WO2013112270A1

WO2013112270A1 - Member peeling method, member peeling apparatus, and semiconductor chip manufacturing method

Info

Publication number: WO2013112270A1
Application number: PCT/US2013/020278
Authority: WO
Inventors: Kazuta Saito
Original assignee: 3M Innovative Properties Company
Priority date: 2012-01-23
Filing date: 2013-01-04
Publication date: 2013-08-01
Also published as: TW201335985A; JP2013149919A

Abstract

[Problem] To make it possible to quickly and safely separate first and second members from one another, which have been joined to one another via an adhesive layer, with a simpler technique. [Resolution Means] An adhesive force of a second adhesive layer 22 of a film 24 with respect to a first member 12 is greater than an adhesive force between the first member 12 and a second member 14 resulting from a first adhesive layer 10. The film 24 is secured along a curved backing surface 18 with an adhesive surface 22a of the second adhesive layer 22 in an exposed state. The first member 12, which is joined to the second member 14 via the first adhesive layer 10, is gradually separated from the second member 14 by gradually fixing the first member 12 to the adhesive surface 22a of the second adhesive layer 22 of the film 24 secured to the curved backing surface 18 and gradually bending the first member 12 along the curved backing surface 18 without bending the second member 14.

Description

MEMBER PEELING METHOD, MEMBER PEELING APPARATUS, AND SEMICONDUCTOR

CHIP MANUFACTURING METHOD BACKGROUND

Technical Field

[0001]

The present invention relates to a member peeling method and a member peeling apparatus for peeling first and second members from one another, which have been joined to one another via an adhesive layer. The present invention also relates to a semiconductor chip manufacturing method using the member peeling method.

Related Art

[0002]

Techniques for peeling from one another first and second members, which have been joined to one another via an adhesive layer, are implemented in a variety of fields. In a known manufacturing method for semiconductor chips, for example, a circuit is first formed on a surface of a wafer of a prescribed thickness, and then, in a state with a backing such as a protective film, glass sheet, or the like adhered to a circuit formation surface (hereafter called the "circuit face"), a thickness of the wafer is uniformly reduced by grinding a back surface on an opposite side of the circuit face. The wafer, which has been thinned by grinding the back surface, is typically peeled from the backing before being sent to post-processing such as dicing or the like.

[0003]

For example, in Japanese Unexamined Patent Application Publication No. 2004-064040 (paragraphs 0006 and 0009), a laminate which can be peeled from a backing without damaging a substrate which has been ground to ultrathin dimensions and a manufacturing method for an ultrathin substrate using this laminate are described. The configuration of the laminate is described as a configuration "including a substrate to be ground, a junction layer making contact with the substrate to be ground, a photothermal conversion layer containing a light-absorbing agent and a pyrolytic resin, and a light-transmissive backing, wherein the photothermal conversion layer is formed by grinding the surface of the substrate to be ground on an opposite side from the junction layer, breaking the photothermal conversion layer down by irradiation with radiant energy, and then separating the ground substrate from the light-transmissive backing." The manufacturing method for the ultrathin substrate is described as a method "including a step of preparing the laminate, a step of grinding the substrate to be ground to a desired thickness, a step of irradiating the photothermal conversion layer with radiant energy via the light- transmissive backing, breaking down the photothermal conversion layer, and separating the ground substrate from the light-transmissive backing, and a step of peeling the junction layer from the ground substrate."

[Related Art Documents]

[Patent Documents]

[0004]

Patent Document 1 : Japanese Unexamined Patent Application Publication No. 2004-064040 (paragraphs 0006 and 0009).

[Summary of the Invention]

[Problems to be Solved by the Invention]

[0005]

When peeling from one another first and second members, which have been joined to one another via an adhesive layer, as in the process for peeling the wafer from the backing after the back surface is ground, there is demand for the capability to peel the wafer quickly and safely using a simpler technique.

SUMMARY

[0006]

A first aspect of the present invention is a member peeling method for peeling a first member and a second member from one another, which have been joined to one another via a first adhesive layer, the method including: a step of preparing a curved backing surface; a step of preparing a film having a second adhesive layer, wherein an adhesive force between the first member and the second adhesive layer is greater than an adhesive force between the first member and the second member resulting from the first adhesive layer; a step of securing the film along the curved backing surface with a surface of the second adhesive layer in an exposed state; and a step of gradually peeling the first member from the second member by fixing an exposed surface of the first member, which is joined to the second member via the first adhesive layer, to the surface of the second adhesive layer of the film, which is secured to the curved backing surface, and gradually bending the first member along the curved backing surface.

[0007]

A second aspect of the present invention is a member peeling apparatus for implementing the member peeling method described above, the member peeling apparatus being provided with a rotatable, cylindrical backup roll having a curved backing surface, a film supplying part for continuously supplying a film to the curved backing surface in synchronization with the rotation of the backup roll, a securing mechanism for securing the film along the curved backing surface, and a laminate feeding mechanism for feeding a laminate having the first member and the second member, which have been joined to one another via the first adhesive layer, the laminate feeding mechanism feeding the laminate in a tangential plane direction at a speed corresponding to a speed of the curved backing surface in that tangential plane direction, while pressing the first member into the surface of the second adhesive layer of the film secured to the curved backing surface.

[0008]

A third aspect of the present invention is a manufacturing method for a semiconductor chip including a step of peeling the first member including a wafer from the second member including a backing that is joined to a circuit formation surface of the wafer via the first adhesive layer.

[Effect of the Invention]

[0009]

With the member peeling method of the first aspect of the present invention, by simply fixing the exposed surface of the first member to the surface of the second adhesive layer of the film secured to the curved backing surface, it is possible to gradually peel the first member from the second member.

Moreover, by fixing the entire first member to the second adhesive layer, it is possible to continue this gradual process and peel the entire first member from the second member. Accordingly, processing for melting down the first adhesive layer or reducing the adhesive force becomes unnecessary, and it is possible to peel the first and second members from one another quickly and safely with a simpler technique.

[0010]

With the member peeling apparatus of the second aspect of the present invention, the member peeling method described above can be executed continuously for a plurality of laminates. Therefore, it is possible to peel the respective first and second members of a plurality of laminates from one another quickly and safely with a simpler technique.

[0011]

With the manufacturing method for a semiconductor chip according to the third aspect of the present invention, it is possible to peel the wafer from the backing quickly and safely with a simpler technique without melting down the first adhesive layer or reducing the adhesive force.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012]

FIG. 1 is a side view schematically illustrating a step of the member peeling method according to an embodiment of the present invention.

FIG. 2 is a plan view schematically illustrating the step of FIG. 1.

FIG. 3 is a drawing schematically illustrating another step of the member peeling method of FIG.

1. FIG. 4 is a drawing schematically illustrating another step of the member peeling method of FIG.

1.

