WO2014027761A1 - Substrat flexible pour élément d'affichage, son procédé de fabrication, et dispositif d'affichage l'utilisant - Google Patents

Substrat flexible pour élément d'affichage, son procédé de fabrication, et dispositif d'affichage l'utilisant Download PDF

Info

Publication number
WO2014027761A1
WO2014027761A1 PCT/KR2013/006394 KR2013006394W WO2014027761A1 WO 2014027761 A1 WO2014027761 A1 WO 2014027761A1 KR 2013006394 W KR2013006394 W KR 2013006394W WO 2014027761 A1 WO2014027761 A1 WO 2014027761A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
display device
matrix
resin
reinforcing material
Prior art date
Application number
PCT/KR2013/006394
Other languages
English (en)
Korean (ko)
Inventor
김태호
곽병도
김영권
김태정
이상걸
이우진
임성한
정은환
최석원
김성국
Original Assignee
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제일모직 주식회사 filed Critical 제일모직 주식회사
Publication of WO2014027761A1 publication Critical patent/WO2014027761A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present invention relates to a flexible substrate for a display device, a method of manufacturing the same, and a display device using the same.
  • plastic substrate materials such as polyester (polyethylene terephthalate) or polyethylene naphthalate (PEN), polycarbonate, polyether sulfone, cyclic olefin resin, epoxy resin or acrylic resin are used.
  • polyester polyethylene terephthalate
  • PEN polyethylene naphthalate
  • polycarbonate polyethylene naphthalate
  • polyether sulfone polyether sulfone
  • cyclic olefin resin epoxy resin or acrylic resin
  • acrylic resin acrylic resin
  • these materials have a high coefficient of thermal expansion, which may cause problems such as warpage of the product and disconnection of wiring.
  • a technique of applying a resin having a low coefficient of thermal expansion such as polyamide-based resin
  • polyamide-based resin is not suitable as a substrate material due to its very low transparency and high birefringence and hygroscopicity.
  • a silicone fiber reinforced plastic (FRP) composite sheet having low thermal expansion and providing flexibility, heat resistance and transparency by using a low anisotropic silicone rubber (rubber) as a matrix with glass fiber cloth was developed.
  • a low anisotropic silicone rubber (rubber) as a matrix with glass fiber cloth.
  • an inorganic membrane barrier layer for preventing moisture permeability required for manufacturing a substrate and preventing gas passage to the outside of the composite sheet should be secured.
  • such an inorganic membrane barrier layer has a high elastic modulus, different mechanical properties from the resin matrix, and a weak interfacial adhesion between the two layers, which may cause cracks, warpage, and the like. And durability can be reduced.
  • the silicon fiber reinforced plastic (FRP) composite sheet has a high surface roughness, which makes it difficult to be used as a flexible substrate for a liquid crystal display device or an organic EL display device.
  • the surface roughness is applied to both sides of the core layer by applying a core resin or a heterogeneous liquid crude liquid used for manufacturing the composite sheet. Is improving.
  • a resin or a liquid crude liquid the viscosity, the thickness of the coating film, the physical properties of the liquid crude liquid and the like have to be controlled.
  • the silicon FRP composite sheet may cause deformation of the entire substrate due to heat or the like when the planarization layer is applied.
  • An object of the present invention is to provide a flexible substrate for a display device with improved surface roughness and a method of manufacturing the same.
  • Another object of the present invention is to provide a flexible substrate for a display device having excellent moisture permeability, low thermal expansion coefficient, flexibility and durability, and a method of manufacturing the same.
  • Still another object of the present invention is to provide a flexible substrate for a display device and a method of manufacturing the same, which do not generate cracks and have excellent flatness without controlling the viscosity, the thickness of the coating film, the physical properties of the liquid crude liquid, and the like.
  • the display substrate flexible substrate may include a matrix; Reinforcing material impregnated in the matrix; And a buffer layer formed on at least one surface of the matrix, wherein a rod having a crack during the Mandrel Bend Test has a diameter of 7 mm or less.
  • the flexible substrate for the display device may have an elastic modulus of 100 MPa or more.
  • the flexible substrate for the display device may have an elastic modulus of 1 GPa or more.
  • the matrix may comprise a silicone rubber.
  • a gas barrier layer may be further formed on the buffer layer.
  • the surface roughness Ra of the flexible substrate for the display device may be 40 nm or less.
  • the buffer layer may have a thickness of 0.01 to 50 ⁇ m.
