WO2013105242A1 - Procédé permettant de former un film anti-salissures - Google Patents

Procédé permettant de former un film anti-salissures Download PDF

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Publication number
WO2013105242A1
WO2013105242A1 PCT/JP2012/050443 JP2012050443W WO2013105242A1 WO 2013105242 A1 WO2013105242 A1 WO 2013105242A1 JP 2012050443 W JP2012050443 W JP 2012050443W WO 2013105242 A1 WO2013105242 A1 WO 2013105242A1
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WIPO (PCT)
Prior art keywords
pressure
film
substrate
antifouling film
substrate holder
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PCT/JP2012/050443
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English (en)
Japanese (ja)
Inventor
充祐 宮内
一郎 塩野
真悟 佐守
友松 姜
亦周 長江
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株式会社シンクロン
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Priority to PCT/JP2012/050443 priority Critical patent/WO2013105242A1/fr
Priority to TW101105039A priority patent/TW201328849A/zh
Publication of WO2013105242A1 publication Critical patent/WO2013105242A1/fr

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process

Definitions

  • the present invention relates to a method for forming an antifouling film having abrasion resistance that can withstand practical use.
  • a surface of a substrate such as glass or plastic is provided with a flaw having a depth of 10 to 400 nm so as to have a streaky fine uneven surface in a predetermined direction, and then a predetermined composition is formed on the fine uneven surface.
  • a method for forming an antifouling film is known (Patent Document 1).
  • an antifouling film having abrasion resistance that can withstand practical use.
  • the inventors of the present invention have a wear resistance that can withstand practical use by starting film formation after adjusting the pressure in the container to a pressure within the optimum range determined based on the size of the vacuum container (that is, the chamber size).
  • the present inventors have found that an antifouling film having properties can be formed.
  • the antifouling film source is disposed below the vacuum vessel, the substrate holder is disposed above the vacuum vessel so as to be capable of rotating about a vertical axis, and the pressure inside the vacuum vessel is further increased.
  • a film forming apparatus having pressure control means for controlling the substrate is used to hold a plurality of substrates, which are film forming objects, on the substrate holder so as to face the film forming source, and then rotate each substrate holder while rotating the substrate holder.
  • the pressure control means is operated so that the internal pressure of the vacuum vessel is in a pressure range determined based on the size of the vacuum vessel, and the vacuum vessel After the internal pressure is adjusted, the antifouling film is formed by depositing the antifouling film.
  • the distance between the substrate held near the rotation axis of the substrate holder disposed in the chamber and the film forming source of the antifouling film is set, and based on this distance After adjusting the internal pressure of the vacuum container so as to be included in the determined pressure range, the film formation by the film formation source can be started.
  • SS unit: mm
  • SS unit: mm
  • the antifouling film deposition pressure deposition start by the film deposition source
  • P unit is Pa
  • the internal pressure of the vacuum vessel can be adjusted so that P satisfies the relationship of (0.06 / SS) ⁇ P ⁇ (50 / SS).
  • the antifouling film is formed in order to form the antifouling film after the pressure control means is operated to adjust the internal pressure of the vacuum vessel so that the pressure range is determined based on the chamber size. Abrasion can be improved to a level that can withstand practical use.
  • FIG. 1 is a sectional view of a configuration example of a film forming apparatus capable of realizing the method of the present invention as seen from the front.
  • FIG. 2 is an enlarged view of a part of FIG.
  • FIG. 3 is a diagram illustrating a method for determining the presence / absence of a substrate at an arbitrary position on the substrate holder using the distance sensor of FIGS. 1 and 2.
  • a film forming apparatus 1 as an example capable of realizing the method of the present invention includes a vertically placed cylindrical vacuum vessel 2.
  • An exhaust port (not shown) for exhaust is provided near the lower end of the side wall of the vacuum vessel 2.
  • One end of a pipe 23 is connected to the exhaust port, and a vacuum pump 24 is connected to the other end of the pipe 23.
  • the vacuum pump 24 is operated by a command from the controller 52, and the degree of vacuum (pressure) in the container 2 is reduced through the pipe 23.
  • the vacuum vessel 2 is provided with pressure detection means 22 (pressure gauge or the like) that detects the pressure in the vessel 2. Information on the pressure in the container detected by the pressure detection means 22 is sequentially output to the controller 52. When the controller 52 determines that the container internal pressure has reached a predetermined value, this state is maintained.