FIGS. 5A to 5E are drawings schematically illustrating another step of the member peeling method of FIG. 1 over time.

FIG. 6 is a drawing schematically illustrating another step of the member peeling method of FIG.

1.

FIG. 7 is a drawing schematically illustrating another step of the member peeling method of FIG.

1.

FIG. 8 is a perspective view schematically illustrating another step of the member peeling method of FIG. 1.

FIG. 9 is a drawing schematically illustrating another step of the member peeling method of FIG.

1.

FIGS. 10A to 10D are drawings schematically illustrating another step of the member peeling method of FIG. 1 over time.

FIG. 11 is a drawing schematically illustrating another step of the member peeling method of

FIG. 1.

FIG. 12 is a drawing schematically illustrating a member peeling apparatus according to an embodiment of the present invention and a semiconductor chip manufacturing method according to an embodiment of the present invention.

FIG. 13 is a perspective view schematically illustrating a component of the member peeling apparatus of FIG. 12.

FIG. 14 is a drawing schematically illustrating the configuration of the main parts of the member peeling apparatus of FIG. 12.

DETAILED DESCRIPTION

[0013]

Embodiments of the present invention are described below in detail while referring to the attached drawings. Common reference symbols are assigned to corresponding components across all of the drawings.

FIGS. 1 through 7 illustrate the main steps of a member peeling method according to an embodiment of the present invention. The illustrated member peeling method is for peeling from one another a first member 12 and a second member 14, which are joined to one another via a first adhesive layer 10, and it can be applied, for example, to a process for peeling a wafer from a backing after the back surface is ground in a manufacturing method for a semiconductor chip. However, the applications of this member peeling method are not limited to this example. [0014]

In the member peeling method of the illustrated embodiment, a laminate 16 having the first and second members 12 and 14, which are joined to one another via the first adhesive layer 10, is given as an object of the peeling operation. First, the configuration of the laminate 16 used as the object of peeling will be described with reference to FIG. 1.

[0015]

The first member 12 is a tabular element having a flat front surface 12a and a back surface 12b extending roughly parallel to one another and a peripheral surface 12c extending between the front surface 12a and the back surface 12b. The first member 12 has a flexibility which enables the member to maintain a tabular form against the processing force of grinding, polishing, or the like performed on the back surface 12b, for example, in the state in which it is joined to the front surface 14a of the second member 14 via the first adhesive layer 10, while also enabling the member to be bent relatively easily by an external force in an isolated state having been peeled from the second member 14. The first member 12 may be a wafer or a substrate made of silicon, gallium arsenide, crystal, glass, or the like, for example.

[0016]

The second member 14 is a tabular element having a flat front surface 14a and a back surface 14b extending roughly parallel to one another and an annular peripheral surface 14c extending between the front surface 14a and the back surface 14b. The second member 14 has a rigidity enabling the member to support the first member 12 stably on the front surface 14a without being deformed itself while also maintaining a tabular form against an external force such as a bending force transmitted from the first member 12 via the first adhesive layer 10. The second member 14 may be a substrate having high flexural rigidity, such as glass, a ceramic such as aluminum oxide or the like, or a plastic such as Bakelite or the like.

[0017]

If the first member 12 has a discoid shape, a diameter of the first member 12 may be approximately 70 mm or more and approximately 500 mm or less, for example. Furthermore, a thickness of the first member 12 may be approximately 0.01 mm or more and approximately 0.2 mm or less or may be approximately 0.02 mm or more and approximately 0.1 mm or less, for example. Even if the first member 12 is a wafer or substrate as described above, having a relatively thin thickness will allow the member to be bent at a prescribed curvature radius by an arbitrary external force without sustaining damage. If the second member 14 has a discoid shape, a diameter of the second member 14 may be approximately the same as the diameter of the first member 12. Furthermore, the thickness of the second member 14 is not particularly limited, and for example, may be changed according to a material used in the second member 14, becoming thinner as the flexural rigidity of the material becomes higher, and becoming thicker as the flexural rigidity of the material becomes lower. Generally, the thickness of the second member 14 may be approximately 0.5 mm or more and approximately 5 mm or less, or may be approximately 1 mm or more and approximately 2 mm or less.

[0018]

When the illustrated member peeling method is implemented in a process for peeling a wafer from a backing after the back surface is ground in a manufacturing method for a semiconductor chip, the first member 12 is a wafer with the back surface ground, which serves as a base material for the semiconductor chip. The front surface 12a is a circuit surface on which a required circuit pattern is formed, and the back surface 12b is the surface after grinding (that is, the ground surface). A thickness of the wafer before the back surface is ground is from approximately 0.5 to approximately 1 mm, for example, and is standardized along with the diameter. Furthermore, the thickness of the wafer (or semiconductor chip) after grinding of a back surface where the illustrated member peeling method can be applied, is from approximately 10 to approximately 200 μηι, for example. On the other hand, the second member 14 is a backing which covers the circuit surface of the wafer and stably supports the wafer during the back surface grinding process, and at least the front surface 14a is a smooth surface capable of improving a degree of parallelism of the ground surface with respect to the circuit surface of the wafer.

[0019]

The first member 12 may have a typical discoid shape as a wafer, but may also have a rectangular discoid shape, for example. The second member 14 may have a discoid or rectangular discoid shape similar to that of the first member 12. The materials, shapes, dimensions, and the like of the first and second members 12 and 14 are not particularly limited with the exception that the first member 12 must be relatively easily bendable on its own and that the second member 14 must be able to effectively maintain the tabular form against an external force such as a bending force transmitted from the first member 12. Moreover, if a radiation-curing adhesive such as an ultraviolet-curing adhesive or the like is used as the first adhesive layer 10, the second member 14 should preferably have sufficient transmittance. Transmittance herein refers to transmittance in a specific range of the electromagnetic spectrum applicable to curing adhesives, such as the spectrum of the ultraviolet range, for example.

[0020]

The first adhesive layer 10 is able to exhibit an adhesive force which keeps the front surface 12a of the first member 12 firmly secured to the front surface 14a of the second member 14 by curing or hardening. The first adhesive layer 10 may consist of a thermoplastic resin containing a curing adhesive, a solvent-based adhesive, or a hotmelt adhesive, or may consist of a water dispersion adhesive or the like. Here, a curing adhesive is a liquid adhesive that is cured by energy rays such as heat or ultraviolet rays and the like, a solvent-based adhesive is a liquid adhesive that hardens as a solvent is evaporated, and a hotmelt adhesive is an adhesive that melts due to heating and is hardened due to cooling. Moreover, a water dispersion adhesive is an adhesive in which the adhesive ingredient is dispersed in water, wherein the adhesive hardens as the water evaporates. The curing adhesives are not particularly limited, and examples include one-component curing adhesives using an epoxy, urethane, or acrylic as a base, two- component mixed reaction adhesives using an epoxy, urethane, or acrylic as a base, and ultraviolet-curing and electron beam-curing adhesives using an acrylic or epoxy as a base. Solvent-based adhesives are not particularly limited, and an example is a rubber adhesive prepared by dissolving a rubber, elastomer, or the like in a solvent.

