductive layer 12 is provided on one main surface of the base material 21 and the transparent conductive layer 22 is provided on the other main surface, the base material 11 (see FIG. 1) in the first embodiment is omitted. be able to. Therefore, the information input device 10 can be further reduced in thickness.

<11. Eleventh Embodiment>
[Configuration of information input device]
FIG. 29A is a plan view illustrating a configuration example of an information input device according to an eleventh embodiment of the present technology. FIG. 29B is a cross-sectional view along the line AA shown in FIG. 29A. The information input device 10 is a so-called projected capacitive touch panel. As shown in FIGS. 29A and 29B, the base material 11, the plurality of transparent electrode portions 13 and the transparent electrode portions 23, and the transparent insulating portion 14. The transparent insulating layer 81 is provided. The plurality of transparent electrode portions 13 and the transparent electrode portion 23 are provided on the same surface of the substrate 11. The transparent insulating part 14 is provided between the transparent electrode part 13 and the transparent electrode part 23 in the in-plane direction of the substrate 11. The transparent insulating layer 81 is interposed between the intersecting portions of the transparent electrode portion 13 and the transparent electrode portion 23.

29B, an optical layer 91 may be further provided on the surface of the base material 11 on which the transparent electrode portion 13 and the transparent electrode portion 23 are formed as necessary. In FIG. 29A, the optical layer 91 is not shown. The optical layer 91 includes a bonding layer 92 and a base 93, and the base 93 is bonded to the surface of the base material 11 via the bonding layer 92. The information input device 10 is suitable for application to a display surface of a display device. The base material 11 and the optical layer 91 have transparency with respect to visible light, for example, and the refractive index n is preferably in the range of 1.2 or more and 1.7 or less. Hereinafter, two directions orthogonal to each other within the surface of the information input device 10 are referred to as an X-axis direction and a Y-axis direction, respectively, and a direction perpendicular to the surface is referred to as a Z-axis direction.

(Transparent electrode part)
The transparent electrode portion 13 extends in the X-axis direction (first direction) on the surface of the base material 11, while the transparent electrode portion 23 extends in the Y-axis direction (second direction on the surface of the base material 11. Direction). Therefore, the transparent electrode portion 13 and the transparent electrode portion 23 cross each other at right angles. At the intersection C where the transparent electrode portion 13 and the transparent electrode portion 23 intersect, a transparent insulating layer 81 for insulating the two electrodes is interposed.

FIG. 30A is an enlarged plan view showing the vicinity of the intersection C shown in FIG. 29A. FIG. 30B is a cross-sectional view along the line AA shown in FIG. 30A. The transparent electrode portion 13 includes a plurality of pad portions (unit electrode bodies) 13m and a plurality of connecting portions 13n that connect the plurality of pad portions 13m to each other. The connection part 13n is extended in the X-axis direction, and connects the edge parts of the adjacent pad part 13m. The transparent electrode portion 23 includes a plurality of pad portions (unit electrode bodies) 23m and a plurality of connecting portions 23n that connect the plurality of pad portions 23m. The connecting portion 23n extends in the Y-axis direction, and connects the ends of the adjacent pad portions 23m.

In the intersection C, the connecting portion 23n, the transparent insulating layer 81, and the connecting portion 13n are laminated on the surface of the base material 11 in this order. The connecting portion 13n is formed so as to cross over the transparent insulating layer 81, and one end of the connecting portion 13n straddling the transparent insulating layer 81 is electrically connected to one of the adjacent pad portions 13m. The other end of the connecting portion 13n straddling 81 is electrically connected to the other of the adjacent pad portions 13m.

The pad portion 23m and the connecting portion 23n are integrally formed, whereas the pad portion 13m and the connecting portion 13n are separately formed. The pad portion 13m, the pad portion 23m, the connecting portion 23n, and the transparent insulating portion 14 are constituted by, for example, a single transparent conductive layer 12 provided on the surface of the base material 11. The connection part 13n consists of a conductive layer, for example.

