WO2013185628A1 - 一种通过音频接口进行音频信号上行的装置和方法 - Google Patents
一种通过音频接口进行音频信号上行的装置和方法 Download PDFInfo
- Publication number
- WO2013185628A1 WO2013185628A1 PCT/CN2013/077224 CN2013077224W WO2013185628A1 WO 2013185628 A1 WO2013185628 A1 WO 2013185628A1 CN 2013077224 W CN2013077224 W CN 2013077224W WO 2013185628 A1 WO2013185628 A1 WO 2013185628A1
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- WO
- WIPO (PCT)
- Prior art keywords
- audio
- pin
- circuit
- uplink signal
- generating device
- Prior art date
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- 230000005236 sound signal Effects 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000011144 upstream manufacturing Methods 0.000 claims description 10
- 230000002238 attenuated effect Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 description 43
- 230000005540 biological transmission Effects 0.000 description 20
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/16—Sound input; Sound output
- G06F3/162—Interface to dedicated audio devices, e.g. audio drivers, interface to CODECs
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2420/00—Details of connection covered by H04R, not provided for in its groups
- H04R2420/03—Connection circuits to selectively connect loudspeakers or headphones to amplifiers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2420/00—Details of connection covered by H04R, not provided for in its groups
- H04R2420/09—Applications of special connectors, e.g. USB, XLR, in loudspeakers, microphones or headphones
Definitions
- the present invention relates to the field of electronic technologies, and in particular, to an apparatus and method for uplinking an audio signal through an audio interface. Background technique
- the existing audio interface generally includes an audio output pin AUDIO, a ground pin GND, and a microphone pin MIC.
- the audio output pin AUDIO generally includes a left channel pin and/or a right channel pin, usually four segments.
- the third pin and the fourth pin of the audio interface, the first pin and the second pin of the audio interface exist in two types, one is that the first pin is the microphone pin MIC, and the second pin is ground. Pin GND, the other is the first pin is the ground pin GND, and the second pin is the microphone pin MIC.
- the audio downlink signal is transmitted through the audio output pin AUDIO, and one or two of the left channel pin and the right channel pin can be used, and the audio uplink signal passes through the microphone pin MIC. Transfer.
- the first pin and the second pin of the existing audio interface cannot obtain their line order when not measured, the first pin and the second pin of the audio interface are required when transmitting the audio uplink signal.
- the line sequence is measured to obtain the microphone pin MIC for audio uplink signal transmission, and the measurement of the line order of the audio interface requires an extra workload and is not convenient to use.
- the present invention aims to solve at least one of the above technical problems.
- an object of the present invention to provide an apparatus for performing audio signal uplink through an audio interface. Another object of the present invention is to provide a method for uplinking an audio signal through an audio interface.
- an embodiment of the first aspect of the present invention provides a device for uplinking an audio signal through an audio interface, where a first pin of the audio interface is connected to an audio uplink signal generating device through a first circuit; The two pins are connected to the audio uplink signal generating device through a second circuit; the first circuit and the second circuit are mutually attenuating circuits.
- the first pin of the audio interface is one of a microphone pin or a ground pin; and the second pin of the audio interface is the other of the microphone pin or the ground pin.
- the first circuit uses a filter circuit or a voltage dividing circuit; and the second circuit uses a filter circuit or a voltage dividing circuit. Furthermore, the first circuit and the second circuit are mutually symmetric attenuation circuits.
- first circuit and the second circuit are mutually asymmetric attenuation circuits.
- the embodiment of the first aspect of the present invention provides a method for uplinking an audio signal through an audio interface, and connecting a first pin of the audio interface to an audio uplink signal generating device through a first circuit; and a second pin of the audio interface Connected to the audio uplink signal generating device by a second circuit, wherein the first circuit and the second circuit are mutually attenuating circuits.
- the first pin of the audio interface is one of a microphone pin or a ground pin; and the second pin of the audio interface is the other of the microphone pin or the ground pin.
- the first circuit uses a filter circuit or a voltage dividing circuit; and the second circuit uses a filter circuit or a voltage dividing circuit.
- first circuit and the second circuit are symmetrically attenuated with each other.
- first circuit and the second circuit are asymmetrically attenuated with each other.
- An apparatus and method for performing audio signal uplink through an audio interface wherein the first pin and the second pin of the audio interface are attenuated to each other and connected to an audio uplink signal generating device, and the amplitude of the audio uplink signal can be The value becomes smaller, so that the first pin and the second pin of the audio interface can receive the audio uplink signal sent by the audio uplink signal generating device, so that the first pin and the second pin line of the audio interface are unclear.