  • the vacuum pump 24, the pressure detection means 22, and the controller 52 correspond to the “pressure control means” of the present invention.
  • a pressure control unit such as an auto pressure controller (automatic pressure controller (APC)
  • APC automatic pressure controller
  • MFC mass flow controller
  • the pressure in the container 2 can be controlled by introducing a gas such as argon into the container 2.
  • the pump 24, the pressure detection means 22, APC, MFC, the pressure detection means 22, and the controller 52 correspond to the pressure control means.
  • a valve (not shown) is provided in the middle of the pipe 23 connecting the exhaust port of the container 2 and the pump 24, and the pressure in the container 2 is controlled by adjusting the opening of the valve while the pump 24 is operated. You may make it the structure to carry out.
  • the pump 24, the valve, the pressure detection means 22, and the controller 52 correspond to the pressure control means.
  • a stainless steel dome-shaped substrate holder 4a is disposed above the inside of the vacuum vessel 2.
  • the substrate holder 4a is connected to an output shaft (not shown, rotating means) of a motor (not shown, rotating means), and is rotatable around its vertical axis.
  • the substrate holder 4a has a concavely curved substrate holding surface on the inner surface (the surface on the lower side in the vertical direction).
  • a plurality of substrates 101 are held by contact.
  • An opening is provided at the center of the substrate holder 4a, and a crystal monitor 50 is provided here.
  • the crystal monitor 50 detects the physical film thickness formed on the surface of each substrate 101 by the film thickness detector 51 from the change in the resonance frequency due to the deposition material adhering to the surface.
  • the film thickness detection result is sent to the controller 52.
  • An electric heater 53 is disposed inside the vacuum vessel 2 so as to wrap the entire substrate holder 4a.
  • the temperature of the substrate holder 4 a is detected by a temperature sensor 54 such as a thermocouple, and the result is sent to the controller 52.
  • the controller 52 appropriately controls the temperature of the substrate 101 by controlling the electric heater 53 using the output from the temperature sensor 54.
  • an evaporation source 36 and a distance sensor 39 for adhering the film forming raw material to the substrate 101 held by the substrate holder 4a are arranged in a spaced state.
  • the evaporation source 36 is a resistance heating type evaporation source such as a direct heating method or an indirect heating method, and a crucible (boat) having a recess for placing a film forming material on the upper part. 36b, and a shutter 36a provided so as to be openable and closable at a position where the film forming raw material from the crucible 36b toward the substrate 101 is blocked.
  • a direct heating method an electrode is attached to a metal boat and an electric current is passed, and the metal boat is directly heated to use the boat itself as a resistance heater, and the film forming raw material placed in the boat is heated.
  • the indirect heating method is a method in which a boat is not a direct heat source, but is heated by passing a current through a heating device provided separately from the boat, for example, a vapor deposition filament made of a rare metal such as a transition metal.
  • a heating device provided separately from the boat, for example, a vapor deposition filament made of a rare metal such as a transition metal.
  • the distance sensor 39 (an example of a distance measuring mechanism) is an optical distance sensor (laser displacement meter, triangular distance measuring method) with a tilt mechanism in this example.
  • the distance sensor 39 first irradiates light in the vicinity of the rotation axis of the substrate holder 4a rotating around the vertical axis while holding each substrate 101. Next, the reflected light or diffused light of the irradiated light is received, and the light receiving position and the light receiving intensity are detected based on the received light, and then predetermined processing is performed.
  • the distance Sx (x is each substrate held in the vicinity of the rotation axis of the substrate holder 4a) between the sensor 39 and the specific substrate 101 actually held in the vicinity of the rotation axis of the substrate holder 4a, detected by such processing.
  • the unit is mm. The same applies hereinafter) and information on the tilt angle ⁇ of the sensor body with respect to the vertical direction at that time are output to the controller 52 (see FIGS. 1 and 2).
  • the controller 52 receives outputs from the film thickness detector 51 and the temperature sensor 54 and outputs predetermined commands to the electric heater 53 and the shutter 36a as well as outputs from the distance sensor 39.
  • the controller 52 operates the pressure control means (in this example, the vacuum pump 24 and the pressure detection means 22) based on the input information from the distance sensor 39, and the degree of vacuum inside the container 2 (that is, the pressure at the start of film formation). ) Is adjusted to an appropriate state.
