WO2014013856A1 - Exposure apparatus, method of obtaining amount of regulation of object to be regulated, program, and method of manufacturing article - Google Patents
Exposure apparatus, method of obtaining amount of regulation of object to be regulated, program, and method of manufacturing article Download PDFInfo
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- WO2014013856A1 WO2014013856A1 PCT/JP2013/067963 JP2013067963W WO2014013856A1 WO 2014013856 A1 WO2014013856 A1 WO 2014013856A1 JP 2013067963 W JP2013067963 W JP 2013067963W WO 2014013856 A1 WO2014013856 A1 WO 2014013856A1
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- Prior art keywords
- regulation
- linear
- amount
- wavefront aberration
- variable
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
- G02B7/005—Motorised alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0012—Optical design, e.g. procedures, algorithms, optimisation routines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
Definitions
- the present invention relates to an
- An exposure apparatus which projects and transfers the pattern of a reticle (mask) onto a substrate by a projection optical system is employed to manufacture a semiconductor device using the
- the projection optical system is regulated upon a step of measuring the optical characteristic (aberration) , a step of
- optical characteristic to be regulated depend on the amount of regulation of each unit (for example, lenses which constitute the
- Japanese Patent Laid-Open No. 2005-268451 proposes a technique of determining (optimizing) the amount of regulation of each unit using linear programming or quadratic programming.
- Japanese Patent Laid-Open No. 2005-268451 discloses two methods for determining the amount of regulation of each unit, both of which pose the
- the first method uses quadratic programming.
- the amount of regulation which minimizes the quadratic optical characteristic for example, the (weighted) square sum of wavefront aberrations
- this method uses the quadratic optical characteristic as an objective function, and therefore does not guarantee a precise optimum solution.
- an amount for example, the square root of the (weighted) square sum of wavefront aberrations
- a linear expression which describes it as the weighted sum of the absolute values of wavefront aberration coefficients (Zernike coefficients)
- a variable indicating the upper limit value of the linear expression is defined as an objective function.
- the present invention provides, for example, a technique advantageous in obtaining an amount of regulation of an object included in a projection device of an exposure apparatus.
- an exposure apparatus which exposes a substrate to light through a reticle
- the apparatus including a projection device including an object whose at least one of a position, an attitude and a shape is regulatable, and configured to project light from the reticle onto the substrate, a regulating device configured to regulate the at least one of the position, the attitude and the shape of the object, and a controller configured to obtain an amount of
- the controller is configured, under a constraint including a linear equality and a plurality of linear
- each of the plurality of linear inequalities being linear with respect to the wavefront aberration coefficient and indicating that, in an orthogonal coordinate system having each coordinate axis that represents the wavefront aberration coefficient, a distance to one of each side and each face of corresponding one of a polygon and a polyhedron, with a center of gravity thereof at an origin of the orthogonal coordinate system, from the origin is not greater than a first variable, to obtain, by linear programming, the amount of regulation which minimizes an objective function, wherein the objective function is the first variable.
- FIG. 1 is a schematic perspective view showing the configuration of an exposure apparatus according to an aspect of the present invention.
- Fig. 2 is a view schematically illustrating an example of the direction (driving direction) in which a reticle, and optical elements included in a projection optical system, both of which have regulable positions, are movable in the exposure apparatus shown in Fig. 1.
- Fig. 3 is a flowchart for explaining how to regulate the projection optical system in the exposure apparatus shown in Fig. 1.
- Fig. 4 is a view showing the ranges of Pi h and 2 h which satisfy inequalities presented in
- Fig. 5 is a view showing the ranges of and ⁇ 2 ⁇ which satisfy a plurality of inequalities including relations (9) to (12).
- Fig. 6 is a view illustrating an example
- Fig. 7 is a view illustrating an example
- Fig. 8 is a flowchart for explaining how to regulate the projection optical system in the exposure apparatus shown in Fig. 1.
- Fig. 9 is a flowchart for explaining how to regulate the projection optical system in the exposure apparatus shown in Fig.
- Fig. 1 is a schematic perspective view showing the configuration of an exposure apparatus 1 according to an aspect of the present invention.
- the exposure apparatus 1 exposes a substrate to light through a reticle (mask) . More specifically, the exposure apparatus 1 exposes a substrate to light through a reticle using, for example, the step-and-scan scheme. However, the exposure apparatus 1 may adopt the step- and-repeat scheme or another exposure scheme.
