WO2014029066A1 - Radiateur en aluminium/cuivre purs, procédé de production associé et moule de production s'y rapportant - Google Patents

Radiateur en aluminium/cuivre purs, procédé de production associé et moule de production s'y rapportant Download PDF

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Publication number
WO2014029066A1
WO2014029066A1 PCT/CN2012/080371 CN2012080371W WO2014029066A1 WO 2014029066 A1 WO2014029066 A1 WO 2014029066A1 CN 2012080371 W CN2012080371 W CN 2012080371W WO 2014029066 A1 WO2014029066 A1 WO 2014029066A1
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WO
WIPO (PCT)
Prior art keywords
pure
pure aluminum
pure copper
base
heat sink
Prior art date
Application number
PCT/CN2012/080371
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English (en)
Chinese (zh)
Inventor
杨亚西
Original Assignee
深圳市西德利电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市西德利电子科技有限公司 filed Critical 深圳市西德利电子科技有限公司
Priority to PCT/CN2012/080371 priority Critical patent/WO2014029066A1/fr
Publication of WO2014029066A1 publication Critical patent/WO2014029066A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to the field of heat sinks.
  • Heat sinks are mostly base and fin structures.
  • the base is used to contact the heat source.
  • the fins are used to increase the surface area and increase the heat dissipation efficiency.
  • the constraints here include the material of the heat sink itself, as well as the structure and processing difficulty of the heat sink.
  • the heat sinks on the market are produced by processes such as die casting or extrusion stretching. These processes require heating to form, although pure aluminum/pure copper is a good thermal conductive material, but because they are highly viscous after heating, The mold will be stuck, so pure aluminum or pure copper cannot be used as the heat sink material in the prior art.
  • the object of the present invention is to provide a pure aluminum/pure copper heat sink with excellent heat dissipation effect, and a supporting production method of the pure aluminum/pure copper heat sink, and a production mold used in the method.
  • the present invention provides a pure aluminum/pure copper heat sink comprising a base, at least one heat pipe is disposed on one side of the base, one end of the heat pipe is connected to the base, and the pipe body is perpendicular to the base
  • the inner hole of the tube penetrates through the base; the base and the heat dissipation tube are the same whole, and the whole is a pure aluminum/pure copper member.
  • a plurality of fins are disposed on the outer wall of the heat dissipation tube, and the fins extend along the tube body; the base, the heat dissipation tube and the fin are the same whole, and the whole is a pure aluminum/pure copper member. .
  • the heat pipe has a rectangular cross section, and the plurality of heat pipes are disposed on the base in parallel with each other.
  • the present invention further provides a method for producing a pure aluminum/pure copper heat sink, comprising the following steps:
  • a plurality of fins extending in the direction of the tube body are formed on the outer wall of the heat dissipation tube while punching and stretching the heat dissipation tube.
  • the press stretching in the step 3) is a cold stamping drawing.
  • the present invention also provides a production mold of a pure aluminum/pure copper heat sink, comprising an upper mold and a lower mold; the upper surface of the lower mold is provided with at least one vertical molding hole, and the molding hole is axially
  • the variable diameter is divided into three sections: the upper section, the transition section and the lower section.
  • the upper section has a larger aperture than the lower section, and the transition section has a funnel shape which is gradually narrowed, and connects the upper section and the lower section; the lower surface of the upper mold is provided with a fixing jig, which is aligned with the forming hole. .
  • the inner wall of the lower hole is provided with a plurality of sharp ribs distributed around the central axis of the forming hole.
  • the transition angle of the transition section is 27°.
  • the holes of the upper section are rounded.
  • the upper mold is divided into upper and lower layers, the fixing jig is disposed on the lower layer, and a buffer device is disposed between the upper layer and the lower layer.
  • the lower mold is divided into an inner portion and an outer portion, and the outer portion is divided into a fixed base, and a central hole is opened in the fixed base for the inner portion to be inserted;
  • the inner portion includes a plurality of vertical flaps A sub-mold that encloses the shaped hole.
  • the production mold according to the present invention described above can be used to produce the pure aluminum/pure copper radiator provided by the present invention in accordance with the production method provided by the present invention.
  • the invention has the beneficial effects that the pure aluminum/pure copper radiator in the invention has a heat dissipating tube, can simultaneously exert the chimney effect of air convection and increase the heat dissipating area, and adopts pure aluminum/pure copper as a manufacturing material, and has excellent performance.
  • the heat-dissipating effect; the production mold and the production method of the invention are specially designed for the material of the pure aluminum/pure copper radiator itself, and the stamping process can make the base and the heat-dissipating tube integrally formed, and the production is efficient, fast and feasible.
  • the present invention preferably has a cold stamping process, which ensures that the product can be completed, the process does not require any external heating, does not generate waste gas, saves energy, and is environmentally friendly and economical.
  • the pure aluminum/pure copper radiator of the invention is provided with fins on the outer wall of the heat dissipation pipe, which can further increase the heat dissipation area; the corresponding production mold and production method can ensure that the base, the heat dissipation pipe and the fin are integrally formed at the same time, and the operation Simple and easy to use, saving production costs.
