CN104603680B - Back light unit - Google Patents
Back light unit Download PDFInfo
- Publication number
- CN104603680B CN104603680B CN201380015859.3A CN201380015859A CN104603680B CN 104603680 B CN104603680 B CN 104603680B CN 201380015859 A CN201380015859 A CN 201380015859A CN 104603680 B CN104603680 B CN 104603680B
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- China
- Prior art keywords
- mentioned
- heat
- heat pipe
- led modules
- angle section
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The present invention relates to a kind of back light unit.The back light unit of the present invention includes：Optical sheet, by with the light guide plate of dispersity transmitted ray or with the diffuser plate of disperse state transmitted ray at least some constituted；LED modules, with the light-emitting component that light is provided for above-mentioned optical sheet and the circuit of driving light-emitting component；Heat pipe, heat that above-mentioned LED modules occur is absorbed in side and is transferred to opposite side and is radiated；And shell, house above-mentioned heat pipe with above-mentioned optical sheet and above-mentioned LED modules at least some；The side of above-mentioned heat pipe is directly connected to above-mentioned LED modules and so that the heat of above-mentioned LED modules is transferred directly to side.The heat of above-mentioned LED modules is transferred directly to heat pipe and realizes excellent heat dispersion by the present invention.
Description
【Technical field】
The present invention relates to a kind of back light unit, it is more particularly related to it is a kind of by heat pipe by light-emitting component institute
The back light unit that the heat of generation is radiated and cooled down.
【Background technology】
In flat display, Fig. 1 and Fig. 2 is the flat display for the back light unit for being applicable prior art, its
To be registered in the 10-1047726 patent (titles in the Korean Patent Room：Back light unit and possess the aobvious of the back light unit
Showing device).
As shown in figure 1, backlight is by the light-emitting component constituted including light emitting diode and the LED modules of circuit board
(1) constitute, its metallic heat radiation rack (3) constituted with illustrated light guide plate (2), by section bar, heat pipe (4) and shell (5) knot
Back light unit is constituted after conjunction.
Here, foregoing heat pipe (4) such as Fig. 1 and be formed as illustrated in fig. 2 it is plate after be adjacent to shell as illustrated in fig. 2
(5).Moreover, foregoing heat radiation rack (3) is adjacent to heat pipe (4) as illustrated in fig. 2, then it is mounted with the side of bending luminous by having mounted
The LED modules (1) that the circuit board (1b) of element (1a) is constituted.Moreover, foregoing light guide plate (2) as illustrated in fig. 2 with heat pipe (4)
And heat radiation rack (3) is housed by shell (5) together.
The back light unit of the prior art allows the heat of LED modules (1) to be delivered to heat via heat radiation rack (3) as illustrated in fig. 2
Manage (4) and radiate.
But the prior art allows the heat of LED modules (1) to be delivered to heat pipe (4) by heat radiation rack (3) so that LED modules (1)
Heat resist (Thermal resistance) between heat radiation rack (3) and heat radiation rack (3) and heat pipe (4) has influence on radiating
Effect.That is, the heat transfer efficiency for the heat radiation rack (3) being made up of metalwork is less than the heat by internal working fluid quick heat radiating
Manage (4), thus the heat dispersion realized it is relatively low in heat pipe (4) directly receive LED modules (1) it is hot after pass to shell
(5) heat dispersion during radiator such as.
In addition, foregoing heat pipe (4) is formed as linear as shown in Figure 3, one end is adjacent to heat radiation rack (3) and is able to by one
Radiated after absorbing the heat of LED modules (1) by the other end end.
But, the prior art is because only that the one end of heat pipe (4) contacts heat radiation rack (3) and causes endotherm area limitation
In one end, can also occur the isolation section (G) that can not be absorbed heat as shown in figure.Therefore, prior art is due to isolation section (G)
Isolation distance between caused light-emitting component (1a) and cause configuration in the light-emitting component (1a) on isolation section (G) periphery
The amount of being discharged of heat is relatively fewer and have influence on life-span and light beam, and heat pipe (4) is ignored and is present in the luminous of isolation section (G)
Element (1a) and absorbed heat just for light-emitting component (1a) of the configuration in the one end wide cut of heat pipe (4), the heat absorbed is not
It is enough to have given play to the heat transfer property of heat pipe (4) completely, that is to say, that the heat for absorbing light-emitting component (1a) simultaneously constitutes heat pipe (4) one
Heat pipe (4) endothermic section of end and light-emitting component (1a) are so that narrow and small area is contacted and can only limitedly absorb light-emitting component (1a)
Heat, inside the heat pipe (4) heated working fluid possibly can not be delivered to can give play to condensing portion's function heat pipe (4) it is another
End terminal and cause dead angle area (△ L).
Moreover, the heat pipe (4) of prior art is formed as shown as a rectilinear configuration, therefore in order to reduce heat pipe as far as possible
(4) the isolation section (G) of heat can not be transmitted in and heat pipe (4) is installed with high-density installation heat pipe (4) or continuously as shown in figure,
Or illustrated heat pipe (4) is not installed and wide cut heat pipe (not shown) is installed to make with reducing isolation section (G) as far as possible.But
It is that in this case, the increase of heat pipe (4) quantity or wide cutization can but improve production unit price or production cost.
