WO2013091584A1 - Procédé et un dispositif de détection de défauts au sein d'une matrice - Google Patents

Procédé et un dispositif de détection de défauts au sein d'une matrice Download PDF

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Publication number
WO2013091584A1
WO2013091584A1 PCT/CN2013/070388 CN2013070388W WO2013091584A1 WO 2013091584 A1 WO2013091584 A1 WO 2013091584A1 CN 2013070388 W CN2013070388 W CN 2013070388W WO 2013091584 A1 WO2013091584 A1 WO 2013091584A1
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Prior art keywords
substrate
optical
optical detection
defect
detection path
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PCT/CN2013/070388
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English (en)
Chinese (zh)
Inventor
林晓峰
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法国圣戈班玻璃公司
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Publication of WO2013091584A1 publication Critical patent/WO2013091584A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens

Definitions

  • the present application claims priority to Chinese Patent Application No. 201110430121.6, entitled “A Method and Apparatus for Detecting Defects in a Substrate”, filed on December 20, 2011, the entire contents of which are incorporated herein by reference.
  • FIELD OF THE INVENTION The present invention relates to defect detection techniques, and more particularly to a method and apparatus for detecting defects in a substrate.
  • BACKGROUND OF THE INVENTION In the existing transparent substrates, especially in the production process of glass, various causes cause defects and existence, and main defects include scratches, bubbles and stains, etc. How to automatically identify defects of glass is the quality of the production process of the glass production enterprise. Problems that need to be addressed in control and product quality inspection.
  • the automatic optical inspection (AOI) technology is used to detect the defects in the glass, and the surface of the glass is scanned by detecting light (including a laser beam or an LED beam, etc.), and the light of the transmitted light or the reflected light is detected by the detector. Strong changes to detect glass defects.
  • the existing method for detecting the position of defects in the glass by detecting the light scanning glass is: using the detection light to expand into a surface beam through the cylindrical mirror, and the glass, the glass or the glass surface defects such as bubbles, scratches are incident from the side of the thickness of the glass to be inspected.
  • the camera When it becomes a scatterer, the camera performs frontal shooting on the glass to be inspected placed on the loading platform under computer control, and the clear defect image is discriminated by computer image processing and recognition software, and the defect mark and prompt are given;
  • An optical scanning mechanism consisting of a rotating mirror and an f- ⁇ lens is added between the light source generator and the cylindrical mirror, and the detecting light is first converted into a scanning beam along the axial direction of the cylindrical mirror, and then developed into a surface beam by a cylindrical mirror.
  • the defect depth position can be detected.
  • the existing automatic optical detection technology has low resolution, and the correct rate of distinguishing defect types is not high or the type of defects cannot be effectively distinguished at all.
  • the present invention provides a method of detecting defects in a substrate, the substrate having opposing first and second surfaces, the first surface having a plurality of incident points distributed, the method comprising: providing detection And a reference beam; the incident point of the detecting beam from the first surface of the substrate is incident along the optical detection path to the second surface and the incident point corresponding to the incident point, respectively, on the optical detection path through which the detecting beam passes a set of backscattered light generated at each point is used as a sample beam corresponding to the point; respectively, an interference signal formed by interference between each sample beam and the reference beam is acquired to obtain backscattered light of each point on the optical detection path Light intensity information, optical length information between points on the optical detection path; determining whether there is a defect on the optical detection path based on light intensity information of backscattered light at each
  • the optical detection path determines whether there is a defect on the optical detection path.
  • the number of physical interfaces on the optical detection path is determined according to the light intensity information of the backscattered light at each point on the optical detection path.
  • the substrate is a composite material of glass, plastic, or glass ceramic or the above materials.
  • the detecting beam and the reference beam are formed by splitting a single beam emitted by the light source.
  • the light source has coherence, the resolution of the light source is 5 micrometers to 200 micrometers, and the power source spectrum has a full width at half maximum of 10 nanometers to 100 nanometers.
  • the resolution of the light source is 100 micrometers to 200 micrometers, and the power source spectrum has a full width at half maximum of more than 10 nanometers.
  • the interference signals formed by the interference between each sample beam and the reference beam are respectively acquired to obtain the light intensity information of the backscattered light at each point on the optical detection path, and the optical length of the optical detection path
  • the step of information includes: each sample beam and the reference beam respectively collide in the coupling member and interfere with each other.
  • the step of separately acquiring the interference signals formed by the interference between the sample beams and the reference beams to obtain the optical intensity information of the backscattered light at each point on the optical detection path and the optical length information of the optical detection path is Made with photodetection components.
  • a corresponding detection surface connecting the two surfaces is defined according to at least two optical detection paths between the first surface and the second surface of the substrate.
  • the detection image of the detection surface is obtained according to the light intensity information of the backscattered light at each point on each optical detection path on the detection surface.
  • the detection beam is generated by a point source or a line source.
  • the detecting beam is a light beam emitted by the point source
  • the detecting beam is scanned along a boundary between the detecting surface to be analyzed and the first surface, and is incident on each of the incident points to the corresponding reflecting point on the second surface.
  • the detecting beam when the detecting beam is a beam emitted by the line source, the detecting beam is simultaneously incident on the second surface from each incident point on the boundary between the detecting surface to be analyzed and the first surface.
