WO2013091516A1 - Earphone interface and gpio interface multiplexing circuit structure - Google Patents

Earphone interface and gpio interface multiplexing circuit structure Download PDF

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Publication number
WO2013091516A1
WO2013091516A1 PCT/CN2012/086745 CN2012086745W WO2013091516A1 WO 2013091516 A1 WO2013091516 A1 WO 2013091516A1 CN 2012086745 W CN2012086745 W CN 2012086745W WO 2013091516 A1 WO2013091516 A1 WO 2013091516A1
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interface
output
power amplifier
universal input
host
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PCT/CN2012/086745
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French (fr)
Chinese (zh)
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奚剑雄
陈锋
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杭州硅星科技有限公司
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Publication of WO2013091516A1 publication Critical patent/WO2013091516A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00Stereophonic arrangements
    • H04R5/04Circuit arrangements, e.g. for selective connection of amplifier inputs/outputs to loudspeakers, for loudspeaker detection, or for adaptation of settings to personal preferences or hearing impairments
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00Stereophonic arrangements
    • H04R5/033Headphones for stereophonic communication

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Amplifiers (AREA)

Abstract

The present invention provides an earphone interface and GPIO interface multiplexing circuit structure. A host baseband or a host audio codec comprises a low-dropout linear voltage stabilizer, a programmable gain amplifier, a first power amplifier, a second power amplifier, and a grounding terminal. An output end of the low-dropout linear voltage stabilizer, an input end of the programmable gain amplifier, and a first universal input/output interface are connected in parallel and then connected to a microphone interface. The grounding terminal of the host baseband is connected to a grounding interface. An output end of the first power amplifier and a second universal input/output interface are connected in parallel and then connected to a left-channel earphone interface. An output end of the second power amplifier and a third universal input/output interface are connected in parallel and then connected to a right-channel earphone interface. The earphone interface and GPIO interface multiplexing circuit structure of the present invention can implement the connection between a host and an earphone device, and further implement the connection between the host and a data interface device, thereby extending the functions of the earphone interface.

Description

耳麦接口与 GPIO接口复用电路结构  Headset interface and GPIO interface multiplexing circuit structure
技术领域 Technical field
本发明涉及一种耳麦接口与 GPIO接口复用电路结构。  The invention relates to a muzzle interface and a GPIO interface multiplexing circuit structure.
背景技术 Background technique
耳麦的应用极其广泛, 因此在很多设备上都有耳麦接口。 现有技术中耳 麦接口仅充当耳麦设备与音频编解码器、 基带或处理器等的连接的桥梁, 因 此, 现有技术的耳麦接口只能实现主机与耳麦设备的连接。  Headsets are extremely versatile, so there are headsets on many devices. The prior art earphone interface only serves as a bridge between the headset device and the audio codec, baseband or processor, etc. Therefore, the prior art headset interface can only implement the connection between the host and the headset device.
发明内容 Summary of the invention
本发明的目的在于提供一种耳麦接口与 GPIO接口复用电路结构,该电路 结构既可配置成耳麦接口, 又可配置成 GPIO接口。  It is an object of the present invention to provide a multiplexed circuit structure of a headset interface and a GPIO interface, which can be configured as either a headset interface or a GPIO interface.
为了达到上述的目的, 本发明提供一种耳麦接口与通用输入输出接口复 用电路结构, 包括: 主机基带或主机音频编解码器、 第一通用输入输出接口、 第二通用输入输出接口、 第三通用输入输出接口、 麦克风接口、 左声道耳机 接口、 右声道耳机接口和接地口, 所述主机基带或主机音频编解码器包括低 压差线性稳压器、 可编程增益放大器、 第一功率放大器、 第二功率放大器和 接地端; 所述低压差线性稳压器的输出端连接第一电阻后与所述麦克风接口 连接, 所述麦克风接口连接第一电容后与所述可编程增益放大器的输入端连 接, 所述第一通用输入输出接口与所述麦克风接口连接; 所述主机基带或主 机音频编解码器的接地端与所述接地口连接; 所述第一功率放大器的输出端 与所述左声道耳机接口连接, 所述第二通用输入输出接口与所述左声道耳机 接口连接; 所述第二功率放大器的输出端与所述右声道耳机接口连接, 所述 第三通用输入输出接口与所述右声道耳机接口连接。  In order to achieve the above object, the present invention provides a headset circuit and a universal input/output interface multiplexing circuit structure, including: a host baseband or host audio codec, a first universal input/output interface, a second universal input/output interface, and a third Universal input/output interface, microphone interface, left channel headphone jack, right channel headphone jack and grounding port, the host baseband or host audio codec includes a low dropout linear regulator, a programmable gain amplifier, a first power amplifier a second power amplifier and a ground terminal; the output end of the low-dropout linear regulator is connected to the microphone interface after being connected to the first resistor, and the microphone interface is connected to the first capacitor and the input of the programmable gain amplifier End connection, the first universal input/output interface is connected to the microphone interface; the ground end of the host baseband or the host audio codec is connected to the grounding port; the output end of the first power amplifier and the a left channel headphone interface connection, the second universal input/output interface and the Interface channel headphones; the output of the second power amplifier is connected to the headphone jack right channel, the third general-purpose input-output interface with the earphone interface of the right channel.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述低压差线 性稳压器的控制端与主机寄存器连接, 由所述主机寄存器控制其工作状态, 所述低压差线性稳压器的输入端连接主机传送来的电压, 该主机传送来的电 压经所述低压差线性稳压器稳压后输出麦克风偏置电压。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the control end of the low dropout linear regulator is connected to the host register, and the working state of the low voltage difference linear regulator is controlled by the host register The input terminal is connected to a voltage transmitted from the host, and the voltage transmitted from the host is regulated by the low-dropout linear regulator to output a microphone bias voltage.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述可编程增 益放大器的控制端与主机寄存器连接, 由所述主机寄存器控制其工作状态, 所述可编程增益放大器的输出端与主机的模数转换器连接。 The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the control end of the programmable gain amplifier is connected to the host register, and the working state is controlled by the host register, The output of the programmable gain amplifier is coupled to an analog to digital converter of the host.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第一功率 放大器的控制端与主机寄存器连接, 由所述主机寄存器控制其工作状态, 所 述第一功率放大器的输入端与主机的数模转换器连接。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the control end of the first power amplifier is connected to the host register, and the working state is controlled by the host register, and the input end of the first power amplifier and the host Digital to analog converter connection.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第二功率 放大器的控制端与主机寄存器连接, 由所述主机寄存器控制其工作状态, 所 述第二功率放大器的输入端与主机的数模转换器连接。