In addition, the pictorial symbolization 11 for not having explanation in Fig. 1 is the reflecting plate of the light of Refl-Luminous element (1a), figure mark
Note 12 is that pictorial symbolization 13 is the diffusion for allowing light to spread for showing that the display panel of frame out gives the support member of support
Plate, pictorial symbolization 15 is the upper lid (top cover) combined with shell (5).
【The technical task of solution】
It is contemplated that overcoming above mentioned problem, it is an object of the invention to provide a kind of back light unit, make the heat of LED modules straight
Switch through and move on to heat pipe.
It is a further object to provide a kind of back light unit, the one end as the inscape of LED modules is straight
The side of heat pipe is connected in succession and heat is transferred directly to heat pipe, or allows heat pipe that the heat of LED modules is transferred to other heat conduction
Property component, further, heat is transferred to thermal conductivity component and heat can also be transferred to shell by heat pipe.
It is also another object of the present invention to provide a kind of back light unit, a part for heat pipe is adjacent in foregoing thermal conductivity structure
Part, foregoing a part of angle that other parts are then adjacent in thermal conductivity component according to being different from is formed, to be isolated from thermal conductivity
The state heat of transfer of component or radiating.
Especially, it is also another object of the present invention to provide a kind of back light unit, it is adjacent to the heat pipe in thermal conductivity component
A foregoing part is formed and the endotherm area that is increased longlyer.
Unlike this, it is also another object of the present invention to provide a kind of back light unit, a part for heat pipe bends and made
LED modules are fixed or constituted the circuits of LED modules to be adjacent to the state of crooked position and directly form pattern in crooked position
And be able to directly absorb the heat of LED modules and shift.
【Solve the technical scheme of problem】
The back light unit of the present invention includes：Optical sheet, by with the light guide plate of dispersity transmitted ray or with disperse state
At least some composition in the diffuser plate of transmitted ray；LED modules, with the light-emitting component that light is provided for above-mentioned optical sheet
And the circuit of driving light-emitting component；Heat pipe, heat that above-mentioned LED modules occur is absorbed in side and is transferred to opposite side and gives
To radiate；And shell, house above-mentioned heat pipe with above-mentioned optical sheet and above-mentioned LED modules at least some；Above-mentioned heat pipe
Side is directly connected to above-mentioned LED modules and so that the heat of above-mentioned LED modules is transferred directly to side.
Above-mentioned LED modules are made up of substrate, and the substrate is by foregoing circuit formation pattern and mounts above-mentioned light-emitting component, on
State the one end that the side of heat pipe is directly connected to the aforesaid substrate for being housed in above-mentioned shell with overlap condition.
Present invention additionally comprises radiating angle section, aforesaid substrate is fixed on the side opposite with the side of above-mentioned optical sheet and handle
The heat of above-mentioned LED modules is radiated and the light mounted to the above-mentioned light-emitting component of substrate is fed into above-mentioned optical sheet
Side, the side of above-mentioned heat pipe is adjacent to allows the heat of heat pipe to be transferred directly to opposite side in the opposite side from curving, or
The heat of above-mentioned LED modules is transferred to by heat pipe by opposite side, be adjacent to heat pipe opposite side the back side then with above-mentioned outer hull shape
Heat into the state that is adjacent to by heat and the heat pipe transfer of above-mentioned LED modules is transferred to shell.
Above-mentioned heat pipe is adjacent in a part in the state of the opposite side of above-mentioned radiating angle section, in order to allow other parts to be adjacent to
State and heat is transferred to shell and there is at least one inflection point for being used for forming complications in above-mentioned other parts after shell.
As one, above-mentioned heat pipe can include：One sidepiece, with the length parallel to above-mentioned radiating angle section it is longer formed
And be adjacent to along the length direction of radiating angle section, absorb the heat of above-mentioned LED modules and be transferred to radiating angle section opposite side or
Person receives the heat of above-mentioned LED modules from radiating angle section；And the other side, according to being different from the angle of an above-mentioned sidepiece from a sidepiece
Extend to be formed longlyer, above-mentioned radiating angle section is isolated from by the angle for being different from a sidepiece, obtained due to extending from a sidepiece
To shift the heat of a sidepiece.
As one, above-mentioned heat pipe can include：Endothermic section, above-mentioned LED modules are formd in pattern (pattern) mode
The substrate of foregoing circuit be connected directly and absorb the heat of LED modules to be adjacent to mode；And heat transfer part, it is curved from above-mentioned endothermic section
It is bent and with endothermic section is with maintaining connection status longer is formed, be adjacent to above-mentioned shell and the heat transfer in transfer self heat absorption portion
To shell.
As one, above-mentioned heat pipe can include：Endothermic section, the foregoing circuit of above-mentioned LED modules forms pattern on surface
And allow LED modules to be connected directly with a volume morphing and absorb the heat of LED modules；And heat transfer part, from the bending of above-mentioned endothermic section simultaneously
And with endothermic section is with maintaining connection status longer is formed, be adjacent to above-mentioned shell and the heat transfer in transfer self heat absorption portion to outside
Shell.
Above-mentioned LED modules local configuration or are only configured in central portion and are directly connected on above-mentioned optical sheet
Heat pipe is stated, as one, above-mentioned heat pipe can include：One sidepiece, is directly connected to above-mentioned LDE modules and absorbs the heat of LED modules；
And the other side, from an above-mentioned sidepiece it is longer extend and to be formed, be adjacent to above-mentioned shell and transfer from the heat transfer of a sidepiece to
Shell.