[0021]

The first adhesive layer 10 is formed at a roughly uniform thickness throughout an entire space between the front surface 12a of the first member 12 and the front surface 14a of the second member 14, and is preferably in close contact with an entirety of the front surfaces 12a and 14a after air bubbles have been removed. The thickness of the first adhesive layer 10 may be approximately 0.001 mm or more and approximately 0.2 mm or less, for example. If the first member 12 is a wafer, the adhesive used for the first adhesive layer 10 may be the same as the adhesive used to join the backing (second member 14) to the circuit surface (front surface 12a) for protection and support at the time of the back surface grinding process performed on the wafer. For example, the liquid-ultraviolet-curing-type acrylic liquid adhesive LC-3200 (brand name), which can be obtained from Sumitomo 3M Limited (Tokyo), may be used.

[0022]

The laminate 16 is formed by overlapping the first member 12 and second member 14, which are roughly identical in dimensions and shape with the exception of the thicknesses thereof, with a roughly coaxial arrangement in which the respective front surfaces 12a and 14a oppose one another in a roughly parallel manner. The first member 12 and second member 14 are joined together with the first adhesive layer 10 interposed between the front surfaces 12a and 14a (FIG. 2 shows a laminate 16 having a discoid external shape as an example). The illustrated member peeling method includes the following steps for this laminate 16.

[0023]

i) Step of preparing curved backing surface 18 (FIGS. 1 and 2).

In step i, a curved backing surface 18 is prepared as a part of a cylindrical surface curved in a convex shape with a prescribed curvature. The curved backing surface 18 may have rigidity to allow the initial curvature to be maintained against an external force. Alternatively, the curved backing surface 18 may have elasticity, allowing slight deformation against an external force and allowing the initial curvature to be recovered easily. The curved backing surface 18 may also be an essentially smooth surface having minute irregularities. The curved backing surface 18 may be formed by the peripheral surface of a hollow or solid cylindrical structure 20. An outer edge 18a of the curved backing surface 18 may have various shapes such as a circular shape, rectangular shape, or the like, as viewed from a planar perspective (this is shown in FIG. 2 as the curved backing surface 18 having an outer edge 18a with a rectangular shape as viewed from a planar perspective, as an example). The material, shape, dimensions, and the like of the curved backing surface 18 are not particularly limited, except for a condition that the curved backing surface 18 must be larger than the back surface 12b of the first member 12 of the laminate 16.

[0024]

ii) Step of preparing film 24 having second adhesive layer 22 (FIGS. 1 and 2).

In step ii, a film 24 is prepared as a pliable membranous element having a second adhesive layer

22, a back surface 24a on an opposite side thereof, and a peripheral edge 24b. The second adhesive layer 22 can be formed, for example, by uniformly applying an adhesive with an appropriate composition to an entire surface of a film substrate with a uniform thickness made of a resin or the like. An adhesive force of the second adhesive layer 22 of the film 24 with respect to the first member 12 of the laminate 16 is greater than an adhesive force between the first member 12 and the second member 14 resulting from the first adhesive layer 10.

[0025]

An adhesive forming the second adhesive layer 22 is preferably a pressure sensitive adhesive that can express an adhesive force capable of keeping the back surface 12b of the first member 12 secured to the second adhesive layer 22.

[0026]

After the first member 12 is peeled from the second member 14 by the process described below, the necessity to peel the first member 12 from the second adhesive layer 22 of the film 24 may arise. In this case, an adhesive with an adhesive force that is diminished by heat or radioactive irradiation may be used as the adhesive forming the second adhesive layer 22. If an adhesive with an adhesive force that is diminished by radioactive irradiation, for example, is used as the adhesive forming the second adhesive layer 22, it is desirable for the film 24 to have sufficient radiolucency. For example, the film 24 may be a polymer film made of a polyester such as polyethylene terephthalate or the like, a polyolefin resin such as polypropylene or the like, a polyvinyl chloride resin, a polyvinylidene chloride resin, a polyamide resin, or the like. T-172M Integrated Circuit Packaging Tape (brand name) (single-sided adhesive tape in which an acrylic adhesive is applied to a polyolefin substrate), which can be obtained from Sumitomo 3M Limited (Tokyo), may be used as the film 24 having the second adhesive layer 22, with an adhesive force that is diminished by radioactive irradiation.

[0027] The adhesive fonning the second adhesive layer 22 is selected in combination with the adhesive forming the first adhesive layer 10, with a condition that the adhesive force of the second adhesive layer 22 with respect to the first member 12 must be larger than the adhesive force between the first member 12 and the second member 14 resulting from the first adhesive layer 10. For example, if the first adhesive layer 10 consists of the liquid-ultraviolet-curing-type adhesive LC-3200 (brand name), which can be obtained from Sumitomo 3M Limited (Tokyo), the adhesive force of the first adhesive layer 10 with respect to the front surfaces 12a and 14a of the first and second members 12 and 14, while differing depending on the material, the shape of irregularities, and the like of the front surfaces 12a and 14a, is roughly within a range of 0.98 N/25 mm to 9.8 N/25 mm. In contrast, if the film 24 having the second adhesive layer 22 consists of T-172M Integrated Circuit Packaging Tape (brand name), which can be obtained from Sumitomo 3M Limited (Tokyo), the adhesive force of the second adhesive layer 22 with respect to the front surface 12a of the first member 12, while differing depending on the material, the shape of irregularities, and the like of the front surface 12a, is roughly 24.5 N/25 mm. Moreover, for the T-172M Integrated Circuit Packaging Tape (brand name), an adhesive force of the adhesive is reduced to approximately 0.49 N/25 mm by exposure to radiation.

[0028]

In order to ensure that the first member 12, in particular, is not damaged when peeling the first member 12 from the second member 14, it is desirable for the adhesive force between the first member 12 and the second member 14 resulting from the first adhesive layer 10 to be at most approximately 9.8 N/25 mm. On the other hand, it is desirable for the adhesive force of the second adhesive layer 22 with respect to the first member 12 to be at least approximately 14.7 N/25 mm in order to ensure that the first member 12 can be easily peeled from the second member 14. The difference between the adhesive force of the second adhesive layer 22 with respect to the first member 12 and the adhesive force between the first member 12 and the second member 14 resulting from the first adhesive layer 10 may be approximately 4.9 N/25 mm or more, 9.8 N/25 mm or more, or 14.7 N/25 mm or more, for example.

