TWI779304B - 揚聲器 - Google Patents

揚聲器 Download PDF

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Publication number
TWI779304B
TWI779304B TW109121200A TW109121200A TWI779304B TW I779304 B TWI779304 B TW I779304B TW 109121200 A TW109121200 A TW 109121200A TW 109121200 A TW109121200 A TW 109121200A TW I779304 B TWI779304 B TW I779304B
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Taiwan
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frame
chamber
holes
loudspeaker
partition wall
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TW109121200A
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TW202201973A (zh
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賴采緹
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美律實業股份有限公司
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Priority to TW109121200A priority Critical patent/TWI779304B/zh
Priority to CN202010800507.0A priority patent/CN111818423B/zh
Priority to US17/013,836 priority patent/US11317194B2/en
Publication of TW202201973A publication Critical patent/TW202201973A/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/345—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
    • H04R1/2888—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Abstract

一種揚聲器包含一框架以及一腔室隔牆。框架具有一環形側牆與一頂牆。腔室隔牆連接至框架藉以區隔出一內腔室以及外腔室，其中環形側牆包含複數通孔。

Description

揚聲器
本發明是關於一種揚聲器，特別是關於一種具有高、低音域異向位分流的揚聲器。
聽音樂已成為現代人生活中用以調劑緊張、單調的生活不可缺少的重要部分，所以一般消費性產品的揚聲器(如：喇叭、耳機等)所表現出音樂的音質，會影響消費者在聆聽音樂時對揚聲器的使用體驗。更隨著消費者對音質的要求也是越來越高，因此對於一般消費性產品的揚聲器的要求日趨重視，故改善音質和提高消費者的使用體驗，需要揚聲器製造商持續不斷投注心力。
一般來說體積較小的揚聲器，例如耳機內的揚聲器，只能設計一個發聲單體，較難同時兼顧高、低音的音效體驗。如何在體積較小的揚聲器提升高、低音的輸出品質是揚聲器製造商研發的方向之一。
本發明提出一種創新的揚聲器，藉以解決先前技術的問題。
於本發明的一實施例中，一種揚聲器包含一框架以及一腔室隔牆。框架具有一環形側牆與一頂牆。腔室隔牆連接至框架藉以區隔出一內腔室以及外腔室，其中環形側牆包含複數通孔。
於本發明的一實施例中，框架之頂牆不具有該些通孔。
於本發明的一實施例中，框架具有一開孔，藉以容納一電磁迴路元件，且腔室隔牆覆蓋電磁迴路元件與開孔並與框架連接。
於本發明的一實施例中，內腔室包含位於腔室隔牆與電磁迴路元件之間的空腔空間。
於本發明的一實施例中，電磁迴路元件具有一中心孔。
於本發明的一實施例中，揚聲器還包含一多孔吸音體位於中心孔內。
於本發明的一實施例中，腔室隔牆與框架為一體成型的組件。
於本發明的一實施例中，揚聲器還包含一振動膜，連接於框架的底部。
於本發明的一實施例中，振動膜、框架與腔室隔牆共同定義出內腔室。
於本發明的一實施例中，內腔室是藉由環形側牆之該些通孔與外腔室形成空氣連通。
於本發明的一實施例中，揚聲器還包含複數低音聲波調整片，每一低音聲波調整片覆蓋一對應的通孔。
於本發明的一實施例中，揚聲器還包含一弧形低音聲波調整片，藉以覆蓋所有該些通孔。
綜上所述，本發明之揚聲器結構，藉其腔室隔牆與框架的結構以區隔出內腔室以及外腔室，且框架的環形側牆具有通孔作為調音孔。藉由框架調音孔之設計將低音域聲波引導至側邊，而直接傳導至外腔室中，再搭配腔室隔牆將高音域聲波藉由磁迴通道匯集至內腔室，讓高、低音域形成異向位分流，獨立出的高、低音音域則可避免音質混濁，更進一步讓聲音品質均勻與穩定的輸出。
以下將以實施方式對上述之說明作詳細的描述，並對本發明之技術方案提供更進一步的解釋。
