WO2013166454A1 - Antimony-modified low-lead copper alloy - Google Patents
Antimony-modified low-lead copper alloy Download PDFInfo
- Publication number
- WO2013166454A1 WO2013166454A1 PCT/US2013/039567 US2013039567W WO2013166454A1 WO 2013166454 A1 WO2013166454 A1 WO 2013166454A1 US 2013039567 W US2013039567 W US 2013039567W WO 2013166454 A1 WO2013166454 A1 WO 2013166454A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sulfur
- antimony
- stibnite
- sample
- alloy
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 155
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 154
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 128
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 127
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 122
- 239000011593 sulfur Substances 0.000 claims abstract description 116
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 95
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 76
- 239000010951 brass Substances 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 12
- 229910052959 stibnite Inorganic materials 0.000 claims description 98
- IHBMMJGTJFPEQY-UHFFFAOYSA-N sulfanylidene(sulfanylidenestibanylsulfanyl)stibane Chemical compound S=[Sb]S[Sb]=S IHBMMJGTJFPEQY-UHFFFAOYSA-N 0.000 claims description 97
- 239000010949 copper Substances 0.000 claims description 87
- 229910052802 copper Inorganic materials 0.000 claims description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 70
- 239000000203 mixture Substances 0.000 claims description 64
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 60
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 60
- 239000011701 zinc Substances 0.000 claims description 55
- 239000011135 tin Substances 0.000 claims description 50
- 229910052718 tin Inorganic materials 0.000 claims description 42
- 229910052725 zinc Inorganic materials 0.000 claims description 42
- 239000000155 melt Substances 0.000 claims description 38
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 34
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 32
- 229910052759 nickel Inorganic materials 0.000 claims description 32
- 229910052799 carbon Inorganic materials 0.000 claims description 31
- 239000000654 additive Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000002893 slag Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 230000036961 partial effect Effects 0.000 claims description 3
- 229910000581 Yellow brass Inorganic materials 0.000 abstract description 42
- 239000011133 lead Substances 0.000 description 47
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 37
- 229910002804 graphite Inorganic materials 0.000 description 28
- 239000010439 graphite Substances 0.000 description 28
- 238000004458 analytical method Methods 0.000 description 25
- 238000005260 corrosion Methods 0.000 description 25
- 230000007797 corrosion Effects 0.000 description 25
- 239000000126 substance Substances 0.000 description 23
- 238000007792 addition Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 20
- 238000003754 machining Methods 0.000 description 20
- 238000005266 casting Methods 0.000 description 19
- 238000009826 distribution Methods 0.000 description 17
- 239000002245 particle Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 239000011572 manganese Substances 0.000 description 14
- 239000006104 solid solution Substances 0.000 description 13
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 12
- 238000001816 cooling Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 10
- 229910018306 Cu2Sb Inorganic materials 0.000 description 9
- 238000013400 design of experiment Methods 0.000 description 9
- 238000009472 formulation Methods 0.000 description 9
- 238000010587 phase diagram Methods 0.000 description 9
- 150000004763 sulfides Chemical class 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 229910000765 intermetallic Inorganic materials 0.000 description 8
- 238000013507 mapping Methods 0.000 description 8
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052796 boron Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 230000000670 limiting effect Effects 0.000 description 7
- 229910052748 manganese Inorganic materials 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 229910052984 zinc sulfide Inorganic materials 0.000 description 7
- 241001275902 Parabramis pekinensis Species 0.000 description 6
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229910052726 zirconium Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 5
- 238000009428 plumbing Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 239000005083 Zinc sulfide Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000011835 investigation Methods 0.000 description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- -1 transition metal sulphides Chemical class 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 3
- 229910018082 Cu3Sn Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000010120 permanent mold casting Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 229910052950 sphalerite Inorganic materials 0.000 description 3
- CADICXFYUNYKGD-UHFFFAOYSA-N sulfanylidenemanganese Chemical compound [Mn]=S CADICXFYUNYKGD-UHFFFAOYSA-N 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 229910001370 Se alloy Inorganic materials 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 229910007657 ZnSb Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 2
- 239000002006 petroleum coke Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 101100350659 Arabidopsis thaliana P4H1 gene Proteins 0.000 description 1
- 229910000714 At alloy Inorganic materials 0.000 description 1
- 241001644084 Cnestus solidus Species 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017888 Cu—P Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910017940 Cu—Sn—Sb Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001340 Leaded brass Inorganic materials 0.000 description 1
- 241000238634 Libellulidae Species 0.000 description 1
- 229910016773 Mn2Sb Inorganic materials 0.000 description 1
- 229910016964 MnSb Inorganic materials 0.000 description 1
- 229910007662 Sn3Sb2 Inorganic materials 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000845 anti-microbial effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical class [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005088 metallography Methods 0.000 description 1
- 238000009862 microstructural analysis Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052569 sulfide mineral Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
- C22B9/10—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals with refining or fluxing agents; Use of materials therefor, e.g. slagging or scorifying agents
- C22B9/103—Methods of introduction of solid or liquid refining or fluxing agents
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Definitions
- One embodiment of the invention relates to a composition of matter comprising 82% to about 89% copper, about 0.01 % to about 0.65% sulfur, greater than 0.1 to about 1 .5% antimony, about 2.0% to about 4.0% tin, less than about 0.09% lead, about 5.0% to about 14.0% zinc, and about 0.5% to about 2.0% nickel.
- the composition comprises 86% to about 89% copper, about 0.01 % to about 0.65% sulfur, greater than 0.1 to about 1 .5% antimony, about 7.5% to about 8.5% tin, less than about 0.09% lead, about 1 .0% to about 5.0% zinc, and about 1 .0% % nickel.
- the composition comprises 58% to about 62% copper, about 0.01 % to about 0.65% sulfur, greater than 0.1 to about 1 .5% antimony, about 1 .5% tin, less than about 0.09% lead, about 31 .0% to about 41 .0% zinc, and about 1 .5% nickel.
- the composition comprises 58% to about 62% copper, about 0.01 % to about 0.65% sulfur, greater than 0.1 to about 1 .5% antimony, less than about 0.09% lead, and about 31 .0% to about 41 .0% zinc.
- Another embodiment of the invention relates to a method for adding sulfur to a brass alloy.
- a base ingot is heated to a temperature of about 2,100 degrees Fahrenheit to form a melt.
- Zn, Ni, and Sn are added to the copper the melt at about 2,124 F°
- stibnite is added at about 2,164 F°
- phosphorous is added at about 2,164 F°.
- Stibnite wrapped in copper foil is added and the temperature maintained at about 2164F.
- phosphorus deoxidation is also done at this temperature. Heating of the melt is ceased and additives, including tin, zinc, nickel, and carbon, are added at about 2124 F. At least a partial amount of slag is skimmed from the melt. Temperature of the melt is maintained at 2100 F. Slag is removed from the melt.
- Figure 1 provides a table listing formulations for several known low-lead commercial copper alloys.
- Figure 2 provides a table listing formulations of alloys in accordance with select embodiments of the invention.
