WO2013118848A1 - Method for producing thermal conductive sheet - Google Patents
Method for producing thermal conductive sheet Download PDFInfo
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- WO2013118848A1 WO2013118848A1 PCT/JP2013/052953 JP2013052953W WO2013118848A1 WO 2013118848 A1 WO2013118848 A1 WO 2013118848A1 JP 2013052953 W JP2013052953 W JP 2013052953W WO 2013118848 A1 WO2013118848 A1 WO 2013118848A1
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- sheet
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- rolling member
- heat conductive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/24—Calendering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
- B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
- B29C55/18—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets by squeezing between surfaces, e.g. rollers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/203—Solid polymers with solid and/or liquid additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0013—Conductive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a method for manufacturing a heat conductive sheet, and more particularly, to a method for manufacturing a heat conductive sheet used in power electronics technology.
- a heat conductive sheet containing a plate-like boron nitride powder and an acrylate copolymer resin has been proposed (for example, see Patent Document 1).
- Patent Document 1 a composition comprising a boron nitride powder and an acrylate copolymer resin is pressed into a sheet shape.
- the heat conductive sheet obtained by the method proposed in Patent Document 1 has a high porosity, and therefore has a problem that the heat conductivity cannot be sufficiently improved.
- Patent Document 1 is a method of simply pressing the composition, there is a problem that the plate-like boron nitride powder is easily crushed and the thermal conductivity in a specific direction is lowered.
- Patent Document 1 is a method of simply pressing the composition, there is a problem that the production efficiency cannot be sufficiently improved.
- An object of the present invention is to provide a thermally conductive sheet that can sufficiently reduce the porosity and is excellent in thermal conductivity and flexibility in the plane direction, while effectively preventing crushing of plate-like boron nitride particles.
- An object of the present invention is to provide a method for producing a heat conductive sheet that can be produced with excellent production efficiency.
- the method for producing a thermally conductive sheet according to the present invention includes a step of preparing a raw material component containing plate-like boron nitride particles and a polymer matrix, and a long sheet is formed from the raw material component by a calendar. And a step of pressing the long sheet.
- the calendar includes a plurality of rolls arranged so that a plurality of nip portions are formed, and the nip portions on the upstream side adjacent to each other in the conveying direction of the long sheet. It is preferable that the distance between the downstream nip portions is smaller than the distance between the upstream nip portions.
- a gap between the downstream nip portion is an interval between the upstream nip portion. In contrast, it is preferably 0.9 times or less.
- the calender is provided with at least three nip portions.
- a porosity of the heat conductive sheet is 3.0% by volume or less.
- the calender includes a plurality of pairs of rolls arranged opposite to each other along the transport direction.
- the heat conductive sheet is measured by dynamic viscoelasticity measurement in accordance with JIS K7244-10 (2005) according to dynamic viscoelasticity measurement at a frequency of 10 Hz and a heating rate of 2 ° C./min. It is preferable that the complex shear viscosity ⁇ * at a temperature of 20 to 150 ° C. to be obtained is 300 Pa ⁇ s or more and 10,000 Pa ⁇ s or less.
- the average particle diameter measured by the dynamic light scattering method of the said boron nitride particle is 20 micrometers or more
- the said boron nitride particle in the said heat conductive sheet The volume ratio is preferably 60% by volume or more.
- the heat conductivity in the direction perpendicular to the thickness direction of the heat conductive sheet is 6 W / m ⁇ K or more.
- the heat conductive sheet of the present invention is prepared by a step of preparing a raw material component containing plate-like boron nitride particles and a polymer matrix, by rolling the raw material component with a calender provided with at least one pair of rolls.
- the said calender is provided with two or more rolling members which consist of a pair of roll mutually opposingly arranged,
- the said several rolling members are the conveyance direction upstream of the said elongate sheet
- the long sheet is formed by the plurality of first rolled members, and the plurality of first sheets are formed by the second rolled member. It is preferable that a plurality of the long sheets formed by one rolling member are rolled together.
- the method for producing a heat conductive sheet of the present invention is characterized in that the step of laminating a plurality of the long sheets is performed twice or more.
- a heat conductive sheet of the present invention since a long sheet is formed from a raw material component by a calender, a heat conductive sheet can be obtained with excellent production efficiency.
- the thermally conductive sheet is oriented while aligning the plate-like boron nitride along the plane direction perpendicular to the thickness direction in the polymer matrix.
- the porosity of can be reduced.
- a heat conductive sheet having excellent surface direction heat conductivity and flexibility can be manufactured with excellent manufacturing efficiency.
- FIG. 1 shows the schematic block diagram of the calendar
- FIG. 2 shows the schematic perspective view of the press process of the manufacturing method of the heat conductive sheet of 1st Embodiment of this invention.
- FIG. 3 shows a perspective view of a thermally conductive sheet obtained by the method for producing a thermally conductive sheet according to the first embodiment of the present invention.
- FIG. 4 is a perspective view of a type I test apparatus (before the bending resistance test) of the bending resistance test.
- FIG. 1 shows the schematic block diagram of the calendar
- FIG. 2 shows the schematic perspective view of the press process of the manufacturing
- FIG. 5 is a perspective view of a type I test apparatus (in the middle of the bending resistance test) for the bending resistance test.
- FIG. 6 shows the schematic block diagram (a mode provided with five rolling members by horizontal arrangement
- FIG. 7 shows a schematic configuration diagram (a mode in which three rolls are arranged upright) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 8 shows a schematic configuration diagram (a mode in which four rolls are arranged upright) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 6 shows the schematic block diagram (a mode provided with five rolling members by horizontal arrangement
- FIG. 7 shows a schematic configuration diagram (a mode in which three rolls are
- FIG. 9 shows a schematic configuration diagram (a mode in which five rolls are arranged upright) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 10 shows a schematic configuration diagram of a calendar (an aspect in which three rolls are arranged in an inclined manner) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 11 is a schematic configuration diagram of a calendar used in another embodiment of the long sheet forming step of the manufacturing method of the heat conductive sheet of the present invention (the upper two of the three rolls are arranged in an inclined manner. Embodiment).
- FIG. 10 shows a schematic configuration diagram of a calendar (an aspect in which three rolls are arranged in an inclined manner) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 11 is a schematic configuration diagram of a calendar used in another embodiment of the long sheet forming step of the manufacturing method of
- FIG. 12 is a schematic configuration diagram of a calendar (an aspect in which four rolls are arranged in an inverted L shape) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 13 shows the schematic block diagram (form which four rolls are arrange
- FIG. 14 shows the schematic block diagram (form which four rolls are arrange
- FIG. 13 shows the schematic block diagram (form which four rolls are arrange
- FIG. 14 shows the schematic block diagram (form which four rolls are arrange
- FIG. 15 is a schematic configuration diagram of a calendar (an aspect in which four rolls are arranged in an S shape) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 16 is a schematic configuration diagram (a mode in which five rolls are arranged in an inverted L shape) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 17 is a schematic configuration diagram of a calendar (an aspect in which five rolls are arranged in a 7-shape) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention. Show.
- FIG. 16 is a schematic configuration diagram (a mode in which five rolls are arranged in an inverted L shape) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 17 is a schematic configuration diagram of a calendar (an aspect in which
- FIG. 18 shows a schematic configuration diagram (a mode in which five rolls are arranged in an M-shape) used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention.
- FIG. 19 shows a schematic configuration diagram of a calendar used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention (a mode in which a pair of rolls are arranged opposite to each other in the left-right direction).
- FIG. 20 shows a schematic configuration diagram of a calendar used in another embodiment of the long sheet forming step of the method for producing a heat conductive sheet of the present invention (a mode in which a pair of rolls are arranged opposite to each other in the vertical direction). .
- FIG. 21 is an image processing diagram of an SEM photograph of the thermally conductive sheet of Example 1.
- FIG. 22 is an image processing diagram of an SEM photograph of the thermally conductive sheet of Example 4.
- FIG. 23 shows an image processing diagram of an SEM photograph of boron nitride particles.
- B1 shows the schematic block diagram of the calendar
- FIG. B2 is a modification of the calendar of FIG. B1, and shows a mode in which the sheet stacking portion is a single stage.
- FIG. B3 shows an image processing diagram of an SEM photograph of the thermally conductive sheet of Example B10.
- FIG. B4 shows an image processing diagram of an SEM photograph of boron nitride particles.
- FIG. B5 shows a schematic configuration diagram of calendars of Comparative Example B8, Comparative Example B13, and Comparative Example B15.
- 1st Embodiment of the manufacturing method of the heat conductive sheet of 1st Embodiment is the process (raw material preparation process) of preparing a raw material component, and the process of forming a long sheet from a raw material component with a calendar (long sheet forming process). And a step of pressing the long sheet (pressing step).
- the raw material component contains boron nitride particles and a polymer matrix.
- the boron nitride particles are formed in a plate shape (or scale shape).
- the plate shape only needs to include at least a flat plate shape having an aspect ratio, and includes a disk shape and a hexagonal flat plate shape when viewed from the thickness direction of the plate.
- the plate shape may be laminated in multiple layers, and in the case of being laminated, a plate-like structure with different sizes is laminated and a step shape, and a shape in which the end face is cleaved Is included.
- the plate shape includes a linear shape (see FIG. 3) when viewed from a direction (plane direction) orthogonal to the thickness direction of the plate, and further includes a shape in which the middle of the linear shape is slightly bent.
- Boron nitride particles have an average length in the longitudinal direction (maximum length in the direction perpendicular to the thickness direction of the plate) occupying 60% or more by volume ratio, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, particularly preferably 30 ⁇ m or more, most preferably 40 ⁇ m or more, and for example, 300 ⁇ m or less.
- the average of the thickness (length in the thickness direction of the plate, that is, the length in the short direction of the particle) of the particles occupying 60% or more by the volume ratio of the boron nitride particles is 0.01 ⁇ m or more, preferably 0 .1 ⁇ m or more, and for example, 20 ⁇ m or less, preferably 15 ⁇ m or less.
- the aspect ratio (length / thickness in the longitudinal direction) of the particles occupying 60% or more by the volume ratio of the boron nitride particles is, for example, 2 or more, preferably 3 or more, more preferably 4 or more. For example, it is 10,000 or less, preferably 5,000 or less, and more preferably 2,000 or less.
- the form, thickness, longitudinal length and aspect ratio of boron nitride particles are measured and calculated by an image analysis method. For example, it can be obtained by SEM, X-ray CT, particle size distribution image analysis method, or the like.
- the boron nitride particles have an average particle size measured by a light scattering method of, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, particularly preferably 30 ⁇ m or more, and most preferably 40 ⁇ m or more. In addition, for example, it is 200 ⁇ m or less.
- the average particle diameter measured by the light scattering method is a volume average particle diameter measured by a dynamic light scattering method using a dynamic light scattering particle size distribution measuring apparatus.
- the thermal conductivity may decrease.
- the bulk density (JIS K 5101, apparent density) of the boron nitride particles is, for example, 0.1 g / cm 3 or more, preferably 0.15 g / cm 3 or more, and more preferably 0.2 g / cm 3 or more. Particularly preferably, it is 0.2 g / cm 3 , and for example, 2.3 g / cm 3 or less, preferably 2.0 g / cm 3 or less, more preferably 1.8 g / cm 3 or less, Preferably, it is 1.5 g / cm 3 or less.
- boron nitride particles a commercially available product or a processed product obtained by processing it can be used.
- examples of commercially available boron nitride particles include the “PT” series (for example, “PT-110”, etc.) manufactured by Momentive Performance Materials Japan, and the “Shobi N UHP” series (manufactured by Showa Denko) ( For example, “ShowBN UHP-1” and the like.
- the raw material component may contain other inorganic fine particles in addition to the boron nitride particles described above.
- examples of other inorganic fine particles include carbides such as silicon carbide, nitrides such as silicon nitride (excluding boron nitride), oxides such as silicon oxide (silica), aluminum oxide (alumina), and the like. Examples thereof include metals such as copper and silver, for example, carbon-based particles such as carbon black.
- the other inorganic fine particles may be functional particles having, for example, flame retardancy performance, animal cooling performance, antistatic performance, magnetism, refractive index adjustment performance, dielectric constant adjustment performance, and the like.
- the raw material component may contain, for example, fine boron nitride or irregularly shaped boron nitride particles that are not included in the boron nitride particles described above.
- These other inorganic fine particles can be used alone or in combination of two or more at an appropriate ratio.
- polymer matrix examples include polymer components such as a thermosetting resin component, a thermoplastic resin component, and a rubber component.
- thermosetting resin component examples include epoxy resin, thermosetting polyimide, phenol resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, silicone resin, thermosetting urethane resin, and the like.
- thermosetting resin components an epoxy resin is preferable.
- the epoxy resin is in a liquid, semi-solid or solid form at normal temperature.
- the epoxy resin for example, bisphenol type epoxy resin (for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin (including crystalline bisphenol type epoxy resin), bisphenol S type epoxy resin, water-added bisphenol, etc.
- novolac type epoxy resin for example, phenol novolac type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, etc.
- naphthalene type epoxy resin for example, bisarylfluorene type epoxy resin, etc.