  • the detection image of each detection surface is obtained by scanning in a direction perpendicular to the boundary between the detection surface and the first surface.
  • the present invention also provides a method of detecting defects in a substrate, the substrate having opposing first and second surfaces, wherein the first surface and the second surface are respectively interfaces of the substrate and an external environment
  • the method includes: providing a detection beam and a reference beam; the detection beam is incident on at least one incident point in a detection area of the first surface, and the detection beam propagates along a corresponding optical detection path to the first
  • the two surfaces correspond to the incident point a reflection point; obtaining intensity information of backscattered light distributed at each point on the optical detection path; and determining a detection area range according to light intensity information of backscattered light at each point distributed on the optical detection path Whether there is a defect in the interior and/or surface of the inner matrix.
  • optical length information between points distributed on the optical detection path is determined according to light intensity information of backscattered light of each point distributed on the optical detection path.
  • optical length information between points distributed on the optical detection path is used to determine the type of defect.
  • the defect is a bubble.
  • the method for detecting defects in the matrix further comprises: determining optical opening and closing type of the bubble by using optical intensity information of backscattered light at various points distributed on the optical detection path.
  • the following steps are performed to determine the type of opening and closing of the bubble: determining the number of physical interfaces through which the optical detecting path passes according to the light intensity information of the backscattered light at each point distributed on the optical detecting path, and according to The number of physical interfaces determines the type of opening and closing of the bubble.
  • the air bubbles are determined to be closed bubbles; when the number of the physical interfaces is less than 4, the air bubbles are determined to be open air bubbles.
  • the defect along the optical detection path and the optical length of the substrate on both sides of the defect along the optical detection path are greater than the physical length of the optical detection path and the substrate relative to the detection beam
  • the product of the refractive index is accumulated, it is judged that the defect is a solid defect.
  • the optical length of the defect distributed over it determines the refractive index of the defect.
  • the refractive index of the defect is calculated by: dividing the optical length of the substrate along one side or both sides of the defect along the optical detection path by the refractive index of the substrate relative to the detection beam, and obtaining the distribution Along the side or sides of the defect along the optics Detecting the physical thickness of the substrate of the path; subtracting the physical thickness of the substrate along the optical detection path on one or both sides of the defect by the physical length of the optical detection path, obtaining the physical thickness of the defect; The optical length is divided by the physical thickness of the defect to obtain the refractive index of the defect.
  • the defect type is determined according to the refractive index of the defect.
  • an optical length between points distributed on the optical detection path is a distance that the detection beam propagates between points along the optical detection path and a substance distributed within the distance relative to the Detect the integral of the refractive index of the beam.
  • the substrate is a composite of glass, plastic, or glass ceramic or a combination of the above materials.
  • the first surface and the external environment on both sides of the second surface are the same medium.
  • the external environment is air or water or a non-corrosive gas or a non-corrosive liquid.
  • the first surface and the external environment on both sides of the second surface are different media.
  • the external environment on one side of the first surface is air; the second surface is in contact with the loading platform, and the external environment on one side of the second surface is a bearing platform made of metal or plastic.
  • the present invention also provides an apparatus for detecting defects in a matrix, comprising: a light source providing a single beam; a light splitting unit dividing the single beam into a detection beam and a reference beam; and a sample beam acquisition unit acquiring the detection beam from the first surface of the substrate a sample beam generated at each point on the optical detection path through which the reflection point corresponding to the incident point passes on the second surface; the signal acquisition unit separately acquires interference formed by interference between each sample beam and the reference beam a signal to obtain light intensity information of backscattered light at each point on the optical detection path, and optical length information between points on the optical detection path; a defect determining unit, according to the back of each point on the optical detection path To the light intensity information of the scattered light, it is judged whether or not there is a defect on the optical detection path.
  • the technical solution of the present invention has the following advantages: acquiring an interference signal formed by interference between each sample beam and the reference beam to obtain light intensity information of backscattered light at each point on the optical detection path, According to the light intensity information, it can be determined whether there is a defect on the optical detection path; the light intensity information of each point in the matrix is ensured, and the integrity of the defect information is ensured.
  • the optical length information between the points distributed on the optical detection path determined according to the light intensity information of the backscattered light of each point distributed on the optical detection path can effectively determine the type of the defect and improve the type of the distinguished defect. The correct rate.
  • determining the number of physical interfaces on the optical detection path based on the light intensity information of the backscattered light at each point on the optical detection path can intuitively and accurately distinguish whether the bubble is closed or open.
  • the optical length of the defect determines the refractive index of the defect, and the specific type of the defect can be determined according to the refractive index of the defect, which improves the accuracy of detecting the defect.