  • a film forming raw material for the antifouling film filled in the boat of the evaporation source 36 for example, an organic compound having at least one hydrophobic group and at least one reactive group capable of binding to a hydroxyl group in one molecule (
  • a material capable of forming a thin film (antifouling film) composed of “hydrophobic reactive organic compound” is used.
  • the hydrophobic reactive organic compound include a fluorine-containing organic compound containing a polyfluoroether group or a polyfluoroalkyl group.
  • examples of products include Canon Optron's OF-SR (oil repellent) and OF-110 (water repellent).
  • the form of the film forming raw material is not particularly limited, and for example, (a) a porous ceramic impregnated with a hydrophobic reactive organic compound, or (b) a hydrophobic reactive organic in a metal fiber or a lump of fine wires. Those impregnated with a compound can be used. They can quickly absorb and evaporate large amounts of hydrophobic reactive organic compounds.
  • the porous ceramic is preferably used in the form of pellets from the viewpoint of handling properties.
  • metal fibers or fine wires include iron, platinum, silver, and copper. It is preferable to use a metal fiber or a thin wire having a shape entangled so as to hold a sufficient amount of a hydrophobic reactive organic compound, for example, a woven fabric or a nonwoven fabric.
  • the porosity of the metal fiber or fine wire lump can be determined depending on how much the hydrophobic reactive organic compound is retained.
  • a lump of metal fibers or fine wires held in a container can be regarded as a pellet.
  • the shape of the container is not particularly limited, and examples include a Knudsen type, a divergent nozzle type, a straight cylinder type, a divergent cylinder type, a boat type, and a filament type, and can be appropriately selected depending on the specifications of the vapor deposition apparatus. At least one end of the container is open, and the hydrophobic reactive organic compound evaporates from the open end.
  • metals such as copper, tungsten, tantalum, molybdenum and nickel, ceramics such as alumina, carbon and the like can be used, and the material is appropriately selected depending on the vapor deposition apparatus and the hydrophobic reactive organic compound.
  • Both the porous ceramic pellets and the pellets made of metal fibers or fine wire lumps held in a container are not limited in size.
  • hydrophobic reactive organic compound When impregnating a porous ceramic or metal fiber or fine wire lump with a hydrophobic reactive organic compound, first prepare an organic solvent solution of the hydrophobic reactive organic compound, and then make the solution porous by dipping, dropping, spraying, etc. After impregnating the ceramic or metal fiber or fine wire, the organic solvent is volatilized. Since the hydrophobic reactive organic compound has a reactive group (hydrolyzable group), it is preferable to use an inert organic solvent.
  • inert organic solvents examples include fluorine-modified aliphatic hydrocarbon solvents (perfluoroheptane, perfluorooctane, etc.), fluorine-modified aromatic hydrocarbon solvents (m-xylene hexafluoride, benzotrifluoride, etc.), fluorine Modified ether solvents (methyl perfluorobutyl ether, perfluoro (2-butyltetrahydrofuran), etc.), fluorine-modified alkylamine solvents (perfluorotributylamine, perfluorotripentylamine, etc.), hydrocarbon solvents (toluene, xylene, etc.) ), Ketone solvents (acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.). These organic solvents may be used alone or in combination of two or more.
  • the concentration of the hydrophobic reactive organic compound solution is not limited, and can be appropriately set according to the form of
  • the heating of the film forming material is not limited to the resistance heating method, and a halogen lamp, a sheathed heater, an electron beam, a plasma electron beam, induction heating, or the like can also be used.
  • a plurality of substrates 101 are fixed to the substrate holder 4a.
  • a plastic substrate organic glass substrate
  • an inorganic substrate inorganic glass substrate
  • a metal substrate such as stainless steel
  • the thickness thereof is, for example, 0.1 to 5 mm.
  • the inorganic glass substrate which is an example of the substrate 101 include soda lime glass (6H to 7H), borosilicate glass (6H to 7H), and the like.
  • the numbers in parentheses on the inorganic glass substrate are pencil hardness values measured by a method according to JIS-K5600-5-4.
  • a substrate whose shape is processed into, for example, a plate shape or a lens shape is used as the plurality of substrates 101 fixed to the substrate holder 4a.
  • the substrate 101 is preferably wet-cleaned before or after being fixed to the substrate holder 4a.
