WO2014033118A1 - Écriture sans masque dans différents plans focaux - Google Patents

Écriture sans masque dans différents plans focaux Download PDF

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Publication number
WO2014033118A1
WO2014033118A1 PCT/EP2013/067703 EP2013067703W WO2014033118A1 WO 2014033118 A1 WO2014033118 A1 WO 2014033118A1 EP 2013067703 W EP2013067703 W EP 2013067703W WO 2014033118 A1 WO2014033118 A1 WO 2014033118A1
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WO
WIPO (PCT)
Prior art keywords
writing
workpiece
beams
focus
focal planes
Prior art date
Application number
PCT/EP2013/067703
Other languages
English (en)
Inventor
Per Askebjer
Mats Rosling
Original Assignee
Micronic Mydata AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronic Mydata AB filed Critical Micronic Mydata AB
Publication of WO2014033118A1 publication Critical patent/WO2014033118A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G03F7/70333—Focus drilling, i.e. increase in depth of focus for exposure by modulating focus during exposure [FLEX]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature

Definitions

  • the technology disclosed relates to accommodating embedded substrates during direct writing onto a workpiece such as a substrate or printed circuit board and to other patterning problems that benefit from an extended depth of focus.
  • a workpiece such as a substrate or printed circuit board
  • multi- focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes.
  • JPCA Japan Electronics Packaging and Circuits Association
  • the technology disclosed relates to accommodating embedded substrates during direct writing onto a workpiece such as a substrate or printed circuit board and to other patterning problems that benefit from an extended depth of focus.
  • it relates to multi- focus interleaved writing and may be used to produce an effective total depth of focus of a first and a second writing beam in overlapping areas that is greater than the effective depth of focus of any of the first or second writing beam alone.
  • a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes. Further details and alternative implementations appear in the accompanying figures, claims, and description.
  • FIGS. 1A-B are a simplified cross-section and plan view of a substrate with an embedded device.
  • FIG. 2 illustrates interleaving of writing to two and three focal planes, respectively.
  • FIG. 3 is a simplified plan view of overlap for two pass writing with interleaved writing focused on two focal planes using a rotating arm writer.
  • FIG. 4 illustrates increased effective depth of focus with multiple focal planes.
  • FIGS. 5 and 6A-B illustrate exposing a workpiece using multiple modulators in various arrangements.
  • FIGS. 7-8 are reproduced from WO 2005/029178 to illustrate a writing platform that can be modified to implement the technology disclosed.
  • FIGS. 9-13A-B illustrate an image generating platform described in EP 1
  • FIGS. 14A-C illustrate how varying parameters for a translation vector can produce a variety of patterns in which successive exposure spots contribute to the overall, cumulative exposure of an area.
  • Patterning of a workpiece surface is accomplished using a laser direct imaging device.
  • patterning by of a layer on the workpiece's surface may include exposing a photoresist or other photosensitive material, annealing by optical heating, ablating, or creating any other change to the surface by an optical beam.
  • Examples of products produced using patterning steps include printed circuit boards (PCBs), substrates, flexible roll substrate, flexible displays, wafer level packages (WLPs), flexible electronics, solar panels and display.
  • PCBs printed circuit boards
  • WLPs wafer level packages
  • the technology disclosed is directed to patterning a photosensitive surface on a workpiece carrying a surface layer upon which a pattern can be printed with a laser direct imaging system.
  • LDM light-in-distance tomography
  • a laser beam is scanned over a photosensitive surface layer of a workpiece to expose the layer with a pattern in accordance with pattern image data.
  • Other implementations of the technology disclosed may include patterning equipment. For example, equipment for patterning by projecting, writing or printing a pattern on a surface that may accomplish the patterning by exposing a photoresist or other photosensitive material, annealing by optical heating, ablating, creating any other change to the surface.
  • Depth of focus For the purpose of this application, the term depth of focus is used to denominate the total range of focus that can be tolerated, i.e. the range of focus that keeps the resulting printed features within a variety of specifications such as e.g. linewidth.
  • Unidirectional sequence of exposures For the purpose of this application, the term "unidirectional sequence of exposures" is used to denote a sequence of exposures by direct imaging of a workpiece with unidirectional relative movement on one axis between a writing unit and the workpiece. A unidirectional sequence of exposures may be accomplished in several ways.
  • the workpiece can be exposed by continuous scanning of the workpiece in one direction during continuous relative movement of the workpiece another direction.
  • a direct write tool in this implementation, exposes the workpiece by scanning a stripe or strip of the workpiece area during the continuous movement of the workpiece.
  • the rotor- based LDI tool with several writing heads on rotor arms works this way. Alternating arms of the rotor can be focused on different focal planes.
  • the exposure uses a unidirectional series of exposures in the sense that the workpiece runs through the rotor scanning device and the relevant surface has been exposed at two or more focal planes in one
  • step and scan exposure combines the scanning motion of a writing head scanning a strip of the workpiece with a step-and-repeat relative motion of the writing head and workpiece. For instance, a stage moves the workpiece in a step and scan fashion under the writing head. The workpiece is lying still during an exposure by scanning a strip or stripe of the workpiece area.
  • the workpiece can be exposed by a stamp flashing and continuous or step- and-flash exposure.
  • the assignee's SigmaTM line of products use an SLM to project stamped patterns onto the workpiece in brief flashes.
  • the flashes may be short enough to freeze any motion of the workpiece.
  • Either continuous movement of the workpiece or step and flash exposure can be used.
  • This process uses unidirectional movement of the workpiece in the sense that the stamps are applied in a series along a direction generally orthogonal to the relative movement of the workpiece.
  • An area or the whole width of the workpiece is exposed at two or more focal planes in one unidirectional movement of the workpiece.