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the control end of the second power amplifier is connected to the host register, and the working state is controlled by the host register, and the input end of the second power amplifier and the host Digital to analog converter connection.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第一通用 输入输出接口、 第二通用输入输出接口和第三通用输入输出接口分别与所述 主机寄存器连接, 由所述主机寄存器控制其或为输入状态或为输出状态。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the first universal input/output interface, the second universal input/output interface, and the third universal input/output interface are respectively connected to the host register, and the host register is Control whether it is either an input state or an output state.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述输入状态 为浮空输入、 弱上拉输入或弱下拉输入。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the input state is a floating input, a weak pull-up input or a weak pull-down input.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第一功率 放大器的输出端连接一电容后与所述左声道耳机接口连接, 所述第二功率放 大器的输出端连接一电容后与所述右声道耳机接口连接, 麦克风接在所述麦 克风接口与接地口之间, 左耳机接在所述左声道耳机接口与接地口之间, 右 耳机接在所述右声道耳机接口与接地口之间, 所述低压差线性稳压器、 可编 程增益放大器、 第一功率放大器和第二功率放大器均开启, 所述第一通用输 入输出接口、 第二通用输入输出接口和第三通用输入输出接口均配置成浮空 输入。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the output end of the first power amplifier is connected to the left channel headphone interface after being connected to a capacitor, and the output end of the second power amplifier is connected to a capacitor And connected to the right channel earphone interface, the microphone is connected between the microphone interface and the grounding port, the left earphone is connected between the left channel earphone interface and the grounding port, and the right earphone is connected to the right channel. Between the earphone interface and the grounding port, the low dropout linear regulator, the programmable gain amplifier, the first power amplifier and the second power amplifier are both turned on, the first universal input/output interface, the second universal input/output interface, and The third general purpose input and output interface is configured as a floating input.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第一功率 放大器的输出端连接一电容后与所述左声道耳机接口连接, 所述第二功率放 大器的输出端连接一电容后与所述右声道耳机接口连接, 所述低压差线性稳 压器、 可编程增益放大器、 第一功率放大器和第二功率放大器均断开, 通过 对所述第一通用输入输出接口、 第二通用输入输出接口和第三通用输入输出 接口的配置形成总线。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the output end of the first power amplifier is connected to the left channel headphone interface after being connected to a capacitor, and the output end of the second power amplifier is connected to a capacitor After being connected to the right channel earphone interface, the low dropout linear regulator, the programmable gain amplifier, the first power amplifier and the second power amplifier are both disconnected, by the first universal input/output interface, The configuration of the two general purpose input and output interfaces and the third general purpose input and output interface form a bus.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第一功率 放大器的输出端连接一电容后与所述左声道耳机接口连接, 所述第二功率放 大器的输出端连接一电容后与所述右声道耳机接口连接, 在所述麦克风接口 与所述左声道耳机接口之间连接一电阻, 在所述左声道耳机接口与所述右声 道耳机接口之间连接一电阻; 所述低压差线性稳压器、 可编程增益放大器、 第一功率放大器和第二功率放大器均断开; 将所述第一通用输入输出接口配 置成 I2C接口的数据线, 将所述第二通用输入输出接口配置成 I2C接口的电 源线, 将所述第三通用输入输出接口配置成 I2C接口的时钟线。 The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the output end of the first power amplifier is connected to the left channel headphone interface after being connected to a capacitor, and the output end of the second power amplifier is connected to a capacitor Connecting to the right channel earphone interface, at the microphone interface a resistor is connected to the left channel earphone interface, and a resistor is connected between the left channel earphone interface and the right channel earphone interface; the low dropout linear regulator, a programmable gain amplifier, Disconnecting the first power input amplifier and the second power amplifier; configuring the first universal input/output interface as a data line of an I2C interface, and configuring the second universal input/output interface as a power line of an I2C interface, The third general-purpose input/output interface is configured as a clock line of the I2C interface.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第一功率 放大器的输出端连接一电容后与所述左声道耳机接口连接, 所述第二功率放 大器的输出端连接一电容后与所述右声道耳机接口连接, 在所述麦克风接口 与所述左声道耳机接口之间连接一电阻, 在所述左声道耳机接口与所述右声 道耳机接口之间连接一电阻; 所述低压差线性稳压器、 可编程增益放大器、 第一功率放大器和第二功率放大器均断开; 将所述第一通用输入输出接口配 置成两线接口的数据线, 将所述第二通用输入输出接口配置成两线接口的电 源线, 将所述第三通用输入输出接口配置成两线接口的时钟线。  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the output end of the first power amplifier is connected to the left channel headphone interface after being connected to a capacitor, and the output end of the second power amplifier is connected to a capacitor Connecting to the right channel earphone interface, connecting a resistor between the microphone interface and the left channel earphone interface, and connecting a connection between the left channel earphone interface and the right channel earphone interface a low-dropout linear regulator, a programmable gain amplifier, a first power amplifier, and a second power amplifier are both disconnected; configuring the first general-purpose input/output interface as a data line of a two-wire interface, The second universal input/output interface is configured as a power line of the two-wire interface, and the third universal input/output interface is configured as a clock line of the two-wire interface.
上述耳麦接口与通用输入输出接口复用电路结构, 其中, 所述第一功率 放大器的输出端连接一电容后与所述左声道耳机接口连接, 所述第二功率放 大器的输出端连接一电容后与所述右声道耳机接口连接, 在所述麦克风接口 与所述左声道耳机接口之间连接一电阻, 在所述左声道耳机接口与所述右声 道耳机接口之间连接一电阻; 所述低压差线性稳压器、 可编程增益放大器、 第一功率放大器和第二功率放大器均断开; 将所述第一通用输入输出接口配 置成 USB接口的正差分数据线 ( D+ ), 将所述第二通用输入输出接口配置成 USB接口的电源线,将所述第三通用输入输出接口配置成 USB接口的负的差 分数据线( D- 1  The above-mentioned headset interface and the universal input/output interface multiplexing circuit structure, wherein the output end of the first power amplifier is connected to the left channel headphone interface after being connected to a capacitor, and the output end of the second power amplifier is connected to a capacitor Connecting to the right channel earphone interface, connecting a resistor between the microphone interface and the left channel earphone interface, and connecting a connection between the left channel earphone interface and the right channel earphone interface a low-dropout linear regulator, a programmable gain amplifier, a first power amplifier, and a second power amplifier are both disconnected; configuring the first general-purpose input/output interface as a USB interface positive differential data line (D+) Configuring the second universal input/output interface as a power line of the USB interface, and configuring the third universal input/output interface as a negative differential data line of the USB interface (D-1)
本发明的耳麦接口与 GPIO接口复用电路结构既可配置成耳麦接口,又可 配置成 GPIO接口, 扩展了耳麦接口的功能。  The headset interface and the GPIO interface multiplexing circuit structure of the present invention can be configured as a headset interface or a GPIO interface, which expands the functions of the headset interface.