- Figure 3A and 3B is a table of chemical analysis of semi-red brass with copper coated graphite, MnS, and sulfur.
- Figure 4A and 4B is a table of chemical analysis of semi-red brass with copper coated graphite and Stibnite in accordance with certain embodiments of the invention.
- Figure 5A - 5c is a table indicating composition and mechanical properties of certain semi-red brass with copper coated graphite, MnS, and Sulfur.
- Figure 6A -6C is a table indicating composition and mechanical properties of semi-red brass with copper coated graphite and antimony in accordance with certain embodiments of the invention.
- Figure 7 is a table of chemical analysis of yellow brass having antimony in accordance with certain embodiments of the invention.
- Figure 8 is a table indicating composition and mechanical properties of certain embodiments of yellow brass.
- Figure 9 is an analysis of typical and minimum mechanical properties for certain embodiments of the invention and selected prior art alloys.
- Figures 10A illustrates machining chip morphology of a semi-red brass with copper coated graphite (1 .5%).
- Figures 10B illustrates machining chip morphology of a semi-red brass with copper coated graphite ("CCG") (1 .5%) and 1 .3% MnS.
- Figures 10C illustrates machining chip morphology of a semi-red brass with 0.44% sulfur.
- Figures 10D illustrates machining chip morphology of a semi-red brass with 1 .3% MnS.
- Figures 10E illustrates machining chip morphology of a semi-red brass 1 .64% stibnite and 1 .5% calcinated petroleum coke (“CPC").
- Figures 10F illustrates machining chip morphology of a semi-red brass with 1 .64% stibnite and 1 .5% CPC.
- Figures 10G illustrates machining chip morphology of a semi-red brass with 1 .64% stibnite.
- Figures 10H illustrates machining chip morphology of a semi-red brass with 1 % stibnite.
- Figures 101 illustrates machining chip morphology of a semi-red brass with 0.8% stibnite.
- Figures 10J illustrates machining chip morphology of a semi-red brass with 1 .2% stibnite, 1 % copper coated graphite, and 0.08% boron.
- Figures 1 1 illustrates machining chip morphology of a yellow brass with 1 .5% copper coated graphite and 0.8% stibnite.
- Figure 12 illustrates the machinability of the C84030 red brass and C28330 yellow brass in comparison to the commercially available C36000 leaded red brass.
- Figure 13A is a graph depicting the relationship of amount of stibnite addition to three mechanical properties (UTS, YS, and % Elongation);
- Figure 13B is a graph depicting the relationship of antimony concentration to three mechanical properties (UTS, YS, and % Elongation);
- Figure 13C is a graph depicting the relationship of sulfur concentration to three mechanical properties (UTS, YS, and % Elongation).
- Figure 14 is a table of the chemistries for the test samples indicated in the metallographic images of Figures 15A-17J.
- Figure 15A Photomicrograph showing inclusion size of sample 1 109319.
- Figure 15B SEM backscatter image of sample 1 109319 at low magnification.
- Figure 15C SEM backscatter image of sample 1 109319 at higher magnification.
- Figure 15D Element map of sample 1 109319.
- Figure 15E BE image of sample 1 109319 showing annotated locations.
- Figure 15F EDS spectrum of sample 1 109319 - location 1 .
- Figure 15G EDS spectrum of sample 1 109319 - location 2.
- Figure 15H EDS spectrum of sample 1 109319 - location 3.
- Figure 151 EDS spectrum of sample 1 109319 - location 4.
- Figure 15J Sample 1 109319 element map.
- Figure 16A Photomicrograph showing inclusion size of sample 84XX42- 022812-H20P2-9A.
- Figure 16B SEM backscatter image of sample 84XX42-022812- H20P2-9A at low magnification.
- Figure 16C SEM backscatter image of sample 84XX42-022812-H20P2-9A at higher magnification.
- Figure 16D Element map of sample 84XX42-022812-H20P2-9A.
- Figure 16E BE image of sample 84XX42- 022812-H20P2-9A showing annotated locations.
- Figure 16F EDS spectrum of sample 84XX42-022812-H20P2-9A - location 1 .
- Figure 16G EDS spectrum of sample 84XX42-022812-H20P2-9A - location 2.
- Figure 16H EDS spectrum of sample 84XX42-022812-H20P2-9A - location 3.
- Figure 161 EDS spectrum of sample 84XX42-022812-H20P2-9A - location 4.
- Figure 16J Sample 84XX42- 022812-H20P2-9A element map.
- Figure 17A Photomicrograph showing inclusion size of sample 84XX9- 0131 12-H18P2-10A.
- Figure 17B SEM backscatter image of sample 84XX9-0131 12- H18P2-10A at low magnification.
- Figure 17C SEM backscatter image of sample 84XX9-0131 12-H18P2-10A at higher magnification.
- Figure 17D Element map of sample 84XX9-0131 12-H18P2-10A.
- Figure 17E BE image of sample 84XX9- 0131 12-H18P2-10A showing annotated locations.
- Figure 17F EDS spectrum of sample 84XX9-0131 12-H18P2-10A - location 1 .
- Figure 17G EDS spectrum of sample 84XX9-0131 12-H18P2-10A - location 2.
- Figure 17H EDS spectrum of sample 84XX9-0131 12-H18P2-10A - location 3.
- Figure 171 EDS spectrum of sample 84XX9-0131 12-H18P2-10A - location 4.
- Figure 17J Sample 84XX9- 0131 12-H18P2-10A element map.
- Figure 18A BE image of Perm Mold sample at low magnification.
- Figure 18B BE image of Perm Mold sample at high magnification.
- Figure 18C EDS spectrum of Perm Mold sample - location 1 .
- Figure 18D EDS spectrum of Perm Mold sample - location 2.
- Figure 18E EDS spectrum of Perm Mold sample - location 3.
- Figure 18F EDS spectrum of Perm Mold sample - location 4.
- Figure 18G EDS spectrum of Perm Mold sample - location 5.
- Figure 18H EDS spectrum of Perm Mold sample - location 6.
- Figure 181 Element map of Perm Mold sample.
- Figure 19A BE image of Annealed sample at low magnification.
- Figure 19B BE image of Annealed sample at low magnification.
- Figure 19C EDS spectrum of Annealed sample - location 1 .
- Figure 19D EDS spectrum of Annealed sample - location 2.
- Figure 19E EDS spectrum of Annealed sample - location 3.
- Figure 19F EDS spectrum of Annealed sample - location 4.
- Figure 19G EDS spectrum of Annealed sample - location 5.
- Figure 19H EDS spectrum of Annealed sample - location 6.
- Figure 191 EDS spectrum of Annealed sample - location 7.
- Figure 19J Element map of Annealed sample.
- Figure 20A BE image of Cold Rolled sample at low magnification.
- Figure 20B BE image of Cold Rolled sample at high magnification.
- Figure 20C EDS spectrum of Cold Rolled sample - location 1 .
- Figure 20D EDS spectrum of Cold Rolled sample - location 2.
- Figure 20E EDS spectrum of Cold Rolled sample - location 3.