  • FIG. 1 is a flow chart showing the detection of defects in a substrate according to a first embodiment of the present invention
  • FIG. 2 is a flow chart showing the detection of defects in a substrate according to a second embodiment of the present invention
  • 4 is a schematic view showing the principle of detecting defects in a matrix according to the first embodiment of the present invention
  • FIG. 5 is a schematic view showing a method for detecting defects in a matrix according to the first embodiment of the present invention
  • FIG. 6 is a second embodiment of the present invention
  • FIG. 7 is a schematic view showing a method for detecting defects in a matrix according to a second embodiment of the present invention
  • FIG. 1 is a flow chart showing the detection of defects in a substrate according to a first embodiment of the present invention
  • FIG. 2 is a flow chart showing the detection of defects in a substrate according to a second embodiment of the present invention
  • 4 is a schematic view showing the principle of detecting defects in a matrix according to the first embodiment of the present invention
  • FIG. 5 is
  • FIG. 8 is a schematic diagram of detecting defects in a matrix by using a point light source according to an embodiment of the present invention
  • FIG. An embodiment uses a line light source to detect a defect in a substrate
  • 10 is a schematic view of a glass image with defects obtained by the detection method of the present invention
  • FIG. 11 is a schematic diagram of an open bubble interface distribution in a glass
  • Figure 13 is a schematic view showing the distribution of the closed bubble interface in the glass
  • Figure 15 is a schematic diagram of a time domain OCT detecting device extended by the detecting device of the present invention
  • Figure 16 is a schematic view showing a process for detecting glass by using a time domain OCT
  • Figure 17 is a schematic view of a spectral domain OCT detecting device extended by the detecting device of the present invention
  • 18 is a schematic diagram of a process for detecting glass by spectral domain OCT
  • FIG. 19 is a schematic diagram of a frequency domain OCT detecting device extended by the detecting device of the present invention
  • FIG. 20 is a schematic diagram showing a principle of detecting a glass by frequency domain OCT.
  • the inventors have discovered a method for detecting defects in a matrix having opposite first and second surfaces, and a plurality of incident points are distributed on the first surface, and the detecting step is as shown in FIG.
  • the method includes: performing step S1, providing a detection beam and a reference beam; Step S2 is performed, and the incident point of the detecting beam from the first surface of the substrate is incident along the optical detecting path to the reflecting point corresponding to the incident point on the second surface, respectively, on the optical detecting path through which the detecting beam passes.
  • a set of backscattered light generated at each point is used as a sample beam corresponding to the point; and step S3 is performed to separately acquire an interference signal formed by interference between each sample beam and the reference beam to obtain a back of each point on the optical detection path Light intensity information of the scattered light, and optical length information between points on the optical detection path; performing step S4, determining the optical light according to light intensity information of backscattered light at each point on the optical detection path Check for defects on the path.
  • the interference signal formed by the interference between the sample beam and the reference beam is acquired to obtain the light intensity information of the backscattered light at each point on the optical detection path, and according to the light intensity information, Determining whether there is a defect on the optical detection path; collecting light intensity information of the generated backscattered light at each point in the matrix to ensure the integrity of the defect information. Then, according to the optical length information between the points on the optical detection path, the type of the defect (whether a bubble or a stone) can be preliminarily distinguished, and the correct rate of distinguishing the defect type is improved.
  • the present invention also provides another method of detecting defects in a substrate having opposing first and second surfaces, wherein the first surface and the second surface are respectively the substrate and the external environment
  • the detecting step includes: performing step S11, providing a detecting beam and a reference beam; performing step S12, the detecting beam is incident on at least one incident point in the detection area of the first surface, the detecting beam edge Corresponding optical detection path is propagated to a reflection point corresponding to the incident point on the second surface; performing step S13, acquiring light intensity information of backscattered light distributed at each point on the optical detection path; Step S14, determining whether there is a defect in the interior and/or surface of the substrate within the detection area according to the light intensity information of the backscattered light at each point distributed on the optical detection path.
  • a device for detecting defects in a matrix based on the above method for detecting defects in a matrix comprising: a light source, Providing a single beam; a light splitting unit, dividing the single beam into a detecting beam and a reference beam; and a sample beam acquiring unit acquiring a reflection point of the detecting beam from the incident point of the first surface of the substrate to the second surface corresponding to the incident point a sample beam generated at each point on the optical detection path; a signal acquisition unit respectively acquiring an interference signal formed by interference between each sample beam and the reference beam to obtain backscattered light of each point on the optical detection path Strong information, optical length information between points on the optical detection path; and a defect determining unit determining whether the optical detection path exists according to light intensity information of backscattered light at each point on the optical detection path defect.
  • the detection beam is incident on the second surface from the first surface of the substrate along the optical detection path, and the light intensity information of the backscattered light at each point on the optical detection path in the detection region is obtained to determine the inside of the detected substrate and / or whether the surface is defective.
  • the light intensity information of the backscattered light generated at each point in the detection area is collected to ensure the integrity of the defect information.
  • the presence or absence of the defect is directly judged according to the light intensity information, and the accuracy is high.
  • the apparatus for detecting a substrate includes: a light source 100, a beam splitting member (coupling member) 102, a reference arm 106, a sample arm 114, a photodetecting member 110, and a display processing unit 118.
  • the principle of the above apparatus for detecting the substrate is as follows: First, it is necessary to provide a substrate 116 as shown in FIG. 4, the substrate 116 having an opposite first surface 116a and a second surface 116b, and the first surface 116a is distributed over the first surface 116a. One incident point 117a. The first surface 116a and the second surface 116b are interfaces of the substrate 116 with the external environment. Then, in combination with FIGS.
  • the light source 100 emits a single beam; the single beam enters the beam splitting member 102, and is divided into a detecting beam and a reference beam by the beam splitting unit 102; after the detecting beam and the reference beam are output from the beam splitting member 102, wherein
  • the reference beam enters the reference arm 106, and the sample beam enters the sample arm 114; the reference beam is first focused by the lens group 104 in the reference arm 106, and the focused reference beam is reflected by the original path to the reflective element 108; the detected beam is focused
  • the lens group 112 is then irradiated onto the substrate under test 116, the detection beam being incident from the incident point 117a of the first surface 116a of the substrate 116 to the second surface 116b, wherein each of the detection beams is incident along the first surface 116a.
