WO2014000330A1 - 半导体制冷箱湿度调节方法及装置 - Google Patents

半导体制冷箱湿度调节方法及装置 Download PDF

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Publication number
WO2014000330A1
WO2014000330A1 PCT/CN2012/079139 CN2012079139W WO2014000330A1 WO 2014000330 A1 WO2014000330 A1 WO 2014000330A1 CN 2012079139 W CN2012079139 W CN 2012079139W WO 2014000330 A1 WO2014000330 A1 WO 2014000330A1
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Prior art keywords
humidity
box
refrigeration box
semiconductor refrigeration
controller
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PCT/CN2012/079139
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English (en)
French (fr)
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张中春
何伟儒
高俊岭
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广东富信电子科技有限公司
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Publication of WO2014000330A1 publication Critical patent/WO2014000330A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/042—Air treating means within refrigerated spaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/04—Treating air flowing to refrigeration compartments
    • F25D2317/041—Treating air flowing to refrigeration compartments by purification
    • F25D2317/0411—Treating air flowing to refrigeration compartments by purification by dehumidification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a dehumidification apparatus, and more particularly to a humidity adjustment method and apparatus for a semiconductor refrigeration box.
  • Another object of the present invention is to provide a method for humidity adjustment of a semiconductor refrigeration box capable of independent humidity control with constant temperature dehumidification.
  • the invention provides a semiconductor refrigeration box humidity adjusting device, which comprises a TEC installed in a refrigeration box, the TEC side is connected to a cold end heat exchanger disposed in the refrigeration box body, and the other side is connected to heat disposed outside the box body.
  • the end heat exchanger, the cold end heat exchanger is provided with an internal circulation fan
  • the box body is further provided with a temperature sensor inside the box and a humidity sensor inside the box, and a controller capable of regulating the working voltage of the TEC and the inner circulation fan, the box
  • the internal humidity sensor and the temperature sensor inside the box are connected to the controller.
  • the device can utilize the original refrigeration equipment of the refrigeration box, and then add a controller for the working voltage of the inner circulation fan to realize the constant temperature dehumidification function.
  • the semiconductor refrigeration box humidity conditioning device further includes a heat exchanger temperature sensor mounted on the cold junction heat exchanger.
  • the cold end heat exchanger is a cold fin, particularly a cold aluminum fin.
  • the heat exchanger temperature sensor is an NTC thermistor (NTC, Negative Temperature) Coefficient, negative temperature coefficient).
  • the controller has a refrigeration control circuit and uses PWM (PWM, Pulse Width). Modulation, pulse width modulation) controls the output voltage.
  • PWM Pulse Width
  • Modulation pulse width modulation
  • the output voltage of the cooling control circuit is connected to the TEC.
  • the control circuit is connected to the internal circulation fan control circuit, and the output voltage of the internal circulation fan control circuit is connected to the internal circulation fan.
  • the output voltage of the refrigeration control circuit is coupled to the TEC via a relay control circuit.
  • the invention also provides a semiconductor refrigeration box humidity adjusting method using the semiconductor refrigeration box humidity adjusting device, which comprises the following steps: (1) The relative humidity reference value ⁇ 0 is set in the controller. When the humidity sensor in the box detects the relative humidity value ⁇ ⁇ ⁇ 0, the dehumidification function is turned on, and the process proceeds to step (2); (2) The controller raises the TEC control voltage VTEC and adjusts the internal circulating fan operating voltage VFAN to 0, so that the cooling capacity of the TEC cooling is stored in the cold-end heat exchanger, and then proceeds to step (3) according to the set conditions. ; (3) The controller turns on the internal circulation fan, and raises its working voltage VFAN to complete rapid heat exchange dehumidification. At a fixed time t0, when ⁇ 0- ⁇ is detected, the dehumidification is ended; when the fixed time t0 ends, and the detection Go to ⁇ > ⁇ 0- ⁇ and return to step (1).
  • the setting condition of the entering step (3) in the step (2) may have various embodiments, one of which: the temperature reference value T0 is set in the controller, and the temperature value detected by the heat exchanger temperature sensor is T1 ⁇ T0, and proceeds to step (3).
  • the reference time t1 is set in the controller, and the step (3) is entered when the time t1 is reached. Where t1 is set according to actual needs, for example 2 minutes.