- aromatic epoxy such as triphenylmethane type epoxy resin (eg, trishydroxyphenylmethane type epoxy resin, etc.)
- Fats for example, nitrogen-containing ring epoxy resins such as triepoxypropyl isocyanurate (triglycidyl isocyanurate), hydantoin epoxy resins, for example, aliphatic epoxy resins, alicyclic epoxy resin
- epoxy resins can be used alone or in combination of two or more.
- a semi-solid epoxy resin is used alone, or a combination of a solid epoxy resin and a liquid epoxy resin is used.
- aromatic epoxy resins and alicyclic epoxy resins are used.
- the epoxy resin has an epoxy equivalent of, for example, 100 g / eqiv. As mentioned above, Preferably, it is 180 g / eqiv. Or more and 1000 g / eqiv. Hereinafter, preferably 700 g / eqiv. It is as follows.
- the epoxy resin can be prepared as an epoxy resin composition by containing a curing agent and a curing accelerator.
- the curing agent is a latent curing agent (epoxy resin curing agent) that can cure the epoxy resin by heating.
- a latent curing agent epoxy resin curing agent
- an imidazole compound, an amine compound, an acid anhydride compound, an amide compound, a hydrazide compound, an imidazoline compound, A phenol compound etc. are mentioned.
- urea compounds, polysulfide compounds, and the like are also included.
- imidazole compound examples include 2-phenylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and the like.
- amine compound examples include polyamines such as ethylenediamine, propylenediamine, diethylenetriamine, and triethylenetetramine, and amine adducts thereof such as metaphenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone.
- Examples of the acid anhydride compound include phthalic anhydride, maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride, methyl nadic acid anhydride, and pyromellitic acid.
- Anhydride, dodecenyl succinic anhydride, dichlorosuccinic anhydride, benzophenone tetracarboxylic acid anhydride, chlorendic acid anhydride and the like can be mentioned.
- amide compound examples include dicyandiamide and polyamide.
- Examples of the hydrazide compound include adipic acid dihydrazide.
- imidazoline compound examples include methyl imidazoline, 2-ethyl-4-methyl imidazoline, ethyl imidazoline, isopropyl imidazoline, 2,4-dimethyl imidazoline, phenyl imidazoline, undecyl imidazoline, heptadecyl imidazoline, 2-phenyl-4-methyl.
- phenol compound examples include a novolak type phenol resin obtained by condensing phenol and formaldehyde under an acidic catalyst, for example, a phenol aralkyl resin synthesized from phenol and dimethoxyparaxylene or bis (methoxymethyl) biphenyl. Can be mentioned.
- These curing agents can be used alone or in combination of two or more.
- Preferred examples of the curing agent include imidazole compounds and phenol compounds.
- the curing accelerator examples include tertiary amine compounds such as triethylenediamine and tri-2,4,6-dimethylaminomethylphenol, such as triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium- Phosphorus compounds such as o, o-diethyl phosphorodithioate, for example, triazine compounds such as 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine isocyanuric acid adduct Examples thereof include quaternary ammonium salt compounds such as organometallic salt compounds such as derivatives thereof. These curing accelerators can be used alone or in combination of two or more. Preferably, a triazine compound is used.
- tertiary amine compounds such as triethylenediamine and tri-2,4,6-dimethylaminomethylphenol
- the mixing ratio of the curing agent in the epoxy resin composition is, for example, 0.5 parts by mass or more, preferably 1 part by mass or more, and, for example, 1000 parts by mass or less, preferably 100 parts by mass of the epoxy resin. Is 500 parts by mass or less, and the blending ratio of the curing accelerator is, for example, 0.1 parts by mass or less, preferably 0.2 parts by mass or less, and for example, 10 parts by mass or less, preferably 5 parts by mass or less.
- the above-mentioned curing agent and / or curing accelerator can be prepared and used as a solvent solution and / or a solvent dispersion dissolved and / or dispersed with a solvent, if necessary.
- the solvent examples include organic solvents such as ketones such as acetone and methyl ethyl ketone, esters such as ethyl acetate, and amides such as N, N-dimethylformamide.
- organic solvents such as ketones such as acetone and methyl ethyl ketone, esters such as ethyl acetate, and amides such as N, N-dimethylformamide.
- examples of the solvent also include aqueous solvents such as water, for example, alcohols such as methanol, ethanol, propanol, and isopropanol.
- the solvent is preferably an organic solvent, more preferably a ketone.
- thermoplastic resin component examples include polyolefin (for example, polyethylene, polypropylene, ethylene-propylene copolymer, etc.), acrylic resin (for example, polymethyl methacrylate, etc.), polyvinyl acetate, ethylene-vinyl acetate copolymer, Polyvinyl chloride, polystyrene, polyacrylonitrile, polyamide (nylon (registered trademark)), polycarbonate, polyacetal, polyethylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polysulfone, polyethersulfone, polyetheretherketone, polyallylsulfone, thermoplastic polyimide, Thermoplastic urethane resin, polyaminobismaleimide, polyamideimide, polyetherimide, bismaleimide triazine resin, polymethylpentene, Resin, liquid crystal polymer, an olefin - vinyl alcohol copolymer, ionomer, polyarylate, acryl
- the rubber component is a polymer that exhibits rubber elasticity, and includes, for example, an elastomer.
- urethane rubber acrylic rubber, silicone rubber, vinyl alkyl ether rubber, polyvinyl alcohol rubber, polyvinyl pyrrolidone rubber, polyacrylamide rubber , Cellulose rubber, natural rubber, butadiene rubber, chloroprene rubber, styrene / butadiene rubber (SBR), acrylonitrile / butadiene rubber (NBR), styrene / ethylene / butadiene / styrene rubber, styrene / isoprene / styrene rubber, styrene / isobutylene rubber, Examples include isoprene rubber, polyisobutylene rubber, and butyl rubber.
- acrylic rubber is preferable.
- Acrylic rubber is a synthetic rubber obtained by polymerization of monomers containing (meth) acrylic acid alkyl ester.
- the (meth) acrylic acid alkyl ester is a methacrylic acid alkyl ester and / or an acrylic acid alkyl ester.
- methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, (meth) Examples include hexyl acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate and the like, and linear or branched (meth) acrylic acid alkyl esters having an alkyl moiety of 1 to 10 carbon atoms are preferable. Includes a linear (meth) acrylic acid alkyl ester having an alkyl moiety of 2 to 8 carbon atoms.
- the blending ratio of the (meth) acrylic acid alkyl ester is, for example, 50% by mass or more, preferably 75% by mass or more, for example, 99% by mass or less with respect to the monomer.
- the monomer can also include a copolymerizable monomer that can be polymerized with an alkyl (meth) acrylate.
- the copolymerizable monomer contains a vinyl group, and examples thereof include cyano group-containing vinyl monomers such as (meth) acrylonitrile, and aromatic vinyl monomers such as styrene.
- the blending ratio of the copolymerizable monomer is, for example, 50% by mass or less, preferably 25% by mass or less, for example, 1% by mass or more based on the monomer.
- copolymerizable monomers can be used alone or in combination of two or more.
- the acrylic rubber may contain a functional group bonded to the end of the main chain or in the middle in order to increase the adhesive force.
- a functional group a carboxyl group, a hydroxyl group, an epoxy group, an amide group etc. are mentioned, for example, Preferably, an epoxy group is mentioned.
- the weight average molecular weight of the acrylic rubber is, for example, 10,000 or more, preferably 50,000 or more, more preferably 100,000 or more, and for example, 10,000,000 or less, preferably 5, It is 3,000,000 or less, more preferably 3,000,000 or less, and most preferably 1,000,000 or less.
- the weight average molecular weight (standard polystyrene equivalent value) of acrylic rubber is calculated by GPC.
- the glass transition temperature of the acrylic rubber is, for example, ⁇ 100 ° C. or higher, preferably ⁇ 80 ° C. or higher, more preferably ⁇ 50 ° C. or higher, still more preferably ⁇ 40 ° C. or higher, and for example, 200 ° C. or lower.
- the temperature is preferably 100 ° C. or lower, more preferably 100 ° C. or lower, still more preferably 50 ° C. or lower, and most preferably 40 ° C. or lower.
- the glass transition temperature of the acrylic rubber is calculated by, for example, a midpoint glass transition temperature after heat treatment measured based on JIS K7121-1987 or a theoretical calculated value. When measured based on JIS K7121-1987, the glass transition temperature is specifically calculated at a temperature rising rate of 10 ° C./min in differential scanning calorimetry (heat flow rate DSC).
- Rubber components can be used alone or in combination of two or more.
- the rubber component can be prepared and used as a rubber component solution dissolved in the above-described solvent, if necessary.
- the content ratio of the rubber component is, for example, 1% by mass or more, preferably 2% by mass or more, more preferably 5% by mass or more with respect to the rubber component solution.
- it is 99 mass% or less, Preferably, it is 90 mass% or less, More preferably, it is 80 mass% or less.
- These polymer components can be used alone or in combination of two or more.
- thermosetting resin component a thermosetting resin component and a rubber component are preferable.
- the blending ratio of the thermosetting resin component is, for example, 0.1% by mass or more, preferably 1% by mass or more, more preferably 5% by mass or more, and, for example, 100% by mass with respect to the polymer matrix. % Or less, preferably 99.9% by mass or less, and more preferably 99% by mass or less.
- the blending ratio of the rubber component is, for example, 0.1% by mass or more, preferably 1% by mass or more, more preferably 5% by mass or more, and, for example, 100% by mass or less with respect to the polymer matrix. Preferably, it is 99.9 mass% or less, More preferably, it is 99 mass% or less.
- the blending ratio of the boron nitride particles based on the mass of the raw material components (total solid content) of 100 parts by mass is, for example, 40 parts by mass or more, preferably 65 parts by mass or more, and for example, 95 parts by mass or less, preferably , 90 parts by mass or less, and the blending ratio of the polymer matrix based on 100 parts by mass of the total amount of the raw material components is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, and, for example, 60 parts by mass or less, Preferably, it is 35 parts by mass or less.
- the mixing ratio of the boron nitride particles based on 100 parts by mass of the polymer matrix is, for example, 60 parts by mass or more, preferably 185 parts by mass or more, for example, 1900 parts by mass or less, preferably 900 parts by mass. It is as follows.
- the polymer matrix includes, for example, a polymer precursor (for example, a low molecular weight polymer including an oligomer) and / or a monomer in addition to the above-described components (polymerized products).
- a polymer precursor for example, a low molecular weight polymer including an oligomer
- a monomer in addition to the above-described components (polymerized products).
- the above-described components components including boron nitride particles and a polymer matrix
- a solvent a solvent
- the above-described components components including boron nitride particles and a polymer matrix
- a solvent a solvent
- the raw material components as raw material powders.
- the solvent examples include the same solvents as those used in the curing agent and / or the curing accelerator described above.
- the mixing ratio of the solvent is, for example, 20 parts by mass or more, preferably 50 parts by mass or more, and, for example, 2000 parts by mass or less, preferably 100 parts by mass of the total amount of the boron nitride particles and the polymer matrix. It is 500 parts by mass or less.
- the drying method is, for example, 0 ° C. or higher, preferably 10 ° C. or higher, 80 ° C. or lower, preferably 40 ° C. or lower, for example, 0.01 Pa or higher, preferably 0.1 Pa or higher,
- a vacuum drying method in which vacuum heating is performed at 300 Pa or less, preferably 100 Pa or less is employed.
- the raw material powder can also be prepared from the raw material components by a known rolling fluidized bed granulation method or the like.
- a calendar 1 is a calendar forming apparatus including a plurality of rolls 3 arranged so that a plurality of nip portions 2 are formed.
- the calendar 1 has a conveying direction (vertical direction, vertical direction in FIG. 1) of the long sheet 20 (specifically, the long sheet 20 before the heat conductive sheet 100 is formed by pressing).
- the rolling member 4 which consists of a pair of rolls 5 and 6 mutually opposingly arranged in the direction (right-and-left direction in FIG. 1) orthogonal to is provided.
- a plurality of rolling members 4 are arranged and arranged at intervals along the conveying direction. That is, the rolling member 4 includes a plurality of pairs of rolls 5 and 6 arranged in the transport direction.
- Each of the plurality of rolling members 4 includes a first roll 5 and a second roll 6 facing the first roll 5, and a nip portion 2 (that is, a gap between the first roll 5 and the second roll 6). Is formed.
- the 1st roll 5 and the 2nd roll 6 consist of metal rolls, such as stainless steel, iron, copper, for example. Preferably, it consists of stainless steel.
- the first roll 5 and the second roll 6 are provided to rotate in the same direction (downward) in the nip portion 2 so that the long sheet 20 can be transported downstream (downward) in the transport direction. .
- the rotation speeds of the first roll 5 and the second roll 6 are set to, for example, 50 m / min or less, preferably 10 m / min or less, and for example, 0.01 m / min or more.
- the surface temperature is those B stage, for example, when a polymer matrix contains a thermosetting resin component. It is set to a temperature that will be in a state.