  • Point edge corresponding optical inspection A point at which the measurement path is incident on the second surface 116b is defined as a reflection point 117b, respectively, as backscattered light generated at each point on the optical detection path through which the detection beam passes, as a sample beam corresponding to the point; samples generated at each point The beam and the reference beam merge within the coupling component 102 and interfere with one another to form an interfering light signal; the interfering light signal is acquired by the photodetecting component 110, the interfering optical signal comprising the intensity of the backscattered light at a corresponding point on the optical detection path Information, according to the light intensity information of the backscattered light at each point distributed on the optical detection path, the optical length information between the points distributed on the optical detection path may be determined, and the interference light intensity signal undergoes photoelectric conversion and signal After the amplification processing, an interference electric signal is formed; after the reception processing is performed on the interference display processing unit 118, a detection image is formed.
  • the substrate 116 may be a composite material of glass, plastic, or glass ceramic or the above materials. Wherein, the substrate 116 is transparent with respect to the detection beam because the detection beam of a predetermined wavelength can directly penetrate the substrate 116.
  • the first surface 116a and the second surface 116b of the substrate 116 are substantially parallel to each other, that is, the first surface 116a and the second surface 116b may be parallel, or may be the first surface 116a and the second surface.
  • the extension of 116b has an included angle.
  • the external environment on both sides of the first surface 116a of the substrate 116 and the second surface 116b may be the same medium or different media.
  • the external environment on both sides of the first surface 116a and the second surface 116b may be air or water or a non-corrosive gas or a non-corrosive liquid. If it is a non-identical medium, the external environment of the first surface 116a may be air or water or a non-corrosive gas or a non-corrosive liquid; the second surface 116b is in contact with the carrier, and the second surface is The external environment is a load-bearing table made of metal or plastic.
  • the light intensity and the light energy of the detection beam and the reference beam are the same.
  • the optical detection paths are also different depending on the incident angle of the light beam. As shown in FIG.
  • a corresponding detection surface connecting the two surfaces is defined according to at least two optical paths between the first surface 116a and the second surface 116b of the substrate 116.
  • the detecting beam when the detecting beam is incident perpendicularly into the substrate 116 in FIG. 4, the detecting beam is incident on the second surface 116b along the optical detecting path from the incident point 117a of the first surface 116a, the optical detecting path. Also perpendicular to the two surfaces; defining a respective detection surface connecting the two surfaces according to the at least two optical paths, the detection surface 116c connecting the first surface 116a and the second surface 116b may be defined, the detection surface 116c and The sides of the substrate 116 are parallel. As shown in FIG.
  • the detection beam when the detection beam is incident on the substrate 116 in accordance with the inclination of the detection beam, the detection beam is incident on the second surface 116b along the optical detection path from the incident point 117a of the first surface 116a, and the optical detection path is also An oblique intersection with the two surfaces; a corresponding detection surface connecting the two surfaces is defined according to the at least two optical paths, and a detection surface 116c connecting the first surface 116a and the second surface 116b may be defined, the detection surface 116c and The side of the substrate 116 has an included angle.
  • each detection surface 116c is parallel to each other in each detection mode; and the incident points 117a are distributed on a boundary line between each detection surface 116c and the first surface 116a.
  • the detected image of the detection surface 116c can be obtained by processing the light intensity information of the backscattered light at each point on each optical detection path on the detection surface 116c defined above.
  • a point at which each incident point on the first surface 116a of the substrate 116 is incident on the second surface 116b along the corresponding optical detection path is defined as a reflection point 117b, and the reflection point 117b receives the detection beam. After that, backscattering and reflection will occur at this point.
  • the light source may be a laser source or a light emitting diode; the laser source or the light emitting diode is a wide spectrum light source, and the generated light beam is a coherent light beam, and the resolution of the coherent light source is 5 micrometers to 200 Micron, the power spectrum of the light source has a full width at half maximum of 10 nm to 100 nm.
  • the laser source or the light emitting diode may be a line source or a point source.
  • the resolution of the selected coherent light source is 100 micrometers to 200 micrometers, and the power source spectrum has a full width at half maximum of more than 10 nanometers.
  • the detection device for using the point light source as the light source acquires the substrate image (for example, by defining the XZ detection surface), as shown in FIG. 8, the substrate is moved to a position where the light emitted from the point source is directly incident on the first surface.
  • the first incident point a is near an angle of the substrate; after the single beam emitted by the point source is split into the detecting beam and the reference beam, the detecting beam is incident from the first incident point a along the first optical detecting path a first reflection point corresponding to the first incident point a to the second surface; the detection beam passes from the first incident point a along the first optical detection path through the first surface of the substrate, the interior and the second surface Generating backscattering, the set of backscattered light generated at each point is taken as the first sample beam corresponding to the point; each first sample beam and the reference beam are combined in the coupling component and interfered; first photodetection The first interference light signals formed by the interference between the first sample beam and the reference beam are respectively acquired, and the first interference light signal is converted into a corresponding first interference electrical signal.
