CN202587734U - 一种热管水冷组合散热设备 - Google Patents

一种热管水冷组合散热设备 Download PDF

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CN202587734U
CN202587734U CN 201220208750 CN201220208750U CN202587734U CN 202587734 U CN202587734 U CN 202587734U CN 201220208750 CN201220208750 CN 201220208750 CN 201220208750 U CN201220208750 U CN 201220208750U CN 202587734 U CN202587734 U CN 202587734U
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water
heat
heat pipe
parts
cooling
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周哲明
周发明
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Guangzhou Luo Book Computer Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本实用新型涉及电子设备,特别是涉及服务器、网络设备、PC、笔记本电脑等电脑设备产生的热量的排散。该设备包含热管部件、隔水部件和水冷部件,热管部件安装在机箱内的各个主要发热部件上,热管上安装隔水部件,将热管的蒸发端和冷凝端隔离,隔水部件安装在机箱外壳或者机箱内的隔水板上,使水冷部件安装在机箱外或者是机箱内与电子设备相隔离的空间内。水冷部件的一种是水箱,包含有进水孔、出水孔、水槽,热管的冷凝端插入到水箱的水槽内,热管的热量可以直接交换到冷却水中。水冷部件的另一种是水冷头,包含有进水孔、出水孔、导热板,热管的冷凝端与导热板相连接。该方案的优点是使水冷部分与电子设备相隔离,降低了电子设备因冷却水泄漏而损坏的风险,同时可以利用热管的热流密度可调特性增加冷却水与发热源的热交换面积,从而提高了散热效率。

Description

一种热管水冷组合散热设备
技术领域
本实用新型涉及电子设备,特别是涉及服务器、网络设备、PC、笔记本电脑等电脑设备产生的热量的排散。
背景技术
目前的电脑机箱最常用的水冷散热方式是在机箱内的各个主要发热部件上安装水冷头,用水管将水冷头与散热水箱等连接起来,其缺点是水冷头直接安装在电子设备上,冷却水泄漏后可以直接流到电子设备上,电子设备因冷却水泄漏而损坏的风险较高;另外冷却水与发热源的热交换面积局限于水冷头与电子设备接触的面积,散热效率不高。
实用新型内容
为解决现有技术中的电子设备因冷却水泄漏而损坏的风险较高和散热效率不高的问题,本实用新型提出一种热管水冷组合散热设备,该设备包含热管部件、隔水部件和水冷部件,热管部件安装在机箱内的各个主要发热部件上,热管上安装隔水部件,将热管的蒸发端和冷凝端隔离,隔水部件安装在机箱外壳或者机箱内的隔水板上,使水冷部件安装在机箱外或者是机箱内与电子设备相隔离的空间内。该方案的优点是使水冷部分与电子设备相隔离,降低了电子设备因冷却水泄漏而损坏的风险,同时可以利用热管的热流密度可调特性增加冷却水与发热源的热交换面积,从而提高了散热效率。
本实用新型解决其技术问题所采用的技术方案是:
一种热管水冷组合散热设备,包含热管部件、隔水部件和水冷部件,热管部件安装在机箱内的各个主要发热部件上,热管上安装隔水部件,将热管的蒸发端和冷凝端隔离,隔水部件安装在机箱外壳或者机箱内的隔水板上,使水冷部件安装在机箱外或者是机箱内与电子设备相隔离的空间内,以降低电子设备因冷却水泄漏而损坏的风险,同时可以利用热管的热流密度可调特性增加冷却水与发热源的热交换面积,从而提高散热效率。
热管部件主要由热管组成,热管的蒸发端与机箱内的主要发热部件相连接,主要发热部件是CPU、主板南北桥芯片、显卡、内存、硬盘、电源等部件,热管的冷凝端与水冷部分相连接。
隔水部件安装在热管上,将热管的蒸发端和冷凝端隔离。隔水部件可以安装在机箱外壳或者机箱内的隔水板上。
水冷部件的一种是水箱,包含有进水孔、出水孔、水槽,热管的冷凝端插入到水箱的水槽内,热管的热量可以直接交换到冷却水中。
水冷部件的另一种是水冷头,包含有进水孔、出水孔、导热板,热管的冷凝端与导热板相连接。
本实用新型的有益效果是:使水冷部分与电子设备相隔离,降低了电子设备因冷却水泄漏而损坏的风险,同时可以利用热管的热流密度可调特性增加冷却水与发热源的热交换面积,从而提高了散热效率。
附图说明
图1是根据本实用新型的热管与水箱组合散热器的结构示意图。
图2是根据本实用新型的热管与水冷头组合散热器的结构示意图。
图3是根据本实用新型的热管水冷组合散热器的安装示意图。
图中,1.热管,2.水箱,3.隔水板,4.蒸发端,5.冷凝端,6.进水孔,7.出水孔,8.水槽,9.水冷头,10.导热板,11.机箱隔水板。
具体实施方式
下面结合附图和实施例对本实用新型进一步说明。
在图1中,本实用新型的实施例是一种热管与水箱组合散热器。
如图1所示:
一种热管与水箱组合散热器,包含(1)热管、(2)水箱和(3)隔水板。(2)水箱包含(6)进水孔、(7)出水孔、(8)水槽,(1)热管的(5)冷凝端插入到(2)水箱的(8)水槽内。
在图2中,本实用新型的实施例是一种热管与水冷头组合散热器。
如图2所示:
一种热管与水冷头组合散热器,包含(1)热管、(9)水冷头和(3)隔水板。(9)水冷头包含(6)进水孔、(7)出水孔、(10)导热板,(1)热管的(5)冷凝端与(10)导热板相连接。
在图3中,本实用新型的实施例是一种热管水冷组合散热器,安装在PC机上。
如图3所示:
一种热管水冷组合散热器,安装在PC机上,包含(1)热管、(2)水箱和(3)隔水板。(3)隔水板安装在(11)机箱隔水板上。

