JP2017162819A - Backlight unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a backlight unit having an excellent property for releasing the heat of an LED module.SOLUTION: A backlight unit includes: a heat pipe 60 for releasing the heat generated by an LED module 50; and a housing 54 for storing at least one of the heat pipe, an optical plate 53 and an LED module. The heat pipe includes: a heat absorbing part 62 for absorbing heat of the LED module by being closely attached directly to a substrate 52 on which a circuit in the LED module is patterned; and a heat transmission part 64 bent from the heat absorbing part and extending in a connected state with the heat absorbing part, and being in contact with the housing to transmit the heat from the heat absorbing part to the housing. The heat pipe is provided with a channel which passes the working fluid only to the heat transmission part 64.SELECTED DRAWING: Figure 6

Description

The present invention relates to a backlight unit, and more particularly, to a backlight unit that can radiate and cool heat generated from a light emitting element through a heat pipe.

FIG. 1 and FIG. 2 show a flat panel display to which a backlight unit according to the prior art is applied. FIG. 10 and FIG. Backlight unit and display device including the same)
FIG.

As shown in FIG. 1, the above-described backlight includes an LED module 1 composed of a light emitting element composed of a light emitting diode and a circuit board, and includes a light guide plate 2 shown in the figure, a metal heat radiation band 3 composed of a mold material, The backlight unit is configured by combining with the heat pipe 4 and the housing 5.

Here, the heat pipe 4 described above is formed in a flat plate shape as shown in FIGS.
As shown in FIG. As shown in FIG. 2, the heat radiation band 3 is in close contact with the heat pipe 4, and the LED module 1 including the circuit board 1b on which the light emitting element 1a is mounted is attached to one side of the bending. The light guide plate 2 described above is
As shown in FIG. 2, the heat pipe 4 and the heat dissipation band 3 are housed in a housing 5.

In such a conventional backlight unit, as shown in FIG. 2, the heat of the LED module 1 is transmitted to the heat pipe 4 through the heat radiating zone 3 and is radiated.

However, in such a conventional technique, the heat of the LED module 1 is transmitted to the heat pipe 4 through the heat radiating band 3, so that the thermal resistance between the LED module 1 and the heat radiating band 3 (Thermal resis
tance), and the heat resistance between the heat radiation zone 3 and the heat pipe 4 has a problem that the heat radiation effect is lowered. That is, the heat radiating band 3 made of a metal material has lower heat transfer efficiency than the heat pipe 4 that radiates heat quickly by the internal working fluid, so the heat pipe 4 directly receives the heat of the LED module 1 and the housing 5 or the like. The heat dissipation performance is relatively lower than the heat transfer to the heat radiator.

On the other hand, the heat pipe 4 described above is formed in a straight line as shown in FIG. 3, and one end portion is in close contact with the heat radiating band 3, thereby absorbing the heat of the LED module 1 at one end portion and radiating from the other end portion. .

However, in such a conventional technique, only one end portion of the heat pipe 4 is in contact with the heat radiating zone 3, so that the heat absorption area is limited to one end portion and, as shown in the drawing, the separation section G where no heat absorption is performed.
Occurs. Therefore, according to the conventional technique, the light emitted from the light emitting elements 1a arranged around the separation section G is released relatively little by the separation distance between the light emitting elements 1a formed by the separation section G. The heat pipe 4 absorbs only the heat of the light emitting element 1a arranged at the width of one end of the heat pipe 4 in spite of the light emitting element 1a in the separation section G. By absorbing only the amount of heat that does not sufficiently exhibit the heat transfer performance, in other words, the heat absorbing part of the heat pipe 4 that absorbs the heat of the light emitting element 1a and constitutes one end of the heat pipe 4 is the light emitting element. Because the heat of the light emitting element 1a is limitedly absorbed by contacting with 1a in a small area, the working fluid that has received heat transfer inside the heat pipe 4 serves as a condensing part. There is a possibility that blind spot region ΔL which can not transfer to the edge occurs.

Further, in the prior art, since the heat pipe 4 is formed in a straight line as shown in the figure, in order to minimize the separation section G in which heat is not transmitted to the heat pipe 4, the heat pipe 4 as shown in the figure.
Should be installed densely or continuously, or a wide heat pipe (not shown) may be installed in place of the illustrated heat pipe 4 to minimize the separation section G. However, in such a case, the manufacturing unit price and the manufacturing cost increase due to the increase in the number of heat pipes 4 or the widening of the heat pipe 4.