為了使本發明之敘述更加詳盡與完備，可參照所附之圖式及以下所述各種實施例，圖式中相同之號碼代表相同或相似之元件。另一方面，眾所周知的元件與步驟並未描述於實施例中，以避免對本發明造成不必要的限制。
於實施方式與申請專利範圍中，除非內文中對於冠詞有所特別限定，否則『一』與『該』可泛指單一個或複數個。
請參照第1圖，其繪示根據本發明之一實施例的揚聲器之分解圖。一種揚聲器100a包含揚聲器本體103以及外殼102。外殼102包含後蓋102a與前蓋102b彼此組合以容納揚聲器本體103於其內。揚聲器本體103所產生的聲音經前蓋102b聲音輸出孔116輸出。
請參照第2、3圖，第2圖繪示根據本發明之一實施例的揚聲器本體之剖面圖，此剖面圖是沿第1圖之剖面線2-2所繪示。第3圖係繪示第1、2圖的揚聲器100a之爆炸圖。揚聲器本體103包含框架112以及腔室隔牆104。腔室隔牆104連接至框架112，藉以區隔出一內腔室105a, 105c以及外腔室105b。框架112具有一環形側牆112b與一頂牆112a。環形側牆112b包含複數通孔112c，藉以使內腔室105a, 105c以及外腔室105b形成空氣連通。頂牆112a與腔室隔牆104組合後，則不具有通孔使內腔室105a, 105c與外腔室105b形成空氣連通。
在本實施例中，框架112具有一中心的開孔112d，藉以容納一電磁迴路元件106a。腔室隔牆104連接框架112並覆蓋電磁迴路元件106a與開孔112d，且形成一內腔室105a位於腔室隔牆104與電磁迴路元件106a之間。
在本實施例中，電磁迴路元件106a具有一中心孔106c，可供一多孔吸音體107置入其內，於其他可能實施例中多孔吸音體107亦可配置於內腔室105a中，藉以在有限的空間條件下，無形的創造出虛擬容積並調整音阻。
揚聲器本體103還包含一振動膜114設置於框架112的底部。振動膜114包含一內圓區114a與一外環區114b。振動膜114之內圓區114a的位置是對準電磁迴路元件106a。振動膜114之外環區114b與框架112之間形成一內腔室 105c。換言之，振動膜114 、框架112與腔室隔牆104共同定義出內腔室 105a與105c。
揚聲器還包含一音源線圈106b，其固定於振動膜114之內圓區114a與外環區114b之間。音源線圈106b電性連接至驅動電路板108，並藉其驅動激磁而帶動振動膜114振動而產生聲音。振動膜114之內圓區114a振動而產生的較高頻聲音，可通過中心孔106c傳導至內腔室105a。振動膜114之外環區114b振動而產生的較低頻聲音，可經內腔室105c與通孔112c傳導至外腔室105b（即腔室隔牆104與外殼102之間的空腔區域）。
在本實施例中，揚聲器還包含複數低音聲波調整片110，每一低音聲波調整片110覆蓋一對應的通孔112c。腔室隔牆104與框架112並非一體成型的組件，需藉二次加工黏合。
請參照第4圖，其繪示根據本發明之一實施例的揚聲器之爆炸圖。揚聲器100b不同於揚聲器100a主要在於腔室隔牆與框架的結構。在本實施例中，腔室隔牆與框架是一體成型的組件(即框架112’)，不需二次加工黏合。此外，揚聲器還包含一弧形低音聲波調整片110’，藉以覆蓋框架112’側牆上的所有通孔112c。框架112’的頂牆則不具有通孔。
綜上所述，本發明之揚聲器結構，藉其腔室隔牆與框架的結構以區隔出內腔室以及外腔室，且框架的環形側牆具有通孔作為調音孔。藉由框架調音孔之設計將低音域聲波引導至側邊，而直接傳導至外腔室中，再搭配腔室隔牆將高音域聲波藉由磁迴通道匯集至內腔室，讓高、低音域形成異向位分流，獨立出的高、低音音域則可避免音質混濁，更進一步讓聲音品質均勻與穩定的輸出。
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，於不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100a:揚聲器 100b:揚聲器 102:外殼 102a:後蓋 102b:前蓋 103:揚聲器本體 104:腔室隔牆 105a、105c:內腔室 105b:外腔室 106a:磁迴路元件 106b:音源線圈 106c:中心孔 107:多孔吸音體 108:驅動電路板 110:低音聲波調整片 110’:弧形低音聲波調整片 112:框架 112’:框架 112a:頂牆 112b:環形側牆 112c:通孔 112d:開孔 114:振動膜 114a:內圓區 114b:外環區 116:聲音輸出孔
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下： 第1圖係繪示根據本發明之一實施例的揚聲器之分解圖； 第2圖係繪示根據本發明之一實施例的揚聲器本體之剖面圖； 第3圖係繪示根據本發明之一實施例的揚聲器之爆炸圖；以及。 第4圖係繪示根據本發明之另一實施例的揚聲器之爆炸圖。
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無
103:揚聲器本體
104:腔室隔牆
105a、105c:內腔室
105b:外腔室
106a:磁迴路元件
106b:音源線圈
106c:中心孔
107:多孔吸音體
110:低音聲波調整片
112:框架
112a:頂牆
112c:通孔
112d:開孔
114:振動膜
114a:內圓區
114b:外環區

Claims (8)