- the exposure apparatus 1 includes an illumination optical system (not shown) , a reticle stage 20 which holds a reticle 10, a projection optical system 30, a substrate stage 50 which holds a substrate 40, laser interferometers 60a, 60b, and 60c, a
- measuring unit 70 a regulating unit 80, and a control unit 90.
- the illumination optical system illuminates the reticle 10 with light from a light source such as a KrF excimer laser having a wavelength of about 248 nm, an ArF excimer laser having a wavelength of about 193 nm, or an F2 laser having a wavelength of about 157 nm.
- a light source such as a KrF excimer laser having a wavelength of about 248 nm, an ArF excimer laser having a wavelength of about 193 nm, or an F2 laser having a wavelength of about 157 nm.
- the reticle 10 has a pattern (circuit pattern) to be transferred onto the substrate 40, and is held by the reticle stage 20. Light (diffracted light) diffracted by the pattern of the reticle 10 is projected onto the substrate 40 through the projection optical system 30.
- the reticle stage 20 includes, for example, a reticle chuck, and is moved by the regulating unit 80 upon holding the reticle 10.
- the regulating unit 80 is controlled by the control unit 90, and has a function of regulating at least one of the position and attitude of the reticle 10.
- the projection optical system 30 includes a plurality of optical elements (for example, a lens, mirror, and aperture stop) , and projects light from the reticle 10 onto the substrate 40.
- a plurality of optical elements for example, a lens, mirror, and aperture stop
- the projection optical system 30 has a position, attitude, and shape, at least one of which can be regulated by the regulating unit 80.
- the regulation of these optical elements by the regulating unit 80 is also controlled by the control unit 90.
- the regulating unit 80 regulates at least one of the position, attitude, and shape of each of some of the plurality of optical elements included in the projection optical system 30.
- the regulating unit 80 can include, for example, a mechanism which displaces the optical elements in the optical axis direction (the Z-direction shown in Fig. 1) or a direction perpendicular to the optical axis direction, a mechanism which tilts the optical elements with respect to the optical axis, and a mechanism which deforms the optical elements.
- the substrate 40 is a substrate onto which the pattern of the reticle 10 is transferred.
- the substrate 40 is coated with a resist (photosensitive agent) .
- the substrate 40 includes, for example, a silicon wafer, glass plate, and other substrates.
- the substrate stage 50 includes, for example,
- a substrate chuck for example, a substrate chuck, and is moved by the
- the regulating unit 80 upon holding the substrate 40.
- the regulating unit 80 is controlled by the control unit 90, and has a function of regulating at least one of the position and attitude of the substrate 40.
- the reticle stage 20, projection optical system 30, and substrate stage 50 constitute a projection unit in the exposure apparatus 1.
- the laser interferometers 60a, 60b, and 60c are arranged around the substrate stage 50, and measure the position of the substrate stage 50.
- the measuring unit 70 measures the optical characteristic in the exposure apparatus 1 and, especially, those of the projection optical system 30.
- the measuring unit 70 includes, for example, an interferometer, and has a function of measuring a wavefront aberration at each point (at each of a plurality of image heights) in the image plane
- the measuring unit 70 may also have a function of measuring a distortion as the aberration of the projection optical system 30.
- the distortion indicates the amount of deviation of the position of an actual image on the image plane from that of an ideal image, and can be measured at each point on the image plane (in the exposure region) . Since the measuring unit 70 can take any form known to those skilled in the art, its structure and operation will not be described in detail herein.
- the control unit 90 includes, for example, a CPU and memory, and can control the operation of each unit of the exposure apparatus 1.
- the control unit 90 can control, for example, the scan operations of the reticle stage 20 and substrate stage 50.
- the control unit 90 obtains (calculates) the amount of regulation of at least one of each optical element of the projection optical system 30, the reticle stage 20, and the substrate stage 50 by the regulating unit 80, using linear programming based on the measurement result obtained by the measuring unit 70.
- the control unit 90 controls the regulating unit 80 based on the amount of regulation obtained using linear programming. A method of obtaining the amount of regulation by the control unit 90 will be described in detail later.
- Fig. 2 is a view schematically illustrating an example of the direction (driving direction) in which the reticle 10, optical elements 302 and 304 included in the projection optical system 30, and the substrate 40 are movable.
- the position of the reticle 10 is regulated in six degrees of freedom (that is, degrees of freedom indicated by arrows x if y x , z lr ⁇ ⁇ ⁇ , co yl , and ⁇ ⁇ ⁇ ) through the regulating unit 80 and reticle stage 20.
