WO2013089405A1 - Système de blindage pour dispositif mobile et procédé d'assemblage du système - Google Patents

Système de blindage pour dispositif mobile et procédé d'assemblage du système Download PDF

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Publication number
WO2013089405A1
WO2013089405A1 PCT/KR2012/010726 KR2012010726W WO2013089405A1 WO 2013089405 A1 WO2013089405 A1 WO 2013089405A1 KR 2012010726 W KR2012010726 W KR 2012010726W WO 2013089405 A1 WO2013089405 A1 WO 2013089405A1
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WO
WIPO (PCT)
Prior art keywords
pcb
lead
back side
fixing
cover
Prior art date
Application number
PCT/KR2012/010726
Other languages
English (en)
Inventor
Jeong Ung Kim
Jae Woo Jeong
Kun Tak Kim
Hyun Joo Han
Se Young Jang
Original Assignee
Samsung Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co., Ltd. filed Critical Samsung Electronics Co., Ltd.
Publication of WO2013089405A1 publication Critical patent/WO2013089405A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Definitions

  • the present invention relates to a shielding system for a mobile device. More particularly, the present invention relates to a shielding system that can be easily installed on a Printed Circuit Board (PCB) of a mobile device for increasing the stiffness of the PCB, without causing pressure to applied to the PCB, and a method for assembling the shielding system.
  • PCB Printed Circuit Board
  • mobile devices As technology for mobile devices continues to be developed, the number of users of such mobile devices continues to increase. That is, because mobile devices provide a mobile communication function, as well as various additional functions based on the convergence of technologies, mobile devices are commonly used. Moreover, mobile devices continue to be developed to provide a variety of advanced functions to meet users’ needs. To this end, they are equipped with a variety of hardware components.
  • a mobile device integrates a communication chip for supporting a mobile communication function and a process chip for supporting a multimedia function onto one PCB.
  • the PCB may also include a processing chip for supporting a touch screen function, and various modules for supporting a number of user functions, such as a broadcast receiving module, a short-range communication module, etc.
  • the hardware components perform switching operations to process data, they cause noise. Such noise affects the nearby processing chips.
  • the PCB of the related art is partially covered with a conductive shield enclosure. Such a conductive shield enclosure is intended to prevent the propagation of noise and to provide stiffness to the PCB.
  • Shield enclosures of the related art are fixed onto PCBs via mechanical members, such as screws.
  • a PCB includes coupling areas that allows the PCB to be coupled with the shield enclosure by a mechanical means such as a screw.
  • the shield enclosure is placed on the PCB and then fixed thereon as screws are coupled to the coupling areas.
  • shield enclosures of the related art that are fixed to PCBs via a screw coupling system are disadvantageous in that they come off the PCBs, provide only a small number of coupling space areas due to the volume limitation of mobile devices, and thus cannot provide a sufficient level of stiffness to adequately support the mobile device.
  • a shielding system for a mobile device comprising: a Printed Circuit Board, PCB; and a shield enclosure coupled to the PCB, and arranged to surround components on the front side of the PCB; wherein the shield enclosure is coupled to at least one of a lateral side and a back side of the PCB.
  • a method for assembling a shielding system for a mobile device comprising: providing a Printed Circuit Board, PCB; providing a shield enclosure that comprises a cover, above the PCB, and a fixing lead extending from the cover; and coupling the fixing lead to at least one of a lateral side and a back side of the PCB.
  • the shielding system and the method for assembling the system can tightly fix the shield enclosure to the PCB, providing a proper coupling space area where components will be installed, and can reduce the size of mobile devices.
  • the shielding system and the method for assembling the system can increase the stiffness of a PCB via the shield enclosure.