  • the stripe exposed in the first unidirectional sequence of exposures is narrower than the whole width of the workpiece, the unidirectional movement pattern may be repeated for additional stripes.
  • workpiece is used to denote any carrier of a surface layer upon which a pattern can be printed with a laser direct imaging system.
  • the workpiece may be a silicon substrate, a silicon wafer for a printed circuit board workpiece, or an organic substrate.
  • Workpieces may have any shape, such as circular, rectangular or polygonal, and may have any size for example in a piece or in a roll.
  • Die has a slightly different meaning in the context of embedded substrates than in patterning a wafer with dies.
  • the term die is used to denote an active or passive component or any other component associated with electronics that is fabricated into a workpiece.
  • a die may include a small block of semiconducting material, on which a given functional circuit is fabricated.
  • Example applications of the technology disclosed relate to scanning of workpieces, such as a substrate or wafer, for writing patterns and/or images.
  • Example substrates or wafers include flat panel displays, printed circuit boards (PCBs), flexible printed circuit boards (FPBs), flexible electronics, printed electronics, substrates or workpieces for packaging applications, photovoltaic panels, and the like.
  • Suitable modulators to be used in connection with the writing method of the technology disclosed include the polygon scanner of Orbotech, acousto-optic and electro optic modulators and directly modulated lasers.
  • Micromechanical Spatial Light Modulators such as Grating Light Valves (GLVs from Silicon Light Machines) and Digital Mirror Devices (DMDs from Texas Instruments) as well as analog SLMs (from Micronic Laser Systems and Lucent) also may be suitable.
  • Analog SLMs may rely on either tilting or piston driven mirrors. Either configuration may render shades of grey due to destructive interference effects.
  • Exposure with scanning laser light may be modeled as Gaussian beams with a Gaussian intensity distribution. Other optical power density distributions are naturally possible.
  • the beam, or beams in a multi-beam writer can be focused in the laser writer tool's final lens system either on the upper surface of the photoresist, or somewhere between the resist surface and the substrate surface in the downwards z-direction.
  • a Gaussian beam diverges (widens) due to its wave property and other optical effects, making the resulting lateral (x, y) as well as vertical (z) writing resolution deteriorate.
  • the depth-of- focus is determined by the numerical aperture (NA) of the lens system of the writer system, together with the refractive index of the photoresist and of the ambient medium. Furthermore, the power density or deposited/absorbed exposure dose varies with the depth in the resist.
  • NA numerical aperture
  • FIG. 1A is a one example of a cross-section of a substrate with an embedded device. This diagram is reproduced from JPCA-EBOl - 2nd Edition, Standard on Device Embedded Substrate - Terminology / Reliability /Design Guide. This example suggests the new problem of unevenness of the target radiation sensitive layer, when one observes how much thicker an embedded device (active 115 or passive 137) is than a trace on the substrate (in the base 125 area).
  • FIG IB is a simplified plan view of the embedded devices.
  • the width of a scanline 213 is illustrated as wider than a topography hump 259 resulting from an embed.
  • the panel topography is typically in the vicinity of or larger than the optical depth of focus. This depth of focus depends on optical factors such as resolution requirements and exposure wavelength. It is not possible for current exposure systems to both meet stringent resolution requirements while providing a large depth of focus. This presents a problem for embeded substrates.
  • the embedded substrate panels typically include large topography steps
  • the usable depth of focus that produces usable pattern features is defined by the optical system.
  • Writing the pattern on the substrate multiple times with different focus for each pass has the advantage that the focal depth experienced by the resist on the substrate is increased, as compared to the optical depth of focus that the optics can deliver in a single exposure. See, e.g., FIG. 4. This is helpful for substrates with large topography features, such as embedded passive or active devices.
  • Laying out the multiple focus depth writing passes in an interlaced pattern accomplishes an extended depth of focus within the standard writing scheme - in some implementations, only the alternating focus depths change during writing, not the pattern written.
  • a bonus advantage is that an averaging effect is accomplished that evens out nonuniformities across the frame of a modulator such as spatial light modulator (SLM).
  • SLM spatial light modulator
  • the interlaced writing scheme may be implemented with the assignee's LDI writing engine, without any writing speed loss by just increasing the speed of the deflecting element used for scanning the laser beam impinging on the workpiece.
  • the technology disclosed may be used by a system, or pattern generator, for exposing a radiation sensitive layer on an uneven workpiece covered with, comprising: one or more laser sources configured to generate at least first and second writing beams, one or more optics adapted to project the first and second writing beams onto the uneven workpiece with first and second focal planes of the respective writing beams that target mutually different focal plane positions on a surface of the uneven workpiece, and one or more controllers that are configured to interlace writing passes consecutively exposed by the first and second writing beams on overlapping areas of the uneven workpiece.
  • the technology disclosed may be used by a system, or pattern generator, that exposes a radiation sensitive layer on an uneven workpiece covered with, comprising: one or more laser sources that generate at least first and second writing beams, one or more optics that project the first and second writing beams onto the uneven workpiece with first and second focal planes of the respective writing beams that target higher and lower positions on a surface of the uneven workpiece, and one or more controllers that interlace writing beams (or passes) consecutively exposed by the first and second writing beams on overlapping areas of the uneven workpiece.
  • the technology disclosed can produce an extended effective depth of focus by printing multiple passes or exposures in a single pass with a slightly different focus setting for each exposure.
  • the slightly degraded resolution can, in many cases, be overcome or compensated for by reoptimizing exposure dose and pattern bias to fit the new exposure conditions.
  • the pattern bias, dose and multiple focal planes can be adjusted to produce the best resolution and depth of focus.
  • the technology disclosed may be used to produce an effective total depth of focus of a first and a second writing beam in overlapping areas that is greater than the effective depth of focus of any of the first or second writing beam alone.
