WO2013141608A1

WO2013141608A1 - Backlight unit

Info

Publication number: WO2013141608A1
Application number: PCT/KR2013/002310
Authority: WO
Inventors: 최유진; 이동헌; 김병호; 차준선
Original assignee: 티티엠주식회사
Priority date: 2012-03-22
Filing date: 2013-03-20
Publication date: 2013-09-26
Also published as: KR20130107586A; CN104603680A; JP2015514292A; KR101342247B1; JP2017162819A; CN104603680B; JP6189411B2; CN107092131A

Abstract

The present invention relates to a backlight unit. The backlight unit of the present invention comprises: an optical plate constituted by at least either a light guide plate for allowing light to pass at a dispersed state or a diffusion plate for allowing light to pass at a diffused state; an LED module having a light-emitting element for providing light to the optical plate and a circuit for driving the light-emitting element; a heat pipe for absorbing heat generated from the LED module through one side thereof and transferring the absorbed heat to the other side thereof so as to dissipate the heat; and a housing for accommodating at least one of the heat pipe, the optical plate and the LED module. The LED module is directly connected to one side of the heat pipe such that the heat from the LED module can be directly transferred to the one side of the heat pipe. The backlight unit of the present invention has excellent heat dissipating performance as the heat from the LED module is directly transferred the heat pipe.

Description

Backlight unit

The present invention relates to a backlight unit, and more particularly, to a backlight unit capable of cooling by dissipating heat generated from a light emitting device through a heat pipe.

1 and 2 illustrate a flat panel display to which a backlight unit according to the prior art is applied, and is disclosed in Korean Patent Application No. 10-1047726 (name: backlight unit and display device having the same). Drawing.

As shown in FIG. 1, the above-described backlight includes a light emitting device made of a light emitting diode and an LED module 1 formed of a circuit board, and a heat radiating plate 3 and a heat pipe made of a light guide plate 2 and a shape shown. And 4 and the housing 5 to form a backlight unit.

Here, the above-described heat pipe 4 is formed in a flat plate shape as shown in Figs. 1 and 2 and is in close contact with the housing 5 as shown in Fig. In addition, the above-described heat sink 3 is in close contact with the heat pipe 4, as shown in Figure 2, the LED module (1) consisting of a circuit board (1b) mounted with a light emitting element (1a) on one side bent. Is attached. In addition, the light guide plate 2 described above is accommodated in the housing 5 together with the heat pipe 4 and the heat sink 3 as shown in FIG. 2.

In the backlight unit of the prior art, as shown in FIG. 2, heat of the LED module 1 is transferred to the heat pipe 4 through the heat sink 3 to radiate heat.

However, since the heat of the LED module 1 is transferred to the heat pipe 4 through the heat sink 3, the LED module 1, the heat sink 3 and the heat sink 3 and the heat pipe ( 4) There is a problem in that the heat dissipation effect is lowered by the thermal resistance between. That is, since the heat sink 3 made of metal has a lower heat transfer efficiency than the heat pipe 4 which dissipates heat quickly due to the working fluid therein, the heat pipe 4 receives heat from the LED module 1 directly. It exhibits a relatively low heat dissipation performance than heat transfer with a heat dissipator such as the housing 5.

On the other hand, the heat pipe 4 is formed as a straight line, as shown in Figure 3, as one end is in close contact with the heat sink 3 to absorb heat of the LED module 1 to one end to radiate heat to the other end. .

However, in the related art, since only one end of the heat pipe 4 is in contact with the heat sink 3, the endothermic area is not only limited to one end, but a gap section G that does not endotherm is generated as shown. . Therefore, in the related art, due to the separation distance between the light emitting elements 1a formed by the spaced interval G, the heat of the light emitting element 1a disposed in the vicinity of the spaced interval G is relatively discharged. Since the luminous flux is deteriorated, the heat pipe 4 absorbs heat only the light emitting devices 1a disposed at the width of one end of the heat pipe 4 despite the light emitting device 1a in the separation section G. By absorbing only the amount of heat that the heat transfer performance of (4) cannot be sufficiently exhibited, that is, the heat absorbing portion of the heat pipe 4 constituting one end of the heat pipe 4 by absorbing heat of the light emitting element 1a. Since the light emitting element 1a contacts the light emitting element 1a in a narrow area and absorbs heat of the light emitting element 1a in a limited manner, the working fluid received heat inside the heat pipe 4 serves as a condenser. Blind spot that cannot be delivered to the end (△ L) May occur.