[0029]

When the illustrated member peeling method is implemented in a manufacturing method for a semiconductor chip, it is preferable for the film 24 to have physical properties allowing the film to stably support a wafer (first member 12) during subsequent processes (for example, dicing and the like) after the back surface has been ground and the wafer peeled from the backing (second member 14). The thickness of such a film 24 may be from 5 to 200 μπι, for example.

[0030]

The film 24 may be supplied as a sheet cut to an appropriate shape and dimensions in advance, or may be continuously supplied by reeling out from a roll (FIG. 2 shows a sheet-shaped film 24 cut into a discoid external shape as an example). The material, shape, dimensions, and the like of the film 24 are not particularly limited with the exception that the adhesive force of the second adhesive layer 22 with respect to the first member 12 must be greater than the adhesive force between the first member 12 and the second member 14 resulting from the first adhesive layer 10. Additionally, a back surface (that is, an adhesive surface) 22a of the second adhesive layer 22 must be larger than the back surface 12b of the first member 12.

[0031]

iii) Step of securing film 24 along curved backing surface 18 with back surface 22a of second adhesive layer 22 in exposed state (FIG. 3).

In step iii, the film 24 is secured with the back surface 24a in close contact with the curved backing surface 18 so that the back surface 22a of the second adhesive layer 22 (hereafter, called adhesive surface 22a) forms an essentially smooth curved surface along the curved backing surface 18. The step of securing the film 24 to the curved backing surface 18 may include a step of holding the film 24 against the curved backing surface 18 by applying a vacuum to the film 24. (However, the present specification is not limited to a negative pressure state that is lower than atmospheric pressure and a reduced pressure state lower than that of an air pressure surrounding the film 24 will be called a "vacuum" hereafter.) In this case, various attachment mechanisms for vacuum- attaching the film 24 onto the curved backing surface 18 may be used. With a configuration in which the film 24 is secured to the curved backing surface 18 using a vacuum, the film 24 can be easily separated from the curved backing surface 18 by releasing the vacuum. If it is unnecessary to take into consideration separation of the film 24 from the curved backing surface 18, it is also possible to secure the film 24 to the curved backing surface 18 with an adhesive or the like, and in this case a film 24 having an adhesive layer on both sides of the film substrate may be used. In a case where the film 24 has an adhesive layer on both sides (one of which is the second adhesive layer 22), an adhesive forming these adhesive layers may be the same or may be different.

[0032]

As an example of the attachment mechanism described above, a configuration may be employed that is provided with a single or a plurality of grooves 26 (FIG. 2) having a prescribed width and depth (both of which are approximately from 1 to 2 mm, for example) which are formed annularly at desired positions of the curved backing surface 18, and with a vacuum device (not shown) connected to the grooves 26. With this attachment mechanism, it is possible to attach and securely hold the film 24 onto the curved backing surface 18 by reducing the pressure inside the grooves 26 with the operation of the vacuum device, while the film 24 is in a state placed on the curved backing surface 18 so as to cover the entire groove 26. In particular, by reducing the pressure inside the groove 26, the pressure of the minute irregularities of the curved backing surface 18 in the region enclosed by the groove 26 is similarly reduced, which makes it possible to firmly secure the portion of the film 24 positioned inside of the groove 26 to the curved backing surface 18. The film 24 can be easily separated from the curved backing surface 18 by releasing the operation of the vacuum device from this secured state and returning the inside of the groove 26 to atmospheric pressure. The groove 26, which is assumed to form a closed loop, may extend in various shapes such as circular shapes, rectangular shapes, or the like, when viewed from the planar perspective (FIG. 2 shows two grooves 26 extending in a rectangular shape from the planar perspective as an example). The shape, dimensions, number, and the like of the groove 26 are not particularly limited, with the exception that at least one groove 26 must extend over a region capable of enclosing the entire first member 12 of the laminate 16. As an attachment mechanism, a configuration in which the entire curved backing surface 18 is given a porous structure and the gaps thereof are drawn into a vacuum may be employed instead of the above configuration having the groove 26.

[0033]

iv) Step of gradually peeling first member 12 from second member 14 (FIGS. 4 through 7).

In step iv, a portion of the back surface (that is, an exposed surface) 12b adjacent to the peripheral surface 12c of the first member 12 (hereafter called the "first outer edge adjacent part 12d"), which is joined to the second member 14 via the first adhesive layer 10, is first brought into contact with and fixed to the adhesive surface 22a of the second adhesive layer 22 of the film 24 secured to the curved backing surface 18 (FIG. 4). Here, when the aforementioned attachment mechanism is used, the position at which the back surface 12b is initially brought into contact with the adhesive surface 22a of the second adhesive layer 22 is determined so that the entire back surface 12b of the first member 12 can ultimately be positioned in the region inside at least one groove 26. Also at this time, a pressing force P, in a direction such that the back surface 12b of the first member 12 is pressed against the second adhesive layer 22 of the film 24, may be applied to the laminate 16 using a pressing member such as a rubber roller 28, for example (FIG. 5A). When the peeling step is begun, the pressing force P is applied to a portion of the back surface 14b of the second member 14 corresponding to the first outer edge adjacent part 12d of the back surface 12b of the first member 12 which initially makes contact with the adhesive surface 22a of the second adhesive layer 22 (hereafter called the "first outer edge adjacent part 14d"). If the second adhesive layer 22 is formed from a pressure sensitive adhesive, the pressing force P is of a sufficient magnitude for the adhesive force between the first member 12 and the second adhesive layer 22 to be larger than that of the adhesive force between the first member 12 and the second member 14 resulting from the first adhesive layer 10.

[0034] By rolling the rubber roller 28, for example, along the back surface 14b of the second member 14 from the initial fixed position described above, the pressing force P applied to the laminate 16 is continuously moved from the first outer edge adjacent part 14d of the back surface 14b toward a portion adjacent to the peripheral surface 14c on the opposing side (hereafter called the "second outer edge adjacent part 14e") (FIG. 5B). During this interval, the pressing force P is applied uniformly across an entire linear section of the back surface 14b of the second member 14 extending in a direction orthogonal to the movement direction of the pressing force P. When a rubber roller 28 is used, for example, the rubber roller 28 is configured to have a dimension along an axial line greater than a maximum width of the back surface 14b of the second member 14 (diameter of the back surface 14b if the second member 14 is discoid), such that the pressing force P can be applied uniformly to the entire linear section of the back surface 14b where the peripheral surface of the rubber roller 28 makes contact. By moving the pressing force P in this way, the back surface 12b of the first member 12 is gradually fixed to the adhesive surface 22a of the second adhesive layer 22 of the film 24, which is secured to the curved backing surface 18, from the first outer edge adjacent part 12d toward the portion adjacent to the peripheral surface 12c on the opposing side (hereafter called the "second outer edge adjacent part 12e").