As the conductive layer constituting the connecting portion 13n, for example, a metal layer or a transparent conductive layer can be used. The metal layer contains a metal as a main component. As the metal, it is preferable to use a metal having high conductivity. Examples of such a material include Ag, Al, Cu, Ti, Nb, and impurity-added Si. In consideration of film-forming properties and printability, Ag is preferable. By using a highly conductive metal as the material of the metal layer, it is preferable to reduce the width of the connecting portion 13n, reduce the thickness thereof, and shorten the length thereof. Thereby, visibility can be improved.

(Transparent insulation layer)
The transparent insulating layer 81 preferably has a larger area than the portion where the connecting portion 13n and the connecting portion 23n intersect. For example, the transparent insulating layer 81 covers the pad portion 13m located at the intersecting portion C and the tip of the pad portion 23m. It has the size.

The transparent insulating layer 81 contains a transparent insulating material as a main component. As the transparent insulating material, it is preferable to use a polymer material having transparency, and examples of such a material include vinyl monomers such as polymethyl methacrylate, methyl methacrylate and other alkyl (meth) acrylates, and styrene. (Meth) acrylic resins such as copolymers; polycarbonate resins such as polycarbonate and diethylene glycol bisallyl carbonate (CR-39); homopolymers or copolymers of (brominated) bisphenol A type di (meth) acrylates Thermosetting (meth) acrylic resins such as polymers and copolymers of urethane-modified monomers of (brominated) bisphenol A mono (meth) acrylate; polyesters, especially polyethylene terephthalate, polyethylene naphthalate and unsaturated polyesters Le, acrylonitrile - styrene copolymers, polyvinyl chloride, polyurethane, epoxy resins, polyarylate, polyether sulfone, polyether ketone, cycloolefin polymer (trade name: ARTON, ZEONOR), and the like cycloolefin copolymer. It is also possible to use an aramid resin in consideration of heat resistance. Here, (meth) acrylate means acrylate or methacrylate.

The shape of the transparent insulating layer 81 is not particularly limited as long as it is interposed between the transparent electrode portion 13 and the transparent electrode portion 23 at the intersection C and can prevent electrical contact between both electrodes. However, for example, a polygon such as a quadrangle, an ellipse, and a circle can be given as examples. Examples of the quadrangle include a rectangle, a square, a rhombus, a trapezoid, a parallelogram, and a rectangle with a corner having a curvature R.

(wiring)
As shown in region R of FIG. 29A, wiring 82 is electrically connected to one end of each of transparent electrode portion 13 and transparent electrode portion 23, and this wiring 82 and a drive circuit (not shown) are connected to FPC (Flexible Printed). Circuit) 83 is connected.

FIG. 31 is an enlarged plan view showing the region R shown in FIG. 29A. As shown in FIG. 31, the wiring 82 is a linear conductive layer (continuous film) in which a plurality of conductive part elements 13 a are continuously provided on the surface of the substrate 11. An insulating portion 84 is provided between the wirings 82. The conductive layer, which is a continuous film, preferably has a substantially uniform film thickness. The conductive layer contains a metal material or a transparent conductive material as a main component. The conductive part element 13a can be formed by a printing method such as an ink jet printing method or a microdroplet coating method, as in the first embodiment. When an ink jet printing method or a micro droplet application method is used as a printing method, adjacent droplets (conductive ink) dropped on the surface of the substrate 11 are in the X-axis direction (first direction) and / or the Y-axis. It is preferable to adjust the dropping position of the droplet (conductive ink) so as to be continuously connected in the direction (second direction).

In the eleventh embodiment, other than the above are the same as in the first embodiment.

[effect]
According to the eleventh embodiment, the following effects can be further obtained in addition to the effects of the first embodiment. That is, since the

transparent electrode portions

13 and 23 are provided on one main surface of the base material 11, the base material 21 (see FIG. 1) in the first embodiment can be omitted. Therefore, the information input device 10 can be further reduced in thickness.

