WO2013109023A1 - Procédé de liaison optique et de durcissement - Google Patents

Procédé de liaison optique et de durcissement Download PDF

Info

Publication number
WO2013109023A1
WO2013109023A1 PCT/KR2013/000272 KR2013000272W WO2013109023A1 WO 2013109023 A1 WO2013109023 A1 WO 2013109023A1 KR 2013000272 W KR2013000272 W KR 2013000272W WO 2013109023 A1 WO2013109023 A1 WO 2013109023A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
light source
curing
wavelength
hardening
Prior art date
Application number
PCT/KR2013/000272
Other languages
English (en)
Korean (ko)
Inventor
유승명
Original Assignee
주식회사 디엠케이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 디엠케이 filed Critical 주식회사 디엠케이
Publication of WO2013109023A1 publication Critical patent/WO2013109023A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Definitions

  • the present invention relates to a light-bonding curing method, and more particularly, to reduce the heat generated during the curing of the heat-sensitive bonding substrate by the second curing step to overcome the disadvantages of bending the substrate, the existing long multi-wavelength curing
  • the present invention relates to a light bonding curing method having an effect of shortening time and improving productivity of a substrate.
  • LCDs liquid crystal display devices
  • PDPs plasma display panels
  • ELDs electro luminescent displays
  • VFDs vacuum fluorescence
  • liquid crystal display is the most widely used, replacing the CRT (Cathode Ray Tube) for mobile image display devices due to the advantages of excellent image quality, light weight, thinness, and low power consumption.
  • CTR Cathode Ray Tube
  • various developments have been made such as a television and a computer monitor for receiving and displaying broadcast signals.
  • liquid crystal display device As described above, although various technical advances have been made in the liquid crystal display device to serve as a screen display device in various fields, there are many aspects in which the operation of improving the image quality as the screen display device is arranged with the above characteristics and advantages. .
  • the key to power generation is how to realize high quality images such as high brightness and large area while maintaining the characteristics of light weight, thinness, and low power consumption.
  • a liquid crystal injection method of injecting a liquid crystal through an injection hole of a sealing material after a pattern drawing of a sealing material so as to form an injection hole on one substrate, and then bonding the substrate in vacuum, and a liquid crystal are suitable.
  • the other substrate prepared by the pattern which cut off the sealing material was prepared so that one board
  • the present invention overcomes the disadvantages of the bending of the substrate by reducing the heat generated during curing of the weakly bonded substrate, and improves the productivity of the substrate by shortening the existing long multi-wavelength curing time.
  • An object of the present invention is to provide a light bonding curing method.
  • the present invention is a surface of the bonded substrate after the first curing step and the first curing step of curing by irradiating with a UV light source of a single wavelength on the surface of the bonded substrate bonded to the lower substrate and the upper substrate It provides a light bonding curing method comprising a second curing step of curing by irradiating with a UV light source of a multi-wavelength.
  • the heat generated during curing of the weakly bonded substrate through the single wavelength and the multi-wavelength curing is reduced to overcome the disadvantages of the warpage of the substrate, and the existing long multi-wavelength curing time is shortened. This has the effect of improving productivity.
  • Figure 1 schematically shows a UV light source device of a single wavelength used in the first curing step.
  • Figure 2 schematically shows a multi-wavelength UV light source device used in the second curing step .