- the audio uplink signal can also be transmitted.
- Figure 1 is a first schematic illustration of an embodiment 1 of an apparatus for performing audio signal uplink through an audio interface in accordance with the present invention
- FIG. 2 is a schematic view showing a second configuration of an apparatus embodiment 1 for performing audio signal uplink through an audio interface according to the present invention
- Embodiment 3 is a third structural diagram of Embodiment 1 of an apparatus for performing audio signal uplink through an audio interface according to the present invention
- Figure 4 is a fourth structural diagram of an apparatus embodiment 1 for performing audio signal uplink through an audio interface according to the present invention.
- Embodiment 5 is a fifth schematic structural diagram of Embodiment 1 of an apparatus for performing audio signal uplink through an audio interface according to the present invention
- 6 is a first schematic structural diagram of Embodiment 2 of an apparatus for performing audio signal uplink through an audio interface according to the present invention
- Figure 7 is a diagram showing a second configuration of an apparatus embodiment 2 for performing audio signal uplink through an audio interface according to the present invention.
- Figure 8 is a first schematic illustration of an embodiment 3 of an apparatus for performing audio signal uplink through an audio interface in accordance with the present invention
- Figure 9 is a schematic illustration of a second configuration of an apparatus embodiment 3 for performing audio signal uplink through an audio interface in accordance with the present invention. detailed description
- first”, second and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
- first, second, etc. are used for descriptive purposes only, and are not to be construed as indicating or implying relative importance or quantity or position, further, “first pin”, “second pin” only It is a distinction between pins and is not used to limit the position of the pins.
- connection and “connected” are to be understood broadly, and may be, for example, a fixed connection, a detachable connection, or an integral, unless otherwise specifically defined and defined.
- Ground connection can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium.
- multiple means two or more unless otherwise stated.
- an apparatus for performing audio signal uplink through an audio interface includes: an audio interface, a first circuit, and a second circuit.
- the audio interface transmits the audio uplink signal sent by the audio uplink signal generating device through the microphone pin MIC. Since the line order of the audio interface microphone pin MIC and the ground pin GND is unknown, that is, the first pin of the audio interface For one of the microphone pin MIC and the ground pin GND, the second pin is the other of the microphone pin MIC and the ground pin GND.
- the first pin of the audio interface is connected to the audio uplink signal generating device through the first circuit; the second pin of the audio interface is connected to the audio uplink signal generating device through the second circuit.
- the first circuit and the second circuit are mutually attenuating circuits.
- the first pin or the second pin of the audio interface needs to form a loop with the audio uplink signal generating device.
- the first pin of the audio interface is connected to the signal end or the ground end of the audio uplink signal generating device through the first conducting device, and the second pin is connected to the audio uplink signal through the second conducting device.
- the other port of the audio upstream signal generating means is used as the reference level of the signal output terminal of the audio interface in this embodiment.
- the other port includes a signal terminal or ground.
- the audio interface is connected to the audio uplink signal receiving device, and the audio device third pin is used as the reference level of the first pin and/or the second pin of the audio interface in this embodiment.
- the other port of the audio upstream signal generating means is used as the reference level of the signal output terminal of the audio interface in this embodiment.
- the other port includes a signal terminal or ground.
- the attenuation circuit can adopt a voltage dividing circuit as shown in FIG. 4. Referring to FIG. 4, the first pin of the audio interface is connected to the audio uplink signal generating device through the first resistor R1 and the second resistor R2; the second pin of the audio interface passes The third resistor R3 and the second resistor R2 are connected to the audio uplink signal generating device.
- the DC audio uplink signal sent by the audio uplink signal generating device passes through the partial voltage of the first resistor R1 and the second resistor R2, so that The amplitude of the signal of the audio uplink signal sent by the audio uplink signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the first pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the DC audio uplink signal sent by the audio uplink signal generating device is divided by the third resistor R3 and the second resistor R2, so that The amplitude of the signal of the audio uplink signal sent by the audio uplink signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the second pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the attenuation circuit can also adopt a voltage dividing circuit as shown in FIG. 5. Referring to FIG. 5, the first pin of the audio interface is connected to the audio uplink signal generating device through the first capacitor C1 and the second capacitor C2; the second pin of the audio interface The audio uplink signal generating device is connected through the third capacitor C3 and the second capacitor C2.
