WO2013109023A1

WO2013109023A1 - Method for optical bonding and hardening

Info

Publication number: WO2013109023A1
Application number: PCT/KR2013/000272
Authority: WO
Inventors: 유승명
Original assignee: 주식회사 디엠케이
Priority date: 2012-01-20
Filing date: 2013-01-14
Publication date: 2013-07-25
Also published as: KR20130085657A

Abstract

The present invention relates to a method for optical bonding and hardening, and more specifically, to a method for optical bonding and hardening comprising: a first hardening step of irradiating with a single wavelength UV light source device a surface of a coupled substrate comprising a lower substrate and an upper substrate that are coupled, and hardening same; and a second hardening step of irradiating with a multi-wavelength UV light source device the surface of the coupled substrate that has undergone the first hardening step, and hardening same, thereby using the two hardening steps to overcome the shortcoming of bending in the substrate by reducing heat that is generated when hardening the coupled substrate, which is vulnerable to heat, and to enhance productivity of the substrate by reducing the long time required for multi-wavelength hardening in existing methods.

Description

Light bonding curing method

The present invention relates to a light-bonding curing method, and more particularly, to reduce the heat generated during the curing of the heat-sensitive bonding substrate by the second curing step to overcome the disadvantages of bending the substrate, the existing long multi-wavelength curing The present invention relates to a light bonding curing method having an effect of shortening time and improving productivity of a substrate.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescence (VFDs) have been developed. Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, liquid crystal display (LCD) is the most widely used, replacing the CRT (Cathode Ray Tube) for mobile image display devices due to the advantages of excellent image quality, light weight, thinness, and low power consumption. In addition to the mobile use such as a computer monitor, various developments have been made such as a television and a computer monitor for receiving and displaying broadcast signals.

As described above, although various technical advances have been made in the liquid crystal display device to serve as a screen display device in various fields, there are many aspects in which the operation of improving the image quality as the screen display device is arranged with the above characteristics and advantages. .

Therefore, in order to use a liquid crystal display device in various parts as a general screen display device, the key to power generation is how to realize high quality images such as high brightness and large area while maintaining the characteristics of light weight, thinness, and low power consumption.

As a method for manufacturing a liquid crystal display device as described above, a liquid crystal injection method of injecting a liquid crystal through an injection hole of a sealing material after a pattern drawing of a sealing material so as to form an injection hole on one substrate, and then bonding the substrate in vacuum, and a liquid crystal are suitable. The other substrate prepared by the pattern which cut off the sealing material was prepared so that one board | substrate and an injection hole may not be provided, Then, the said other board | substrate is arrange | positioned on the said one board | substrate, and the upper and lower board | substrate are closely approached in vacuum. There is a liquid crystal compatibility method to be bonded to each other, and when the bonding of the substrate is completed through the bonding method as described above is subjected to a curing process.

However, there is a problem that warpage occurs in the plywood due to the heat generated during the curing process and the product is deformed due to the heat of curing.

In order to solve the problems of the prior art as described above, the present invention overcomes the disadvantages of the bending of the substrate by reducing the heat generated during curing of the weakly bonded substrate, and improves the productivity of the substrate by shortening the existing long multi-wavelength curing time. An object of the present invention is to provide a light bonding curing method.

The above and other objects of the present invention can be achieved by the present invention described below.

In order to achieve the above object, the present invention is a surface of the bonded substrate after the first curing step and the first curing step of curing by irradiating with a UV light source of a single wavelength on the surface of the bonded substrate bonded to the lower substrate and the upper substrate It provides a light bonding curing method comprising a second curing step of curing by irradiating with a UV light source of a multi-wavelength.

As described above, according to the present invention, the heat generated during curing of the weakly bonded substrate through the single wavelength and the multi-wavelength curing is reduced to overcome the disadvantages of the warpage of the substrate, and the existing long multi-wavelength curing time is shortened. This has the effect of improving productivity.

Figure 1 schematically shows a UV light source device of a single wavelength used in the first curing step.