Claims (3)

1.一种热管水冷组合散热设备,其特征是:包含热管部件、隔水部件和水冷部件;所述热管部件主要由热管组成,所述热管的蒸发端与机箱内的主要发热部件相连接,所述热管的冷凝端与所述水冷部件相连接。
2.根据权利要求1所述的隔水部件,其特征是:所述隔水部件安装在所述热管上,将所述热管的蒸发端和冷凝端隔离;所述隔水部件可以安装在机箱外壳或者机箱内的隔水板上。
3.根据权利要求1所述的水冷部件,其特征是:所述的水冷部件的一种是水箱,包含有进水孔、出水孔、水槽,所述热管的冷凝端插入到所述水槽内;所述的水冷部件的另一种是水冷头,包含有进水孔、出水孔、导热板,所述热管的冷凝端与所述导热板相连接。
CN 201220208750 2012-05-10 2012-05-10 一种热管水冷组合散热设备 Expired - Fee Related CN202587734U (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103260384A (zh) * 2013-04-25 2013-08-21 奇瑞汽车股份有限公司 一种电机控制器冷却结构
WO2013166933A1 (zh) * 2012-05-10 2013-11-14 Zhou Zheming 一种热管水冷组合散热设备
CN103411192A (zh) * 2013-08-14 2013-11-27 中南大学 一种太阳能led灯联合散热装置
EP3518640A1 (en) * 2018-01-30 2019-07-31 Quanta Computer Inc. Server water cooling modules prevent water leakage device

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TWM584589U (zh) * 2019-07-03 2019-10-01 技嘉科技股份有限公司 散熱裝置

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JP2003078269A (ja) * 2001-09-04 2003-03-14 Hitachi Ltd 電子機器装置
JP2003078270A (ja) * 2001-09-07 2003-03-14 Hitachi Ltd 電子装置
CN2640041Y (zh) * 2003-08-19 2004-09-08 林项武 一种热管水冷散热系统
CN100401507C (zh) * 2005-08-24 2008-07-09 讯凯国际股份有限公司 一种散热装置及其散热方法
TWI419641B (zh) * 2010-10-29 2013-12-11 Ind Tech Res Inst 電子裝置之散熱結構
CN202587734U (zh) * 2012-05-10 2012-12-05 周哲明 一种热管水冷组合散热设备

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013166933A1 (zh) * 2012-05-10 2013-11-14 Zhou Zheming 一种热管水冷组合散热设备
CN103260384A (zh) * 2013-04-25 2013-08-21 奇瑞汽车股份有限公司 一种电机控制器冷却结构
CN103260384B (zh) * 2013-04-25 2015-10-28 奇瑞新能源汽车技术有限公司 一种电机控制器冷却结构
CN103411192A (zh) * 2013-08-14 2013-11-27 中南大学 一种太阳能led灯联合散热装置
CN103411192B (zh) * 2013-08-14 2015-09-23 中南大学 一种太阳能led灯联合散热装置
EP3518640A1 (en) * 2018-01-30 2019-07-31 Quanta Computer Inc. Server water cooling modules prevent water leakage device
CN110096122A (zh) * 2018-01-30 2019-08-06 广达电脑股份有限公司 冷却系统、服务器及服务器系统
JP2019133631A (ja) * 2018-01-30 2019-08-08 廣達電腦股▲ふん▼有限公司 冷却システム、サーバー、及びサーバーシステム
US10694640B2 (en) 2018-01-30 2020-06-23 Quanta Computer Inc. Server water cooling modules prevent water leakage device
JP6991953B2 (ja) 2018-01-30 2022-01-13 廣達電腦股▲ふん▼有限公司 冷却システム、サーバー、及びサーバーシステム

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Effective date of registration: 20161028

Address after: 511407, room 268, No. 302, West Ring Road, Shiqiao street, Guangzhou, Guangdong, Panyu District

Patentee after: Guangzhou Luo Book Computer Co., Ltd.

Address before: Shilou town Manor Road Guangzhou City, Guangdong province 511447 No. 1 Panyu District, room 402, 6 ladder

Patentee before: Zhou Zheming

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