  • the buffer layer may include at least one of (meth) acrylic resin, polyimide resin, polyester resin, polycarbonate resin, epoxy resin, and urethane resin.
  • the reinforcing material is one of glass fiber, glass fiber cloth, glass fabric, glass nonwoven fabric, glass mesh, glass beads, glass flake, silica particles, and colloidal silica. It may contain the above.
  • the gas barrier layer may include at least one of silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, aluminum nitride, aluminum oxide, tantalum oxide, titanium oxide, indium tin oxide (ITO), and indium zinc oxide (IZO).
  • the gas barrier layer may have an elastic modulus of about 10 to about 500 GPa at 25 ° C.
  • the flexible substrate for the display device may have a moisture permeability of about 0.15 g / m 2 / day or less, for example, 0.10 g / m 2 / day or less.
  • the method is a method of manufacturing a flexible substrate for a display device, which comprises forming a laminated sheet by laminating a buffer layer on at least one surface of a matrix including a silicon-based rubber impregnated with a reinforcing material, and the display device flexible substrate is a Mandrel Bend Test.
  • the diameter of the rod where the crack occurs may be 7 mm or less.
  • the laminated sheet, the reinforcing material on one surface of the buffer layer is characterized in that it comprises a step of coating and curing the resin for forming the matrix on the reinforcing material.
  • the laminated sheet is formed by applying a matrix forming resin to a reinforcing material to form a matrix impregnated with the reinforcing material; And applying and curing a resin for forming a buffer layer on at least one surface of the matrix impregnated with the reinforcing material.
  • the laminate sheet has a reinforcing material on one side of the first buffer layer; Applying a matrix forming resin to the reinforcing material to form a matrix; And laminating the second buffer layer on the matrix to cure the same.
  • the method may further include forming a gas barrier layer on the buffer layer.
  • the display device includes a substrate; An organic light emitting device formed on the substrate; And an encapsulation member encapsulating the organic light emitting device, and the substrate may be a flexible substrate for a display device.
  • the present invention provides a display device having improved surface roughness, excellent moisture permeability, low coefficient of thermal expansion, flexibility and durability, no cracking, and excellent flatness without controlling the viscosity, thickness of the coating film, or physical properties of the liquid crude liquid. It is to provide a flexible substrate and a method of manufacturing the same.
  • FIG. 1 is a schematic cross-sectional view of a flexible substrate for a display device according to an exemplary embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a flexible substrate for a display device according to another exemplary embodiment of the present invention.
  • FIG 3 is a schematic cross-sectional view of a display device according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a portion of a display device according to another embodiment of the present invention.
  • the flexible substrate 100 for a display device of the present invention includes a matrix 10; Reinforcing material (15) impregnated in the matrix (10); And buffer layers 21 and 22 formed on at least one surface of the matrix 10.
  • the flexible substrate 200 for a display device of the present invention includes a matrix 10; Reinforcing material (15) impregnated in the matrix (10); And buffer layers 21 and 22 formed on at least one surface of the matrix 10. And gas barrier layers 31 and 32 formed on the buffer layers 21 and 22.
  • the matrix 10 used in the present invention a matrix having excellent high temperature processability, flexibility, and the like may be used.
  • a matrix including a silicone rubber, a matrix including an acrylic resin, a matrix including an epoxy resin, and a urethane type A matrix containing a resin can be used, and for example, a matrix containing the silicone rubber can be used.
  • the matrix may be a matrix having an elastic modulus of about 0.01 to about 20 MPa, for example, about 1 to about 15 MPa at 25 ° C.
  • the flexible substrate for the display device may have excellent flexibility, heat resistance, moisture permeability, durability, and flatness.
  • the glass transition temperature of the matrix 10 may be about -150 to about 30 °C, for example, about -40 to about 10 °C. It is excellent in flexibility and rigidity in the above range and has a small coefficient of thermal expansion.
  • a matrix comprising a silicone rubber may be applied to maintain a low coefficient of thermal expansion.
  • the elastic modulus of the matrix and the buffer layer is measured at 25 ° C. using an MTS Alliance RT / 5 test frame based on a 100N load cell. Specifically, the specimens were weighted with two air grips spaced 25 mm apart and pulled at a crosshead speed of 1 mm / min. This is obtained by continuously collecting load and displacement data and taking the maximum slope of the initial part of the load displacement curve as a Young's modulus.