  • FIG. 1 illustrates a perspective view showing a shielding system according to a first exemplary embodiment of the present invention
  • FIG. 2 illustrates a perspective view showing a shield enclosure of the shielding system shown in FIG. 1 according to an exemplary embodiment of the present invention
  • FIG. 3 illustrates a perspective view showing the Printed Circuit Board (PCB) shown in FIG. 1 according to an exemplary embodiment of the present invention
  • FIG. 4 illustrates a side view showing the shield enclosure shown in FIG. 1 along a lengthwise direction according to an exemplary embodiment of the present invention
  • FIG. 5 illustrates a side view showing the shield enclosure shown in FIG. 1 along a widthwise direction according to an exemplary embodiment of the present invention
  • FIG. 6 illustrates a top view showing the shield enclosure shown in FIG. 1 according to an exemplary embodiment of the present invention
  • FIG. 7 illustrates a perspective view showing a shielding system according to a second exemplary embodiment of the present invention
  • FIG. 8 illustrates a perspective view showing a shield enclosure of the shielding system shown in FIG. 7 according to an exemplary embodiment of the present invention
  • FIG. 9 illustrates a perspective view showing a PCB shown in FIG. 7 according to an exemplary embodiment of the present invention.
  • FIG. 10 illustrates a side view showing the shield enclosure shown in FIG. 7 along a lengthwise direction according to an exemplary embodiment of the present invention
  • FIG. 11 illustrates a side view showing the shield enclosure shown in FIG. 7 along a widthwise direction according to an exemplary embodiment of the present invention
  • FIG. 12 illustrates a perspective view showing a shielding system according to a third exemplary embodiment of the present invention.
  • FIG. 13 illustrates a perspective view showing a shielding system according to a fourth exemplary embodiment of the present invention
  • FIG. 14 illustrates a perspective view showing a modification of the shielding system shown in FIG. 13 according to an exemplary embodiment of the present invention
  • FIG. 15 illustrates a perspective view showing a shielding system according to a fifth exemplary embodiment of the present invention.
  • FIG. 16 illustrates a flowchart that describes a method for assembling a shielding system according to an exemplary embodiment of the present invention.
  • FIG. 1 illustrates a perspective view showing a shielding system according to a first exemplary embodiment of the present invention.
  • FIG. 2 illustrates a perspective view showing a shield enclosure of the shielding system shown in FIG. 1 according to an exemplary embodiment of the present invention.
  • FIG. 3 illustrates a perspective view showing a Printed Circuit Board (PCB) shown in FIG. 1 according to an exemplary embodiment of the present invention.
  • FIG. 4 illustrates a side view showing the shield enclosure shown in FIG. 1 along a lengthwise direction according to an exemplary embodiment of the present invention.
  • FIG. 5 illustrates a side view showing the shield enclosure shown in FIG. 1 along a widthwise direction according to an exemplary embodiment of the present invention.
  • FIG. 6 illustrates a top view showing the shield enclosure shown in FIG. 1 according to an exemplary embodiment of the present invention.
  • the shielding system 10 includes a shield enclosure 100 and a PCB 200.
  • the shielding system 10 is designed in such a way that fixing members of the shield enclosure 100 are coupled to the sides of the PCB 200.
  • the design can tightly fix the shield enclosure 100 to the PCB 200 so that it can enclose components on the PCB, without requiring additional space from the PCB 200 in order to fix the shield enclosure 100 to the PCB. Therefore, the design allows the shield enclosure 100 to address the creation of noise from the components on the PCB 200 and also allows the shield enclosure 100 to provide stiffness to the PCB 200, thereby preventing the components on the PCB 200 from being damaged by an external impact, while minimising space requirements.
  • the shield enclosure 100 is designed in such a way that at least one contact lead 135 contacts at least a part of a side of the PCB 200 and a cover 115 encloses components on the PCB 200.
  • the cover 115 is shaped to enclose one or more edges of components on the PCB 200 and is made of a material for shielding noise, such as a conductive material, etc.
  • the cover 115 may be shaped as a band with a certain width.
  • the cover 115 includes a band 110 which is generally rectangular according to the shape of the PCB 200 and at least one extension area 120 extended from at least one side of the band 110.
  • the illustrated exemplary embodiment is implemented in such a way that the cover 115 is formed to be empty in the center portion, it should be understood that the invention is not limited thereto.
  • the cover 115 may be shaped as a continuous plate having no hole in the center portion, as a discontinuous plate having a plurality of holes, slots, or similar openings formed therein, and the like.
  • the cover 115 is implemented in such a way that a fundamental frame is formed as a band with a certain width along the edge and an extension frame is coupled to the fundamental frame to enclose the components in the PCB 200.