  • the detection beam Moving the substrate in the X direction such that the light beam emerging from the point source can be incident directly onto the second incident point b of the first surface, the detection beam being incident on the second surface along the second optical detection path from the second incident point b Corresponding to the second reflection point of the second incident point b; the detection beam is generated from the second incident point b along the second optical detection path through the first surface of the substrate, the interior and the second surface, and backscattering occurs.
  • the set of backscattered light generated at each point serves as a second sample beam corresponding to the point; each of the second sample beam and the reference beam merge and interfere in the coupling component; and the second photodetector separately acquires each second sample The light beam and the reference beam interfere with each other to form a second interference light signal, and convert the second interference light signal into a corresponding second interference electrical signal.
  • the substrate is continuously moved in the X direction to obtain interference light signals at various points along the optical detection path corresponding to each incident point; until the sample is moved to enable the light beam emitted from the point source to be directly incident on the first surface
  • the detection beam is incident from the Nth incident point n along the Nth optical detection path to the second reflection point of the second surface corresponding to the Nth incident point n;
  • the back beam is generated from the Nth incident point n along the Nth optical detection path through the first surface, the inner surface and the second surface of the substrate, and the set of backscattered light generated at each point is corresponding to the point.
  • the Nth sample beam; the Nth sample beam and the reference beam are combined and interfered in the coupling component; the Nth photodetector respectively acquires the Nth interference optical signal formed by the interference of each Nth sample beam and the reference beam, And converting the Nth interference optical signal into a corresponding Nth interference electrical signal.
  • the first photodetector, the second photodetector, the Nth photodetector output the electrical signal with the interfering light intensity information to the display processing unit, and the display processing unit denoises the electrical signal Zoom in and perform the first detection surface image display and analysis.
  • the first optical detection Path, second optical detection path... Nth optical detection defines a first detection surface; then the substrate moves in the Y direction to the second detection surface...
  • the first method of detecting the image of the face acquires the detected image of the second detecting surface, the Nth detecting surface (i.e., the entire substrate).
  • the detection device for using the line light source as the light source acquires the substrate image (for example, defining the XZ detection surface).
  • the substrate 116 is moved to position the light emitted from the line source directly onto the first surface.
  • Each incident point is adjacent to one side of the substrate; the multiple beams emitted by the line source (which may be composed of the fiber array) are respectively split into corresponding detection beams and reference beams, and each detection beam is simultaneously from the first incident point.
  • the second incident point b ...
  • the Nth incident point n is incident from the first surface to the second surface along the corresponding optical detection path, and the detection beam is from the first incident point a and the second incident point b
  • the incident point n generates backscattering along the first optical surface of the substrate along the corresponding optical detection path, and the backscattered light generated at each point serves as a sample beam corresponding to the point; each sample beam And the reference beam merges within the coupling component and interferes;
  • the first photodetector is collected from the first incident point a along the respective optical detection path through the first surface of the substrate, the interior and the second surface
  • the scattered sample beam and the reference beam interfere with each other to form a first interference light signal, and convert the first interference light signal into a corresponding first interference electrical signal;
  • the second photodetector collects from the second incident point b along the corresponding
  • the optical detection path passes through a second interference optical signal formed by the sample beam reflected at the first surface of the substrate, the inner surface and the second surface, and the
  • the Nth photodetector collects a sample beam reflected from the Nth incident point n along the corresponding optical detection path through the first surface of the substrate, the interior and the second surface, and the reference beam interfere with each other.
  • the Nth interference optical signal converts the Nth interference optical signal into a corresponding Nth interference electrical signal.
  • the first photodetector, the second photodetector, the Nth photodetector output the electrical signal with the interfering light intensity information to the display processing unit, and the display processing unit denoises the electrical signal Zoom in, and perform first detection surface image display and analysis.
  • the correspondence between the multiple light beams emitted by the line light source from the first incident point a of the first surface, the second incident point b, the Nth incident point n, and the corresponding reflective point of the second surface The optical detection path defines a first detection surface; then the substrate moves in the Y direction to the second detection surface ... the Nth detection surface, and the second detection surface is obtained by acquiring the first detection surface image. . Detection image of the Nth detection surface (ie the entire substrate).
  • a collimator such as a lens or a lens group.
  • the beam splitting member 102 and the coupling member 102 are the same component.
  • the beam splitting component and the coupling component can also be two separate devices.
  • the light splitting member (coupling member) 102 may be a fiber coupler or a beam splitting prism or a beam splitter group or the like.
  • the transmission path of the light beam can be realized by the optical fiber; for example, a single beam emitted by the light source 100 can be transmitted to the coupler 102 through the optical fiber; the detection beam output from the coupler 102 And the reference beam can be input to the sample arm 114 and the reference arm 106 through the optical fiber, respectively.
  • the detector 110 is a CMOS device or a CCD device, and is configured to acquire an interference light intensity signal formed by interference between a sample beam and a reference beam, and perform optical imaging. After the detector 110 collects the interference light intensity signal, the detected light intensity signal is further converted into a corresponding telecommunications.
  • the display processing unit 118 may be a computer, and may include: a signal acquisition processing unit and a display unit. After the detector outputs the electrical signal with the interference light intensity information, the signal acquisition processing unit in the display processing unit 118 performs the denoising amplification on the electrical signal, and then the processed electrical signal is output to the display unit for image display and analysis.