- the surface temperature of the 1st roll 5 and the 2nd roll 6 is 20 degreeC or more, for example, Preferably, it is 40 degreeC or more, for example, 150 degrees C or less, Preferably, it sets to the range of 80 degrees C or less. Has been.
- the diameters of the first roll 5 and the second roll 6 are, for example, 80 mm or more, preferably 100 mm or more, for example, 1000 mm or less, preferably 700 mm or less, and their axial lengths. However, it is formed, for example, as 100 mm or more, preferably 200 mm or more, for example, 3000 mm or less, preferably 2000 mm or less.
- the plurality of rolling members 4 include a first rolling member 7, a second rolling member 8 that is disposed at an interval on the downstream side in the transport direction of the first rolling member 7, and the second rolling member 8.
- the 3rd rolling member 9 arrange
- the 4th rolling member 10 arrange
- the fifth rolling member 11 is allocated to the downstream side in the transport direction with an interval.
- the 1st rolling member 7, the 2nd rolling member 8, the 3rd rolling member 9, the 4th rolling member 10, and the 5th rolling member 11 are arrange
- the gap G of the nip portion 2 between the first roll 5 and the second roll 6 in each of the plurality of rolling members 4 is set so as to be gradually reduced toward the downstream side in the transport direction.
- the gap G1 of the nip part 2 of the first rolling member 7, the gap G2 of the nip part 2 of the second rolling member 8, the gap G3 of the nip part 2 of the third rolling member 9, and the fourth rolling member 10 The gap G4 of the nip portion 2 and the gap G5 of the nip portion 2 of the fifth rolled member 11 satisfy, for example, the following formula (1).
- the gap (gap, hereinafter agreed) G ′ of the nip portion 2 of the downstream rolling member 4 is the upstream rolling member.
- the distance G of the nip portion 2 of 4 is 0.99 times or less, preferably 0.95 times or less, more preferably 0.9 times or less, for example, 0.1 times or more. .
- the ratio R (G ′ / G) of the gap G ′ of the nip portion 2 of the downstream rolling member 4 to the gap G of the nip portion 2 of the upstream rolling member 4 is preferably 0.99 or less, preferably Is 0.95 or less, more preferably 0.9 or less, for example, 0.1 times or more.
- R 2/1 ⁇ R 3/2 ⁇ R 4/3 ⁇ R 5/4 (2)
- R 2/1 is G2 / G1
- R 3/2 is G3 / G2
- R 4/3 is G4 / G3
- R 5/4 is G5 / G4.
- the following formula (3) is satisfied.
- the gap G1 of the nip portion 2 of the first rolling member 7 is, for example, 0.2 mm or more, preferably 0.3 mm or more, and, for example, 5 mm or less, preferably 3 mm or less.
- the gap G2 of the nip portion 2 of the second rolling member 8 is, for example, 0.1 mm or more, and, for example, 4 mm or less, preferably 3 mm or less.
- the gap G3 of the nip portion 2 of the third rolling member 9 is, for example, 0.1 mm or more, for example, 3 mm or less, preferably 2 mm or less.
- the gap G4 of the nip portion 2 of the fourth rolled member 10 is, for example, 0.1 mm or more, and, for example, 2 mm or less, preferably 1 mm or less.
- the gap G5 of the nip portion 2 of the fifth rolled member 11 is, for example, 0.1 mm or more, and, for example, 1 mm or less, preferably 0.8 mm or less.
- R 2/1 , R 3/2 , R 4/3 and R 5/4 are, for example, 0.1 or more, preferably 0.2 or more, and for example, 0.9 or less, preferably Is 0.8 or less.
- the calendar 1 is provided with winding rolls (not shown) on the downstream side in the transport direction of the fifth rolling member 11 with an interval, if necessary.
- the raw material component 27 is introduced from above the nip portion 2 of the first rolling member 7.
- the input amount of the raw material component 27 is, for example, 0.01 kg / min or more, preferably 0.02 kg / min or more, and for example, 50 kg / min or less, preferably 5 kg / min or less.
- the raw material component 27 introduced into the nip portion 2 of the first rolling member 7 is moved downstream in the conveying direction (downward) by the rotation of the first roll 5 and the second roll 6 in the nip portion 2 of the first rolling member 7.
- the long sheet 20 is fed from the first rolling member 7 toward the second rolling member 8.
- the thickness T1 of the long sheet 20 formed by the first rolling member 7 is, for example, 0.2 mm or more, preferably 0.25 mm or more, and, for example, 5 mm or less, preferably 4 mm or less.
- the long sheet 20 sent out from the first rolling member 7 reaches the nip portion 2 of the second rolling member 8 by the rotation of the first roll 5 and the second roll 6 of the second rolling member 8 thereafter.
- the second rolling member 8 is rolled while being conveyed downstream (downward) in the conveying direction by the rotation of the first roll 5 and the second roll 6 of the second rolling member 8, and sent out from the nip portion 2 of the second rolling member 8. .
- the thickness T2 of the long sheet 20 formed by the second rolling member 8 is thinner than the thickness T1 of the long sheet 20 formed by rolling of the first rolling member 7, and the thickness T1 is, for example, It is 99% or less, preferably 95% or less, more preferably 90% or less, and 10% or more.
- the thickness T2 of the long sheet 20 formed by the second rolling member 8 is, for example, 0.1 mm or more, preferably 0.2 mm or more, and, for example, 4 mm or less, preferably 3 mm or less.
- the long sheet 20 sent out from the second rolling member 8 reaches the nip portion 2 of the third rolling member 9 by the rotation of the third rolling member 9 and then enters the third rolling member 9.
- the first roll 5 and the second roll 6 are rotated while being transported downstream (downward) in the transport direction, and are sent out from the nip portion 2 of the third rolling member 9.
- the thickness T3 of the long sheet 20 formed by the third rolling member 9 is thinner than the thickness T2 of the long sheet 20 formed by rolling the second rolling member 8, and the thickness T2 is, for example, It is 99% or less, preferably 95% or less, more preferably 90% or less, and 10% or more.
- the thickness T3 of the long sheet 20 formed by the third rolling member 9 is, for example, 0.1 mm or more, and, for example, 3 mm or less, preferably 2 mm or less.
- the long sheet 20 fed out from the third rolling member 9 reaches the nip portion 2 of the fourth rolling member 10 by the rotation of the fourth rolling member 10 and then enters the fourth rolling member 10.
- the first roll 5 and the second roll 6 are rotated while being transported downstream (downward) in the transport direction, and are sent out from the nip portion 2 of the fourth rolling member 10.
- the thickness T4 of the long sheet 20 formed by the fourth rolling member 10 is thinner than the thickness T3 of the long sheet 20 formed by rolling the third rolling member 9, and the thickness T3 is, for example, It is 99% or less, preferably 95% or less, more preferably 90% or less, and 10% or more.
- the thickness T4 of the long sheet 20 formed by the fourth rolling member 10 is, for example, 0.1 mm or more, and, for example, 2 mm or less, preferably 1 mm or less.
- the long sheet 20 fed out from the fourth rolling member 10 reaches the nip portion 2 of the fifth rolling member 11 by the rotation of the fifth rolling member 11 and then enters the fifth rolling member 11.
- the first roll 5 and the second roll 6 are rotated while being transported downstream (downward) in the transport direction, and are sent out from the nip portion 2 of the fifth rolling member 11.
- the thickness T5 of the long sheet 20 formed by the fifth rolling member 11 is thinner than the thickness T4 of the long sheet 20 formed by rolling the fourth rolling member 10, and the thickness T4 is, for example, It is 99% or less, preferably 95% or less, more preferably 90% or less, and 10% or more.
- the thickness T5 of the long sheet 20 formed by the fifth rolling member 11 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and, for example, 1 mm or less, preferably 0.8 mm or less.
- the long sheet 20 sent out from the fifth rolling member 11 is wound up by a winding roll (not shown).
- a release sheet may be provided and rolled by the calendar 1.
- the raw material component 27 is sandwiched between two release sheets (not shown), and a laminate composed of them is rolled by the calendar 1.
- release sheet examples include resin sheets such as polyester (specifically, polyethylene terephthalate (PET)) sheet, polyolefin sheet, silicone rubber sheet, and metal foil such as stainless steel and iron.
- resin sheets such as polyester (specifically, polyethylene terephthalate (PET)) sheet, polyolefin sheet, silicone rubber sheet, and metal foil such as stainless steel and iron.
- PET polyethylene terephthalate
- a resin sheet is used.
- a well-known mold release process can also be given to the surface of a mold release sheet.
- the thickness of the release sheet is, for example, 10 ⁇ m or more, preferably 30 ⁇ m or more, and for example, 300 ⁇ m or less, preferably 250 ⁇ m or less.
- a commercially available product can be used.
- a PET sheet specifically, a diamond foil MRF series, a diamond foil MRX series, a diamond foil MRN series (above, manufactured by Mitsubishi Plastics), a panapeel series SG series (manufactured by PANAC) is used.
- the pressing process is performed after the long sheet forming process.
- the long sheet 20 formed by the long sheet forming step is cut into a predetermined size to form the sheet 21, and then the sheet 21 is, for example, a vacuum as shown in FIG.
- a heat conductive sheet is obtained by pressing with a press such as a press.
- the long sheet 20 is cut into a rectangular shape to form a sheet 21, a release sheet (not shown) is peeled off from the sheet 21 as necessary, and then another release sheet 44 (long The long sheet 20 is sandwiched with a release sheet (different from the release sheet used in the long sheet forming step) interposed, and pressed under vacuum as necessary.
- the release sheet 44 can also use the release sheet (not shown) used in the elongate sheet formation process as it is.
- a plurality of release sheets 44 can be stacked and used.
- a frame-shaped spacer can be provided around the sheet 21 in the press.
- the spacer is made of, for example, a metal and has a thickness of, for example, 0.05 to 1 mm.
- the vacuum pressure of the vacuum press machine is, for example, 100 Pa or less, preferably 50 Pa or less, more preferably 20 Pa or less, still more preferably 10 Pa or less, for example 0.01 Pa or more.
- the sheet 21 can be set in a vacuum press, the inside of the vacuum press can be evacuated, and then the press can be started.
- the vacuum press is evacuated and the press is started.
- the time is, for example, 0.1 minute or more, preferably 0.5 minute or more, more preferably 1 minute or more, further preferably 2 minutes or more, and for example, 1 hour or less, preferably 30 For 10 minutes or less, more preferably for 10 minutes or less, and even more preferably for 5 minutes or less.
- the press pressure is an effective pressure, for example, 0.5 MPa or more, preferably 1 MPa or more, more preferably 3 MPa or more, further preferably 5 MPa or more, and particularly preferably 10 MPa or more. For example, it is 100 MPa or less.
- the pressing time is, for example, 1 minute or more, preferably 3 minutes or more, more preferably 5 minutes or more, and further preferably 10 minutes or more, for example, 5 hours or less, preferably 2 hours or less, More preferably, it is 1 hour or less, More preferably, it is 30 minutes or less.
- the temperature of the hot press is, for example, 20 ° C. or more, preferably 30 ° C. or more, more preferably 40 ° C. or more, and for example, 150 ° C. or less, preferably 120 ° C. or less, more preferably 80 ° C. It is as follows.
- the heat conductive sheet 100 obtained by the pressing process is a B stage when the polymer matrix contains a thermosetting resin component.
- the thickness T0 (see FIG. 3) of the obtained heat conductive sheet 100 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and, for example, 1 mm or less, preferably 0.8 mm or less. Preferably, it is 0.6 mm or less, more preferably 0.4 mm or less.
- the volume-based content ratio of the boron nitride particles 23 in the heat conductive sheet 100 is, for example, 35% by volume or more, preferably 50% by volume or more, more preferably 60% by volume or more, and further preferably 65% by volume or more. Moreover, it is 95 volume% or less, for example, Preferably, it is 90 volume% or less.
- the boron nitride particles 23 When the content ratio of the boron nitride particles 23 is less than the above range, the boron nitride particles 23 may not be oriented in the plane direction PD (described later) in the thermally conductive sheet 100. Moreover, when the content ratio of the boron nitride particles exceeds the above range, the flexibility of the heat conductive sheet 100 may be lowered.
- the longitudinal direction LD of the boron nitride particles 23 intersects (orthogonally) the thickness direction TD of the heat conductive sheet 100. It is oriented along the plane direction PD.
- the arithmetic average of the angles formed by the longitudinal direction LD of the boron nitride particles 23 in the plane direction PD of the thermally conductive sheet 100 is, for example, 25 degrees or less, Preferably, it is 20 degrees or less, for example, 0 degrees or more.
- the thermal conductivity of the surface direction PD of the heat conductive sheet 100 is, for example, 6 W / m ⁇ K or more, preferably 10 W / m ⁇ K or more, more preferably 15 W / m ⁇ K or more, particularly preferably. Is 20 W / m ⁇ K or more, for example, 200 W / m ⁇ K or less.
- thermal conductivity in the surface direction PD of the thermal conductive sheet 100 is substantially the same before and after thermal curing (complete curing) described later.
- the thermal conductivity of the surface direction PD of the thermal conductive sheet 100 is less than the above range, the thermal conductivity of the surface direction PD is not sufficient. It may not be used.