Figure 2 schematically shows a multi-wavelength UV light source device used in the second curing step .

3 schematically shows a UV light source of multiple wavelengths used in the second curing step .

4 and 5 show a part of the substrate for measuring the results of the following Examples and Comparative Examples.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the invention may be modified in various forms, the scope of the invention should not be construed as limited to the embodiments described below. These embodiments are provided to explain in detail the present invention to those skilled in the art.

The present invention is a UV light source device having a multi-wavelength on the surface of the bonded substrate after the first curing step and the first curing step of curing the irradiation by irradiating with a UV light source device of a single wavelength on the surface of the bonded substrate bonded to the lower substrate and the upper substrate It relates to a light bonding curing method comprising a second curing step of curing by irradiation with.

The lower substrate and the upper substrate of the present invention may be a liquid crystal panel and a cover glass, but are not necessarily limited thereto, and may employ a conventional one used in the art.

A jig and a bezel are generally used when the adhesive liquid is applied for bonding the lower substrate and the upper substrate, or when the lower substrate and the upper substrate are bonded. The form or material of the jig is not particularly limited.

The first curing step of the present invention is to apply a pressure-sensitive adhesive and the like on the lower substrate and the upper substrate to cure the surface of the bonded substrate with a single wavelength UV light source device. That is, it refers to the step of first curing the bonded substrate surface using a UV light source.

In the first curing step, the size of the UV light source wavelength can be selected from one of the wavelength range of 320 ~ 420 nm, the amount of light depends on the curing conditions of the pressure-sensitive adhesive, the curing time can be changed according to the UV transmittance of the substrate Within this range, there is an effect of suppressing heat generated excessively from the UV light source when curing to the bonded substrate. The curing time of the first curing step is not particularly limited because it depends on the material of each substrate.

The form of the UV light source of a single wavelength used in the first curing step, etc. may be used that is commonly used in the art, it is not particularly limited. A specific example is shown in FIG. 1 below.

As the UV lamp of the single wavelength UV light source device, an LED or a laser may be used.

The second curing step of the present invention is to cure the bonded substrates subjected to the first curing step with a multi-wavelength UV light source device. That is, this refers to the step of main hardening the surface of the first cured bonded substrate using a UV light source. The size of the UV light source wavelength used in the second curing step may be 320 ~ 420 nm, within this range there is an effect of suppressing excessive heat generated from the UV light source when curing the bonded substrate.

Figure 2 below schematically shows a second curing step of curing using a multi-wavelength UV light source device.

The multi-wavelength UV light source device used in the second curing step may be configured to include a housing 1, the coupling member 2 and the lamp 10, as shown in Figure 3 below.

In the multi-wavelength UV light source device, a lamp 10 may be disposed under the housing part 1 and the housing part 1, and the housing part 1 serves to firmly support the lamp 10. Do it. In this case, the housing 1 is used in the art, and may be used in any form, material, and the like as long as it does not impair the effects of the present invention, and is not particularly limited. The lamp 10 is a conventional one used in the art, and specifically, may be selected and used from a high pressure mercury UV lamp, a metal halide UV lamp, a metal UV lamp, and the like.

Between the lamp 10 and the housing portion 1 is connected to the coupling member 2, the coupling member 2 is disposed on the lower end of the housing portion 1 can move to the left or right.

Properties such as the material, shape, etc. of the coupling member 2 is not particularly limited. When the coupling member 2 is connected to the housing part 1, the upper portion of the coupling member 2 may be configured in a wheel shape or the like so that the coupling member 2 may move. The electrical connection configuration is not particularly limited.

The bonded substrate of the present invention is formed by applying an adhesive liquid between the upper substrate and the lower substrate, and bonding the UV-curable adhesive liquid, but is not necessarily limited thereto.