In addition, in the related art, since the heat pipe 4 is formed in a straight line shape as shown, the heat pipe 4 is shown as shown in order to minimize the separation section G in which heat is not transmitted to the heat pipe 4. It is to be manufactured in a structure that minimizes the separation section G by installing densely or successively or by installing a wide heat pipe (not shown) instead of the heat pipe 4 shown. However, in this case, the manufacturing cost and manufacturing cost increase due to the increase in the number of the heat pipes 4 or the widening.

Meanwhile, reference numeral 11 in FIG. 1 is a reflective sheet for reflecting light of the light emitting device 1a, 12 is a supporting member for supporting a display panel displaying a screen, 13 is a diffusion sheet for diffusing light, 15 is a top cover which is coupled to the housing 5.

The present invention was created to solve the above problems, and an object thereof is to provide a backlight unit in which heat of an LED module can be directly transferred to a heat pipe.

In addition, one end of the components constituting the LED module is directly connected to one side of the heat pipe to directly transfer heat to the heat pipe, or the heat of the LED module to the heat pipe other heat conductive member, in addition to the heat Another object is to provide a backlight unit that can transfer heat to the housing while the pipe transfers heat to the thermally conductive member.

In addition, a part of the heat pipe is in close contact with the above-mentioned heat conductive member, and another part is formed at an angle different from the above-described part in close contact with the heat conductive member, so that the backlight can transfer heat or radiate heat away from the heat conductive member. Another purpose is to provide a unit.

In particular, another object of the present invention is to provide a backlight unit in which the above-described portion of the heat pipe that is in close contact with the thermally conductive member is formed long to increase the endothermic area.

Alternatively, a portion of the heat pipe may be bent to fix the LED module in close contact with the banded portion, or the circuit constituting the LED module may be directly patterned on the banded portion to directly absorb and transfer heat of the LED module. Another object is to provide a backlight unit.

According to an aspect of the present invention, there is provided a backlight unit including: an optical plate including at least one of a light guide plate transmitting light in a dispersed state and a diffusion plate transmitting light in a diffusion state; An LED module having a light emitting element for providing light to the optical plate and a circuit for driving the light emitting element; A heat pipe that absorbs heat generated from the LED module to one side and radiates heat while transferring to the other side; And a housing accommodating at least one of the heat pipe, the optical plate, and the LED module, wherein the heat pipe is configured such that the LED module is directly connected to one side so that the heat of the LED module is directly transferred to one side. It features.

The LED module may be configured of a substrate on which the circuit is patterned and on which the light emitting device is mounted, and the heat pipe is directly connected to one end portion of the heat pipe in an overlapping state.

The present invention is fixed to one side of the substrate is opposed to the side of the optical plate to radiate heat of the LED module to provide the light of the light emitting element mounted on the substrate to the side of the optical plate, and bent at one side One side of the heat pipe is in close contact with the other side, and the heat of the heat pipe is directly transferred to the other side, or the heat of the LED module is transferred to the heat pipe through the other side, and the rear side of the other side where the heat pipe is in close contact with the housing And a heat dissipation angle for transferring heat transferred from the heat pipe and the heat of the LED module to the housing.

The heat pipe may be provided with at least one inflection point for bending in the other part such that the other part is in close contact with the housing and the heat is transferred to the housing while the part is in close contact with the other side of the genital heat dissipation angle.

For example, the heat pipe may be formed to have a length parallel to the heat dissipation angle and closely adhere along the longitudinal direction of the heat dissipation angle. The heat pipe may absorb heat of the LED module and transfer the heat to the other side of the heat dissipation angle, or the heat of the LED module from the heat dissipation angle. One side is passed; And the other side formed to be extended at one side at a different angle from the one side, spaced apart from the heat dissipation angle by a different angle from one side, and the other side having heat transferred from one side as extending from one side. Can be configured.

The heat pipe may include, for example, an endothermic portion that absorbs heat of the LED module as the circuit patterned substrate of the LED module is directly connected to the adhesive state; And a heat transfer part which is bent at the heat absorbing part and formed to be connected to the heat absorbing part, and is transferred to the housing in close contact with the housing to transfer heat transferred from the heat absorbing part to the housing.