On the other hand, reference numeral 11 in FIG. 1 is a reflection sheet that reflects light from the light emitting element 1a, 12 is a support member for supporting a display panel that displays a screen, and 13 is a diffusion sheet that diffuses light. Reference numeral 15 denotes a top cover coupled to the housing 5.

The present invention has been made to solve the above-described problems, and an object thereof is to provide a backlight unit capable of directly transferring heat of an LED module to a heat pipe.

In addition, the present invention is such that one end portion of the component constituting the LED module is directly connected to one side of the heat pipe and directly transfers heat to the heat pipe, or the heat pipe transfers the heat of the LED module to other heat conductivity. It is another object of the present invention to provide a backlight unit that can be transmitted to a member, and in addition, a heat pipe can transmit heat to a housing while transferring heat to a heat conductive member.

In addition, the present invention provides a heat conductive member in which a part of the heat pipe is in close contact with the above-described heat conductive member and the other part is formed at an angle different from that of the above part in close contact with the heat conductive member. Another object of the present invention is to provide a backlight unit that can transmit or dissipate heat in a separated state.

In particular, another object of the present invention is to provide a backlight unit capable of increasing the endothermic area by forming the part of the heat pipe in close contact with the heat conductive member long.

In contrast, in the present invention, a part of the heat pipe is bent and fixed to the bent portion of the LED module in close contact with each other, or the circuit constituting the LED module is directly patterned on the bent portion. Another object of the present invention is to provide a backlight unit capable of directly absorbing and transferring the heat of the LED module.

A backlight unit according to the present invention includes an optical plate comprising at least one of a light guide plate that transmits light in a dispersed state and a diffusion plate that transmits light in a diffused state; a light emitting element that provides light to the optical plate; An LED module having a circuit for driving the light emitting element; a heat pipe that absorbs heat generated from the LED module to one side and dissipates heat while transmitting the heat to the other side; the heat pipe, the optical plate, and the LED module A housing that houses at least one of the heat pipe and the heat pipe.
The ED module is directly connected to one side, and heat of the LED module is directly transferred to the one side.

The LED module includes a substrate on which the circuit is patterned and the light emitting device is mounted, and the heat pipe is directly connected to one end of the substrate accommodated in the housing in a superimposed state. And

In the present invention, the substrate is fixed to one side facing the side of the optical plate, and the LED is
While radiating the heat of the module, the light of the light emitting element mounted on the substrate is provided to the side of the optical plate, and one side of the heat pipe is closely attached to the other side bent from one side to the other side. The heat of the heat pipe is directly transmitted or the heat of the LED module is transmitted to the heat pipe through the other side, and the back surface of the other side that is in close contact with the heat pipe is in close contact with the housing. A heat dissipating angle that transfers heat and heat from the heat pipe to the housing.

The heat pipe has at least one change for bending in the other part so that the other part is in close contact with the housing and heat is transferred to the housing in a state where the part is in close contact with the other side of the heat radiation angle. A music point may be provided.

For example, the heat pipe is formed in a length parallel to the heat dissipation angle and is closely adhered along the longitudinal direction of the heat dissipation angle, or the heat of the LED module is absorbed and transmitted to the other side of the heat dissipation angle, Alternatively, one side part to which the heat of the LED module is transmitted from a heat radiation angle; extended from one side part at an angle different from the one side part, and with respect to the heat radiation angle at a different angle from the one side part And the other side part which is heat-transferred from one side part by being extended from one side part.

The heat pipe includes, for example, a heat absorption part that absorbs heat of the LED module by directly connecting a substrate on which the circuit of the LED module is patterned in close contact; and a connection between the heat absorption part and the heat absorption part that is bent from the heat absorption part And a heat transfer section that is formed long in a state and is in close contact with the housing and transfers heat from the heat absorption section to the housing.

The heat pipe includes, for example, a heat absorption part that absorbs heat of the LED module by patterning the circuit of the LED module on the surface and directly connecting the LED module as the same body; and a heat absorption part that is bent from the heat absorption part And a heat transfer portion that is long in connection with the housing and that is in close contact with the housing and transfers heat from the heat absorbing portion to the housing.