  • the substrate holder 4a to which the plurality of substrates 101 are fixed is set inside the vacuum vessel 2, and then the pump 24 is operated to start exhausting the vacuum vessel 2. Then, the electric heater 53 is energized to generate heat, and the substrate holder 4a is rotated at a low speed. This rotation makes the temperature of the substrate 101 and the film forming conditions uniform. In this example, together with these, the operation of the distance sensor 39 is also started. Depending on the presence or absence of the substrate 101 in the vicinity of the rotation axis of the substrate holder 4a, the pattern of the light intensity detected by the sensor differs. From this different pattern, the presence or absence of the substrate 101 at the radial position of the substrate holder 4a can be confirmed. (See FIG. 3).
  • the controller 52 receives the output from the distance sensor 39 (information on the distance Sx and the tilt angle ⁇ ), and based on the following formula 1, the specific substrate 101 and the evaporation source 36 held near the rotation axis of the substrate holder 4a. Is calculated.
  • the position information of the evaporation source 36 is defined as (x 0 , 0) in the XY plane, and the position information of the specific substrate 101 is defined as (Sx ⁇ cos ⁇ , Sx ⁇ sin ⁇ ) in the XY plane. (See FIG. 2).
  • the controller 52 further selects a distance SS (unit: mm) that is the maximum value (maximum distance) from the calculated distance Dx, and inputs the value of the selected distance SS into the following equation 2 to obtain the optimum pressure.
  • the range of P (unit is Pa) is calculated.
  • the coefficient of the above formula 2 is a unique coefficient calculated by the present inventors in consideration of the molecular weight of the hydrophobic reactive organic substance used as a film forming raw material, the film forming temperature, and the like. Then, the controller 52 controls the pressure in the container by operating the pressure control means so that the degree of vacuum (pressure) in the vacuum container 2 is in the range of the optimum pressure P. In this example, the film formation of the antifouling film is started in this state. Specifically, it is as follows.
  • the controller 52 determines from the output from the temperature sensor 54 that the temperature of the substrate 101 has reached, for example, room temperature to 120 ° C., preferably 50 to 90 ° C.
  • the controller 52 starts to form an antifouling film.
  • the substrate temperature is less than room temperature, the density of the antifouling film formed is low, and sufficient film durability tends to be not obtained.
  • the substrate temperature exceeds 120 ° C., when a plastic substrate is used as the substrate 101, the substrate 101 may be deteriorated or deformed.
  • the film may be formed at room temperature.
  • the evaporation source 36 is prepared so that the film forming material can be immediately diffused (released) by opening the shutter 36a.
  • the controller 52 opens the shutter 36a and starts vacuum deposition of the film forming material by resistance heating. That is, the film forming process is performed by scattering the film forming material from the evaporation source 36 for 3 to 20 minutes, for example, on the plurality of substrates 101 being rotated. As a result, an antifouling film is formed on each of the plurality of substrates 101 with a predetermined thickness (for example, 1 to 50 nm).
  • the controller 52 continues to monitor the film thickness of the thin film formed on the substrate 101 with the crystal monitor 50, and closes the shutter 36a and stops vapor deposition when the film thickness reaches a predetermined value. Thereby, an antifouling film is formed on each substrate 101.
  • the pressure in the container 2 at the start of film formation by the evaporation source 36 is controlled when the pressure in the container 2 at the start of film formation of the antifouling film is less than (0.06 / SS). This is because the degree of exhaustion becomes too high and the exhaust time becomes long, so that the film formation efficiency of the antifouling film is deteriorated.
  • the raw material for forming the antifouling film organic material
  • a part of the antifouling film tends to re-evaporate when it is formed at a pressure that is too low.
  • the antifouling film molecules constituting the film do not adhere to the substrate 101 precisely and uniformly.
  • the antifouling film is considered to be formed by forming a network (dehydration condensation) between adjacent molecules after the constituent molecules reach the substrate 101, but the antifouling film molecules are uniformly attached on the substrate 101. If not, a portion where the antifouling film is not formed exists on the substrate 101. If there is a non-existing part of the antifouling film, film peeling at the time of friction occurs starting from this part, and as a result, improvement in wear resistance cannot be expected.
  • the antifouling film molecules are applied to the substrate 101 due to a decrease in the mean free path of the antifouling film molecules. It becomes difficult to reach and does not adhere precisely and uniformly.
