WO2013166933A1 - Dispositif de dissipation thermique combiné à refroidissement à eau pour caloduc - Google Patents

Dispositif de dissipation thermique combiné à refroidissement à eau pour caloduc Download PDF

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Publication number
WO2013166933A1
WO2013166933A1 PCT/CN2013/075104 CN2013075104W WO2013166933A1 WO 2013166933 A1 WO2013166933 A1 WO 2013166933A1 CN 2013075104 W CN2013075104 W CN 2013075104W WO 2013166933 A1 WO2013166933 A1 WO 2013166933A1
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WO
WIPO (PCT)
Prior art keywords
water
heat
heat pipe
cooling
component
Prior art date
Application number
PCT/CN2013/075104
Other languages
English (en)
Chinese (zh)
Inventor
周哲明
周发明
Original Assignee
Zhou Zheming
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhou Zheming filed Critical Zhou Zheming
Publication of WO2013166933A1 publication Critical patent/WO2013166933A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to electronic devices, and more particularly to the dissipation of heat generated by computer devices such as servers, network devices, PCs, and notebook computers.
  • the most common water-cooling method for the current computer case is to install a water-cooled head on each of the main heat-generating components in the chassis, and connect the water-cooling head to the heat-dissipating water tank with a water pipe.
  • the disadvantage is that the water-cooled head is directly mounted on the electronic device. After the cooling water leaks, it can flow directly to the electronic equipment. The risk of damage to the electronic equipment due to leakage of the cooling water is high.
  • the heat exchange area between the cooling water and the heat source is limited to the area where the water cooling head contacts the electronic equipment, and the heat dissipation efficiency is not high.
  • the present invention provides a heat pipe water cooling combined heat dissipation device, which comprises a heat pipe component and a water blocking component.
  • the water-cooling component the heat pipe component is installed on each of the main heat-generating components in the chassis, and the water pipe is installed on the heat pipe to isolate the evaporation end and the condensation end of the heat pipe, and the water-blocking component is installed on the watertight plate of the chassis shell or the chassis. Install the water-cooled component outside the chassis or in a space inside the chassis that is isolated from the electronics.
  • the advantage of this scheme is that the water-cooled part is isolated from the electronic equipment, which reduces the risk of damage of the electronic equipment due to leakage of cooling water, and can increase the heat exchange area of the cooling water and the heat source by utilizing the adjustable heat flux density of the heat pipe, thereby improving The heat dissipation efficiency.
  • a heat pipe water-cooling combined heat dissipating device comprises a heat pipe component, a water blocking component and a water cooling component, wherein the heat pipe component is installed on each main heat-generating component in the chassis, and a water-blocking component is installed on the heat pipe, and the evaporation end and the condensation end of the heat pipe are isolated and separated
  • the water component is installed on the airtight board inside the chassis shell or the chassis, so that the water-cooled component is installed outside the chassis or in the space separated from the electronic device in the chassis, so as to reduce the risk of damage of the electronic device due to leakage of cooling water, and
  • the heat flux density of the heat pipe is used to increase the heat exchange area between the cooling water and the heat source, thereby improving heat dissipation efficiency.
  • the heat pipe component is mainly composed of a heat pipe, and the evaporation end of the heat pipe is connected with the main heat-generating component in the chassis, and the main heat-generating component is a CPU, a north-south bridge chip of the motherboard, a graphics card, a memory, a hard disk, a power supply, etc., and a condensation end of the heat pipe
  • the water-cooled parts are connected.
  • the water blocking member is mounted on the heat pipe to isolate the evaporation end and the condensation end of the heat pipe.
  • the water barrier can be mounted on the chassis enclosure or on the water barrier inside the enclosure.
  • One type of water-cooling component is a water tank, which includes a water inlet hole, a water outlet hole, a water tank, and a condensation end of the heat pipe is inserted into the water tank.
  • the heat of the heat pipe can be directly exchanged into the cooling water.
  • Another type of water-cooling component is a water-cooling head, which comprises a water inlet hole, a water outlet hole, and a heat conduction plate, and the condensation end of the heat pipe is connected to the heat conduction plate.
  • the beneficial effects of the invention are: separating the water-cooled portion from the electronic device, reducing the risk of the electronic device being damaged by the leakage of the cooling water, and simultaneously increasing the heat of the cooling water and the heat source by utilizing the adjustable heat flux density of the heat pipe. Exchange area, which improves heat dissipation efficiency.
  • FIG. 1 is a schematic structural view of a heat pipe and a water tank combined heat sink according to the present invention.
  • FIG. 2 is a schematic structural view of a combined heat sink and water-cooled head heat sink according to the present invention.
  • FIG. 3 is a schematic view showing the installation of a heat pipe water-cooled combined heat sink according to the present invention.
  • an embodiment of the present invention is a heat pipe and a water tank combined heat sink.
  • a combination heat pipe and water tank heatsink includes (1) a heat pipe, (2) a water tank, and (3) a water barrier.
  • the water tank contains (6) water inlet holes, (7) water outlet holes, (8) water tanks, (1) heat pipes (5) condensing ends are inserted into (2) water tanks (8) water tanks.
  • an embodiment of the present invention is a combination heat pipe and water-cooling head heat sink.
  • a combination heat pipe and water cooling head heatsink includes (1) a heat pipe, (9) a water cooling head, and (3) a water blocking plate. (9)
  • the water-cooled head contains (6) inlet holes, (7) outlet holes, (10) heat-conducting plates, and (1) the (5) condensation ends of the heat pipes are connected to the (10) heat-conducting plates.
  • an embodiment of the present invention is a heat pipe water-cooled combined heat sink mounted on a PC.
  • a heat pipe water-cooling combination radiator mounted on a PC includes (1) a heat pipe, (2) a water tank, and (3) a water barrier. (3) The water barrier is installed on the (11) chassis water barrier.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif électronique et plus particulièrement la dissipation de la chaleur générée par les dispositifs informatiques tels qu'un serveur, un périphérique de réseau, un PC et un bloc-notes électronique. Un dispositif de dissipation thermique combiné à refroidissement à eau pour un caloduc comprend un élément formant caloduc, un élément résistant à l'eau et un élément de refroidissement à eau. L'élément formant caloduc est principalement constitué d'un caloduc (1) et il est installé sur chaque élément calogène principal dans un boîtier. Ledit caloduc (1) est doté d'un élément résistant à l'eau de façon à isoler une extrémité d'évaporation (4) du caloduc (1) d'une extrémité de condensation (5). L'élément résistant à l'eau est un panneau résistant à l'eau (3) installé sur un logement de boîtier ou un panneau résistant à l'eau du boîtier de façon à permettre l'installation de l'élément de refroidissement à eau à l'extérieur du boîtier ou dans un espace du boîtier isolé des dispositifs électroniques. Un type d'élément de refroidissement à eau est un réservoir d'eau (2) comprenant un orifice d'entrée d'eau (6), un orifice de sortie d'eau (7) et un bain-marie (8). L'extrémité de condensation (5) du caloduc (1) est insérée dans le bain-marie (8) du réservoir d'eau (2), et la chaleur du caloduc (1) peut être directement échangée dans l'eau de refroidissement. Un autre type d'élément de refroidissement à eau est une tête de refroidissement à eau, comprenant un orifice d'entrée d'eau, un orifice de sortie d'eau, un panneau thermo-conducteur. L'extrémité de condensation du caloduc est reliée au panneau thermo-conducteur. Un avantage de cette solution tient au fait que l'élément de refroidissement à eau est isolé des dispositifs électroniques de façon à minimiser le risque de destruction des dispositifs électroniques par fuite de l'eau de refroidissement. De plus, une caractéristique réglable de densité de l'écoulement calorifique du caloduc peut être mise en œuvre pour accroître une surface d'échange thermique entre l'eau de refroidissement et une source calogène de façon à améliorer l'efficacité de la dissipation thermique.
PCT/CN2013/075104 2012-05-10 2013-05-03 Dispositif de dissipation thermique combiné à refroidissement à eau pour caloduc WO2013166933A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201220208750.4 2012-05-10
CN 201220208750 CN202587734U (zh) 2012-05-10 2012-05-10 一种热管水冷组合散热设备