  • step (2) the controller raises the TEC operating voltage VTEC to 2/3 Vmax1 ⁇ Vmax1, where Vmax1 is the maximum value of VTEC.
  • step (3) the controller increases the internal circulating fan operating voltage VFAN to 1/2Vmax2 ⁇ Vmax2, where Vmax2 is the maximum value of VFAN.
  • the relative humidity value reference value ⁇ 0 ranges from 55% to 85%.
  • the relative humidity reference value ⁇ 0 allows a lower floating value ⁇ , and the lower floating value ⁇ of the relative humidity reference value ⁇ 0 ranges from 0% to 5%. In this way, the relative humidity in the box can be controlled within the reference range of 50% ⁇ 80%, which is in line with EU standards.
  • the relative humidity reference value ⁇ 0 takes a value of 75% or 70%, and the relative humidity value in the box is controlled to be 75% or less.
  • the fixed time reference value t0 ranges from 1 to 10 minutes.
  • the invention realizes the constant temperature dehumidification function by rapidly cooling, simultaneously stopping the operation of the cold end inner circulation fan, storing the cold quantity in the cold end heat exchanger, rapidly increasing the working voltage of the inner circulation fan, and performing rapid humidity adjustment, the control method No cooling loss, and constant temperature dehumidification, humidity can be adjusted separately.
  • the humidity sensor can monitor the humidity in the refrigeration box in real time. As long as the dehumidification condition is reached, the dehumidification mode is repeated immediately, thus solving the humidity in the refrigeration box that has long plagued people. Big technical problems.
  • the semiconductor refrigeration box humidity adjusting device of the invention can share the original refrigeration system in the refrigeration box, and no special dehumidifying device is added, and the relative humidity value of the closed space is quickly adjusted by adjusting the cooling capacity of the refrigeration system and the working state of the internal circulation fan.
  • the adjustment and no loss of cooling capacity, the device has a simple structure and low manufacturing cost.
  • the invention can also be applied to a cabinet which requires constant temperature dehumidification such as tea leaves and cigarettes.
  • FIG. 1 is a schematic structural view of a humidity conditioning device for a semiconductor refrigeration box according to the present invention
  • 2 is a schematic view showing a first embodiment of a control circuit of a humidity conditioning device for a semiconductor refrigeration box according to the present invention
  • 3 is a schematic view showing a second embodiment of a control circuit of a humidity conditioning device for a semiconductor refrigeration box according to the present invention
  • 4 is a schematic view showing a third embodiment of a control circuit of a humidity conditioning device for a semiconductor refrigeration box according to the present invention
  • 5 is a schematic view showing a fourth embodiment of a control circuit of a semiconductor refrigeration box humidity adjusting device according to the present invention
  • 6 is a flow chart of a method for adjusting humidity of a semiconductor refrigeration box according to the present invention.
  • the semiconductor refrigeration box humidity adjusting device of the present invention comprises a TEC and a controller chip 1 mounted on the refrigeration box 10, and the TEC side is connected to a cold end heat exchanger 2 disposed in the casing of the refrigeration box 10, and the other side Connecting the hot end heat exchanger 3 disposed outside the tank, the cold end heat exchanger 2 is provided with an inner circulation fan 4, and the cold end heat exchanger is connected with a heat exchanger temperature sensor, and the hot end heat exchanger 3 is provided with an external circulation fan 5, the box body is also provided with a temperature sensor inside the box and a humidity sensor inside the box, the controller can regulate the working voltage of the TEC and the inner circulation fan, the humidity sensor inside the box, the temperature sensor inside the box Both are connected to the controller.
  • the device can utilize the original refrigeration equipment of the refrigeration box, and then add a controller for the working voltage of the inner circulation fan to realize the constant temperature dehumidification function.
  • the cold end heat exchanger is a cold aluminum fin, and the heat exchanger temperature sensor is an NTC thermistor.
  • the controller has a cooling control circuit, which uses PWM to control the output voltage.
  • the output voltage of the cooling control circuit is connected to the TEC.
  • the control circuit is connected to the internal circulating fan control circuit and the output of the internal circulating fan control circuit.
  • the voltage is connected to the inner circulation fan, thereby realizing the control of the operating voltage of the inner circulation fan by the controller.
  • the output voltage of the refrigeration control circuit is connected to the refrigerator TEC through a relay control circuit, and a relay cold-heat converter is provided to realize the conversion of cooling and heating.