  • the extension frame mitigates noise from components in the PCB 200 and provides stiffness to the PCB 200.
  • the fundamental frame and the extension frame are made of a conductive material, e.g., a metal.
  • Each contact lead 135 is formed in such a way that it is extended from the side or edge of the cover 115 toward the PCB 200.
  • the contact leads 135 include at least one fixing lead 140 for contacting the side of the PCB 200 to fix the shield enclosure 100 to the PCB, and at least one supporting lead 130 contacting a front side of the PCB 200 to support the shield enclosure 100 upon the front side of the PCB.
  • the supporting leads 130 include one or more walls extended from the cover 115.
  • the supporting leads 130 may include one or more walls extended perpendicular to the cover 115.
  • the supporting leads 130 support the shield enclosure 100 in such a way that ends of the supporting leads 130 contact the front side of the PCB 200.
  • the PCB 200 may include grooves on the front side to receive the ends of the supporting lead 130, which will be described in greater detail later, referring to the accompanying drawings.
  • the fixing leads 140 extend from the edge of the cover 115 toward the PCB 200 and are long enough for end portions of the fixing leads 140 to contact the side of the PCB 200.
  • the fixing leads 140 extend from the edge of the extension area 120 of the cover 115 toward the PCB 200 so that they can contact the side of the PCB 200 when the contact leads 135 are placed on the front side of the PCB 200.
  • the extension area 120 of the cover 115 has a greater width than the other part of the cover 115.
  • Each fixing lead 140 extends from the edge of the extension area 120 toward the PCB 200, so that an end portion can contact the side of the PCB 200.
  • the fixing leads 140 are longer than the supporting leads 130.
  • the or each extension area 120 extends from the edge of the band 110 toward the outside (i.e., an outer edge of the PCB) so that each fixing lead 140 extending toward the PCB 200 from an edge of an extension area 120 can contact the side of the PCB 200. Therefore, the width of the extension area 120 is the summation of the distance from a point where a supporting lead 130 is placed on the PCB 200 to the edge of the PCB 200 and the thickness of the fixing lead 140. As shown in FIG. 2, the extension areas 120 are formed on lengthwise sides of the cover 115. Therefore, the fixing leads 140 are also formed on lengthwise sides of the cover 115.
  • the illustrated exemplary embodiment is implemented in such a way that the fixing leads 140 are formed at both lengthwise sides of the cover 115 respectively, it should be understood that the invention is not limited thereto. That is, the fixing leads 140 and the extension areas 120 may be formed on one or more sides of the cover 115 shaped as a band, so that the fixing leads 140 can contact corresponding sides of the PCB 200.
  • the fixing leads 140 may be formed in such a way that their number and their width are set by at least one of the four sides of the PCB 200 that the corresponding fixing leads will contact. In that case, the number of extension areas 120 is set according to the number of fixing leads 140.
  • the fixing leads 140 are formed at both lengthwise sides of the cover 115, and the supporting leads 130 are formed around the periphery of the cover 115.
  • the PCB 200 supports a number of hardware components for the mobile device and wires for transferring signals between components (not shown).
  • the PCB 200 may also be implemented with a substrate onto which one or more copper sheets are laminated, forming multi-layers for space efficiency (not shown).
  • the PCB 200 may include one or more contact areas 210 for contacting the or each fixing lead 140 of the shield enclosure 100 on one or more sides.
  • the contact areas 210 are designed in such a way that a lead placement groove 211 extends into the PCB by a certain distance from the level of the PCB side surface.
  • a soldering material 213 may be provided in the lead placement groove 211.
  • the number and the shape of the lead placement grooves 211 correspond to the number and shape of the fixing leads 140.
  • the PCB 200 may be provided with four lead placement grooves 211 at corresponding locations on the side of the PCB.
  • Each of the four lead placement grooves 211 may also be filled with soldering material 213.
  • the four side walls of the fixing lead 140 of the shield enclosure 100 are arranged corresponding to and in contact with the lead placement grooves 211.
  • the four side walls of the fixing lead 140 of the shield enclosure 100 may then be coupled to the soldering materials 213 therein via a reflow process.