Publications (1)

Publication Number Publication Date
WO2013166933A1 true WO2013166933A1 (fr) 2013-11-14

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Country Status (2)

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CN (1) CN202587734U (fr)
WO (1) WO2013166933A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190239386A1 (en) * 2018-01-30 2019-08-01 Quanta Computer Inc. Server water cooling modules prevent water leakage device
EP3760959A1 (fr) * 2019-07-03 2021-01-06 Giga-Byte Technology Co., Ltd. Dispositif de dissipation de chaleur

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202587734U (zh) * 2012-05-10 2012-12-05 周哲明 一种热管水冷组合散热设备
CN103260384B (zh) * 2013-04-25 2015-10-28 奇瑞新能源汽车技术有限公司 一种电机控制器冷却结构
CN103411192B (zh) * 2013-08-14 2015-09-23 中南大学 一种太阳能led灯联合散热装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1455954A (zh) * 2001-09-07 2003-11-12 株式会社日立制作所 电子装置
CN1456038A (zh) * 2001-09-04 2003-11-12 株式会社日立制作所 电子装置
CN2640041Y (zh) * 2003-08-19 2004-09-08 林项武 一种热管水冷散热系统
CN1921093A (zh) * 2005-08-24 2007-02-28 讯凯国际股份有限公司 一种散热装置及其散热方法
TW201218936A (en) * 2010-10-29 2012-05-01 Ind Tech Res Inst Cooling structure of electronic device
CN202587734U (zh) * 2012-05-10 2012-12-05 周哲明 一种热管水冷组合散热设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1456038A (zh) * 2001-09-04 2003-11-12 株式会社日立制作所 电子装置
CN1455954A (zh) * 2001-09-07 2003-11-12 株式会社日立制作所 电子装置
CN2640041Y (zh) * 2003-08-19 2004-09-08 林项武 一种热管水冷散热系统
CN1921093A (zh) * 2005-08-24 2007-02-28 讯凯国际股份有限公司 一种散热装置及其散热方法
TW201218936A (en) * 2010-10-29 2012-05-01 Ind Tech Res Inst Cooling structure of electronic device
CN202587734U (zh) * 2012-05-10 2012-12-05 周哲明 一种热管水冷组合散热设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190239386A1 (en) * 2018-01-30 2019-08-01 Quanta Computer Inc. Server water cooling modules prevent water leakage device
US10694640B2 (en) * 2018-01-30 2020-06-23 Quanta Computer Inc. Server water cooling modules prevent water leakage device
EP3760959A1 (fr) * 2019-07-03 2021-01-06 Giga-Byte Technology Co., Ltd. Dispositif de dissipation de chaleur

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