  • the controller controls the humidity sensor, the temperature sensor, the display, and the illumination through the humidity sensor control circuit, the temperature sensor control circuit, the display control circuit, and the illumination control circuit, respectively.
  • the refrigeration control circuit is connected to the power supply via the switching power supply control circuit.
  • the second embodiment is based on the first embodiment, and the switching power supply circuit is integrated with the controller of the first embodiment, which is more space-saving.
  • the third embodiment is based on the first embodiment, and the output voltage of the refrigeration control circuit is directly connected to the chiller TEC, so that the relay and its control circuit can be removed, and the structure is simpler and the cost is lower.
  • the fourth embodiment is based on the third embodiment, and the switching power supply circuit is integrated with the controller of the third embodiment, which is more space-saving.
  • the present invention further provides a semiconductor refrigeration box humidity adjustment method using the semiconductor refrigeration box humidity adjusting device.
  • the semiconductor refrigeration box humidity adjustment method comprises the following steps: (1) Power on, when the humidity sensor in the box detects the relative humidity value ⁇ 0, the normal cooling mode is performed, ⁇ 0, the dehumidification function is turned on, and the step (2) is entered; (2) The controller adjusts the TEC to full-power cooling, and adjusts the internal circulating fan operating voltage VFAN to 0, so that the cooling capacity of the TEC cooling is stored in the cold-end heat exchanger, and the temperature is detected according to the heat exchanger temperature sensor.
  • the value T1 determines that when T1 ⁇ T0 proceeds to step (3), when T1 > T0 repeats step (2); (3)