- the position of the optical element 302 is similarly regulated in six degrees of freedom (that is, degrees of freedom indicated by arrows x 2 , y 2 , z 2 , ⁇ ⁇ 2 , G)y2, and ⁇ ⁇ 2 ) through the regulating unit 80.
- the position of the optical element 304 is similarly regulated in six degrees of freedom (that is, degrees of freedom indicated by arrows x 3 , y 3 , z 3 , ⁇ ⁇ 3 , ⁇ ⁇ 3 , and ⁇ ⁇ 3 ) through the regulating unit 80.
- the position of the substrate 40 is similarly regulated in six degrees of freedom (that is, degrees of freedom indicated by arrows x 4 , y , z 4 , ⁇ ⁇ 4 , co y4 , and ⁇ ⁇ 4 ) through the regulating unit 80 and substrate stage 50.
- FIG. 3 is a flowchart for
- control unit 90 executes overall control of each unit of the exposure apparatus 1, as described above.
- step S302 the aberration (wavefront aberration) of the projection .optical system 30 is measured through the measuring unit 70. More
- the wavefront aberration is measured for each of H measurement points (image heights) in the image plane (exposure region) of the projection optical system 30.
- step S304 the control unit 90 expands the wavefront aberration at an image height h, which is measured in step S302, using J (first to Jth) Zernike orthogonal functions to calculate each Zernike
- optical characteristic value represented by a linear expression for a Zernike coefficient which is exemplified by, for example, line width asymmetry, curvature of field, and astigmatism, can be obtained from the Zernike coefficient Zj h .
- the Zernike coefficient that is, the optical characteristic value can be represented by a linear function describing the amount of regulation of each object to be regulated (the reticle stage 20, substrate stage 50, and optical elements 302 and 304).
- an optical characteristic value (an optical characteristic value corresponding to the RMS of the wavefront aberration) expressed as the square root of the (weighted) square sum of the Zernike coefficients Zj h can be obtained from the Zernike coefficients Zj h .
- the square of the optical characteristic value can be represented by a quadratic function describing the amount of regulation of each object to be regulated (the reticle stage 20, substrate stage 50, and optical elements 302 and 304). Accordingly, in this embodiment, the optical
- first optical characteristic value will also be referred to as a quadratic optical characteristic value (first optical characteristic value) hereinafter.
- zojh is the initial value (measurement value) of the jth Zernike coefficient at the image height h
- x k is the kth amount of regulation of each object to be regulated
- bjhk is the degree of influence bj h k of the amount of regulation x k of each object to be regulated (the amount of change in Zernike coefficient Zj h per unit amount of x k ) .
- oij h is a coefficient (positive value) by which the Zernike coefficient Zj h is to be multiplied.
- the wavefront aberration rms h is the square root of the weighted square sum of the Zernike coefficients Zj h .
- all the weighting coefficients jh may be 1.
- Fig. 4 shows the ranges of i h and ⁇ 2h which satisfy inequalities presented in relations (9) to (12) . Also, when a plurality of values are set for Q m (0 ⁇ Q m ⁇ (n/2)) to increase the number of inequalities, the shape defined by the ranges of ⁇ 3 ⁇ 4 and p 2 h which satisfy these inequalities comes close to a circle, as shown in Fig. 5. Note that t 2 h in relations (9) to (12) is the distance from the origin to each side of a polygon (the length of a normal dropped from the origin to each side) in orthogonal coordinate systems shown in Figs. 4 and 5. In other words, satisfying inequalities
- the amount of regulation Xk which minimizes the objective function can be obtained using linear programming.
- the amount of regulation of each object to be regulated, which minimizes the wavefront aberration rms h can be obtained by linear programming.
- nested constraint expression or nested constraint expression
- the nested constraint expression may adopt either a ladder tournament structure as shown in Fig. 6 or a knockout tournament structure as shown in Fig. 7.
- constraints including polygon enclosure constraint expressions corresponding to relations (8) and (13) to
- the second dummy variables will also simply be referred to as second variables hereinafter.
- step S306 polygon enclosure constraint expressions (for example, relations (9) to (12)) are determined (defined) using the dummy variable t ⁇ h which defines the upper limit of the wavefront aberration rms h .
- a constraint for example, relations (9) to (12)
- coordinate axis for example, a polygon having its center of gravity at the origin. Note that a plurality of sides of the polygon are
- expressions can be a plurality of linear inequalities for a wavefront aberration coefficient indicating that the distance from the origin to each side or each face of a polygon or polyhedron having its center of gravity at the origin of an orthogonal coordinate system having a wavefront aberration coefficient on each coordinate axis is equal to or smaller than a first variable.