The LED module may be partially disposed on the optical plate or may be disposed only in a central portion and directly connected to the heat pipe. The heat pipe may be directly connected to the LED module, for example, to heat the LED module. One side portion that absorbs heat; and a heat transfer portion that is extended from the one side portion and is in close contact with the housing and transfers heat from the one side portion to the housing.

In the present invention, the LED module is directly connected to the heat pipe.
The heat of the module can be quickly transmitted, and thus the heat of the LED module can be easily dissipated.

In addition, since one side of the substrate constituting the LED module is directly connected to one side of the heat pipe that forms a plane, the heat pipe can immediately transfer the heat of the LED module. Since the substrate and the heat pipe are in close contact with one side and the other side of the heat radiation angle, respectively, heat of the heat pipe transmitted from the LED module can be transmitted and dissipated through the heat radiation angle. Since a part of the pipe is bent at the inflection point, the other part is in close contact with the heat dissipation angle and the other part is in close contact with the housing to transfer heat to the housing. Heat can also be dissipated.

Also, one side of the heat pipe that adheres along the longitudinal direction of the heat radiation angle is formed long along the heat radiation angle, and the other side of the heat pipe is formed long while forming an angle different from the one side. In addition to increasing the heat absorption area of the heat pipe, heat can be transferred to the end of the other side to dissipate heat, and since one side of the heat pipe is formed long along the heat dissipation angle, Even if the heat pipes are not densely installed, the required heat transfer performance or heat dissipation performance can be ensured.

Unlike this, the substrate constituting the LED module is in close contact with the heat absorption part of the heat pipe, and the heat of the LED module is directly transmitted to the heat pipe, thereby improving the heat transfer performance and heat dissipation performance through the heat pipe. LED and the heat absorption part of the heat pipe
When the light emitting device is mounted on the patterned circuit after the module circuit is patterned, the heat transfer obstacle (thermal resistance) due to the thickness of the substrate is removed to improve heat transfer performance and heat dissipation performance. In addition, the heat pipe can serve instead of the substrate constituting the LED module.

In addition, even if the LED module is partially disposed on the optical plate or installed in the center, the LED module is directly connected to one side and the other side is bent from one side and formed long. Since the heat pipe is configured, the heat of the LED module can be easily transmitted to dissipate heat.

It is a disassembled perspective view of the backlight unit which concerns on a prior art. FIG. 2 is a partial side cross-sectional view of the backlight unit shown in FIG. 1. It is a front view which shows roughly the front of the backlight unit shown in FIG. 1 is a front view of a backlight unit according to a first embodiment of the present invention. It is sectional drawing along the AA line of FIG. It is sectional drawing of the backlight unit which concerns on 2nd Example of this invention. It is sectional drawing of the backlight unit which concerns on 3rd Example of this invention. It is a front view of the backlight unit which concerns on 4th Example of this invention. It is a front view of the backlight unit according to the fifth embodiment of the present invention. It is a front view which shows the other Example of the heat pipe shown in FIG. It is a backlight unit front view which concerns on 6th Example of this invention.

Hereinafter, a backlight unit according to a first embodiment of the present invention will be described with reference to FIGS. 4 and 5 attached.

The backlight unit according to the first embodiment of the present invention includes an optical plate 53, an LED module 50, a heat pipe 60, and a housing 54, as shown in FIGS.

The optical plate 53 includes at least one of a normal light guide plate that transmits light in a dispersed state and a normal diffuser plate that transmits light in a diffused state. When the optical plate 53 is composed of a light guide plate, the optical plate 53 is disposed in front of the LED module 50 as shown in FIG.
The light that flows in from the side surface via the ED module 50 is uniformly dispersed throughout the light guide plate.
When the optical plate 53 is composed of a diffusion plate, as shown in FIGS.
The D module 50 is installed on the back surface, and diffuses the light of the LED module 50 flowing from the back surface uniformly. Since such an optical plate 53 is a normal member, its detailed description is omitted.

The LED module 50 can include, for example, a light emitting element 51 that provides light to the optical plate 53 described above, and a circuit that drives the light emitting element 51. At this time, the circuit is shown in FIG.
As shown in FIG. As shown in FIG. 4, the light emitting element 51 is a light emitting diode mounted on a substrate 52 or a normal LE including the light emitting diode.
It can consist of D packages. Therefore, as shown in FIG. 4, the LED module 50 can include a light emitting element 51 and a substrate 52 on which a circuit is patterned.

