WO2013106486A1 - Cleanspace fabricators for high technology manufacturing and assembly processing - Google Patents
Cleanspace fabricators for high technology manufacturing and assembly processing Download PDFInfo
- Publication number
- WO2013106486A1 WO2013106486A1 PCT/US2013/020904 US2013020904W WO2013106486A1 WO 2013106486 A1 WO2013106486 A1 WO 2013106486A1 US 2013020904 W US2013020904 W US 2013020904W WO 2013106486 A1 WO2013106486 A1 WO 2013106486A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- cleanspace
- tool
- fabricator
- processing
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Definitions
- the present invention relates to apparatus and methods which support processing tools used in conjunction with cleanspace fabricators. More specifically, the present invention relates to fabricator designs which may be used to process high technology products and assemble them into a packaged form. BACKGROUND OF THE INVENTION
- processing tools are arranged to provide aisle space for human operators or automation equipment.
- Exemplary cleanroom design is described in: “Cleanroom Design, Second Edition,” edited by W. Whyte, published by John Wiley & Sons, 1999, ISBN 0- 471-94204-9, (herein after referred to as "the Whyte text").
- Cleanroom design has evolved over time from an initial starting point of locating processing stations within clean hoods. Vertical unidirectional airflow can be directed through a raised floor, with separate cores for the tools and aisles. It is also known to have specialized mini-environments which surround only a processing tool for added space cleanliness. Another known approach includes the "ballroom” approach, wherein tools, operators and automation all reside in the same cleanroom.
- the processing of high technology products may typically be split into portions that require high levels of cleanliness in the manufacturing environment which are typically at the beginning of the processing and then steps like the assembly steps which have less critical contamination sensitive processing.
- these two types of processing steps may be processed in different facilities because of their different needs.
- the need for rapid processing of all steps to result in a product that can be utilized in its fully processed form may be important. It would therefore be useful to have an efficient processing fabricator design that can process the different types of steps of multiple cleanliness requirements in a single location with rapidity.
- the various type of processing tools can be placed with each port inside the first cleanspace and the body of each processing tool can be placed at a location peripheral to the cleanspace boundary wall, such that in some embodiments at least a portion of the tool body is outside the first cleanspace.
- the substrate carriers that carry substrates while they move in the first cleanspace may be different for the different types of processing and the different types and sizes of substrates.
- a combination of multiple discrete but collocated cleanspace fabricators may be formed and used to process high technology substrates which start in wafer form and are later are substrates processed in forms related to pieces of the wafer form.
- a combination of multiple cleanspace fabricators which are joined but have separate primary cleanspace regions for the different forms of processing is also possible.
- a cleanspace fabricator of one type may be combined with another of a different type for the two different types of substrate processing.
- the present invention can therefore include methods and apparatus for: processing high technology substrates of different types in collocated environments and forming products of different types in some embodiments including wafers in a complete form, and in some embodiments packaged electronic components.
- Fig. 1 Illustrates some exemplary cleanspace fabricators
- Fig. 2 Illustrates an exemplary set of collocated cleanspace fabricators for different types of processing in a single location.
- Fig. 3 Illustrates an exemplary embodiment where two different cleanspace environments are created in a single cleanspace fabricator design with an intermediate wall.
- Fig. 5 Illustrates an exemplary cleanspace fabricator for processing multiple types of substrates where a single cleanspace environment is utilized with multiple and varied types of automation.
- Fig. 6 Illustrates examples depicting different types of substrate carriers that might be processed in different processing tools including a single wafer carrier, a multiple wafer carrier and an exemplary waffle pack carrier.
- the present invention relates to methods and apparatus to process substrates of different types in cleanspace fabricator environments.
- substrates in the form of wafers may be processed to create integrated circuits upon the substrate and then in subsequent processing the integrated circuits can be processed to result in a discrete integrated circuit in its packaging.
- Cleanspace fabricators may come in numerous different types. Proceeding to Fig. 1, a number of exemplary cleanspace fabricators are depicted. In item 110, a fabricator is depicted which is made up of numerous essentially planar cleanspace fabricators elements which are connected together. In item 120, a single standalone planar cleanspace is depicted. Item 130, depicts a round tubular annular cleanspace fabricator type. And, item 140 depicts a square exemplary tubular annular cleanspace fabricator type. It may be apparent that many different variations on these fundamental types of fabricators are included in the general art of cleanspace fabricators.