  • the antifouling film is formed by forming a network (dehydration condensation) between adjacent molecules after the constituent molecules reach the substrate 101, the antifouling film molecules are uniformly attached on the substrate 101. If not, a portion where the antifouling film is not formed is present on the substrate 101, and the film is peeled off at the time of friction starting from the nonexistent portion of the antifouling film. As a result, improvement in wear resistance cannot be expected. .
  • the antifouling film formed in this example is a film having water repellency and oil repellency, and has a function of preventing adhesion of oil stains.
  • “preventing adhesion of oil stains” means not only that oil stains do not adhere, but also that even if they adhere, they can be easily wiped off. That is, the antifouling film maintains oil repellency.
  • the antifouling film formed in this example may be obtained by reciprocating steel wool # 0000 with a load of 1 kg / cm 2 more than 200 times (preferably 400 times, more preferably 600 times). Abrasion resistance is improved to a level that can withstand practical use so that ink with an oil-based pen can be wiped off.
  • the wear resistance is improved in this way, as described above, by appropriately adjusting the internal pressure of the container 2 at the start of film formation by the evaporation source 36, the surface of the substrate 101 is reliably antifouling film. This is because it is filled with molecules so that the non-existing portion of the antifouling film does not exist on the substrate 101.
  • the controller 52 that receives the output from the distance sensor 39 performs a predetermined calculation and holds it near the rotation axis of the substrate holder 4a.
  • a straight line distance Dx connecting the specific substrate 101 and the evaporation source 36 is calculated, and then a distance SS that is a maximum value (maximum distance) is selected from the calculated distance Dx, and the selected maximum distance SS is selected.
  • a predetermined calculation is further performed based on the value to calculate the optimum pressure P at the start of film formation.
  • the controller 52 operates the pressure control means to appropriately control the internal pressure of the container so that the internal pressure of the vacuum container 2 is within the calculated optimum pressure P, and then forms an antifouling film. Thereby, the abrasion resistance of the antifouling film formed on each substrate 101 can be improved to a level that can be practically used.
  • the antifouling film formed by the method of this example even if oil such as fingerprints adhered to the surface is wiped off with a heavy load (for example, a load of about 1 kg / cm 2 ), the constituent components of the antifouling film are not changed. It can be effectively left. That is, according to the present embodiment, it is possible to form an antifouling film having abrasion resistance that can withstand practical use on the substrate 101.
  • a heavy load for example, a load of about 1 kg / cm 2
  • the substrate 101 on which the antifouling film is formed by the method according to this example is used for applications requiring oil repellency, for example, various displays (for example, plasma display panel PDP, cathode ray tube CRT, liquid crystal display LCD, electroluminescence display ELD, etc.); Cases; covers for clocks and instruments; touch surfaces of touch panel electronic devices such as bank ATMs and ticket vending machines; various electronic devices such as mobile phones and personal computers having the above various displays; it can.
  • various displays for example, plasma display panel PDP, cathode ray tube CRT, liquid crystal display LCD, electroluminescence display ELD, etc.
  • Cases covers for clocks and instruments; touch surfaces of touch panel electronic devices such as bank ATMs and ticket vending machines; various electronic devices such as mobile phones and personal computers having the above various displays; it can.
  • the distance sensor 39 is used as an example of the distance measuring mechanism, but the present invention is not limited to this.
  • information (data) that allows the controller 52 to calculate the linear distance Dx that connects the specific substrate 101 and the evaporation source 36 that are held near the rotation axis of the substrate holder 4 a during rotation is sent to the controller 52.
  • Any configuration can be used.
  • the substrate holder 4a was rotated at a speed (RS) of 10 rpm, and the pump 24 was operated to start exhausting the container 2.
  • the operation of the distance sensor 39 (Optex FA, LED distance sensor, product name: DT2) is started, and light is received while continuously irradiating near the rotation axis of the substrate holder 4a during rotation.
  • the measurement results after processing (information on the distance Sx and the tilt angle ⁇ ) were output to the controller 52 one after another.
  • the controller 52 After calculating the distance Dx, the controller 52 calculated the range of the optimum pressure P based on the selected distance SS.
  • the controller 52 confirms that the internal pressure of the container 2 has reached a predetermined pressure (see Table 1) by the output from the pressure detection means 22, this state is maintained under the control of the pressure control means. Then, after the substrate temperature reaches 60 ° C., the shutter 36a is opened, and a film-forming raw material (oil repellent manufactured by Canon Optron, trade name: OF-SR, component name: fluorine-containing organosilicon compound) by the evaporation source 36 is opened. Deposition was started (film formation rate: 1.0 nm / min.). Then, each experimental example sample in which an antifouling film having a thickness of 5 nm was formed on the substrate 101 was obtained.