In the multi-wavelength UV light source device, at least one UV light source, such as a UV lamp, is mounted on an upper portion thereof, and a bonded substrate support (fixture) on which a bonded substrate is loaded and seated is disposed at a lower portion of the light source irradiation device, and the bonded substrate is loaded. It may be configured to include a drive unit for driving the bonded substrate support (fixture) up and down as possible.

In addition, in the multi-wavelength UV light source device, the temperature is increased by the heat generation of the UV light source. In this case, an additional circulation cooling tube (not shown) may be further disposed in order to prevent excessive temperature rise. In order to control the air in the irradiation apparatus, a rotating blowing fan may be further arranged.

The present invention effectively prevents an increase in the device internal temperature and the curing temperature due to the multi-wavelength UV light source device.

Hereinafter, preferred examples are provided to help understanding of the present invention, but the following examples are only exemplified by the present invention, and various changes and modifications within the scope and spirit of the present invention are apparent to those skilled in the art. It is natural that such variations and modifications fall within the scope of the appended claims.

Examples 1 to 3

The first curing step was performed by irradiating UV with a UV light source (LED UV) having a single wavelength (365 nm). After the first curing step, the temperature of the three parts of the substrate was measured at a 30 second interval using a non-contact infrared temperature meter as shown in FIG. 4 (and FIG. 5) below, and the results are shown in Table 1 below.

The second curing step was performed by irradiating UV on the (three) substrates subjected to the first curing step using a multi-wavelength UV light source (mercury UV lamp) having a wavelength of 320 to 420 nm. After the second curing step, as described above, the temperature of the three parts of the substrate was measured at 30 second intervals using a non-contact infrared temperature meter, and the results are shown in Table 2 below.

Comparative Examples 1 to 3

In the same manner as in Example 1, without performing the first curing step with a UV light source having a single wavelength, two curing steps were performed with a multi-wavelength UV light source, as described above, the non-contact temperature of the three parts of the substrate The measurement was performed using an infrared thermometer and the results are shown in Tables 3 to 4 below.

Table 1

TIME (sec)	Example 1 (unit: ℃)			Example 2 (unit: ℃)			Example 3 (unit: ℃)
TIME (sec)	One	2	3	One	2	3	One	2	3
0	30	32	30	29	32	29	31	32	31
30	22	25	22	24	26	24	25	27	24
60	22	23	22	22	24	21	24	25	24
90	20	22	20	22	23	21	22	24	22
120	20	21	20	21	22	20	21	22	20
150	20	21	20	20	21	20	20	21	20
180	20	20	20	20	21	21	20	21	20

TABLE 2

TIME (sec)	Example 1 (unit: ℃)			Example 2 (unit: ℃)			Example 3 (unit: ℃)
TIME (sec)	One	2	3	One	2	3	One	2	3
0	33	34	34	34	33	34	35	34	35
30	28	26	28	29	27	27	29	27	27
60	27	24	26	26	25	26	26	25	25
90	26	24	26	25	24	24	24	24	24
120	24	23	24	24	23	23	23	23	23
150	23	23	23	23	22	22	23	22	22
180	23	22	22	22	22	22	22	22	22
210	22	23	22	22	22	22	22	22	22
240	22	22	21	22	22	21	22	21	21
270	21	21	21	21	21	21	21	21	21

TABLE 3

TIME (sec)	Comparative Example 1 (Unit: ℃)			Comparative Example 2 (unit: ℃)			Comparative Example 3 (Unit: ° C)
TIME (sec)	One	2	3	One	2	3	One	2	3
0	57	59	59	58	59	58	57	62	60
30	46	49	51	47	49	51	51	55	56
60	41	45	48	43	44	49	47	51	52
90	38	42	45	40	41	46	44	48	50
120	35	39	43	38	39	44	41	46	48
150	33	37	40	37	37	42	38	43	45
180	31	34	39	35	36	40	36	41	43
210	30	33	37	34	35	38	35	40	41
240	29	32	36	33	34	37	35	38	39
270	28	31	34	32	34	36	34	36	36
300	28	30	33	31	33	35	32	34	35
330	27	29	32	30	31	34	31	31	34
360	27	29	31	29	30	33	31	30	33
390	26	27	30	28	29	32	30	29	31
420	26	27	30	28	29	31	29	29	30
450	26	27	29	27	27	30	28	28	29
480	26	27	29	26	26	28	27	28	27

