WO2013100815A3 - Светодиодный источник белого света с комбинированным удаленным фотолюминесцентным конвертером - Google Patents

Светодиодный источник белого света с комбинированным удаленным фотолюминесцентным конвертером Download PDF

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Publication number
WO2013100815A3
WO2013100815A3 PCT/RU2012/001083 RU2012001083W WO2013100815A3 WO 2013100815 A3 WO2013100815 A3 WO 2013100815A3 RU 2012001083 W RU2012001083 W RU 2012001083W WO 2013100815 A3 WO2013100815 A3 WO 2013100815A3
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WO
WIPO (PCT)
Prior art keywords
radiation
light
converter
opening
leds
Prior art date
Application number
PCT/RU2012/001083
Other languages
English (en)
French (fr)
Other versions
WO2013100815A2 (ru
Inventor
Виталий Николаевич ДЕЙНЕГО
Наум Пинхасович СОЩИН
Владимир Николаевич УЛАСЮК
Original Assignee
Закрытое Акционерное Общество "Научно-Производственная Коммерческая Фирма "Элтан Лтд"
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Закрытое Акционерное Общество "Научно-Производственная Коммерческая Фирма "Элтан Лтд" filed Critical Закрытое Акционерное Общество "Научно-Производственная Коммерческая Фирма "Элтан Лтд"
Priority to JP2014550238A priority Critical patent/JP6126624B2/ja
Priority to KR1020147021431A priority patent/KR20140128979A/ko
Priority to CA2865884A priority patent/CA2865884A1/en
Priority to US14/369,747 priority patent/US20140362557A1/en
Priority to CN201280070399.XA priority patent/CN104272014B/zh
Publication of WO2013100815A2 publication Critical patent/WO2013100815A2/ru
Publication of WO2013100815A3 publication Critical patent/WO2013100815A3/ru

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

Изобретение относится к источникам белого света на основе полупроводниковых светоизлучающих диодов с удаленными фотолюминофорными конвертерами. Сущность изобретения: осветитель содержит теплоотводящее основание с отверстием для выхода излучения, закрепленные по периферии отверстия СИД, излучающие первичное излучение, на удалении от которых с одной стороны отверстия последовательно расположены конвертер первичного излучения, выполненный в виде вогнутого слоя фотолюминесцентного материала, и светоотражатель с вогнутой отражающей свет поверхностью, обращенные вогнутостями к СИД и выходному отверстию, осветитель также содержит второй конвертер излучения, расположенный с другой стороны отверстия, имеющий плоскую или выпуклую форму. Вторичное излучение, образующееся при попадании на поверхность конвертера первичного излучения, выходит в отверстие в теплоотводящем основании и возбуждает фотолюминесцентный материал второго конвертера излучения, приводя к эмиссии третичного излучения, образующийся в результате смешения вторичного и третичного излучения белый свет выходит из второго конвертера.
PCT/RU2012/001083 2011-12-30 2012-12-19 Светодиодный источник белого света с комбинированным удаленным фотолюминесцентным конвертером WO2013100815A2 (ru)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014550238A JP6126624B2 (ja) 2011-12-30 2012-12-19 離れたフォトルミネセンス変換器を組み合わせた白色ｌｅｄ光源
KR1020147021431A KR20140128979A (ko) 2011-12-30 2012-12-19 합성 원격 발광 컨버터가 있는 led 백색 광원
CA2865884A CA2865884A1 (en) 2011-12-30 2012-12-19 Led white light source with a combined remote photoluminescent converter
US14/369,747 US20140362557A1 (en) 2011-12-30 2012-12-19 LED White Light Source with a Combined Remote Photoluminescent Converter
CN201280070399.XA CN104272014B (zh) 2011-12-30 2012-12-19 具有组合的远置光致发光转换层的led白光源

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2011154397/07A RU2502917C2 (ru) 2011-12-30 2011-12-30 Светодиодный источник белого света с комбинированным удаленным фотолюминесцентным конвертером
RU2011154397 2011-12-30

Publications (2)

Publication Number Publication Date
WO2013100815A2 WO2013100815A2 (ru) 2013-07-04
WO2013100815A3 true WO2013100815A3 (ru) 2013-09-26

Family

ID=48698764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU2012/001083 WO2013100815A2 (ru) 2011-12-30 2012-12-19 Светодиодный источник белого света с комбинированным удаленным фотолюминесцентным конвертером

Country Status (7)

Country Link
US (1) US20140362557A1 (ru)
JP (1) JP6126624B2 (ru)
KR (1) KR20140128979A (ru)
CN (1) CN104272014B (ru)
CA (1) CA2865884A1 (ru)
RU (1) RU2502917C2 (ru)
WO (1) WO2013100815A2 (ru)

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Also Published As

Publication number Publication date
JP2015508572A (ja) 2015-03-19
CN104272014B (zh) 2016-08-24
WO2013100815A2 (ru) 2013-07-04
CN104272014A (zh) 2015-01-07
KR20140128979A (ko) 2014-11-06
RU2011154397A (ru) 2013-07-10
RU2502917C2 (ru) 2013-12-27
US20140362557A1 (en) 2014-12-11
CA2865884A1 (en) 2013-07-04
JP6126624B2 (ja) 2017-05-10

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