- Figure 20F EDS spectrum of Cold Rolled sample - location 4.
- Figure 20G EDS spectrum of Cold Rolled sample - location 5.
- Figure 20H Element map of Cold Rolled sample.
- Figures 21A-C illustrate phase diagrams for semi-red brass and Alloy C84030.
- Figure 21 A is a phase diagram for a red brass without antimony.
- Figure 21 B is a phase diagram for semi-red brass with 0.8 wt% antimony.
- Figure 21 C is a phase diagram for semi-red brass with 1 .3 wt% antimony.
- Figure 22A is a phase assemblage diagram of Semi-Red Brass with 0.8 Sb.
- Figure 22B is a magnified part of the phase assemblage diagram of Semi-Red Brass with 0.8 Sb.
- Figure 22C is a magnified part of the phase assemblage diagram of Semi-Red Brass with 1 .3 Sb.
- Figure 22D is a magnified part of the phase assemblage diagram of Semi-Red Brass with 0.8 Sb - Scheil Cooling.
- Figure 22E is a magnified part of the phase assemblage diagram of Semi-Red Brass with 1 .3 Sb - Scheil Cooling.
- Figure 23 is phase diagram showing the location of the yellow brass alloy 61/38/0.3/0 Cu/Zn/Sn/Sb wt%.
- Figure 24A is an equilibrium phase assemblage diagram of yellow brass with 0 wt% Sb.
- Figure 24B is an equilibrium phase assemblage diagram of yellow brass with 0.6 wt% Sb.
- Figure 24C is an equilibrium phase assemblage diagram of yellow brass with 1 wt% Sb.
- Figure 24D is a Scheil phase assemblage diagram of yellow brass with 0 wt% Sb.
- Figure 24E is a Scheil phase assemblage diagram of yellow brass with 0.6 wt% Sb.
- Figure 24F is a Scheil phase assemblage diagram of yellow brass with 1 wt% Sb.
- Figure 25 is a free energy diagram.
- Figure 26A shows dezincification corrosion (between lines) extends to a maximum depth of 0.0012" (31 .2 microns) from the exposed surface (towards top) in the metallographic section prepared through the edge of the "MBAF 180" sample. Unetched. (494X).
- Figure 26B shows dezincification corrosion (between lines) extends to a maximum depth of 0.01 13" (287.0 microns) from the exposed surface (towards top) in the metallographic section prepared through the core of the "MBAF 180" sample. Unetched. (201 X).
- Figure 27A shows dezincification corrosion (between lines) extends to a maximum depth of 0.04830" (1 ,228.1 microns) from the exposed surface (towards top) in the metallographic section prepared through the thin walled section of the "C36000 Ht# 1 -Yeager” sample. Unetched. (50X).
- Figure 27B shows dezincification corrosion (between red lines) extends to a maximum depth of 0.05133" (1 ,303.8 microns) from the exposed surface (towards top) in the metallographic section prepared through the thick walled section of the "C36000 Ht# 1 -Yeager” sample. Unetched. (50X).
- Figure 28A shows no dezincification corrosion is present at the exposed surface (towards top) in the metallographic section prepared through the edge of the "28330-Lab# 358050 P4 H2a" sample. Unetched. (494X).
- Figure 28B shows dezincification corrosion (between lines) extends to a maximum depth of 0.0033" (82.8 microns) from the exposed surface (towards top) in the metallographic section prepared through the core of the "28330-Lab# 358050 P4 H2a" sample. Unetched. (494X).
- Figure 29A shows no dezincification corrosion is present at the exposed surface (towards top) in the metallographic section prepared through the edge of the "84030-62412-H3P2-9" sample. Unetched. (494X).
- Figure 29B shows no dezincification corrosion is present at the exposed surface (towards top) in the metallographic section prepared through the edge of the "84030-62412-H3P2-9" sample. Unetched. (494X).
- Figure 30 illustrates the chemical compositions of various alloys tested based on Design of Experiments (DOE).
- Figure 31 illustrates the relation of alloy properties between C84030 red brass and two commercial brasses which were used as the base for the DOE.
- Figure 32 illustrates the composition and mechanical properties of various tested alloys based on Design of Experiments (DOE).
- Brass alloys typically utilize lead as a chip breaker and to generally improve the qualities desirable in brass alloys for use in a wide range of situations, including plumbing.
- the use of sulfides as a replacement for lead has been previously taught in U.S. Pat. App. Ser. No. 13/317,785, incorporated by reference herein.
- the brass alloys of the present invention utilize antimony for improved properties.
- a sulfur containing mineral, stibnite is utilized as a source of sulfur and to provide antimony to the alloy.
- Stibnite is a naturally occurring sulfide mineral in the form of SD2S3. Stibnite typically contains 26.7% sulfur , 69.2% antimony and 0.4% moisture. Apparent density is 1 .19 g/cc. Particle size is 325 mesh or 44 microns.
- Figure 2 illustrates the nominal ranges for four alloy embodiments, each including antimony.
- C84030 is a red brass having sulfur and antimony.
- C90430 is a tin bronze having sulfur and antimony.
- C85930 is a yellow brass for permanent mold casting applications having sulfur and antimony.
- C28330 is a yellow brass for wrought applications having sulfur and antimony.
- the respective embodiments will be referred to by these numbers throughout. The specific materials used for such formulations may be specified in certain embodiments.
- the alloys of the present invention comprise copper, zinc, tin, sulfur, nickel, phosphorus, and antimony.
- one or more of manganese, zirconium, boron, titanium and/or carbon are included.
- the alloys comprise as a principal component, copper.
- Copper provides basic properties to the alloy, including antimicrobial properties and corrosion resistance. Pure copper has a relatively low yield strength, and tensile strength, and is not very hard relative to its common alloy classes of bronze and brass. Therefore, it is desirable to improve the properties of copper for use in many applications through alloying.
- the copper will typically be added as a base ingot. The base ingot's composition purity will vary depending on the source mine and post-mining processing.
- the copper may also be sourced from recycled materials, which can vary widely in composition. Therefore, it should be appreciated that ingot chemistry can vary, so, in one embodiment, the chemistry of the base ingot is taken into account.
- the amount of zinc in the base ingot is taken into account when determining how much additional zinc to add to arrive at the desired final composition for the alloy.
- the base ingot should be selected to provide the required copper for the alloy while considering the secondary elements in the base ingot and their intended presence in the final alloy since small amounts of various impurities, such as iron, are common and have no material effect on the desired properties.
- Lead has typically been included as a component in copper alloys, particularly for applications such as plumbing where machinability is an important factor.
- Lead has a low melting point relative to many other elements common to copper alloys.
- lead in a copper alloy, tends to migrate to the interdendritic or grain boundary areas as the melt cools.
- the presence of lead at interdendritic or grain boundary areas can greatly improve machinability and pressure tightness.
- the serious detrimental impacts of lead have made use of lead in many applications of copper alloys undesirable.
- the presence of the lead at the interdendritic or grain boundary areas the feature that is generally accepted to improve machinability, is, in part, responsible for the unwanted ease with which lead can leach from a copper alloy.