  • FIG. 3 schematically shows a UV light source of multiple wavelengths used in the second curing step .
  • the present invention is a UV light source device having a multi-wavelength on the surface of the bonded substrate after the first curing step and the first curing step of curing the irradiation by irradiating with a UV light source device of a single wavelength on the surface of the bonded substrate bonded to the lower substrate and the upper substrate It relates to a light bonding curing method comprising a second curing step of curing by irradiation with.
  • Figure 2 below schematically shows a second curing step of curing using a multi-wavelength UV light source device.
  • the coupling member 2 is disposed on the lower end of the housing portion 1 can move to the left or right.
  • the coupling member 2 is not particularly limited.
  • the upper portion of the coupling member 2 may be configured in a wheel shape or the like so that the coupling member 2 may move.
  • the electrical connection configuration is not particularly limited.
  • the temperature is increased by the heat generation of the UV light source.
  • an additional circulation cooling tube (not shown) may be further disposed in order to prevent excessive temperature rise.
  • a rotating blowing fan may be further arranged.
  • the present invention effectively prevents an increase in the device internal temperature and the curing temperature due to the multi-wavelength UV light source device.
  • the first curing step was performed by irradiating UV with a UV light source (LED UV) having a single wavelength (365 nm).
  • LED UV UV light source
  • the temperature of the three parts of the substrate was measured at a 30 second interval using a non-contact infrared temperature meter as shown in FIG. 4 (and FIG. 5) below, and the results are shown in Table 1 below.
  • the second curing step was performed by irradiating UV on the (three) substrates subjected to the first curing step using a multi-wavelength UV light source (mercury UV lamp) having a wavelength of 320 to 420 nm.
  • a multi-wavelength UV light source curcury UV lamp
  • the temperature of the three parts of the substrate was measured at 30 second intervals using a non-contact infrared temperature meter, and the results are shown in Table 2 below.
  • Example 2 In the same manner as in Example 1, without performing the first curing step with a UV light source having a single wavelength, two curing steps were performed with a multi-wavelength UV light source, as described above, the non-contact temperature of the three parts of the substrate The measurement was performed using an infrared thermometer and the results are shown in Tables 3 to 4 below.
  • Example 1 (unit: °C)
  • Example 2 (unit: °C)
  • Example 3 (unit: °C) One 2 3 One 2 3 One 2 3 0 30 32 30 29 32 29 31 32 31 30 22 25 22 24 26 24 25 27 24 60 22 23 22 22 24 21 24 25 24 90 20 22 20 22 23 21 22 24 22 120 20 21 20 21 22 20 21 22 20 150 20 21 20 21 20 21 20 21 20 180 20 20 20 21 21 20 21 20 21 20
  • Example 1 (unit: °C)
  • Example 2 (unit: °C)
  • Example 3 (unit: °C) One 2 3 One 2 3 One 2 3 0 33 34 34 34 33 34 35 34 35 30 28 26 28 29 27 27 29 27 27 60 27 24 26 26 25 26 26 25 25 90 26 24 26 25 24 24 24 24 24 120 24 23 24 24 23 23 23 23 23 150 23 23 23 22 22 23 22 22 180 23 22 22 22 22 22 22 22 22 210 22 23 22 22 22 22 22 22 22 22 22 240 22 22 21 22 21 22 21 21 270 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21
  • the sample temperature measured immediately after taking out from the curing device is 50 ⁇ 60 °C and the temperature goes down to 20 ⁇ 30 °C. It took a long time
  • the sample temperature measured immediately after removal from the curing device with a single wavelength was 29 to 32 °C (Table 1), and the sample temperature measured immediately after taking out from the curing device was 33 ⁇ 35 °C (Table 2), the time was lowered to 21 °C was 270 seconds, it took a short time compared to Comparative Examples 1 to 3 .
  • the internal temperature can be lowered by eliminating the factor of heat rise due to overheating by changing the irradiation area.