[0035]

Here, the adhesive force of the second adhesive layer 22 with respect to the first member 12 is greater than the adhesive force between the first member 12 and the second member 14 resulting from the first adhesive layer 10, and the first member 12 has flexibility enabling it to be bent relatively easily by an external force on its own, while the second member 14 has rigidity enabling it to maintain the tabular form against a bending force transmitted from the first member 12 via the first adhesive layer 10.

Accordingly, while the back surface 12b of the first member 12 is gradually fixed to the second adhesive layer 22, the first member 12 gradually bends along the curved backing surface 18 while remaining in the state fixed to the second adhesive layer 22. On the other hand, the second member 14 attempts to maintain the tabular form without bending. As a result, the first member 12 is gradually peeled from the second member 14.

[0036]

By continuously moving the pressing force P, the fixing of the back surface 12b of the first member 12 to the second adhesive layer 22 is gradually advanced from the first outer edge adjacent part 12d to the second outer edge adjacent part 12e, and the peeling of the first member 12 from the second member 14 is gradually advanced accordingly (FIGS. 5C and 5D). At the point when the pressing force P reaches the second outer edge adjacent part 14e of the back surface 14b of the second member 14, the entire back surface 12b of the first member 12 is fixed to the adhesive surface 22a of the second adhesive layer 22 (FIG. 5E). The pressing force P is thus released (FIG. 6), and the entire first member 12 is peeled from the second member 14 by pulling the second member 14 away from the first member 12 as necessary (FIG. 7).

[0037]

With the member peeling method described above, the first member 12 can be gradually peeled from the second member 14 simply by gradually fixing the first member 12 of the laminate 16 to the second adhesive layer 22 of the film 24 secured to the curved backing surface 18, and the entire first member 12 can be peeled from the second member 14 by continuing this gradual process to fix the entire first member 12 to the second adhesive layer 22. Accordingly, processing for melting the first adhesive layer 10 or reducing the adhesive force becomes unnecessary, and it is possible to peel the first and second members 12 and 14 from one another quickly and safely with a simpler technique.

[0038]

Moreover, the member peeling method described above can also be implemented in a manufacturing method for a semiconductor chip as a step of peeling a first member 12 consisting of a wafer from a second member 14 consisting of a backing which is joined to a circuit formation surface (front surface 12a) of the wafer via a first adhesive layer 10. With this configuration, the wafer (first member 12) can be peeled from the backing (second member 14) quickly and safely with a simpler technique without melting the first adhesive layer 10 or reducing the adhesive force.

[0039]

In the aforementioned member peeling method for peeling a first member 12 from a second member 14 by bending the first member 12 along a curved backing surface 18, it is necessary to bend the first member 12 at a curvature radius no greater than a critical curvature radius wherein damage does not occur. In particular, if the first member 12 is a wafer, it is required that the semiconductor device or circuit formed on the front surface 12a of the first member 12 must not sustain damage due to deformation (stretching) of the front surface 12a. The amount of deformation (stretching) of the front surface 12a when the first member 12 is bent at a prescribed curvature radius is proportional to the thickness of the first member 12 and inversely proportional to the curvature radius. From such a perspective, in the member peeling method described above, the curvature radius of the curved backing surface 18 may be set to at least approximately 2000 times or to at least approximately 4000 times the thickness of the first member 12. In order to quickly and smoothly execute the step of gradually peeling the first member 12 from the second member 14, the curvature radius of the curved backing surface 18 may also be set to at most approximately 10,000 times or to at most approximately 8,000 times the thickness of the first member 12.

[0040] After the respective peeling of the first and second members 12 and 14 is completed in the member peeling method described above, the first adhesive layer 10, preferably the entirety thereof, remains in the state attached to the front surface 12a of the first member 12 or the front surface 14a of the second member 14. Alternatively, a configuration may be used in which the first adhesive layer 10 is appropriately segmented so as to partially remain on the respective front surfaces 12a and 14a of the first and second members 12 and 14.

[0041]

When the illustrated member peeling method is implemented in a process for peeling a wafer having a back surface that has been ground from a backing in a manufacturing method for a

semiconductor chip, it is effective from the perspective of smoothly executing post-processing on the wafer to leave the entire first adhesive layer 10 behind on the backing (second member 14) supporting the wafer (first member 12). Accordingly, the step of gradually peeling the first member 12 from the second member 14 may be implemented so that the first member 12 is gradually peeled from the first adhesive layer 10 while maintaining the state in which the second member 14 is attached to the first adhesive layer 10.

[0042]

With the objective of making it possible to peel the first member 12 from the first adhesive layer 10 while maintaining the state in which the first adhesive layer 10 is attached to the second member 14, various means can be employed to make the adhesive strength of the first adhesive layer 10 with respect to the front surface 14a of the second member 14 greater than the adhesive strength of the first adhesive layer 10 with respect to the front surface 12a of the first member 12. An example of this type of means may be the selection of the materials of the first and second members 12 and 14. For example, the second member 14 can be formed from a plastic such as Bakelite, and the first member 12 can be formed from a wafer material such as silicon. Moreover, as other examples of the aforementioned means, it is possible to perform surface processing on the front surface 14a in advance to increase the adhesive strength of the first adhesive layer 10 with respect to the front surface 14a of the second member 14 or to perform surface processing on the front surface 12a in advance to decrease the adhesive strength of the first adhesive layer 10 with respect to the front surface 12a of the first member 12.

[0043]

In the member peeling method described above, there are cases in which separation of the film 24 from the curved backing surface 18 together with the first member 12 fixed to the adhesive surface 22a of the second adhesive layer 22 is required supplementarily, after the entire first member 12 is peeled from the second member 14. FIGS. 8 through 11 show such a supplementary step of the member peeling method according to an embodiment of the present invention. In FIG. 8, a sheet-shaped film 24 cut into a rectangular external shape is secured to the curved backing surface 18, which has one groove 26 extending to form a rectangular shape from the planar perspective, and a discoid first member 12 is fixed to the region inside the groove 26.

[0044]

The illustrated supplementary step is a step of separating the film 24 from the curved backing surface 18 together with the first member 12 fixed to the adhesive surface 22a of the second adhesive layer 22, after peeling the entire first member 12 from the second member 14. This supplementary step further includes the following steps.

[0045]

v) Step of fixing annular frame member 30 having a shape enclosing first member 12 to adhesive surface 22a of adhesive layer 22 of film 24 in a vicinity of first member 12 (FIGS. 8 through 10).

A frame member 30 is created from a metal, a resin, or the like to a uniform thickness and is fixed to the second adhesive layer 22 along the peripheral edge 24b of the film 24. This gives the frame member 30 rigidity, enabling the first member 12 positioned inside the frame member 30 on the expanded film 24 to be stably supported. For example, if the frame member 30 is a toric member made of stainless steel, it may have dimensions with a thickness of approximately from 1 to 2 mm, an inside diameter of approximately 350 mm, and an outside diameter of approximately 400 mm. These dimensions are suited to cases in which the first member 12 is a silicon wafer with a diameter of 300 mm, for example.