- the audio upstream signal sent by the audio uplink signal generating device passes through the partial voltage of the first capacitor C1 and the second capacitor C2, so that The amplitude of the signal of the audio uplink signal sent by the audio uplink signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the first pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the audio upstream signal sent by the audio uplink signal generating device passes through the partial voltage of the third capacitor C3 and the second capacitor C2, so that The amplitude of the signal of the audio uplink signal sent by the audio uplink signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the second pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the voltage dividing circuit used in the present invention may be a symmetrical circuit, that is, the resistances of the first resistor R1 and the third resistor R3 are equivalent, and the capacitances of the first capacitor C1 and the third capacitor C3 are equivalent; the voltage dividing circuit used in the present invention It is also possible to be an asymmetrical circuit, that is, the resistances of the first resistor R1 and the third resistor R3 are not equal, and the capacitances of the first capacitor C1 and the third capacitor C3 may be unequal.
- the voltage dividing circuit employed in the present invention is not limited to the resistor and capacitor circuits shown in this embodiment, and any symmetrical circuit or asymmetric circuit capable of achieving the purpose of attenuation is within the scope of the present invention.
- Embodiment 1 The difference between this embodiment and Embodiment 1 is that the attenuation circuit uses a filter circuit.
- the attenuation circuit can adopt the filter circuit as shown in FIG. 6.
- the first pin of the audio interface is connected to the audio uplink signal generating device through the first resistor R1 and the first capacitor C1; the second pin of the audio interface
- the audio uplink signal generating means is connected through the second resistor R2 and the first capacitor C1.
- the audio uplink signal sent by the audio uplink signal generating device is filtered by the first resistor R1 and the first capacitor C1 of the filter circuit, so that the audio is made.
- the amplitude of the signal of the audio uplink signal sent by the uplink signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the first pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the audio uplink signal occurs.
- the audio uplink signal sent by the device is filtered by the second resistor R2 and the first capacitor CI, so that the amplitude of the signal of the audio uplink signal sent by the audio uplink signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the second pin. That is, the microphone pin MIC realizes the uplink transmission of the audio signal.
- the uplink transmission of the audio signal can be realized by the attenuating circuit of the embodiment.
- the attenuation circuit can also adopt a filter circuit as shown in FIG. 7. Referring to FIG. 7, the first pin of the audio interface is connected to the audio uplink signal generating device through the first capacitor C1 and the first resistor R1; the second pin of the audio interface passes The second capacitor C2 and the first resistor R1 are connected to the audio uplink signal generating means.
- the audio uplink signal sent by the audio uplink signal generating device is filtered by the first capacitor C1 and the first resistor R1, so that the audio uplink signal
- the amplitude of the signal of the audio uplink signal sent by the generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the first pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the audio uplink signal sent by the audio uplink signal generating device is filtered by the second capacitor C2 and the first resistor R1, so that the audio uplink signal
- the amplitude of the signal of the audio uplink signal sent by the generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the second pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the filter circuit used in the present invention may be a symmetric circuit, that is, the resistances of the first resistor R1 and the second resistor R2 are equivalent, and the capacitances of the first capacitor C1 and the second capacitor C2 are equivalent; the filter circuit used in the present invention may also be For the asymmetric circuit, that is, the resistances of the first resistor R1 and the second resistor R2 are not equal, and the capacitances of the first capacitor C1 and the second capacitor C2 may be unequal.
- the embodiment should also be such that the audio interface and the audio uplink signal generating device form a loop to ensure that the audio uplink signal generating device can normally send the audio uplink signal.
- the filter circuit employed in the present invention is not limited to the resistor and capacitor circuits shown in this embodiment, and any symmetrical circuit or asymmetric circuit capable of achieving the purpose of attenuation is within the scope of the present invention.
- Example 3
- the attenuation circuit adopts a combination of a filter circuit and a voltage dividing circuit.
- the attenuation circuit can be implemented by combining the filter circuit and the voltage dividing circuit as shown in FIG. 8. Referring to FIG. 6, the first pin of the audio interface is connected to the audio uplink signal generating device through the first resistor R1 and the first capacitor C1. The second pin of the audio interface is connected to the audio uplink signal generating device through the second capacitor C2 and the first capacitor C1.
- the audio uplink signal sent by the audio uplink signal generating device is filtered by the first resistor R1 and the first capacitor C1 of the filter circuit, so that the audio is made.
