WO2014032550A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2014032550A1
WO2014032550A1 PCT/CN2013/082205 CN2013082205W WO2014032550A1 WO 2014032550 A1 WO2014032550 A1 WO 2014032550A1 CN 2013082205 W CN2013082205 W CN 2013082205W WO 2014032550 A1 WO2014032550 A1 WO 2014032550A1
Authority
WO
WIPO (PCT)
Prior art keywords
speaker unit
sound
speaker
acoustic cavity
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2013/082205
Other languages
English (en)
French (fr)
Inventor
王建建
张志兵
范双双
邵明辉
牟宗君
许超
陈钢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US14/422,632 priority Critical patent/US9241207B2/en
Priority to KR1020157004698A priority patent/KR101657917B1/ko
Publication of WO2014032550A1 publication Critical patent/WO2014032550A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/02—Spatial or constructional arrangements of loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2819—Enclosures comprising vibrating or resonating arrangements of the bass reflex type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/345—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for loudspeakers
    • H04R1/347—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for loudspeakers for obtaining a phase-shift between the front and back acoustic wave
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H04R1/403—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers loud-speakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2205/00—Details of stereophonic arrangements covered by H04R5/00 but not provided for in any of its subgroups
    • H04R2205/022—Plurality of transducers corresponding to a plurality of sound channels in each earpiece of headphones or in a single enclosure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2205/00—Details of stereophonic arrangements covered by H04R5/00 but not provided for in any of its subgroups
    • H04R2205/024—Positioning of loudspeaker enclosures for spatial sound reproduction

Definitions

  • the present invention relates to the field of electroacoustics, and in particular to a speaker module. Background technique
  • the speaker module includes a peripheral frame and a speaker unit housed in the peripheral frame.
  • the conventional speaker module includes only one speaker unit.
  • the peripheral module cannot be fully utilized.
  • the internal space of the frame guarantees its acoustic performance. Therefore, it is necessary to provide a technical solution to solve the above problems to improve the overall performance of the speaker module. Summary of the invention
  • the present invention provides a speaker module that can make full use of the internal space of the speaker module and improve the sound quality of the product and improve its acoustic performance.
  • the present invention provides a speaker module including a peripheral frame and a speaker unit housed inside the peripheral frame, and the peripheral frame is provided with an acoustic hole communicating with the outside, the speaker unit Forming a front acoustic cavity in communication with the sounding hole, forming a rear acoustic cavity between a side of the speaker unit facing away from the front acoustic cavity and the peripheral frame; wherein the speaker single More than one body, the rear acoustic cavity is divided into a plurality of sub-sound sound chambers of the same number as the speaker unit, each of the speaker units corresponding to one of the sub-sub-sound chambers, and the speaker unit and the corresponding one The sub-sound cavity is connected.
  • the speaker unit is two, including a first speaker unit and a second speaker unit disposed side by side; a rear wall is disposed in the rear sound chamber to divide the rear sound chamber into two a separate sub-sound cavity, gp, a first rear sound chamber and a second rear sound chamber, wherein the first The sounder unit is in communication with the first rear sound chamber, and the second speaker unit is in communication with the second rear sound chamber.
  • the peripheral frame includes a first housing and a second housing, and a space between the first housing, the second housing and the speaker unit forms a rear acoustic cavity; the second housing a first retaining wall as a first portion of the retaining wall, the first retaining wall partitioning an inner space of the second housing into a first rear cavity corresponding to the first speaker unit and the second speaker unit a chamber and a second rear chamber.
  • the first housing is provided with a second blocking wall corresponding to the first blocking wall as a second portion of the blocking wall, the second blocking wall and the second blocking wall
  • the first retaining wall is joined by ultrasonic welding.
  • the first speaker unit and the second speaker unit each include a vibration system and a magnetic circuit system
  • the vibration system includes a diaphragm
  • the front acoustic chamber is located at the diaphragm away from the One side of the magnetic circuit system
  • the rear acoustic cavity is located in the vicinity of the diaphragm adjacent to the magnetic circuit system.