The heat pipe may include, for example, an endothermic portion that absorbs heat of the LED module as the circuit of the LED module is patterned on a surface thereof so that the LED module is directly connected to the same form. And a heat transfer part which is bent at the heat absorbing part and formed to be connected to the heat absorbing part, and is transferred to the housing in close contact with the housing to transfer heat transferred from the heat absorbing part to the housing.

The LED module may be partially disposed on the optical plate or disposed only at a central portion thereof to be directly connected to the heat pipe. The heat pipe may include, for example, one side of the LDE module directly connected to absorb heat of the LED module; And a heat transfer part extending from the one side and extending to the housing in close contact with the housing and transferring the heat transferred from the one side to the housing.

According to the present invention, since the LED module is directly connected to the heat pipe, the heat pipe can quickly transfer the heat of the LED module, thereby easily dissipating heat of the LED module.

In addition, since one end of the substrate constituting the LED module is directly connected to one side of the heat pipe forming a plane, the heat pipe can directly transfer the heat of the LED module, and in addition, the substrate and the heat pipe each have one side of the heat radiation angle. And since it is in close contact with the other side can also dissipate heat by transferring heat of the heat pipe transmitted from the LED module through the heat dissipation angle, and furthermore, as the heat pipe is partially bent by the inflection point, a part of the other side is in close contact with the heat dissipation angle. Since the other part of the other side is in close contact with the housing and transfers heat to the housing, heat can be radiated through the housing.

In addition, since one side of the heat pipe closely contacted along the longitudinal direction of the heat dissipation angle is formed along the heat dissipation angle, and the other side of the heat pipe is formed at a different angle from the one side, the heat absorbing area of the heat pipe can be increased. In addition, heat can be transferred to the end of the other side to dissipate heat, and since one side of the heat pipe is formed along the heat dissipation angle, the heat transfer performance or heat dissipation performance required can be secured even if the heat pipe is not densely installed.

On the other hand, since the substrate constituting the LED module is in close contact with the heat absorbing portion of the heat pipe, and the heat of the LED module is directly transferred to the heat pipe, thereby improving heat transfer performance and heat dissipation performance through the heat pipe, and further, heat absorbing of the heat pipe. After the circuit of the LED module is patterned on the unit, when the light emitting device is mounted on the patterned circuit, the heat dissipation (heat resistance) due to the thickness of the substrate is eliminated, thereby improving heat transfer performance and heat dissipation performance, as well as heat. The pipe may take the place of the substrate that constitutes the LED module.

In addition, even if the LED module is partially disposed in the optical plate or installed in the center, the heat pipe is configured to one side and the other side is formed long bent at one side to which the LED module is directly connected, so the heat of the LED module can be easily transferred to Heat dissipation can be performed.

1 is an exploded perspective view of a backlight unit according to the prior art;

FIG. 2 is a partial side cross-sectional view of the backlight unit shown in FIG. 1; FIG.

3 is a front view schematically showing the front of the backlight unit shown in FIG.

4 is a front view of the backlight unit according to the first embodiment of the present invention;

5 is a cross-sectional view taken along the line A-A of FIG. 4;

6 is a sectional view of a backlight unit according to a second embodiment of the present invention;

7 is a sectional view of a backlight unit according to a third embodiment of the present invention;

8 is a front view of a backlight unit according to a fourth embodiment of the present invention;

9 is a front view of a backlight unit according to a fifth embodiment of the present invention;

10 is a front view showing another embodiment of the heat pipe shown in FIG. And

11 is a front view of a backlight unit according to a sixth embodiment of the present invention.

Hereinafter, the backlight unit according to the first embodiment of the present invention will be described with reference to FIGS. 4 and 5.

The backlight unit according to the first embodiment of the present invention includes an optical plate 53, an LED module 50, a heat pipe 60, and a housing 54 as shown in FIGS. 4 and 5.

The optical plate 53 is composed of at least one of a conventional light guide plate for transmitting light in a dispersed state and a conventional diffuser plate for transmitting light in a diffused state. When the optical plate 53 is configured as a light guide plate, as shown in FIG. 5, the optical plate 53 is disposed in front of the LED module 50 to uniformly disperse the light flowing to the side through the LED module 50 to the light guide plate as a whole. And, when the optical plate 53 is composed of a diffusion plate, as shown in Figs. 9 and 10, the LED module 50 is installed on the back, the light of the LED module 50 flowing from the back uniformly as a whole Spread. Since the optical plate 53 is a normal member, detailed description thereof will be omitted.