  • the technology disclosed may also be used by a writing system, or pattern generator, to change the effective total depth of focus and resolution during the writing of a single pass.
  • the writing system may be configured to change the effective total depth of focus and resolution during the unidirectional sequence of exposures in a single pass.
  • the change of effective total depth of focus and resolution may be accomplished by configuring at least two of the plurality of exposure heads (or writing heads) to target mutually different focal plane positions during a portion of time of a single writing pass.
  • the technology disclosed enable high-complex single pass writing of a workpiece where at least a first portion of the surface area of a workpiece is exposed during a portion of the single pass using a high resolution mode (and with a smaller effective total depth of focus) of a writing system and at least a second portion of the surface of the same workpiece area is exposed during a portion of the same single pass using an extended effective total depth of focus mode (and with a lower resolution) of the same writing system.
  • the direct writing of the surface area of the workpiece may then be performed by using a system configured to produce unidirectional writing in one sequence of exposures where at least a portion of the surface area of the workpiece is exposed in a single pass using a plurality of exposure heads targeting mutually different focal plane positions.
  • the effective total depth of focus of the overlapping first and second writing beams in the first portion of the surface area is greater than an effective depth of focus of any of the first or the second writing beam alone.
  • the interlaced, interleaved or overlapping multipass writing schemes suggested in this application will also have an averaging effect because different parts of the scanning line will overlap.
  • the method of the technology disclosed of having interleaved, or interlaced, scanning of mulitple scans with mutually different focal depths will also average out many irregularities that can be present across the scanning widths, or scanning lines, of the different scans of the exposure system.
  • the scanning width, or scanning lines, of the exposure system may e.g. relate to or correpond to the width of one of the axes of a frame of a modulator such as spatial light modulator (SLM), e.g. the longest axis of the frame, where images of the SLM frame is continuously scanned in a scan sweep over the workpiece.
  • SLM spatial light modulator
  • FIG. 2 illustrates interleaving of writing to two or three focal planes. In the first part of the figure, odd and even numbered writing passes alternate. In the second part of the figure, three focal planes are illustrated with alternating in cycles of three overlapping exposures.
  • FIG. 3 is a simplified plan view of overlap for two pass writing with interleaved writing focused on two focal planes, using a rotating arm writer.
  • This plan view includes both interleaved writing (e.g., 320 interleaved between 310 and 330) and butting or overlap areas (e.g., 320 overlapping 340) printed along arcs using a rotating arm device.
  • interleaved writing e.g., 320 interleaved between 310 and 330
  • butting or overlap areas e.g., 320 overlapping 340
  • the physical relationship between first (320, 340) and second (310, 330) writing passes is illustrated.
  • Other types of devices will produce butting or overlapping between exposing stripes or strips focused at the same focal plane.
  • FIG. 4 illustrates increased effective depth of focus.
  • resist 417A,B overlays a substrate 427 A,B.
  • the substrate is contoured, e.g. at 415, due to embeds.
  • Focused exposure at two heights 432, 441 produces a composite depth of focus 433.
  • the composite depth of focus 433 does a better job handling a contoured substrate than 411, 415.
  • multipass printing with different focus, or focal depth, for each pass allows for high-resolution direct patterning of substrates with larger topography, e.g. substrates with embedded dies or components, than what normally can be printed can be printed within specification.
  • using multipass for direct imaging of a workpiece may itself have also been found to produce better stability and sometimes higher resolution with the resist type that is currently used with the exposure systems of today.
  • the interlaced multipass printing scheme may be implemented at no throughput cost by just increasing the rotating speed of the rotating arm or polygon(s).
  • the system includes a laser, e.g. a pulsed or continuous laser, outputting a laser beam.
  • the laser beam(s) are passed through suitable pre scan optics and directed to impinge on a scanner, such as a rotating polygon having a plurality of facets.
  • a scanner such as a rotating polygon having a plurality of facets.
  • scanning optics include an f-0 scan lens and other optical elements. As the polygon rotates, beam is scanned along a scan path in a scan direction.
  • Pattern data corresponding to a pattern to be exposed is supplied to a system controller.
  • System controller controls one or more of: the rotational speed of the polygon of scanner, the mutual translation of panel relative to the scanner and a clock governing the generation of laser pulses, if the laser source is a pulsed laser source.
  • Fig. 1 of WO 2005/029178 depicts a translator moving panel while scanner remains stationary
  • actual system design may be such that panel is kept stationary while scanner is moved.
  • each scan path is contiguous with a previous scan path, thereby generating an additive portion to each exposed region to extend the exposed region as a strip in the cross scan direction.
  • the technology disclosed of interlaced scans with different focal planes, or focus depths, to extend the total focus range, or depth of focus (DoF) may be implemented in the polygon scanner system equal or similar to the exposure system depicted in Fig. 1 of WO 2005/029178 by changing the focal depth, or focal plane, of the optical system between the scan paths once the laser beams reaches the end of a swath to be scanned, where a single optical path and a single scanner deflecting the laser beam, such as a polygon scanner, is used.
  • the technology disclosed may also be implemented in a new type of polygon scanner system having two or more parallel optical scanning systems for projecting scanning lines on a workpiece with separate optical paths and polygons where each of the plurality of optical scanning systems, or writing units, may have different focal depths and where the plurality of scan lines, or scan sweeps, are interleaved to provide an extended total focus range, i.e. depth of focus, in accordance with the technology disclosed.
  • Fig. 2 of WO 2005/029178 reproduced herein as FIG. 8, system
  • a laser 120 outputting a laser beam 122 may be a continuous wave laser beam or a pulsed laser beam, provided, for example by a Q-switch diode pumped solid state laser.