<12. Twelfth Embodiment>
The electronic apparatus according to the twelfth embodiment includes any one of the information input devices 10 according to the first to eleventh embodiments in the display unit. An example of an electronic device according to the twelfth embodiment of the present technology will be described below.

FIG. 32A is an external view illustrating an example of a television device as an electronic apparatus. The television apparatus 201 includes a display unit 202, and the display unit 202 includes any one of the information input devices 10 according to the first to eleventh embodiments.

FIG. 32B is an external view showing an example of a notebook personal computer as an electronic apparatus. The notebook personal computer 211 includes a display unit 212, and the display unit 212 includes any one of the information input devices 10 according to the first to eleventh embodiments.

FIG. 33A is an external view illustrating an example of a mobile phone as an electronic apparatus. The mobile phone 221 is a so-called smartphone, and includes a display unit 222. The display unit 222 includes any one of the information input devices 10 according to the first to eleventh embodiments.

FIG. 33B is an external view illustrating an example of a tablet computer as an electronic device. The tablet computer 231 includes a display unit 232, and the display unit 232 includes any one of the information input devices 10 according to the first to eleventh embodiments.

[effect]
Since the electronic apparatus according to the twelfth embodiment described above includes any of the information input devices 10 according to the first to twelfth embodiments in the display unit, the information input device 10 can be visually recognized on the display unit. Can be suppressed.

Hereinafter, the present technology will be specifically described by way of examples. However, the present technology is not limited to only these examples.

Examples will be described in the following order.
<1. Drawing performance of needle dispenser>
<2. Discharge time dependence of sheet resistance (surface resistance)>
<3. Relationship between the difference in the proportion of dots forming the conductive element and the visibility>

<1. Drawing performance of needle dispenser>
A conductive ink containing silver nanowires (hereinafter referred to as “silver nanowire paint”) was applied with a needle-type dispenser, and the drawability of the needle-type dispenser was evaluated.

Example 1-1
First, as a silver nanowire paint, a silver nanowire paint using isopropyl alcohol (IPA) as a main solvent as a diluent solvent (hereinafter referred to as “IPA-based silver nanowire paint”) was prepared. Silver nanowires having an average diameter of 110 nm and an average length of 60 μm or less were used.

Next, after applying this IPA type silver nanowire coating material to the acrylic sheet surface in the form of dots with a needle-type dispenser, a plurality of conductive parts were formed on the acrylic sheet surface by heating and drying. Below, the structure of the needle type dispenser used for printing is shown.
Glass pipette (pump) Tip inner diameter (diameter) φ: 400 μm, Material: Glass Application needle (needle) Diameter (diameter) φ: 50 μm, Material: Tungsten tact 1 dot / sec

Example 1-2
A plurality of conductive part elements were formed on the surface of the acrylic sheet in the same manner as in Example 1-1 except that the IPA-based silver nanowire paint was applied in a line to the surface of the acrylic sheet with a needle-type dispenser.

[Drawability]
The conductive part elements on the acrylic sheet surfaces of Examples 1 and 2 obtained as described above were observed with an optical microscope. As a result, the following was found.
With the needle-type dispenser, dot-shaped and line-shaped conductive part elements can be drawn.
The dot diameter and line width are approximately equal to the needle diameter (φ: 50 μm). Therefore, it is possible to set the diameter of the dot to be drawn and the width of the line by the needle diameter.

<2. Discharge time dependence of sheet resistance (surface resistance)>
A silver nanowire paint was continuously applied to the sheet surface using an ink jet printing method to form a transparent conductive layer, and the discharge time dependency of the sheet resistance (surface resistance) was evaluated.