【Beneficial effect】
The present invention because LED modules are directly connected to heat pipe and enable heat pipe to shift the heat of LED modules quickly, from
And heat that can be easily to LED modules radiates.
Moreover, the one end for constituting the substrate of LED modules is directly connected to the one of the heat pipe for being constituted plane with overlap condition
Side and be able to the heat of LED modules being transferred directly to heat pipe, further, because substrate and heat pipe are each adjacent to radiating angle section
Side and opposite side, therefore transmission can also be shifted from the heat of the heat pipe of LED modules by the angle section that radiates and be radiated,
Further, heat pipe causes a part circuitously to form and be adjacent to a part for opposite side the shape of radiating angle section by inflection point
State allows the other parts of opposite side to be adjacent to shell, therefore can also be able to be radiated by shell to shell heat of transfer.
Moreover, a sidepiece of the heat pipe being adjacent to along the length direction of radiating angle section can be along the radiating longer landform of angle section
Then form different angle with a sidepiece into, the other side of heat pipe and it is longer formed, the heat-absorbent surface of heat pipe can not only be increased
Product, moreover it is possible to radiated with heat being transferred to the end of the other side, because a sidepiece of heat pipe is longer along radiating angle section
Formed, therefore heat transfer property needed for heat pipe is also ensured that or heat dispersion need not be densely installed.
Unlike this, the substrate for constituting LED modules is adjacent to the endothermic section of heat pipe and the heat of LED modules is directly shifted
To heat pipe, therefore, it is possible to improve the heat transfer property and heat dispersion based on heat pipe, further, the circuit of LED modules is in heat pipe
Endothermic section formed pattern after by light-emitting component mount to the circuit for forming pattern when, the thickness institute by aforesaid base plate can be eliminated
The heat transfer obstacle (heat resist) that causes and be improved heat transfer property and heat dispersion, heat pipe, which can be substituted, constitutes LED modules
The role of substrate.
Moreover, LED modules local configuration or are only configured in central portion on optical sheet, due to heat pipe include it is straight
A sidepiece of LED modules is connect in succession and from the longer the other side that is formed of ground of a lateral curvature, therefore, it is possible to shift easily
The heat of LED modules is simultaneously radiated.
【Brief description of the drawings】
Fig. 1 is the exploded perspective view of the back light unit of prior art.
Fig. 2 is the side partial cross-sectional of back light unit shown in Fig. 1.
Fig. 3 is the positive front view for being shown schematically in back light unit shown in Fig. 1.
Fig. 4 is the front view of the back light unit of the first embodiment of the present invention.
Fig. 5 is the sectional view of line A-A shown in Fig. 4.
Fig. 6 is the sectional view of the back light unit of the second embodiment of the present invention.
Fig. 7 is the sectional view of the back light unit of the third embodiment of the present invention.
Fig. 8 is the front view of the back light unit of the fourth embodiment of the present invention.
Fig. 9 is the front view of the back light unit of the fifth embodiment of the present invention.
Figure 10 is the front view of the other embodiments of heat pipe shown in Fig. 9.
Figure 11 is the front view of the back light unit of the sixth embodiment of the present invention.
【Embodiment】
Illustrate the back light unit of the first embodiment of the present invention with reference to Fig. 4 and Fig. 5.
As shown in figs. 4 and 5, the back light unit of the first embodiment of the present invention includes optical sheet (53), LED modules
(50), heat pipe (60) and shell (54).
Optical sheet (53) is by with the general light guide plate of dispersity transmitted ray or with the general of disperse state transmitted ray
At least some composition in diffuser plate.When optical sheet (53) is made up of light guide plate, as shown in figure 5, configuration is in LED modules (50)
Front and by LED modules (50) from side enter light be integrally evenly dispersed into light guide plate.Moreover, optical sheet
(53) when being made up of diffuser plate, as shown in Figures 9 and 10, LED modules (50) are installed in the back side and entering from the back side
The light of LED modules (50) is integrally equably spread.The optical sheet (53) is general component, therefore omits it specifically
It is bright.
As one, LED modules (50) include supplying light-emitting component (51) and the driving of light to foregoing optical sheet (53)
The circuit of light-emitting component (51).Now, circuit can be as illustrated in fig. 4 in substrate (52) formation pattern.Moreover, light-emitting component
(51) it can be sealed as illustrated in fig. 4 by being mounted on the light emitting diode of substrate (52) or general LED comprising the light emitting diode
Dress is constituted.Therefore, LED modules (50) by light-emitting component (51) and can form the substrate (52) of circuit pattern as illustrated in fig. 4
Constitute.
LED modules (50) are configured in the side of optical sheet (53) as illustrated in fig. 4 when optical sheet (53) is made up of light guide plate
Face and to the side-emitted light of optical sheet (53).
Heat pipe (60) side absorb LED modules (50) occur heat and conduct heat (transfer) or radiate to opposite side.