  • the detecting device further includes a sample stage for carrying the substrate 116. The sample stage is controlled by the display processing unit 118 to move the sample stage in the X- ⁇ direction. According to the movement of the sample stage, the detecting surface 116c in Figs. 5, 7, 8, and 9 may be in the ⁇ direction or the YZ direction.
  • the scanned image of the detecting surface includes light intensity information of backscattered light of each point distributed on the plurality of optical detecting paths;
  • the light intensity information of the backscattered light at each point on the optical detection path can determine the number of physical interfaces on each optical detection path in the detection surface, and determine whether there is a defect in the interior or surface of the substrate. As shown in Fig. 4, if there is a defect inside the substrate, it can be seen from the scanned image of the detection surface that the number of physical interfaces on the optical detection path is greater than two.
  • the intensity information of the backscattered light at each point on the optical detection path, and the optical length of the optical detection path are determined.
  • determining the type of the defect with respect to the refractive index of the substrate relative to the detection beam Specifically, a preset line is set in the scan image of the detection surface of FIG. 4, and the preset line passes the defect in the thickness direction of the glass, and the preset line only needs to pass the defect, and the position is not limited.
  • the distance between two parallel lines perpendicular to the preset line and crossing the edge of the defect is determined as the optical length of the glass a+c (a or c).
  • a+c a or c
  • One of them may be an integral of the refractive index of the substance distributed within the distance with respect to the detection beam.
  • the optical length And the sum of the optical lengths of the substrates on both sides of the defect along the optical detection path is less than the product of the physical length ( ⁇ ⁇ ) of the corresponding optical detection path of the substrate and the refractive index of the substrate relative to the detection beam: ie a+b+c ⁇ T x xn x , determining that the defect is a bubble.
  • the sum of the optical length of the defect along the optical detection path and the optical length of the substrate along the optical detection path on both sides of the defect is greater than the physical length of the optical detection path
  • the product of the matrix relative to the refractive index of the detection beam that is, a+b is trapped as a solid defect (stone).
  • glass is used as an example, according to the formula:
  • the physical length T glass of the glass is known, and the optical length is an integral of the distance of the detection beam along the broadcast and the refractive index of the substance distributed within the distance with respect to the detection beam, and the refractive index n glass of the glass is known. . Therefore, by calculating n defect by the formula, the defects can be classified more accurately.
  • the physical length of the optical detection path (the physical length of the matrix of the corresponding region) can be measured by a detection tool such as a vernier caliper or a thickness gauge.
  • the refractive index of the substrate relative to the detection beam is also known.
  • the refractive index table can be obtained according to the wavelength of the detection beam and the material of the substrate, that is, the refractive index of the substrate can be obtained.
  • Figure 11 is a schematic diagram of the open bubble interface distribution in the mass (mainly glass).
  • the open bubble is located on the surface of the glass, so the open bubble has two interfaces, namely the air-glass interface 200 and the glass-air interface 210.
  • Figure 13 is a schematic diagram of the closed-cell bubble interface distribution in the glass. The closed bubble is located in the glass, so the closed bubble has four interfaces, namely the air-glass interface 300, the glass-air interface 310, the air-glass interface 320, the glass-air Interface 330.
  • the second split beam Separating a single beam emitted from the light source into a first split beam and a second split beam, the second split beam as a reference beam; the first split beam is irradiated onto the glass surface or inside, and is optically detected on each path
  • the distributed backscattered light is used as a sample beam; the sample beam and the reference beam combine to interfere; the interference light signal is processed and displayed to form a detected image.
  • the open bubble is located on the glass surface, so the first split beam will be incident on the glass-air interface 210 along the respective optical detection path from each incident point on the air-glass interface 200 shown in FIG.
  • Point respectively, a set of backscattered light generated at each point on the optical detection path through which the detection beam passes as a sample beam corresponding to the point; the sample beams generated by the points distributed on the optical detection paths between the two interfaces are respectively Interference with the reference beam to obtain interference light information; after photoelectric conversion, the image is displayed as bright lines at the two physical interfaces.
  • a pseudo bright line having a brightness lower than the brightness of the interface bright line appears above the open bubble interface; usually, in this case, there is a bright line on the detection surface image of the open bubble.
  • the total number is also less than 4. As shown in FIG.
  • the closed bubble is located inside the glass, so the first split beam will occur at the air-glass interface 300, the glass-air interface 310, the air-glass interface 320, and the glass-air interface 330 shown in FIG.
  • the backscattered light generated by the corresponding points on the four interfaces interferes with the reference beam as the sample beam, and obtains the intensity information of the backscattered light at the points on the corresponding optical detection paths of the four interfaces; after photoelectric conversion and signal
  • the image is displayed in bright lines on the four physical interfaces. Four bright lines are usually displayed in four interfaces. Usually in this case, the total number of bright lines is equal to four.
  • the detection image of the detection surface is formed based on the interference light intensity information at each point on the detection surface. Therefore, the detection image includes the light intensity information of the detection surface.
  • OCT optical coherence tomography
  • the present invention can employ different OCT devices to acquire a detected image of the glass.
  • Figure 15 shows a time domain OCT (first generation OCT) device. As shown in FIG.
  • the time domain OCT apparatus includes: a light source 12, a spectroscopic coupling section 13, a reference mirror 14, a focus lens 15, a photodetector 16, and a display processing unit 17. The method of detecting the glass acquired image by using the time domain OCT apparatus of FIG.