Example 2-1
First, a silver nanowire paint (hereinafter referred to as “aqueous silver nanowire paint”) using water as a main solvent as a dilution solvent was prepared. Next, a water-based silver nanowire paint was continuously applied to the acrylic sheet surface by an ink jet printing method to form a square-shaped coating film (continuous film) in which droplets were continuously connected two-dimensionally. This printing operation was performed for 60 minutes, and a square-shaped coating film (continuous film) was repeatedly formed. Table 3 shows the printing conditions at this time. Next, the plurality of transparent conductive layers having a square shape were formed on the acrylic sheet surface by heating and drying the coating film. Thereby, the target transparent conductive sheet was obtained.

(Example 2-2)
A transparent conductive sheet was obtained in the same manner as in Example 2-1, except that an IPA silver nanowire paint was used as the silver nanowire paint.

[Sheet resistance]
The sheet resistance of the transparent conductive sheets of Examples 2-1 and 2-2 obtained as described above was measured by a four-probe method. The results are shown in Table 4 and FIG. As a sheet resistance measuring device, Loresta EP, MCP-T360, manufactured by Mitsubishi Chemical Analytech Co., Ltd. was used. In addition, measurement of sheet resistance is a rectangular shape formed by application | coating after 60 minutes after application | coating start immediately after application | coating start among several transparent conductive layers formed in the acrylic sheet surface. It carried out about each transparent conductive layer.

Table 3 shows the printing conditions of the transparent conductive sheets of Examples 2-1 and 2-2.

Table 4 shows the measurement results of the transparent conductive sheets of Examples 2-1 and 2-2.

The following can be understood from Table 4 and FIG.
When using either the water-based silver nanowire paint or the IPA-based silver nanowire paint, there is almost no variation in the sheet resistance value due to the discharge time (printing time), and a sheet resistance value of around 100Ω / □ can be obtained. That is, even when printing is performed by an ink jet method using a silver nanowire paint, problems such as head clogging do not occur.

<3. Relationship between the difference in the proportion of dots forming the conductive element and the visibility>
Regions having different proportions p of dots forming the conductive element were formed adjacent to each other, and the visibility and sheet resistance of the samples having these regions were evaluated.

Example 3-1
First, an IPA silver nanowire paint was prepared as a silver nanowire paint. Next, IPA-based silver nanowire paint was printed on the acrylic sheet surface by an ink jet printing method. At the time of printing, printing was performed so that the droplets (dots) of the paints adjacent in the X-axis direction and the Y-axis direction were connected in adjacent rows. As the print pattern, a random pattern created based on a raster image creation algorithm shown in FIG. 9 was used. During the creation, the first region R _{1 in} which the proportion p of dots forming the conductive element is set to 50 [%] and the proportion p of dots forming the conductive element are set to 15 [%]. a second region R _2, and alternately formed in the acrylic sheet surface. The first region R ₁ and the second region R ₂ of the shape was elongated rectangular. Next, by heating and drying the IPA Keigin nanowires paint printed on the acrylic sheet surface to form a first region R ₁ and the second region R ₂ to a plurality of conductive portions element acrylic sheet surface. Thus, the intended transparent conductive sheet was obtained.

(Example 3-2)
First the rate of dots p in the region R ₁ 50 [%], the transparent conductive except for setting the proportion p of the dots in the second region R ₂ to 25 [%] in the same manner as in Example 3-1 Sex sheet was obtained.

(Example 3-3)
First the rate of dots p in the region R ₁ 50 [%], the transparent conductive except for setting the proportion p of the dots in the second region R ₂ to 35 [%] in the same manner as in Example 3-1 Sex sheet was obtained.

(Example 3-4)
First the rate of dots p in the region R ₁ 50 [%], the transparent conductive except for setting the proportion p of the dots in the second region R ₂ to 40% in the same manner as in Example 3-1 Sex sheet was obtained.

(Example 3-5)
First the rate of dots p in the region R ₁ 60 [%], the transparent conductive except for setting the proportion p of the dots in the second region R ₂ to 25 [%] in the same manner as in Example 3-1 Sex sheet was obtained.

(Example 3-6)
The transparent conductive material is the same as in Example 3-1, except that the dot ratio p in the first region R ₁ is set to 60 [%] and the dot ratio p in the second region R ₂ is set to 35 [%]. Sex sheet was obtained.