Heat pipe (60) is made up of flat plate type heat tube, and side is adjacent to the aforesaid base plate (52) of LED modules (50) as illustrated in fig. 5.The heat pipe
(60) substrate (52) is directly connected in side as illustrated in fig. 5.Now, heat pipe (60) is as illustrated in fig. 5 in side with the folded (weight of product
It is folded) state be directly connected to substrate (52) one end it is preferable.Therefore, heat pipe (60) is due to being directly connected to LED modules in side
(50) heat of LED modules (50) can be effectively absorbed in side and is transferred to opposite side and radiates.Now, heat pipe (60) with
The heat absorbed is quickly delivered to opposite side by means of internal process fluid (not shown).
In addition, previous housings (54) are housed in heat pipe (60) and LED modules (50) and optical sheet (53) as illustrated in fig. 5
At least some.The shell (54) combines the lid in the most gabarit as display (not shown) and protects foregoing inscape.
The edge of foregoing shell (54) does not bend and forms plate to be combined with lid (not shown) as shown in figure.Outside
Shell (54) is made up of the material for possessing rigidity and thermal conductivity, for example, can be made up of metalwork or working of plastics.
On the other hand, the first embodiment of the present invention can possess radiating angle section (56) as shown in Figure 5.Radiate angle section
(56) it is made up of thermally conductive materials, fixes substrate (52) in the side of bending as shown in figure.Moreover, radiating angle section (56) is as schemed
The shown opposite side in bending and product have folded a side contacts of the heat pipe (60) of substrate (52).That is, radiating angle section (56) exists
The another side contact of the opposite side and heat pipe (60) of bending, the another side is located to accumulate the heat pipe of overlapping state contact substrate (52)
(60) the opposite side of one side.Therefore, radiating angle section (56) centered on the place of bending side fix substrate (52) and
It is adjacent in opposite side by heat pipe (60).Therefore, radiating angle section (56) in side simultaneously from the end of LED modules (50) and heat pipe (60)
Portion receives heat and receives to contact connecing for heat pipe (60) in the transfer of heat, opposite side from the endothermic section of heat pipe (60) by opposite side
The back side of contacting surface is then contacted with shell (54), thus be able to while the heat transfer effect for heat pipe (60) gives auxiliary also to
Shell (54) transmission heat, therefore, it is possible to which more effectively the heat of LED modules (50) is radiated.As a result, the first of the present invention
Embodiment is constituted in the way of the heat of LED modules (50) can be delivered into radiating angle section (56) and heat pipe (60) simultaneously, and
Transmission can be allowed effectively to contact the external cooling bodies such as shell (54) from the heat of radiating angle section (56) and transmitted, therefore, it is possible to
The significantly radiating of enhancing LED modules (50).
The back side for the opposite side for being adjacent to heat pipe (60) in radiating angle section (56) is then adjacent to shell (54).Therefore, radiating angle
Material (56) can also be transferred to the heat shifted as previously mentioned on shell (54).Moreover, heat pipe (60) is long-pending with radiating angle section (56)
The folded side being adjacent to, that is, start to be adjacent to shell in condensing portion direction in the folded place terminated of product with radiating angle section (56)
, therefore condensing portion can more effectively radiate (54).Whereby, the radiating angle section (56) and heat pipe of the first embodiment of the present invention
(60) while shifting the heat of LED modules (50) to shell (54) and realizing excellent heat dispersion.That is, first embodiment energy
It is enough that the heat of LED modules (50) is transferred to shell (54) radiating in many aspects and excellent heat dispersion is realized.
Here, as shown in figure 5, foregoing heat pipe (60) a part product be stacked in radiating angle section (56) opposite side in the state of,
There is the inflection point (60a, 60b) for being used for forming complications in order to allow other positions that product is folded to be adjacent to shell (54).That is,
Heat pipe (60) allows the not long-pending other positions for being stacked in radiating angle section (56) to pass through bending by inflection point (60a, 60b)
(bending) formed tortuous and be adjacent to shell (54).Now, heat pipe (60) possess as shown in figure multiple inflection points (60a,
60b) preferably.Therefore, a part of heat is transferred to radiating angle section (56) and remaining a part of heat is transferred to shell by heat pipe (60)
(54) and by shell (54) radiated.
In addition, radiating angle section (56) may heat pipe (60) contraflexure starting point (60a) to starting to be adjacent to shell (54)
Contraflexure terminal (60b) between form space, therefore the form of filling space can be capable of as shown in Fig. 5 enlarged drawing
Form the end of opposite side.The relatively low position of heat transference efficiency can be eliminated in this case.
On the other hand, all structures of the back light unit of the second embodiment of the present invention are as illustrated in fig. 6 with foregoing first
Embodiment is identical, and the difference of itself and first embodiment is only to eliminate foregoing radiating angle section (56) and cause substrate (52) directly
It is connected to heat pipe (60).Therefore, only the difference is illustrated with reference to Fig. 6.
In a second embodiment, heat pipe (60) allow as shown in figure absorb heat curving and formed endothermic section (62) with
Heat transfer part (64).Endothermic section (62) is directly connected to substrate (52) and the heat of absorptive substrate (52) as shown in figure.Moreover, heat transfer part
(64) as shown in figure from endothermic section (62) with generally at a right angle bending and with endothermic section (62) into connection status it is longer
Formed, be adjacent to shell (54) and the heat that endothermic section (62) absorb is transferred to shell (54) and radiated, at the same time, in order to
Allow endothermic section (62) hot quick heat radiating and allow inside working fluid rapidly move and be diffused into whole interior.Now, conduct heat
Portion (64) in the front one end of state product laminated substrate (52) in snapping-like, can directly absorb LED modules as shown in figure
(50) heat, can more swimmingly shift the heat of LED modules (50) and be radiated in this case.