- the thermal conductivity in the surface direction PD of the thermal conductive sheet 100 is measured by a pulse heating method.
- a xenon flash analyzer “LFA-447 type” manufactured by NETZSCH is used.
- the thermal conductivity in the thickness direction TD of the heat conductive sheet 100 is, for example, 0.5 W / m ⁇ K or more, preferably 1 W / m ⁇ K or more, and, for example, 15 W / m ⁇ K or less. Preferably, it is 10 W / m ⁇ K or less.
- the thermal conductivity in the thickness direction TD of the thermal conductive sheet 100 is measured by a pulse heating method, a laser flash method, or a TWA method.
- a pulse heating method the same one as described above is used
- the laser flash method “TC-9000” (manufactured by ULVAC-RIKO)
- the TWA method “ai-Phase mobile” (manufactured by Eye Phase). Is used.
- the ratio of the thermal conductivity in the plane direction PD of the thermal conductive sheet 100 to the thermal conductivity in the thickness direction TD of the thermal conductive sheet 100 Is, for example, 1.5 or more, preferably 3 or more, more preferably 4 or more, and for example 50 or less.
- the density of the heat conductive sheet 100 is, for example, 1.5 g / cm 2 or more, preferably 1.55 g / cm 2 or more, more preferably 1.6 g / cm 2 or more, and particularly preferably 1. 65 g / cm 2 or more, most preferably 1.7 g / cm 2 or more, for example, 4 g / cm 2 or less.
- a gap (gap) 28 may be formed in the heat conductive sheet 100.
- the ratio of the voids 28 in the thermally conductive sheet 100 is, for example, 3.0% by volume or less, preferably 2.5% by volume or less, more preferably 2.0% by volume or less. More preferably 1.5% by volume or less, and for example, 0% by volume or more.
- the porosity P is first determined by cutting the thermally conductive sheet 100 along the thickness direction with a cross section polisher (CP), and the resulting cross section is measured with a scanning electron microscope (SEM) 200. An image is obtained by observing the image at a magnification, and from the obtained image, the void 28 portion and the other portion are binarized, and then the area of the void 28 portion with respect to the entire cross-sectional area of the heat conductive sheet 100 It is measured by calculating the ratio.
- SEM scanning electron microscope
- a thermally conductive sheet 100 in a B-stage (semi-cured) state is used.
- the thermal conductivity of the thermal conductive sheet 100 and the step following ability (when the thermal conductive sheet 100 is provided on a stepped installation target, The characteristic of following so as to adhere closely along the step can be improved.
- the complex shear viscosity ⁇ * of the heat conductive sheet 100 is at least at any temperature within a temperature range of 20 to 150 ° C. obtained by dynamic viscoelasticity measurement (particularly preferably at 70 ° C.). 300 Pa ⁇ s or more, preferably 500 Pa ⁇ s or more, more preferably 800 Pa ⁇ s or more, and for example, 5 ⁇ 10 4 Pa ⁇ s or less, preferably 3 ⁇ 10 4 Pa ⁇ s or less, More preferably, it is 1 ⁇ 10 4 Pa ⁇ s or less.
- the dynamic viscoelasticity is measured according to JIS K7244-10 (2005) in a shear mode with a frequency of 10 Hz and a heating rate of 2 ° C./min.
- the processability (formability) of the raw material components can be improved.
- thermal conductive sheet 100 is evaluated under the following test conditions in a bending resistance test based on the cylindrical mandrel method of JIS K 5600-5-1, for example, no fracture is observed.
- Test equipment Type I Mandrel: 1mm diameter, 5mm, 10mm Bending angle: 90 ° to 180 °
- the thickness of the heat conductive sheet 100 0.1 to 2 mm (specifically, 0.2 mm)
- FIGS. 4 and 5 A perspective view of the type I test apparatus is shown in FIGS. 4 and 5, and the type I test apparatus will be described below.
- the type I test apparatus 30 relatively rotates the first flat plate 31, the second flat plate 32 arranged in parallel with the first flat plate 31, and the first flat plate 31 and the second flat plate 32.
- a mandrel (rotary shaft) 33 is provided.
- the first flat plate 31 is formed in a substantially rectangular flat plate shape.
- a stopper 34 is provided at one end (free end) of the first flat plate 31.
- the stopper 34 is formed on the surface of the first flat plate 31 so as to extend along one end portion of the first flat plate 31.
- the second flat plate 32 has a substantially rectangular flat plate shape, and one side thereof is one side of the first flat plate 31 (one side of the other end (base end) opposite to the one end where the stopper 34 is provided). It arrange
- the mandrel 33 is formed so as to extend along one side of the first flat plate 31 and the second flat plate 32 adjacent to each other.
- the surface of the first flat plate 31 and the surface of the second flat plate 32 are flush with each other before the bending resistance test is started.
- the heat conductive sheet 100 is mounted on the surface of the first flat plate 31 and the surface of the second flat plate 32.
- the heat conductive sheet 100 is placed so that one side thereof is in contact with the stopper 34.
- the first flat plate 31 and the second flat plate 32 are relatively rotated. Specifically, the free end portion of the first flat plate 31 and the free end portion of the second flat plate 32 are rotated about the mandrel 33 by a predetermined angle. Specifically, the first flat plate 31 and the second flat plate 32 are rotated so that the surfaces of their free end portions are close (opposed).
- the heat conductive sheet 100 bends around the mandrel 33 while following the rotation of the first flat plate 31 and the second flat plate 32.
- the thermal conductive sheet 100 is not observed to break even when the bending angle is set to 180 degrees under the test conditions described above.
- the heat conductive sheet 100 may not be provided with excellent flexibility.
- the thermally conductive sheet 100 in the B stage state is used.
- this heat conductive sheet 100 is affixed on the heat dissipation object used as a to-be-adhered body, and after that, when a polymer matrix contains a thermosetting resin component, it heat-hardens by heating (it is set as a C stage state). ) To adhere to the heat dissipation object.
- the heat conductive sheet 100 In order to thermally cure the heat conductive sheet 100, for example, 60 ° C. or more, preferably 80 ° C. or more, for example, 250 ° C. or less, preferably 200 ° C. or less, for example, 5 minutes or more, preferably The heat conductive sheet 100 is heated for 10 minutes or longer, for example, 300 minutes or shorter, preferably 200 minutes or shorter.
- the heat conductive sheet 100 is formed from the raw material component 27 with the calendar 1, the heat conductive sheet 100 can be obtained with excellent manufacturing efficiency.
- the raw material component 27 is passed through the upstream nip portion 2 and the downstream nip portion 2 adjacent to each other in the vertical direction, that is, through the rolling member 4.
- the interval G 'between the downstream nip portions 2 is set to be smaller than the interval G between the upstream nip portions.
- the gap G2 of the nip part 2 of the second rolling member 8 is smaller than the gap G1 of the nip part 2 of the first rolling member 7, and the gap G3 of the nip part 2 of the third rolling member 9 is 2 is smaller than the gap G2 of the nip portion 2 of the rolling member 8, the gap G4 of the nip portion 2 of the fourth rolling member 10 is smaller than the gap G3 of the nip portion 2 of the third rolling member 9, and is the nip of the fifth rolling member 8.
- the interval G5 of the portion 2 is set smaller than the interval G4 of the nip portion 2 of the first rolling member 7.
- the gaps G1 to G5 of the nip portion 2 of the rolling member 4 are set so as to decrease sequentially toward the downstream side in the transport direction.
- the porosity P can be reduced while the plate-like boron nitride particles 23 are efficiently oriented in the polymer matrix 24 along the plane direction PD.
- the heat conductive sheet 100 having excellent heat conductivity and flexibility in the surface direction PD can be manufactured with excellent manufacturing efficiency.
- the heat conductive sheet 100 having excellent flexibility and thermal conductivity in the surface direction PD can be used for various heat dissipation applications.
- the heat of the electronic element can be efficiently conducted while protecting the electronic element.
- the electronic element coated on the heat conductive sheet 100 is not particularly limited, and examples thereof include an IC (integrated circuit) chip, a capacitor, a coil, a resistor, and a light emitting diode. These electronic elements are usually provided on a substrate, and are arranged at intervals in a plane direction (plane direction of the substrate).
- the heat conductive sheet 100 can be prevented from being deteriorated by heat, and the heat conductive sheet can be prevented.
- the heat of the electronic component and / or the mounting board can be dissipated along the surface direction PD.
- Electronic components used in power electronics include, for example, IC (integrated circuit) chips (especially narrow electrode terminal portions in IC chips), thyristors (rectifiers), motor parts, inverters, power transmission parts, capacitors, coils , Resistors, light emitting diodes, and the like.
- IC integrated circuit
- the electronic component described above is mounted on the surface (one surface) of the mounting substrate, and in such a mounting substrate, the electronic components are arranged at intervals in the surface direction (surface direction of the mounting substrate). Yes.
- the heat conductive sheet 100 excellent in heat resistance can be provided on, for example, an LED heat dissipation board or a battery heat dissipation material.
- the raw material component containing the solvent is dried to prepare the raw material powder, which is put into the calendar 1.
- the raw material sheet 26 can be put into the calendar 1.
- the calendar 1 has a vertical arrangement in which a plurality of rolling members 4 are arranged in series in a vertical manner so that the plurality of rolling members 4 extend in the vertical direction. It can also be set as the horizontal type arrangement
- the manufacturing method of the heat conductive sheet using the calendar 1 of FIG. 6 has the same effect as the manufacturing method of the heat conductive sheet using the calendar 1 of FIG.
- the 1st roll 5 and the 2nd roll 6 are each arrange
- positioning is not limited to it.
- the calendar 1 can also be constituted by a rolling member 4 made of rolls 3 formed in various arrangements.
- the path of the long sheet 20 is formed in a bent shape, the long sheet 20 is rolled while being bent, and the heat conductive sheet 100 is manufactured.
- a plurality (three) of the rolls 3 are arranged in an inclined manner with respect to the vertical direction.
- the upper two rolls 3 are arranged to face each other in the inclination direction with respect to the vertical direction.
- the rolling member 4 is composed of four rolls 3.
- the roll 3 is in an inverted L shape in FIG. 12, in an L shape in FIG. 13, and in FIG. In FIG. 15, it is arranged in an S shape in a Z shape.
- the rolling member 4 comprises five rolls 3.
- the roll 3 has an inverted L shape in FIG. 16, a 7 shape in FIG. 17, and a roll shape in FIG. Are arranged in an M-shape.
- the manufacturing method of the heat conductive sheet 100 using the calendar 1 shown in FIG. 1 and FIG. 6 is mentioned.
- this method since the rolling member 4 is arranged in a straight line and the path of the long sheet 20 is formed to extend in a straight line, a stress for bending the plate-like boron nitride particles 23 is generated. This can be prevented, whereby the breakage of the boron nitride particles 23 can be more effectively prevented.
- the number is not particularly limited as long as it is plural so that a plurality of nip portions 2 are formed.
- the number can be set (excluding 5), preferably 3 to 7 (excluding 5).
- three or more rolling members 4 are provided. Thereby, the long sheet 20 can be rolled sufficiently efficiently.
- a calendar forming apparatus including a plurality of rolling members 4 is used as the calendar 1.
- a calendar including a single rolling member 4 is used.
- a molding apparatus can also be used.
- a pair of rolls 3 constitutes a single rolled member 4 and are arranged to face each other in the left-right direction.
- the manufacturing method of the heat conductive sheet of 2nd Embodiment is the process of preparing a raw material component (raw material preparation process), the process of forming a long sheet by rolling a raw material component with a calendar (long sheet forming process), And the process (press process) of pressing a long sheet is provided.
- the raw material preparation process of the second embodiment is the same as the raw material preparation process of the first embodiment.
- a calendar B1 includes a sheet forming portion B3 that forms the first long sheet B2 from the raw material component B9, and the first long sheet B2 in the thickness direction (the thickness direction of the first long sheet B2, the same applies hereinafter). And a sheet lamination part B4 for laminating a plurality of sheets.
- the sheet forming section B3 is arranged on the most upstream side in the conveying direction of the first long sheet B2 in the calendar B1 (the vertical direction in FIG. B1, hereinafter simply referred to as the conveying direction), and includes a plurality of rolling members B5.
- the sheet stacking part B4 is arranged on the downstream side in the transport direction with respect to the sheet forming part B3.
- the sheet stacking part B4 is composed of multiple stages or single stages (n stages (n is an integer of 1 or more)), for example, 1 to 9 stages, preferably 2 to 6 stages (specifically, 4 stages) in the conveying direction. Has been.
- the sheet forming unit B3 includes a plurality ( 2n , specifically, 16) of rolling members B5 arranged in parallel in a direction orthogonal to the conveying direction.
- Each of the rolling members B5 is a pair arranged to face each other so as to form a nip portion (hereinafter referred to as a first nip portion B8 in the sheet forming portion and a second nip portion B14 in the sheet stacking portion). It is equipped with a roll.
- the pair of rolls includes a first roll B6 disposed on one side in the parallel direction (a direction intersecting the transport direction) and a second roll B7 disposed opposite to the other side in the parallel direction with respect to the first roll B6. I have.