- step S308 it is determined whether the number J of ⁇ -j serving as a variable is larger than 2 (J > 2) . If the number J of ⁇ -jh is larger than 2, the process proceeds to step S310. However, if the number J of j h is equal to or smaller than 2, the process proceeds to step S312.
- step S310 nested constraint expressions
- characteristic value is expressed as the square root of the square sum of J (J > 2) Zernike coefficients. It is therefore necessary to obtain the amount of
- step S312 the amount of regulation of each object to be regulated (each unit) is obtained
- step S314 the regulating unit 80 is controlled based on the amount of regulation obtained in step S312. More specifically, the regulating unit 80 drives each object to be regulated in accordance with the amount of regulation obtained in step S312 to regulate the optical characteristic (quadratic optical characteristic value) of the exposure apparatus.
- characteristic value of the exposure apparatus is equal to or smaller than the upper limit value is '
- a light beam emitted by a light source illuminates the reticle 10 by an illumination optical system.
- the light which bears the information of the pattern of the reticle 10 forms an image on the substrate 40 by the projection optical system 30.
- the optical characteristic of the exposure apparatus can be regulated using the above-mentioned regulating method to attain excellent imaging performance.
- the exposure apparatus 1 is advantageous in terms of at least one of the
- w h is the allowable value (positive value) of the wavefront aberration rms h at each image height.
- a polygon enclosure constraint expression is determined (defined) using a dummy variable (to be also referred to as a third dummy variable or simply as a third variable hereinafter) indicating the upper limit of a wavefront aberration rmsi at a first image height.
- a polygon enclosure constraint expression is determined (defined) using a dummy variable (third dummy variable) indicating the upper limit of a wavefront aberration rms 2 at a second image height different from the first image height.
- step S308A it is determined whether the number J of jh serving as a variable is larger than 2 (J > 2) for the first image height. If the number J of Pjh is larger than 2, the process proceeds to step S310A, in which a nested constraint expression serving as a constraint is determined (defined) for the first image height. However, if the number J of 3j h is equal to or smaller than 2, the process proceeds to step S311A.
- step S308B it is determined whether the number J of ⁇ -jh serving as a variable is larger than 2 (J > 2) for the second image height. If the number J of is larger than 2, the process proceeds to step S310B, in which a nested constraint expression serving as a constraint is determined
- step S311B (defined) for the second image height. However, if the number J of 3j h is equal to or smaller than 2, the process proceeds to step S311B.
- step S311A the upper limit value (third dummy variable tji) of the wavefront aberration rmsi at the first image height is divided by its allowable value w x to normalize it, as described above.
- step S311B the upper limit value (third dummy variable t J2 ) of the wavefront aberration rms 2 at the second image height is divided by its allowable value w 2 to normalize it.
- the upper limit value t Jh (third dummy variable) of the wavefront aberration rms h (quadratic optical characteristic value) corresponding to each of a plurality of image heights is divided by the
- step S312 the amount of regulation of each object to be regulated (each unit) is obtained (determined) using linear programming, as described above. More specifically, a first dummy variable t (relation (17)) indicating the upper limit value (third dummy variable) normalized in steps S311A and S311B is defined as an objective function to obtain the amount of regulation of each object to be regulated, which minimizes the value of the objective function, using linear programming.
- the amount of regulation of each object to be regulated can be obtained so as to regulate the quadratic optical characteristic value of the exposure apparatus with good balance for each of a plurality of image heights.
- a first dummy variable indicating the upper limit of the quadratic optical characteristic value need only be used as a variable indicating the upper limit of the linear optical characteristic value as well, as shown in Fig. 9.
- the linear optical characteristic values of an exposure apparatus such as coma, curvature of field, astigmatism,
- a linear optical characteristic value (the value of the ith aberration at the image height h) y ih is expressed as the linear sum of Zernike coefficients as per:
- a ⁇ j is the degree of influence of the Zernike coefficient Zj h on the ith aberration.
- an expression for obtaining a linear optical characteristic value is determined (that is, a dummy variable corresponding to a linear optical
- step S324 the linear optical characteristic value determined in step S322 is divided by its allowable value to normalize it.
- step S312 the amount of regulation of each object to be regulated (each unit) is obtained
- a first dummy variable t indicating an upper limit value commonly of the values normalized in steps S311A, S311B, and S324 is defined as an objective function to obtain the amount of regulation of each object to be regulated, which minimizes the value of the objective function, using linear programming.