When the optical plate 53 is composed of a light guide plate, the LED module 50 is disposed on the side surface of the optical plate 53 as shown in FIG. 4 and emits light from the side surface of the optical plate 53.

The heat pipe 60 absorbs heat generated from the LED module 50 to one side and transfers (transmits) or dissipates heat to the other side. The heat pipe 60 is a flat plate heat pipe, and one side is in close contact with the substrate 52 of the LED module 50 as shown in FIG. In such a heat pipe 60, the substrate 52 is directly connected to one side as shown in FIG. At this time, the heat pipe 6
As shown in FIG. 5, one side is preferably directly connected to one end of the substrate 52 in a stacked (superposed) state. Therefore, since the LED module 50 is directly connected to one side, the heat pipe 60 dissipates heat while effectively absorbing the heat of the LED module 50 to one side and transmitting it to the other side.
At this time, the heat pipe 60 quickly transfers the heat absorbed by the internal working fluid (not shown) to the other side.

On the other hand, the housing 54 described above accommodates at least one of the heat pipe 60, the LED module 50, and the optical plate 53, as shown in FIG. Such a housing 54 is coupled to an outermost cover of a display (not shown) to protect the aforementioned components. Unlike the illustrated case, the housing 54 may be formed in a flat plate shape without being bent, and may be coupled to a cover (not shown). The housing part 54
It can be made of a material having rigidity and thermal conductivity, for example, a metal material or a plastic material.

On the other hand, the heat radiation angle 56 as shown in FIG. 5 may be provided in the first embodiment of the present invention. The heat radiation angle 56 is made of a heat conductive material, and the substrate 52 is fixed to one side of the bending as shown in the figure. As shown in the figure, the heat radiation angle 56 contacts one side of the heat pipe 60 on which the substrate 52 is laminated on the other side of the bend. In other words, the heat radiating angle 56 is in contact with the other side opposite to the one side of the heat pipe 60 that is in contact with the substrate 52 in a stacked state. As a result, the substrate 52 is fixed to one side of the heat radiating angle 56 around the bent point, and the heat pipe 60 is in close contact with the other side. Therefore, the heat radiation angle 56 receives heat from the ends of the LED module 50 and the heat pipe 60 at one side at the same time, and heat is transmitted from the heat absorption part of the heat pipe 60 through the other side, so that the heat pipe at the other side. Since the rear surface of the contact surface in contact with 60 is in contact with the housing 54, heat is transferred to the housing 54 while assisting the heat transfer action of the heat pipe 60, so that the heat of the LED module 50 can be radiated more efficiently. . As a result, according to the first embodiment of the present invention, the heat of the LED module 50 is the heat radiation angle 56 and the heat pipe 60.
LE is configured to be simultaneously transmitted to the heat dissipation angle, and heat transmitted to the heat radiation angle 56 is effectively transmitted in contact with an external heat radiator such as the housing 54, thereby enabling LE
The heat radiation of the D module 50 can be maximized.

The heat radiation angle 56 is in close contact with the housing 54 on the back side of the other side that is in close contact with the heat pipe 60. Therefore, the heat radiating angle 56 can transmit the heat transmitted to the housing 54 as described above. Further, since the heat pipe 60 is in close contact with the housing 54 in the direction of the condensing part from the side where the heat dissipating angle 56 is laminated and in close contact, that is, the point where the lamination with the heat dissipating angle 56 ends, effective heat dissipation of the condensing part is achieved. Is possible. Thereby, the first of the present invention.
Since the heat radiation angle 56 and the heat pipe 60 simultaneously transmit the heat of the LED module 50 to the housing 54, the embodiment shows excellent heat radiation performance. That is, the first embodiment is L
Since the heat of the ED module 50 can be transferred to the housing 54 in many directions and dissipated, excellent heat dissipation performance is exhibited.

Here, as shown in FIG. 5, the heat pipe 60 described above is bent so that the other part of the heat radiation angle 56 is laminated on the other side of the heat radiation angle 56 and the other part that is not laminated closely contacts the housing 54. Inflection points 60a and 60b are provided. That is, in the heat pipe 60, other portions that are not stacked on the heat radiation angle 56 are bent at the inflection points 60 a and 60 b to be in close contact with the housing 54. At this time, the heat pipe 60 is preferably provided with a plurality of inflection points 60a and 60b as shown in the figure. Therefore, heat pipe 60
Transmits a part of the heat to the heat radiation angle 56 and transmits the remaining part of the heat to the housing 54 to radiate heat through the housing 54.