  • the controller turns on the internal circulation fan, raises its working voltage VFAN, and simultaneously cools at full power, completes rapid heat exchange dehumidification, and simultaneously counts the working time of the inner circulation fan, and ends when ⁇ 0- ⁇ is detected. Dehumidification, otherwise judged according to the working time of the inner circulation fan.
  • ⁇ > ⁇ 0- ⁇ returns to step (1), and the inner circulation fan working time is cleared.
  • the invention can also be applied to a cabinet which requires constant temperature dehumidification such as tea leaves and cigarettes.

Abstract

一种半导体制冷箱湿度调节装置，包括安装在制冷箱（10）的TEC（1），该TEC（1）一侧连接设置在制冷箱（10）箱体内的冷端换热器（2），另一侧连接设置在箱体外的热端换热器（3），该冷端换热器（2）上设有内循环风扇（4），箱体内还设有箱内温度感应器和箱内湿度感应器，以及可调控TEC（1）和内循环风扇（4）工作电压的控制器，箱内湿度感应器、箱内温度感应器均与控制器连接。该装置可以利用制冷箱（10）原有的制冷设备，再加设内循环风扇（4）工作电压的控制器，来实现恒温除湿功能。还提供一种半导体制冷箱湿度调节方法，通过快速制冷，同时停止冷端内循环风扇工作，将冷量储存在冷端换热器（2）中，再迅速提升内循环风扇（4）工作电压，进行快速湿度调节，来实现恒温除湿功能。该控制方法无冷量损失，可单独调节湿度，可实时监控制冷箱内的相对湿度值。该装置结构简单，制造成本低。

Description

半导体制冷箱湿度调节方法及装置
【技术领域】
本发明涉及一种除湿设备，尤其是指半导体制冷箱的湿度调节方法及其装置。
【背景技术】
随着科技的发展，很多储藏红酒的红酒柜都采用半导体红酒柜，这种红酒柜是一种采用TEC (Thermoelectric Cooler，半导体致冷器)制冷技术的制冷箱，箱体里面需要保持一定的温度和湿度，一般技术只是对制冷箱内的温度进行控制，借着制冷带来的干燥效果来使箱体内达到一定的湿度要求，但是这种只控制温度的情况，箱内湿度不可控，往往难以达到想要的湿度要求，长久使用的制冷箱经常会遇到湿气内渗，或因开门时候带来的温度变化和带入一定量湿气，使得箱体内湿气上升，箱体内壁、箱内物品表面都可能带有凝露，使得箱体内物品变质受到损害，例如红酒的酒感变味，起不到保质作用，如果红酒储藏在里面时间久了，会因为湿度的原因，造成红酒商标发霉、发黑，甚至霉烂而脱落，最后致使整个酒柜的红酒商标烂掉，酒感变味，使红酒失去了它原有的价值，几千甚至几万一瓶的红酒也被毁坏，甚为可惜。
因此，提供一种恒温除湿的可进行独立湿度控制的半导体制冷箱湿度调节方法及装置实为必要。
【发明内容】
本发明的目的在于提供一种可进行独立湿度控制的半导体制冷箱湿度调节装置。
本发明的另一目的在于提供一种恒温除湿的可进行独立湿度控制的半导体制冷箱湿度调节方法。
为实现本发明目的，提供以下技术方案：
本发明提供一种半导体制冷箱湿度调节装置，其包括安装在制冷箱的TEC，该TEC一侧连接设置在制冷箱箱体内的冷端换热器，另一侧连接设置在箱体外的热端换热器，该冷端换热器上设有内循环风扇，箱体内还设有箱内温度感应器和箱内湿度感应器，以及可调控TEC和内循环风扇工作电压的控制器，箱内湿度感应器、箱内温度感应器均与控制器连接。该装置可以利用制冷箱原有的制冷设备，再加设内循环风扇工作电压的控制器，来实现恒温除湿功能。
一些实施方式中，该半导体制冷箱湿度调节装置进一步包括安装在冷端换热器上的换热器温度感应器。
一些实施方式中，该冷端换热器为冷翅片，特别是冷铝翅片。
一些实施方式中，该换热器温度感应器为NTC热敏电阻（NTC，Negative Temperature Coefficient，负温度系数）。
一些实施方式中，该控制器内设制冷控制电路，采用PWM(PWM，Pulse Width Modulation，脉宽调制)控制输出电压，制冷控制电路的输出电压连接TEC，该控制电路连接内循环风扇控制电路，内循环风扇控制电路的输出电压连接内循环风扇。
一些实施方式中，该制冷控制电路的输出电压通过继电器控制电路连接TEC。