The LED module 50 may include, for example, a light emitting device 51 for providing light to the above-described optical plate 53 and a circuit for driving the light emitting device 51. In this case, the circuit may be patterned on the substrate 52 as shown in FIG. 4. In addition, the light emitting device 51 may be configured as a light emitting diode mounted on the substrate 52 or a conventional LED package including the light emitting diode as shown in FIG. 4. Accordingly, the LED module 50 may include the light emitting device 51 and the substrate 52 patterned as shown in FIG. 4.

When the optical plate 53 is composed of a light guide plate, the LED module 50 is disposed on the side of the optical plate 53 to emit light toward the side of the optical plate 53, as shown in FIG. 4.

The heat pipe 60 absorbs heat generated from the LED module 50 to one side and heats (transfers) or radiates heat to the other side. The heat pipe 60 is composed of a flat heat pipe, and one side is in close contact with the above-described substrate 52 of the LED module 50 as shown in FIG. 5. The heat pipe 60 is directly connected to one side of the substrate 52, as shown in FIG. In this case, as shown in FIG. 5, the heat pipe 60 may be directly connected to one end of the substrate 52 in a stacked (overlapping) state. Therefore, since the heat pipe 60 is directly connected to the LED module 50 on one side, the heat pipe 60 effectively absorbs heat of the LED module 50 to one side and radiates while transferring to the other side. At this time, the heat pipe 60 quickly transfers the heat absorbed by the working fluid of the inside not shown to the other side.

Meanwhile, the housing 54 described above receives at least one of the heat pipe 60, the LED module 50, and the optical plate 53, as shown in FIG. 5. This housing 54 is combined with the outermost cover of the not shown display to protect the aforementioned components. The housing 54 may be formed in a flat plate shape without being bent as shown in the drawing, and may be combined with a cover not shown. The housing 54 is made of a material having rigidity and thermal conductivity, and may be made of, for example, metal or plastic material.

On the other hand, the first embodiment of the present invention may be provided with a heat radiation angle 56 as shown in FIG. Heat dissipation angle 56 is made of a thermally conductive material, the substrate 52 is fixed to one side bent as shown. In addition, one side of the heat pipe 60 having the substrate 52 stacked on the other side of the heat dissipation angle 56 is bent as shown. That is, the heat dissipation angle 56 contacts one side of the heat pipe 60 which is in contact with the substrate 52 in the stacked state and the other side of the heat dissipation angle 56 on the opposite side. Accordingly, the heat dissipation angle 56 is fixed to the substrate 52 on one side around the bending point, the heat pipe 60 is in close contact with the other side. Therefore, the heat radiating angle 56 receives heat simultaneously from the ends of the LED module 50 and the heat pipe 60 at one side, and heat is transferred from the heat absorbing portion of the heat pipe 60 through the other side to heat pipe at the other side. The back surface of the contact surface which is in contact with 60 contacts the housing 54, thereby transferring heat to the housing 54 while assisting the heat transfer of the heat pipe 60, thereby more effectively dissipating heat of the LED module 50. Can be. As a result, the first embodiment of the present invention is configured such that the heat of the LED module 50 is simultaneously transmitted to the heat dissipation angle 56 and the heat pipe 60, and also effectively houses the heat received by the heat dissipation angle 56. By being configured to be in contact with the external radiator, such as 54, it is possible to maximize the heat radiation of the LED module 50.

The heat dissipation angle 56 is in close contact with the housing 54 on the other side of the heat pipe 60 is in close contact. Therefore, the heat radiation angle 56 can transfer the heat transferred to the housing 54 as described above. In addition, the heat pipe 60 is in close contact with the heat dissipation angle 56, that is, close to the housing 54 in the direction of the condensation unit from the end of the lamination and the heat dissipation angle 56, the heat dissipation can be effectively radiated. For this reason, the first embodiment of the present invention exhibits excellent heat dissipation performance because the heat dissipation angle 56 and the heat pipe 60 simultaneously transfer heat of the LED module 50 to the housing 54. That is, the first embodiment shows excellent heat dissipation performance because the heat of the LED module 50 can be transferred to the housing 54 in various directions to dissipate heat.