  • a film-forming raw material oil repellent manufactured by Canon Optron, trade name: OF-SR, component name: fluorine-containing organosilicon compound
  • the controller 52 calculates the optimum pressure P (deposition start pressure) of the antifouling film as 10 ⁇ 4 to 8.5 ⁇ 10 ⁇ 2 Pa, and adjusts the pressure inside the container 2 outside this range. Compared with the samples formed in this manner (Experimental Examples 7 and 8), the usefulness of the samples (Experimental Examples 1 to 6) formed by adjusting the pressure in the container 2 within this range could be confirmed.
  • the optimum pressure P of the antifouling film is calculated by the controller 52 as 5.2 ⁇ 10 ⁇ 5 to 4.3 ⁇ 10 ⁇ 2 Pa, and is adjusted by adjusting the pressure in the container 2 outside this range.
  • the usefulness of the samples (Experimental Examples 9 to 13) formed by adjusting the pressure in the container 2 within this range could be confirmed.
  • the optimum pressure P of the antifouling film is calculated as 3.7 ⁇ 10 ⁇ 5 to 3.1 ⁇ 10 ⁇ 2 Pa by the controller 52, and the pressure inside the container 2 is adjusted outside this range.
  • the usefulness of the samples (Experimental Examples 17 to 20) formed by adjusting the pressure in the container 2 within this range could be confirmed.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention se rapporte à un procédé permettant de former un film anti-salissures qui présente une résistance à l'abrasion qui est suffisante pour permettre une utilisation pratique. Ce procédé de formation d'un film est un procédé consistant à utiliser un dispositif de formation de film (1) qui comprend un moyen de régulation de pression (une pompe à vide (24), un moyen de détection de pression (22), un dispositif de commande (52)) qui régule la pression à l'intérieur d'une chambre à vide (2), à maintenir une pluralité de substrats (101), qui doivent être soumis à une formation de film, contre un support de substrat (4a) de telle manière que les substrats (101) soient orientés vers une source de dépôt (36), et, ensuite, à former un film anti-salissures sur chaque substrat de la pluralité de substrats (101) tout en tournant le support de substrat (4a), le film anti-salissures étant formé après ajustement de la pression à l'intérieur de la chambre à vide (2) par actionnement du moyen de régulation de pression de telle manière que la pression à l'intérieur de la chambre à vide (2) baisse dans les limites d'une plage de pression déterminée sur la base de la distance entre la source de dépôt (36) et le substrat (101) maintenu près de l'axe de rotation du support de substrat (4a). Il est préférable d'ajuster la pression à l'intérieur de la chambre à vide (2) de telle manière que P satisfasse la relation suivante, où la distance entre le substrat (101) et la source de dépôt (36) est fixée à SS (l'unité est le millimètre (mm)) et où la pression de formation d'un film anti-salissures est établie à P (l'unité est le Pascal (Pa)) : (0,06/SS) ≤ P ≤ (50/SS).
PCT/JP2012/050443 2012-01-12 2012-01-12 Procédé permettant de former un film anti-salissures WO2013105242A1 (fr)

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PCT/JP2012/050443 WO2013105242A1 (fr) 2012-01-12 2012-01-12 Procédé permettant de former un film anti-salissures
TW101105039A TW201328849A (zh) 2012-01-12 2012-02-16 防污膜的成膜方法

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05239243A (ja) * 1991-03-15 1993-09-17 Shinkuron:Kk 物体の表面処理方法
JP2005187936A (ja) * 2003-12-02 2005-07-14 Seiko Epson Corp 薄膜の製造方法、光学部品の製造方法および成膜装置
JP2010090454A (ja) * 2008-10-09 2010-04-22 Shincron:Kk 成膜方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05239243A (ja) * 1991-03-15 1993-09-17 Shinkuron:Kk 物体の表面処理方法
JP2005187936A (ja) * 2003-12-02 2005-07-14 Seiko Epson Corp 薄膜の製造方法、光学部品の製造方法および成膜装置
JP2010090454A (ja) * 2008-10-09 2010-04-22 Shincron:Kk 成膜方法

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