Although the illustrated frame member 30 has a toric shape similar to the circular shape of the first member 12, the material, shape, dimensions, and the like are not particularly limited, with the exception that the frame member 30 have a shape and dimensions allowing the first member 12 to be enclosed with a gap, as well as a rigidity allowing the first member 12 to be supported on the expanded film 24.

[0046]

In step v, a portion of the toric frame member 30 is brought into contact with and fixed to the adhesive surface 22a of the second adhesive layer 22 of the film 24 (FIGS. 8 and 9). At this time, the position at which the frame member 30 initially makes contact with the adhesive surface 22a of the second adhesive layer 22 is determined so that the entire first member 12 is ultimately enclosed by the frame member 30. A pressing force in a direction such that the frame member 30 is pressed into the second adhesive layer 22 may also be applied to the frame member 30 at this time. Moreover, before and after this step, the film 24 is placed in a state in which it is not secured to the curved backing surface 18 by releasing the vacuum of the attachment mechanism described above, for example. Further, the frame member 30 is gradually fixed to the adhesive surface 22a of the second adhesive layer 22 from the initial fixing part toward the part on the opposite side (FIGS. 10A through 10D).

[0047] vi) Step of moving frame member 30 fixed to adhesive surface 22a of second adhesive layer 22 in a direction away from curved backing surface 18 (FIGS. 10 and 1 1).

Part of step vi is performed along with the gradual fixing step described above for the frame member 30. That is, while the frame member 30 is gradually fixed to the adhesive surface 22a of the second adhesive layer 22 from the initial fixing portion toward the portion on the opposing side, the frame member 30, which has rigidity enabling the first member 12 to be stably supported on the expanded film 24, maintains its own shape while the portion fixed to the second adhesive layer 22 is gradually moved in a direction away from the curved backing surface 18 together with the frame 24 and the first member 12 (FIGS. lOA to 10D).

[0048]

In the state in which the entire frame member 30 is fixed to the second adhesive layer 22 (FIG. 10D), the frame member 30 can be independently and freely moved from the curved backing surface 18 while stably supporting the first member 12 on the expanded film 24. In this way, the film 24 is separated from the curved backing surface 18 together with the first member 12 fixed to the second adhesive layer 22 (FIG. 1 1). The film 24, which is separated from the curved backing surface 18 together with the first member 12 using the frame member 30, is kept in the state in which it is expanded evenly by the frame member 30. Therefore, desired operations such as machining or transportation can be stably executed for the first member 12 that is peeled from the second member 14, for example.

[0049]

When the illustrated member peeling method is implemented in a process for peeling a wafer from a backing after the back surface is ground in a manufacturing method for a semiconductor chip, the supplementary step described above is a step of separating the film 24 from the curved backing surface 18 together with the wafer fixed to the second adhesive layer 22 after peeling the entire wafer (first member 12) from the backing (second member 14). This step further includes a step of fixing an annular frame member 30, which has a shape enclosing the wafer, to the adhesive surface 22a of the second adhesive layer 22 of the film 24 in the vicinity of the wafer and a step of moving the frame member 30 fixed to the adhesive surface 22a of the second adhesive layer 22 in the direction away from the curved backing surface 18. With a manufacturing method having such a supplementary step, processes such as dicing can be stably executed for the wafer (first member 12) fixed to the film 24, which is kept in the expanded state by the frame member 30.

[0050]

In the member peeling method described above, the step of securing the film 24 to the curved backing surface 18 may include a step of continuously securing a web-shaped film 24 to the continuously moving curved backing surface 18. In addition, the step of gradually peeling the first member 12 from the second member 14 may be configured to be sequentially performed for a plurality of laminates 16 having respective first members 12 and second members 14, which are joined to one another via first adhesive layers 10, using a film 24 continuously secured to the curved backing surface 18. With such a configuration, continuous operations on the plurality of laminates 16 enables the respective first members 12, which are respectively joined via the first adhesive layers 10 to the plurality of second members 14, to be peeled from the plurality of second members 14 continuously and quickly.

[0051]

FIGS. 12 through 14 show a member peeling apparatus 40 according to an embodiment which is able to continuously execute the member peeling method shown in FIGS. 1 through 11 for a plurality of laminates 16. The member peeling apparatus 40 is also able to execute the semiconductor chip manufacturing method of an embodiment. However, the applications of the member peeling apparatus 40 are not limited to this example.

[0052]

The member peeling apparatus 40 is provided with a rotatable, cylindrical backup roll 44 having a curved backing surface 42, a film supplying part 50 for continuously supplying a film 48 having a second adhesive layer 46 to the curved backing surface 42 in synchronization with a rotation of the backup roll 44, a securing mechanism 52 for securing the film 48 along the curved backing surface 42 while exposing an adhesive surface 46a of the second adhesive layer 46, and a laminate feeding mechanism 54 for feeding a laminate 16 having a first member 12 and a second member 14, which are joined to one another via a first adhesive layer 10, in a tangential plane direction at a speed corresponding to a speed of the curved backing surface 42 in the tangential plane direction while pressing the first member 12 into the surface (that is, the adhesive surface) 46a of the second adhesive layer 46 of the film 48 secured to the curved backing surface 42 (FIG. 12).

[0053]

The backup roll 44 is made of a hollow cylinder and rotates at a prescribed speed ω in the direction of arrow R around an axis line 44a when driven by a driving device 56 (FIG. 14). The curved backing surface 42 is formed by the cylindrical peripheral surface of the backup roll 44 and has the same configuration as the curved backing surface 18 described above. The film 48 is a long film that extends to form a webbed shape and has a second adhesive layer 46 formed on an entirety of one surface thereof. The film 48 and the second adhesive layer 46 have the same configurations as the film 24 and the second adhesive layer 22 described above, except for being web-shaped. The film supplying part 50 is able to support the web-shaped film 48 in the form of a roll 60 wrapped around a shaft 58 and can continuously supply the film 48 to the curved backing surface 42 by reeling it out from the roll 60.

[0054] The securing mechanism 52 is provided with an attachment mechanism that holds the film 48 against the curved backing surface 42 by applying a vacuum to the film 48 so that it can be released. The attachment mechanism is provided with an annular groove 62 formed as a depression in the curved backing surface 42 and a vacuum device 64 for reducing the pressure of the space inside the annular groove 62 (FIGS. 13 and 14). The annular groove 62 is provided at a position to enclose a surface region of the curved backing surface 42 corresponding to the fixing region of the first member 12 on the second adhesive layer 46 of the film 48. The annular groove 62 has the same configuration as the groove 26 described above. Instead of the aforementioned configuration having the annular groove 62, it is also possible to employ a configuration in which the entire curved backing surface 42 is given a porous structure and the gaps thereof are drawn into a vacuum.