附图说明 DRAWINGS
本发明的耳麦接口与 GPIO接口复用电路结构由以下的实施例及附图给 出。  The headset interface and GPIO interface multiplexing circuit structure of the present invention are given by the following embodiments and the accompanying drawings.
图 1是本发明的耳麦接口与 GPIO接口复用电路结构的示意图。  1 is a schematic diagram showing the structure of a multiplexer circuit of a headset interface and a GPIO interface of the present invention.
图 2是本发明复用电路结构配置成传统耳麦接口的示意图。 图 3是本发明复用电路结构配置成 GPIO通用数据接口的示意图。 2 is a schematic diagram of a structure of a multiplexing circuit of the present invention configured as a conventional headset interface. 3 is a schematic diagram of a multiplexing circuit structure of the present invention configured as a GPIO general data interface.
图 4是本发明复用电路结构配置成 I2C接口的示意图。  4 is a schematic diagram of the structure of the multiplexing circuit of the present invention configured as an I2C interface.
图 5是本发明复用电路结构配置成两线接口的示意图。  FIG. 5 is a schematic diagram of the structure of the multiplexing circuit of the present invention configured as a two-wire interface.
具体实施方式 detailed description
以下将结合图 1〜图 5对本发明的耳麦接口与 GPIO接口复用电路结构作 进一步的详细描述。  The headset interface and GPIO interface multiplexing circuit structure of the present invention will be further described in detail below with reference to Figs.
参见图 1 , 本发明的耳麦接口与 GPIO接口复用电路结构包括主机基带、 第一通用输入输出 ( General Purpose Input Output, GPIO )接口 GPIOl、 第二 通用输入输出接口 GPI02、第三通用输入输出接口 GPI03、 麦克风接口 MIC、 左声道耳机接口 HPL、 右声道耳机接口 HPR和接地口 GND, 所述主机基带 包括低压差线性稳压器 LDO、可编程增益放大器 PGA、第一功率放大器 PA1、 第二功率放大器 PA2和接地端 GND1 ;  Referring to FIG. 1, the multiplex interface structure of the headset interface and the GPIO interface of the present invention includes a host baseband, a first general input/output (GPIO) interface GPIO1, a second universal input/output interface GPI02, and a third universal input/output interface. GPI03, microphone interface MIC, left channel headphone interface HPL, right channel headphone interface HPR and grounding port GND, the host baseband includes a low dropout linear regulator LDO, a programmable gain amplifier PGA, a first power amplifier PA1, Two power amplifiers PA2 and ground GND1;
上述主机基带也可以是主机音频编解码器, 该主机音频编解码器的结构 与上述主机基带的结构相同;  The host baseband may also be a host audio codec, and the structure of the host audio codec is the same as that of the host baseband;
所述低压差线性稳压器 LDO的输出端 11连接第一电阻 R1后与所述麦克 风接口 MIC连接, 所述麦克风接口 MIC连接第一电容 C1后与所述可编程增 益放大器 PGA的输入端 21连接, 所述第一通用输入输出接口 GPI01与所述 麦克风接口 MIC连接;  The output end 11 of the low-dropout linear regulator LDO is connected to the microphone interface MIC after being connected to the first resistor R1, and the microphone interface MIC is connected to the first capacitor C1 and the input end 21 of the programmable gain amplifier PGA. Connecting, the first universal input/output interface GPI01 is connected to the microphone interface MIC;
所述主机基带的接地端 GND1与所述接地口 GND连接;  The grounding terminal GND1 of the baseband of the host is connected to the grounding port GND;
所述第一功率放大器 PA1的输出端 31与所述左声道耳机接口 HPL连接, 所述第二通用输入输出接口 GPI02与所述左声道耳机接口 HPL连接;  The output end 31 of the first power amplifier PA1 is connected to the left channel headphone interface HPL, and the second universal input/output interface GPI02 is connected to the left channel headphone interface HPL;
所述第二功率放大器 PA2的输出端 41与所述右声道耳机接口 HPR连接, 所述第三通用输入输出接口 GPI03与所述右声道耳机接口 HPR连接。  An output 41 of the second power amplifier PA2 is connected to the right channel headphone interface HPR, and the third universal input/output interface GPI03 is connected to the right channel headphone interface HPR.
所述低压差线性稳压器 LDO的控制端 12与主机寄存器(图 1 中未示) 连接, 由所述主机寄存器发送来的第一控制信号 SHD— BIAS控制所述低压差 线性稳压器 LDO 的工作状态, 为了便于说明, 假定所述第一控制信号 SHD— BIAS为高电平时, 所述低压差线性稳压器 LDO断开, 同时, 所述低压 差线性稳压器 LDO的输出端 11置成高阻态, 所述第一控制信号 SHD— BIAS 为低电平时, 所述低压差线性稳压器 LDO 开启, 从所述低压差线性稳压器 LDO的输入端 13输入的电压 VDD经低压差线性稳压器 LDO稳压后, 通过 所述低压差线性稳压器 LDO 的输出端 11 输出, 得到麦克风偏置电压 MIC BIASo The control terminal 12 of the low dropout linear regulator LDO is connected to a host register (not shown in FIG. 1), and the first control signal SHD_BIAS sent by the host register controls the low dropout linear regulator LDO For the convenience of description, the low-dropout linear regulator LDO is turned off when the first control signal SHD_BIAS is at a high level, and the output terminal 11 of the low-dropout linear regulator LDO is simultaneously When the first control signal SHD_BIAS is at a low level, the low dropout linear regulator LDO is turned on, from the low dropout linear regulator The voltage VDD input to the input terminal 13 of the LDO is regulated by the low-dropout linear regulator LDO, and output through the output terminal 11 of the low-dropout linear regulator LDO to obtain a microphone bias voltage MIC BIASo.
所述可编程增益放大器 PGA的控制端 22与所述主机寄存器连接, 由所 述主机寄存器发送来的第二控制信号 SHD— MIC控制所述可编程增益放大器 PGA的工作状态, 所述可编程增益放大器 PGA的输出端 23与主机的模数转 换器(图 1中未示)连接, 为了便于说明, 假定所述第二控制信号 SHD— MIC 为高电平时,所述可编程增益放大器 PGA断开,所述第二控制信号 SHD— MIC 为低电平时,所述可编程增益放大器 PGA开启,从所述麦克风接口 MIC输入 的麦克风信息 MICIN经所述可编程增益放大器 PGA放大后, 由所述可编程 增益放大器 PGA的输出端 23输出, 所述可编程增益放大器 PGA输出的信号 MIC— ADC输入至所述主机的模数转换器。  The control terminal 22 of the programmable gain amplifier PGA is connected to the host register, and the second control signal SHD_MIC sent by the host register controls an operating state of the programmable gain amplifier PGA, the programmable gain The output terminal 23 of the amplifier PGA is connected to an analog-to-digital converter (not shown in FIG. 1) of the host. For convenience of explanation, the programmable gain amplifier PGA is turned off assuming that the second control signal SHD_MIC is at a high level. When the second control signal SHD_MIC is at a low level, the programmable gain amplifier PGA is turned on, and the microphone information MICN input from the microphone interface MIC is amplified by the programmable gain amplifier PGA, The output 23 of the programmable gain amplifier PGA is output, and the signal MIC-ADC output from the programmable gain amplifier PGA is input to an analog-to-digital converter of the host.