  • a pulsed laser when a pulsed laser is used, as noted below system design (spot size, scanning speed, and the speed of mutual translation) needs to be such that a spot exposed by each of the pulses mutually overlaps at least one other spot in order to ensure the exposure of a continuous strip.
  • Laser beam 122 is passed through suitable pre-scan optics 126 and directed to impinge on a scanner 128, such as a rotating polygon having a plurality of facets 130.
  • Pre-scan optics 126 typically include a plurality of lenses (not shown) which are selected to suitably shape laser beam 122 for exposing a continuous strip on panel 112.
  • scanning optics 134 include an f-0 scan lens and other optical elements (not shown).
  • beam 122 is scanned along a scan path in a nominal scan direction indicated by arrow 136.
  • panel 112 and scanner 128 are mutually relatively translated, for example by a transporter 144, in a cross scan direction indicated by arrow 146. It is noted that because of the mutual relative translation during scanning, the actual direction of scanning is slightly skewed, as indicated by arrow 148.
  • a rotator 150 establishes a mutual angular offset between panel 112 and scanner 128 during scanning.
  • rows of pattern elements in pattern 113 intersect an axis corresponding to the nominal scan direction 136.
  • the actual scan direction matches the orientation of rows of pattern elements 113 thereby facilitating the continuous exposure of regions 160.
  • pattern data 140 corresponding to a pattern to be exposed is supplied to a system controller 142.
  • System controller 142 controls one or more of: the rotational speed of the polygon of scanner 128, the mutual translation of panel 112 relative to scanner 128 and rotational orientation of panel 112 relative to scanner 128.
  • Fig. 2 of WO 2005/029178 depicts a translator 144 moving panel 112 in the direction of arrow 146 (the cross scan direction) while scanner 128 remains stationary
  • actual system design may be such that panel 112 is kept stationary while scanner 128 is moved.
  • the translator may operate to directly move panel 112, for example while panel 112 is supported on an air cushion, or it may operate to move a support table supporting panel 112.
  • FIG. 2 of WO 2005/029178 schematically shows a rotator 150 operative to rotate panel 112. It is noted that in accordance with an
  • embodiment of the rotator 150 may operate directly on panel 112, or on a support table (not show) supporting panel 112, or it may rotate the scanner 128 relative to panel 112, while panel 112 is held stationary.
  • the rotator may be operative once panel is already placed on system 128, or it may rotate panel 112 prior to placing it on system 110, for example as part of a pick and place type loader.
  • System 110 is configured so that upon the completion of a scan path, that is to say once laser beam 122 reaches the end of a swath to be scanned, the next facet of the polygon in scanner 128 is rotated into place to instantaneously return laser beam 122 to the beginning of the scan path.
  • System control 142 determines the appropriate relative angular orientation of panel 112 and scanner 128, along with the speed of translation and the speed of scanning so that each scan path corresponds to a stripe region 160 to be exposed, and to skip the region between stripes.
  • the technology disclosed of interlaced scans with different focal planes or focus depths to extend the total focus range, or depth of focus (DoF) may be implemented in the polygon scanner system equal or similar to the exposure system depicted in Fig. 2 of WO 2005/029178 by changing the focal depth, or focal plane, of the optical system between the scan paths once the laser beams reaches the end of a swath to be scanned, where a single optical path and a single scanner deflecting the laser beam, such as a polygon scanner, is used.
  • the technology disclosed may thereby provide for ane extended total focus range enabling the sustem to pattern features in the workpiece, e.g. embedded dies, that causes large topography steps that usually are smaller than the scan width of the exposure system and to average out irregularities that can be present across the scanning widths, or scanning lines, of the different scans of the exposure system.
  • the technology disclosed may also be implemented in a new type of polygon scanner system having two or more parallel optical scanning systems for projecting scanning lines on a workpiece with separate optical paths and polygons where each of the plurality of optical scanning systems, or writing units, may have different focal depths and where the plurality of scan lines, or scan sweeps, are interleaved to provide an extended total focus range, i.e. depth of focus, to be able to pattern features in the workpiece, e.g. embedded dies, that causes large topography steps that usually are smaller than the scan width of the exposure system and to average out irregularities that can be present across the scanning widths, or scanning lines, of the different scans of the exposure system.
  • an extended total focus range i.e. depth of focus
  • FIGS. 9-13 Another platform that can benefit from application of multiple focal planes to accommodate an irregular surface is seen in EP 1 426 190 Bl .
  • Figures 1, 2, 3A-B and 8A-B are reproduced in this application as FIGS. 9-13.
  • This platform uses a DMD device, such as those manufactured by Texas
  • the imaging device on the platform in EP 1 426 190 Bl is provided with a flat board- form stage 152, which adsorbs and retains a sheet-form photosensitive material 150 at a surface thereof.
  • Two guides 158 which extend in a stage movement direction, are provided at an upper 45 face of a thick board- form equipment platform 156, which is supported by four leg portions 154.
  • the stage 152 is disposed such that a longitudinal direction thereof is oriented in the stage movement direction, and is supported by the guides 158 so as to be so movable backward and forward.
  • an unillustrated driving apparatus is provided for driving the stage 152 along the guides 158.
  • an 'n'-shaped gate 160 is provided that straddles a movement path of the stage 152. Respective end portions of the 'n'-shaped gate 160 are fixed at two side faces of the equipment platform 156.
  • a scanner 162 is provided at one side, and a plurality of detection sensors 164 are provided at the other side.
  • the detection sensors 164 detect leading and trailing ends of the photosensitive material 150.
  • the scanner 162 and the detection sensors 164 are respectively mounted at the gate 160, and are fixedly disposed upward of the movement path of the stage 152.