  • the front acoustic cavity is provided with a partition wall, and the partition wall will be the front The sound chamber is divided into an independent first front sound chamber and a second front sound chamber; the first front sound chamber is disposed corresponding to the first speaker unit, and the second front sound chamber is disposed corresponding to the second speaker unit.
  • the speaker module includes an sound hole disposed at a side, the sound hole includes a first sound hole communicating with the first front sound cavity and communicating with the second front sound cavity The second sound hole.
  • the first speaker unit is the same as the second speaker unit, and includes a vibration system and a magnetic circuit system having the same structure.
  • the first front acoustic cavity and the second front acoustic cavity have the same size.
  • the speaker module used in the invention has a plurality of speaker units installed therein, and the rear sound chamber corresponding to each speaker unit is separately designed to facilitate adjusting the acoustic performance of the speaker module, and can improve the sound generation of the speaker module. The stereo effect enhances the acoustic performance of the product.
  • 1 is a perspective exploded structural view of a speaker module of the present invention
  • 2 is a schematic perspective view of a speaker module of the present invention
  • FIG. 3 is a schematic structural view of the speaker module of the present invention with the insert removed;
  • FIG. 4 is a schematic structural view of a second housing of the speaker module of the present invention.
  • FIG. 5 is a schematic view showing the assembled structure of the first casing and the second casing of the speaker module of the present invention. detailed description
  • the speaker module includes a peripheral frame and a speaker unit housed inside the peripheral frame, wherein the speaker unit includes a vibration system and a magnetic circuit system.
  • the present invention includes two speaker units arranged side by side: a first speaker unit and a second speaker unit, the first speaker unit including a vibration system 21 and a magnetic circuit system 31, the second speaker unit including a vibration system 22 and a magnetic body
  • the road system 32; the vibration system 21 and the vibration system 22 each include a diaphragm and a voice coil coupled to the lower side of the diaphragm (the angle shown in FIG. 1 does not show the voice coil), and the vibration system includes a washer, a magnet and a basin which are sequentially combined. frame.
  • This speaker module with two speaker units can make full use of its internal space.
  • the first speaker unit and the second speaker unit are identical structures
  • the vibration system and the magnetic circuit system are identical in structure
  • the structures are the same in size, thereby improving the acoustic performance of the speaker module.
  • the peripheral frame of the present invention includes a first housing 11, a second housing 12 and an insert 13, wherein the first housing 11 and the second housing 12 are provided with a structure for housing a fixed vibration system and a magnetic circuit system, as shown in FIG. Shown.
  • the insert 13 includes an intermediate metal plate and a plastic frame disposed around the metal plate.
  • the peripheral frame is provided with a metal plate structure designed to reduce the thickness of the speaker module to a desired strength.
  • a metal heat sink 41 and a heat sink 42 combined with the second housing 12 and corresponding to the bottom of the magnetic circuit system are also included, and the two heat sink structures are identical to the first speaker unit and the second speaker unit.
  • the heat dissipation plate 41 and the heat dissipation plate 42 of the magnetic conductive structure are used, and the heat dissipation plate is designed to achieve the heat dissipation effect while fully utilizing the internal space of the speaker module, and can prevent magnetic saturation.
  • the present invention is a speaker module with a side sounding structure, including a first sound hole 51 and a second sound hole 52, wherein the first sound hole 51 and the second sound hole 52 are provided. Separate sounding structures that are set for the interval.
  • a front acoustic cavity is formed between the speaker unit and the peripheral frame. The space between the diaphragm of the speaker unit of the embodiment and the first housing 11 and the insert 13 forms a front acoustic cavity, usually the front sound.
  • the cavity is a channel connecting the speaker unit and the outside, and the sound generated by the speaker unit is transmitted to the outside through the front sound cavity. As shown in FIG.
  • a partition wall 111 is disposed on the first housing 11 at a position corresponding to the middle of the first vibration system 21 and the second vibration system 22.