(Example 3-7)
First the rate of dots p in the region R ₁ 60 [%], the transparent conductive except for setting the proportion p of the dots in the second region R ₂ to 40% in the same manner as in Example 3-1 Sex sheet was obtained.

(Example 3-8)
The transparent conductive material is the same as in Example 3-1, except that the dot ratio p in the first region R ₁ is set to 75 [%] and the dot ratio p in the second region R ₂ is set to 40 [%]. Sex sheet was obtained.

[Visibility]
The transparent conductive sheets of Examples 3-1 to 3-8 obtained as described above were attached to a slide glass with an adhesive sheet, and a black tape was attached to the back side so that the reflection on the surface was easy to see. Sensory evaluation was performed on the basis. The results are shown in Table 5.
○: the boundary of the first region R ₁ and the second region R ₂ is unclear.
×: the boundary of the first region R ₁ and the second region R ₂ is clear.

[Sheet resistance]
The sheet resistance of the first region R ₁ and the second region R ₂ of the transparent conductive sheets of Examples 3-1 to 3-8 obtained as described above was measured by the 4 probe method. The results are shown in Table 5. As a sheet resistance measuring device, Loresta EP, MCP-T360, manufactured by Mitsubishi Chemical Analytech Co., Ltd. was used.

Then, based on the measured sheet resistance and whether it functions as either a first region R ₁ and the second region R ₂ are conductively portion and nonconductive portion determined by the following criteria.
Conductive part: 1.0 × 10 ⁵ Ω / □ or less, usable as a transparent electrode Non-conducting part: 10 ⁶ Ω / □ or more, usable as an insulating part between transparent electrodes Show. The proportion of dots p is the first region R ₁ is 50 ≦ p functions as a conductive portion (the transparent electrode). On the other hand, the second region R ₁ ratio of dot p is p <50 functions as a non-conductive portion (insulating portion between the transparent electrodes). Therefore, the conductive portion and the non-conductive portion can be separately formed according to the dot ratio p.

Table 5 shows the evaluation results of the transparent conductive sheets of Examples 3-1 to 3-8.

The following was found from the above evaluation results.
When the difference Δp between the dot ratio p of the first area R _{1 and} the dot ratio p of the second area R ₂ is set to 30% or less, the first area R ₁ and the second area R _{2 are used.} Visual recognition of the boundary between the two can be suppressed. That is, from the viewpoint of suppressing the visual recognition of the boundary between the transparent electrode part and the transparent insulating part, the average ratio P1 of the conductive part element per unit section of the transparent electrode part and the conductive part element per unit section of the transparent insulating part It is preferable to set the difference ΔP (= P1−P2) from the average ratio P2 to 30% or less.

The embodiments and examples of the present technology have been specifically described above. However, the present technology is not limited to the above-described embodiments and examples, and various modifications based on the technical idea of the present technology are possible. It is.

For example, the configurations, methods, steps, shapes, materials, numerical values, and the like given in the above-described embodiments and examples are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, and the like are necessary as necessary. May be used.