  • the scanner 162 and detection sensors 164 are connected to an unillustrated controller which controls the scanner 162 and detection sensors 164.
  • the scanner 162 and detection sensors 164 are controlled such that, at a time of exposure by exposure heads 166, the exposure heads 166 effect exposure with predetermined timings.
  • the scanner 162 is equipped with a plurality of the exposure heads 166, which are arranged substantially in a matrix pattern with m rows and n columns (for example, three rows and five columns). In this example, in consideration of width of the photosensitive material 150, four of the exposure heads 166 are provided in the third row, and there are fourteen exposure heads 166 in total. Note that when an individual exposure head which is arranged in an m-th row and an n-th column is to be referred to, that exposure head is denoted as exposure head 166mn.
  • Exposure areas 168 are covered by the exposure heads 166 have rectangular shapes with short sides thereof aligned in a sub-scanning direction, as in FIG. 10, and are inclined at a predetermined inclination angle G, which is discussed later, with respect to the sub-scanning direction.
  • band- form exposed regions 170 are formed on the photosensitive material 150 at the respective exposure heads 166. Note that when an exposure area corresponding to an individual exposure head which is arranged in an m-th row and an n-th column is to be referred to, that exposure area is denoted as exposure area 168mn.
  • each row the respective exposure lenses, which are arranged in a line, are offset by a predetermined interval in a row arrangement direction (which interval is an integer multiple (two in the present embodiment) of the long dimension of the exposure areas), such that the band- form exposed regions 170 partially overlap with respective neighboring the exposed regions 170.
  • a portion that cannot be exposed between exposure area 168n and exposure area 168 12 of the first row can be exposed by exposure area I68 21 of the second row and exposure area I683 1 of the third row.
  • a digital micromirror device (DMD) 50 is provided to serve as a spatial light modulation element for modulating an incident light beam at each of pixels in accordance with image data.
  • the DMD 50 is connected with an unillustrated controller, which is provided with a data processing section and a mirror driving control section.
  • the controller On the basis of inputted image data, driving signals are generated for driving control of each micromirror in a region of the DMD 50 at the corresponding exposure head 166 which region is to be controlled.
  • the controller includes an image data conversion function for making resolution in a row direction higher than in an original image.
  • various processes and corrections of the image data can be implemented with higher accuracy. For example, in a case in which a number of pixels employed is altered in accordance with an inclination angle of the DMD 50 and a row pitch is corrected, as described later, correction with higher accuracy is enabled.
  • This conversion of the image data enables conversions which include
  • the mirror driving control section controls the angle of a reflection surface of each micromirror of the DMD 50 at the corresponding exposure head 166 on the basis of the control signals generated at the image data processing section. Control of the angles of the reflection surfaces is described later.
  • a fiber array light source 66, a lens system 67 and a mirror 69 are disposed in this order at a light incidence side of the DMD 50.
  • the fiber array light source 66 is equipped with a laser emission portion at which emission end portions (light emission points) of optical so fibers are arranged in a row along a direction corresponding to the direction of the long sides of the exposure area 168.
  • the lens system 67 corrects laser light that is emitted from the fiber array light source 66, and focuses the light on the DMD 50.
  • the mirror 69 reflects the laser light that has been transmitted through the lens system 67 toward the DMD 50.
  • a lens system is shown and discussed in EP 1 426 190 Bl .
  • the lenses system would be configured to rapidly change the effective focal plane.
  • the focal plane depth from the lens might change between exposures produced from the modulated DMD device.
  • FIGS. 13A-B show the exposure area 168, which is a two-dimensional image provided by one of the DMDs 50.
  • the exposure area 168 is divided into respective pixels of M columns by L rows, corresponding to exposure beams 53.
  • the DMD 50 is inclinedly disposed such that this exposure area 168 is angled at the predetermined inclination angle with respect to the sub-scanning direction.
  • a row pitch of scanning paths (scanning lines) of the exposure beams 53 from the respective micromirrors becomes smaller (approximately 0.27 ⁇ in the present embodiment), and is narrower than a row pitch of scanning lines in a case in which the exposure area 168 is not inclined and than a resolution of the image data itself (2 ⁇ ). is Thus, resolution can be improved.
  • the number of pixels employed in the row direction is altered for imaging (image recording) in accordance with the actual inclination angle ⁇ ' by an unillustrated controller, and thus variation of the pitch P is suppressed to a certain so range.
  • the technology disclosed of interlaced scans with different focal planes or focus depths to extend the total focus range or depth of focus (DoF) may be implemented in the DMD system equal or similar to the exposure system depicted in EP 1 426 190 Bl by changing the focal depth, or focal plane, of the optical system between the scan sweeps once the laser beams reaches the end of a swath to be scanned.
  • the technology disclosed may thereby provide for an extended total focus range enabling the system to pattern features in the workpiece, e.g. embedded dies, that causes large topography steps that usually are smaller than the scan width of the exposure system and to average out irregularities that can be present across the scanning widths, or scanning lines, of the different scans of the exposure system.
  • the technology disclosed includes exposing to form spots onto workpiece using binary micromirrors of a DMD-based writer.
  • the writing head (with the source array and/or the projection optics), or the substrate, or both can be physically moving to create a relative motion.
  • the image of the source array can be scanned by optical means, e.g., by a galvanometer or polygon.
  • the relative motion of the substrate can be continuous and frozen by a short exposure time.
  • the relative motion can be stepped.
  • exposing beams can track motion of the substrate over a finite distance. In any of these cases, the exposure of spots can be simultaneous or distributed in time, in which case the effect of timing and movement on the placement of the spots on the substrate has to be accounted for.
  • the light source may be continuous or quasi-continuous, e.g., a high frequency pulsed laser that emits pulses close enough to be considered continuous.