  1. 一種揚聲器，包含：一框架，具有一環形側牆與一頂牆；一電磁迴路元件，容納於該框架內且具有一中心孔；一振動膜，連接於該框架，該振動膜具有一內圓區與一外環區；以及一腔室隔牆，連接至該框架，藉以區隔出一內腔室以及外腔室，其中該環形側牆包含複數通孔，該內圓區對準該中心孔，該外環區對準該些通孔，該內腔室對應該外環區的部份藉由該些通孔與該外腔室形成空氣連通，其中該些通孔之開口方向朝與該中心孔之開口方向不同。
  2. 如請求項1所述之揚聲器，其中該腔室隔牆覆蓋該電磁迴路元件並與該框架連接。
  3. 如請求項1所述之揚聲器，其中該內腔室包含位於該腔室隔牆與該電磁迴路元件之間的空腔空間。
  4. 如請求項1所述之揚聲器，還包含一多孔吸音體位於該中心孔內。
  5. 如請求項1所述之揚聲器，其中該腔室隔牆與該框架為一體成型的組件。
  6. 如請求項1所述之揚聲器，其中該振動膜、該框架與該腔室隔牆共同定義出該內腔室。
  7. 如請求項1所述之揚聲器，還包含複數低音聲波調整片，每一該低音聲波調整片覆蓋該些通孔其中一對應者。
  8. 如請求項1所述之揚聲器，還包含一弧形低音聲波調整片，藉以覆蓋所有該些通孔。
TW109121200A 2020-06-22 2020-06-22 揚聲器 TWI779304B (zh)

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TW109121200A TWI779304B (zh) 2020-06-22 2020-06-22 揚聲器
CN202010800507.0A CN111818423B (zh) 2020-06-22 2020-08-10 扬声器
US17/013,836 US11317194B2 (en) 2020-06-22 2020-09-07 Speaker

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220337931A1 (en) * 2021-04-16 2022-10-20 Kingston Technology Corporation Acoustic chamber and venting systems and methods

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4742887A (en) * 1986-02-28 1988-05-10 Sony Corporation Open-air type earphone
TW494703B (en) * 2001-01-26 2002-07-11 Mitsubishi Electric Corp Car speaker
US6804366B2 (en) * 2000-12-05 2004-10-12 Pioneer Corporation Speaker apparatus
TWM317132U (en) * 2007-02-06 2007-08-11 Dk Signal Ltd Driver of speakers
TWM317727U (en) * 2007-02-06 2007-08-21 Dk Signal Ltd Speaker driver
TWI455613B (zh) * 2011-08-03 2014-10-01 Meiloon Ind Co Ltd Inner bracket speaker structure
TW201834472A (zh) * 2017-03-14 2018-09-16 大陸商廣東歐珀移動通信有限公司 揚聲器、揚聲裝置及行動終端

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388718A (en) * 1976-12-15 1978-08-04 Matsushita Electric Ind Co Ltd Sealed head phone
JPH03130700U (zh) * 1990-04-10 1991-12-27
CN2214698Y (zh) * 1994-12-05 1995-12-06 吕贵美 吸音构件
US5790679A (en) * 1996-06-06 1998-08-04 Northern Telecom Limited Communications terminal having a single transducer for handset and handsfree receive functionality
US10063962B2 (en) * 2015-06-30 2018-08-28 Apple Inc. Vented acoustic enclosures and related systems
CN205902020U (zh) * 2016-07-15 2017-01-18 东莞市丰纶电子科技有限公司 改善三频平衡的新型耳机单体
CN105592378B (zh) * 2016-02-14 2018-10-12 东莞市丰纶电子科技有限公司 一种低音分频耳机
US10602247B2 (en) * 2017-08-21 2020-03-24 Ssi New Material (Zhenjiang) Co., Ltd. Loudspeaker with metallic organic framework material
TWI760612B (zh) * 2019-05-15 2022-04-11 美律實業股份有限公司 揚聲器
TWI700936B (zh) * 2018-06-21 2020-08-01 美律實業股份有限公司 揚聲器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4742887A (en) * 1986-02-28 1988-05-10 Sony Corporation Open-air type earphone
US6804366B2 (en) * 2000-12-05 2004-10-12 Pioneer Corporation Speaker apparatus
TW494703B (en) * 2001-01-26 2002-07-11 Mitsubishi Electric Corp Car speaker
TWM317132U (en) * 2007-02-06 2007-08-11 Dk Signal Ltd Driver of speakers
TWM317727U (en) * 2007-02-06 2007-08-21 Dk Signal Ltd Speaker driver
TWI455613B (zh) * 2011-08-03 2014-10-01 Meiloon Ind Co Ltd Inner bracket speaker structure
TW201834472A (zh) * 2017-03-14 2018-09-16 大陸商廣東歐珀移動通信有限公司 揚聲器、揚聲裝置及行動終端

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US11317194B2 (en) 2022-04-26
US20210400377A1 (en) 2021-12-23
TW202201973A (zh) 2022-01-01
CN111818423B (zh) 2023-06-20
CN111818423A (zh) 2020-10-23

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