- Microelectromechanical systems "Lab on Chip” processing, Biochip processing, and many other examples including the processing of substrates which support device production or are incorporated into devices as they are produced. Without losing the generality and purely for exemplary purposes, some examples that relate to the processing of semiconductor substrates will be used to illustrate the inventive art being described.
- Item 210 depicts a first cleanspace element, which in an exemplary sense, may show a cleanspace fabricator where the substrate type is semiconductor wafers and the equipment or tools used to process semiconductor wafers into integrated circuits on wafers may be depicted for example as item 245.
- Item 210 is a cleanspace fabricator, and one embodiment type of such a fabricator may have the following distinguishing characteristics.
- the fabricator has a cleanspace, item 270, which is bounded by walls which span numerous tooling levels.
- items 250, 255, 260 and 265 may define walls surrounding the cleanspace 270.
- cleanspace 270 may be located the ports of various processing tools, for example, one of which is depicted as item 240.
- the body of the processing tool may be represented as item 245.
- airflow to create the clean environment of the cleanspace may proceed in a unidirectional manner from and through wall 250 to and through wall 255.
- the direction of the flow may be reversed.
- the flow may proceed from wall 250 to wall 255 but do so in a non-unidirectional manner.
- walls 260 and 265 may simply be smooth faced walls which do not relate to the flow of air around them, alternatively the walls may either correspond to air source walls or to air receiving walls.
- the nature of the air source walls may be defined by placing HEPA filters upon the wall and either flowing air through the wall and then through the HEPA Filters or alternatively flowing air to the HEPA filters and then flowing the air out of the filter surface into the cleanspace.
- HEPA filters may be placed upon the wall and either flowing air through the wall and then through the HEPA Filters or alternatively flowing air to the HEPA filters and then flowing the air out of the filter surface into the cleanspace.
- the cleanspace type where the airflow in unidirectional fashion or in non-unidirectional fashion may be flowed from the top of the cleanspace to the bottom.
- the processing tools may be arranged in a vertical and horizontal manner which in some embodiments may be termed a matrix; that is where tools are generally located at discrete vertical heights or levels and then at various horizontal locations between two standard vertical limits.
- a wafer in such a completed form may then be ready to be further processed in manners that may require cleanspace processing but at a significantly less severe cleanliness requirement.
- cleanspace fabricators provide an innovative manner to continue such processing.
- a similar essentially planar cleanspace fabricator, item 220 may be located in the general vicinity of fabricator 210.
- the cleanspace, 280, of this fabricator 220 may as mentioned be operated at a lower cleanliness requirement when compared to cleanspace 270.
- testing may characterize defectivity aspects of the wafer processing as for example incorporated particulates, missing or extra features on the processed device or other measures of defectiveness. There may be numerous forms of testing that may occur on the substrate which has been processed in a first type of cleanspace environment.
- wafer processing that can occur in an "assembly" portion of a multiple substrate cleanspace fabricator may relate to the general processing steps classified as "Wafer Level Packaging” steps. In these steps the thinning, coating and other processing steps to create interconnects and encapsulated package elements are all performed on a wafer level format.
- substrates in die form may be attached, glued, affixed or bonded to various forms of metal or insulator packaging.
- the packages that the dies are mounted to may typically have electrical leads that comes out of them in between insulating and hermetically sealing regions.
- the connection of metal lines from the integrated circuits to the package leads can occur with numerous processing including for example, wire bonding and flip chip or solder bump processing... in some processing conductive adhesives, epoxies or pastes may be applied.
- Thermal processing and annealing may be performed on the wafers, dies or packaged die forms. There may be many other types of processing standard in the art of packaging that would comprise different types of tooling in the exemplary fabricator 220.
- item 300 a representation of a different way to configure a cleanspace fabricator to process different types of substrates is shown.
- Item 310 may represent a cleanspace, in an exemplary sense, that is of high cleanliness specification, consistent with processing of integrated circuits into semiconductor substrates.
- item 320 may represent the lower cleanliness specification cleanspace environment consistent with "assembly" processing.
- the two cleanliness environments may be formed in this embodiment type by the insertion of a physical separation, shown as item 330, with an essentially planar fabricator type.
- Item 330 may be as simple as a wall, or as shown may be two walls on each fabricator element side with various equipment running in between. As mentioned before there may be numerous means to establish the cleanliness of the cleanspace environment through various types and directions of airflow consistent with the art herein.
- Item 410 and 420 depict simple annular, tubular cleanspace fabricators.
- Item 410 is a round annular tubular cleanspace fabricator and item 411 may represent a typical location of a primary cleanspace in such a fabricator.