  • the stage is scanned with a low enough speed to let a modulator change state once per pixel in the grid on the workpiece.
  • IMS Nano fabrication US 7,084,411 B2 and others
  • additional rows are added to provide redundancy for bad elements in the array. More elements are added in the same column and small-range scanning is used to let an element write only some pixels in the column on the workpiece to circumvent the speed limitation imposed by the highest practical switching speed of the modulator elements, here blankers in a massively parallel particle beam writer.
  • Gilad Almogy of Applied Materials, has used a simple 2D interlace scheme in order to put every pixel non-adjacent to the last one, thereby avoiding the effect of heating of adjacent pixels, see e.g. (US 6,897,941).
  • Ball Semiconductors gave the mathematics of the slanted scheme in 2004 (US2004/0004699), and ASML discussed using hexagonal grids in US 7,230,677.
  • a complex 2D interlace platform that can benefit from the use of multiple focal planes scans sparse 2D point arrays or grids across the surface of a workpiece, e.g., multiple optical, electron or particle beams modulated in parallel, as illustrated in US Pat. Pub. US 2010/012743 (May 27, 2010), entitled "Image Reading And Writing Using a Complex Two -Dimensional Interlace Scheme", which has issued as US Pat. No.
  • FIGS 14A-C The effect of writing with a sparse grid is partially illustrated by FIGS 14A-C, which are taken from the ⁇ 20 patent.
  • the scanning and repeated writing creates a dense pixel or spot grid on the workpiece.
  • the grid may be created by various arrays: arrays of light sources, e.g., laser or LED arrays, by lenslet arrays where each lenslet has its own modulator, by aperture plates for particle beams, or arrays of near- field emitters or mechanical probes.
  • the point grid may be created by a sparse point matrix illumination and/or a detector array where each detector element sees only one isolated spot. The idea behind the use of large arrays is to improve throughput.
  • the complex two dimensional interlace application discloses methods to scan workpieces with large arrays while preserving the scaling of throughput proportional to array size, even for very large arrays, in fact, essentially without limits.
  • Advantages in some implementations of the disclosed methods include greater flexibility in the choice of array size, workpiece grid, and stage parameters, and a dissolution of hardware signatures in the image, leading to a more ideal image in certain respects than with prior art. More details of this approach are given in US Pat. Pub. US 2010/012743 (May 27, 2010), entitled “Image Reading And Writing Using a Complex Two-Dimensional Interlace Scheme", which has issued as US Pat. No. 8,351,020.
  • FIGS. 14A-C illustrate how varying parameters for a translation vector can produce a variety of patterns in which successive exposure spots contribute to the overall, cumulative exposure of an area.
  • the writing of spots in the unit cells can be changed by varying the interlace parameters.
  • the same parameters can be chose to cause the points to be written a variable number of times, as explained in the ⁇ 20 patent.
  • the technology disclosed which uses interlaced scans with different focal planes, or focus depths, can be applied to complex interleaving, particularly when spots within an area or cell are exposed two or more times.
  • the complex interlacing pattern uses a repeating pattern.
  • the focal plane can be adjusted at the end of a repeat cycle. Then, overstriking exposures will be at a different focal depth than the preceding exposures.
  • Many complex interlacing schemes, with analysis, could be divided into exposing subcycles that are shorter than a full repeat cycle. The exposure focus could be changed between subcycles.
  • FIGS. 6A-B Yet another platform is illustrated in FIGS. 6A-B.
  • the technology disclosed which uses interlaced scans with different focal planes, or focus depths, to extend the total focus range, or depth of focus (DoF,) may be implemented in a DMD- based writer using one or a plurality of DMDs, e.g. slanted DMDs, by changing the focal depth, or focal plane, of the optical system between the scan paths once the laser beams reaches the end of a swath to be scanned.
  • adjoining optical (writer) systems associated with adjoining (slanted) DMDs may have different focal planes, or depths, and the scans from adjoining DMDs are interlaced to extend the total focus range (depth of focus) to be able to pattern features in the workpiece, e.g. embedded dies, that causes large topography steps that usually are smaller than the scan width of the exposure system and to average out other irregularities that can be present across the scan widths, or scanning lines, of the different scans of the exposure system.
  • the technology disclosed may include an interlaced direct writing onto a substrate focused on two or more focal planes at different heights.
  • interlaced we mean that exposing radiation focused at the first focal plane alternates with exposing radiation focused at the second focal plane in overlapping exposures of the workpiece. For instance, with rotating arms that expose overlapping strips of the substrate, one arm could be focused at the first focal plane and the next arm focused at the second focal plane.
  • the first focal plane could be at or near the base of an embedded device and the second focal plane at or near the top of the embedded device.
  • a contoured layer of radiation sensitive material such as resist
  • the difference in height between the first and second focal planes could exceed the effective depth of focus of a patterning beam. This difference in height could be great enough that choosing an intermediate, compromise focal plane would sacrifice precision in patterning at the first or second focal plane or in exposing both portions of the resist overlaying the lower substrate and portions overlaying the higher embedded device.
  • the lower level will be a trench prepared for formation of an embedded device and the higher level will be the general field of the substrate.
  • Interlaced direct writing avoids issues of alignment and resists activation time associated with writing a first pass over all or substantial parts of the substrate followed by writing second and sometimes subsequent passes over the substrate. Writing is simplified. With interlaced writing, exposing an area with radiation focused at a first focal plane is completed at about the same time as exposing the same area with radiation focused at the second focal plane.
  • Direct writing can involve a swept beam or other exposing mechanism or overlapping stamps.
  • machines that use a swept beam are assignee's Laser Direct Imaging (LDI) writer with rotating arms; Orbotech's polygon scanner system; and Fuji's and Hitachi's multi-parallel-DMD writing systems.