  • soldering material 213 In order to place soldering material 213 into a lead placement groove 211, a pad on which soldering material is deposited may be applied to the lead placement groove 211.
  • soldering material 213 may be placed into the grooves 211 using any of a plurality of methods.
  • the shield enclosure 100 is coupled to the PCB 200 in such a way that each fixing lead 140 contacts and is fixed to the side of the PCB 200. In this manner, the PCB 200 does not require a fixing space to adhere the shield enclosure 100 thereto, thus enabling the PCB 200 to be made smaller. Moreover, if hardware components need to be arranged on the front side of the PCB 200, the exemplary shielding system 10 can provide enough space to stably arrange them. In addition, since each fixing lead 140 of the shield enclosure 100 is tightly fixed to the soldering material 213 of the PCB 200 via a soldering process, the shield enclosure 100 can be permanently coupled to the PCB 200 which provides stiffness to the PCB 200. Therefore, the exemplary shielding system 10 can prevent damage to and therefore increase the reliability of hardware components mounted on the PCB 200.
  • FIG. 7 illustrates a perspective view showing a shielding system according to a second exemplary embodiment of the present invention.
  • FIG. 8 illustrates a perspective view showing a shield enclosure of the shielding system shown in FIG. 7 according to an exemplary embodiment of the present invention.
  • FIG. 9 illustrates a perspective view showing a PCB shown in FIG. 7 according to an exemplary embodiment of the present invention.
  • FIG. 10 illustrates a side view showing the shield enclosure shown in FIG. 7 along a lengthwise direction according to an exemplary embodiment of the present invention.
  • FIG. 11 illustrates a side view showing the shield enclosure shown in FIG. 7 along a widthwise direction according to an exemplary embodiment of the present invention.
  • the shielding system 10 includes a shield enclosure 100 and a PCB 200.
  • the shield enclosure 100 includes at least one fixing lead 140 having a hook 141 formed at the end.
  • the shield enclosure 100 is coupled to the PCB 200 in such a way that, when each fixing lead 140 contacts the side of the PCB 200, the hook 141 hooks the back side of the PCB 200. That is, the shield enclosure 100 can be fixed to the PCB 200 in such a way that the hook 141 of each fixing lead 140 is fixed to the sides and/or the back side of the PCB 200.
  • the shielding system 10 does not need an additional space in the front side of the PCB 200 for affixing the shield enclosure 100 and allows the shield enclosure 100 to enclose the components on the PCB 200.
  • the design allows the shield enclosure 100 to mitigate noise from the components on the PCB 200.
  • the design can also allow the shield enclosure 100 to provide stiffness to the PCB 200, thereby preventing the components on the PCB 200 from being damaged by an external impact.
  • the hook 141 may be formed as an extension from the end of the fixing lead 140.
  • the shield enclosure 100 is designed in such a way that at least one contact lead 135 contacts the side (e.g., a lateral side) or/and the back side of the PCB 200 and a cover 115 encloses components on the PCB 200.
  • the cover 115 is shaped to enclose one or more edges of the components on the PCB 200.
  • the cover 115 may be shaped as a plate with a certain area or as a band with a certain width.
  • the cover 115 may be shaped according to the shape of the PCB 200.
  • the cover 115 is formed to be empty in the center portion, it should be understood that the invention is not limited thereto.
  • the cover 115 may be shaped as a continuous plate having no hole in the center portion, as a discontinuous plate having a plurality of holes, slots, or similar opening formed therein, and the like. As shown in FIG.
  • the cover 115 may be implemented in such a way that a fundamental frame is formed as a band with a certain width along the edge, and an extension frame is coupled to the fundamental frame to enclose the components in the PCB 200.
  • the extension frame mitigates noise from components of the PCB 200 and provides stiffness to the PCB 200.
  • the fundamental frame may include a structure to be coupled to the extension frame, and, likewise, the extension frame may also include the corresponding structure to be coupled to the fundamental frame.
  • the contact leads 135 includes side walls that extend from the side or edge of the cover 115 toward the PCB 200. That is, the contact leads 135 include at least one fixing lead 140 for contacting the side (e.g., a lateral side) or the back side of the PCB 200 to fix the shield enclosure 100 thereto, and at least one supporting lead 130 contacting the front side of the PCB 200 to support the shield enclosure 100 upon the front side of the PCB 200.