  • the partition wall 111 can divide the front sound chamber into independent first front sound chambers and The second front acoustic cavity: a first front acoustic cavity corresponding to the first speaker unit and a second front acoustic cavity corresponding to the second speaker unit.
  • first sound hole 51 communicates with the first front sound cavity
  • second sound hole 52 communicates with the second front sound cavity to separate the sounds emitted by the first speaker unit and the second speaker unit, thereby preventing two The sound waves of the speaker unit interfere.
  • the first front sound chamber and the second front sound chamber are the same size or nearly the same, which ensures uniformity of sound emission of the two speaker units.
  • first sound hole 51 and the second sound hole 52 are further provided with a support column 53.
  • the support column 53 can strengthen the strength of the corresponding sound hole on the peripheral frame to improve the stability of the product.
  • a rear acoustic cavity is formed between the first housing 11, the second housing 12 and the speaker unit, and the rear acoustic cavity is a space formed by the diaphragm of the speaker unit close to the side of the voice coil (ie, the side of the diaphragm facing away from the front acoustic cavity)
  • the rear acoustic cavity is a closed structure, and the space on the rear side of the diaphragm (the diaphragm is close to the voice coil side) is sealed.
  • the rear acoustic cavity can be divided into a plurality of sub-posterior acoustic cavities. As shown in FIG. 1, FIG. 4 and FIG.
  • the second housing 12 is provided with two sub-sound chambers corresponding to the first speaker unit and the second speaker unit, gp, the first rear chamber 121 and the first
  • the second rear chamber 122, the first rear chamber 121 and the second rear chamber 122 are spaced apart by the first retaining wall 123, and the first retaining wall 123 and the second housing 12 are of unitary structure.
  • the first rear chamber 121 and the second rear chamber 122 are the same or approximately the same size to ensure product consistency.
  • a second blocking wall 112 corresponding to the first blocking wall 123 is disposed on a side of the first housing 11 facing the second housing 12, and the first blocking wall 123 and the second blocking wall 112 are assembled after the assembly is completed.
  • the first rear chamber 121 and the second rear chamber 122 are completely separated by ultrasonic welding to form a sealed first rear sound chamber and the first connecting the first speaker unit and the second speaker unit respectively. After the second sound cavity.
  • the speaker module is equipped with two speaker units. Compared with the structure in which one speaker unit is mounted, the performance of the speaker module with two speaker units is easier to adjust, especially for such a narrow speaker module.
  • the group structure the two speaker units can be set to avoid the speaker unit is too narrow to prevent polarization and other defects.
  • each speaker unit corresponds to a separate rear sound cavity, avoiding interference between the two speaker units, facilitating adjustment of the acoustic characteristics of the speaker module, and improving the stereoscopic effect of the sound of the speaker module, thereby improving the acoustics of the product. performance.
  • the number of speaker units is not limited to two, and may be two or more knots.