The heat pipe (60) is because substrate (52) is adjacent to endothermic section (62) as shown in figure and causes the contact with substrate (52)
Area is larger compared to the heat pipe (60) of aforementioned first embodiment.That is, the endotherm area of heat pipe (60) has than first embodiment
Increased.And heat pipe (60) eliminates foregoing radiating angle section (50), therefore due to eliminating in the heat transfer with substrate (52)
Play the part of the radiating angle section (50) of heat resist (Thermal resistance) role on path and considerably improve heet transfer rate.
Therefore, heat pipe (60) is radiated after more heat being absorbed than first embodiment, can easily be absorbed and be shifted LED moulds
The heat of group (50).
In addition, endothermic section (62) allow work although can not possess internally as shown in the right upper portion enlarged drawing of accompanying drawing
Constitute the channel of bypass fluid, but internally have as shown in the lower right side of accompanying drawing to more swimmingly be radiated
There is the channel (channel) that the channel with heat transfer part (64) is connected preferably.Here, canal can be relied in the case of possessing channel
Road and allow endothermic section (62) thickness be more than endothermic section (62) described above thickness.
On the other hand, all structures of the back light unit of the third embodiment of the present invention are as illustrated in fig. 7 with foregoing second
Embodiment is identical, and its difference only causes shape on substrate (52) in the inscape of LED modules (50) as previously mentioned
Circuit into pattern is directly printed onto the endothermic section (62) of heat pipe (60) and eliminates aforesaid base plate (52).Therefore, with reference to
Accompanying drawing is only illustrated to the difference.
The back light unit of the third embodiment of the present invention allows circuit (52a) in the endothermic section of heat pipe (60) as shown in figure
(62) surface directly forms pattern and so that the endothermic section (62) of heat pipe (60) instead of the role of aforesaid base plate (52).That is,
3rd embodiment, which is allowed over, to be printed on the circuit of aforesaid base plate (52) (52a) and is directly printed on heat pipe (60).Moreover, the 3rd is real
Apply shown in for example scheming in light-emitting component (51) attachment to the circuit (52a) for forming pattern on endothermic section (62).Therefore,
Three embodiments allow LED modules (50) to be directly connected to heat pipe (60) with a volume morphing.
The 3rd embodiment due to eliminate aforesaid base plate (52) and cause in light-emitting component (51) and substrate (52) and
Two heat resists occurred between substrate (52) and heat pipe (62) reduce into the heat between light-emitting component (51) and heat pipe (62)
Resistance, that is to say, that be reduced to a heat resist and improve heat transfer property (heat transfer performance), moreover it is possible to save LED modules (50)
Production cost.
Here, the heat pipe (60) of aforementioned third embodiment can form energy in endothermic section (62) as in the second embodiment
The channel for enough allowing working fluid to be dredged, can not also possess channel.
In addition, all structures of the back light unit of the fourth embodiment of the present invention are implemented with foregoing first as illustrated in fig. 8
Example is identical, and its difference is only in that：Possesses foregoing radiating angle section (56)；Heat pipe (60) by it is longer by bending formed one
Sidepiece (66) and the other side (68) are constituted.Therefore, only the difference is illustrated below in conjunction with the accompanying drawings.
As shown in figure 8, the heat pipe (60) of the fourth embodiment of the present invention is made up of a sidepiece (66) and the other side (68).
As shown in figure 8, a sidepiece (66) with the length parallel to radiating angle section (56) it is longer formed and along radiating angle section (56)
Length direction is adjacent to radiating angle section (56) to accumulate overlapping state, such as the foregoing substrate (52) for constituting LED modules (50) as shown in Figure 5
One end is then directly connected to accumulating overlapping state and absorbs the heat of LED modules (50).One sidepiece (66) is then by the heat transfer of absorption
To the opposite side being adjacent to as illustrated in fig. 5 in the radiating angle section (56) of shell (54).Therefore, shell (54) will be from radiating angle section
(56) heat of LED modules (50) is radiated.
As shown in figure 8, the other side (68) are the angle of a foregoing sidepiece (66) is different from formation from a sidepiece (66)
Extend and longer formed.The other side (68) is by way of bending to be different from the angle of a sidepiece (66) from a sidepiece
(66) with rectilinear configuration it is longer extend preferably.The other side (68) can be tilted with a sidepiece (66) formation as shown in figure
(θ) bend, with may also be distinct from that diagramatic content in order to make working fluid straight with a sidepiece (66) formation along just dredging
Bend to angle.Now, it is foregoing to tilt (θ) as illustrated in fig. 8 to be formed at the visual horizontal line (H) an of sidepiece (66) end for base
Standard is between -90 °<θ<+ 90 ° of scope.That is (θ) is tilted between following scope, and the scope allows the other side (68) and one
Sidepiece (66) not shape in line, make the other side (68) not overlapping with a sidepiece (66).The other side (68) is according to required
Heat dispersion and determine angle, on the basis of aforementioned horizontal line (H) formed 0 °≤θ<+ 90 ° preferably, and 0 °≤θ≤+ 45 ° are then more preferably.