The present technology can also employ the following configurations.
(1)
A substrate having a surface;
Comprising transparent conductive portions and transparent insulating portions provided alternately on the surface in a plane,
The transparent conductive element and the transparent insulating part are transparent conductive elements including a plurality of conductive part elements provided two-dimensionally in the first direction and the second direction of the surface.
(2)
The transparent conductive element according to (1), wherein the conductive part elements adjacent in the first direction and the conductive part elements adjacent in the second direction are connected.
(3)
The transparent conductive element according to (1) or (2), wherein the transparent insulating part includes a plurality of island parts made of the conductive part element.
(4)
The transparent conductive element according to any one of (1) to (3), wherein the plurality of conductive part elements are randomly provided two-dimensionally in the first direction and the second direction.
(5)
The transparent conductive element according to any one of (1) to (4), wherein the conductive part element has a circular shape, a substantially circular shape, an elliptical shape, or a substantially elliptical shape.
(6)
The transparent conductive element according to any one of (1) to (5), wherein conductive part elements adjacent to each other in a direction oblique to the first direction or the second direction are connected.
(7)
The said electroconductive part element is a transparent conductive element in any one of (1) to (6) obtained by printing electroconductive ink on the said surface.
(8)
The boundary part of the said transparent conductive part and a transparent insulating part is a transparent conductive element in any one of (1) to (7) which has a shape pattern.
(9)
The transparent conductive element according to any one of (1) to (8), wherein the transparent conductive part includes a plurality of holes.
(10)
The plurality of conductive part elements of the transparent conductive part and the transparent insulating part are randomly provided two-dimensionally in the first direction and the second direction,
The average ratio P1 of the conductive part elements in the transparent conductive part satisfies the relationship of 50 [%] ≦ P1,
The transparent conductive element according to any one of (1) to (9), wherein an average ratio P2 of conductive part elements in the transparent insulating part satisfies a relationship of P2 <50 [%].
(11)
The difference ΔP (= P1−P2) between the average ratio P1 of the conductive part elements in the transparent conductive part and the average ratio P2 of the conductive part elements in the transparent insulating part satisfies the relationship ΔP ≦ 30 [%] (10 ) Transparent conductive element.
(12)
The transparent conductive element according to any one of (1) to (9), wherein the transparent conductive part is a transparent conductive layer continuously provided in a region between the transparent insulating parts.
(13)
A substrate having a first surface and a second surface;
A transparent conductive portion and a transparent insulating portion provided alternately in a plane on the first surface and the second surface,
The transparent conductive part and the transparent insulating part include an input device including a plurality of conductive part elements provided two-dimensionally in the first direction and the second direction of the first surface and the second surface.
(14)
An input device comprising the transparent conductive element according to any one of (1) to (12).
(15)
A transparent conductive element having a substrate having a first surface and a second surface, and transparent conductive portions and transparent insulating portions provided alternately in a plane on the first surface and the second surface Prepared,
The transparent conductive portion and the transparent insulating portion are electronic devices including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction of the first surface and the second surface.
(16)
An electronic device comprising the transparent conductive element according to any one of (1) to (12).
(17)
The conductive ink was printed on the surface of the base material, and the conductive portion elements were two-dimensionally formed in the first direction and the second direction of the base material surface, thereby being alternately provided in a plane on the base material surface. A method for producing a transparent conductive element, comprising forming a transparent conductive part and a transparent insulating part.
(18)
The printing is printing by an inkjet method or a microdroplet coating method,
The said conductive ink is a manufacturing method of the transparent conductive element as described in (17) containing the metal wire.
(19)
The method for producing a transparent conductive element according to (17) or (18), wherein a virtual grid is set on the surface of the substrate, and the conductive ink is printed based on the set grid.
(20)
A method for forming a conductive portion, comprising: printing a conductive ink on a surface of a base material by a microdroplet coating method, and forming a plurality of conductive portion elements on the surface of the base material one-dimensionally or two-dimensionally.

DESCRIPTION OF SYMBOLS 1 1st transparent conductive element 2 2nd transparent conductive element 3 Optical layer 4

Display apparatus

5, 6 Bonding layer 10

Information input device

11, 21

Base material

12, 22 Transparent

conductive layer

13, 23

Transparent electrode part

14 , 24 Transparent insulating

portion

13a, 14a Conductive portion element 13b Transparent conductive portion

13c Hole portion

14b Island portion 14c Separating portion L Boundary R ₁ First region R ₂ Second region