On the other hand, in the heat radiation angle 56, since a space may be generated between the inflection start point 60a of the heat pipe 60 and the inflection end point 60b at which the housing 54 starts to adhere, as shown in FIG. The other end can be formed so as to be able to fill the space. In such a case, inefficient portions of heat transfer can be removed.

On the other hand, as shown in FIG. 6, the backlight unit according to the second embodiment of the present invention has the same configuration as that of the first embodiment described above, except that the heat dissipation angle 56 described above is omitted. The difference from the first embodiment is that the substrate 52 is directly connected to the pipe 60. Therefore, only such differences will be described with reference to FIG.

In the second embodiment, the heat pipe 60 includes a heat absorption part 62 and a heat transfer part 64 by bending one side that absorbs heat as shown in the figure. The heat absorbing portion 62 is formed on the substrate 5 as shown in the figure.
2 are directly connected to absorb the heat of the substrate 52. As shown in the figure, the heat transfer section 64 is bent at a substantially right angle from the heat absorption section 62 and is formed long in a connected state with the heat absorption section 62, and is in close contact with the housing 54 to transmit heat from the heat absorption section 62 to the housing 54. At the same time, the internal working fluid is rapidly moved so that the heat of the heat absorbing portion 62 is quickly dissipated and diffused throughout. At this time, the heat transfer section 64 can also directly absorb the heat of the LED module 50 when one end of the substrate 52 is laminated in a close contact state on the tip side as shown in the figure. In such a case, L
The heat of the ED module 50 can be transmitted more smoothly and dissipated.

Since such a heat pipe 60 has the substrate 52 in close contact with the heat absorbing portion 62 as shown in the figure,
Compared with the heat pipe 60 of the first embodiment described above, the contact area with the substrate 52 is wide. That is, the heat pipe 60 has a larger heat absorption area than that of the first embodiment. In the heat pipe 60, the heat radiation angle 50 described above is omitted, so that the heat resistance (Thermal
The heat transfer rate is significantly increased by the removal of the heat release angle acting as resistance. Therefore, the heat pipe 60 can absorb and dissipate more heat than that of the first embodiment, and can easily absorb and transfer the heat of the LED module 50.

On the other hand, the heat absorption part 62 can be configured without a channel through which the working fluid is communicated as shown in the upper right part of FIG. 6, but is enlarged to the lower right part of FIG. 6 for smoother heat dissipation. As shown, the channel communicating with the channel of the heat transfer section 64 is preferably provided inside. In the latter case, the heat absorption part 62 can be formed thicker than the former heat absorption part 62 by the channel.

On the other hand, the backlight unit according to the third embodiment of the present invention has the same configuration as that of the second embodiment as shown in FIG. 7, except that the components of the LED module 50 are as described above. The difference is that the circuit patterned on the inner substrate 52 is directly printed on the heat absorbing portion 62 of the heat pipe 60 and the substrate 52 is omitted. Therefore, only such differences will be described with reference to the accompanying drawings as follows.

In the backlight unit according to the third embodiment of the present invention, as shown in the figure, the circuit 52a is directly patterned on the surface of the heat absorbing portion 62 of the heat pipe 60 to thereby absorb the heat absorbing portion 62 of the heat pipe 60.
Plays the role of the substrate 52 instead. That is, in the third embodiment, the circuit 52a printed on the substrate 52 is directly printed on the heat pipe 60. And third
In the embodiment, as shown in the drawing, the light emitting element 51 is mounted on a circuit 52 a patterned on the heat absorbing portion 62. Therefore, in the third embodiment, the LED module 50 is directly connected to the heat pipe 60 as the same body.

In the third embodiment, since the substrate 52 is omitted, the light emitting element 51 and the substrate 5 are omitted.
The heat resistance between the two and the two heat resistances between the substrate 52 and the heat pipe 62 are reduced to the heat resistance between the light emitting element 51 and the heat pipe 62, that is, one heat resistance. In addition, the manufacturing cost of the LED module 50 can be reduced.