The other side (68) is by feat of the angle for being different from a sidepiece (66) as shown in figure away from radiating angle section (56)
And it is able to swimmingly give play to the role in condensing portion.
The heat of substrate (52) is transferred to radiating angle section by the heat pipe (60) so constituted by a sidepiece (66) as illustrated in fig. 8
(56) heat for the substrate (52) for, then being shifted a sidepiece (66) and radiating angle section (56) by the other side (68) is radiated.
A sidepiece (66) for heat pipe (60) forms and causes endotherm area longlyer as illustrated in fig. 8 in the fourth embodiment
Much larger than previous embodiment.Therefore, fourth embodiment is because the caloric receptivity of heat pipe (60) is more than previous embodiment and is absorbed
The heat for allowing working fluid to gasify is enough, so as to be able to the end of hot quick the other side (68) for being delivered to heat pipe (60).
In addition, the heat pipe (60) of fourth embodiment is adjacent to shell (54) due to the other side (68) and passed to shell (54)
Heat is passed, therefore can possess aforementioned first embodiment to allow the other side (68) to give play to condensing portion role by radiating
Inflection point (60a, 60b), can be equally straight in the other side (68) as second and third embodiment (referring to Fig. 6 and Fig. 7)
Contact substrate (52) allows circuit (52a) directly to form pattern and omits foregoing radiating angle section (56).
On the other hand, as shown in figure 9, the heat pipe (60) of the back light unit of the fifth embodiment of the present invention and foregoing 4th reality
Apply example equally to constitute, difference is, LED modules (50) are dividedly constituted and in not foregoing radiating angle section as shown in figure
(56) local configuration is in optical sheet (53) in the state of.Therefore, only the difference is illustrated below in conjunction with the accompanying drawings.
In the 5th embodiment, LED modules (50) local configuration dividedly constituted as shown in the figure is in optical sheet (53).This
When, LED modules (50) can be divided into 2 to 16 ground composition, especially can as shown in figure by 4 constitute after only match somebody with somebody
Put the adjacent corner in optical sheet (53), can also with diagramatic content it is different the corner of optical sheet (53) and pars intermedia it
Between or along the edge of optical sheet (53) give local configuration.
LED modules (50) can possess the aforesaid base plate (52) that has mounted light emitting element (51) and by substrate
(52) be directly connected to a sidepiece (66) for heat pipe (60) as shown in figure, unlike this, can heat pipe (60) side
Portion (66) is allowed aforementioned circuit (52a) formation pattern and the sidepiece (66) of heat pipe (60) is directly connected to integral kenel.
Heat pipe (60) can allow a sidepiece (66) product to be stacked in LED modules (50) as shown in figure, unlike this, can also
A sidepiece (66) is allowed to be adjacent to the side of LED modules (50) as shown in the enlarged view.Therefore, heat pipe (60) absorbs in a sidepiece (66)
The previous housings (54) that are hot and being transferred to the other side (68) and be adjacent to by the other side (68) of LED modules (50) give
Radiating.
Even if foregoing 5th embodiment LED modules (50) are local installation on optical sheet (53), also can be light
Change places and shift the heat of LED modules (50) and radiated.
Here, when foregoing heat pipe (60) is located at the lower side of optical sheet (53) as shown in figure, due to the other side (68)
Cause internal working fluid that gasification is repeated and condensing internally swimmingly moves towards top.That is, optical sheet
(53) heat pipe (A) of lower side is because the other side (68) are towards top, and working fluid steams when heat is transferred to a sidepiece (66)
Hair rises to the other side (68), then condensing and come back to a sidepiece (66) for bottom in the other side (68).
But as shown in figure, positioned at optical sheet (53) upper side heat pipe (B) because the other side (68) are towards bottom,
Thus while the capillarity of inner core (not shown) (wick) can be relied in the other side (68) condensing working fluid
And a vertical sidepiece (66) is returned to, a vertical sidepiece (66) but can not be successfully returned to because of gravity.Especially since
The extension after a sidepiece (66) bending of the other side (68) of upside heat pipe (B) is formed and more can not successfully returned.Therefore,
Upside heat pipe (B) is constituted preferably with a rectilinear configuration as illustrated in fig. 10 in order to allow working fluid smoothly to move.
As shown in Figure 10, the upside heat pipe (B) due to foregoing the other side (68) in a foregoing sidepiece (66) with a straight line
Extension forms and is formed as shown a rectilinear configuration on the whole, therefore is arranged on LED modules (50) most with horizontality
It is good.But upside heat pipe (B) can also be installed with heeling condition or plumbness as illustrated in fig. 10.Now, it is foregoing to tilt what is referred to
It is the angle between the heat pipe (60) of illustrated horizontality and the heat pipe (60) of illustrated plumbness, with horizontality
Heat pipe (60) as 0 ° using the heat pipe (60) of plumbness as -90 ° when, its represent to be more than -90 ° and less than 0 ° angle
Degree, forms to allow working fluid smoothly to move and is more than -45 ° and the angle less than 0 ° is preferable.