所述第一功率放大器 PA1的控制端 32与所述主机寄存器连接, 由所述主 机寄存器发送来的第三控制信号 SHD— HPL控制所述第一功率放大器 PA1的 工作状态, 所述第一功率放大器 PA1的输入端 33与主机的数模转换器(图 1 中未示)连接,为了便于说明,假定所述第三控制信号 SHD— HPL为高电平时, 所述第一功率放大器 PA1断开, 同时, 所述第一功率放大器 PA1的输出端 31 置成高阻态,所述第三控制信号 SHD— HPL为低电平时,所述第一功率放大器 PA1 开启, 所述主机的数模转换器发送的左声道耳机驱动信号 HPL— DAC通 过所述第一功率放大器 PA1的输出端 31输出。  The control terminal 32 of the first power amplifier PA1 is connected to the host register, and the third control signal SHD_HPL sent by the host register controls an operating state of the first power amplifier PA1, the first power The input terminal 33 of the amplifier PA1 is connected to a digital-to-analog converter (not shown in FIG. 1) of the host. For convenience of explanation, the first power amplifier PA1 is turned off when the third control signal SHD_HPL is at a high level. At the same time, the output terminal 31 of the first power amplifier PA1 is placed in a high impedance state, and when the third control signal SHD_HPL is at a low level, the first power amplifier PA1 is turned on, and the digital-to-analog conversion of the host is performed. The left channel headphone drive signal HPL_DAC transmitted by the device is output through the output terminal 31 of the first power amplifier PA1.
所述第二功率放大器 PA2的控制端 42与所述主机寄存器连接, 由所述主 机寄存器发送来的第四控制信号 SHD— HPR控制所述第二功率放大器 PA2的 工作状态,所述第二功率放大器 PA2的输入端 43与所述主机的数模转换器连 接, 为了便于说明, 假定所述第四控制信号 SHD— HPR为高电平时, 所述第 二功率放大器 PA2断开, 同时,所述第二功率放大器 PA2的输出端 41置成高 阻态, 所述第四控制信号 SHD— HPR为低电平时, 所述第二功率放大器 PA2 开启, 所述主机的数模转换器发送的右声道耳机驱动信号 HPR— DAC通过所 述第二功率放大器 PA2的输出端 41输出。  The control terminal 42 of the second power amplifier PA2 is connected to the host register, and the fourth control signal SHD_HPR sent by the host register controls the operating state of the second power amplifier PA2, the second power The input terminal 43 of the amplifier PA2 is connected to the digital-to-analog converter of the host. For convenience of explanation, the second power amplifier PA2 is turned off when the fourth control signal SHD_HPR is at a high level, and the The output terminal 41 of the second power amplifier PA2 is placed in a high impedance state, when the fourth control signal SHD_HPR is at a low level, the second power amplifier PA2 is turned on, and the right sound of the digital-to-analog converter sent by the host The channel headphone drive signal HPR_DAC is output through the output terminal 41 of the second power amplifier PA2.
所述第一通用输入输出接口 GPI01、 第二通用输入输出接口 GPI02和第 三通用输入输出接口 GPI03分别与所述主机寄存器连接, 由所述主机寄存器 控制其或为输入状态或为输出状态, 所述输入状态可以是浮空输入、 弱上拉 输入、 弱下拉输入, 所述输出状态可以是 NMOS管开漏输出、 PMOS管开漏 输出、 推挽输出。 即所述主机寄存器控制基带 /音频编解码器相应耳麦接口与 GPIO接口的工作状态, 通过不同的组合, 可以得到不同功能。 The first universal input/output interface GPI01, the second universal input/output interface GPI02, and the first The three general-purpose input/output interfaces GPI03 are respectively connected to the host register, and the host register controls whether it is an input state or an output state, and the input state may be a floating input, a weak pull-up input, or a weak pull-down input. The output state can be an NMOS open-drain output, a PMOS open-drain output, and a push-pull output. That is, the host register controls the working state of the corresponding headset interface and the GPIO interface of the baseband/audio codec, and different functions can be obtained through different combinations.
由于所述低压差线性稳压器 LDO的输出端 11、 可编程增益放大器 PGA 的输入端 21 与第一通用输入输出接口 GPI01 并联, 因此, 所述麦克风接口 MIC 就成为麦克风接口与通用输入输出接口的复用接口; 由于所述第一功率 放大器 PA1的输出端 31与第二通用输入输出接口 GPI02并联, 因此, 所述 左声道耳机接口 HPL就成为左声道耳机接口与通用输入输出接口的复用接 口; 由于所述第二功率放大器 PA2 的输出端 41 与第三通用输入输出接口 GPI03并联, 因此, 所述右声道耳机接口 HPR就成为右声道耳机接口与通用 输入输出接口的复用接口。  Since the output terminal 11 of the low-dropout linear regulator LDO and the input terminal 21 of the programmable gain amplifier PGA are connected in parallel with the first general-purpose input/output interface GPI01, the microphone interface MIC becomes a microphone interface and a universal input/output interface. The multiplexing interface of the first power amplifier PA1 is connected in parallel with the second universal input/output interface GPI02, so that the left channel headphone interface HPL becomes a left channel headphone interface and a universal input/output interface. The multiplexing interface; the output terminal 41 of the second power amplifier PA2 is connected in parallel with the third universal input/output interface GPI03, so that the right channel headphone interface HPR becomes a complex of the right channel headphone interface and the universal input/output interface. Use the interface.
当将所述耳麦接口与 GPIO接口复用电路结构配置成传统的耳麦接口时, 通过所述麦克风接口 MIC、 左声道耳机接口 HPL、 右声道耳机接口 HPR和接 地口 GND可实现主机与耳麦设备之间的连接, 当将所述耳麦接口与 GPIO接 口复用电路结构配置成通用输入输出接口时, 通过所述麦克风接口 MIC、 左 声道耳机接口 HPL、 右声道耳机接口 HPR和接地口 GND可实现主机与数据 接口设备之间的连接, 扩展了耳麦接口的功能。  When the headset interface and the GPIO interface multiplexing circuit structure are configured as a traditional headset interface, the host and the headset can be realized through the microphone interface MIC, the left channel headphone interface HPL, the right channel headphone interface HPR, and the grounding port GND. The connection between the devices, when the headset interface and the GPIO interface multiplexing circuit structure are configured as a universal input/output interface, through the microphone interface MIC, the left channel headphone interface HPL, the right channel headphone interface HPR, and the grounding port GND enables the connection between the host and the data interface device, extending the functionality of the headset interface.