  • a resin for forming a matrix may be used, and for example, may include silicone rubber, acrylic resin, epoxy resin, urethane resin, and the like. Silicone-based rubber may be included.
  • silicone rubber an organopolysiloxane having an average degree of polymerization of about 5 to about 2,000 may be used. Examples of the organopolysiloxanes include polydimethylsiloxane, polymethylphenylsiloxane, polyalkylarylsiloxane, polyalkylalkylsiloxane, and the like. These are three-dimensional molecules of the network structure.
  • the number of the net bond points is about 5 to about 500 may have a structure containing one per R 2 SiO.
  • Organopolysiloxanes having a viscosity of about 5 to about 500,000 Cst at 25 ° C. may be used. Within this range, the composite sheet may have excellent flexibility, heat resistance, moisture permeability, durability and flatness.
  • the viscosity of the silicone rubber can be, for example, from about 5 to about 120,000 Cst, in embodiments from about 100 to about 100,000 Cst, in embodiments from about 1,000 to about 80,000 Cst at 25 ° C.
  • the matrix together with the silicone rubber is styrene-butadiene rubber (SBR), butadiene rubber, isoprene rubber, chloroprene rubber, neoprene rubber, ethylene-propylene-diene terpolymer, styrene-ethylene-butylene- Styrene (SEBS) block copolymer, Styrene-ethylene-propylene-styrene (SEPS) block copolymer, Acrylonitrile-butadiene rubber (NBR), hydrogenated nitrile rubber (NBR), Flori It may further comprise one or more selected from the group consisting of fluorinated rubber, and plasticized polyvinylchloride rubber.
  • SBR styrene-butadiene rubber
  • SEBS styrene-ethylene-butylene- Styrene
  • SEBS styrene-ethylene-butylene- Styrene
  • SEPS Styrene-ethylene-propylene-
  • the reinforcing material 15 used in the present invention may be impregnated in the matrix 10 and exist inside the matrix to impart heat resistance stability to the substrates 100 and 200.
  • the reinforcement 15 may be dispersed in the matrix 10 or may be impregnated in a woven form, or may be impregnated with the matrix 10 arranged in a uni-direction.
  • the reinforcing material 15 may be formed of a single layer or a plurality of layers.
  • the reinforcing material 15 is glass fiber, glass fiber cloth (glass fiber cloth), glass fabric (glass fabric), glass nonwoven fabric, glass mesh (glass mesh), glass beads, glass flake (glass flake), silica particles, colloidal silica And the like can be used. These may be used alone or in combination of two or more thereof.
  • the reinforcing material 15 may have a refractive index difference of about 0.01 or less from the matrix 10. Within this range, it may have excellent transparency and light transmittance. In embodiments, the refractive index difference from the matrix 10 may be about 0.0001 to about 0.007.
  • the resin constituting the matrix 10 after the resin constituting the matrix 10 is impregnated with the reinforcing material 15, it can be produced in the form of a sheet by crosslinking or curing the resin.
  • the thickness of the matrix 10 impregnated with the reinforcing material 15 may be about 10 to about 200 ⁇ m, for example, about 50 to about 100 ⁇ m. Handling can be easy in the above range.
  • the buffer layers 21 and 22 used in the present invention may be formed on at least one surface of the matrix 10.
  • the buffer layers 21 and 22 are formed on both surfaces of the matrix 10, but may be formed only on one surface thereof.
  • the buffer layers 21, 22 may have an elastic modulus of greater than about 100 MPa at 25 ° C., for example, greater than 100 MPa and less than or equal to about 10 GPa.
  • the elastic modulus of the buffer layers 21 and 22 is in the above range, the crack characteristics are excellent.
  • the matrix 10 and the gas barrier layers 31 and 32 are less than about 100 MPa or more than about 10 GPa.
  • the glass transition temperature of the buffer layers 21 and 22 may be about 30 to about 400 °C. If the glass transition temperature is less than about 30 ° C., the heat resistance may be inferior when the gas barrier layers 31 and 32 are formed, and thermal deformation may occur in the entire substrate, and the glass transition temperature may exceed about 400 ° C. In this case, there is a fear that the surface roughness may not be improved.
  • the elastic modulus at 25 ° C. of the buffer layers 21, 22 may be, for example, about 500 MPa to about 7 GPa, in particular about 1 to about 5 GPa.
  • the glass transition temperatures of the buffer layers 21 and 22 may be, for example, about 50 to about 350 ° C, and in some embodiments, about 150 to about 300 ° C.
  • the buffer layers 21 and 22 may have a surface roughness Ra of about 100 nm or less, for example, about 10 nm or less, and in embodiments, about 0.001 to about 5 nm. It is possible to improve the surface roughness in the above range and can be applied to a flexible substrate for a display device.