- Sulfur is added to the alloys of the present invention to overcome certain disadvantages of using leaded copper alloys.
- Sulfur present in the melt will typically react with transition metals also present in the melt to form transition metal sulphides.
- transition metals For example, copper sulfide and zinc sulfide may be formed, or, for embodiments where manganese is present, it can form manganese sulfide.
- Figure 25 illustrates a free-energy diagram for several transition metal sulphides that may form in embodiments of the present invention.
- the melting point for copper sulfide is 1 130 Celsius, 1 185 Celsius for zinc sulfide, 1610 Celsius for manganese sulfide, and 832 Celsius for tin sulfide.
- the presence of the sulphides provides a break in the metallic structure and a point for the formation of a chip in the grain boundary region and improve machining lubricity, allowing for improved overall machinability.
- the sulphides predominate in the alloys of the present invention provide improved lubricity. Good distribution of sulphides improves pressure tightness, as well as, machinability.
- tin in some embodiments increases the strength and hardness but reduces ductility by solid solution strengthening and by forming Cu-Sn intermetallic phase such as Cu 3 Sn. It also increases the solidification range. Casting fluidity increases with tin content. Tin also increases corrosion resistance. However, currently Sn is very expensive relative to other components.
- Zn is similar to that of Sn, but to a lesser degree, in certain embodiments approximately 2% Zn is roughly equivalent to 1 % Sn with respect to the above mentioned improvements to characteristics noted above.
- Zn increases strength and hardness by solid solution hardening.
- Cu-Zn alloys have a short freezing range.
- Zn is much less expensive than Sn.
- iron can be considered an impurity picked up from stirring rods, skimmers, etc during melting and pouring operations, or as an impurity in the base ingot.
- Such categories of impurity have no material effect on alloy properties.
- nickel is included to increase strength and hardness. Further, nickel aids in distribution of the sulphide particles in the alloy. In one embodiment, adding nickel helps the sulfide precipitate during the cooling process of the casting. The precipitation of the sulfide is desirable as the suspended sulfides act as a substitute to the lead for chip breaking and machining lubricity during the post casting machining operations. With the lower lead content, it is believed that the sulfide precipitate will minimize the effects of lowered machinability.
- Phosphorus may be added to provide deoxidation.
- the addition of phosphorus reduces the gas content in the liquid alloy. Removal of gas generally provides higher quality castings by reducing gas content in the melt and reducing porosity in the finished alloy. However, excess phosphorus can contribute to metal- mold reaction giving rise to low mechanical properties and porous castings.
- Al is, in some embodiments, such as semi-red brasses and tin bronzes, treated as an impurity.
- aluminum has harmful effects on pressure tightness and mechanical properties.
- aluminum in yellow brass castings can selectively improve casting fluidity. It is believed that aluminum encourages a fine feathery dendritic structure in such embodiments which allows for easy flow of liquid metal.
- Silicon is also considered an impurity. In foundries with multiple alloys, silicon based materials can lead to silicon contamination in non silicon containing alloys. A small amount of residual silicon can contaminate semi red brass alloys, making production of multiple alloys near impossible. In addition, the presence of silicon can reduce the mechanical properties of semi-red brass alloys.
- Manganese may be added in certain embodiments.
- the manganese is believed to aid in the distribution of sulphides.
- the presence of manganese is believed to aid in the formation of and retention of zinc sulfide in the melt.
- a small amount of manganese is added to improve pressure tightness.
- manganese is added as MnS.
- Either zirconium or boron may be added individually (not necessarily in combination) to produce a fine grained structure which improves surface finish of castings during polishing.
- Carbon may be added in certain embodiments to improve pressure tightness, reduce porosity, and improve machinability.
- carbon may be added to the alloy as copper coated graphite ("CCG").
- CCG copper coated graphite
- One type of copper coated graphite product is available from Superior Graphite and sold under the name DesulcoMCTM.
- One embodiment of the copper coated graphite utilizes graphite that contains 99.5% min carbon, 0.5% max ash, and 0.5% max moisture. US mesh size of particles is 200 or 125 microns. This graphite is coated with 60% Cu by weight and has very low S.
- carbon may be added to the alloy as calcinated petroleum coke (“CPC") also known as thermally purified coke.
- CPC may be screened to size.
- 1 % sulfur is added and the CPC is coated with 60% Cu by weight.
- CPC because of its relatively higher and coarser S content compared to copper coated graphite, imparts slightly higher S to the alloy and hence, better machinability.
- the atomic radius of carbon is 0.91 X10 "10 M, which is smaller than that of copper (1 .57X "10 M). Without limiting the scope of the invention, it is believed that carbon because of its low atomic volume remains in the face centered cubic crystal lattice of copper, thus contributing to strength and ductility.
- Titanium may be added in combination with carbon, such as in graphite form. Without limiting the scope of the invention, it is believed that the titanium aids in bonding the carbon particles with the copper matrix, particularly for raw graphite. For embodiments utilizing copper coated with carbon, titanium may not be useful to distribute the carbon.
- Brass alloys having antimony have been shown to exhibit dezincification resistance.
- antimony may aid in chip breaking by segregating to the grain boundaries. This provides for improved machinability.
- Sb forms compounds with Cu (Cu 2 Sb) and Zn (ZnSb).
- Sb if added as Stibnite, separates from the S and interacts with Sn and Cu.
- Antimony may be provided in the form of Stibnite, which has the benefit of also providing sulfur and avoiding certain issues that arise with the use of elemental sulfur.
- Figure 2 illustrates a table listing four embodiment corresponding to semi-red brass, tin bronze, yellow brass (permanent mold cast) and yellow brass (sand cast).
- Figure 3 is a table comparing the content of various alloy heats, with the components noted in the comments.
- Figure 3 provides a comparison, for example, of the sulfur content of alloys having various components.
- Figure 4 provides chemical compositions of embodiments of a semi-red brass having antimony and copper coated graphite.
- Figure 7 provides chemical compositions of embodiments of a yellow brass having antimony.
- One embodiment of the invention relates to a composition of matter comprising 82% to about 89% copper, about 0.01 % to about 0.65% sulfur, greater than 0 to about 1 .5% antimony, about 2.0% to about 4.0% tin, less than about 0.09% lead, about 5.0% to about 14.0% zinc, and about 0.5 to about 2.0% nickel.
- less than 0.65% sulfur is utilized to minimize the formation of gases such as sulfur dioxide, which negatively impact the mechanical properties of the finished product made from the alloy.
- the composition comprises 86% to about 89% copper, about 0.1 % to about 0.65% sulfur, greater than 0 to about 1 .5% antimony, about 7.5% to about 8.5% tin, less than about 0.09% lead, about 1 .0% to about 5.0% zinc, and about 1 .0% % nickel.
- the composition comprises 58% to about 62% copper, about 0.01 % to about 0.65% sulfur, greater than 0 to about 1 .5% antimony, about 1 .5% tin, less than about 0.09% lead, about 31 .0% to about 41 .0% zinc, and about 1 .5% % nickel.