现通过实施例详细说明本发明耳麦接口与 GPIO接口复用电路结构的使 用:  The use of the multiplexed circuit structure of the headset interface and the GPIO interface of the present invention will now be described in detail by way of an embodiment:
实施例一  Embodiment 1
参见图 2, 该实施例将所述耳麦接口与 GPIO接口复用电路结构配置成传 统的耳麦接口。 所述第一功率放大器 PA1的输出端 31连接第二电容 C2后与 所述左声道耳机接口 HPL连接,所述第二通用输入输出接口 GPI02与所述左 声道耳机接口 HPL连接; 所述第二功率放大器 PA2的输出端 41连接第三电 容 C3后与所述右声道耳机接口 HPR连接,所述第三通用输入输出接口 GPI03 与所述右声道耳机接口 HPR连接; 麦克风 51接在所述麦克风接口 MIC与接 地口 GND之间, 左耳机 52接在所述左声道耳机接口 HPL与接地口 GND之 间, 右耳机 53接在所述右声道耳机接口 HPR与接地口 GND之间。 所述主机 寄存器发送来的第一控制信号 SHD— BIAS、 第二控制信号 SHD— MIC、 第三控 制信号 SHD— HPL、 第四控制信号 SHD— HPR均为低电平, 相应地, 所述低压 差线性稳压器 LDO、 可编程增益放大器 PGA、 第一功率放大器 PA1和第二功 率放大器 PA2均开启, 所述第一通用输入输出接口 GPI01、 第二通用输入输 出接口 GPI02和第三通用输入输出接口 GPI03—般配置成浮空输入,对外体 现为高阻态,也可以将所述第一通用输入输出接口 GPI01配置成 NMOS开漏 输出。 Referring to FIG. 2, this embodiment configures the headset interface and the GPIO interface multiplexing circuit structure into a conventional headset interface. The output end 31 of the first power amplifier PA1 is connected to the left channel headphone interface HPL after being connected to the second capacitor C2, and the second universal input/output interface GPI02 is connected to the left channel headphone interface HPL; The output terminal 41 of the second power amplifier PA2 is connected to the right channel headphone interface HPR after being connected to the third capacitor C3, and the third universal input/output interface GPI03 is connected to the right channel headphone interface HPR; Between the microphone interface MIC and the grounding port GND, the left earphone 52 is connected to the left channel earphone interface HPL and the grounding port GND The right earphone 53 is connected between the right channel headphone interface HPR and the ground port GND. The first control signal SHD_BIAS, the second control signal SHD_MIC, the third control signal SHD-HPL, and the fourth control signal SHD-HPR sent by the host register are all low level, and correspondingly, the low voltage The differential linear regulator LDO, the programmable gain amplifier PGA, the first power amplifier PA1, and the second power amplifier PA2 are both turned on, the first general-purpose input/output interface GPI01, the second universal input/output interface GPI02, and the third general-purpose input and output. The interface GPI03 is generally configured as a floating input, and is externally embodied as a high impedance state. The first general-purpose input/output interface GPI01 can also be configured as an NMOS open-drain output.
实施例二  Embodiment 2
参见图 3 , 该实施例将所述耳麦接口与 GPIO接口复用电路结构配置成 GPIO通用数据接口。所述第一功率放大器 PA1的输出端 31连接第四电容 C4 后与所述左声道耳机接口 HPL连接,所述第二通用输入输出接口 GPI02与所 述左声道耳机接口 HPL连接; 所述第二功率放大器 PA2的输出端 41连接第 五电容 C5后与所述右声道耳机接口 HPR连接, 所述第三通用输入输出接口 GPI03与所述右声道耳机接口 HPR连接。 所述主机寄存器发送来的第一控制 信号 SHD— BIAS、 第二控制信号 SHD— MIC、 第三控制信号 SHD— HPL、 第四 控制信号 SHD— HPR均为高电平, 相应地, 所述低压差线性稳压器 LDO、 可 编程增益放大器 PGA、 第一功率放大器 PA1和第二功率放大器 PA2均断开, 对外体现为高阻态, 通过对所述第一通用输入输出接口 GPI01、 第二通用输 入输出接口 GPI02和第三通用输入输出接口 GPI03的配置形成总线, 实现主 机与数据接口设备之间的数据通信。  Referring to FIG. 3, this embodiment configures the headset interface and the GPIO interface multiplexing circuit structure into a GPIO general data interface. The output end 31 of the first power amplifier PA1 is connected to the left channel headphone interface HPL after being connected to the fourth capacitor C4, and the second universal input/output interface GPI02 is connected to the left channel headphone interface HPL; The output terminal 41 of the second power amplifier PA2 is connected to the right channel headphone interface HPR after being connected to the fifth capacitor C5, and the third universal input/output interface GPI03 is connected to the right channel headphone interface HPR. The first control signal SHD_BIAS, the second control signal SHD_MIC, the third control signal SHD-HPL, and the fourth control signal SHD-HPR sent by the host register are all at a high level, and correspondingly, the low voltage The differential linear regulator LDO, the programmable gain amplifier PGA, the first power amplifier PA1 and the second power amplifier PA2 are both turned off, and externally embodied as a high impedance state, through the first general-purpose input/output interface GPI01, the second universal The configuration of the input/output interface GPI02 and the third general-purpose input/output interface GPI03 form a bus to implement data communication between the host and the data interface device.