- the first roll B6 and the second roll B7 are made of, for example, a roll made of metal such as stainless steel, iron, or copper.
- the first roll B6 and the second roll B7 are preferably made of stainless steel. Further, the surface of the first roll B6 and the second roll B7 can be subjected to mold release treatment.
- the first roll B6 and the second roll B7 have a diameter of, for example, 80 mm or more, preferably 100 mm or more, for example, 1000 mm or less, preferably 700 mm or less, and an axial direction thereof.
- the length is, for example, 100 mm or more, preferably 200 mm or more, for example, 3000 mm or less, preferably 2000 mm or less.
- the gap G1 between the first nip portion B8 of the first roll B6 and the second roll B7 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and, for example, 10 mm or less, preferably 0. .5 mm or less.
- the rotation speeds of the first roll B6 and the second roll B7 are set, for example, in a range of 50 m / min or less, preferably 10 m / min or less, for example, 0.01 m / min or more.
- the 1st roll B6 and the 2nd roll B7 are heated by the heat source which is not shown in figure as needed,
- the surface temperature is 20 degreeC or more, for example, Preferably, it is 40 degreeC or more, for example, 150 degreeC or less, Preferably Is set to a range of 80 ° C. or lower.
- the first roll B6 and the second roll B7 are provided so as to rotate in the same direction at the first nip portion B8 so that the first long sheet B2 can be transported downstream in the transport direction.
- the rolled member B5 forms the first long sheet B2 by rolling the raw material component B9 into a sheet shape.
- the sheet lamination part B4 includes a first stage lamination part, and if necessary, a plurality of intermediate stage lamination parts and a final stage lamination part.
- the sheet stacking part B4 is composed of n stages, for example, the first sheet stacking part (first stage stacking part), if necessary, the second sheet stacking part (intermediate stage stacking part), ..., and The nth sheet lamination part (final stage lamination part) is provided.
- the sheet stacking section B4 includes a first sheet stacking section B10 (first stage stacking section), a second sheet stacking section B11 (intermediate stage stacking section), and a third sheet stacking section B12 (intermediate stage stacking section). Laminating part) and a fourth sheet laminating part B13 (final stage laminating part).
- the first sheet stacking unit B10 is disposed on the downstream side in the transport direction with respect to the sheet forming unit B3, and is disposed on the most upstream side in the transport direction in the sheet stacking unit B4. Moreover, 1st sheet
- stacking part B10 is orthogonal to a conveyance direction in the conveyance direction downstream with respect to several rolling member B5 (equivalent to a 1st rolling member) in sheet
- One rolling member B5 (corresponding to a second rolling member) arranged in parallel in the direction to be provided.
- one rolling member B5 of the first sheet stacking part B10 is provided corresponding to the two rolling members B5 in the sheet forming part B3.
- half of the rolling members B5 of the first sheet stacking portion B10 are provided with respect to the number of rolling members B5 of the sheet forming portion B3.
- the first sheet stacking portion B10 includes 2 n-1 (specifically, 8) rolling members B5.
- the material, size, rotation speed, surface temperature, and rotation direction of the first roll B6 and the second roll B7 that form each rolling member B5 in the first sheet lamination portion B10 are the same as those of the rolling member B5 in the sheet forming portion B3. It is.
- the gap G2 between the second nip portion B14 of the first roll B6 and the second roll B7 in the first sheet lamination portion B10 is, for example, 50% with respect to the first gap G1 of the first nip portion B8 in the sheet forming portion B3.
- the gap G2 of the second nip portion B14 in the first sheet lamination part B10 is, for example, 0.05 mm or more, preferably 0.05 mm or more, more preferably 0.1 mm or more, and further preferably For example, it is 1.5 mm or less, preferably 1 mm or less, more preferably 0.8 mm or less, and still more preferably 0.6 mm or less.
- the second sheet stacking part B11 is arranged on the downstream side in the transport direction with respect to the first sheet stacking part B10.
- stacking part B11 is a conveyance direction in the conveyance direction downstream with respect to several rolling member B5 (equivalent to a 1st rolling member) in 1st sheet
- one rolling member B5 of the second sheet lamination portion B11 is provided corresponding to the two rolling members B5 in the first sheet lamination portion B10.
- half of the rolling members B5 of the second sheet lamination portion B11 are provided with respect to the number of rolling members B5 of the first sheet lamination portion B10.
- the second sheet stacking part B11 is provided with 2 n ⁇ 2 (specifically, four) rolling members B5.
- 1st roll B6 and 2nd roll B7 which form each rolling member B5 in 2nd sheet lamination part B11 are the same as those in 1st sheet lamination part B10.
- the third sheet stacking part B12 is arranged on the downstream side in the transport direction with respect to the second sheet stacking part B11.
- the third sheet stacking portion B12 is in the transport direction on the downstream side in the transport direction with respect to the plurality of rolling members B5 (corresponding to the first rolling member) in the second sheet stacking portion B11 arranged on the upstream side in the transport direction. Is provided with one rolling member B5 (corresponding to a second rolling member) arranged in parallel in a direction orthogonal to the direction.
- one rolling member B5 of the third sheet lamination portion B12 is provided corresponding to the two rolling members B5 in the second sheet lamination portion B11.
- half of the rolling members B5 of the third sheet lamination part B12 are provided with respect to the number of rolling members B5 of the second sheet lamination part B11.
- the third sheet stacking part B12 includes 2 n ⁇ 3 (specifically, two) rolling members B5.
- 1st roll B6 and 2nd roll B7 which form each rolling member B5 in 3rd sheet lamination part B12 are the same as those in 1st sheet lamination part B10.
- the fourth sheet stacking part B13 is disposed on the downstream side in the transport direction with respect to the third sheet stacking part B12, and is disposed on the most downstream side in the transport direction in the sheet stacking part B4. Further, the fourth sheet stacking portion B13 is in the transport direction on the downstream side in the transport direction with respect to the plurality of rolling members B5 (corresponding to the first rolling member) in the third sheet stacking portion B12 arranged on the upstream side in the transport direction. Is provided with one rolling member B5 (corresponding to a second rolling member) arranged in parallel in a direction orthogonal to the direction.
- one rolling member B5 of the fourth sheet lamination part B13 is provided corresponding to the two rolling members B5 in the third sheet lamination part B12.
- half of the rolling members B5 of the fourth sheet lamination portion B13 are provided with respect to the number of rolling members B5 of the third sheet lamination portion B12.
- the fourth sheet stacking portion B13 includes 2 n ⁇ 4 (specifically, one) rolling members B5.
- 1st roll B6 and 2nd roll B7 which form each rolling member B5 in 4th sheet lamination part B13 are the same as those in 1st sheet lamination part B10.
- a winding roll (not shown) is a rolling member in the fourth sheet lamination portion B13 (or the nth sheet lamination portion when the sheet lamination portion B4 is composed of n stages). It is provided at an interval on the downstream side in the conveyance direction of B5.
- the raw material component B9 is charged into each first nip portion B8 of the plurality of rolling members B5 in the sheet forming portion B3.
- the input amount of the raw material component B9 is, for example, 0.01 kg / min or more, preferably 0.02 kg / min or more, and, for example, 50 kg / min or less, 5 kg / min or less.
- the raw material component B9 introduced into each first nip portion B8 of the plurality of rolling members B5 in the sheet forming portion B3 is conveyed in the conveying direction by the rotation of the first roll B6 and the second roll B7 in the first nip portion B8.
- Each of the first long sheets B2 is rolled out while being conveyed to the downstream side and formed on the first long sheet B2, and the first long sheets B2 are sent out from the respective rolling members B5 in the sheet forming portion B3.
- the thickness TB1 of the first long sheet B2 formed by the rolling member B5 in the sheet forming portion B3 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and for example, 1 mm or less, preferably It is 0.8 mm or less, More preferably, it is 0.6 mm or less, More preferably, it is 0.4 mm or less.
- the two first long sheets B2 rolled by the two rolling members B5 adjacent to each other in the parallel direction in the sheet forming portion B3 are one rolling member in the first sheet stacking portion B10 corresponding to these two. It is sent out to B5. Then, the two first long sheets B2 then reach the second nip portion B14 of the rolling member B5 in the first sheet stacking portion B10, and are joined together and stacked in the second sheet in the first sheet stacking portion B10. The nip portion B14 is entered. Next, the two first long sheets B2 that have entered the second nip portion B14 are rolled together while being transported downstream (downward) in the transport direction by the rotation of the first roll B6 and the second roll B7. It is formed on one second long sheet B15 composed of two layers, and is sent out from the rolling member B5 in the first sheet lamination part B10.
- the thickness TB2 of the second long sheet B15 formed by the rolling member B5 in the first sheet lamination part B10 is compared with the thickness TB1 of the first long sheet B2 formed by rolling of the rolling member B5 in the sheet forming part B3.
- it is 150% or less, preferably 130% or less, more preferably 120% or less, and for example, 50% or more, preferably 70% or more, and more preferably 80% or more.
- the thickness TB2 of the second long sheet B15 formed by the rolling member B5 in the first sheet stacking portion B10 is, for example, 0.05 mm or more, preferably 0.1 mm or more, 1 mm or less, preferably 0.8 mm or less, more preferably 0.6 mm or less, and further preferably 0.4 mm or less.
- the two second long sheets B15 rolled by the two rolling members B5 adjacent to each other in the parallel direction in the first sheet lamination part B10 correspond to one of the two in the second sheet lamination part B11. It is sent out toward the rolling member B5. Then, the two second long sheets B15 then reach the second nip portion B14 of the rolling member B5 in the second sheet lamination portion B11 and are united and laminated while being second in the second sheet lamination portion B11. The nip portion B14 is entered. Next, the two second long sheets B15 that have entered the second nip portion B14 are rolled together while being conveyed downstream (downward) in the conveyance direction by the rotation of the first roll B6 and the second roll B7. It is formed on one third long sheet B16 composed of four layers, and is fed out from the rolling member B5 in the second sheet lamination part B11.
- the thickness TB3 of the third long sheet B16 formed by the rolling member B5 in the second sheet lamination part B11 is the thickness TB2 of the second long sheet B15 formed by rolling of the rolling member B5 in the first sheet lamination part B10.
- 150% or less preferably 130% or less, more preferably 120% or less, and for example, 50% or more, preferably 70% or more, more preferably 80% or more. is there.
- the thickness TB3 of the third long sheet B16 formed by the rolling member B5 in the second sheet lamination portion B11 is, for example, 0.05 mm or more, preferably 0.1 mm or more, 1 mm or less, preferably 0.8 mm or less, more preferably 0.6 mm or less, and further preferably 0.4 mm or less.
- the thickness TB4 of the fourth long sheet B17 formed by the rolling member B5 in the third sheet lamination part B12 is the thickness TB3 of the third long sheet B16 formed by rolling of the rolling member B5 in the second sheet lamination part B11.
- 150% or less, preferably 130% or less, more preferably 120% or less, and for example, 50% or more, preferably 70% or more, more preferably 80% or more. is there.
- the thickness TB4 of the fourth long sheet B17 formed by the rolling member B5 in the third sheet lamination portion B12 is, for example, 0.05 mm or more, preferably 0.1 mm or more, 1 mm or less, preferably 0.8 mm or less, more preferably 0.6 mm or less, and further preferably 0.4 mm or less.
- Two fourth long sheets B17 rolled by two rolling members B5 adjacent to each other in the parallel direction in the third sheet stacking portion B12 correspond to one of the two in the fourth sheet stacking portion B13. It is sent out toward the rolling member B5. Then, the two fourth long sheets B17 then reach the second nip portion B14 of the rolling member B5 in the fourth sheet stacking portion B13, and the second sheet in the fourth sheet stacking portion B13 is stacked while being united. The nip portion B14 is entered. Next, the two fourth long sheets B17 that have entered the second nip portion B14 are rolled together while being conveyed downstream (downward) in the conveyance direction by the rotation of the first roll B6 and the second roll B7. , Formed in one fifth long sheet B18 composed of 16 layers, and fed out from the rolling member B5 in the fourth sheet lamination part B13.
- the thickness TB5 of the fifth long sheet B18 formed by the rolling member B5 in the fourth sheet lamination part B13 is the thickness TB4 of the fourth long sheet B17 formed by rolling of the rolling member B5 in the third sheet lamination part B12.
- 150% or less, preferably 130% or less, more preferably 120% or less, and for example, 50% or more, preferably 70% or more, more preferably 80% or more. is there.
- the thickness TB5 of the fifth long sheet B18 formed by the rolling member B5 in the fourth sheet lamination portion B13 is, for example, 0.05 mm or more, preferably 0.1 mm or more, It is 1 mm or less, for example, 0.8 mm or less, More preferably, it is 0.6 mm or less, More preferably, it is 0.4 mm or less.
- the fifth long sheet B18 fed from the rolling member B5 in the fourth sheet stacking part B13 is wound up by a winding roll (not shown).
- the pressing process of the second embodiment is the same as the pressing process of the first embodiment.