  • the light source 12 emits a coherent single beam; after the single beam is collimated by a collimator (not shown), it enters the spectral coupling component 13
  • the splitting light coupling member 13 is disposed on the transmission path of the light beam, and the splitting light coupling member 13 splits the collimated single beam into the detection beam 18 and the reference beam 19 of different transmission paths
  • the focusing lens 15 is disposed on the transmission path of the detection beam 18, It receives the detection beam 18 emitted from the spectral coupling component 13 and focuses the detection beam 18 on the first surface of the glass 11, and the collected detection beam 18 is incident on the second surface from the incident point of the first surface of the glass 11,
  • the reflected light generated at the surface of the glass 11 through which the detecting beam passes and the internal points are respectively taken as the sample beam corresponding to the point
  • the reference mirror 14 is used as a part of the reference arm, and is disposed on the transmission path of the reference beam 19, by driving the reference reflection The mirror 14 moves back and forth to generate reference beams of
  • the display processing unit 17 is for analyzing the electrical signals to obtain the respective detection surface images of the glass 11.
  • the method for detecting each detection surface from the first surface incident point to the second surface along the depth direction is as shown in FIG. 16 , and the time domain OCT device mainly moves through the reference mirror 14 (ie, moving the reference arm)
  • the first distance of the reference mirror 14 from the spectroscopic coupling member 13 is ds, and the first optical path length L1 is generated, and the first optical path length L1 is compared with the first depth position of the glass 11 detecting surface.
  • the spot beam reflected by the spot interferes (ie, the optical path difference between the sample beam reflected by the point at the first depth position and the reference beam of the first optical path length L1 is smaller than the coherence length of the light source 12 Degree), and does not interfere with the sample beam reflected by the points of other depth positions (ie, the optical path difference between the reference beam reflected by the reference path of the first optical path length L1 and the detection surface of the glass 11 and other depth positions is larger than the light source
  • the reference mirror 14 is moved so that the distance between the reference mirror 14 and the spectroscopic coupling member 13 is the second distance dr, thereby generating the second optical path length L2 reference beam, and the second optical path length L2
  • the reference beam interferes with the sample beam reflected by the point at the second depth position of the detection surface of the glass 11, and does not interfere with the sample beam reflected by the point at other depth positions; and so on, the reference mirror 14 is constantly moved, changing its The distance between the light-splitting coupling members 13 causes interference between
  • the reference mirror 14 can also be replaced by a scanning device including a first wedge mirror and a second wedge mirror, the first wedge mirror and the second wedge mirror having the same structure and their oblique sides being placed in parallel.
  • the first wedge mirror is fixed, the second wedge mirror is placed on the movable end of the precision electronically controlled translation stage, and the electronically controlled translation stage is controlled by the display processing unit 17, so that the second wedge mirror moves along the oblique side to realize the moving wedge
  • the mirror changes the purpose of the reference beam path.
  • the electronically controlled translation stage in the scanning device is controlled by the display processing unit 17, and the optical path of the reference beam is changed, so that the reference beam respectively interferes with the sample beam reflected from different depths and structures in the glass 11, and the corresponding electronically controlled translation is recorded separately.
  • the displacement amount of the movement of the stage which reflects the spatial position of the different structures in the glass 11, whereby one-dimensional measurement data in the depth direction of the glass 11 can be obtained, and the longitudinal scanning of the glass 11 is completed.
  • the embodiment of the present invention can also acquire a detection image of the glass by using a frequency domain OCT device.
  • Figure 17 is a spectral domain OCT (second generation OCT) device. As shown in FIG.
  • the spectral domain OCT apparatus includes: a light source 21, a spectroscopic coupling section 22, a sample arm 23, a reference arm 24, a spectrometer 25, a photodetector 26, and a display processing unit 27.
  • the light source 21 is a wide-spectrum light source that emits a low-coherence light beam; the low-coherence light beam enters the spectral coupling component 22 through the light source arm 28; the split-light coupling component 22 divides the low-coherent light beam a detecting beam and a reference beam; the detecting beam is irradiated onto the glass through the sample arm 23, and the detecting beam is incident from the incident point of the first surface of the glass to the first The two surfaces respectively are the reflected light generated at the surface of the glass through which the detecting beam passes and the internal points are taken as the sample beam corresponding to the point; the reference beam enters the reference arm 24, and the reference arm 30 includes the adjustable optical delay line and the mirror; The reference beam reflected from the mirror inside the reference arm 23 and the combined sample beam exiting the sample arm 23 are combined in the splitting coupler 22 and interfere with each other; the interference beam is transmitted by the splitting coupling section 22 to the spectrometer 25 through the detector arm 29.
  • the interference spectrum of different wavelengths is obtained by using a spectrometer spectroscopic characteristic, wherein the interference spectrum includes light intensity information of a point at each depth position of the detecting surface; the interference spectrum is collected by the photodetector 26, and Fourier transform is performed to obtain a glass along the depth direction. Detection images of the surface and internal points.
  • the interference signal entering the spectrometer can be expressed by Equation 1-1:
  • I(k) S(k) a R Qxp(i2kr) + a(z) x exp ⁇ i2k[r + n(z) - z] ⁇ dz ( 1-1 )
  • 2r is the optical path of the reference arm 2 (r+z) is the optical path of the sample arm
  • 2z is the optical path of the sample arm, and its value is measured with the reference plane as the origin, z.