实施例三  Embodiment 3
参见图 4,该实施例将所述耳麦接口与 GPIO接口复用电路结构配置成 I2C 接口。 所述主机寄存器发送来的第一控制信号 SHD— BIAS、 第二控制信号 SHD— MIC、 第三控制信号 SHD— HPL、 第四控制信号 SHD— HPR均为高电平, 相应地, 所述低压差线性稳压器 LDO、 可编程增益放大器 PGA、 第一功率放 大器 PA1和第二功率放大器 PA2均断开, 对外体现为高阻态, 而所述第一通 用输入输出接口 GPIO 1、 第二通用输入输出接口 GPI02和第三通用输入输出 接口 GPI03通过合适的配置形成 I2C接口, 在配置这三个通用输入输出接口 时, 可以轮换, 图 4只显示了其中一种可能的配置。 如图 4所示, 将所述第 一通用输入输出接口 GPI01配置成 I2C接口的数据线 SDA, 将所述第二通用 输入输出接口 GPI02配置成 I2C接口的电源线 VDD ,将所述第三通用输入输 出接口 GPI03配置成 I2C接口的时钟线 SCL; 所述第一功率放大器 PA1的输 出端 31连接第六电容 C6后与所述左声道耳机接口 HPL连接, 所述第二通用 输入输出接口 GPI02与所述左声道耳机接口 HPL连接,所述第二功率放大器 PA2的输出端 41连接第七电容 C7后与所述右声道耳机接口 HPR连接, 所述 第三通用输入输出接口 GPI03与所述右声道耳机接口 HPR连接,在所述麦克 风接口 MIC与所述左声道耳机接口 HPL之间连接第三电阻 R3 , 在所述左声 道耳机接口 HPL与所述右声道耳机接口 HPR之间连接第二电阻 R2 ,根据 I2C 协议, 所述第一通用输入输出接口 GPI01配置成 NMOS开漏输出, 所述第二 通用输入输出接口 GPI02配置成恒 "1"输出来提供电源,所述第三通用输入输 出接口 GPI03配置成 NMOS开漏输出,在数据总线上可以挂多个 I2C接口设 备 61 , 所述 I2C接口设备 61例如是陀螺仪、 加速度计、 温度计、 压力计等。 Referring to FIG. 4, this embodiment configures the headset interface and the GPIO interface multiplexing circuit structure as an I2C interface. The first control signal SHD_BIAS, the second control signal SHD_MIC, the third control signal SHD-HPL, and the fourth control signal SHD-HPR sent by the host register are all at a high level, and correspondingly, the low voltage The differential linear regulator LDO, the programmable gain amplifier PGA, the first power amplifier PA1, and the second power amplifier PA2 are both turned off, and externally embodied as a high-impedance state, and the first general-purpose input/output interface GPIO 1 and the second universal The input and output interface GPI02 and the third general-purpose input/output interface GPI03 form an I2C interface through proper configuration, and the three general-purpose input and output interfaces are configured. When it is possible to rotate, Figure 4 shows only one of the possible configurations. As shown in FIG. 4, the first general-purpose input/output interface GPI01 is configured as a data line SDA of an I2C interface, and the second general-purpose input/output interface GPI02 is configured as a power line VDD of an I2C interface, and the third universal The input/output interface GPI03 is configured as a clock line SCL of the I2C interface; the output end 31 of the first power amplifier PA1 is connected to the left-channel headphone interface HPL after being connected to the sixth capacitor C6, and the second universal input/output interface GPI02 Connected to the left channel headphone interface HPL, the output end 41 of the second power amplifier PA2 is connected to the right channel headphone interface HPR after being connected to the seventh capacitor C7, and the third universal input/output interface GPI03 and the a right channel headphone interface HPR connection, a third resistor R3 is connected between the microphone interface MIC and the left channel headphone interface HPL, and the left channel headphone interface HPL and the right channel headphone interface HPR A second resistor R2 is connected between the first general-purpose input/output interface GPI01 and an NMOS open-drain output according to the I2C protocol, and the second universal input/output interface GPI02 is configured to output a constant "1" to provide power. Three universal input-output interface is configured to GPI03 NMOS open drain output, the data bus can be linked to multiple I2C interface devices 61, the I2C interface device 61 is, for example a gyroscope, an accelerometer, a thermometer, a pressure gauge.
实施例四  Embodiment 4
参见图 5, 该实施例将所述耳麦接口与 GPIO接口复用电路结构配置成两 线接口。 所述主机寄存器发送来的第一控制信号 SHD— BIAS、 第二控制信号 SHD— MIC、 第三控制信号 SHD— HPL、 第四控制信号 SHD— HPR均为高电平, 相应地, 所述低压差线性稳压器 LDO、 可编程增益放大器 PGA、 第一功率放 大器 PA1和第二功率放大器 PA2均断开, 对外体现为高阻态, 而所述第一通 用输入输出接口 GPIO 1、 第二通用输入输出接口 GPI02和第三通用输入输出 接口 GPI03通过合适的配置形成两线接口, 如图 5所示, 将所述第一通用输 入输出接口 GPI01 配置成两线接口的数据线 SDIN, 将所述第二通用输入输 出接口 GPI02配置成两线接口的电源线 VDD,将所述第三通用输入输出接口 GPI03配置成两线接口的时钟线 SCLK; 所述第一功率放大器 PA1的输出端 31连接第八电容 C8后与所述左声道耳机接口 HPL连接, 所述第二通用输入 输出接口 GPI02与所述左声道耳机接口 HPL连接,所述第二功率放大器 PA2 的输出端 41连接第九电容 C9后与所述右声道耳机接口 HPR连接, 所述第三 通用输入输出接口 GPI03与所述右声道耳机接口 HPR连接,在所述麦克风接 口 MIC与所述左声道耳机接口 HPL之间连接第四电阻 R4 , 在所述左声道耳 机接口 HPL与所述右声道耳机接口 HPR之间连接第五电阻 R5 , 根据两线接 口协议, 所述第一通用输入输出接口 GPI01配置成 NMOS开漏输出, 所述第 二通用输入输出接口 GPI02配置成恒 "1"输出来提供电源,所述第三通用输入 输出接口 GPI03配置成 NMOS开漏输出,在数据总线上可以挂多个两线接口 设备 71。 Referring to FIG. 5, the embodiment configures the headset interface and the GPIO interface multiplexing circuit structure into a two-wire interface. The first control signal SHD_BIAS, the second control signal SHD_MIC, the third control signal SHD-HPL, and the fourth control signal SHD-HPR sent by the host register are all at a high level, and correspondingly, the low voltage The differential linear regulator LDO, the programmable gain amplifier PGA, the first power amplifier PA1, and the second power amplifier PA2 are both turned off, and externally embodied as a high-impedance state, and the first general-purpose input/output interface GPIO 1 and the second universal The input/output interface GPI02 and the third general-purpose input/output interface GPI03 form a two-wire interface through a suitable configuration. As shown in FIG. 5, the first general-purpose input/output interface GPI01 is configured as a data line SDIN of a two-wire interface, and the The second general-purpose input/output interface GPI02 is configured as a power line VDD of the two-wire interface, and the third general-purpose input/output interface GPI03 is configured as a clock line SCLK of the two-wire interface; the output end 31 of the first power amplifier PA1 is connected to The eight-capacitor C8 is connected to the left-channel headphone interface HPL, and the second universal input-output interface GPI02 is connected to the left-channel headphone interface HPL, the second power amplifier The output terminal 41 of the PA2 is connected to the right channel headphone interface HPR after being connected to the ninth capacitor C9, and the third universal input/output interface GPI03 is connected to the right channel headphone interface HPR, and is connected to the microphone. A fourth resistor R4 is connected between the port MIC and the left channel headphone jack HPL, and a fifth resistor R5 is connected between the left channel headphone jack HPL and the right channel headphone jack HPR according to the two-wire interface protocol. The first general-purpose input/output interface GPI01 is configured as an NMOS open-drain output, the second general-purpose input/output interface GPI02 is configured to be a constant "1" output to provide power, and the third general-purpose input/output interface GPI03 is configured to be an NMOS-on With the leakage output, a plurality of two-wire interface devices 71 can be hung on the data bus.