- Item 420 may represent a rectilinear annular tubular cleanspace fabricator with its exemplary primary cleanspace represented as item 421.
- item 460 may represent a combination of a first fabricator of type 430 with a second fabricator of type 460.
- Item 461 may represent a first cleanspace environment in this composite fab
- item 462 may represent a second type of cleanspace environment.
- item 470 may be formed by the combination of two versions of fabricator type 440, where the two different primary cleanspace environments are shown as items 471 and 472. This fabricator shares similarity to the type of fabricator depicted in item 300.
- Item 480 may have two different primary cleanspace regions, items 481 and 482. And, in some embodiments, item 483 may represent a third cleanspace region. It may be apparent that the generality of combining two different cleanspace elements to form a composite fabricator may be extended to cover fabs made from combinations of 3 or more fabricator cleanspace elements.
- the cleanliness of the cleanspace environment, 570 may be uniformly at the highest specification required for any of the processing in the fabricator environment. In such embodiments, therefore, the environment may exceed the needs of other processing steps that are performed within it. Since there may be multiple types of substrates processed in the environment, as for example wafers and die form, there may need to be two different types of automation present to move substrates from tool port to tool port.
- item 520 may represent a robot that is capable of moving wafer carriers through the use of a robotic arm 521.
- item 530 may represent a piece of automation that is capable of moving die carriers through use of a different robotic arm 531, from tool port to tool port.
- such a tool might include a tool for dicing wafer into die.
- carriers with wafers would be input into the tool through one port shown for example as item 550 and then die carriers may leave the tool through tool port 551.
- substrates in various types of carriers may also exit the fabricator environment through a processing tool to an external environment like 580 as well.
- any of the cleanspace fabricator embodiments where multiple types of substrates are processed within a single type of cleanspace environment there may be need for multiple types of automation. This may be true for the type of single fabricator environment shown in item 500 or alternatively for the composite types shown previously where multiple substrate types are processed. It may be clear, that another embodiment may derive where the automation devices, like item 520, are capable of handling multiple substrate carrier types.
- the substrate piece may include a semiconductor wafer where the wafer has a dimension of roughly 2 inches. In other embodiments the substrate piece may include a semiconductor wafer where the wafer has a dimension of 8, 12 or 18 inches. In still further embodiments, the substrate piece may be a round, square or sheet which includes semiconductor, metallic and/or insulating material
- item 620 may represent a multiple substrate carrier where items 621 are the multiple substrates.
- substrates which include but are not limited to the types discussed in the previous discussion of a single substrate carrier.
- Some examples of such a carrier might include SMIF pods and FOUPS in the semiconductor industry.
- some substrate types may be defined from pieces of a larger substrate which has been cut into smaller segments. These pieces may be carried around in various types of carriers.
- An example may be a "waffle pack" 630 where the carrier has multiple wells or chambers 631 into which the segmented substrates may be placed and then carried for further processing.
- a cleanspace fabricator may be capable of processing numerous types of substrates where the substrate processing needs to occur in a clean environment. Although examples of certain substrates have been included, the spirit of the invention is intended to embrace the inclusion of all the different types of substrates that may be processed in a cleanspace fabricator.
- Air receiving wall a boundary wall of a cleanspace that receives air flow from the cleanspace.
- Air source wall a boundary wall of a cleanspace that is a source of clean airflow into the cleanspace.
- Annular The space defined by the bounding of an area between two closed shapes one of which is internal to the other.
- Automation The techniques and equipment used to achieve automatic operation, control or transportation.
- Ballroom A large open cleanroom space devoid in large part of support beams and walls wherein tools, equipment, operators and production materials reside.
- Batches A collection of multiple substrates to be handled or processed together as an entity
- Boundaries A border or limit between two distinct spaces - in most cases herein as between two regions with different air particulate cleanliness levels.
- Circular A shape that is or nearly approximates a circle.
- Cleanspace A volume of air, separated by boundaries from ambient air spaces, that is clean.
- Cleanspace Fabricator A fabricator where the processing of substrates occurs in a cleanspace that is not a typical cleanroom, in many cases because there is not a floor and ceiling within the primary cleanspace immediately above and below each tool body's level; before a next tool body level is reached either directly above or below the first tool body.
- Cleanspace, Primary A cleanspace whose function, perhaps among other functions, is the transport of jobs between tools.
- Cleanspace, Secondary A cleanspace in which jobs are not transported but which exists for other functions, for example as where tool bodies may be located.