  • n is the refractive index
  • a R is the reflected light amplitude of the reference arm (which can be assumed to be 1)
  • a (z) is the reflected light amplitude of the glass, taking into account the offset z.
  • I(k) ⁇ ( ⁇ )[1 + plant a ⁇ z) cos(2knz)dz + ( J Factory ⁇ ) ⁇ ' ) Qxp[-ikn ⁇ ( ⁇ - ⁇ ' )]dzdz'
  • AC[ ⁇ (z) ] represents the autocorrelation item.
  • the light intensity information of the frequency domain OCT in the depth direction of the glass detection surface is simultaneously acquired, and the light intensity information of the one-dimensional depth direction of each detection surface of the glass can be directly obtained by the Fourier transform method;
  • the longitudinal scanning device greatly increases its imaging speed.
  • the light source 21 may be a high brightness light emitting diode (SLED) having a wavelength of about 840 nm and a bandwidth of about 50 nm.
  • the light source arm 28 can be a single mode fiber.
  • the splitting coupling component 22 can be a 2x2 3dB fiber coupler; the 3dB coupler acts as a splitting and combining.
  • the spectrometer 25 may be a grating spectrometer, specifically a diffraction grating spectrometer or a blazed grating spectrometer.
  • the basic function of the spectrometer is to determine the spectral composition of the light being studied, including its wavelength, intensity, and so on.
  • the spectrometer should have the following functions: 1. Decompose the light to be studied according to the wavelength or wave number; 2. Determine the energy of the light of each wavelength, and obtain the distribution of energy according to the wavelength; The intensity is displayed and recorded by wavelength or wave number distribution to obtain a spectrum. As shown in FIG.
  • the spectrometer includes: a light source (not shown), a grating 251, a lens 252, and a photodetector 253 (the same device as the photodetector 26).
  • the wide-spectrum light emitted by the low-coherence light source is sent to the spectrometer through the interference signal generated by the Michelson interferometer, and the intensity distribution of the interference signal with the wavelength ( ⁇ ) is obtained by using the spectroscopic characteristic of the spectrometer, and then the inverse signal is obtained after the inverse transformation.
  • the photodetector 26 of the frequency domain OCT device generally adopts a CCD (Charge Coupled Device), and a line array CCD or an area array CCD can be selected according to different situations.
  • the CCD uses charge as a signal, that is, information is represented by a charge pad (charge packet), and other devices use voltage or current as a signal.
  • FIG. 19 shows a frequency domain light source OCT (third generation OCT) device.
  • the frequency domain OCT apparatus includes: a swept source 31, a spectroscopic coupling unit 32, a reference mirror 33, a sample stage 34, a photodetector 35, and a display processing unit 36.
  • the swept source 31 is a high speed tunable laser source.
  • the Fourier domain mode locking (FDML) laser source is shown in FIG. 20, and includes an isolator 315, a signal amplifier 314, an optical fiber 313, a filter 312, and a wavelength generator 311.
  • the FDML technology uses a long fiber of several kilometers to extend the cavity so that the light travels in the cavity for exactly one turn to match the tuning time of the FFP-TF.
  • the optical fiber causes the light beams filtered by the FFP-TF to oscillate in the cavity at the same time, instead of the short cavity, the light of a certain wavelength is oscillated before the light of the next wavelength passes, so although the cavity of the cavity Long, but the speed has increased.
  • the sweep speed is no longer limited by the tuning speed of the filter and the time for the laser to oscillate in the cavity, just like the short cavity, but only limited by the tuning speed of the filter.
  • the FDML swept laser source has the greatest advantage of high speed, axial scanning speeds of several hundred kilohertz, and ultra-narrow instantaneous linewidths for deeper imaging depths.
  • the FDML swept laser has a sweep rate of 290 kHz, a center wavelength of 1300 nm, a sweep range of 105 nm, an average output power of 20 mW, and an imaging depth of 7 mm.

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Abstract

L'invention concerne un procédé et un dispositif de détection de défauts au sein d'une matrice, selon lequel procédé : on fournit un faisceau lumineux et on s'y réfère; le faisceau lumineux de détection en provenance d'un point d'incidence (117a) d'une première surface (116a) de la matrice (116) incide sur une seconde surface (116b) suivant une trajectoire de détection optique, les points d'incidence étant en correspondance un par un avec les points de réflexion (117b), l'accumulation de lumière rétrodiffusée, obtenue respectivement en chaque point sur la trajectoire de détection optique avec le faisceau de détection, tenant lieu de faisceau échantillon correspondant aux points précités; on recueille séparément les signaux d'interférence formés par l'interférence mutuelle entre chaque faisceau échantillon et le faisceau de référence de manière à obtenir l'information sur l'intensité lumineuse de la lumière rétrodiffusée en chaque point sur la trajectoire de détection optique ainsi que l'information sur la longueur optique entre chaque point se trouvant sur la trajectoire de détection optique. Ce procédé permet distinguer avec précision entre les différents type de défaut au sein d'une matrice et d'améliorer la précision de la détection des défauts.
PCT/CN2013/070388 2011-12-20 2013-01-11 Procédé et un dispositif de détection de défauts au sein d'une matrice WO2013091584A1 (fr)

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