  • the contact leads 135 includes side walls that extend from the side or edge of the cover 115 toward the PCB 200. That is, the contact leads 135 include at least one fixing lead 140 for contacting the side (e.g., a lateral side) or the back side of the PCB 200 to fix the shield enclosure 100 thereto, and at least one supporting lead 130 contacting the front side of the PCB 200 to support the shield enclosure 100 upon the front side of the PCB 200.
  • Each supporting lead 130 includes one or more walls extended from the cover 115.
  • each supporting lead 130 may include one or more walls which extend perpendicular to the cover 115.
  • Each supporting lead 130 supports the shield enclosure 100 in such a way that ends of the supporting lead 130 contact the front side of the PCB 200.
  • the PCB 200 may include grooves 201 on the front side to receive the ends of the supporting leads 130 as shown in FIG. 9.
  • the grooves 201 are located on the front side of the PCB 200 at the corresponding locations where the supporting leads 130 are placed.
  • Each of the grooves 201 may be formed having a depth that does not affect any circuit pattern formed in the substrate of the PCB 200, e.g., 0.1 mm.
  • an exemplary embodiment of the present invention is implemented in such a way that the grooves 201 are located towards the top and bottom of the front side of the PCB 200 so as to form approximately the shape of square or angled brackets ‘[’ and ‘]’, it should be understood that the invention is not limited thereto.
  • the number of grooves 201 may be one or more.
  • the grooves 201 are formed on the front side of the PCB 200 and receive the side walls of each supporting lead 130, extending from the edge of the cover 115 toward the PCB 200. Parts of the side walls of each supporting lead 130, received by the grooves 201, are longer than the remaining side walls that are not inserted into the grooves 201 by the depth of the groove 201. In an exemplary implementation, if the grooves 201 are designed to receive the ends of the entire side wall of each supporting lead 130, each supporting lead 130 may be formed so that the side walls have the same length.
  • Each fixing lead 140 extends from the edge of the cover 115 toward the PCB 200 so that end portions of the fixing leads 140 can contact the side and the back side of the PCB 200. That is, each fixing lead 140 extends from the edge of the extension area 120 of the cover 115 toward the PCB 200 so that it can contact the side or the back side of the PCB 200 when the contact lead 135 is placed on the front side of the PCB 200.
  • the cover 115 shaped as a band may include one or more extension areas 120, each of which has a greater area than the other parts.
  • Each fixing lead 140 is shaped in such a way that it extends from the edge of the extension area 120 toward the PCB 200, contacting the side of the PCB 200, and extending to the back side of the PCB 200.
  • each fixing lead 140 has a greater length than the supporting lead 130, by the summation of the thickness of the PCB 200 and the length of the hook 141 overlapping the back side of the PCB 200 as shown in FIG. 11.
  • each fixing lead 140 comprises a hook 141 at the end.
  • the hook 141 extends from the end of the fixing lead 140, past the back side of the PCB 200, and is configured so that the end contacts the back side of the PCB 200.
  • the end of the hook 141 can be soldered to the back side of the PCB 200, thereby fixing the shield enclosure 100 to the PCB 200.
  • the PCB 200 may include a soldering pad 213 on the back side, thereby soldering the hook 141 thereto, for example via a reflow process.
  • the extension area 120 extends from the edge of the band 110 toward the outside so that each fixing lead 140 extending toward the PCB 200 from the edge of the extension area 120 can contact the side of the PCB 200. Therefore, the width of the extension area 120 is the summation of the distance from a point where the supporting lead 130 is placed on the PCB 200 to the edge of the PCB 200 and the thickness of a fixing lead 140.
  • the extension areas 120 are formed on lengthwise sides of the cover 115. Therefore, the fixing leads 140 are also formed on lengthwise sides of the cover 115.
  • fixing leads 140 with hooks 141 are formed along lengthwise sides of the cover 115
  • the fixing leads 140 and the extension areas 120 may be formed along one or more sides of the cover 115 shaped as a band, so that the fixing leads 140 can contact corresponding sides and the back side of the PCB 200.