- the amount of regulation of each object to be regulated can be obtained so as to regulate the quadratic and linear optical characteristic values of the exposure apparatus (projection optical system 30) with good balance for each of a plurality of image heights .
- a method of manufacturing an article such as a device can include a step of forming a pattern on an object (for example, a substrate coated with a photoresist) using the above- mentioned exposure apparatus (a step of exposing an object to light) .
- the manufacturing method can also include a step of processing (for example, developing or etching) the object having the pattern formed on it in the forming step.
- the manufacturing method can moreover include subsequent known steps (for example, oxidation, film formation, vapor deposition, doping, planarization, etching, resist removal, dicing, bonding, and packaging) .
- the method of manufacturing an article according to this embodiment is more advantageous in terms of at least one of the performance, quality, productivity, and manufacturing cost of an article than the conventional method.
- aspects of the present invention can also be realized by a computer of a system or apparatus (or devices such as a CPU or MPU) that reads out and
- the steps of which are performed by a computer of a system or apparatus by, for example, reading out and executing a program recorded on a memory device to perform the functions of the above-described embodiments.
- the program is provided to the computer for example via a network or from a recording medium of various types serving as the memory device (for example, computer- readable medium) .
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/362,525 US9310695B2 (en) | 2012-07-19 | 2013-06-25 | Exposure apparatus, method of obtaining amount of regulation of object to be regulated, program, and method of manufacturing article |
| KR1020147028990A KR101679493B1 (en) | 2012-07-19 | 2013-06-25 | Exposure apparatus, method of obtaining an amount of regulation of an object included in an exposure apparatus, and method of manufacturing an article |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012160940A JP5969848B2 (en) | 2012-07-19 | 2012-07-19 | Exposure apparatus, method for obtaining adjustment amount for adjustment, program, and device manufacturing method |
| JP2012-160940 | 2012-07-19 |
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| WO2014013856A1 true WO2014013856A1 (en) | 2014-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/JP2013/067963 Ceased WO2014013856A1 (en) | 2012-07-19 | 2013-06-25 | Exposure apparatus, method of obtaining amount of regulation of object to be regulated, program, and method of manufacturing article |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9310695B2 (en) |
| JP (1) | JP5969848B2 (en) |
| KR (1) | KR101679493B1 (en) |
| WO (1) | WO2014013856A1 (en) |
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| US10261423B2 (en) | 2015-06-22 | 2019-04-16 | Asml Netherlands B.V. | Lithographic method and apparatus |
| US10324379B2 (en) | 2015-06-23 | 2019-06-18 | Asml Netherlands B.V. | Lithographic apparatus and method |
| TW201719572A (en) * | 2015-11-19 | 2017-06-01 | 國立交通大學 | 3D model analysis and search method |
| JP7515626B2 (en) * | 2020-06-10 | 2024-07-12 | エーエスエムエル ネザーランズ ビー.ブイ. | Aberration-affected systems, models, and manufacturing processes |
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2013
- 2013-06-25 US US14/362,525 patent/US9310695B2/en not_active Expired - Fee Related
- 2013-06-25 KR KR1020147028990A patent/KR101679493B1/en not_active Expired - Fee Related
- 2013-06-25 WO PCT/JP2013/067963 patent/WO2014013856A1/en not_active Ceased
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| JP2002367886A (en) * | 2001-06-06 | 2002-12-20 | Canon Inc | Exposure apparatus optimally adjusted by linear programming and adjustment method thereof |
| JP2007157824A (en) * | 2005-12-01 | 2007-06-21 | Nikon Corp | Imaging optical system evaluation method, imaging optical system adjustment method, exposure apparatus, exposure method, and device manufacturing method |
| JP2009105097A (en) * | 2007-10-19 | 2009-05-14 | Tokyo Univ Of Agriculture & Technology | Exposure apparatus and device manufacturing method |
| JP2010278034A (en) * | 2009-05-26 | 2010-12-09 | Canon Inc | Exposure apparatus and device manufacturing method |
| JP2011009575A (en) * | 2009-06-26 | 2011-01-13 | Canon Inc | Exposure device, adjusting method, and method of manufacturing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014022613A (en) | 2014-02-03 |
| KR101679493B1 (en) | 2016-12-06 |
| KR20140138965A (en) | 2014-12-04 |
| JP5969848B2 (en) | 2016-08-17 |
| US9310695B2 (en) | 2016-04-12 |
| US20140313499A1 (en) | 2014-10-23 |
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