Table 4

TIME (sec)	Comparative Example 1 (Unit: ℃)			Comparative Example 2 (unit: ℃)			Comparative Example 3 (Unit: ° C)
TIME (sec)	One	2	3	One	2	3	One	2	3
0	51	52	55	54	55	56	50	53	54
30	42	44	47	48	46	48	45	47	48
60	39	41	44	45	43	44	42	44	46
90	36	38	43	43	40	41	40	42	44
120	34	37	40	42	40	41	40	41	44
150	33	35	39	41	39	41	39	40	43
180	31	34	37	41	39	40	39	40	43
210	31	33	36	39	37	39	39	39	43
240	30	32	35	38	37	38	38	39	42
270	30	31	34	38	36	38	37	37	41
300	29	30	33	37	35	36	35	36	40
330	29	30	32	37	34	36	35	35	39
360	28	29	32	36	34	35	34	34	38
390	28	29	31	35	33	34	33	34	36
420	28	29	30	34	32	33	32	33	35
450	28	28	30	32	31	33	31	32	34
480	28	28	29	31	30	32	31	31	32
510	28	28	29	30	29	31	30	30	31
540	27	28	28	29	29	30	30	29	31
570	27	28	28	27	28	29	29	29	30

In case of using only UV curing device with multiple wavelengths (Comparative Examples 1 to 3), the sample temperature measured immediately after taking out from the curing device is 50 ~ 60 ℃ and the temperature goes down to 20 ~ 30 ℃. It took a long time When using the present UV curing device with a single wavelength UV curing device and a multi-wavelength UV curing device (Examples 1 to 3), the sample temperature measured immediately after removal from the curing device with a single wavelength was 29 to 32 ℃ ( Table 1), and the sample temperature measured immediately after taking out from the curing device was 33 ~ 35 ℃ (Table 2), the time was lowered to 21 ℃ was 270 seconds, it took a short time compared to Comparative Examples 1 to 3 .

That is, in Examples 1 to 3, the heat generated during curing is low, and heat control is possible, and since the generated heat is low, the time taken out from the curing apparatus is lowered to 20 to 30 ° C., which requires more time than Comparative Examples 1 to 3. Productivity is improved.

Furthermore, by changing the lamp head of the UV light source device from the fixed method to the head moving method, the internal temperature can be lowered by eliminating the factor of heat rise due to overheating by changing the irradiation area.

[Description of the code]

1: housing part

2: coupling member

10: lamp

20: substrate

30: bonded substrate support (fixture)

40: drive unit (conveyor)

Claims

A first curing step of irradiating and curing the surface of the bonded substrate on which the lower substrate and the upper substrate are bonded with a single wavelength UV light source device; And

And a second curing step of irradiating and curing the surface of the bonded substrate having passed through the first curing step with a multi-wavelength UV light source device.
The method of claim 1,

The size of the wavelength of the light source of the single wavelength UV light source device and the light source of the multi-wavelength UV light source device is 320 ~ 420 nm characterized in that the light bonding curing method.
The method of claim 1,

The multi-wavelength UV light source device includes a lamp,

And a housing part disposed above the lamp.
The method of claim 3, wherein

Between the housing portion and the lamp is connected to the coupling member,

And the coupling member is disposed at the lower end of the housing to move left or right.
The method of claim 1,

And the lamp of the single wavelength UV light source device is an LED or a laser.
The method of claim 1,

The lamp of the multi-wavelength UV light source device is a light bonding curing method, characterized in that selected from high-pressure mercury UV lamp, metal halide UV lamp and metal UV lamp.
The method of claim 1,

And a UV-curable adhesive liquid applied between the upper substrate and the lower substrate and bonded to each other.