  • fixing leads 140 may be formed in such a way that their number and their width are set by at least one of the four sides of the PCB 200 and the back side of the PCB 200 that the corresponding fixing leads will contact.
  • the number of extension area 120 is set according to the number of fixing leads 140.
  • the fixing leads 140 are formed along lengthwise sides of the cover 115, and the supporting leads 130 are formed in the widthwise direction of the cover 115.
  • the PCB 200 may be designed in substantially the same configuration as the first exemplary embodiment of the present invention shown in FIGs. 1 to 6, except that the PCB 200 of the second exemplary embodiment includes grooves 201 for receiving the supporting leads 130 on the front side. That is, the PCB 200 may be implemented with a substrate onto which one or more copper sheets are laminated, forming multi-layers for space efficiency.
  • the PCB 200 may form at least one contact area 210 for contacting the fixing leads 140 of the shield enclosure 100 on one or more sides.
  • the contact areas 210 may be designed in such a way that lead placement grooves 211 extend into the PCB by a certain distance from the side surface of the PCB. The number and the shape of the lead placement grooves 211 correspond to those of the fixing leads 140.
  • the PCB 200 may form four lead placement grooves 211 at the corresponding locations on the side of the PCB.
  • the hook 141 formed at the end of each fixing lead 140 contacts the back side of the PCB 200.
  • each lead placement groove 211 is formed on the side of the PCB 200
  • the second exemplary embodiment of the present invention may be modified in such a way that the PCB 200 does not form lead placement grooves 211 on the side and the hook 141 located at the end of each fixing lead 140 is soldered onto the back side of the PCB 200.
  • the PCB 200 may include a pad with a soldering material 213 at the corresponding location on the back side where the hook 141 will be placed. In that case, when the shield enclosure 100 is coupled to the PCB 200, the hook 141 can be soldered to a pad on the back side of the PCB 200, for example via a reflow process.
  • an exemplary shield enclosure 100 is coupled to the PCB 200 in such a way that fixing leads 140 contact the side of the PCB 200 and hooks 141 of the fixing leads 140 are fixed to the back side of the PCB 200.
  • This can provide enough space to stably arrange hardware components on the PCB 200, without consuming front space on the PCB 200.
  • this can tightly fix the shield enclosure 100 to the PCB 200.
  • FIG. 12 illustrates a perspective view showing a shielding system according to a third exemplary embodiment of the present invention.
  • a shielding system 10 is implemented in such a way that a cover 115A forms a front side of the shield enclosure 100, support leads 130 are formed at the corners of the cover 115A, and fixing leads 140 are formed in extension areas 120 of the cover 115A.
  • the cover 115A includes an enclosing part 110 with an area for covering at least part of the front side of the PCB and side walls 111 each of which extends from an edge of the enclosing part 110 so that it has a certain area.
  • the sidewalls 111 may include one or more walls extended perpendicular from edges of the enclosing part 110. At least one part of a side wall 111 may be replaced with an extension area 120 extending toward the outside (e.g., an external edge) of the enclosing part 110, to have a certain area, with a fixing lead 140 extending from the edge of the extension area 120.
  • the fixing leads 140 may extend perpendicularly from the edge of the extension area 120. The fixing leads 140 extend further than the side wall 111 toward the PCB 200 and contact the side of the PCB 200.
  • the supporting leads 130 extend further than the side walls 111, however they extend less far than the fixing leads 140.
  • the supporting leads 130 are placed into grooves 201 formed on the PCB 200.
  • the shield enclosure 100 is coupled to the PCB 200 in such a way that the cover 115A forms, at certain portions, e.g., corners, the supporting leads 130 to be placed into the grooves 201 of the PCB 200.
  • the fixing leads 140 of the extension areas 120 extend from the cover 115A contact the sides of the PCB 200 and are fixed thereto, for example via a soldering process and a reflow process.
  • the shield enclosure can provide stiffness to the PCB 200.
  • the third exemplary embodiment of the shielding system 10 forms an optimum number of grooves 201 on the PCB 200, it can simplify the manufacturing process of the PCB 200.
  • FIG. 13 illustrates a perspective view showing a shielding system according to a fourth exemplary embodiment of the present invention.