  • the buffer layers 21 and 22 may have a thickness of about 0.01 to about 50 ⁇ m, for example, about 1 to about 30 ⁇ m. In the above range can be expressed without improving the surface roughness without inhibiting the intrinsic properties of the matrix.
  • the buffer layers 21 and 22 may include (meth) acrylic resins, polyimide resins, polyester resins, and resins such as polycarbonate resins, epoxy resins, urethane resins, and the like, or two or more of them. It can be applied in combination.
  • the buffer layers 21 and 22 may be formed using a film made of the resin, or a film formed by applying and curing the resin composition on the matrix 10.
  • the gas barrier layers 31 and 32 of the present invention may be formed on the buffer layers 21 and 22.
  • the gas barrier layers 31 and 32 are formed on both surfaces of the buffer layers 21 and 22, but the present invention is not limited thereto.
  • the gas barrier layers 31 and 32 may be formed only on one surface of the buffer layers 21 and 22.
  • the gas barrier layers 31 and 32 may be formed of a material used for a flexible substrate for a conventional display device.
  • silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, aluminum nitride, aluminum oxide, tantalum oxide, Titanium oxide, ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide) may include one or more.
  • the gas barrier layer may form a single layer or two or more kinds of barrier layers may be stacked to form a plurality of layers.
  • the gas barrier layers 31 and 32 may have an elastic modulus of about 10 to about 500 GPa, for example, about 15 to about 350 GPa at 25 ° C. In the above range, the flexible substrate for the display device may have excellent flexibility, moisture permeability, mechanical properties, and durability, and at the same time, lower flatness and moisture permeability.
  • the thickness of the gas barrier layers 31 and 32 may be about 0.01 ⁇ m to about 1.0 ⁇ m, but is not limited thereto.
  • the flexible substrates 100 and 200 for display devices of the present invention may have a moisture permeability of about 0.01 to about 0.15 g / m 2 / day, for example, about 0.05 to about 0.10 g / m 2 / day.
  • the flexible substrates 100 and 200 for the display device may have a thermal expansion coefficient of about 1 to about 6 ppm / ° C, for example, about 2 to about 5 ppm / ° C.
  • the display substrate flexible substrates 100 and 200 may have a surface roughness of about 40 nm or less, for example, about 0.01 to about 35 nm, in some embodiments, about 0.1 to about 30 nm, and in other embodiments, about 0.1 to about 10 nm. nm can be achieved.
  • the flexible substrates 100 and 200 for the display element may be cracked when the cracks are evaluated by the Mandrel Bend Test using respective rods having a diameter of 5 to 20 mm according to ASTM D522-93a.
  • the rod may have a diameter of about 7 mm or less, for example about 5 to about 6 mm.
  • the flexible substrates 100 and 200 for the display device may have an elastic modulus of about 100 MPa or more, for example about 1 GPa or more, and in some embodiments, about 1.2 to 10 Gpa at 25 ° C.
  • the elastic modulus of the substrate is a value obtained by applying pressure with a force of 1000 mN using Fischer MH500 Micro indentation equipment.
  • Another aspect of the present invention relates to a method of manufacturing a flexible substrate for a display element.
  • a method of manufacturing the flexible substrate 100 for a display device may include stacking buffer layers 21 and 22 on at least one surface of a matrix 10 including the silicon-based rubber impregnated with a reinforcing material 15. Forming a step.
  • a method of manufacturing the flexible substrate 200 for the display device may include buffer layers 21 and 22 stacked on at least one surface of the matrix 10 including the silicon-based rubber impregnated with the reinforcing material 15 and the buffer layer ( Forming a laminated sheet by forming gas barrier layers 31 and 32 on the substrates 21 and 22.
  • the buffer layers 21 and 22 may have an elastic modulus of greater than about 100 MPa and less than or equal to about 10 GPa and a glass transition temperature of about 30 to about 400 degrees Celsius at 25 ° C.
  • the manufactured flexible substrate for the display device may have a diameter of about 7 mm or less, in which a crack occurs in a mandrel bend test.
  • the laminated sheet, the reinforcing material 15 is placed on one surface of the buffer layer 21 or 22 having a film form, and the matrix forming resin is applied to the reinforcing material 15 and cured. It can be prepared by forming a.
  • the buffer layers 21 and 22 are formed on both surfaces of the matrix 10 in which the reinforcing material 15 is impregnated, it will be described below.
  • the reinforcing material 15 is placed on one surface of the first buffer layer 21, and the matrix forming resin is applied to the reinforcing material 15 to form the matrix 10.