- Cleanroom A cleanspace where the boundaries are formed into the typical aspects of a room, with walls, a ceiling and a floor.
- Cleanroom Fabricator A fabricator where the primary movement of substrates from tool to tool occurs in a cleanroom environment; typically having the characteristics of a single level, where the majority of the tools are not located on the periphery.
- Core A segmented region of a standard cleanroom that is maintained at a different clean level. A typical use of a core is for locating the processing tools.
- Dicing A process of cutting out segments of a substrate into smaller discrete entities sometimes called chips, dice or die.
- Ducting Enclosed passages or channels for conveying a substance, especially a liquid or gas - typically herein for the conveyance of air.
- Envelope An enclosing structure typically forming an outer boundary of a
- Fabricator Cleanspace The portion of a cleanspace fabricator where the primary movement of substrates from tool to tool occurs; which is a primary cleanspace environment that is not a cleanroom environment; typically having the characteristics of multiple levels, where the majority of the tools are located on the periphery. When there are multiple Fabricator Cleanspaces within a single location they may be separated spatially and/or have different characteristics of the primary cleanspace such as a different ambient particle level for example.
- Folding A process of adding or changing curvature.
- HEPA An acronym standing for high-efficiency particulate air. Used to define the type of filtration systems used to clean air.
- Horizontal A direction that is, or is close to being, perpendicular to the direction of gravitational force.
- Job A collection of substrates or a single substrate that is identified as a processing unit in a fab. This unit being relevant to transportation from one processing tool to another.
- Laminar Flow When a fluid flows in parallel layers as can be the case in an ideal flow of cleanroom or cleanspace air. If a significant portion of the volume has such a characteristic, even though some portions may be turbulent due to physical obstructions or other reasons, then the flow can be characterized as in a laminar flow regime or as laminar.
- Logistics can also encompass defining the correct tooling to perform a processing step and the scheduling of a processing step.
- Matrix An essentially planar orientation, in some cases for example of tool bodies, where elements are located at discrete intervals along two orthogonal axes directions.
- Multifaced A shape having multiple faces or edges.
- Nonsegmented Space A space enclosed within a continuous external boundary, where any point on the external boundary can be connected by a straight line to any other point on the external boundary and such connecting line would not need to cross the external boundary defining the space.
- Peripheral Of, or relating to, a periphery.
- Periphery With respect to a cleanspace, refers to a location that is on or near a
- a tool located at the periphery of a primary cleanspace can have its body at any one of the following three positions relative to a boundary wall of the primary cleanspace: (i) all of the body can be located on the side of the boundary wall that is outside the primary cleanspace, (ii) the tool body can intersect the boundary wall or (iii) all of the tool body can be located on the side of the boundary wall that is inside the primary cleanspace. For all three of these positions, the tool's port is inside the primary cleanspace. For positions (i) or (iii), the tool body is adjacent to, or near, the boundary wall, with nearness being a term relative to the overall dimensions of the primary cleanspace.
- Planar Having a shape approximating the characteristics of a plane.
- Plane A surface containing all the straight lines that connect any two points on it.
- Polygonal Having the shape of a closed figure bounded by three or more line
- Robot A machine or device, that operates automatically or by remote control, whose function is typically to perform the operations that move a job between tools, or that handle substrates within a tool.
- Substrates A body or base layer, forming a product, that supports itself and the result of processes performed on it.
- a tool can have the capability of interfacing with automation for handling jobs of substrates.
- a tool can also have single or multiple integrated chambers or processing regions.
- a tool can interface to facilities support as necessary and can incorporate the necessary systems for controlling its processes.
- Tool Body That portion of a tool other than the portion forming its port.
- Tool Port That portion of a tool forming a point of exit or entry for jobs to be
- Tubular Having a shape that can be described as any closed figure projected along its perpendicular and hollowed out to some extent.
- Unidirectional Describing a flow which has a tendency to proceed generally along a particular direction albeit not exclusively in a straight path. In clean airflow, the unidirectional characteristic is important to ensuring particulate matter is moved out of the cleanspace.
- Unobstructed removability refers to geometric properties, of fabs constructed in accordance with the present invention, that provide for a relatively
- Utilities A broad term covering the entities created or used to support fabrication environments or their tooling, but not the processing tooling or processing space itself. This includes electricity, gasses, airflows, chemicals (and other bulk materials) and environmental controls (e.g., temperature).