  • the invention can be applied to the field of manufacturing of heat sinks.
  • FIG. 1 is a schematic perspective view of a pure aluminum/pure copper heat sink according to the present invention, in order to clearly show the overall structure, only fins are drawn on one of the heat pipes;
  • FIG. 2 is a schematic structural view of a production mold in the present invention, wherein the lower mold is in a half-sectional state, and the upper mold is clamped with a schematic pure aluminum/pure copper ingot, and the arrow in the figure indicates the punching direction;
  • Figure 3 is a schematic view of a pure aluminum/pure copper ingot in the production method of the present invention, which is in an unpunched state;
  • Figure 4 is a schematic view of a pure aluminum/pure copper ingot in the production method of the present invention, which is in a punched state;
  • Fig. 5 is a perspective view showing another three-dimensional structure of a pure aluminum/pure copper heat sink according to the present invention. In order to clearly show the overall structure, only fins are drawn on one of the heat pipes.
  • a pure aluminum/pure copper heat sink includes a base 11.
  • One side of the base 11 is provided with at least one heat pipe 12 having a plurality of fins 13 on the outer wall.
  • One end of the tube 12 is connected to the base 11 , the tube body is perpendicular to the base 11 , the inner hole of the tube penetrates the base 11 , and the fin 13 extends in the direction of the tube body; the base 11 , the heat dissipation tube 12 and the fin 13 are the same whole.
  • the whole is a pure aluminum/pure copper component.
  • the heat pipe 12 has a rectangular cross section, and the plurality of heat pipes 12 are disposed on the base 11 in parallel with each other.
  • the heat-dissipating tube 12 of rectangular cross-section facilitates the grasping and clamping during assembly without losing its guiding function.
  • the pure aluminum/pure copper heat sink has better heat conduction and heat dissipation effect than the ordinary aluminum alloy material. Since the base 11, the heat pipe 12 and the fins 13 are the same as a whole, there is no blockage in the middle of heat transfer, and the heat transfer efficiency is higher than that of the split-mounted heat sink.
  • a method of producing the pure aluminum/pure copper heat sink comprises the following steps:
  • a plurality of fins 13 extending in the direction of the tube body are formed on the outer wall of the heat dissipation tube 12 while punching and stretching the heat dissipation tube. This can be achieved by using the production mold described below.
  • the press stretching in the step 3) is a cold stamping drawing.
  • the stamping and stretching action of step 3) can be completely completed by a cold stamping process without a heat source, and the material is not heated, so that the processing method has the effect of energy saving and environmental protection.
  • this embodiment can also be used as one of the specific embodiments of the method as long as it does not bond the mold.
  • a production mold for manufacturing the pure aluminum/pure copper heat sink includes an upper mold 21 and a lower mold 22; and an upper surface of the lower mold 22 is provided with at least one vertical formed hole 23, the forming hole 23 is reduced in the axial direction, and is divided into an upper section, a transition section and a lower section, the upper section has a larger diameter than the lower section, and the transition section has a funnel shape which is gradually narrowed, and connects the upper section and the lower section, and the lower section is connected.
  • the inner wall is provided with a plurality of sharp ribs 24 distributed around the central axis of the forming hole 23; the lower surface of the upper mold 21 is provided with a fixing jig aligned with the forming hole 23; the number of the forming holes 23 and the pure aluminum/purity to be produced The number of heat pipes 12 on the copper heat sink match.
  • the transition section has a cone apex angle of 27°.
  • the cone angle of 27° is a preferred lead-in angle, which facilitates the pressing of pure aluminum/pure copper billets during the stamping process.
  • the upper section of the hole is rounded.
  • the hole is rounded, so that the root of the heat pipe 12 during stamping is not easily broken, and the pure aluminum/pure copper ingot is also pressed and drawn.
  • the upper mold 21 is divided into upper and lower layers, the fixing jig is disposed on the lower layer, and a buffer device is disposed between the upper layer and the lower layer.
  • the buffer device may be a strong spring and a cushion rubber provided between the upper and lower layers, and the buffer device may exist to prevent the impact force from being excessively caused to cause the lower mold 22 to collapse.
  • the lower mold 22 is divided into an inner portion and an outer portion, and the outer portion is divided into a fixed base, and a central hole is opened in the fixed base for the inner portion to be inserted; the inner portion includes a plurality of vertical flaps A sub-mold that encloses the shaped hole 23.
  • the heat pipe of the pure aluminum/pure copper radiator needs to strike the molding hole 23 with a large impulse, and in the case of uneven force, the lower mold material near the molding hole 23 is easily broken, and the inner portion is designed into a sub-assembly.
  • the form of the mold is beneficial to disperse the impact stress and protect the mold.
  • FIG. 2 only the inner portion of the lower mold 22 is partially divided, and only one molding hole 23 is shown in the figure, and if a plurality of heat dissipation tubes 12 are arranged side by side on the base 11, the corresponding ones are correspondingly A plurality of molding holes 23 may be added to the portion.