  • the matrix forming resin is applied to the reinforcing material 15 to form the matrix 10.
  • the matrix 10 to the second impregnated with the reinforcing material 15 and the second buffer layer 22 are shown in FIG. 1.
  • a laminate sheet in which the buffer layers 22 are sequentially stacked is formed.
  • the first and second buffer layers 21 and 22 have an elastic modulus of about 100 MPa to about 10 GPa and a glass transition temperature of about 30 to about 400 ° C. at 25 ° C. do.
  • the laminated sheet is cured by heat or ultraviolet rays as it is, and forms gas barrier layers 31 and 32 on the first and second buffer layers 21 and 22, respectively.
  • the gas barrier layers 31 and 32 may be physically deposited, chemically deposited, coated, sputtered, evaporated, ion plated, wet coated, or organic inorganic multilayer coating on the surfaces of the buffer layers 21 and 22. It can be formed as.
  • the laminated sheet is formed by applying a matrix forming resin to the reinforcing material (15) to form a matrix (10) impregnated with the reinforcing material (15); (Meth) acrylic resins, polyimide resins, polyester resins and resins for buffer layer formation such as polycarbonate, epoxy, urethane, etc. are applied to at least one surface of the matrix 10 impregnated with the reinforcing material 15 and cured. It can be produced by forming the buffer layer (21, 22).
  • gas barrier layers 31 and 32 may be formed on the buffer layers 21 and 22.
  • the gas barrier layers 31 and 32 may be physically deposited, chemically deposited, coated, sputtered, evaporated, ion plated, wet coated, or organic inorganic multilayer coating on the surfaces of the buffer layers 21 and 22. It can be formed as.
  • Another aspect of the invention relates to a display device including the flexible substrate.
  • the display device may include a liquid crystal display device, an organic light emitting diode display device, a touch panel, and the like, but are not limited thereto.
  • the flexible substrate of the present invention may be applied to the substrate of the display device.
  • the display device includes a substrate and an organic light emitting element formed on the substrate.
  • 3 is a cross-sectional view of a display device according to an embodiment of the present invention.
  • the display apparatus includes a substrate 100 and an organic light emitting diode formed on the substrate 100, and the organic light emitting diode includes a first electrode 111 and the first electrode 111. ) And a second electrode 113 formed on the light emitting layer 112.
  • the organic light emitting diode may be encapsulated by the encapsulation member 114.
  • the emission layer 112 includes an organic compound that may emit light when voltage is applied from the first and second electrodes 111 and 113.
  • the flexible substrate of the present invention may be applied to the substrate 100.
  • the display apparatus includes a substrate 300, a protective film 120 formed under the substrate 300, a buffer layer 25 formed on the substrate 300, and an upper portion of the buffer layer 25.
  • the gate insulating layer 40 may be formed between the gate electrode 41, the gate electrode 41, and the buffer layer 25.
  • An active layer 135 including source and drain regions 131 and 133 is formed in the gate insulating layer 40.
  • the passivation layer 61 including the contact hole 62 is formed on the interlayer insulating layer 51, and the interlayer insulating layer 51 on which the source and drain electrodes 52 and 53 are formed is formed on the gate insulating layer 40.
  • the first electrode 70 and the pixel defining layer 80 are formed.
  • the organic emission layer 71 and the second electrode 72 are formed on the pixel defining layer 80.
  • the substrate 300 may be a flexible substrate according to embodiments of the present invention, and the buffer layer 25 may be replaced with a buffer layer included in the flexible substrate according to embodiments of the present invention as needed.
  • Matrix Silicone rubber (polydimethylsiloxane (PDMS), product name: Sylgard 184, manufacturer: Dow Corning) with an elastic modulus of 10 MPa and a glass transition temperature of -30 ° C was used.
  • PDMS polydimethylsiloxane
  • c2 A polycarbonate film (product name: Lexan, manufactured by Dupont teijin) having an elastic modulus of 2.0 to 2.4 GPa, a glass transition temperature of 150 ° C., and a surface roughness of 5 nm was used.
  • Silicone rubber polydimethylsiloxane (PDMS), product name: Sylgard 184, manufactured by Dow Corning
  • silica particles product name: Aerosil, manufactured by Evonik having an elastic modulus of 50 MPa and a glass transition temperature of -30 ° C. The composition which mixed Degussa company) was used.
  • c9 A silicone rubber (polydimethylsiloxane (PDMS), product name: Sylgard 184, manufactured by Dow Corning) with an elastic modulus of 10 MPa and a glass transition temperature of -30 ° C was used.
  • PDMS polydimethylsiloxane