本发明还提供一种采用所述半导体制冷箱湿度调节装置的半导体制冷箱湿度调节方法，其包括如下步骤：
（1）控制器内设定有相对湿度参考值Ф0，当箱内湿度感应器检测到相对湿度值Ф≥Ф0时，开启除湿功能，进入步骤（2）；
（2）控制器将TEC控制电压VTEC升高，同时将内循环风扇工作电压VFAN调为0，使TEC制冷的冷量储存在冷端换热器中，然后根据设定条件进入步骤（3）；
（3）控制器开启内循环风扇，将其工作电压VFAN调高，完成迅速换热除湿，在固定时间t0内，当检测到Ф≤Ф0-ΔΦ时结束除湿；当固定时间t0结束，且检测到Φ>Ф0-ΔΦ则返回步骤（1）。
步骤（2）中所述进入步骤（3）的设定条件可以有多种实施方式，其中一种：控制器内设定有温度参考值T0，当换热器温度感应器检测到的温度值T1≤T0，进入步骤（3）。另一种实施方式：控制器内设定参考时间t1，到达时间t1时进入步骤（3）。其中t1根据实际需要而设定，例如2分钟。
一些实施方式中，在步骤（2），控制器将TEC工作电压VTEC升高至2/3Vmax1~Vmax1，其中Vmax1为VTEC的最大值。
一些实施方式中，在步骤（3），控制器将内循环风扇工作电压VFAN调高至1/2Vmax2~Vmax2，其中Vmax2为VFAN的最大值。
一些实施方式中，该相对湿度值参考值Ф0取值范围在55%~85%。
一些实施方式中，该相对湿度参考值Ф0允许有下浮动值ΔФ，相对湿度参考值Ф0的下浮动值ΔФ取值范围在0%~5%。这样就可以将箱内相对湿度控制在50%~80%的参考值范围，较为符合欧盟标准。优选的，该相对湿度参考值Ф0取值75%或70%，将箱内相对湿度值控制在75%或70%以下。
一些实施方式中，该温度参考值T0，取值范围在-5℃~5℃。优选的，该温度参考值T0=0℃。
一些实施方式中，步骤（3）中，该固定时间参考值t0取值范围为1～10分钟。
对比现有技术，本发明具有以下优点：
本发明通过快速制冷，同时停止冷端内循环风扇工作，将冷量储存在冷端换热器中，再迅速提升内循环风扇工作电压，进行快速湿度调节，来实现恒温除湿功能，该控制方法无冷量损失，并且恒温除湿，可单独调节湿度，通过湿度感应器可实时监控制冷箱内的湿度，只要达到除湿条件，马上重复除湿模式，从而解决了长期以来困扰人们的制冷箱内湿度过大的技术难题。本发明的半导体制冷箱湿度调节装置可共用制冷箱内原来的制冷系统，不用再另外加专门的除湿装置，通过调节制冷系统的制冷量和内循环风扇的工作状态完成密闭空间相对湿度值的迅速调节，且无冷量损失，该装置结构简单、制造成本低。本发明还可以用于茶叶、香烟等需要恒温除湿的柜体。
【附图说明】
图1为本发明半导体制冷箱湿度调节装置的结构示意图；
图2为本发明半导体制冷箱湿度调节装置的控制电路实施例一示意图；
图3为本发明半导体制冷箱湿度调节装置的控制电路实施例二示意图；
图4为本发明半导体制冷箱湿度调节装置的控制电路实施例三示意图；
图5为本发明半导体制冷箱湿度调节装置的控制电路实施例四示意图；
图6为本发明半导体制冷箱湿度调节方法的流程图。
【具体实施方式】
请参阅图1，本发明半导体制冷箱湿度调节装置包括安装在制冷箱10的TEC及控制器芯片1，该TEC一侧连接设置在制冷箱10箱体内的冷端换热器2，另一侧连接设置在箱体外的热端换热器3，该冷端换热器2上设有内循环风扇4，以及冷端换热器上连接有换热器温度感应器，热端换热器3上设有外循环风扇5，箱体内还设有箱内温度感应器和箱内湿度感应器，控制器可调控TEC和内循环风扇的工作电压，箱内湿度感应器、箱内温度感应器均与控制器连接。该装置可以利用制冷箱原有的制冷设备，再加设内循环风扇工作电压的控制器，来实现恒温除湿功能。
该冷端换热器为冷铝翅片，该换热器温度感应器为NTC热敏电阻。
请一并参阅图2~5，该控制器内设制冷控制电路，采用PWM控制输出电压，制冷控制电路的输出电压连接TEC，该控制电路连接内循环风扇控制电路，内循环风扇控制电路的输出电压连接内循环风扇，从而实现控制器对内循环风扇的工作电压的控制。
如图2所示，该制冷控制电路的输出电压通过继电器控制电路连接制冷器TEC，并设置继电器冷热转换器来实现制冷与制热的转换。控制器通过湿度感应器控制电路、温度感应器控制电路、显示器控制电路、照明控制电路分别控制湿度感应器、温度感应器、显示器、照明。其中制冷控制电路经开关电源控制电路接电源。
请参阅图3，实施例二是在实施例一的基础上，将开关电源电路与实施例一所述的控制器整合在一起，这样更节省空间。
请参阅图4，实施例三是在实施例一的基础上，将制冷控制电路的输出电压直接连接制冷器TEC，这样可以将继电器及其控制电路去掉，结构更简单，成本更低。
请参阅图5，实施例四是在实施例三的基础上，将开关电源电路与实施例三所述的控制器整合在一起，这样更节省空间。