  • the rear sound chamber is divided into a plurality of sub-sound chambers of the same number as the single speaker unit, and each speaker unit corresponds to an independent sub-sound chamber. This improvement in the number of the speaker unit and the sub-aft chamber is also improved. Within the scope of protection of the invention.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Description

扬声器模组
技术领域
本发明涉及电声领域， 具体涉及一种扬声器模组。 背景技术
当前便携式电子产品得到广泛的应用， 作为重要声学器件的扬声器也被 大量应用。 现有技术中为了便于组装及保证发声装置的声学性能， 多采用扬 声器模组结构。
扬声器模组包括外围框架和收容于外围框架中的扬声器单体， 传统的扬 声器模组仅包括一个扬声器单体， 对于结构复杂而且对声音效果要求较高的 扬声器模组， 往往不能即充分利用外围框架的内部空间又保证其声学性能。 因此， 有必要提供一种解决上述问题的技术方案， 以提高扬声器模组的整体 性能。 发明内容
为了解决上述技术问题， 本发明提供一种扬声器模组， 可以充分利用扬 声器模组的内部空间， 并且提高产品的音效， 提高其声学性能。
为了实现上述目的， 本发明提供一种扬声器模组， 包括外围框架和收容 于所述外围框架内部的扬声器单体， 所述外围框架上设有与外界连通的出声 孔， 所述扬声器单体与所述外围框架之间形成与所述出声孔相连通的前声腔， 所述扬声器单体背离所述前声腔的一侧与所述外围框架之间形成后声腔； 其 中， 所述扬声器单体为一个以上， 所述后声腔分隔成数量与所述扬声器单体 相同的多个子后声腔， 每个所述扬声器单体对应一个所述子后声腔， 所述扬 声器单体与对应的所述子后声腔相连通。
此外， 优选的方案是， 所述扬声器单体为两个， 包括并排设置的第一扬 声器单体和第二扬声器单体； 所述后声腔中设置有挡壁以将所述后声腔分隔 成两个独立的的子后声腔， gp， 第一后声腔和第二后声腔， 其中所述第一扬 声器单体与所述第一后声腔相连通， 所述第二扬声器单体与所述第二后声腔 相连通。
此外， 优选的方案是， 所述外围框架包括第一壳体和第二壳体， 所述第 一壳体、 第二壳体和扬声器单体之间的空间形成后声腔； 所述第二壳体上设 有作为所述挡壁的第一部分的第一挡壁， 第一挡壁将第二壳体的内部空间分 隔成对应于第一扬声器单体和第二扬声器单体的第一后腔室和第二后腔室。
此外， 优选的方案是， 所述第一壳体上设有对应于所述第一挡壁设置的 作为所述挡壁的第二部分的第二挡壁， 所述第二挡壁与所述第一挡壁通过超 声波焊接结合。
此外， 优选的方案是， 所述第一扬声器单体和所述第二扬声器单体均包 括振动系统和磁路系统， 所述振动系统包括振膜， 所述前声腔位于所述振膜 远离所述磁路系统的一侧， 所述后声腔位于所述振膜靠近所述磁路系统的一 此外， 优选的方案是， 所述前声腔中设有间隔壁， 所述间隔壁将所述前 声腔分隔成独立的第一前声腔和第二前声腔； 所述第一前声腔对应所述第一 扬声器单体设置， 所述第二前声腔对应所述第二扬声器单体设置。
此外， 优选的方案是， 所述扬声器模组包括设置于侧面的出声孔， 所述 出声孔包括与所述第一前声腔连通的第一出声孔和与所述第二前声腔连通的 第二出声孔。
此外， 优选的方案是， 所述第一扬声器单体与所述第二扬声器单体相同， 包括结构相同的振动系统和磁路系统。
此外， 优选的方案是， 所述第一前声腔与所述第二前声腔的大小相同。 本发明采用的这种扬声器模组中安装有多个扬声器单体， 并且对应每个 扬声器单体的后声腔为分开设计的结构， 便于调节扬声器模组的声学性能， 可以提高扬声器模组发声的立体效果， 从而提高了产品的声学性能。 附图说明