  • Gas barrier layer Silicon oxide and silicon nitride were used.
  • the elastic modulus of the matrix or buffer layer is the value measured at 25 ° C. using an MTS Alliance RT / 5 test frame based on 100 N load cells, each of which is made into a film form. Specifically, the specimens were weighted with two air grips spaced 25 mm apart and pulled at a crosshead speed of 1 mm / min. Load and displacement data can be collected continuously and obtained by taking the maximum slope of the initial part of the load displacement curve as a Young's modulus.
  • a transparent imide film (c1) having a thickness of 10 ⁇ m was placed on a glass substrate, and a reinforcing material (b) was placed thereon, and then a matrix resin (a) was applied onto the reinforcing material.
  • a 10 ⁇ m-thick transparent imide film (c1) was placed on the matrix resin, and a glass substrate was placed. Then, the matrix resin was impregnated with a reinforcing material through lamination. After thermal curing, the glass substrate was removed to prepare a laminated sheet having a thickness of 100 ⁇ m with a reinforcing material impregnated into the matrix.
  • Example 2 The same procedure as in Example 1 was carried out except that a transparent imide film (c1) having a thickness of 30 ⁇ m was used instead of the transparent imide film having a thickness of 10 ⁇ m.
  • Example 2 The same procedure as in Example 1 was carried out except that a polycarbonate film (c2) having a thickness of 30 ⁇ m was used instead of the transparent imide film having a thickness of 10 ⁇ m.
  • Example 2 The same procedure as in Example 1 was performed except that a 30 ⁇ m-thick polyethylene terephthalate film (c3) was used instead of a 10 ⁇ m-thick transparent imide film.
  • a matrix resin (a) was applied on the reinforcing material (b) to prepare a matrix (silicon FRP) impregnated with a reinforcing material having a thickness of 90 ⁇ m.
  • the laminated sheet having a thickness of 100 ⁇ m was prepared by applying and curing an acrylic curable resin (c4) to both surfaces of the matrix resin impregnated with the reinforcing material to form a buffer layer (c).
  • a flexible substrate for a display device was manufactured by forming a gas barrier layer (d) having a thickness of 100 nm using alternating silicon oxide and silicon nitride by sputtering on the laminated sheet.
  • a matrix resin (a) was applied on the reinforcing material. After placing the glass substrate on the matrix resin, the matrix resin was impregnated with the reinforcing material through lamination. After thermal curing, the glass substrate was removed to prepare a sheet having a thickness of 90 ⁇ m in which the matrix was impregnated with a reinforcing material.
  • a flexible substrate for a display device was manufactured by forming a gas barrier layer (d) having a thickness of 100 nm by alternately using silicon oxide and silicon nitride by sputtering on the sheet.
  • a matrix resin (a) was applied on the reinforcing material. After placing the glass substrate on the matrix resin, the matrix resin was impregnated with the reinforcing material through lamination. After thermal curing, the glass substrate was removed to prepare a sheet having a thickness of 90 ⁇ m in which the matrix was impregnated with a reinforcing material. Plasma treatment of the surface of the sheet was performed by coating a silicone rubber (c9) on both sides with a thickness of 5 ⁇ m and ultraviolet curing to form a buffer layer (c), thereby preparing a laminated sheet having a thickness of 100 ⁇ m.
  • a flexible substrate for a display device was manufactured by forming a gas barrier layer (d) having a thickness of 100 nm using alternating silicon oxide and silicon nitride by sputtering on the laminated sheet.
  • Moisture permeability (unit: g / m 2 / day): Measured using the ASTM F 1249 method using the MOCON equipment. The prepared specimens were cut to a size of 30 mm x 40 mm and then measured by inserting them into a jig having a central portion. Water vapor pressure at 25 ° C. was treated at 100% relative humidity.
  • Elastic modulus The modulus of the substrate was measured by applying a pressure of 1000 mN to the substrate prepared in Examples and Comparative Examples using Fischer MH500 Micro indentation equipment.
  • Examples 1 to 7 in which the high heat resistance and high flatness buffer layer according to the present invention are applied to the silicon matrix (silicon FRP) are excellent in moisture permeability, low thermal expansion coefficient, and surface roughness, and crack and peeling phenomenon. It can be seen that this does not occur.
  • Comparative Example 1 which does not use the buffer layer
  • Comparative Examples 2 to 4 which use the buffer layer whose elastic modulus and / or glass transition temperature is out of the range of the present invention, have a large surface roughness value, and crack and peeling phenomenon may occur to display devices. It can be seen that it is not suitable as a flexible substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