- the physical properties and the like of the sheet B21 and the heat conductive sheet B100 of the second embodiment are the same as those of the heat conductive sheet 100 of the first embodiment.
- this heat conductive sheet B100 is affixed on the heat dissipation object used as a to-be-adhered body, and after that, when a polymer matrix contains a thermosetting resin component, it is thermoset by heating (it is set as a C stage state). ) To adhere to the heat dissipation object.
- the heat conductive sheet B100 In order to thermally cure the heat conductive sheet B100, for example, 60 ° C. or more, preferably 80 ° C. or more, for example, 250 ° C. or less, preferably 200 ° C. or less, for example, 5 minutes or more, preferably The heat conductive sheet B100 is heated for 10 minutes or longer, for example, 300 minutes or shorter, preferably 200 minutes or shorter.
- the plate-like boron nitride particles B23 can be effectively prevented from being crushed.
- the first long sheet B2 is formed by rolling the raw material component B9 with the first roll B6 and the second roll B7 in the sheet forming section B3, and then the first sheet stacking section B10 in the sheet stacking section B4.
- a plurality of third long sheets B16 and fourth long sheets B17 are stacked in the thickness direction TD and rolled. Thereafter, in order to further press the long sheet, the porosity P can be reduced while orienting the plate-like boron nitride 23 along the surface direction PD orthogonal to the thickness direction TD in the polymer matrix B24.
- the porosity P can be reduced while the plate-like boron nitride particles B23 are efficiently oriented along the plane direction PD in the polymer matrix B24.
- the thermal conductive sheet B100 having excellent thermal conductivity and flexibility in the surface direction PD can be manufactured with excellent manufacturing efficiency.
- the heat conductive sheet B100 having excellent flexibility and thermal conductivity in the surface direction PD can be used for various heat dissipation applications.
- the electronic element can be efficiently conducted while protecting the electronic element.
- the electronic element covered with the heat conductive sheet B100 is not particularly limited, and examples thereof include an IC (integrated circuit) chip, a capacitor, a coil, a resistor, and a light emitting diode. These electronic elements are usually provided on a substrate, and are arranged at intervals in a plane direction (plane direction of the substrate).
- the heat conductive sheet B100 covers an electronic component employed in power electronics and / or a mounting substrate on which the electronic component is mounted, the heat conductive sheet B100 can be prevented from being deteriorated by heat, and the heat conductive sheet B100 can be prevented. With B100, the heat of the electronic component and / or the mounting substrate can be radiated along the surface direction PD.
- Electronic components used in power electronics include, for example, IC (integrated circuit) chips (especially narrow electrode terminal portions in IC chips), thyristors (rectifiers), motor parts, inverters, power transmission parts, capacitors, coils , Resistors, light emitting diodes, and the like.
- IC integrated circuit
- the electronic component described above is mounted on the surface (one surface) of the mounting substrate, and in such a mounting substrate, the electronic components are arranged at intervals in the surface direction (surface direction of the mounting substrate). Yes.
- the heat conductive sheet B100 having excellent heat resistance can be provided on, for example, an LED heat dissipation board or a battery heat dissipation material.
- the raw material component containing the solvent is dried to prepare the raw material powder, which is put into the calendar B1, but for example, shown by the phantom line in FIG.
- the raw material sheet B26 can be put into the calendar B1.
- positioned relatively downstream in a conveyance direction is provided corresponding to two rolling members B5 arrange
- the rolling member B5 that is relatively disposed on the downstream side in the conveying direction corresponds to three or more rolling members B5 that are relatively disposed on the upstream side in the conveying direction.
- the step of laminating two long sheets is performed four times, but the number of times of laminating the long sheets is not particularly limited, for example, once (that is, The embodiment in which the sheet lamination part is a single stage (see FIG. B2)) or more, preferably 2 times or more, more preferably 3 times or more, for example, 10 times or less, preferably 7 times or less. .
- the porosity may not be sufficiently reduced.
- Example 1 [Raw material component preparation process] After mixing and stirring each component based on the formulation described in Table 1, the raw material component was prepared as a raw powder by distilling off methyl ethyl ketone (solvent) by vacuum drying at 25 ° C. (mixing) ⁇ Vacuum drying method).
- the raw material component When the raw material component was introduced into the rolled member, the raw material component was sandwiched between two long release sheets (trade name “Panapeel TP-03”, PET, thickness 188 ⁇ m, manufactured by PANAC). .
- the two release sheets sandwiched the raw material components so that their processing surfaces face each other, that is, face the inside.
- the long sheet was in the B stage state.
- a plate-like silicone rubber sheet (release sheet) was first placed in a vacuum press, and a laminate was placed thereon. Further, a silicone rubber sheet was placed thereon, and subsequently vacuuming was performed at 70 ° C. for 5 minutes at 50 Pa or less with a vacuum heating press. Next, the effective pressure was adjusted to 10 MPa, and after performing hot pressing for 10 minutes, the pressure was released to obtain a heat conductive sheet.
- the thermally conductive sheet was in a B-stage state, and its thickness was 258 ⁇ m.
- Examples 2 to 8 and Comparative Examples 1 to 15 Based on the formulations and conditions described in Tables 1 to 6, the same treatment as in Example 1 was performed to obtain thermally conductive sheets of Examples 2 to 8 and Comparative Examples 1 to 15.
- Comparative Examples 1 to 7 the long sheet forming process was not performed by a calendar. That is, in Comparative Examples 1, 3, and 5, the raw material powder was pressed. In Comparative Examples 2 and 4, the raw material powder was kneaded and then pressed. Further, in Comparative Example 6, the raw material powder was kneaded and extruded. In Comparative Example 7, the raw material powder was kneaded and extruded, and then pressed.
- Comparative Examples 8 to 15 did not perform the pressing process. That is, only the long sheet forming step was performed, and the obtained long sheet was obtained as it was as a heat conductive sheet.
- the thermal conductivity in the plane direction (PD) was measured by a pulse heating method using a xenon flash analyzer “LFA-447 type” (manufactured by NETZSCH). Further, the thermal conductivity in the thickness direction (TD) was measured by the TWA method using “ai-Phase mobile” (manufactured by Eye Phase).
- boron nitride particles (PT-110) were also observed with an electron microscope (SEM). The image processing diagram is shown in FIG.
- the bending resistance (flexibility) of the thermal conductive sheets of the respective examples in the B stage state and the comparative examples was evaluated under the following test conditions.
- Test equipment Type I Mandrel: 10mm diameter, 5mm diameter, or 1mm diameter Then, from the diameter of the mandrel of the test apparatus that causes each thermal conductive sheet in the B-stage state to bend at a bending angle of more than 90 degrees and 180 degrees or less and cause the thermal conductive sheet to break (damage), It was evaluated as follows.
- Measuring method of porosity First, the volume and weight of the heat conductive sheet were measured, and the density was calculated. Furthermore, the density of 2.28 g / cm 3 of boron nitride particles, assuming the density of the resin and 1.2 g / cm 3, when calculating the theoretical density of the thermal conductive sheet (a 70vol%, 1.956g / cm 3 ).
- Example B1 [Raw material component preparation process] After mixing and stirring each component based on the formulation described in Table B1, methyl ethyl ketone (solvent) was distilled off by vacuum drying at 25 ° C. to prepare a raw material component as a raw powder (mixing) ⁇ Vacuum drying method).
- the long sheet was in the B stage state.
- a plate-like silicone rubber sheet was first placed in a vacuum press, and a laminate was placed thereon. Further, a silicone rubber sheet was placed thereon, and subsequently vacuuming was performed at 70 ° C. for 5 minutes at 50 Pa or less with a vacuum heating press. Next, the effective pressure was adjusted to 10 MPa, and after pressing for 10 minutes, the pressure was released to obtain a heat conductive sheet.
- the thermally conductive sheet was in a B-stage state, and its thickness was 258 ⁇ m.
- Example B2 to Example B10 and Comparative Example B1 to Comparative Example B20 Based on the formulation and conditions described in Tables B1 ⁇ Table B6, was treated in the same manner as in Example B1, to obtain a thermally conductive sheet.
- Comparative Examples B1 to B7 the long sheet forming process was not performed by a calendar. That is, Comparative Example B1, Comparative Example B3, and Comparative Example B5 pressed the raw material powder. In Comparative Example B2 and Comparative Example B4, the raw material powder was kneaded and then pressed. Further, in Comparative Example B6, the raw material powder was kneaded and extruded. In Comparative Example B7, the raw material powder was kneaded and extruded, and then pressed.
- Comparative Example B8 to Comparative Example B20 did not perform the pressing step. That is, only the long sheet forming step was performed, and the obtained long sheet was obtained as it was as a heat conductive sheet.
- Comparative Example B8, Comparative Example B13, and Comparative Example B15 use a calendar that does not include a sheet stacking unit, that is, a calendar B1 that includes only a sheet forming unit B3 including a pair of rolls B6 and B7 shown in FIG. The long sheet B20 was formed and obtained as a heat conductive sheet as it was.
- the thermal conductivity in the plane direction (PD) was measured by a pulse heating method using a xenon flash analyzer “LFA-447 type” (manufactured by NETZSCH). Further, the thermal conductivity in the thickness direction (TD) was measured by the TWA method using “ai-Phase mobile” (manufactured by Eye Phase).
- boron nitride particles (PT-110) were also observed with an electron microscope (SEM).
- SEM electron microscope
- the bending resistance (flexibility) of the thermal conductive sheets of Examples B and Comparative Examples B in the B-stage state was evaluated under the following test conditions.
- Test equipment Type I Mandrel: 10mm diameter, 5mm diameter, or 1mm diameter Then, from the diameter of the mandrel of the test apparatus that causes each thermal conductive sheet in the B-stage state to bend at a bending angle of more than 90 degrees and 180 degrees or less and cause the thermal conductive sheet to break (damage), It was evaluated as follows.
- Measuring method of porosity First, the volume and weight of the heat conductive sheet were measured, and the density was calculated. Furthermore, the density of 2.28 g / cm 3 of boron nitride particles, assuming the density of the resin and 1.2 g / cm 3, when calculating the theoretical density of the thermal conductive sheet (a 70vol%, 1.956g / cm 3 ).
- Example B and Comparative Example B are classified into prescription B1 to prescription B3, and the complex shear viscosity (complex viscosity) of the heat conductive sheet in each prescription conforms to JIS K7244-10 (2005).
- the measurement was performed by dynamic viscoelasticity measurement in a shear mode at a frequency of 10 Hz and a heating rate of 2 ° C./min.
- PT-110 trade name, plate-like boron nitride particles, average particle size (light scattering method) 45 ⁇ m, manufactured by Momentive Performance Materials
- Japan EG-200 trade name “Ogsol EG-200”, bisarylfluorene Type epoxy resin, semi-solid, epoxy equivalent 292 g / eqiv. Normal temperature semi-solid, manufactured by Osaka Gas Chemical Co., Ltd.
- EXA-1000 Trade name “Epicron EXA-4850-1000”, bisphenol A type epoxy resin, epoxy equivalent of 310 to 370 g / eqiv.
- 2P4MHZ-PW manufactured by Meiwa Kasei Co., Ltd .: Trade name “Cureazole 2P4MHZ-PW” (curing agent, imidazole compound, Shikoku Kasei Co., Ltd.) 5 mass% methyl ethyl ketone dispersion SG-P3 (15 mass% MEK solution): Trade name “Taisan” Resin SG-P3 ", epoxy-modified ethyl acrylate-butyl acrylate-acrylonitrile copolymer, solvent: methyl ethyl ketone, rubber component content 15 mass%, weight average molecular weight 850,000, epoxy equivalent 210 eqiv.
- the heat conductive sheet is used by covering electronic elements such as an IC (integrated circuit) chip, a capacitor, a coil, a resistor, and a light emitting diode.
- electronic elements such as an IC (integrated circuit) chip, a capacitor, a coil, a resistor, and a light emitting diode.
Abstract
Description
[第1実施形態]
第1実施形態の熱伝導性シートの製造方法の第1実施形態は、原料成分を調製する工程(原料調製工程)、原料成分からカレンダーによって長尺シートを形成する工程(長尺シート形成工程)、および、長尺シートをプレスする工程(プレス工程)を備えている。 The present invention will be described by exemplifying the first embodiment and the second embodiment. Hereinafter, each embodiment will be described in detail.
[First Embodiment]
1st Embodiment of the manufacturing method of the heat conductive sheet of 1st Embodiment is the process (raw material preparation process) of preparing a raw material component, and the process of forming a long sheet from a raw material component with a calendar (long sheet forming process). And a step of pressing the long sheet (pressing step).
原料成分は、窒化ホウ素粒子およびポリマーマトリクスを含有する。 <Raw material preparation process>
The raw material component contains boron nitride particles and a polymer matrix.
次いで、この方法では、上記した原料成分からカレンダーによって熱伝導性シートを形成する。 <Long sheet forming process>
Next, in this method, a heat conductive sheet is formed from the above-described raw material components by a calendar.