- the amplitude of the signal of the audio uplink signal sent by the uplink signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the first pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the audio uplink signal sent by the audio uplink signal generating device passes through the voltage division of the second capacitor C2 and the first capacitor C1, so that the audio uplink The amplitude of the signal of the audio uplink signal sent by the signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the second pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the uplink transmission of the audio signal can be realized by the attenuating circuit of the embodiment.
- the first pin of the audio interface can also be connected to the audio uplink signal generating device through the second capacitor C2 and the first capacitor C1; the second pin of the audio interface can also pass the first resistor R1 and the first The capacitor C1 is connected to the audio upstream signal generating device.
- the attenuation circuit can also be implemented by combining the filter circuit and the voltage dividing circuit as shown in FIG. 9, see the figure
- the first pin of the audio interface is connected to the audio uplink signal generating device through the first capacitor C1 and the first resistor R1; the second pin of the audio interface is connected to the audio uplink signal generating device through the second resistor R2 and the first resistor R1.
- the audio uplink signal sent by the audio uplink signal generating device is filtered by the first capacitor C1 and the first resistor R1, so that the audio uplink signal
- the amplitude of the signal of the audio uplink signal sent by the generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the first pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the audio uplink signal sent by the audio uplink signal generating device passes through the voltage divider of the second resistor R2 and the first resistor R1, so that the audio uplink
- the amplitude of the signal of the audio uplink signal sent by the signal generating device becomes smaller, thereby ensuring that the audio uplink signal is sent to the second pin, that is, the microphone pin MIC, and the uplink transmission of the audio signal is realized.
- the uplink transmission of the audio signal can be realized by the attenuating circuit of the embodiment.
- the first pin of the audio interface can also be connected to the audio uplink signal generating device through the second resistor R2 and the first resistor R1; the second pin of the audio interface passes through the first capacitor C1 and the first resistor R1. Connect the audio upstream signal generating device.
- the filter circuit used in the present invention may be a symmetric circuit, that is, the reactance of the first resistor R1 and the second capacitor C2 is equivalent, and the impedances of the first capacitor C1 and the second resistor R2 are equivalent; the filter circuit used in the present invention may also For an asymmetrical circuit, that is, the impedances of the first resistor R1 and the second capacitor C2 are not equal, and the impedances of the first capacitor C1 and the second resistor R2 may be unequal.
- the embodiment should also be such that the audio interface and the audio uplink signal generating device form a loop to ensure that the audio uplink signal generating device can normally transmit the audio uplink signal.
- the filter circuit and the voltage dividing circuit employed in the present invention are not limited to the resistor and capacitor circuits shown in this embodiment, and any symmetrical circuit or asymmetric circuit capable of achieving the attenuation purpose is within the scope of the present invention.
- Example 4
- the embodiment provides a method for uplinking an audio signal through an audio interface, the method comprising: connecting a first pin of an audio interface to an audio uplink signal generating device by using a first circuit;
- the second pin of the audio interface is connected to the audio uplink signal generating device through the second circuit, wherein the first circuit and the second circuit are mutually attenuating circuits.
- the amplitude of the audio uplink signal can be reduced, thereby ensuring the first pin and the second tube of the audio interface.
- the foot can receive the audio uplink signal sent by the audio uplink signal generating device, so that the audio uplink signal can also be transmitted in the case that the first pin and the second pin line sequence of the audio interface are unknown.
- the description of the terms "one embodiment”, “some embodiments”, “example”, “specific example”, or “some examples” and the like means a specific feature described in connection with the embodiment or example.
- a structure, material or feature is included in at least one embodiment or example of the invention.
- the schematic representation of the above terms does not necessarily mean the same embodiment or example.