[0055]

In the member peeling apparatus 40, three annular grooves 62 separated from one another in the circumferential direction are formed on the curved backing surface 42. These annular grooves 62 are connected to the vacuum device 64 via a rotating shaft 66 of the backup roll 44 and a rotating joint 68 connected to the rotating shaft 66 so that gas can be circulated. Three gas pathways 70 communicating with each of the annular grooves 62 are provided inside the rotating shaft 66, and these gas pathways 70 are connected to the vacuum device 64 via the rotating joint 68 and a switching valve 72 provided between the rotating joint 68 and the vacuum device 64 (FIG. 14). As the backup roll 44 rotates when driven by the driving device 56, the annular grooves 62 that are at prescribed rotation positions, as specified by a rotation angle of a prescribed range, are connected to the vacuum device 64 by the switching valve 72 and decompressed by drawing a vacuum. On the other hand, the other annular grooves 62 at other rotation positions, as specified by a rotation angle of another prescribed range, are blocked from the vacuum device 64 by the switching valve 72 and are returned to atmospheric pressure.

[0056]

In a state in which the film 48 is supplied to the curved backing surface 42 so as to cover the entirety of each of the annular grooves 62, the film 48 can be suctioned and securely held onto the curved backing surface 42 by reducing the pressure inside each of the annular grooves 62 by the operation of the vacuum device 64. In particular, by reducing the pressure of the three annular grooves 62 independently from one another, minute irregularities of the curved backing surface 42 in the regions enclosed by each of the annular grooves 62 are similarly decompressed by drawing a vacuum, which makes it possible to firmly secure the portions of the film 48 positioned inside each of the annular grooves 62 to the curved backing surface 42. Accordingly, with the member peeling apparatus 40, it is possible to fix three first members 12 at a time to the second adhesive layer 46 of the film 48 secured to the curved backing surface 42 of the backup roll 44 by bending along the curved backing surface 42. [0057]

The laminate feeding mechanism 54, for example through a conveying device (not shown), feeds a laminate 16 in the tangential plane direction (direction of arrow Dl) at a speed v corresponding to the speed of the curved backing surface 42 in the tangential plane direction, with the back surface 12b of the first member 12 in an exposed orientation, and brings the back surface 12b of the first member 12 into contact with the adhesive surface 46a of the second adhesive layer 46 of the film 48 secured to the curved backing surface 42 at the position closest to the backup roll 44. A pressure roller 74 for pressing the first member 12 into the second adhesive layer 46 is installed at the position where the first member 12 is brought into contact with the second adhesive layer 46. The pressure roller 74 has the same configuration as the rubber roller 28 described above, and applies a pressing force P, in a direction such that the back surface 12b of the first member 12 is pressed into the second adhesive layer 46 of the film 48, to the laminate 16 fed at the speed v in the tangential plane direction.

[0058]

When executing the member peeling method described above with the member peeling apparatus 40, the end region of the film 48 is first secured to the curved backing surface 42 by reducing the pressure of one annular groove 62. In that state, the backup roll 44 is rotated and the other annular grooves 62 are sequentially decompressed so that the film 48 is continuously drawn out from the film supplying part 50 and secured to the curved backing surface 42 (step iii as described above). The laminate feeding mechanism 54 determines the position of the laminate 16 on the conveying device so that the entire back surface 12b of the first member 12, which is ultimately fixed by bending along the curved backing surface 42, can be positioned inside one annular groove 62 with respect to the film 48 moving at the speed ω in the direction of rotation of the backup roll 44, and feeds the laminate 16 in the tangential plane direction at the speed v. As a result, the back surface 12b of the first member 12, which is joined to the second member 14 via the first adhesive layer 10, initially makes contact with the adhesive surface 46a of the second adhesive layer 46 at the first outer edge adjacent part 12d (FIG. 5) described above, and is fixed to the second adhesive layer 46 by the pressing force P from the pressure roller 74.

[0059]

When the backup roll 44 continues to be rotated from the initial fixing position described above, the first member 12 moves at the speed ω in the rotational direction of the roll together with the film 48, and the back surface 12b of the first member 12 moves from the first outer edge adjacent part 12d toward the second outer edge adjacent part 12e described above (FIG. 5) and is gradually fixed to the adhesive surface 46a of the second adhesive layer 46 under the pressing force P from the pressure roller 74. While the back surface 12b of the first member 12 is gradually fixed to the adhesive surface 46a of the second adhesive layer 46, the first member 12 moving at the speed ω gradually bends along the curved backing surface 42 while maintaining the state in which it is fixed to the second adhesive layer 46. On the other hand, the second member 14 moves at the speed v in the tangential plane direction while maintaining the tabular form without bending. As a result, the first member 12 is gradually peeled from the second member 14 (step iv). The entire first member 12 is peeled from the second member 14 at the point when the entire laminate 16 has passed through the pressure roller 74.

[0060]

By continuously feeding a plurality of laminates 16 at a prescribed alignment pitch corresponding to the alignment pitch of the annular grooves 62 on the curved backing surface 42 with the laminate feeding mechanism 54 in the member peeling apparatus 40, the first members 12 can be sequentially peeled from the second members 14 for at least three laminates 16. In this way, the member peeling method described above can be continuously executed for a plurality of laminates 16 with the member peeling apparatus 40. Accordingly, the respective first and second members 12 and 14 of the plurality of laminates 16 can be peeled quickly and safely with a simpler technique.

[0061]

In order to make it possible to continuously execute the member peeling method described above for a plurality (at least four in the drawings) of laminates 16 regardless of the configuration of the securing mechanism 52 (specifically, the number of annular grooves 62), the member peeling apparatus 40 may be further equipped with a film separating part 76 provided on the downstream side in the film supply direction of the laminate feeding mechanism 54. The film separating part 76 functions to separate the film 48 secured to the curved backing surface 42 of the rotating backup roll 44 from the curved backing surface 42 together with the first member 12 fixed to the second adhesive layer 46.

[0062]

The film separating part 76 is configured to feed the annular frame member 30 described above in the tangential plane direction (direction of arrow D2) at the speed v corresponding to the speed of the curved backing surface 42 in the tangential plane direction using the conveying device (not shown), for example, and brings a portion of the frame member 30 into contact with the adhesive surface 46a of the second adhesive layer 46 of the film 48 secured to the curved backing surface 42 and fixes it at the position closest to the backup roll 44. With the film separating part 76, the position of the frame member 30 on the conveying device is determined so that the entire first member 12, which is fixed to the second adhesive layer 46 and is moving at the speed ω, is ultimately enclosed by the frame member 30, and the frame member 30 is fed at the speed v in the tangential plane direction. Before part of the frame member 30 initially makes contact with the second adhesive layer 46, the switching valve 72 of the securing mechanism 52 is operated to release the vacuum of the annular grooves 62 securing the portions of the film 48 to be separated, which results in a state in which the portions of the film 48 to be separated are not secured on the curved backing surface 42.