Here, the heat pipe 60 described above is an inflection point 60a for bending so that other parts not stacked in close contact with the housing 54 are partially stacked on the other side of the heat dissipation angle 56 as shown in FIG. 5. 60b) is provided. That is, the heat pipe 60 is bent by the

inflection points

60a and 60b, and other portions which are not stacked on the heat dissipation angle 56 are bent by bending to be in close contact with the housing 54. At this time, the heat pipe 60 is preferably provided with a plurality of inflection points (60a, 60b) as shown. Therefore, the heat pipe 60 transfers a part of heat to the heat dissipation angle 56, transfers a part of the heat to the housing 54, and radiates heat through the housing 54.

On the other hand, the heat radiation angle 56 may be a space between the inflection start point (60a) of the heat pipe 60 from the inflection end point (60b) that is in close contact with the housing 54, as shown in FIG. The other end can be formed in a form that can fill the space, in this case it can eliminate the inefficient portion of the heat transfer.

On the other hand, the backlight unit according to the second embodiment of the present invention has the same configuration as all of the above-described first embodiment, as shown in FIG. 6, except that the above-described heat dissipation angle 56 is omitted so that the heat pipe 60 Is directly connected to the substrate 52, which is different from the first embodiment. Therefore, referring only to these differences with reference to Figure 6 as follows.

In the second embodiment, as shown in the heat pipe 60, one side for absorbing heat is bent to include a heat absorbing portion 62 and a heat transfer portion 64. The heat absorbing portion 62 is directly connected to the substrate 52, as shown in the heat absorbing heat of the substrate 52. In addition, the heat transfer part 64 is bent at approximately right angles at the heat absorbing portion 62 to form a long connection state with the heat absorbing portion 62, and is in close contact with the housing 54 to absorb heat at the heat absorbing portion 62. The heat is transferred to the housing 54 to dissipate heat, and at the same time, the working fluid inside is rapidly moved to diffuse the heat of the heat absorbing part 62 and diffused throughout the inside. At this time, the heat transfer unit 64 may directly absorb heat of the LED module 50 when one end of the substrate 52 is stacked in close contact with the front end side as shown, and in this case, The heat can be transferred more smoothly to dissipate heat.

Since the substrate 52 is in close contact with the heat absorbing portion 62 as shown in the heat pipe 60, the contact area with the substrate 52 is wider than that of the heat pipe 60 of the first embodiment. That is, the heat pipe 60 has an increased heat absorbing area than the first embodiment. In addition, since the heat dissipation angle 50 of the heat pipe 60 is omitted, the heat transfer rate is significantly increased by removing the heat dissipation angle 50 that acts as a thermal resistance in the heat transfer path with the substrate 52. . Therefore, the heat pipe 60 absorbs and dissipates more heat than the first embodiment, and can easily absorb and transfer heat of the LED module 50.

On the other hand, the heat absorbing portion 62 may be configured in a state in which there is no channel for communicating the working fluid therein, as shown in an enlarged upper right portion of the figure, as shown in an enlarged lower right portion of the figure for more smooth heat dissipation. It is preferable that a channel communicating with the channel of the heat transfer part 64 is provided therein. Here, in the latter case, due to the channel, the thickness of the heat absorbing portion 62 may be thicker than the thickness of the heat absorbing portion 62 described in the former.

On the other hand, as shown in Fig. 7, the backlight unit according to the third embodiment of the present invention has the same configuration as that of the second embodiment described above, except that the substrate in the components of the LED module 50 ( The difference is that the circuit patterned at 52 is directly printed on the heat absorbing portion 62 of the heat pipe 60 to omit the above-described substrate 52. Accordingly, only these differences will be described with reference to the accompanying drawings.

In the backlight unit according to the third exemplary embodiment of the present invention, as illustrated, the circuit 52a is directly patterned on the surface of the heat absorbing portion 62 of the heat pipe 60 so that the heat absorbing portion 62 of the heat pipe 60 is described above. It replaces the role of one substrate 52. That is, in the third embodiment, the circuit 52a which has been printed on the substrate 52 described above is printed directly on the heat pipe 60. In the third embodiment, the light emitting element 51 is mounted on the circuit 52a patterned on the heat absorbing portion 62. Therefore, in the third embodiment, the LED module 50 is directly connected to the heat pipe 60 in the form of an identical body.