实施例五  Embodiment 5
该实施例将所述耳麦接口与 GPIO接口复用电路结构配置成 USB接口。 所述第一功率放大器的输出端连接一电容后与所述左声道耳机接口连接, 所 述第二功率放大器的输出端连接一电容后与所述右声道耳机接口连接, 在所 述麦克风接口与所述左声道耳机接口之间连接一电阻, 在所述左声道耳机接 口与所述右声道耳机接口之间连接一电阻; 所述主机寄存器发送来的第一控 制信号 SHD— BIAS、 第二控制信号 SHD— MIC、 第三控制信号 SHD— HPL、 第 四控制信号 SHD— HPR均为高电平, 相应地, 所述低压差线性稳压器 LDO、 可编程增益放大器 PGA、第一功率放大器 PA1和第二功率放大器 PA2均断开, 对外体现为高阻态; 将所述第一通用输入输出接口配置成 USB接口的正差分 数据线(D+ ), 将所述第二通用输入输出接口配置成 USB接口的电源线, 将 所述第三通用输入输出接口配置成 USB接口的负的差分数据线( D— λ  In this embodiment, the headset interface and the GPIO interface multiplexing circuit structure are configured as a USB interface. The output of the first power amplifier is connected to the left channel earphone interface, and the output end of the second power amplifier is connected to the right channel earphone interface, and the microphone is connected to the right channel earphone. A resistor is connected between the interface and the left channel earphone interface, and a resistor is connected between the left channel earphone interface and the right channel earphone interface; the first control signal SHD sent by the host register is The BIAS, the second control signal SHD_MIC, the third control signal SHD-HPL, and the fourth control signal SHD-HPR are all at a high level, and accordingly, the low-dropout linear regulator LDO, the programmable gain amplifier PGA, The first power amplifier PA1 and the second power amplifier PA2 are both turned off and externally embodied as a high impedance state; the first general-purpose input/output interface is configured as a positive differential data line (D+) of the USB interface, and the second universal The input/output interface is configured as a power cable of the USB interface, and the third universal input/output interface is configured as a negative differential data line of the USB interface (D_λ
显然, 本领域的技术人员可以对发明进行各种改动和变型而不脱离本发 明的精神和范围。 这样, 倘若本发明的这些修改和变型属于本发明权利要求 及其等同技术的范围之内, 则本发明也意图包括这些改动和变型在内。  It will be apparent that those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and modifications of the invention

Claims

权利要求 Rights request
1、一种耳麦接口与通用输入输出接口复用电路结构, 其特征在于, 包括: 主机基带或主机音频编解码器、 第一通用输入输出接口、 第二通用输入输出 接口、 第三通用输入输出接口、 麦克风接口、 左声道耳机接口、 右声道耳机 接口和接地口, 所述主机基带或主机音频编解码器包括低压差线性稳压器、 可编程增益放大器、 第一功率放大器、 第二功率放大器和接地端; A multiplexer circuit structure for a headset interface and a universal input/output interface, comprising: a host baseband or a host audio codec, a first universal input/output interface, a second universal input/output interface, and a third universal input/output An interface, a microphone interface, a left channel headphone jack, a right channel headphone jack, and a ground port, the host baseband or host audio codec including a low dropout linear regulator, a programmable gain amplifier, a first power amplifier, a second Power amplifier and ground terminal;
所述低压差线性稳压器的输出端连接第一电阻后与所述麦克风接口连 接, 所述麦克风接口连接第一电容后与所述可编程增益放大器的输入端连接, 所述第一通用输入输出接口与所述麦克风接口连接;  The output end of the low-dropout linear regulator is connected to the microphone interface after being connected to the first resistor, and the microphone interface is connected to the first capacitor and connected to the input end of the programmable gain amplifier, the first universal input An output interface is connected to the microphone interface;
所述主机基带或主机音频编解码器的接地端与所述接地口连接; 所述第一功率放大器的输出端与所述左声道耳机接口连接, 所述第二通 用输入输出接口与所述左声道耳机接口连接;  a ground end of the host baseband or the host audio codec is connected to the grounding port; an output end of the first power amplifier is connected to the left channel earphone interface, the second universal input/output interface is Left channel headphone jack connection;
所述第二功率放大器的输出端与所述右声道耳机接口连接, 所述第三通 用输入输出接口与所述右声道耳机接口连接。  An output end of the second power amplifier is connected to the right channel earphone interface, and the third universal input/output interface is connected to the right channel earphone interface.
2、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述低压差线性稳压器的控制端与主机寄存器连接, 由所述主机 寄存器控制其工作状态, 所述低压差线性稳压器的输入端连接主机传送来的 电压, 该主机传送来的电压经所述低压差线性稳压器稳压后输出麦克风偏置 电压。  2. The headset interface and the universal input/output interface multiplexing circuit structure according to claim 1, wherein a control end of the low dropout linear regulator is connected to a host register, and the working state is controlled by the host register. The input end of the low-dropout linear regulator is connected to a voltage transmitted from a host, and the voltage transmitted from the host is regulated by the low-dropout linear regulator to output a microphone bias voltage.
3、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述可编程增益放大器的控制端与主机寄存器连接, 由所述主机 寄存器控制其工作状态, 所述可编程增益放大器的输出端与主机的模数转换 器连接。  3. The headset interface and the universal input/output interface multiplexing circuit structure according to claim 1, wherein a control end of the programmable gain amplifier is connected to a host register, and the host register controls the working state thereof. The output of the programmable gain amplifier is coupled to an analog to digital converter of the host.
4、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述第一功率放大器的控制端与主机寄存器连接, 由所述主机寄 存器控制其工作状态, 所述第一功率放大器的输入端与主机的数模转换器连 接。  The multiplexer circuit structure of the headset interface and the universal input/output interface according to claim 1, wherein the control end of the first power amplifier is connected to a host register, and the working state of the host is controlled by the host register. The input of the first power amplifier is connected to the digital-to-analog converter of the host.
5、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述第二功率放大器的控制端与主机寄存器连接, 由所述主机寄 存器控制其工作状态, 所述第二功率放大器的输入端与主机的数模转换器连 接。 5. The headset interface and universal input/output interface multiplexing circuit structure according to claim 1, The control terminal of the second power amplifier is connected to a host register, and the working state is controlled by the host register, and the input end of the second power amplifier is connected to a digital-to-analog converter of the host.