  • a shield enclosure 100 of the fourth exemplary embodiment of the present invention is designed with similar components to those shown in FIGs. 7 to 11.
  • the shield enclosure 100 of the fourth exemplary embodiment includes bent parts 143 instead of hooks 141.
  • the bent parts 143 extend from the end of the fixing leads 140 toward the PCB 200, so that they can contact the back side of the PCB 200.
  • the bent parts 143 may extend perpendicularly from the end of the fixing lead 140.
  • the PCB 200 includes locking grooves 215 to receive the bent parts 143 at the corresponding locations on the back side.
  • the locking grooves 215 may guide the bent parts 143 for ease of placement of the bent parts 143.
  • the locking grooves 215 may include soldering materials. In that case, the bent parts 143 can be tightly fixed to the locking grooves 215 via the soldering materials, for example by a reflow process.
  • the bent parts 143 may also be formed in such way that the fixing leads 140 are extended.
  • FIG. 14 illustrates a perspective view showing a modification of the shielding system shown in FIG. 13 according to an exemplary embodiment of the present invention.
  • the fourth exemplary embodiment of shielding system 10 may be modified in such a way that the PCB 200 includes a lead placement groove 211 on the side and a locking groove 215 on the back surface, where the lead placement groove 211 and the locking grooves 215 are placed side by side.
  • each extension area 120 may include a fixing lead 140 and a bent part 143, where the fixing lead 140 is fixed to the lead placement groove 211 and the bent part 143 is fixedly received by the locking groove 215.
  • the lead placement groove 211 and the locking groove 215 can be coupled to the fixing lead 140 and the bent pat 143, for example via soldering material and reflow processes, respectively.
  • the PCB 200 may include a soldering pad on the surface in order to protect the grooves formed thereon and to locate the soldering material therein.
  • the soldering pad may be implemented with a metal plate shaped as a thin film.
  • FIG. 15 illustrates a perspective view showing a shielding system according to a fifth exemplary embodiment of the present invention.
  • the shielding system 10 is designed in such a way that the shield enclosure 100 includes at least one contact lead 135.
  • Each contact lead 135 is coupled to PCB 200 in such a way that at least one contact lead 135 is inserted to a slot unit 220 located on the PCB 200, and at least one contact lead 135 is fixed to the lead placement groove 211 located on the side (e.g., a lateral side) and/or the back side of the PCB 200.
  • the slot units 220 may be fixed onto the front side of the PCB 200, for example via a soldering material and a reflow process.
  • the contact leads 135 may be fitted into the slot unit 220 and separated therefrom by applying an external force to the contact lead 135.
  • the shield enclosure 100 of the fifth exemplary embodiment of the present invention may be applied to PCBs having restricted use of their sides, so that it can still provide stiffness to the PCBs.
  • FIG. 16 illustrates a flowchart that describes a method for assembling the shielding system 10 according to an exemplary embodiment of the present invention.
  • a PCB 200 is provided in step 1601.
  • Each fixing lead of the shield enclosure 100 is fixed to the side and/or the back surface of the PCB 200 in step 1605.
  • the exemplary assembly method can easily couple the shield enclosure 100 to the PCB 200, so that the shield enclosure 100 can provide stiffness to the PCB 200.
  • the fixation of the shield enclosure 100 to the side and/or the back surface of the PCB may include forming a lead placement groove, formed on the side of the PCB at a location corresponding to the fixing lead, and/or on the back surface of the PCB at a location corresponding to a bent part formed at an end of a fixing lead.
  • a pad with soldering material is placed in the lead placement groove.
  • the shield enclosure with the fixing lead is brought into position such that a fixing lead or a bent part is in contact with the lead placement groove.
  • the fixing lead or the bent part is secured to the lead placement groove via a reflow process.
  • the fixing leads may include a hook, or a bent part.
  • the fixing lead extends from the cover and may perpendicularly extend from the cover.
  • a hook may be formed at the end of the fixing lead in such a way that it is bent toward the back side of the PCB and contacts the back side of the PCB.
  • a bent part may be formed at the end of the fixing lead in such a way that it is bent toward the back side of the PCB, perpendicular to the fixing lead.