- the composition comprises 58% to about 62% copper, about 0.01 % to about 0.65% sulfur, greater than 0 to about 1 .5% antimony, less than about 0.09% lead, and about 31 .0% to about 41 .0% zinc.
- Figure 3 is a chemical analysis table showing examples of various semi-red brasses with copper coated graphite, MnS, and Sulfur.
- Figure 4 is a chemical analysis table showing examples of various semi-red brass with copper coated graphite and antimony in accordance with certain embodiments of the invention.
- Figure 7 is a chemical analysis table showing embodiments of yellow brass with antimony in accordance with certain embodiments of the invention.
- the brass alloy includes stibnite.
- the stibnite may be added in the range of greater than zero but less than 1 .2%. In one embodiment, the preferred range is about 0.4 to about 1 .2%. In one embodiment, the stibnite is 1 .64%. In an alternative embodiment, the stibnite is 0.6%. In an alternative embodiment, the stibnite is 0.4%. The preferred embodiment utilizes about 1 % stibnite.
- Addition of elemental S contributes to environmental problems due to release of sulfur dust and SO2 to the atmosphere.
- the use of stibnite provides a source of antimony and a source of sulfur, without the drawbacks associated with working with elemental sulfur in alloy melts.
- the preferred range for Sb ,S and stibnite, in the final alloy are 0.3 to 0.8%, 0.1 to 0.35% and 0.4 to 1 % respectively. (This is evident from Figures 13B and 13C)
- the brass alloy may include stibnite in combination with carbon.
- the alloy includes 1 .0% CCG or CPC and 1 % stibnite.
- an additional 0.2% sulphur is provided for better machinability.
- 1 % carbon and 1 % stibnite is utilized.
- the stibnite is 0.6% and the carbon is 1 .
- the stibnite is 1 .64% and the carbon is 1 .5%.
- the carbon is copper coated graphite.
- the carbon is CPC.
- the total amount of stibnite utilized in the melt can be varied to alter the amount of sulfur and the amount of antimony in the final alloy.
- 0.4 % Stibnite gives 0.071 % S and 0.27% Sb
- 0.6% Stibnite gives 0.12% S and 0.4 % Sb
- 0.8% stibnite gives 0.2% S and 0.64% Sb
- 1 % stibnite gives 0.25% S and 0.77% Sb
- 1 .2% stibnite gives 0.278 % S and 0.859% Sb
- 1 .64% Stibnite gives 0.4% S and 1 .35 % Sb.
- about 0.5 to about 1 .0 CCG (or CPC) together with about 0.8 to about 1 .0 Stibnite provides desirable mechanical properties and machinability.
- the use of the stibnite provides benefits of sulfur while avoiding many of the issues with using pure sulfur in an alloy melt, including flaring and excess dross.
- the stibnite breaks down to Sb and S. Sb reacts with Cu and Sn to form intermetallic compounds; whereas S reacts with Cu and Zn to form their sulfides.
- the stibnite is wrapped in copper foil prior to addition to the melt.
- the wrapped stibnite may be added after melting the ingots and bringing temperature to about 2000F.
- about 0.5 to about 1 .0 CCG (or CPC) is utilized with about 0.8 to about 1 .0 Stibnite to provide the best combination of mechanical properties and machinability.
- additional sulfur may be added to further increase the amount of sulfur in the alloy.
- an alloy of the present invention solidifies in a manner such that a multitude of discrete particles of sulfur/sulfide are distributed throughout in a generally uniform manner throughout the casting. These nonmetallic sulfur particles serve to improve lubricity and break chips developed during the machining of parts cast in this new alloy, thereby improving machinability with a significant or complete reduction in the amount of lead. Without limiting the scope of the invention, the sulfides are believed to improve lubricity. The presence of antimony further improves properties of the C84030 red brass as described below. Embodiments utilizing stibnite provide for a source of antimony and sulfur while also delivering the sulfur in a form more readily compatible with the alloy melt process.
- the preferred embodiments of the described alloy retain machinability advantages of the current leaded alloys. Further, it is believed that due to the relative scarcity of certain materials involved, the preferred embodiments of the ingot alloy will cost considerately less than that of the bismuth and/or selenium alloyed brasses that are currently advocated for replacement of leaded brass alloys.
- the sulfur is present in certain embodiments described herein as a sulfide which is soluble in the melt, but is precipitated as a sulfide during solidification and subsequent cooling of the alloy in a piece part. This precipitated sulfur enables improved machinability by serving as a chip breaker similar to the function of lead in alloys and in bismuth and selenium alloys.
- graphite is placed on the bottom of the crucible prior to heating.
- silicon carbide or clay graphite crucibles may be used in the melts. It is believed that the use of graphite reduces the loss of zinc during the heat without substantially becoming incorporated into the final alloy.
- approximately two cups of graphite are used for a 90 to 95 lbs capacity crucible.
- a B-30 crucible was used for the melts, which has a capacity of 90 to 95 lbs of alloy.
- the carbon is wrapped in copper foil, preheated in oven at 150 C to drive off moisture and plunged into the melt followed by stirring.
- the required base ingot is placed in the crucible and the furnace started.
- the base ingot is brought to a temperature of about 1 ,149 degrees Celsius to form a melt.
- a conventional gas-fired furnace is used, and in another an induction furnace is used.
- the furnace is then turned off, i.e. the melt is no longer heated.
- the additives except, in one embodiment, for sulfur and phosphorus, are then plunged into the melt between 15 to 20 seconds to achieve desired levels of Zn, Ni and Sn.
- the additives comprise the materials needed to achieve the final desired alloy composition for a given base ingot.
- the additives comprise elemental forms of the elements to be present in the final alloy. Then a partial amount of slag is skimmed from the top of the melt.
- the furnace is then brought to a temperature of about 1 ,171 Celsius.
- the furnace is then shut off and the sulfur additive is plunged in, such as in the form of stibnite.
- the furnace is then reheated to a temperature of about 1 ,177 degrees Celsius and phosphorous is plunged into the melt as a Cu-P master alloy.
- phosphorous is plunged into the melt as a Cu-P master alloy.
- preferably all of the slag is skimmed from the top of the crucible.
- Tail castings for pressure testing and evaluation of machinability and plating, buttons, wedges and mini ingots for chemical analysis, and web bars for tensile testing are poured at about 1 ,149, about 1 ,1 16, and about 1 ,093 degrees Celsius respectively.
- Table 1 (below in the section regarding machinability) provides an analysis of select properties of certain embodiments of the alloys of semi-red brass with copper coated graphite, MnS, and Sulfur, including machinability, mechanical properties, cost, etc.
- Figure 6 shows Composition and Mechanical Properties of Semi-red Brass C84030, illustrating semi- red brass with stibnite added and with various other combinations of MnS and copper coated graphite.
- the mechanical properties of semi- red Brass (SRB) with low amounts of Stibnite are generally around 40.5 ksi UTS, 18.3 ksi Ys and 41 .0% elongation.