- the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
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- Engineering & Computer Science (AREA)
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- Theoretical Computer Science (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- Multimedia (AREA)
- Audiology, Speech & Language Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
- Circuit For Audible Band Transducer (AREA)
- Telephone Function (AREA)
- Interface Circuits In Exchanges (AREA)
- Telephonic Communication Services (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
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Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR112014031337A BR112014031337A2 (pt) | 2012-06-16 | 2013-06-14 | dispositivo e método de transmissão de enlace ascendente para um sinal de áudio |
RU2015100981/08A RU2580008C1 (ru) | 2012-06-16 | 2013-06-14 | Устройство и способ передачи данных для аудиосигнала посредством аудиоинтерфейса |
EP13804166.0A EP2863649A4 (en) | 2012-06-16 | 2013-06-14 | DEVICE AND METHOD FOR AUDIO SIGNAL UPLINK VIA AUDIO INTERFACE |
US14/408,358 US9176705B2 (en) | 2012-06-16 | 2013-06-14 | Uplink transmission device and method for audio signal via audio interface |
KR1020157001079A KR101504468B1 (ko) | 2012-06-16 | 2013-06-14 | 오디오 인터페이스를 통해 오디오 신호 상행을 진행하는 장치 및 방법 |
AU2013275930A AU2013275930B2 (en) | 2012-06-16 | 2013-06-14 | Device and method for audio signal uplink via audio interface |
JP2015516433A JP5844500B2 (ja) | 2012-06-16 | 2013-06-14 | オーディオインターフェイスによるオーディオ信号のアップリンク装置および方法 |
SG11201408192TA SG11201408192TA (en) | 2012-06-16 | 2013-06-14 | Device and method for audio signal uplink via audio interface |
MYPI2014703778A MY173997A (en) | 2012-06-16 | 2013-06-14 | Uplink transmission device and method for audio signal via audio interface |
CA2876905A CA2876905C (en) | 2012-06-16 | 2013-06-14 | Uplink transmission device and method for audio signal via audio interface |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN2012102041702A CN102740188B (zh) | 2012-06-16 | 2012-06-16 | 一种通过音频接口进行音频信号上行的装置和方法 |
CN201210204170.2 | 2012-06-16 |
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Country Status (13)
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US (1) | US9176705B2 (zh) |
EP (1) | EP2863649A4 (zh) |
JP (1) | JP5844500B2 (zh) |
KR (1) | KR101504468B1 (zh) |
CN (1) | CN102740188B (zh) |
AU (1) | AU2013275930B2 (zh) |
BR (1) | BR112014031337A2 (zh) |
CA (1) | CA2876905C (zh) |
HK (1) | HK1177366A1 (zh) |
MY (1) | MY173997A (zh) |
RU (1) | RU2580008C1 (zh) |
SG (1) | SG11201408192TA (zh) |
WO (1) | WO2013185628A1 (zh) |
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CN102740188B (zh) * | 2012-06-16 | 2013-08-28 | 天地融科技股份有限公司 | 一种通过音频接口进行音频信号上行的装置和方法 |
CN103780995A (zh) * | 2014-01-28 | 2014-05-07 | 天地融科技股份有限公司 | 音频信号输出装置 |
CN103763661B (zh) * | 2014-01-28 | 2017-06-06 | 天地融科技股份有限公司 | 智能密钥设备及音频信号传输系统 |
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- 2013-06-14 BR BR112014031337A patent/BR112014031337A2/pt not_active IP Right Cessation
- 2013-06-14 JP JP2015516433A patent/JP5844500B2/ja not_active Expired - Fee Related
- 2013-06-14 WO PCT/CN2013/077224 patent/WO2013185628A1/zh active Application Filing
- 2013-06-14 KR KR1020157001079A patent/KR101504468B1/ko active IP Right Grant
- 2013-06-14 RU RU2015100981/08A patent/RU2580008C1/ru active
- 2013-06-14 CA CA2876905A patent/CA2876905C/en active Active
- 2013-06-14 EP EP13804166.0A patent/EP2863649A4/en not_active Ceased
- 2013-06-14 AU AU2013275930A patent/AU2013275930B2/en not_active Ceased
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Also Published As
Publication number | Publication date |
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US20150178039A1 (en) | 2015-06-25 |
EP2863649A1 (en) | 2015-04-22 |
SG11201408192TA (en) | 2015-01-29 |
BR112014031337A2 (pt) | 2017-06-27 |
HK1177366A1 (en) | 2013-08-16 |
KR20150016636A (ko) | 2015-02-12 |
KR101504468B1 (ko) | 2015-03-19 |
CA2876905A1 (en) | 2013-12-19 |
AU2013275930A1 (en) | 2015-01-15 |
CN102740188B (zh) | 2013-08-28 |
MY173997A (en) | 2020-03-03 |
AU2013275930B2 (en) | 2015-10-29 |
CA2876905C (en) | 2015-09-01 |
JP5844500B2 (ja) | 2016-01-20 |
RU2580008C1 (ru) | 2016-04-10 |
JP2015521810A (ja) | 2015-07-30 |
US9176705B2 (en) | 2015-11-03 |
CN102740188A (zh) | 2012-10-17 |
EP2863649A4 (en) | 2016-04-06 |
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