Claims

A substrate having a surface;
Comprising transparent conductive portions and transparent insulating portions provided alternately on the surface in a plane,
The transparent conductive element and the transparent insulating part are transparent conductive elements including a plurality of conductive part elements provided two-dimensionally in the first direction and the second direction of the surface.
The transparent conductive element according to claim 1, wherein the conductive part elements adjacent in the first direction and the conductive part elements adjacent in the second direction are connected to each other.
The transparent conductive element according to claim 1, wherein the transparent insulating part includes a plurality of island parts made of the conductive part elements.
The transparent conductive element according to claim 1, wherein the plurality of conductive part elements are randomly provided two-dimensionally in the first direction and the second direction.
The transparent conductive element according to claim 1, wherein the conductive part element has a circular shape, a substantially circular shape, an elliptical shape, or a substantially elliptical shape.
The transparent conductive element according to claim 1, wherein conductive part elements adjacent to each other in an oblique direction with respect to the first direction or the second direction are connected to each other.
2. The transparent conductive element according to claim 1, wherein the conductive part element is obtained by printing a conductive ink on the surface.
The transparent conductive element according to claim 1, wherein a boundary portion between the transparent conductive portion and the transparent insulating portion has a shape pattern.
The transparent conductive element according to claim 1, wherein the transparent conductive part includes a plurality of holes.
The plurality of conductive part elements of the transparent conductive part and the transparent insulating part are randomly provided two-dimensionally in the first direction and the second direction,
The average ratio P1 of the conductive part elements in the transparent conductive part satisfies the relationship of 50 [%] ≦ P1,
2. The transparent conductive element according to claim 1, wherein an average ratio P <b> 2 of the conductive part elements in the transparent insulating part satisfies a relationship of P <b> 2 <50 [%].
A difference ΔP (= P1−P2) between an average ratio P1 of conductive part elements in the transparent conductive part and an average ratio P2 of conductive part elements in the transparent insulating part satisfies a relationship of ΔP ≦ 30 [%]. The transparent conductive element according to 10.
The transparent conductive element according to claim 1, wherein the transparent conductive portion is a transparent conductive layer continuously provided in a region between the transparent insulating portions.
A substrate having a first surface and a second surface;
A transparent conductive portion and a transparent insulating portion provided alternately in a plane on the first surface and the second surface,
The transparent conductive part and the transparent insulating part include an input device including a plurality of conductive part elements provided two-dimensionally in the first direction and the second direction of the first surface and the second surface.
A first transparent conductive element;
A second transparent conductive element provided on the surface of the first transparent conductive element,
The first transparent conductive element and the second transparent conductive element are
A substrate having a surface;
Comprising transparent conductive portions and transparent insulating portions provided alternately on the surface in a plane,
The input device including the transparent conductive portion and the transparent insulating portion including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction of the surface.
A transparent conductive element having a substrate having a first surface and a second surface, and transparent conductive portions and transparent insulating portions provided alternately in a plane on the first surface and the second surface Prepared,
The transparent conductive portion and the transparent insulating portion are electronic devices including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction of the first surface and the second surface.
A first transparent conductive element;
A second transparent conductive element provided on the surface of the first transparent conductive element,
The first transparent conductive element and the second transparent conductive element are
A substrate having a surface;
Comprising transparent conductive portions and transparent insulating portions provided alternately on the surface in a plane,
The transparent conductive portion and the transparent insulating portion are electronic devices including a plurality of conductive portion elements provided two-dimensionally in the first direction and the second direction of the surface.
The conductive ink was printed on the surface of the base material, and the conductive portion elements were two-dimensionally formed in the first direction and the second direction of the base material surface, thereby being alternately provided in a plane on the base material surface. A method for producing a transparent conductive element, comprising forming a transparent conductive part and a transparent insulating part.
The printing is printing by an inkjet method or a microdroplet coating method,
The method of manufacturing a transparent conductive element according to claim 17, wherein the conductive ink includes a metal wire.
The method for manufacturing a transparent conductive element according to claim 17, wherein a virtual grid is set on the surface of the base material, and the conductive ink is printed based on the set grid.
A method for forming a conductive portion, comprising: printing a conductive ink on a surface of a base material by a microdroplet coating method, and forming a plurality of conductive portion elements on the surface of the base material one-dimensionally or two-dimensionally.