Abstract

La présente invention concerne un procédé de liaison optique et de durcissement et, plus particulièrement, un procédé de liaison optique et de durcissement comprenant : une première étape de durcissement consistant à exposer à un dispositif de source de lumière UV à longueur d'onde unique une surface d'un substrat couplé comprenant un substrat inférieur et un substrat supérieur qui sont couplés, et à durcir celle-ci ; et une seconde étape de durcissement consistant à exposer à un dispositif de source de lumière UV à longueur d'onde multiple la surface du substrat couplé qui a subi la première étape de durcissement, et à durcir celle-ci, ce qui permet ainsi d'utiliser les deux étapes de durcissement pour surmonter l'inconvénient de courbure du substrat par la réduction de la chaleur dégagée lors du durcissement du substrat couplé, qui est sensible à la chaleur, et d'améliorer la productivité du substrat par la réduction de la durée nécessaire au durcissement à longueur d'onde multiple des procédés existants.
PCT/KR2013/000272 2012-01-20 2013-01-14 Procédé de liaison optique et de durcissement WO2013109023A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0006579 2012-01-20
KR1020120006579A KR20130085657A (ko) 2012-01-20 2012-01-20 광 합착 경화 방법

Publications (1)

Publication Number Publication Date
WO2013109023A1 true WO2013109023A1 (fr) 2013-07-25

Family

ID=48799408

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2013/000272 WO2013109023A1 (fr) 2012-01-20 2013-01-14 Procédé de liaison optique et de durcissement

Country Status (2)

Country Link
KR (1) KR20130085657A (fr)
WO (1) WO2013109023A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101649931B1 (ko) * 2015-03-10 2016-08-23 주식회사지엘에스 Ｕｖ 경화장치 및 이의 조도 조절방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243161A (ja) * 2002-02-12 2003-08-29 Seiko Epson Corp 電気光学装置の製造方法及び製造装置、電気光学装置、電子機器
JP2010008564A (ja) * 2008-06-25 2010-01-14 Citizen Holdings Co Ltd 液晶表示装置の製造方法
KR20110074351A (ko) * 2009-12-24 2011-06-30 엘지디스플레이 주식회사 액정표시장치의 실런트 경화방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243161A (ja) * 2002-02-12 2003-08-29 Seiko Epson Corp 電気光学装置の製造方法及び製造装置、電気光学装置、電子機器
JP2010008564A (ja) * 2008-06-25 2010-01-14 Citizen Holdings Co Ltd 液晶表示装置の製造方法
KR20110074351A (ko) * 2009-12-24 2011-06-30 엘지디스플레이 주식회사 액정표시장치의 실런트 경화방법

Also Published As

Publication number Publication date
KR20130085657A (ko) 2013-07-30

Similar Documents

Publication Publication Date Title
KR101071138B1 (ko) 액정표시장치
WO2011062408A2 (fr) Dispositif de scellement au laser pour substrats en verre
CN105676543A (zh) 用于制造液晶显示设备的方法
WO2019033538A1 (fr) Procédé de fabrication pour panneau d'affichage à delo
CN110265429A (zh) 显示单元
US7518668B2 (en) Display device having horizontal power transformer configuration
CN100443973C (zh) 显示装置及其可拆卸式散热结构
WO2013004053A1 (fr) Dispositif, procédé, exemple de table et dispositif de source lumineuse de réalisation d'angle pré-incliné de panneau à cristaux liquides
US20040125268A1 (en) Liquid crystal display device
CN101566754A (zh) 液晶显示设备
WO2015030428A1 (fr) Stratifié optique antireflet
KR101830243B1 (ko) 백라이트 어셈블리의 보호필름 박리시스템
KR101267084B1 (ko) 액정모듈
WO2013109023A1 (fr) Procédé de liaison optique et de durcissement
CN107655899A (zh) 光学检测机
WO2019093774A1 (fr) Procédé de fabrication de fenêtre intelligente
WO2020125467A1 (fr) Panneau d'affichage, dispositif d'affichage et procédé de fabrication de panneau d'affichage
CN109901314A (zh) 光学检测装置及光学检测方法
WO2016043521A1 (fr) Composition d'adhésif, film adhésif optique et panneau d'écran tactile
KR101536990B1 (ko) 곡면 표시장치 및 그 제조방법
KR20140008280A (ko) 광 경화 합착 방법
CN208271494U (zh) 一种led显示屏
US20090115956A1 (en) Device for cooling lcd panel and heat treatment apparatus having the same
KR101649701B1 (ko) 자동 솔더링 장비 및 이를 이용한 액정표시장치의 제조방법
WO2016043520A1 (fr) Composition d'adhésif pour panneau d'écran tactile, film adhésif optique et panneau d'écran tactile

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13738919

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 15/01/2015)

122 Ep: pct application non-entry in european phase

Ref document number: 13738919

Country of ref document: EP

Kind code of ref document: A1