また、搬送方向に隣接する上流側の圧延部材4と下流側の圧延部材4とにおいて、下流側の圧延部材4のニップ部分2の間隔(ギャップ、以下同意)G’は、上流側の圧延部材4のニップ部分2の間隔Gに対して、例えば、0.99倍以下、好ましくは、0.95倍以下、さらに好ましくは、0.9倍以下であり、例えば、0.1倍以上である。 G1>G2>G3>G4> G5 (1)
Further, in the
(式中、R2/1は、G2/G1、R3/2は、G3/G2、R4/3は、G4/G3、R5/4は、G5/G4である。)
好ましくは、下記式(3)を満足する。 R 2/1 ≧ R 3/2 ≧ R 4/3 ≧ R 5/4 (2)
(In the formula, R 2/1 is G2 / G1, R 3/2 is G3 / G2, R 4/3 is G4 / G3, and R 5/4 is G5 / G4.)
Preferably, the following formula (3) is satisfied.
(式中、R2/1、R3/2、R4/3およびR5/4は、上記と同義である。)
具体的には、第1圧延部材7のニップ部分2の間隔G1は、例えば、0.2mm以上、好ましくは、0.3mm以上、また、例えば、5mm以下、好ましくは、3mm以下である。また、第2圧延部材8のニップ部分2の間隔G2は、例えば、0.1mm以上、また、例えば、4mm以下、好ましくは、3mm以下である。また、第3圧延部材9のニップ部分2の間隔G3は、例えば、0.1mm以上、また、例えば、例えば、3mm以下、好ましくは、2mm以下である。また、第4圧延部材10のニップ部分2の間隔G4は、例えば、0.1mm以上、また、例えば、2mm以下、好ましくは、1mm以下である。また、第5圧延部材11のニップ部分2の間隔G5は、例えば、0.1mm以上、また、例えば、1mm以下、好ましくは、0.8mm以下である。 R 2/1 > R 3/2 > R 4/3 > R 5/4 (3)
(In the formula, R 2/1 , R 3/2 , R 4/3 and R 5/4 are as defined above.)
Specifically, the gap G1 of the
プレス工程を、長尺シート形成工程後に実施する。 <Pressing process>
The pressing process is performed after the long sheet forming process.
試験装置:タイプI
マンドレル:直径1mm、5mm、10mm
屈曲角度:90度~180度
熱伝導性シート100の厚み:0.1~2mm(具体的には、0.2mm)
タイプIの試験装置の斜視図を図4および図5に示し、以下に、タイプIの試験装置を説明する。 Test conditions Test equipment: Type I
Mandrel: 1mm diameter, 5mm, 10mm
Bending angle: 90 ° to 180 ° The thickness of the heat conductive sheet 100: 0.1 to 2 mm (specifically, 0.2 mm)
A perspective view of the type I test apparatus is shown in FIGS. 4 and 5, and the type I test apparatus will be described below.
[第2実施形態]
第2実施形態の熱伝導性シートの製造方法は、原料成分を調製する工程(原料調製工程)、原料成分をカレンダーで圧延することにより長尺シートを形成する工程(長尺シート形成工程)、および、長尺シートをプレスする工程(プレス工程)を備えている。 In FIG. 19, the pair of
[Second Embodiment]
The manufacturing method of the heat conductive sheet of 2nd Embodiment is the process of preparing a raw material component (raw material preparation process), the process of forming a long sheet by rolling a raw material component with a calendar (long sheet forming process), And the process (press process) of pressing a long sheet is provided.
第2実施形態の原料調製工程は、第1実施形態の原料調製工程と同様である。 <Raw material preparation process>
The raw material preparation process of the second embodiment is the same as the raw material preparation process of the first embodiment.
次いで、この方法では、上記した原料成分を、カレンダーで圧延することにより熱伝導性シートを形成する。 <Long sheet forming process>
Next, in this method, the above-described raw material components are rolled with a calender to form a heat conductive sheet.
第2実施形態のプレス工程は、第1実施形態のプレス工程と同様である。 <Pressing process>
The pressing process of the second embodiment is the same as the pressing process of the first embodiment.
[第1実施形態に対応する実施例1~実施例8および比較例1~比較例15]
実施例1
[原料成分調製工程]
各成分を、表1に記載に処方に基づいて配合して、攪拌した後、25℃の真空乾燥により、メチルエチルケトン(溶媒)を留去することにより、原料成分を原料粉体として調製した(混合・真空乾燥法)。 Hereinafter, the present invention will be specifically described with reference to examples corresponding to the respective embodiments.
[Examples 1 to 8 and Comparative Examples 1 to 15 corresponding to the first embodiment]
Example 1
[Raw material component preparation process]
After mixing and stirring each component based on the formulation described in Table 1, the raw material component was prepared as a raw powder by distilling off methyl ethyl ketone (solvent) by vacuum drying at 25 ° C. (mixing)・ Vacuum drying method).
その後、図19に示すように、1対のロールからなる単数の圧延部材を備えるカレンダーを用意した。 [Long sheet forming step] (Calendar molding: rolled member, see FIG. 19)
Then, as shown in FIG. 19, the calendar provided with the single rolling member which consists of a pair of roll was prepared.
長尺シートを、10cm角の矩形状に切り取って、成形した。その後、2枚の離型シートを剥離した。その後、シートを別の離型シート(商品名「パナピールSG-2」、PET製、PANAC社製))の上(上面、具体的には、処理面)に配置し、さらに、上記した離型シート(パナピールSG-2)の上において、シートの周囲に、枠状の真鍮製の200μmのスペーサーを配置し、それらの上に被せるように、離型シート(商品名「パナピールSG-2」、PET製、PANAC社製))を処理面が、シートおよびスペーサーに対向するように配置した。つまり、2枚の離型シートによってシートを挟み込んだ。これにより、離型シート、シートおよび離型シートからなる積層体を用意した。 [Pressing process]
The long sheet was cut into a 10 cm square rectangle and molded. Thereafter, the two release sheets were peeled off. Thereafter, the sheet is placed on the upper surface (specifically, the treated surface) on another release sheet (trade name “Panapeel SG-2”, manufactured by PET, manufactured by PANAC), and further, the above-described mold release On the sheet (Panapeel SG-2), a frame-shaped brass 200 μm spacer is arranged around the sheet, and a release sheet (trade name “Panapeel SG-2”, PET and PANAC)) were placed so that the treated surface was opposite the sheet and spacer. That is, the sheet was sandwiched between two release sheets. Thereby, the laminated body which consists of a release sheet, a sheet | seat, and a release sheet was prepared.
表1~表6に記載の処方および条件に基づいて、実施例1と同様に処理して、実施例2~8および比較例1~15の熱伝導性シートを得た。 Examples 2 to 8 and Comparative Examples 1 to 15
Based on the formulations and conditions described in Tables 1 to 6, the same treatment as in Example 1 was performed to obtain thermally conductive sheets of Examples 2 to 8 and Comparative Examples 1 to 15.
(1) 熱伝導率
各実施例および各比較例により得られた熱伝導性シートについて、熱伝導率を測定した。 (Evaluation)
(1) Thermal conductivity The thermal conductivity was measured about the heat conductive sheet obtained by each Example and each comparative example.
(2) 電子顕微鏡による断面観察
実施例1および6の熱伝導性シートを、クロスセクションポリッシャーによって厚み方向に沿って切断し、その切断面を、電子顕微鏡(SEM)によって観察した。その画像処理図を、図21および図22に示す。 The results are shown in Tables 1 to 6.
(2) Cross-sectional observation by electron microscope The heat conductive sheets of Examples 1 and 6 were cut along the thickness direction by a cross section polisher, and the cut surface was observed by an electron microscope (SEM). The image processing diagrams are shown in FIG. 21 and FIG.
(3) 耐屈曲性(柔軟性)
各実施例および各比較例の熱伝導性シートについて、JIS K 5600-5-1耐屈曲性(円筒形マンドレル法)に準拠する耐屈曲性試験を実施した。 As a result, the boron nitride particles in the heat conductive sheet of Example 1 shown in FIG. 21 and the heat conductive sheet of Example 6 shown in FIG. 22 are effectively prevented from being crushed compared to the boron nitride particles shown in FIG. You can see that.
(3) Flexibility (flexibility)
A bending resistance test based on JIS K 5600-5-1 bending resistance (cylindrical mandrel method) was performed on the heat conductive sheets of each example and each comparative example.
試験装置:タイプI
マンドレル:直径10mm、直径5mm、または、直径1mm
そして、Bステージ状態の各熱伝導性シートを、90度を超過し、180度以下の屈曲角度で屈曲させ、熱伝導性シートに破断(損傷)を生ずる試験装置のマンドレルの直径から、以下のように評価した。 Test conditions Test equipment: Type I
Mandrel: 10mm diameter, 5mm diameter, or 1mm diameter
Then, from the diameter of the mandrel of the test apparatus that causes each thermal conductive sheet in the B-stage state to bend at a bending angle of more than 90 degrees and 180 degrees or less and cause the thermal conductive sheet to break (damage), It was evaluated as follows.
(4) 空隙率(P)
各実施例および各比較例のBステージ状態の熱伝導性シートの空隙率(P)を下記の測定方法により測定した。 X: Breaking occurred when bent with a mandrel having a diameter of 10 mm.
(4) Porosity (P)
The porosity (P) of the thermally conductive sheet in the B stage state of each example and each comparative example was measured by the following measurement method.
(5)複素剪断粘度(複素粘性率:η*)
実施例および比較例における処方を、処方1~処方3に分類し、各処方における熱伝導性シートの複素剪断粘度(複素粘性率)を、JIS K7244-10(2005年)に準拠し、周波数10Hz、昇温速度2℃/分の剪断モードの動的粘弾性測定によって、測定した。 The results are shown in Tables 1 to 6.
(5) Complex shear viscosity (complex viscosity: η *)
Formulations in Examples and Comparative Examples are classified into
表の窒化ホウ素粒子の欄において、上段の数値は、窒化ホウ素粒子の配合質量(g)であり、下段の括弧内の数値は、熱伝導性シートに対する窒化ホウ素粒子の体積百分率(体積%)である。
[第2実施形態に対応する実施例1~実施例8および比較例1~比較例15]
実施例B1
[原料成分調製工程]
各成分を、表B1に記載に処方に基づいて配合して、攪拌した後、25℃の真空乾燥により、メチルエチルケトン(溶媒)を留去することにより、原料成分を原料粉体として調製した(混合・真空乾燥法)。 <Prescriptions, molding conditions and physical properties of heat conductive sheet in each example and each comparative example>
In the column of boron nitride particles in the table, the upper numerical value is the compounding mass (g) of the boron nitride particles, and the numerical value in parentheses at the lower is the volume percentage (volume%) of the boron nitride particles with respect to the thermal conductive sheet. is there.
[Examples 1 to 8 and Comparative Examples 1 to 15 corresponding to the second embodiment]
Example B1
[Raw material component preparation process]
After mixing and stirring each component based on the formulation described in Table B1, methyl ethyl ketone (solvent) was distilled off by vacuum drying at 25 ° C. to prepare a raw material component as a raw powder (mixing)・ Vacuum drying method).
その後、図B2に示すように、2対のロールからなるシート形成部、および、1対のロールからなるシート積層部を備えるカレンダーを用意した。 [Long sheet forming step] (Calendar molding: one-stage sheet forming section and two-stage sheet stacking section, see FIG. B2)
Thereafter, as shown in FIG. B2, a calendar including a sheet forming unit composed of two pairs of rolls and a sheet lamination unit composed of a pair of rolls was prepared.
長尺シートを、10cm角の矩形状に切り取って、成形した。その後、2枚の離型シートを剥離した。その後、シートを別の離型シート(ポリエステルフィルム(商品名「パナピールSG-2」、PANAC社製))の上(上面、具体的には、処理面)に配置し、さらに、上記した離型シート(パナピールSG-2)の上において、シートの周囲に、枠状の真鍮製の200μmのスペーサーを配置し、それらの上に被せるように、離型シート(ポリエステルフィルム(商品名「パナピールSG-2」、PANAC社製))を処理面が、シートに対向するように配置した。つまり、2枚の離型シートによってシートを挟み込んだ。これにより、離型シート、シートおよび離型シートからなる積層体を用意した。 [Pressing process]
The long sheet was cut into a 10 cm square rectangle and molded. Thereafter, the two release sheets were peeled off. Thereafter, the sheet is placed on another release sheet (polyester film (trade name “Panapeel SG-2”, manufactured by PANAC)) (upper surface, specifically, treated surface), and the above-described release On the sheet (Panapeel SG-2), a frame-shaped brass 200 μm spacer is arranged around the sheet, and a release sheet (polyester film (trade name “Panapeel SG- 2 ”(manufactured by PANAC)) was disposed so that the treated surface was opposed to the sheet. That is, the sheet was sandwiched between two release sheets. Thereby, the laminated body which consists of a release sheet, a sheet | seat, and a release sheet was prepared.
表B1~表B6に記載の処方および条件に基づいて、実施例B1と同様に処理して、熱伝導性シートを得た。 Example B2 to Example B10 and Comparative Example B1 to Comparative Example B20
Based on the formulation and conditions described in Tables B1 ~ Table B6, was treated in the same manner as in Example B1, to obtain a thermally conductive sheet.