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147019197A KR20140112020A (en) | 2012-01-11 | 2013-01-09 | Cleanspace fabricators for high technology manufacturing and assembly processing |
SG11201403183XA SG11201403183XA (en) | 2012-01-11 | 2013-01-09 | Cleanspace fabricators for high technology manufacturing and assembly processing |
CN201380005035.8A CN104081497B (en) | 2012-01-11 | 2013-01-09 | Cleanspace fabricators for high technology manufacturing and assembly processing |
IL233403A IL233403A0 (en) | 2012-01-11 | 2014-06-26 | Cleanspace fabricators for high technology manufacturing and assembly processing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261585368P | 2012-01-11 | 2012-01-11 | |
US61/585,368 | 2012-01-11 |
Publications (1)
Publication Number | Publication Date |
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WO2013106486A1 true WO2013106486A1 (en) | 2013-07-18 |
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ID=48781878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2013/020904 WO2013106486A1 (en) | 2012-01-11 | 2013-01-09 | Cleanspace fabricators for high technology manufacturing and assembly processing |
Country Status (6)
Country | Link |
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KR (1) | KR20140112020A (en) |
CN (1) | CN104081497B (en) |
IL (1) | IL233403A0 (en) |
SG (2) | SG10201608779VA (en) |
TW (1) | TWI608980B (en) |
WO (1) | WO2013106486A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060286920A1 (en) * | 2005-06-18 | 2006-12-21 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US20070055404A1 (en) * | 2005-08-26 | 2007-03-08 | Flitsch Frederick A | Method and apparatus for an elevator system for a multilevel cleanspace fabricator |
US20070059130A1 (en) * | 2005-08-18 | 2007-03-15 | Flitsch Frederick A | Method and apparatus to support a cleanspace fabricator |
US20070269296A1 (en) * | 2005-09-18 | 2007-11-22 | Flitsch Frederick A | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
US20100209226A1 (en) * | 2005-06-18 | 2010-08-19 | Flitsch Frederick A | Method and apparatus to support process tool modules in a cleanspace fabricator |
US20110245964A1 (en) * | 2010-04-06 | 2011-10-06 | Sullivan Robert P | Self Aligning Automated Material Handling System |
US20120214396A1 (en) * | 2005-06-18 | 2012-08-23 | Flitsch Frederick A | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
-
2013
- 2013-01-04 TW TW102100338A patent/TWI608980B/en active
- 2013-01-09 KR KR1020147019197A patent/KR20140112020A/en not_active Application Discontinuation
- 2013-01-09 CN CN201380005035.8A patent/CN104081497B/en active Active
- 2013-01-09 SG SG10201608779VA patent/SG10201608779VA/en unknown
- 2013-01-09 SG SG11201403183XA patent/SG11201403183XA/en unknown
- 2013-01-09 WO PCT/US2013/020904 patent/WO2013106486A1/en active Application Filing
-
2014
- 2014-06-26 IL IL233403A patent/IL233403A0/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060286920A1 (en) * | 2005-06-18 | 2006-12-21 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US20080138179A1 (en) * | 2005-06-18 | 2008-06-12 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US20080146142A1 (en) * | 2005-06-18 | 2008-06-19 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US20100209226A1 (en) * | 2005-06-18 | 2010-08-19 | Flitsch Frederick A | Method and apparatus to support process tool modules in a cleanspace fabricator |
US20120214396A1 (en) * | 2005-06-18 | 2012-08-23 | Flitsch Frederick A | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
US20070059130A1 (en) * | 2005-08-18 | 2007-03-15 | Flitsch Frederick A | Method and apparatus to support a cleanspace fabricator |
US20070055404A1 (en) * | 2005-08-26 | 2007-03-08 | Flitsch Frederick A | Method and apparatus for an elevator system for a multilevel cleanspace fabricator |
US20070269296A1 (en) * | 2005-09-18 | 2007-11-22 | Flitsch Frederick A | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
US20110245964A1 (en) * | 2010-04-06 | 2011-10-06 | Sullivan Robert P | Self Aligning Automated Material Handling System |
Also Published As
Publication number | Publication date |
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TW201339074A (en) | 2013-10-01 |
CN104081497A (en) | 2014-10-01 |
SG11201403183XA (en) | 2014-09-26 |
KR20140112020A (en) | 2014-09-22 |
IL233403A0 (en) | 2014-08-31 |
CN104081497B (en) | 2017-02-22 |
TWI608980B (en) | 2017-12-21 |
SG10201608779VA (en) | 2016-12-29 |
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