请参阅图6，本发明还提供一种采用所述半导体制冷箱湿度调节装置的半导体制冷箱湿度调节方法，在本实施例中，控制器内设定有相对湿度值参考值Ф0=75%，T0=0℃，ΔΦ=5%，内循环风扇工作时间t0=5分钟，该半导体制冷箱湿度调节方法包括如下步骤：
（1）通电，当箱内湿度感应器检测到相对湿度值Ф<Ф0时，进行正常制冷模式，Ф≥Ф0时，开启除湿功能，进入步骤（2）；
（2）控制器将TEC调至全功率制冷，同时将内循环风扇工作电压VFAN调为0，使TEC制冷的冷量储存在冷端换热器中，根据换热器温度感应器检测到温度值T1判断，当T1≤T0进入步骤（3），当T1>T0重复步骤（2）；
（3）控制器开启内循环风扇，将其工作电压VFAN调高，同时全功率制冷，完成迅速换热除湿，同时对内循环风扇工作时间进行计时，期间当检测到Ф≤Ф0-ΔΦ时结束除湿，否则根据内循环风扇工作时间进行判断，当内循环风扇工作时间达到t0时，Φ>Ф0-ΔΦ则返回步骤（1），同时将内循环风扇工作时间清零。
本发明还可以用于茶叶、香烟等需要恒温除湿的柜体。
以上所述仅为本发明的较佳实施例，本发明的保护范围并不局限于此，任何基于本发明技术方案上的等效变换均属于本发明保护范围之内。

Claims (16)

  1. 一种半导体制冷箱湿度调节装置，其包括安装在制冷箱的TEC，该TEC一侧连接设置在制冷箱箱体内的冷端换热器，另一侧连接设置在箱体外的热端换热器，该冷端换热器上或周边设有内循环风扇，箱体内还设有箱内温度感应器，其特征在于，其进一步包括设置在箱体内的箱内湿度感应器，以及可调控TEC和内循环风扇工作电压的控制器，箱内湿度感应器、箱内温度感应器均与控制器连接。
  2. 如权利要求1所述的半导体制冷箱湿度调节装置，其特征在于，其进一步包括安装在冷端换热器上的换热器温度感应器。
  3. 如权利要求2所述的半导体制冷箱湿度调节装置，其特征在于，该冷端换热器为冷翅片。
  4. 如权利要求3所述的半导体制冷箱湿度调节装置，其特征在于，该换热器温度感应器为NTC热敏电阻。
  5. 如权利要求1所述的半导体制冷箱湿度调节装置，其特征在于，该控制器内设的制冷控制电路采用PWM控制输出电压，制冷控制电路的输出电压连接TEC，该控制电路连接内循环风扇控制电路，内循环风扇控制电路的输出电压连接内循环风扇。
  6. 一种采用如权利要求1~5任一项所述半导体制冷箱湿度调节装置的半导体制冷箱湿度调节方法，其特征在于，其包括如下步骤：
    （1）控制器内设定有相对湿度参考值Ф0，当箱内湿度感应器检测到相对湿度值Ф≥Ф0时，开启除湿功能，进入步骤（2）;
    （2）控制器将TEC控制电压VTEC升高，同时将内循环风扇工作电压VFAN调为0，使TEC制冷的冷量储存在冷端换热器中，然后根据设定条件进入步骤（3）；
    （3）控制器开启内循环风扇，将其工作电压VFAN调高，完成迅速换热除湿，在固定时间t0内，当检测到Ф≤Ф0-ΔΦ时结束除湿；当固定时间t0结束，且检测到Φ>Ф0-ΔΦ则返回步骤（1）。
  7. 如权利要求6所述的半导体制冷箱湿度调节方法，其特征在于，步骤（2）中，控制器内设定有温度参考值T0，当换热器温度感应器检测到的温度值T1≤T0时，进入步骤（3）。
  8. 如权利要求6所述的半导体制冷箱湿度调节方法，其特征在于，步骤（2）中，控制器内设定参考时间t1，到达时间t1时进入步骤（3）。
  9. 如权利要求6所述的半导体制冷箱湿度调节方法，其特征在于，步骤（2）中，控制器将TEC工作电压VTEC升高至2/3Vmax1~Vmax1，其中Vmax1为VTEC的最大值。
  10. 如权利要求6所述的半导体制冷箱湿度调节方法，其特征在于，步骤（3）中，控制器将内循环风扇工作电压VFAN调高至1/2Vmax2~Vmax2，其中Vmax2为VFAN的最大值。
  11. 如权利要求6所述的半导体制冷箱湿度调节方法，其特征在于，该相对湿度参考值Ф0取值范围在55%~85%。
  12. 如权利要求6所述的半导体制冷箱湿度调节方法，其特征在于，该相对湿度参考值Ф0的下浮动值ΔФ取值范围在0%~5%。
  13. 如权利要求11所述的半导体制冷箱湿度调节方法，其特征在于，该相对湿度参考值Ф0取值75%或70%。
  14. 14、如权利要求7所述的半导体制冷箱湿度调节方法，其特征在于，该温度参考值T0，取值范围在-5℃~5℃。
  15. 如权利要求7所述的半导体制冷箱湿度调节方法，其特征在于，该温度参考值T0=0℃。
  16. 如权利要求6所述的半导体制冷箱湿度调节方法，其特征在于，该固定时间t0取值范围为1～10分钟。
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