In addition, all structures of the back light unit of the sixth embodiment of the present invention are identical with foregoing 5th embodiment, it is poor
Different is only center of LED modules (50) the configuration as illustrated in fig. 11 in optical sheet (53).Therefore, it is only right below in conjunction with the accompanying drawings
The difference is illustrated.
LED modules (50) are only configured in the center of optical sheet (53) sixth embodiment as shown in figure.LED modules (50) can
To possess foregoing substrate (52) or circuit (52a) and be directly connected to heat pipe (60).
Heat pipe (60) can be formed as shown multiple and each be arranged on LED modules (50), unlike this,
It can also form single rear on LED modules (50).Heat pipe (60) can be stacked in LED modules (50) by area as shown in the figure,
Unlike this, the side of LED modules (50) can also be adjacent to as shown in the enlarged view.Moreover, heat pipe (60) can be as virtual
The surrounding of LED modules (50) is arranged on shown in line (chain-dotted line), can be such as dummy line during positioned at the lower side of LED modules (50)
It is shown to constitute a rectilinear configuration and installed with horizontality or heeling condition.
Foregoing sixth embodiment shifts the heat of LED modules (50) by heat pipe (60) and radiated.Therefore,
The central portion for being arranged on optical sheet (53) even if LED modules (50) in six embodiments can also shift LED modules (50) easily
Heat and radiated.
Here, the LED modules (50) and heat pipe (60) of sixth embodiment are readily applicable to foregoing 5th embodiment.Also
That is, the LED modules (50) and heat pipe (60) of sixth embodiment can be only fitted to the central portion of optical sheet shown in Fig. 9 (53).At this
Plant under situation, back light unit launches light simultaneously by LED modules (50) in the central portion of optical sheet (53) and corner side.This
When, the central portion of optical sheet (53) and the heat of corner side LED modules (50) are transferred to previous housings (54) by heat pipe (60) simultaneously
Radiated on ground.Therefore, back light unit by feat of operating with smoothly radiating and be stabilized.
Above-described embodiment merely illustrates presently preferred embodiments of the present invention, before must not the application of the present invention be limited to
Content is stated, can suitably be changed in same idea category.Therefore, each composition mentioned by embodiments of the invention will
The shape and structure of element can give deformation implementation, and the deformation of the shape and structure should be illustrated as belonging to the power of the appended present invention
Sharp claim.
【Industrial applicability】
The present invention because LED modules are directly connected to heat pipe and enable heat pipe rapidly to shift the heat of LED modules, with
This radiates to the heat of LED modules easily.
Claims (3)
1. a kind of back light unit, it is characterised in that
Including：
Optical sheet, by with the light guide plate of dispersity transmitted ray or with the diffuser plate of disperse state transmitted ray at least certain
One composition；
LED modules, with the light-emitting component that light is provided for above-mentioned optical sheet and the circuit of driving light-emitting component；
Heat pipe, heat that above-mentioned LED modules occur is absorbed in side and is transferred to opposite side and is radiated；And
Shell, house above-mentioned heat pipe with above-mentioned optical sheet and above-mentioned LED modules at least some,
The side of above-mentioned heat pipe is directly connected to above-mentioned LED modules and so that the heat of above-mentioned LED modules is transferred directly to side,
Above-mentioned LED modules are constituted by being formed with the pattern of foregoing circuit and mounting the substrate of above-mentioned light-emitting component,
The side of above-mentioned heat pipe is directly connected to the one end for the aforesaid substrate for being housed in above-mentioned shell with overlap condition,
Also include radiating angle section, with the side of above-mentioned optical sheet the side of opposite above-mentioned radiating angle section fix aforesaid substrate so that
The heat of above-mentioned LED modules is radiated and the light mounted to the above-mentioned light-emitting component of substrate is fed into above-mentioned optical sheet
Side, the side of above-mentioned heat pipe is adjacent to so that heat pipe from the opposite side of the above-mentioned radiating angle section of the curving of above-mentioned radiating angle section
Heat be transferred directly to the opposite side of above-mentioned radiating angle section, or by the opposite side of above-mentioned radiating angle section by above-mentioned LED modules
Heat be transferred to heat pipe, be adjacent to the above-mentioned radiating angle section of heat pipe opposite side the back side then with above-mentioned shell formation be adjacent to state
And the heat of heat and the heat pipe transfer of above-mentioned LED modules is transferred to shell.
2. back light unit according to claim 1, it is characterised in that
Above-mentioned heat pipe is adjacent in a part in the state of the opposite side of above-mentioned radiating angle section, above-mentioned outer in order to allow other parts to be adjacent to
Heat is transferred to shell after shell and there is at least one inflection point for being used for forming complications in above-mentioned other parts.