  • LPI Laser Direct Imaging
  • the Assignee of this application has describe an alternative LDI configuration that would use overlapping stamps, much as the Assignee's commercially available SigmaTM systems use overlapping stamps.
  • the interlaced writing fields overlap by more than fifty percent.
  • the first fifty percent of overlap accommodates the two focal planes.
  • An additional margin of overlap provides a butting or overlap area for blending writing in one stripe or strip with writing in a successive stripe or strip.
  • modulators can readily be employed with the technology disclosed.
  • the modulators can be any of the modulators identified above or depicted in the figures, including DMDs, SLMs and AOMs. With multiple modulators, modulated beams with different focal depths or focused on different focal planes can readily be employed.
  • multiple beams can be focused through different optical elements to produce different focal depths. Even beams that share parts of a common optical path can enter the path with different optical characteristics that result in different optical properties. Alternatively, different beams can be relayed to a workpiece along different optical paths.
  • FIGS. 5 and 6A-B illustrate implementations of multiple modulators, such as modulators having 8192 elements each. While four modulators are illustrated, six or eight modulators could be used. Or, any number of modulars from two to 32 modulators, inclusive, could be used.
  • FIG. 5, to the left 510 depicts use of multiple modulators for single exposure in a single stripe or strip of printing. In this configuration, interlaced multi- focus writing would be accomplished by overlapping stripes. Multiple focus depths could be implemented by focusing horizontally adjacent modulators or pairs of horizontally adjacent modulators on different focal planes. With four modulators and different focal planes for adjacent modulators, interleaved passes could overlap by about 25 or 75 percent, so that consecutive passes would focus on the different focal planes.
  • interleaved passes could overlap by about 50 percent.
  • all of the modulators might be focused to the same focal depth and the focal depth might change between interleaved writing passes. The amount of overlap would depend on the number of writing passes.
  • FIG. 5, to the right 520 depicts use of multiple modulators for double exposure in a singe stripe or strip of printing.
  • Various configurations of focus and overlap can be used, as described for the left hand configuration. For instance, horizontally adjacent modulators would be focused on focal planes at different focal depths. Then, writing of a single strip or stripe would create an exposure at multiple focal depths.
  • FIG. 6A depicts multiple modulators tilted at different angles to the direction in which a stripe or strip is exposed. In this illustration, the different angles are about +/- 45 degrees. Angled orientation reduces the difference in exposure bias along X and Y axes of the resulting pattern. Orientations other than 45 degrees, such as any angles from 30 to 60 degrees could be used.
  • FIG. 6B illustrates how a rotating writer can be used to expose a workpiece on both right to left and left to right portions of a full rotation. In this configuration, each pass of a writing beam presents an opportunity to change the focal plane depth.
  • the problem of writing on an uneven workpiece coated with a radiation sensitive layer is solved by exposing the uneven workpiece in interlaced writing passes using at least first and second writing beams, wherein the first and second writing beams have first and second focal planes that target higher and lower surfaces of the uneven workpiece.
  • a method that includes writing on an uneven workpiece covered with a radiation sensitive layer. This method includes exposing the uneven workpiece in interlaced writing passes using at least first and second writing beams.
  • the first and second writing beams can have first and second focal planes that target higher and lower surfaces of the uneven workpiece. For instance, one focal plane can correspond to a field of the uneven workpiece and the other focal plane can correspond to a trench that is lower than the field or an embedded device that is higher than the field.
  • This method and other implementations of the technology disclosed can each optionally include one or more of the following features and/or features described in connection with additional methods disclosed.
  • the combinations of features disclosed in this application are not individually enumerated and are not repeated with each base set of features. The reader will understand how features identified in this section can readily be combined with sets of base features identified as implementations.
  • the method can further include interlacing the writing passes using writing heads mounted on separate arms of a rotating arm-writing platform.
  • implementations include inducing the different focal planes of the first and second writing beams using optical components positioned in separate optical paths traversed by the writing beams.
  • Other implementations include inducing the different focal planes of the first and second writing beams using optical components positioned in a common optical path traversed by the writing beams.
  • a reflective adaptive optical device can be positioned in the common optical path to control heights of the focal planes.
  • the method can include using separate modulators to modulate the first and second writing beams. Or, using a single modulator to modulate the first and second writing beams. When using a single modulator, the duty cycle of the modulator can alternate among modulations for the different focal planes.
  • a difference in height between the higher and the lower surfaces is greater than the effective focal depth of the first and second writing beams.
  • assignee's LDITM platform has: wavelengths of 355 nm or 405 nm (more generally in the range of 300 to 450 nm); resolution of lOmicrometer (in the range of 5 to 12 micrometers); depth of focus for one writing head (exposure) of about 80 micrometers (in the range of 50 to 150 micrometers).
  • an expanded total depth of focus can be achieved by using multiple focal planes of about 150 micrometers (in the range of 100 to 300 micrometers depending on the DoF for one writing head and the number of writing heads with different focus levels used.)
  • the thickness of a thick die or component, placed (e.g. by a pick- and-place tool) in an embedded structure patterned by an LDI tool may be 150
  • the first and second writing beams are laser beams at different frequencies. These implementations can further include separately modulating the first and second writing beams; and directing the first and second writing beams through an optical train that produces different focal planes due to the different frequencies. Some implementations using writing beams at different frequencies use a single laser source generating two frequencies of laser radiation; and separate the frequencies of radiation to form the first and second writing beams.
  • the interlaced writing passes overlap an instance of the first writing beam with a consecutive instance of the second writing beam by at least 25 percent of a writing width of the first writing beam.
  • the first and second writing beams are swept across the uneven workpiece. In other implementations, the first and second writing beams are flashed onto the uneven workpiece.