- stibnite in a yellow brass alloy either for wrought or permanent mold casting, with all variations of antimony of Stibnite are generally around 49.83 ksi UTS, 29.0 ksi Ys and 7% elongation.
- the 1 % stibnite alloy of C84030 provided 42.9 ksi UTS, 20.3 ksi YS, and 32% Elognation.
- C84030 includes 0.1 % to 1 .5% antimony.
- Figure 8 is a table indicating composition and mechanical properties of certain embodiments of C28330 a yellow brass. Properties of certain embodiments of yellow brass C28330 have been compared with known leaded yellow brass alloys C26000 and C35600. Zr and B were added to heat P4H2A to see if grain refinement would produce any beneficial effect. There appears to have some benefits. UTS and hardness of the grain refined one are relatively higher in the cold rolled condition. % elongation and UTS of cold rolled and annealed at 1290 F are also relatively higher. It is believed that the grain size of this annealed sample is finer than that of heat P4H1 . Figure 8 also includes information regarding annealing and cold working.
- Figure 9 summarizes the properties for several commercially available alloy compounds and for embodiments tested of the C84030 red brass and the C85930 yellow brass.
- Machinability was tested for certain embodiments of semi-red brass C84030 and yellow brass C28330. Machinability testing described in the present application was performed using the following method. The piece parts were machined by a coolant fed, 2 axis, CNC Turning Center. The cutting tool was a carbide insert. The machinability is based on a ratio of energy that was used during the turning on the above mentioned CNC Turning Center. The calculation formula can be written as follows:
- E-i Energy used during the turning of a "known" alloy C 36000 (CDA).
- E 2 Energy used during the turning of the New Alloy.
- Figures 10A-J illustrates the machinability of the C84030 red brass and Figure 1 1 illustrates C28330 yellow brass in comparison to the commercially available C36000 leaded red brass.
- Machinability testing of embodiments of C84030 red brass indicate the addition of CCG does not improve machinability. There is some improvement in machinability when CCG and MnS are added together.
- the addition of sulfur improves machinability; however, addition of sulfur creates a lot of fumes in the melting area which is not environmentally friendly.
- the addition of MnS improves machinability; however, MnS is very expensive and increases ingot cost significantly.
- the addition of antimony as stibnite improves machinability.
- the benefits to machinability of embodiments of the C84030 red brass are lessened above 1 % stibnite (for example, providing 0.8% antimony) as machinability decreases when stibnite content exceeds 1 %.
- a red-brass alloy includes 0.4-1 % stibnite. In one embodiment, 0.3-0.8% antimony is included.
- Machinability index of wrought alloy C28330 was 61 %, which compares with C84030 containing Sb under 1 %. It was observed that tail castings produced by permanent mold casting were used for machinability evaluation. These have a fine grain structure compared with sand cast C84030 tail castings. Chip morphology of C28330 was not good in comparison with C84030. However, it should be noted that the machined surfaces looked good. It should be appreciated that the possibility exists that the machinability rating could change if different speeds, feeds and tool geometry were to be used and samples can be machined well with proper use of tools and appropriate feed rate and speed.
- Table 5 lists the seven alloys of the present invention from Figure 6. The mechanical properties of these alloys were tested. Specifically, UTS, YS, and %elongation. Table 5 also lists the weight percent for each of the sample alloys of stibnite, antimony, and sulfur. The UTS and YS exhibit a trend of improving (increasing) with a maximum at alloy 84XX42-H20P2-7X, which has 1 .0 % stibnite, (0.770 antimony, and 0.249 sulfur). %Elongation exhibits a trend of decreasing as the weight percent of each of stibnite, antimony, and sulfur increase, with the decrease between more pronounced at the higher percentages.
- the observed microstructures consist of dispersed particles throughout the copper-rich matrix. As polished metallograph photomicrographs were taken at 500X. Image analysis was then performed to determine the particle size. The minimum, maximum and average measurements are reported in the following table. As polished photomicrographs are provided in Figures 15A, 16A, and 17A for each of the three tested sample alloys respectively.
- Figures 15A, 16A, and 17A are a photographs of Sample 1 109337, Sample 84XX42-022812-H20P2-9A, and 84XX9-0131 12-H18P2-10A, respectively, showing inclusions.
- Figures 15B and 15C are a SEM images of Sample 1 109337.
- Figures 16B and 16C are a SEM images of Sample 84XX42-022812-H20P2-9A.
- Figures 17B and 17C are a SEM images of Sample 84XX9-0131 12-H18P2-10A.
- the dark materials illustrate sulfur distribution within the alloy. As can be seen, the sulfur distribution as copper sulfides and zinc sulfides are present in dendritic and interdendritic areas.
- Figure 15D illustrates elemental mapping of Sample 1 109337 for sulfur, manganese, iron, nickel, copper, zinc, tin, and antimony.
- Figure 15J illustrates elemental mapping of Sample 1 109337 for sulfur, iron, nickel, copper, zinc, tin, and antimony.
- the distribution of elements is indicative of the stibnite breaking down into antimony and sulfur.
- the antimony distribution of 15D and the sulfur distribution of 15D indicate that the antimony is not isolated to the regions with sulfur, i.e. still present as a sulfide.
- the observed elemental distribution is in agreement with the expected formation based upon the free energies of the involved reactions.
- Figure 16D illustrates elemental mapping of Sample 84XX42-022812-H20P2- 9A for sulfur, manganese, iron, nickel, copper, zinc, tin, and antimony.
- Figures 16J illustrates elemental mapping of Sample 84XX42-022812-H20P2-9A for sulfur, iron, nickel, copper, zinc, tin, antimony, phosphorous, and lead.
- the distribution of elements is indicative of the stibnite breaking down into antimony and sulfur.
- the antimony distribution of 16F and the sulfur distribution of 16D indicate that the antimony is not isolated to the regions with sulfur, i.e. still present as a sulfide.
- the observed elemental distribution is in agreement with the expected formation based upon the free energies of the involved reactions.
- Figure 17D illustrates elemental mapping of Sample 84XX9-0131 12-H18P2- 10A for sulfur, manganese, iron, nickel, copper, zinc, tin, and antimony.
- Figure 17J illustrates elemental mapping of Sample 84XX9-0131 12-H18P2-10A for sulfur, iron, nickel, copper, zinc, tin, antimony, phosphorous, and lead.
- the distribution of elements is indicative of the stibnite breaking down into antimony and sulfur.
- the antimony distribution of 18F and the sulfur distribution of 18D indicate that the antimony is not isolated to the regions with sulfur, i.e. still present as a sulfide.
- the observed elemental distribution is in agreement with the expected formation based upon the free energies of the involved reactions.
- micrograph information supports the improved mechanical properties discussed above. Because some antimony remains in solid solution, a good %elongation is observed. The intermetallic compound and the solid solution contribute to strength. However, if there is too much intermetallic compound, strength and % elongation could gradually decrease. A decrease in UTS and % elongation is observed at 1 .64% Stibnite addition.