3. back light unit according to claim 1, it is characterised in that
Above-mentioned heat pipe includes：One sidepiece, with length parallel to above-mentioned radiating angle section it is longer formed and along radiating angle section
Length direction is adjacent to, and is absorbed the heat of above-mentioned LED modules and is transferred to the opposite side of radiating angle section or receives from radiating angle section
The heat of above-mentioned LED modules；And the other side, according to be different from the angle of an above-mentioned sidepiece from a sidepiece it is longer extend and to be formed,
Above-mentioned radiating angle section is isolated from by the angle for being different from a sidepiece, is able to shift a sidepiece due to from a sidepiece extending
Heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710086497.7A CN107092131A (en) | 2012-03-22 | 2013-03-20 | Back light unit |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0029490 | 2012-03-22 | ||
| KR1020120029490A KR101342247B1 (en) | 2012-03-22 | 2012-03-22 | backlight unit |
| PCT/KR2013/002310 WO2013141608A1 (en) | 2012-03-22 | 2013-03-20 | Backlight unit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710086497.7A Division CN107092131A (en) | 2012-03-22 | 2013-03-20 | Back light unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104603680A CN104603680A (en) | 2015-05-06 |
| CN104603680B true CN104603680B (en) | 2017-07-28 |
Family
ID=49222984
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380015859.3A Expired - Fee Related CN104603680B (en) | 2012-03-22 | 2013-03-20 | Back light unit |
| CN201710086497.7A Pending CN107092131A (en) | 2012-03-22 | 2013-03-20 | Back light unit |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710086497.7A Pending CN107092131A (en) | 2012-03-22 | 2013-03-20 | Back light unit |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6189411B2 (en) |
| KR (1) | KR101342247B1 (en) |
| CN (2) | CN104603680B (en) |
| WO (1) | WO2013141608A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI561766B (en) * | 2014-10-14 | 2016-12-11 | Playnitride Inc | Light emitting module |
| KR102131203B1 (en) * | 2018-08-10 | 2020-07-07 | 주식회사 씨지아이 | Lighting module having enhanced heat radiation performance, bent type heat plate used therefor |
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| KR20080034715A (en) * | 2006-10-17 | 2008-04-22 | 주식회사 우영 | Edge-type led back light unit |
| CN101430068A (en) * | 2004-06-29 | 2009-05-13 | 京瓷株式会社 | Liquid crystal display device |
| KR20100132801A (en) * | 2009-06-10 | 2010-12-20 | 엘지전자 주식회사 | Method and apparatus for receving digital broadcasting signal |
| WO2011077692A1 (en) * | 2009-12-22 | 2011-06-30 | 日本電気株式会社 | Planar light-source device, display device, and method for manufacturing a planar light-source device |
| JP2012054108A (en) * | 2010-09-01 | 2012-03-15 | Sharp Corp | Display device |
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|---|---|---|---|---|
| CN1321345C (en) * | 2003-08-06 | 2007-06-13 | 友达光电股份有限公司 | Sidelight back light module |
| TW201224588A (en) * | 2004-06-29 | 2012-06-16 | Kyocera Corp | Light source device |
| DE102005063433B4 (en) * | 2004-10-29 | 2009-11-26 | Lg Display Co., Ltd. | Backlight unit and liquid crystal display device |
| JP2007017497A (en) * | 2005-07-05 | 2007-01-25 | Showa Denko Kk | Backlight unit and liquid crystal display device |
| JP2007287463A (en) | 2006-04-17 | 2007-11-01 | Sharp Corp | Lighting system |
| CN101017278A (en) * | 2007-03-09 | 2007-08-15 | 友达光电股份有限公司 | side lighting back light module |
| US7467882B2 (en) * | 2007-05-17 | 2008-12-23 | Kun-Jung Chang | Light-emitting diode heat-dissipating module |
| EP2343581A1 (en) * | 2010-01-07 | 2011-07-13 | LG Innotek Co., Ltd. | Backlight unit |
| KR101714037B1 (en) * | 2010-06-03 | 2017-03-08 | 엘지이노텍 주식회사 | Backlight unit and display appratus having the same |
| JP4842390B1 (en) * | 2010-06-30 | 2011-12-21 | シャープ株式会社 | Illumination device and image display device including the same |
-
2012
- 2012-03-22 KR KR1020120029490A patent/KR101342247B1/en not_active IP Right Cessation
-
2013
- 2013-03-20 CN CN201380015859.3A patent/CN104603680B/en not_active Expired - Fee Related
- 2013-03-20 CN CN201710086497.7A patent/CN107092131A/en active Pending
- 2013-03-20 WO PCT/KR2013/002310 patent/WO2013141608A1/en active Application Filing
- 2013-03-20 JP JP2015501577A patent/JP6189411B2/en not_active Expired - Fee Related
-
2017
- 2017-03-27 JP JP2017060952A patent/JP2017162819A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101430068A (en) * | 2004-06-29 | 2009-05-13 | 京瓷株式会社 | Liquid crystal display device |
| KR20080034715A (en) * | 2006-10-17 | 2008-04-22 | 주식회사 우영 | Edge-type led back light unit |
| KR20100132801A (en) * | 2009-06-10 | 2010-12-20 | 엘지전자 주식회사 | Method and apparatus for receving digital broadcasting signal |
| WO2011077692A1 (en) * | 2009-12-22 | 2011-06-30 | 日本電気株式会社 | Planar light-source device, display device, and method for manufacturing a planar light-source device |
| JP2012054108A (en) * | 2010-09-01 | 2012-03-15 | Sharp Corp | Display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013141608A1 (en) | 2013-09-26 |
| CN107092131A (en) | 2017-08-25 |
| KR101342247B1 (en) | 2013-12-16 |
| JP6189411B2 (en) | 2017-08-30 |
| KR20130107586A (en) | 2013-10-02 |
| CN104603680A (en) | 2015-05-06 |
| JP2015514292A (en) | 2015-05-18 |
| JP2017162819A (en) | 2017-09-14 |
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