  • a system that exposes a radiation sensitive layer on an uneven workpiece.
  • This system includes one or more laser sources that generate at least first and second writing beams, one or more optics that project the first and second writing beams onto the uneven workpiece with first and second focal planes of the respective writing beams that target higher and lower surfaces of the uneven workpiece, and one or more controllers that interlace writing passes consecutively exposed by the first and second writing beams on overlapping areas of the uneven workpiece.
  • the system further includes a rotating arm- writing platform with writing heads mounted on separate arms, wherein the first and second writing beams are projected along alternating writing arms.
  • Some implementations include first and second optical paths respectively traversed by the first and second writing beams and these first and second optical paths induce the first and second focal planes.
  • Other implementations include a common optical path for the first and second writing beams and at least one optical component positioned on the common optical path that induces the first and second focal planes. This optical component can be a reflective adaptive optical device.
  • Some system implementations further include two or more separate modulators that modulate the first and second writing beams. Others include using one or more common modulators that modulate the first and second writing beams.
  • a difference in height between the higher and the lower surfaces is greater than an effective focal depth of the first and second writing beams.
  • first and second writing beams are laser beams at different frequencies.
  • Those implementations can further include two or more modulators that modulate the first and second writing beams; and a common optical train traversed by the first and second writing beams that produces different focal planes due to the different frequencies.
  • Some systems use a single laser source that generates two frequencies of laser radiation; and a beam separator that separates the frequencies of radiation into the first and second writing beams.
  • Some systems are configured such that the interlaced writing passes overlap an instance of the first writing beam with a consecutive instance of the second writing beam by at least 25 percent of a writing width of the first writing beam. Others overlap by at least 50 percent.
  • the first and second writing beams are swept across the uneven workpiece. In others, the first and second writing beams are flashed onto the uneven workpiece.
  • implementations may include a non-transitory computer readable storage medium storing instructions executable by a processor to perform a method as described above.
  • implementations may include a system including memory and one or more processors operable to execute instructions, stored in the memory, to perform a method as described above.
  • a plurality of dies in the form of small blocks of semiconducting material each having a functional electronic circuit are distributed on a printed circuit board workpiece, e.g. in the form of a carrier silicon wafer.
  • the dies are then covered with further layers of material to form the integrated circuit in a series of manufacturing steps.
  • patterns are generated on selected layers of the workpiece in one or a plurality of patterning steps.
  • Patterns are generated on a layer of a workpiece, e.g. for the purpose of forming an electric circuit pattern generated in order to couple connection points or contact pads of components such as dies in a desired electric circuit.
  • the expression die is herein used as common expression for any electronic component such as a passive component, an active component, or any other component associated with electronics.
  • Such a pattern is generated in a writing or printing process in which an image of a circuit pattern is projected, e.g. written or printed on a surface layer covering a conductive layer on the workpiece.
  • Prior art patterning systems require workpieces with dies placed very accurately on the workpiece to be able to align patterns to the dies. This is due to the fact that prior art patterning systems use steppers and aligners that have limited capabilities to perform alignment to individual dies without significantly slowing down the patterning process with the consequence that current requirements on the takt time that sets the pace for the process of manufacturing products comprising patterned layers cannot be met.
  • the dies are accurately placed on the workpiece, further including the fastening of the dies by eutectic bonding or glue onto the workpiece, which is a very time consuming process.
  • the fan out process is an example of a process that includes arranging conductive paths for connecting to connection points of dies on a workpiece.
  • FIG 1 shows schematically an example of embedded dies in a prior art process description of a fan-out wafer level packaging process. This process is further described in the detailed description below.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

La présente invention concerne la réception de substrats intégrés durant une écriture directe sur une carte de circuits imprimés et d'autres problèmes de modélisation qui bénéficient d'une profondeur de foyer étendue. En particulier, la présente invention concerne une écriture directe multi-foyer sur une pièce de travail par le déplacement continu ou pas-à-pas de la pièce de travail durant la séquence d'expositions ayant différents plans focaux. Selon une mise en œuvre, un dispositif d'écriture directe tournant multi-bras est configuré pour écriture entrelacée focalisée sur au moins deux plans focaux qui correspondent généralement à au moins deux hauteurs de surface d'une couche sensible vis-à-vis d'un rayonnement qui recouvre la pièce de travail irrégulière. Des bras alternés peuvent produire une écriture entrelacée sur les au moins deux plans focaux.
PCT/EP2013/067703 2012-08-27 2013-08-27 Écriture sans masque dans différents plans focaux WO2014033118A1 (fr)

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CN111694222A (zh) * 2019-03-12 2020-09-22 京东方科技集团股份有限公司 曝光机的调整方法及装置

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US20030210383A1 (en) * 2002-05-10 2003-11-13 Bjorklund Gary C. Maskless conformable lithography
EP1653280A1 (fr) * 2003-08-06 2006-05-03 Sharp Kabushiki Kaisha Systeme et procede d'exposition de motif
WO2007013676A1 (fr) * 2005-07-28 2007-02-01 Fujifilm Corporation Tête et appareil d'exposition
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US20030210383A1 (en) * 2002-05-10 2003-11-13 Bjorklund Gary C. Maskless conformable lithography
EP1653280A1 (fr) * 2003-08-06 2006-05-03 Sharp Kabushiki Kaisha Systeme et procede d'exposition de motif
WO2007013676A1 (fr) * 2005-07-28 2007-02-01 Fujifilm Corporation Tête et appareil d'exposition
WO2010036524A1 (fr) * 2008-09-23 2010-04-01 Pinebrook Imaging Sytems Corporation Système graveur pour imagerie optique
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CN111694222B (zh) * 2019-03-12 2023-04-07 京东方科技集团股份有限公司 曝光机的调整方法及装置

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