Un substrat flexible pour un élément d'affichage de la présente invention comprend : une matrice ; un élément de renforcement imprégné dans la matrice ; et une couche tampon formée sur au moins un côté de la matrice, un diamètre d'une barre ayant une fissure étant de 7 mm ou moins lors d'un essai de flexion par mandrin.
PCT/KR2013/006394 2012-08-17 2013-07-17 Substrat flexible pour élément d'affichage, son procédé de fabrication, et dispositif d'affichage l'utilisant WO2014027761A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0090247 2012-08-17
KR20120090247 2012-08-17

Publications (1)

Publication Number Publication Date
WO2014027761A1 true WO2014027761A1 (fr) 2014-02-20

Family

ID=50269292

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2013/006394 WO2014027761A1 (fr) 2012-08-17 2013-07-17 Substrat flexible pour élément d'affichage, son procédé de fabrication, et dispositif d'affichage l'utilisant

Country Status (2)

Country Link
KR (1) KR101669317B1 (fr)
WO (1) WO2014027761A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111430428A (zh) * 2020-04-10 2020-07-17 京东方科技集团股份有限公司 柔性显示面板及其制作方法、显示装置
US12016240B2 (en) 2016-10-17 2024-06-18 Samsung Display Co., Ltd. Display device and method of manufacturing the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160112600A (ko) * 2015-03-20 2016-09-28 동우 화인켐 주식회사 필름 터치 센서 및 이의 제조 방법
KR101862252B1 (ko) 2015-08-03 2018-05-29 주식회사 엘지화학 플렉시블 플라스틱 필름
KR102094450B1 (ko) 2015-08-03 2020-03-27 주식회사 엘지화학 플렉시블 플라스틱 필름
KR102107736B1 (ko) 2015-08-03 2020-05-07 주식회사 엘지화학 플렉시블 플라스틱 필름용 코팅 조성물
KR102185633B1 (ko) * 2018-01-18 2020-12-02 포항공과대학교 산학협력단 유연 기판, 이의 제조방법, 및 이를 포함하는 유연 전자 장치
KR102545950B1 (ko) 2018-07-12 2023-06-23 삼성디스플레이 주식회사 표시 장치
KR102176819B1 (ko) * 2019-04-08 2020-11-10 한국화학연구원 신축성 기판 및 이를 포함하는 신축성 인쇄 회로기판
KR20230036010A (ko) * 2021-09-06 2023-03-14 엘지이노텍 주식회사 탄성 부재 및 이를 포함하는 디스플레이 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060041696A (ko) * 2004-02-06 2006-05-12 주식회사 엘지화학 다층 플라스틱 기판 및 그 제조방법
KR20090074998A (ko) * 2008-01-03 2009-07-08 주식회사 엘지화학 치수 안정성과 가스차단 특성이 우수한 다층 구조의플라스틱 기판 및 그 제조방법
KR101097431B1 (ko) * 2009-04-28 2011-12-23 제일모직주식회사 디스플레이 패널용 플렉서블 기판 및 그 제조 방법
JP2012509212A (ja) * 2008-11-19 2012-04-19 エルジー・ケム・リミテッド 多層フィルム及びその製造方法
JP2012509213A (ja) * 2008-11-19 2012-04-19 エルジー・ケム・リミテッド 多層プラスチック基板及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060041696A (ko) * 2004-02-06 2006-05-12 주식회사 엘지화학 다층 플라스틱 기판 및 그 제조방법
KR20090074998A (ko) * 2008-01-03 2009-07-08 주식회사 엘지화학 치수 안정성과 가스차단 특성이 우수한 다층 구조의플라스틱 기판 및 그 제조방법
JP2012509212A (ja) * 2008-11-19 2012-04-19 エルジー・ケム・リミテッド 多層フィルム及びその製造方法
JP2012509213A (ja) * 2008-11-19 2012-04-19 エルジー・ケム・リミテッド 多層プラスチック基板及びその製造方法
KR101097431B1 (ko) * 2009-04-28 2011-12-23 제일모직주식회사 디스플레이 패널용 플렉서블 기판 및 그 제조 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12016240B2 (en) 2016-10-17 2024-06-18 Samsung Display Co., Ltd. Display device and method of manufacturing the same
CN111430428A (zh) * 2020-04-10 2020-07-17 京东方科技集团股份有限公司 柔性显示面板及其制作方法、显示装置
CN111430428B (zh) * 2020-04-10 2023-02-07 京东方科技集团股份有限公司 柔性显示面板及其制作方法、显示装置