In the third embodiment, the above-described substrate 52 is omitted so that two thermal resistances generated between the light emitting element 51 and the substrate 52 and between the substrate 52 and the heat pipe 62 are obtained. As the heat resistance between the heat pipe 62 and the heat pipe 62 is reduced to only one heat resistance, not only the heat transfer performance (heat transfer performance) can be improved but also the manufacturing cost of the LED module 50 can be reduced.

Here, the heat pipe 60 of the above-described third embodiment may be provided with a channel through which the working fluid is communicated to the heat absorbing portion 62 as described in the second embodiment. Alternatively, the channel may not be provided. .

Meanwhile, as shown in FIG. 8, the backlight unit according to the fourth embodiment of the present invention has the same configuration as that of the above-described first embodiment, except that the above-described heat dissipation angle 56 is provided, and the heat pipe ( The difference is that 60 consists of one side 66 and the other side 68 formed long by the bending. Accordingly, only these differences will be described with reference to the accompanying drawings.

In the fourth embodiment of the present invention, as shown in FIG. 8, the heat pipe 60 includes one side 66 and the other side 68. One side portion 66 is formed long in parallel with the heat dissipation angle 56 as shown in Figure 8 is in close contact with the heat dissipation angle 56 along the longitudinal direction of the heat dissipation angle 56 in a stacked state, as described above As shown in FIG. 5, one end of the substrate 52 constituting the LED module 50 is directly connected in a stacked state to absorb heat of the LED module 50. One side portion 66 transmits the heat absorbed to the other side of the heat dissipation angle 56 in close contact with the housing 54, as shown in FIG. Thus, the housing 54 dissipates the heat of the LED module 50 transmitted from the heat dissipation angle 56.

As shown in FIG. 8, the other side portion 68 extends from one side portion 66 to form a different angle from the one side portion 66 described above. The other side portion 68 is preferably extended in a straight form in one side portion 66 at a different angle from the one side portion 66 by bending. The other side 68 may be bent to have an inclination θ with one side 66 as shown, and may be bent at right angles to one side 66 for smooth communication of the working fluid, as shown. have. In this case, the aforementioned inclination θ has a range of −90 ° <θ <+ 90 ° based on the imaginary horizontal line H formed at the end of one side portion 66 as shown in FIG. 8. That is, the inclination θ is in the range of an angle at which the other side 68 is not in line with one side 66 or an angle at which the other side 68 is not folded at one side 66. The other side portion 68 is an angle is determined according to the required heat dissipation performance, it is preferably composed of 0 ° ≤ θ <+90 ° based on the horizontal line (H) described above, 0 ° ≤ θ ≤ + 45 ° It is more preferable that it consists of.

The other side portion 68 may move away from the heat dissipation angle 56 as shown by a different angle from the one side portion 66 and thus may smoothly serve as a condensation portion.

In the heat pipe 60 configured as described above, as shown in FIG. 8, one side 66 transfers the heat of the substrate 52 to the heat dissipation angle 56, and the other side 68 is the one side 66 and the other. The heat of the substrate 52 transferred from the heat dissipation angle 56 is dissipated.

In this fourth embodiment, since one side portion 66 of the heat pipe 60 is formed to be long as shown in FIG. 8, the endothermic area is significantly increased than the aforementioned embodiments. Therefore, in the fourth embodiment, since the endothermic amount of the heat pipe 60 is increased than the above-described embodiments, the other side portion 68 provided in the heat pipe 60 is heat absorbed sufficiently to vaporize the working fluid. It is possible to transfer heat quickly to the end of.

On the other hand, in the heat pipe 60 of the fourth embodiment, as the other side 68 is in close contact with the housing 54 and heat is transferred to the housing 54, the other side 68 may serve as a condensation unit by heat dissipation. The

inflection points

60a and 60b of the above-described first embodiment may be provided so that the substrate 52 is in direct contact with the other side 68 as in the second and third embodiments (see FIGS. 6 and 7). The circuit 52a may be directly patterned so that the above-described heat dissipation angle 56 may be omitted.

On the other hand, the backlight unit according to the fifth embodiment of the present invention, as shown in Figure 9, the heat pipe 60 is configured in the same manner as the fourth embodiment described above, except that the LED module 50 is shown The difference is that the divided parts are arranged in the optical plate 53 without the heat-dissipation angle 56 described above. Accordingly, only these differences will be described with reference to the accompanying drawings.