6、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述第一通用输入输出接口、 第二通用输入输出接口和第三通用 输入输出接口分别与所述主机寄存器连接, 由所述主机寄存器控制其或为输 入状态或为输出状态。  The multiplexer circuit structure of the headset interface and the universal input/output interface according to claim 1, wherein the first universal input/output interface, the second universal input/output interface, and the third universal input/output interface are respectively The host register is connected, and the host register controls whether it is an input state or an output state.
7、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述第一功率放大器的输出端连接一电容后与所述左声道耳机接 口连接, 所述第二功率放大器的输出端连接一电容后与所述右声道耳机接口 连接, 麦克风接在所述麦克风接口与接地口之间, 左耳机接在所述左声道耳 机接口与接地口之间, 右耳机接在所述右声道耳机接口与接地口之间, 所述 低压差线性稳压器、 可编程增益放大器、 第一功率放大器和第二功率放大器 均开启, 所述第一通用输入输出接口、 第二通用输入输出接口和第三通用输 入输出接口均配置成浮空输入。  The multiplexer circuit structure of the headset interface and the universal input/output interface according to claim 1, wherein the output end of the first power amplifier is connected to the left channel earphone interface after being connected to a capacitor, The output of the second power amplifier is connected to the right channel headphone interface, the microphone is connected between the microphone interface and the ground port, and the left earphone is connected between the left channel headphone interface and the grounding port. The right earphone is connected between the right channel earphone interface and the grounding port, and the low dropout linear regulator, the programmable gain amplifier, the first power amplifier and the second power amplifier are both turned on, the first universal input The output interface, the second general purpose input and output interface, and the third general purpose input and output interface are all configured as floating inputs.
8、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述第一功率放大器的输出端连接一电容后与所述左声道耳机接 口连接, 所述第二功率放大器的输出端连接一电容后与所述右声道耳机接口 连接, 所述低压差线性稳压器、 可编程增益放大器、 第一功率放大器和第二 功率放大器均断开, 通过对所述第一通用输入输出接口、 第二通用输入输出 接口和第三通用输入输出接口的配置形成总线。  The multiplexer circuit structure of the headset interface and the universal input/output interface according to claim 1, wherein the output end of the first power amplifier is connected to the left channel earphone interface after being connected to a capacitor, The output of the second power amplifier is connected to the right channel headphone and connected to the right channel headphone. The low dropout linear regulator, the programmable gain amplifier, the first power amplifier and the second power amplifier are all disconnected. The configuration of the first general purpose input output interface, the second universal input output interface, and the third general purpose input and output interface form a bus.
9、 如权利要求 1所述的耳麦接口与通用输入输出接口复用电路结构, 其 特征在于, 所述第一功率放大器的输出端连接一电容后与所述左声道耳机接 口连接, 所述第二功率放大器的输出端连接一电容后与所述右声道耳机接口 连接, 在所述麦克风接口与所述左声道耳机接口之间连接一电阻, 在所述左 声道耳机接口与所述右声道耳机接口之间连接一电阻; 所述低压差线性稳压 器、 可编程增益放大器、 第一功率放大器和第二功率放大器均断开; 将所述 第一通用输入输出接口配置成 I2C接口的数据线, 将所述第二通用输入输出 接口配置成 I2C接口的电源线, 将所述第三通用输入输出接口配置成 I2C接 口的时钟线。 The multiplexer circuit structure of the headset interface and the universal input/output interface according to claim 1, wherein the output end of the first power amplifier is connected to the left channel earphone interface after being connected to a capacitor, The output of the second power amplifier is connected to the right channel earphone interface, and a resistor is connected between the microphone interface and the left channel earphone interface, and the left channel earphone interface Connecting a resistor between the right channel headphone interface; the low dropout linear regulator, the programmable gain amplifier, the first power amplifier and the second power amplifier are both disconnected; configuring the first universal input/output interface to a data line of the I2C interface, the second universal input/output interface is configured as a power line of the I2C interface, and the third universal input/output interface is configured as an I2C interface. The clock line of the mouth.
10、 如权利要求 1 所述的耳麦接口与通用输入输出接口复用电路结构, 其特征在于, 所述第一功率放大器的输出端连接一电容后与所述左声道耳机 接口连接, 所述第二功率放大器的输出端连接一电容后与所述右声道耳机接 口连接, 在所述麦克风接口与所述左声道耳机接口之间连接一电阻, 在所述 左声道耳机接口与所述右声道耳机接口之间连接一电阻; 所述低压差线性稳 压器、 可编程增益放大器、 第一功率放大器和第二功率放大器均断开; 将所 述第一通用输入输出接口配置成两线接口的数据线, 将所述第二通用输入输 出接口配置成两线接口的电源线, 将所述第三通用输入输出接口配置成两线 接口的时钟线。  The multiplexer circuit structure of the headset interface and the universal input/output interface according to claim 1, wherein the output end of the first power amplifier is connected to the left channel earphone interface after being connected to a capacitor, The output of the second power amplifier is connected to the right channel earphone interface, and a resistor is connected between the microphone interface and the left channel earphone interface, and the left channel earphone interface Connecting a resistor between the right channel headphone interface; the low dropout linear regulator, the programmable gain amplifier, the first power amplifier and the second power amplifier are both disconnected; configuring the first universal input/output interface to The data line of the two-wire interface configures the second universal input/output interface as a power line of the two-wire interface, and configures the third universal input/output interface as a clock line of the two-wire interface.
11、利要求 1所述的耳麦接口与通用输入输出接口复用电路结构,其特征 在于, 所述第一功率放大器的输出端连接一电容后与所述左声道耳机接口连 接, 所述第二功率放大器的输出端连接一电容后与所述右声道耳机接口连接, 在所述麦克风接口与所述左声道耳机接口之间连接一电阻, 在所述左声道耳 机接口与所述右声道耳机接口之间连接一电阻; 所述低压差线性稳压器、 可 编程增益放大器、 第一功率放大器和第二功率放大器均断开; 将所述第一通 用输入输出接口配置成 USB接口的正差分数据线, 将所述第二通用输入输出 接口配置成 USB接口的电源线, 将所述第三通用输入输出接口配置成 USB 接口的负的差分数据线。  The multiplexer circuit structure of the headset interface and the universal input/output interface according to claim 1, wherein the output end of the first power amplifier is connected to the left channel headphone interface, and the The output of the second power amplifier is connected to the right channel earphone interface, and a resistor is connected between the microphone interface and the left channel earphone interface, and the left channel earphone interface is connected to the Connecting a resistor between the right channel headphone interface; the low dropout linear regulator, the programmable gain amplifier, the first power amplifier and the second power amplifier are both disconnected; configuring the first universal input/output interface as a USB A positive differential data line of the interface, the second universal input/output interface is configured as a power line of the USB interface, and the third universal input/output interface is configured as a negative differential data line of the USB interface.
PCT/CN2012/086745 2011-12-20 2012-12-17 Earphone interface and gpio interface multiplexing circuit structure WO2013091516A1 (en)

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