通过下面结合附图对本实施例进行描述， 本发明的上述特征和技术优点 将会变得更加清楚和容易理解。
图 1 是本发明扬声器模组的立体分解结构示意图； 图 2是本发明扬声器模组的立体结构示意图；
图 3是本发明扬声器模组去掉嵌件后的结构示意图；
图 4是本发明扬声器模组第二壳体的结构示意图；
图 5是本发明扬声器模组第一壳体和第二壳体的组装结构示意图。 具体实施方式
下面结合附图和具体实施例对本发明做进一步详细的描述。
如图 1所示， 扬声器模组包括外围框架和收容于外围框架内部的扬声器 单体， 其中扬声器单体包括振动系统和磁路系统。 本发明包括并排设置的两 个扬声器单体： 第一扬声器单体和第二扬声器单体， 第一扬声器单体包括振 动系统 21和磁路系统 31， 第二扬声器单体包括振动系统 22和磁路系统 32; 振动系统 21和振动系统 22均包括振膜和结合于振膜下侧的音圈 （图 1所示 的角度没有显示音圈）， 振动系统包括依次结合的华司、 磁铁和盆架。
这种采用两个扬声器单体的扬声器模组可以充分利用其内部空间。 优选 的， 第一扬声器单体和第二扬声器单体为完全相同的结构， 振动系统和磁路 系统的结构均相同， 并且各结构的尺寸大小相同， 从而可以提高扬声器模组 的声学性能。
本发明的外围框架包括第一壳体 11、 第二壳体 12和嵌件 13， 其中第一 壳体 11和第二壳体 12设有收容固定振动系统和磁路系统的结构， 如图 1所 示。 嵌件 13包括中间的金属板和环绕金属板设置的塑料框架， 这种外围框架 设置金属板结构的设计可以使扬声器模组在达到所需强度的情况下减小扬声 器模组的厚度。 此外， 还包括与所述第二壳体 12结合的并且对应磁路系统底 部设计的金属散热板 41和散热板 42，两个散热板结构相同对应第一扬声器单 体和第二扬声器单体设置， 优选的采用导磁结构的散热板 41和散热板 42， 这 种散热板的设计可以在充分利用扬声器模组内部空间的情况下达到散热的效 果， 并且可以防止磁饱和。
如图 2和图 3所示， 本发明为侧面出声结构的扬声器模组， 包括第一出 声孔 51和第二出声孔 52，其中第一出声孔 51和第二出声孔 52为间隔设置的 分别独立出声的结构。 扬声器单体与外围框架之间形成前声腔， 本实施例扬 声器单体的振膜与第一壳体 11和嵌件 13之间的空间形成前声腔， 通常前声 腔为连通扬声器单体与外界的通道， 通过前声腔将扬声器单体产生的声音传 输到外界。 如图 3所示， 第一壳体 11上对应于第一振动系统 21和第二振动 系统 22中间的位置设有间隔壁 111， 间隔壁 111可以将前声腔分为独立的第 一前声腔和第二前声腔： 对应于第一扬声器单体的第一前声腔和对应于第二 扬声器单体的第二前声腔。
此外， 第一出声孔 51连通第一前声腔， 第二出声孔 52连通第二前声腔， 使第一扬声器单体和第二扬声器单体发出的声音分隔开， 从而可以防止两个 扬声器单体的声波发生干涉。 优选的第一前声腔和第二前声腔大小相同或近 似相同， 可以保证两扬声器单体发声的一致性。
此外， 第一出声孔 51和第二出声孔 52上还设有支撑柱 53， 支撑柱 53 可以加固外围框架上对应出声孔处的强度， 提高产品的稳定性。
第一壳体 11、第二壳体 12和扬声器单体之间形成后声腔， 后声腔为扬声 器单体的振膜靠近音圈的一侧 (即振膜背离前声腔的一侧)形成的空间，后声腔 为封闭的结构， 密封振膜后侧 （振膜靠近音圈一侧） 的空间。 该后声腔可以 被分隔成多个子后声腔。 如图 1、 图 4和图 5所示， 第二壳体 12上设有分别 对应于第一扬声器单体和第二扬声器单体的两个子后声腔， gp， 第一后腔室 121和第二后腔室 122， 第一后腔室 121和第二后腔室 122由第一挡壁 123间 隔开来， 第一挡壁 123与第二壳体 12为一体结构。 优选的， 第一后腔室 121 和第二后腔室 122的大小相同或近似相同， 以保证产品的一致性。 此外， 第 一壳体 11上正对第二壳体 12的一侧设有与第一挡壁 123对应的第二挡壁 112， 组装完成后第一挡壁 123和第二挡壁 112之间通过超声波焊接的方式固定结 合， 使第一后腔室 121和第二后腔室 122完全分隔开， 形成密封的分别连通 第一扬声器单体和第二扬声器单体的第一后声腔和第二后声腔。