Here, in the heat pipe 60 of the third embodiment described above, a channel through which the working fluid communicates may be provided in the heat absorbing portion 62 as described in the second embodiment, and unlike this, a channel is provided. It does not have to be.

On the other hand, as shown in FIG. 8, the backlight unit according to the fourth embodiment of the present invention has the same configuration as that of the first embodiment described above except that the heat radiation angle 56 is provided. The difference is that the heat pipe 60 is composed of one side portion 66 and the other side portion 68 that are formed long by bending. Therefore, only such differences will be described with reference to the accompanying drawings as follows.

In the fourth embodiment of the present invention, as shown in FIG. 8, the heat pipe 60 is composed of one side portion 66 and the other side portion 68. As shown in FIG. 8, the one side portion 66 is formed to be long in a length parallel to the heat radiation angle 56, and is in close contact with the heat radiation angle 56 along the longitudinal direction of the heat radiation angle 56. As shown, one end of the substrate 52 constituting the LED module 50 is directly connected in a stacked state to absorb the heat of the LED module 50. The one side portion 66 transfers the absorbed heat to the other side of the heat radiation angle 56 that is in close contact with the housing 54 as shown in FIG. Therefore, the housing 54 radiates the heat of the LED module 50 transmitted from the heat radiation angle 56.

As shown in FIG. 8, the other side portion 68 is formed to be elongated by extending from the one side portion 66 so as to form an angle different from the one side portion 66 described above. Such other side portion 68 is preferably extended linearly from one side portion 66 at a different angle from one side portion 66 by bending.
The other side portion 68 may be bent so as to have an inclination (θ) with respect to the one side portion 66 as shown in the figure. Unlike the illustration, the other side portion 68 is connected to the one side portion 66 for smooth communication of the working fluid. It may be bent so as to form a right angle. At this time, the inclination (θ) described above is −90 ° <θ <+ 90 ° with reference to a virtual horizontal line H formed at the end portion of the one side portion 66, as shown in FIG.
With a range of That is, the inclination (θ) is performed within a range of an angle at which the other side portion 68 is not aligned with the one side portion 66 or an angle at which the other side portion 68 is not bent with respect to the one side portion 66. The angle of the other side portion 68 is determined according to the required heat dissipation performance, and is preferably configured by 0 ° ≦ θ <+ 90 ° with respect to the horizontal line H described above, and 0 ° ≦ θ ≦ + 45. More preferably, it is composed of °.

Since the other side portion 68 is far from the heat radiation angle 56 as shown in the drawing at a different angle from the one side portion 66, the other side portion 68 can smoothly serve as a condensing portion.

As shown in FIG. 8, the heat pipe 60 configured in this way has one side 66 on the substrate 52.
The other side portion 68 radiates the heat of the substrate 52 transmitted from the one side portion 66 and the heat radiation angle 56.

In the fourth embodiment, since one side portion 66 of the heat pipe 60 is formed longer as shown in FIG. 8, the heat absorption area is remarkably increased as compared with the above-described embodiment. Therefore, in the fourth embodiment, the heat absorption amount of the heat pipe 60 is increased from that of the above-described embodiment, and therefore the heat pipe 60 is provided in the heat pipe 60 by sufficiently absorbing heat so that the working fluid can be vaporized. Other side 68
Heat can be transferred quickly to the end of the.

On the other hand, in the heat pipe 60 of the fourth embodiment, as the other side portion 68 is in close contact with the housing 54 and heat is transferred to the housing 54, the other side portion 68 can serve as a condensing portion by heat radiation. The inflection points 60a and 60b of the first embodiment described above may be provided, and the substrate 52 directly contacts the other side portion 68 as in the second and third embodiments (see FIGS. 6 and 7). Alternatively, the circuit 52a may be directly patterned so that the heat dissipation angle 56 is omitted.

On the other hand, in the backlight unit according to the fifth embodiment of the present invention, as shown in FIG. 9, the heat pipe 60 is configured in the same manner as in the above-described fourth embodiment, except that the LED module 50 is divided as illustrated. The difference is that it is partially disposed on the optical plate 53 without the above-described heat radiation angle 56. Therefore, only such differences will be described with reference to the accompanying drawings as follows.

In the fifth embodiment, the LED module 50 divided as shown in the drawing is partially arranged on the optical plate 53. At this time, the LED module 50 can be divided into 2 to 16 pieces,
In particular, it may be composed of four as shown in the figure and may be arranged only in the vicinity of the corner of the optical plate 53. Unlike the figure, it is between the corner and the middle of the optical plate 53 or along the edge of the optical plate 53. May be partially arranged.