  • a heat sink having heat pipes arranged in a horizontal row can be produced.
  • the skilled person can refer to this example, freely transform the arrangement of the heat pipe, and the pure aluminum/pure copper heat sink produced is an equivalent transformation of the utility model.
  • the completed pure aluminum / pure copper ingot 31 is clamped to the fixing fixture of the upper mold 21, the base prototype 32 is clamped, the boss 33 is facing downward, aligned with the forming hole 23 of the lower mold 22;
  • the upper mold 21 is quickly undershot, the boss 33 is driven into the forming hole 23, the upper and lower molds are closed, and then the upper mold 21 is lifted up until the boss 33 is pulled out of the forming hole 23, at which time the boss 33 is pulled. Long and forming fins 13 on the outer wall;
  • step 4) a number of times until the boss 33 is no longer elongated, or has been elongated to the actual size of the heat pipe 12 of the pure aluminum/pure copper heat sink.
  • the upper mold 21 is quickly undercut, and the prototype of the heat pipe, that is, the boss 33, is quickly flushed into the upper portion of the molding hole 23, and then pressed by the transition portion to be quickly inserted into the lower portion. Due to the rapid stamping action, the soft metal such as pure aluminum/pure copper has a lower melting point, so that the outer surface of the boss 33 is slightly melted under rapid friction, so that it can still enter the inner diameter when the outer diameter is large. The lower molding hole 23 is in the lower section. Then, the upper mold 21 is lifted up, at this time, the sharp ribs 24 will scrape the outer surface of the boss 33.
  • the adhesion will lengthen the surface metal, so that after the mold is opened, The overall length of the boss 33 is elongated and a fin 13 matching the sharp rib 24 is formed on the outer surface. Repeated operation multiple times, can produce the actual size of pure aluminum / pure copper radiator.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un radiateur en aluminium/cuivre purs, comprenant une base (11) et des conduits de dissipation thermique (12), la base et les conduits de dissipation thermique étant intégrés; l'invention concerne également un procédé de production du radiateur en aluminium/cuivre purs, la base (11) et les conduits de dissipation thermique (12) étant formés d'un seul tenant par estampage et étirement d'ébauches en aluminium/cuivre purs; l'invention concerne en outre un moule de production pour produire le radiateur en aluminium/cuivre purs, le moule comprenant un moule supérieur (21) et un moule inférieur (22), le moule inférieur présentant des trous segmentés de différents diamètres (23). Le radiateur en aluminium/cuivre purs présente les avantages d'un effet de dissipation thermique satisfaisant, d'un procédé de production simple et d'une conception de moule astucieuse.
PCT/CN2012/080371 2012-08-20 2012-08-20 Radiateur en aluminium/cuivre purs, procédé de production associé et moule de production s'y rapportant WO2014029066A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/080371 WO2014029066A1 (fr) 2012-08-20 2012-08-20 Radiateur en aluminium/cuivre purs, procédé de production associé et moule de production s'y rapportant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/080371 WO2014029066A1 (fr) 2012-08-20 2012-08-20 Radiateur en aluminium/cuivre purs, procédé de production associé et moule de production s'y rapportant

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WO2014029066A1 true WO2014029066A1 (fr) 2014-02-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106385781A (zh) * 2015-07-30 2017-02-08 湖南金马铝业有限责任公司 一种改良散热装置及生产工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11292968A (ja) * 1998-04-15 1999-10-26 Jsr Corp 電子部品およびその製造方法
WO2000033622A2 (fr) * 1998-10-29 2000-06-08 Bargman Ronald D Improved heat sink and process of manufacture
US6374490B1 (en) * 1998-08-12 2002-04-23 Nakamura Seisakusho Kabushikigaisha Method of forming a hollow pole projecting on a plate and a method of manufacturing a heat sink using said method
CN201550387U (zh) * 2009-09-30 2010-08-11 浙江西子光电科技有限公司 具有特殊结构的散热器
CN202335187U (zh) * 2011-11-15 2012-07-11 昆山谷捷金属制品有限公司 一种水冷却的圆柱状针式纯铜制散热器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11292968A (ja) * 1998-04-15 1999-10-26 Jsr Corp 電子部品およびその製造方法
US6374490B1 (en) * 1998-08-12 2002-04-23 Nakamura Seisakusho Kabushikigaisha Method of forming a hollow pole projecting on a plate and a method of manufacturing a heat sink using said method
WO2000033622A2 (fr) * 1998-10-29 2000-06-08 Bargman Ronald D Improved heat sink and process of manufacture
CN201550387U (zh) * 2009-09-30 2010-08-11 浙江西子光电科技有限公司 具有特殊结构的散热器
CN202335187U (zh) * 2011-11-15 2012-07-11 昆山谷捷金属制品有限公司 一种水冷却的圆柱状针式纯铜制散热器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106385781A (zh) * 2015-07-30 2017-02-08 湖南金马铝业有限责任公司 一种改良散热装置及生产工艺

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