  • the method for assembling the shielding system may further include forming one or more grooves each of which has a certain depth and an area on the front side of the PCB, and placing supporting leads, extending from an edge of the cover of the shield enclosure 100, into the grooves.
  • the exemplary method for assembling the shielding system may further include placing one or more slot units on the front side of the PCB, and fitting supporting leads, extending parallel to the fixing lead and perpendicular to the cover of the shield enclosure 100, into the slot units via an external force.
  • the shielding system 10 is designed in such a way that the shield enclosure 100 comprises one or more fixing leads 140 that are fixed to one or more sides of the PCB 200 to tightly couple the shield enclosure 100 to the PCB 200 and thus provide reliability in operation.
  • the PCB of the shielding system 10 can be designed to use a combination of part of the side and slot units or screws, considering the shape of the PCB or the space area of the PCB where electric components are mounted, thereby providing extension for coupling shield enclosures to PCBs.
  • the shielding system and the method for assembling the system can tightly fix the shield enclosure to the PCB, providing a proper coupling space area where components will be installed, and can reduce the size of mobile devices.
  • the shielding system and the method for assembling the system can increase the stiffness of a PCB via the shield enclosure.
  • the shielding system according to exemplary embodiments of the present invention can be applied to mobile devices.
  • the term mobile device includes any information communication devices, multimedia devices, and their applications, which are operated according to communication protocols corresponding to various types of communication systems.
  • the mobile device can be applied to mobile communication terminals, Portable Multimedia Players (PMPs), digital broadcast players, Personal Digital Assistants (PDAs), audio players (e.g., MP3 players), mobile game players, smartphones, laptop computers, hand-held PC, etc.
  • PMPs Portable Multimedia Players
  • PDAs Personal Digital Assistants
  • audio players e.g., MP3 players
  • smartphones smartphones, laptop computers, hand-held PC, etc.

Abstract

L'invention concerne un système de blindage pour un dispositif mobile et un procédé d'assemblage du système. Le système de blindage comprend une carte de circuits imprimés et une enveloppe de blindage couplée à un côté avant de la carte et conçu pour entourer des composants de la carte. L'enveloppe de blindage est couplée à au moins un côté latéral ou un côté arrière de la carte.
PCT/KR2012/010726 2011-12-16 2012-12-11 Système de blindage pour dispositif mobile et procédé d'assemblage du système WO2013089405A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110136348A KR20130068901A (ko) 2011-12-16 2011-12-16 단말기의 쉴드캔 장치 및 이의 조립 방법
KR10-2011-0136348 2011-12-16

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Publication Number Publication Date
WO2013089405A1 true WO2013089405A1 (fr) 2013-06-20

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PCT/KR2012/010726 WO2013089405A1 (fr) 2011-12-16 2012-12-11 Système de blindage pour dispositif mobile et procédé d'assemblage du système

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US (1) US20130153286A1 (fr)
EP (1) EP2605629A2 (fr)
JP (1) JP2013128111A (fr)
KR (1) KR20130068901A (fr)
CN (1) CN103167790A (fr)
WO (1) WO2013089405A1 (fr)

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KR20150120209A (ko) 2014-04-17 2015-10-27 삼성전자주식회사 전자 장치 및 전자 장치의 동작 방법
KR101641486B1 (ko) * 2014-05-02 2016-07-21 엘지전자 주식회사 이동 단말기
KR102279365B1 (ko) 2014-09-02 2021-07-21 삼성전자주식회사 인쇄회로기판 위에 배치되는 실드캔
KR101577914B1 (ko) * 2014-11-28 2015-12-16 주식회사 영진전기 전자파 차폐용 실드
KR20170112618A (ko) * 2016-04-01 2017-10-12 주식회사 만도 전자제어유닛의 차폐구조
CN106102313A (zh) * 2016-06-28 2016-11-09 广东欧珀移动通信有限公司 Pcb板及具有其的移动终端
CN107072127A (zh) * 2016-11-29 2017-08-18 北京小米移动软件有限公司 印刷电路板
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EP2605629A2 (fr) 2013-06-19
KR20130068901A (ko) 2013-06-26
JP2013128111A (ja) 2013-06-27
US20130153286A1 (en) 2013-06-20
CN103167790A (zh) 2013-06-19

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