- SEM /EDS element analysis reveals dispersed particles primarily consisting of sulfur, zinc, tin, or antimony.
- SEM backscatter images taken at 200X and 1000X along with element maps at 1500X showing the requested element intensities are provided in Figures 15E-J, 16E-J, and 17E-J.
- Table 6 sets froth the particle size information for the tested alloys. The average particle size increases with Sb and S contents, shown in Figure 14
- SEM EDS spectra results of the base material from sample 1 109320 consist of significant amounts of copper with lesser amounts of tin, nickel, and zinc (see location 1 , Figure 15F).
- the light colored phase reveals significant amounts of copper, tin, and antimony with lesser amounts of nickel zinc (see location 2 and 4, Figure 15G and 151).
- the dark colored phase reveals significant amounts of zinc and sulfur with lesser amounts of nickel (see location 3, Figure 15H).
- the EDS spectra did not show any peaks for Sb, presence of Sb in the microstructure (matrix as well as some intermetallic compounds) is evident from the elemental maps (see Fig. 15D).
- SEM EDS spectra results of the base material from sample 84XX42-022812- H20P2-9A consist of significant amounts of copper with lesser amounts of tin, nickel, and zinc (see location 1 , Figure 16E).
- the dark colored phase reveals significant amounts of zinc and sulfur with lesser amounts of copper (see location 2, Figure 16G).
- the light colored phase reveals significant amounts of copper, tin, and antimony with lesser amounts of phosphorous, lead, iron, nickel, and zinc (see location 3 and 4, Figures 16H, 161).
- SEM EDS spectra results of the base material from sample 84XX9-01 1312- H18P2-10A consist of significant amounts of copper with lesser amounts of tin, antimony, nickel and zinc (see location 1 , Figure 17F).
- the light colored phase reveals significant amounts of copper, tin, and antimony with lesser amounts of nickel zinc (see location 2, Figure 17G).
- the dark colored phase reveals significant amounts of zinc and sulfur with lesser amounts of iron and copper (see location 3 and 4, Figures 17H, 171).
- Location 4 ( Figure 17J) reveals lesser a mounts of nickel.
- Results are semi-quantitative, the spectra results are in weight percent unless otherwise indicated and the method used was SEM/EDS
- grain size of permanent mold cast sample is about 50 microns (Fig.18A). Grains and second phase particles get elongated during cold rolling(Figs. 20A and 20B). Annealing at 1290 F has produced a recrystallized microstructure. Grains are equiaxed. (Fig.19B) Average grain size is about 70 microns. This is relatively coarser than the as-cast grain size. It is believed that for alloys of C28330 annealed at 1 100 and 1200 F. there would be finer than 70 microns grains as evident from the elongation values. The large grain size of 1290 F annealing reduces the % elongation. Antimony content of the two alloys was in the range 0.3 to 0.4%. Although the tested regions did not show any antimony peaks it is believed to be due to the low levels. Antimony is believed to be in solid solution with Cu.
- copper may utilize a number of elements to alloy with.
- stibnite as disclosed herein was tested in comparison to two forms of carbon, CCG and CPC, sulfur, manganese sulfide, and combinations thereof as indicated in Table 1 1 .
- the base composition 87 Cu, 9 Zn, 3 Sn, 1 Ni, 0.4 S for the red brass, plus the indicated amount of antimony. It is generally observed that Sb forms stable compounds with Cu (Cu 2 Sb), with Mn (MnSb and Mn 2 Sb) with Zn (ZnSb) and with S (Sb 2 S 3 ). Among these, it is believed that only Cu 2 Sb forms when Sb is added in the range of 0.4 to 1 .3 wt%. The addition of Sb did not change the liquidus or the solidus temperatures.
- Figures 21 A and 21 B illustrate the phase diagrams of alloys having 0% antimony, 0.8%, and 1 .3% antimony respectively.
- Figure 22A is a phase assemblage diagram of Semi-Red Brass with 0.8 Sb. Less than 2 wt% Cu 2 Sb formed, as can be seen in the magnified Figure 22B. Magnified part of the phase assemblage diagram of Semi-Red Brass with 0.8 Sb.
- Figure 22C is a magnified part of a phase assemblage diagram of semi-red brass C84030 with 1 .3% antimony. When the Sb content is increased to 1 .3, the amount of Cu 2 Sb increased to around 3 wt%. Similar amounts of Cu2Sb form during Scheil cooling as well, as can e seen in Figures 19D (0.8% Sb)and 22E (1 .3% Sb).
- Scheil cooling shows that one can expect the FCC solid solution phase (Cu containing Zn, Ni, some Sn and some Sb in solid solution), the beta ( ⁇ ') phase with Zn, Cu 3 Sn intermetallic compound, Cu 2 S and Cu 2 Sb. Melting point is not affected by the addition of Sb and is about 1025 C which is close to equilibrium temp of 1030 C. Solidus temp under Scheil cooling is 825 C.
- Microstructural analysis shows that there are Zn, Sn and Ni in solid solution with Cu. In view of the microstructure and the phase analysis, it is believed that stibnite breaks down to Sb and S. Some Sb is in solid solution with Cu and some forms Cu 2 Sb compound. S combines with Zn and also Cu to form ZnS and Cu 2 S. The high level of Sn and Cu in some phases indicates that it is Cu 3 Sn phase.
- a 100 kg overall alloy will contain the following amounts of each phase in kg.
- Figure 23 illustrates a phase diagram showing the location of the yellow brass alloy C28330 (61/38/0.3/0 Cu/Zn/Sn/Sb wt%).
- Figures 24A illustrates Equilibrium phase assemblage diagram of yellow brass with 0 wt% Sb
- Figure 24B illustrates Equilibhum phase assemblage diagram of yellow brass with 0.6 wt% Sb.
- the impact of the antimony can be seen in Figure 24B and is further seen in Figure 24C is an equilibrium phase assemblage diagram of yellow brass with 1 wt% Sb.
- Figure 24D is a Scheil phase assemblage diagram of yellow brass with 0 wt% Sb.
- Figure 24E is a Scheil phase assemblage diagram of yellow brass with 0.6 wt% Sb.
- Figure 24F is a Scheil phase assemblage diagram of yellow brass with 1 wt% Sb.
- the Scheil cooling shows that expected phases the beta ( ⁇ ) phase with Zn, some ZnS and Cu 2 Sb. Observed melting point with Sb is about 900 C and solidus temp is 894 C.
- a 100 kg overall alloy will contain the following amounts of each phase in kg.
- Figure 26A shows dezincification corrosion (between lines) extends to a maximum depth of 0.0012" (31 .2 microns) from the exposed surface (towards top) in the metallographic section prepared through the edge of the "MBAF 180" sample Unetched. (494X).
- Figure 26B shows dezincification corrosion (between lines) extends to a maximum depth of 0.01 13" (287.0 microns) from the exposed surface (towards top) in the metallographic section prepared through the core of the "MBAF 180" sample. Unetched. (201 X).