(1) 熱伝導率
各実施例Bおよび各比較例Bにより得られた熱伝導性シートについて、熱伝導率を測定した。 (Evaluation)
(1) Thermal conductivity About the heat conductive sheet obtained by each Example B and each comparative example B, the heat conductivity was measured.
(2) 電子顕微鏡による断面観察
実施例B10の熱伝導性シートを、クロスセクションポリッシャーによって厚み方向に沿って切断し、その切断面を、電子顕微鏡(SEM)によって観察した。その画像処理図を、図B3に示す。 The results are shown in Table B1.
(2) Cross-sectional observation with an electron microscope The heat conductive sheet of Example B10 was cut | disconnected along the thickness direction with the cross section polisher, and the cut surface was observed with the electron microscope (SEM). The image processing diagram is shown in FIG. B3.
(3) 耐屈曲性(柔軟性)
各実施例Bおよび各比較例Bの熱伝導性シートについて、JIS K 5600-5-1耐屈曲性(円筒形マンドレル法)に準拠する耐屈曲性試験を実施した。 As a result, it can be seen that the boron nitride particles in the thermal conductive sheet of Example B10 shown in FIG. B3 are effectively prevented from being crushed compared to the boron nitride particles shown in FIG. B4.
(3) Flexibility (flexibility)
The heat conductive sheet of each Example B and each Comparative Example B was subjected to a bending resistance test based on JIS K 5600-5-1 bending resistance (cylindrical mandrel method).
試験装置:タイプI
マンドレル:直径10mm、直径5mm、または、直径1mm
そして、Bステージ状態の各熱伝導性シートを、90度を超過し、180度以下の屈曲角度で屈曲させ、熱伝導性シートに破断(損傷)を生ずる試験装置のマンドレルの直径から、以下のように評価した。 Test conditions Test equipment: Type I
Mandrel: 10mm diameter, 5mm diameter, or 1mm diameter
Then, from the diameter of the mandrel of the test apparatus that causes each thermal conductive sheet in the B-stage state to bend at a bending angle of more than 90 degrees and 180 degrees or less and cause the thermal conductive sheet to break (damage), It was evaluated as follows.
(4) 空隙率(P)
各実施例Bおよび各比較例BのBステージ状態の熱伝導性シートの空隙率(P)を下記の測定方法により測定した。 X: Breaking occurred when bent with a mandrel having a diameter of 10 mm.
(4) Porosity (P)
Thermally conductive porosity sheet of B-stage of Examples B and Comparative Examples B and (P) were measured by the following measurement method.
(5)複素剪断粘度(複素粘性率:η*)
実施例Bおよび比較例Bにおける処方を、処方B1~処方B3に分類し、各処方における熱伝導性シートの複素剪断粘度(複素粘性率)を、JIS K7244-10(2005年)に準拠し、周波数10Hz、昇温速度2℃/分の剪断モードの動的粘弾性測定によって、測定した。 The results are shown in Tables B1 to B6.
(5) Complex shear viscosity (complex viscosity: η *)
The prescriptions in Example B and Comparative Example B are classified into prescription B1 to prescription B3, and the complex shear viscosity (complex viscosity) of the heat conductive sheet in each prescription conforms to JIS K7244-10 (2005). The measurement was performed by dynamic viscoelasticity measurement in a shear mode at a frequency of 10 Hz and a heating rate of 2 ° C./min.
表の窒化ホウ素粒子の欄において、上段の数値は、窒化ホウ素粒子の配合質量(g)であり、下段の括弧内の数値は、熱伝導性シートに対する窒化ホウ素粒子の体積百分率(体積%)である。 <Prescription in each Example B and each Comparative Example B, molding conditions, physical properties of heat conductive sheet>
In the column of boron nitride particles in the table, the upper numerical value is the compounding mass (g) of the boron nitride particles, and the numerical value in parentheses at the lower is the volume percentage (volume%) of the boron nitride particles with respect to the thermal conductive sheet. is there.
EG-200:商品名「オグソールEG-200」、ビスアリールフルオレン型エポキシ樹脂、半固形状、エポキシ当量292g/eqiv.、常温半固形状、大阪ガスケミカル社製
EXA-1000:商品名「エピクロンEXA-4850-1000」、ビスフェノールA型エポキシ樹脂、エポキシ当量310~370g/eqiv.、常温液体状、粘度(25℃)100,000mPa・s、DIC社製
HP-7200:商品名「エピクロンHP-7200」、ジシクロペンタジエン型エポキシ樹脂、エポキシ当量254~264g/eqiv.、常温固形状、軟化点56~66℃、DIC社製
MEH-7800-SS:商品名、フェノール・アラルキル樹脂、硬化剤、水酸基当量173~177g/eqiv.、明和化成社製
2P4MHZ-PW:商品名「キュアゾール2P4MHZ-PW」(硬化剤、イミダゾール化合物、四国化成社製)の5質量%メチルエチルケトン分散液
SG-P3(15mass% MEK溶液):商品名「テイサンレジン SG-P3」、エポキシ変性したアクリル酸エチル-アクリル酸ブチル-アクリロニトリル共重合体、溶媒:メチルエチルケトン、ゴム成分の含有割合15質量%、重量平均分子量850,000、エポキシ当量210eqiv./g、理論ガラス転移温度12℃、ナガセケムテックス社製
2MAOK-PW:2,4-ジアミノ-6-[2’-メチルイミダゾリル-(1’)]-エチル-s-トリアジンイソシアヌル酸付加物、硬化促進剤、四国化成社製
TP03:商品名「パナピールTP-03」、PET製離型シート、厚み188μm、PANAC社製
MRF38:商品名「ダイヤホイルMRF38」、PET製離型シート、厚み38μm、三菱化学ポリエステル製社製 PT-110: trade name, plate-like boron nitride particles, average particle size (light scattering method) 45 μm, manufactured by Momentive Performance Materials Japan EG-200: trade name “Ogsol EG-200”, bisarylfluorene Type epoxy resin, semi-solid, epoxy equivalent 292 g / eqiv. Normal temperature semi-solid, manufactured by Osaka Gas Chemical Co., Ltd. EXA-1000: Trade name “Epicron EXA-4850-1000”, bisphenol A type epoxy resin, epoxy equivalent of 310 to 370 g / eqiv. , Liquid at normal temperature, viscosity (25 ° C.) 100,000 mPa · s, manufactured by DIC, HP-7200: trade name “Epicron HP-7200”, dicyclopentadiene type epoxy resin, epoxy equivalent of 254 to 264 g / eqiv. Solid state, softening point 56-66 ° C., DIC Corporation MEH-7800-SS: trade name, phenol aralkyl resin, curing agent, hydroxyl group equivalent 173-177 g / eqiv. 2P4MHZ-PW manufactured by Meiwa Kasei Co., Ltd .: Trade name “Cureazole 2P4MHZ-PW” (curing agent, imidazole compound, Shikoku Kasei Co., Ltd.) 5 mass% methyl ethyl ketone dispersion SG-P3 (15 mass% MEK solution): Trade name “Taisan” Resin SG-P3 ", epoxy-modified ethyl acrylate-butyl acrylate-acrylonitrile copolymer, solvent: methyl ethyl ketone, rubber component content 15 mass%, weight average molecular weight 850,000, epoxy equivalent 210 eqiv. / G, theoretical glass transition temperature 12 ° C., 2MAOK-PW manufactured by Nagase ChemteX: 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine isocyanuric acid adduct, Curing accelerator, Shikoku Kasei Co., Ltd. TP03: Trade name “Panapeel TP-03”, PET release sheet, thickness 188 μm, PANAC MRF38: Trade name “Diafoil MRF38”, PET release sheet, thickness 38 μm, Made by Mitsubishi Chemical Polyester
Claims (10)
- 板状の窒化ホウ素粒子およびポリマーマトリクスを含有する原料成分を調製する工程、
前記原料成分からカレンダーによって長尺シートを形成する工程、および、
前記長尺シートをプレスする工程
を備える
ことを特徴とする、熱伝導性シートの製造方法。 A step of preparing a raw material component containing plate-like boron nitride particles and a polymer matrix;
Forming a long sheet by a calendar from the raw material components, and
The manufacturing method of the heat conductive sheet characterized by including the process of pressing the said elongate sheet. - 前記カレンダーは、複数のニップ部分が形成されるように配置される複数のロールを備え、
前記長尺シートの搬送方向に互いに隣接する上流側のニップ部分と下流側のニップ部分とにおいて、前記下流側のニップ部分の間隔が、前記上流側のニップ部分の間隔より小さいことを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The calender includes a plurality of rolls arranged to form a plurality of nip portions,
In the upstream nip portion and the downstream nip portion adjacent to each other in the conveyance direction of the long sheet, the interval between the downstream nip portions is smaller than the interval between the upstream nip portions. The manufacturing method of the heat conductive sheet of Claim 1. - 前記上流側のニップ部分と前記下流側のニップ部分との2つのニップ部分において、前記下流側のニップ部分の隙間が、前記上流側のニップ部分の間隔に対して、0.9倍以下であることを特徴とする、請求項2に記載の熱伝導性シートの製造方法。 In the two nip portions of the upstream nip portion and the downstream nip portion, the gap between the downstream nip portions is 0.9 times or less than the interval between the upstream nip portions. The manufacturing method of the heat conductive sheet of Claim 2 characterized by the above-mentioned.
- 前記カレンダーには、ニップ部分が、少なくとも3つ設けられていることを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The method for producing a thermally conductive sheet according to claim 1, wherein the calender is provided with at least three nip portions.
- 前記カレンダーは、互いに対向配置される1対のロールを前記搬送方向に沿って複数備えていることを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The method for producing a thermally conductive sheet according to claim 1, wherein the calendar includes a plurality of pairs of rolls arranged to face each other along the conveying direction.
- 前記熱伝導性シートの空隙率が、3.0体積%以下であることを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The method for producing a thermally conductive sheet according to claim 1, wherein the porosity of the thermally conductive sheet is 3.0% by volume or less.
- 前記熱伝導性シートは、JIS K7244-10(2005年)に準拠し、周波数10Hz、昇温速度2℃/分の動的粘弾性測定により得られる温度20~150℃のいずれかにおける複素剪断粘度η*が、300Pa・s以上、10000Pa・s以下であることを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The heat conductive sheet is based on JIS K7244-10 (2005), and has a complex shear viscosity at a temperature of 20 to 150 ° C. obtained by dynamic viscoelasticity measurement at a frequency of 10 Hz and a heating rate of 2 ° C./min. The method for producing a thermally conductive sheet according to claim 1, wherein η * is 300 Pa · s or more and 10,000 Pa · s or less.
- 前記窒化ホウ素粒子の動的光散乱法にて測定される平均粒子径が、20μm以上であり、
前記熱伝導性シートにおける前記窒化ホウ素粒子の体積割合が、60体積%以上であることを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The average particle diameter measured by the dynamic light scattering method of the boron nitride particles is 20 μm or more,
The method for producing a thermally conductive sheet according to claim 1, wherein a volume ratio of the boron nitride particles in the thermally conductive sheet is 60% by volume or more. - 前記熱伝導性シートの厚み方向に対する直交方向の熱伝導率が、6W/m・K以上であることを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The method for producing a thermally conductive sheet according to claim 1, wherein the thermal conductivity in the direction perpendicular to the thickness direction of the thermally conductive sheet is 6 W / m · K or more.
- 前記長尺シートを形成する工程は、
前記原料成分を1対のロールで圧延することによって、前記長尺シートを形成する工程、および、
前記長尺シートを厚み方向に複数積層し、1対のロールによって圧延する工程
を備えることを特徴とする、請求項1に記載の熱伝導性シートの製造方法。 The step of forming the long sheet includes
Rolling the raw material components with a pair of rolls to form the long sheet, and
The method for producing a thermally conductive sheet according to claim 1, comprising a step of laminating a plurality of the long sheets in the thickness direction and rolling with a pair of rolls.
Priority Applications (3)
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KR20147020109A KR20140127808A (en) | 2012-02-08 | 2013-02-07 | Method for producing thermal conductive sheet |
US14/375,865 US20140367883A1 (en) | 2012-02-08 | 2013-02-07 | Producing method of thermally conductive sheet |
CN201380008693.2A CN104125976A (en) | 2012-02-08 | 2013-02-07 | Method for producing thermal conductive sheet |
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JP2013012654A JP2013176981A (en) | 2012-02-08 | 2013-01-25 | Method of producing thermal conductive sheet |
JP2013-012655 | 2013-01-25 | ||
JP2013012655A JP2013177565A (en) | 2012-02-08 | 2013-01-25 | Method of manufacturing heat conductive sheet |
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JPWO2017006889A1 (en) * | 2015-07-06 | 2018-04-19 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, and printed wiring board |
EP3315573A4 (en) * | 2015-06-29 | 2019-01-30 | Tatsuta Electric Wire & Cable Co., Ltd. | Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same |
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JP2020158623A (en) * | 2019-03-26 | 2020-10-01 | 大阪ガスケミカル株式会社 | Epoxy-based curable composition, cured product and method for producing the same |
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