The LED module 50 is provided with the substrate 52 on which the light emitting element 51 described above is mounted, and may be directly connected to one side 66 of the heat pipe 60 via the substrate 52 as shown in the figure. The above-described circuit 52a may be patterned on one side 66 of the pipe 60 to be directly connected to the one side 66 of the heat pipe 60 as the same body.

The heat pipe 60 may have one side portion 66 laminated on the LED module 50 as shown in the drawing. Alternatively, the one side portion 66 may be in close contact with the side surface of the LED module 50 as shown in the enlarged view. Therefore, the heat pipe 60 radiates heat through the housing 54 in which the other side portion 68 is in close contact while absorbing heat of the LED module 50 to the one side portion 66 and transmitting the heat to the other side portion 68.

In the fifth embodiment as described above, even if the LED module 50 is partially installed on the optical plate 53, the heat of the LED module 50 can be easily transmitted and radiated.

Here, when the heat pipe 60 described above is positioned on the lower side of the optical plate 53 as shown in the drawing, the other side portion 68 faces the upper portion, so that the internal working fluid moves smoothly while repeatedly evaporating and condensing. To do. That is, since the other side portion 68 of the heat pipe A on the lower side of the optical plate 53 is directed upward, when heat is transferred to the one side portion 66, the working fluid evaporates and rises to the other side portion 68. Then, it condenses at the other side portion 68 and further returns to the one side portion 66 at the lower portion.

However, as shown in the figure, the heat pipe B positioned on the upper side of the optical plate 53 has the other side portion 68 facing the lower portion, so that the working fluid condensed in the other side portion 68 is an internal wick (not shown).
Can be returned to the vertical one side 66 by the capillary action, but cannot be smoothly returned to the vertical one side 66 by gravity. In particular, the heat pipe B on the upper side is formed by extending the other side portion 68 from the one side portion 66, so that the return is not smoother. Therefore, the upper heat pipe B is preferably configured in a straight line as shown in FIG. 10 in order to smoothly move the working fluid.

As shown in FIG. 10, the heat pipe B on the upper side is formed in a straight line as shown in the figure as a whole by extending the other side part 68 described above from the one side part 66 described above. Most preferably, the LED module 50 is configured and installed in a horizontal state. However, the upper heat pipe B may be installed in an inclined state or a vertical state as shown in FIG. At this time, the above-described inclination means an angle between the illustrated horizontal heat pipe 60 and the illustrated vertical heat pipe 60, and the horizontal heat pipe 60 is in a vertical state with respect to 0 °. When the heat pipe 60 is based on 90 °, it means an angle larger than −90 ° and smaller than 0 °, and may be made at an angle larger than −45 ° and smaller than 0 ° for smooth movement of the working fluid. preferable.

On the other hand, the backlight unit according to the sixth embodiment of the present invention has the same configuration as that of the fifth embodiment described above, except that the LED module 50 includes the optical plate 5 as shown in FIG.
3 is the only difference. Therefore, only such differences will be described with reference to the accompanying drawings as follows.

In the sixth embodiment, as shown in the figure, the LED module 50 is disposed only at the center of the optical plate 53. The LED module 50 can be directly connected to the heat pipe 60 by providing the substrate 52 or the circuit 52a as described above.

As shown in the figure, the heat pipe 60 may be composed of a plurality of pieces and installed in the LED module 50. Alternatively, the heat pipe 60 may be composed of a single piece and installed in the LED module 50. The heat pipe 60 may be laminated on the LED module 50 as shown in the figure, and may be in close contact with the side surface of the LED module 50 as shown in the enlarged figure. And the heat pipe 60 may be installed in the four directions of the LED module 50 as shown by a virtual line (one-dot chain line), and when it is located in the lower part side of the LED module 50, it is constituted in a straight line as shown by the virtual line It may be installed in a horizontal state and an inclined state.

In the sixth embodiment as described above, the heat pipe 60 transfers the heat of the LED module 50 and dissipates it. Therefore, even if the LED module 50 is installed in the center part of the optical plate 53, 6th Example can transmit the heat | fever of the LED module 50 easily, and can thermally radiate.