In the fifth embodiment, the divided LED module 50 is partially disposed on the optical plate 53 as shown. At this time, the LED module 50 may be divided into 2 to 16, in particular, as shown in the four can be arranged only near the edge of the optical plate 53, as shown in the optical plate 53 It may be partially disposed between the edge portion and the middle portion of the) or along the edge of the optical plate 53.

The LED module 50 may be directly connected to one side 66 of the heat pipe 60, as illustrated in the substrate 52, on which the above-described light emitting device 51 is mounted. Alternatively, as the above-described circuit 52a is patterned on one side 66 of the heat pipe 60, the same circuit may be directly connected to one side 66 of the heat pipe 60.

As shown in the heat pipe 60, one side portion 66 may be stacked on the LED module 50. Alternatively, the one side portion 66 may be closely attached to the side surface of the LED module 50 as shown in an enlarged view. It may be. Therefore, the heat pipe 60 absorbs heat of the LED module 50 to one side 66 and transfers the heat to the other side 68 while radiating heat through the housing 54 in which the other side 68 is in close contact. .

In the fifth embodiment as described above, even when the LED module 50 is partially installed in the optical plate 53, the heat of the LED module 50 can be easily transferred and radiated.

Herein, when the heat pipe 60 is located at the lower side of the optical plate 53 as shown in the drawing, the other side 68 faces upwards, so that the working fluid therein smoothly moves the inside while repeating vaporization and condensation. Move. That is, the lower side heat pipe A of the optical plate 53 has the other side 68 facing upwards, so when the heat is transferred to the one side 66, the working fluid evaporates and rises to the other side 68. Condensation at the other side 68 returns to the lower side 66.

However, as shown in the heat pipe (B) located on the upper side of the optical plate 53, the other side 68 is directed downward so that the working fluid condensed in the other side 68 is not shown inside the wick The capillary action may return to the vertical portion 66 vertically, but may not return smoothly to the vertical portion 66 vertically by gravity. In particular, since the upper side heat pipe B is formed by extending the other side portion 68 at one side portion 66, the return is not smoother. Therefore, the upper side heat pipe (B) is preferably configured in a straight shape as shown in Figure 10 for the smooth movement of the working fluid.

The upper side heat pipe (B) is formed in a straight line as shown as a whole as the other side portion 68 is formed in a straight line from the above-described one side portion 66 as shown in FIG. Most preferably, 50 is installed in a horizontal state. However, the upper side heat pipe B may be installed in an inclined state or a vertical state as shown in FIG. 10. In this case, the aforementioned inclination means an angle between the horizontal heat pipe 60 shown and the vertical heat pipe 60 shown as reference, and the horizontal heat pipe 60 is referred to as 0 °. When the heat pipe 60 in the vertical state is referred to as -90 °, it means an angle larger than -90 ° and smaller than 0 °, and an angle larger than -45 ° and smaller than 0 ° for smooth movement of the working fluid. desirable.

Meanwhile, the backlight unit according to the sixth embodiment of the present invention has the same configuration as that of the fifth embodiment described above, except that the LED module 50 is provided only at the center of the optical plate 53 as shown in FIG. 11. The difference is that. Accordingly, only these differences will be described with reference to the accompanying drawings.

In the sixth embodiment, as shown, the LED module 50 is disposed only at the center of the optical plate 53. The LED module 50 may have a substrate 52 or a circuit 52a as described above and be directly connected to the heat pipe 60.

The heat pipe 60 may be configured in plural as shown, and may be installed in the LED module 50 respectively. Alternatively, the heat pipe 60 may be configured in a singular form and installed in the LED module 50. The heat pipe 60 may be stacked on the LED module 50 as shown, or may be in close contact with the side surface of the LED module 50 as shown in an enlarged view. Then, the heat pipe 60 may be installed in all directions of the LED module 50, as shown by a virtual line (dotted line), When located on the lower side of the LED module 50 may be configured in a straight line form as shown in a virtual line may be installed in an inclined state in a horizontal state.

In the sixth embodiment as described above, the heat pipe 60 transfers heat of the LED module 50 to radiate heat. Therefore, in the sixth embodiment, even when the LED module 50 is installed in the center of the optical plate 53, the heat of the LED module 50 can be easily transferred and radiated.