- Figure 27A shows dezincification corrosion (between lines) extends to a maximum depth of 0.04830" (1 ,228.1 microns) from the exposed surface (towards top) in the metallographic section prepared through the thin walled section of the "C36000 Ht# 1 -Yeager” sample. Unetched. (50X).
- Figure 27B shows dezincification corrosion (between red lines) extends to a maximum depth of 0.05133" (1 ,303.8 microns) from the exposed surface (towards top) in the metallographic section prepared through the thick walled section of the "C36000 Ht# 1 -Yeager” sample. Unetched. (50X).
- Figure 28A shows no dezincification corrosion is present at the exposed surface (towards top) in the metallographic section prepared through the edge of the "28330-Lab# 358050 P4 H2a" sample of a C28330 yellow brass alloy Unetched. (494X)).
- Figure 28B shows dezincification corrosion (between lines) extends to a maximum depth of 0.0033" (82.8 microns) from the exposed surface (towards top) in the metallographic section prepared through the core of the "28330-Lab# 358050 P4 H2a" sample. Unetched. (494X).
- Figure 29A shows no dezincification corrosion is present at the exposed surface (towards top) in the metallographic section prepared through the edge of the "84030-62412-H3P2-9" sample. Unetched. (494X).
- Figure 29B shows no dezincification corrosion is present at the exposed surface (towards top) in the metallographic section prepared through the edge of the "84030-62412-H3P2-9" sample. Unetched. (494X).
- the Ultimate Tensile Strength has to be greater than the maximum limit of C 84030 ( > than 42.9)
- the Yield Strength has to be greater than the maximum limit of C 84030 ( > than 20.3)
- the Elongation % has to be greater than the typical limit of C 84400 ( > than 26)
- Table 19 below provides a summary of the results of the variance testing.
- the design of experiment (DOE) was conceptually structured based on a statistical Taguchi method. The defining elements to the alloy were brought both above and below their defined limits. Table 19 below shows this logic always with the end result being 100%. The end goal being to see if better properties existed by going both above and below the defined limits to the nominal range for C84030.
- Figure 31 illustrates the relation of alloy properties between C84030 red brass and two commercial brasses which were used as the base for the DOE.
- Figure 32 includes composition information for several tested variance alloys along with the mechanical properties. None of the variance alloys provided superior results for the three properties.
- the mechanical properties of the eight alloys show that although there are some alloys outside the range for C84030 that can meet some of the minimum and typical mechanical properties shown in Figure 9 for C84030, there is no single alloy that can exceed the requirments set out above for UTS, YS and % elongation.
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CN201380032908.4A CN104379784A (en) | 2012-05-03 | 2013-05-03 | Antimony-modified low-lead copper alloy |
MX2014013285A MX366520B (en) | 2012-05-03 | 2013-05-03 | Antimony-modified low-lead copper alloy. |
JP2015510494A JP6359523B2 (en) | 2012-05-03 | 2013-05-03 | Antimony-modified low-lead copper alloy |
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JP (1) | JP6359523B2 (en) |
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US9181606B2 (en) | 2010-10-29 | 2015-11-10 | Sloan Valve Company | Low lead alloy |
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US20120121455A1 (en) * | 2010-10-29 | 2012-05-17 | Sloan Valve Company | Low lead ingot |
US9829122B2 (en) | 2011-11-07 | 2017-11-28 | Nibco Inc. | Leach-resistant leaded copper alloys |
US8991787B2 (en) | 2012-10-02 | 2015-03-31 | Nibco Inc. | Lead-free high temperature/pressure piping components and methods of use |
US11440094B2 (en) | 2018-03-13 | 2022-09-13 | Mueller Industries, Inc. | Powder metallurgy process for making lead free brass alloys |
US11459639B2 (en) | 2018-03-13 | 2022-10-04 | Mueller Industries, Inc. | Powder metallurgy process for making lead free brass alloys |
CN109038940A (en) * | 2018-08-08 | 2018-12-18 | 东莞市特姆优传动科技有限公司 | A kind of efficient high thrust solar panels electric pushrod |
WO2021134210A1 (en) * | 2019-12-30 | 2021-07-08 | 华亿轴承科技(江苏)有限公司 | Preparation method for oil-free bearing material |
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US20110064602A1 (en) * | 2009-09-17 | 2011-03-17 | Modern Islands Co., Ltd. | Dezincification-resistant copper alloy |
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US2102388A (en) * | 1933-09-21 | 1937-12-14 | American Brass Co | Copper-sulphur alloy |
KR100255143B1 (en) * | 1996-03-14 | 2000-05-01 | 후쿠마 노부오 | Copper alloy and bearing having improved seizure resistance |
JP3459623B2 (en) * | 2000-08-08 | 2003-10-20 | 京和ブロンズ株式会社 | Lead-free bronze alloy |
JP3999676B2 (en) * | 2003-01-22 | 2007-10-31 | Dowaホールディングス株式会社 | Copper-based alloy and method for producing the same |
JP5259102B2 (en) * | 2007-02-27 | 2013-08-07 | 株式会社キッツ | Low lead bronze casting alloy |
JP5335558B2 (en) * | 2009-05-26 | 2013-11-06 | 滋賀バルブ協同組合 | Lead-free copper alloy for castings with excellent mechanical properties |
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2013
- 2013-05-03 JP JP2015510494A patent/JP6359523B2/en not_active Expired - Fee Related
- 2013-05-03 CN CN201380032908.4A patent/CN104379784A/en active Pending
- 2013-05-03 MX MX2014013285A patent/MX366520B/en active IP Right Grant
- 2013-05-03 CA CA2872498A patent/CA2872498C/en active Active
- 2013-05-03 US US13/887,231 patent/US20130294965A1/en not_active Abandoned
- 2013-05-03 WO PCT/US2013/039567 patent/WO2013166454A1/en active Application Filing
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WO1992015718A1 (en) * | 1991-03-01 | 1992-09-17 | Olin Corporation | Machinable copper alloys having reduced lead content |
US5653827A (en) * | 1995-06-06 | 1997-08-05 | Starline Mfg. Co., Inc. | Brass alloys |
US20060289094A1 (en) * | 2004-01-15 | 2006-12-28 | Ming Zhang | Lead-free free-cutting brass alloys |
JP2008088499A (en) * | 2006-10-02 | 2008-04-17 | Kobe Steel Ltd | Copper alloy sheet superior in press stampability for electric and electronic parts |
US20110064602A1 (en) * | 2009-09-17 | 2011-03-17 | Modern Islands Co., Ltd. | Dezincification-resistant copper alloy |
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US9181606B2 (en) | 2010-10-29 | 2015-11-10 | Sloan Valve Company | Low lead alloy |
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JP6359523B2 (en) | 2018-07-18 |
JP2015517608A (en) | 2015-06-22 |
MX366520B (en) | 2019-07-11 |
CA2872498A1 (en) | 2013-11-07 |
US20130294965A1 (en) | 2013-11-07 |
CN104379784A (en) | 2015-02-25 |
CA2872498C (en) | 2020-08-11 |
MX2014013285A (en) | 2015-11-16 |
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