Here, the LED module 50 and the heat pipe 60 of the sixth embodiment are also applicable to the above-described fifth embodiment. That is, the LED module 50 and the heat pipe 60 of the sixth embodiment can be arranged at the center of the optical plate 53 in FIG. In such a case, the backlight unit simultaneously emits light from the central portion and the corner portion of the optical plate 53 by the LED module 50. At this time, the backlight unit dissipates heat by simultaneously transmitting the heat of the LED module 50 at the center and corner portions of the optical plate 53 to the housing 54 described above. Therefore, the backlight unit operates stably with smooth heat dissipation.

Since the above-described embodiments are merely examples of the present invention, the scope of the present invention is not limited to these embodiments, and appropriate modifications can be made within the scope of the same idea. . Therefore, since the shape and structure of each component shown in the embodiments of the present invention can be modified and implemented, such modifications of the shape and structure belong to the appended claims of the present invention. It will be natural.

In the present invention, the LED module is directly connected to the heat pipe.
The heat of the module can be quickly transmitted, and thus the heat of the LED module can be easily dissipated.

Claims (9)

An optical plate comprising at least one of a light guide plate that transmits light in a dispersed state and a diffuser plate that transmits light in a diffused state;
An LED module having a light emitting element for providing light to the optical plate and a circuit for driving the light emitting element;
A heat pipe that absorbs heat generated from the LED module to one side and dissipates heat while transmitting it to the other side;
A housing that houses at least one of the heat pipe, the optical plate, and the LED module;
The heat pipe is
The backlight unit, wherein the LED module is directly connected to one side, and heat of the LED module is directly transmitted to the one side. The LED module
The circuit is patterned to comprise a substrate on which the light emitting element is mounted,
The heat pipe is
2. The backlight unit according to claim 1, wherein one side is directly coupled to one end of the substrate accommodated in the housing in an overlapping state. The substrate is fixed to one side opposite to the side of the optical plate to dissipate heat of the LED module, and provides light of the light emitting element mounted on the substrate to the side of the optical plate. One side of the heat pipe is in close contact with the other side bent from the side, and heat of the heat pipe is directly transmitted to the other side, or heat of the LED module is transmitted to the heat pipe through the other side. The heat radiation angle which transmits the heat | fever of the said LED module and the heat | fever from the said heat pipe to the said housing, making the back surface of the other side which closely_contact | adhered closely contact | abutted with the said housing, It further contains; The backlight unit described. The heat pipe is
At least one inflection point for bending is provided in the other part so that the other part is in close contact with the housing and heat is transferred to the housing while the other part is in close contact with the other side of the heat radiation angle. The backlight unit according to claim 3, wherein The heat pipe is
The LED module is formed in a length parallel to the heat dissipation angle and is closely adhered along the longitudinal direction of the heat dissipation angle, and the heat of the LED module is absorbed and transmitted to the other side of the heat dissipation angle, or from the heat dissipation angle to the LED module. One side where the heat of heat is transferred;
The one side part is extended from one side at an angle different from that of the one side part, separated from the heat radiation angle at a different angle from the one side part, and extended from the one side part to heat the one side part. The backlight unit according to claim 3, comprising: another side portion to be transmitted. The heat pipe is
A heat-absorbing part that absorbs heat of the LED module by directly connecting a substrate on which the circuit of the LED module is patterned in a close contact state;
2. A heat transfer part that is bent from the heat absorption part and is long in a connected state with the heat absorption part, and is in close contact with the housing and transmits heat from the heat absorption part to the housing. The backlight unit described in. The heat pipe is
A heat absorbing part that absorbs heat of the LED module by patterning the circuit of the LED module on the surface and directly connecting the LED module as the same body;
The heat transfer part is bent from the heat absorption part and is long in a connected state with the heat absorption part, and is in close contact with the housing and transmits heat from the heat absorption part to the housing. The backlight unit described in. The LED module
It is partially arranged on the optical plate or is arranged only at the center part and directly connected to the heat pipe,
The heat pipe is
A side part that is directly connected to the LED module and absorbs heat of the LED module; a heat transfer part that is extended from the one side part and is in close contact with the housing and transmits heat from the one side part to the housing; The backlight unit according to claim 1, comprising: The other side is
The backlight unit according to claim 8, wherein the backlight unit is extended from the one side at a different angle from the one side, or is aligned with the one side.

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