这种扬声器模组中安装有两个扬声器单体， 与安装一个扬声器单体的结 构相比这种设置两个扬声器单体的扬声器模组性能更容易调节， 尤其对于这 种狭长型的扬声器模组结构， 设置两个扬声器单体可以避免扬声器单体过于 狭长防止产生偏振等不良。 此外， 每个扬声器单体对应独立的后声腔， 避免 两个扬声器单体之间产生干扰， 便于调节扬声器模组的声学特性， 并且可以 提高扬声器模组发声的立体效果， 从而提高了产品的声学性能。
需要说明的是， 扬声器单体的个数不限于两个， 也可以为两个以上的结 构， 后声腔被分隔成与扬声器单体数量相同的多个子后声腔， 每个扬声器单 体均对应一个独立的子后声腔， 这种通过改变扬声器单体和子后声腔个数的 改进也在本发明的保护范围内。
在本发明的上述教导下， 本领域技术人员可以在上述实施例的基础上进 行其他的改进和变形， 而这些改进和变形， 都落在本发明的保护范围内， 本 领域技术人员应该明白， 上述的具体描述只是更好的解释本发明的目的， 本 发明的保护范围由权利要求及其等同物限定。

Claims

1. 一种扬声器模组， 包括外围框架和收容于所述外围框架内部的扬声器 单体， 所述外围框架上设有与外界连通的出声孔， 所述扬声器单体与所述外 围框架之间形成与所述出声孔相连通的前声腔， 所述扬声器单体背离所述前 声腔的一侧与所述外围权框架之间形成后声腔； 其中， 所述扬声器单体为一个 以上， 所述后声腔分隔成数量与所述扬声器单体相同的多个子后声腔， 每个 所述扬声器单体对应一个所述子后声腔， 所述扬声器单体与对应的所述子后 声腔相连通。
2. 根据权利要求 1所述的扬声器模组， 其中， 所述扬声器单体为两个， 包括并排设置的第一扬声器单体和第二扬声器单体； 所述后声腔中设置有挡 壁以将所述后声腔分隔成两个独立的的子后声腔， gp， 第一后声腔和第二后 声腔， 其中所述第一扬声器单体与所述第一后声腔相连通， 所述第二扬声器 单体与所述第二后声腔相连通。 书
3. 根据权利要求 2所述的扬声器模组， 其中， 所述外围框架包括第一壳 体和第二壳体， 所述第一壳体、 第二壳体和扬声器单体之间的空间形成所述 后声腔； 所述第二壳体上设有第一挡壁， 第一挡壁将第二壳体的内部空间分 隔成分别对应于第一扬声器单体和第二扬声器单体的第一后腔室和第二后腔
4. 根据权利要求 3所述的扬声器模组， 其中， 所述第一壳体上设有对应 于所述第一挡壁设置的第二挡壁， 所述第二挡壁与所述第一挡壁通过超声波 焊接结合。
5. 根据权利要求 2所述的扬声器模组， 其中， 所述第一扬声器单体和所 述第二扬声器单体均包括振动系统和磁路系统， 所述振动系统包括振膜； 所 述前声腔位于所述振膜远离所述磁路系统的一侧， 所述后声腔位于所述振膜 靠近所述磁路系统的一侧。
6. 根据权利要求 5所述的扬声器模组， 其中， 所述前声腔中设有间隔壁， 所述间隔壁将所述前声腔分隔成独立的第一前声腔和第二前声腔； 所述第一 前声腔对应所述第一扬声器单体设置， 所述第二前声腔对应所述第二扬声器 单体设置。
7. 根据权利要求 6所述的扬声器模组， 其中， 所述出声孔位于所述外围 框架的侧面， 所述出声孔包括与所述第一前声腔连通的第一出声孔和与所述 第二前声腔连通的第二出声孔， 所述第一出声孔和所述第二出声孔间隔设置。
8. 根据权利要求 5所述的扬声器模组， 其中， 所述第一扬声器单体与所 述第二扬声器单体相同， 包括结构相同的振动系统和磁路系统。
9. 根据权利要求 8所述的扬声器模组， 其中， 所述第一前声腔与所述第 二前声腔的大小相同。
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