Here, the LED module 50 and the heat pipe 60 of the sixth embodiment can also be applied to the fifth embodiment described above. That is, the LED module 50 and the heat pipe 60 of the sixth embodiment may be disposed at the central portion of the optical plate 53 shown in FIG. 9. In this case, the backlight unit emits light at the center and the edge of the optical plate 53 by the LED module 50 at the same time. At this time, the heat pipe 60 simultaneously transfers the heat of the central portion and the corner LED module 50 of the optical plate 53 to the housing 54 described above to radiate heat. Therefore, the backlight unit operates stably due to smooth heat dissipation.

Since the above embodiments are merely illustrative of preferred embodiments of the present invention, the scope of application of the present invention is not limited to the above, and appropriate modifications are possible within the scope of the same idea. Therefore, since the shape and structure of each component shown in the embodiment of the present invention can be carried out by deformation, it is natural that the modification of the shape and structure belong to the appended claims of the present invention.

Claims

An optical plate comprising at least one of a light guide plate for transmitting light in a dispersed state and a diffuser plate for transmitting light in a diffusion state;

An LED module having a light emitting element for providing light to the optical plate and a circuit for driving the light emitting element;

A heat pipe that absorbs heat generated from the LED module to one side and radiates heat while transferring to the other side; And

And a housing accommodating at least one of the heat pipe, the optical plate, and the LED module.

The heat pipe,

The LED module is directly connected to one side of the backlight unit, characterized in that the heat of the LED module is directly transferred to one side.
The method of claim 1, wherein the LED module,

The circuit is patterned and composed of a substrate on which the light emitting element is mounted,

The heat pipe,

The backlight unit, characterized in that the one side is directly connected in an overlapping state to one end of the substrate accommodated in the housing.
The method of claim 2,

The substrate is fixed to one side facing the side of the optical plate to provide heat from the light emitting element mounted on the substrate to the side of the optical plate while dissipating heat of the LED module, the heat on the other side bent from one side One side of the pipe is in close contact and the heat of the heat pipe is directly transferred to the other side or the heat transfer of the LED module to the heat pipe through the other side, the other side of the heat pipe is in close contact with the housing while the other side of the LED module is in close contact with the housing And a heat dissipation angle for transferring heat transferred from the heat pipe and heat transferred from the heat pipe to the housing.
The method of claim 3, wherein the heat pipe,

At least one inflection point for bending is provided in the other portion such that the other portion is in close contact with the housing and the heat is transferred to the housing while the part is in close contact with the other side of the genital heat dissipation angle.
The method of claim 3, wherein the heat pipe,

A side portion formed to have a length parallel to the heat dissipation angle and closely contacted along a length direction of the heat dissipation angle, and absorbs heat of the LED module to transfer to the other side of the heat dissipation angle, or transfers heat of the LED module from the heat dissipation angle; And

The other side is formed to extend in one side at a different angle from the one side, the other side is spaced apart from the heat dissipation angle by a different angle with one side, the heat transfers from one side as extending from one side; unit.
The method of claim 1, wherein the heat pipe,

An endothermic portion that absorbs heat of the LED module as the circuit patterned substrate of the LED module is directly connected to the adhesive state; And

And a heat transfer part which is bent at the heat absorbing part and formed to be connected to the heat absorbing part, and is transferred to the housing in close contact with the housing and transferred from the heat absorbing part to the housing.
The method of claim 1, wherein the heat pipe,

An endothermic unit for absorbing heat of the LED module as the circuit of the LED module is patterned on a surface thereof and the LED module is directly connected to the same body; And

And a heat transfer part which is bent at the heat absorbing part and formed to be connected to the heat absorbing part, and is transferred to the housing in close contact with the housing and transferred from the heat absorbing part to the housing.
The method of claim 1, wherein the LED module,

Partially disposed on the optical plate or disposed only at a central portion thereof to be directly connected to the heat pipe;

The heat pipe,

One side portion is directly connected to the LDE module to absorb heat of the LED module; And

And a second side extending from the one side and extending to the housing in close contact with the housing and transferring heat transferred from the one side to the housing.
The method of claim 8, wherein the other side,

The backlight unit, characterized in that extending at one side or formed in a straight line with one side at a different angle from the one side.