[0063]

When the backup roll 44 continues to be rotated from the initial fixing position described above, the frame member 30 moving at the speed v moves from the initial fixing part to the part on the opposite side and is gradually fixed to the adhesive surface 46a of the second adhesive layer 46 of the film 48 moving at the speed ω (step v). In accordance with this gradual fixing, the frame member 30 maintains its own shape while the portion which is fixed to the second adhesive layer 46 gradually moves away from the curved backing surface 42 together with the film 48 and the first member 12 (step vi). At the point when the entire frame member 30 has passed through the film separating part 76, the portion of the film 48 that fixes and supports the first member 12 on the second adhesive layer 46 is separated from the curved backing surface 42.

[0064]

By continuously feeding a plurality of frame members 30 at a prescribed alignment pitch corresponding to the alignment pitch of the annular grooves 62 on the curved backing surface 42 with the film separating part 76 in the member peeling apparatus 40, film portions which fix and support the first members 12 can be sequentially separated from the curved backing surface 42 for a plurality of first members 12 fixed to the second adhesive layer 46 of the film 48. Accordingly, the member peeling method described above can be continuously executed for a plurality (at least four in the drawings) of laminates 16.

[0065]

The member peeling apparatus 40 can be used to implement a process for peeling a backing from a wafer having a ground back surface in a manufacturing method for a semiconductor chip. In this case, the laminate feeding mechanism 54 can continuously fix a plurality of laminates 16, which are formed by joining wafers (first members 12) and backings (second members 14) to one another via first adhesive layers 10, to the adhesive surface 46a of the second adhesive layer 46 of the film 48 moving at the speed ω together with the curved backing surface 42. The entire wafer (first member 12) is separated from the entire backing (second member 14) in each laminate 16 at the point when each laminate 16 has passed through the pressure roller 74. The film separating part 76 can also sequentially separate the film portions that fix and support wafers from the curved backing surface 42 for a plurality of wafers (first members 12) fixed to the second adhesive layer 46 of the film 48. The film 48 is continuously separated from the curved backing surface 42 by a plurality of frame members 30. The film 48 may also be segmented between adjacent frame members 30 after being separated. Processes such as dicing can be stably executed for wafers (first members 12) fixed to the film 48 that is held in the expanded state by the frame members 30.

[0066]

[Reference Numerals]

[0067]

10: Adhesive layer

12: First member

12a: Front surface

12b: Back surface

14: Second member

14a: Front surface

14b: Back surface

16: Laminate

18 and 42: Curved backing surface

22 and 46: Adhesive surface

24 and 48: Film

26: Groove

28: Rubber roller

30: Frame member

40: Member peeling apparatus

44: Backup roll

50: Film supplying part

52: Securing mechanism

54: Laminate feeding mechanism

62: Annular groove

64: Vacuum device

74: Pressure roller

76: Film separating part

Claims

What is Claimed is:

1. A member peeling method for peeling from one another a first member and a second member, which have been joined to one another via a first adhesive layer, the method comprising:

a step of preparing a curved backing surface;

a step of preparing a film having a second adhesive layer, wherein an adhesive force between the first member and the second adhesive layer is greater than an adhesive force between the first member and the second member resulting from the first adhesive layer;

a step of securing the film along the curved backing surface with a surface of the second adhesive layer in an exposed state; and

a step of gradually peeling the first member from the second member by fixing an exposed surface of the first member, which is joined to the second member via the first adhesive layer, to the surface of the second adhesive layer of the film, which is secured to the curved backing surface, and gradually bending the first member along the curved backing surface.

2. The member peeling method according to claim 1, wherein the step of gradually peeling the first member from the second member comprises a step of gradually peeling the first member from the first adhesive layer while maintaining a state in which the first adhesive layer is attached to the second member.

3. The member peeling method according to claim 1 or 2, wherein the step of securing the film to the curved backing surface comprises a step of holding the film against the curved backing surface by applying a vacuum to the film.

4. The member peeling method according to any one of claims 1 through 3, further comprising a step of separating the film from the curved backing surface, together with the first member fixed to the surface of the second adhesive layer, after peeling an entirety of the first member from the second member.

5. The member peeling method according to any one of claims 1 through 4, wherein the step of securing the film to the curved backing surface comprises a step of continuously securing the film to the curved backing surface; and

the step of gradually peeling the first member from the second member is sequentially performed for a plurality of laminates using the film, which is continuously secured to the curved backing surface.

6. A member peeling apparatus for implementing the member peelmg method according to claim 1 , the apparatus comprising:

a rotatable, cylindrical backup roll having the curved backing surface;

a film supplying part for continuously supplying the film to the curved backing surface in synchronization with a rotation of the backup roll; a securing mechanism for securing the film along the curved backing surface; and

a laminate feeding mechanism for feeding a laminate comprising the first member and the second member, which have been joined to one another via the first adhesive layer, the laminate feeding mechanism feeding the laminate in a tangential plane direction at a speed corresponding to a speed of the curved backing surface in that tangential plane direction, while pressing the first member into the surface of the second adhesive layer of the film secured to the curved backing surface.

7. The member peeling apparatus of claim 6, wherein the securing mechanism comprises a holding mechanism for holding the film against the curved backing surface by applying a vacuum to the film so that the vacuum can be released.

8. The member peeling apparatus of claim 7, wherein the holding mechanism comprises an annular groove formed as a depression in the curved backing surface and a vacuum device for reducing a pressure of a space inside the annular groove, wherein the annular groove is provided at a position enclosing a surface region of the curved backing surface corresponding to a fixing region of the first member on the second adhesive layer of the film.

9. The member peeling apparatus of any one of claims 7 through 8, further comprising a film separating part that is provided on a downstream side of the laminate feeding mechanism and separates the film from the curved backing surface together with the first member fixed to the second adhesive layer.

10. A manufacturing method for a semiconductor chip, comprising:

a step of peeling the first member comprising a wafer from the second member comprising a backing that is joined to a circuit formation surface of that wafer via the first adhesive layer, using the member peeling method according to claim 1.

11. The manufacturing method according to claim 10, further comprising a step of separating the film from the curved backing surface together with the wafer fixed to the second adhesive surface, after peeling an entirety of the wafer from the backing;

the step of separating the film from the curved backing surface comprising a step of fixing an annular frame member, having a shape enclosing the wafer, to the surface of the second adhesive layer of the film in a vicinity of the wafer and a step of moving the frame member fixed to the surface of the second adhesive layer in a direction away from the curved backing surface.