Also Published As

Publication number Publication date
KR101669317B1 (ko) 2016-10-25
KR20140024216A (ko) 2014-02-28

Similar Documents

Publication Publication Date Title
WO2014027761A1 (fr) Substrat flexible pour élément d'affichage, son procédé de fabrication, et dispositif d'affichage l'utilisant
WO2013042938A2 (fr) Feuille composite, substrat pour élément d'affichage comprenant celle-ci et dispositif d'affichage comprenant celle-ci
WO2017082654A1 (fr) Empilement optique et dispositif d'affichage d'image le comprenant
WO2014163352A1 (fr) Substrat de capot en polyimide
WO2014168423A1 (fr) Substrat de couvercle en polyimide
WO2013062246A1 (fr) Film barrière contre les gaz contenant une couche de graphène, substrat flexible le contenant, et procédé de fabrication associé
WO2012157960A2 (fr) Substrat multicouche en plastique et son procédé de fabrication
WO2010058988A2 (fr) Substrat en plastique stratifié et son procédé de production
WO2014137065A1 (fr) Film antidiffusion présentant d'excellentes propriétés optiques et de résistance à la rayure et procédé pour la fabrication de celui-ci
WO2015076505A1 (fr) Électrode de détection tactile intégrée à une plaque de polarisation composite et panneau d'écran tactile la comportant.
WO2015080346A1 (fr) Composition adhésive, film adhésif formé à partir de cette dernière et dispositif d'affichage optique le comprenant
WO2017188683A1 (fr) Filtre coloré intégré à un capteur tactile et procédé de fabrication associé
WO2014204165A9 (fr) Plaque polarisante et dispositif d'affichage comprenant celle-ci
WO2018135865A1 (fr) Film de protection de partie inférieure de panneau delo, et appareil d'affichage électroluminescent organique le comprenant
WO2016021862A1 (fr) Fenêtre tactile
WO2016032157A1 (fr) Film antidiffusion et procédé de fabrication dudit film
WO2016093557A1 (fr) Capteur tactile à film et son procédé de fabrication
WO2018143594A1 (fr) Stratifié transparent
WO2016153192A1 (fr) Procédé et appareil de fabrication d'un capteur tactile à film
WO2016122116A1 (fr) Capteur tactile à film et son procédé de production
WO2017052177A1 (fr) Capteur de toucher de film et son procédé de fabrication
WO2019083246A2 (fr) Film optique, procédé de préparation de film optique et procédé de préparation de dispositif électronique électroluminescent organique
WO2012134032A1 (fr) Feuille composite et substrat pour un élément d'affichage l'utilisant
WO2015020336A1 (fr) Électrode de détection de toucher et panneau à écran tactile la comprenant
WO2020013660A1 (fr) Film adhésif à faible constante diélectrique pour écran tactile

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13879595

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13879595

Country of ref document: EP

Kind code of ref document: A1