WO2013086650A1 - Bullet-shape lens led monitor and bullet-shape lens led light source module - Google Patents

Bullet-shape lens led monitor and bullet-shape lens led light source module Download PDF

Info

Publication number
WO2013086650A1
WO2013086650A1 PCT/CN2011/002064 CN2011002064W WO2013086650A1 WO 2013086650 A1 WO2013086650 A1 WO 2013086650A1 CN 2011002064 W CN2011002064 W CN 2011002064W WO 2013086650 A1 WO2013086650 A1 WO 2013086650A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
light source
lens
source module
cannonball
Prior art date
Application number
PCT/CN2011/002064
Other languages
French (fr)
Chinese (zh)
Inventor
陈明鸿
谢崑杨
潘敬仁
Original Assignee
海立尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海立尔股份有限公司 filed Critical 海立尔股份有限公司
Priority to PCT/CN2011/002064 priority Critical patent/WO2013086650A1/en
Publication of WO2013086650A1 publication Critical patent/WO2013086650A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to a monitor with a cannonball type lens LED and a cannonball type lens LED light source module thereof, in particular to a monitor with a cannonball type lens LED using an infrared light LED light source and a cannonball type lens LED light source module thereof group.
  • LED light-emitting diode
  • panel backlights, instrumentation, signal lights, and surveillance lenses, especially infrared light LEDs can be used for nighttime image illumination.
  • LEDs are designed to save power, convenience, low heat generation and long life. Therefore, conventional lighting equipment often uses a large number of small LEDs to achieve these goals.
  • the illumination of the LED light is usually not too strong, which makes the light source less likely to concentrate on the object and make the illumination less effective.
  • the general infrared light LED is not specially designed for its light exit angle and the illumination is low, when the infrared light emitted by the infrared light LED is irradiated on a relatively fine object, the infrared light LED cannot provide sufficient illumination, so that The monitor cannot capture sharp, high resolution images. Therefore, it is desirable to provide a high-intensity infrared light LED to more effectively increase the illuminance so that the image captured by the monitor at night is sharper and more subtle to the higher resolution image can be captured.
  • the object of the present invention is to overcome the defects of the conventional LED, and to provide a novel structure of a monitor with a cannonball type lens LED and a cannonball type lens light source module thereof, and the technical problem to be solved is to make the infrared light LED
  • the light exit angle is between 20° and 60° and enhances the illuminance of the infrared LED to achieve better infrared light illumination, which is more suitable for practical use.
  • a monitor having a cannonball type lens comprising: a housing coupled to a rotating base, the housing being a hollow housing and having an opening; Is disposed in the hollow housing, the body has a camera, wherein the camera is disposed at the opening and faces outward; and a cannonball lens LED light source module is disposed on the body and surrounds the camera
  • the bullet-type lens LED light source module is an infrared light source
  • the bullet-type lens LED light source module comprises: a circuit substrate; and a plurality of infrared light LEDs, electrically connected and fixed on the circuit substrate, each The infrared light LED includes: a bracket having a die pad and at least two electrodes; an LED chip coupled to the die pad and electrically conductively coupled to the electrodes; a silica gel filled in the die pad And covering the LED chip; and a bullet-type lens, coupled to the bracket and covering the LED chip,
  • the aforementioned monitor having a bullet-type lens LED, wherein the circuit substrate is a printed circuit board, an aluminum-based circuit board or a ceramic substrate.
  • the aforementioned monitor having a cannonball type lens LED, wherein the bracket has a heat conducting base, and the die pad is a part of the heat conducting base.
  • the aforementioned monitor having a cannonball type lens LED, wherein the LED chip is bonded to the die pad by a silver paste.
  • the aforementioned monitor having a cannonball type lens, wherein the cannonball type lens is a silicone lens or a glass lens.
  • a bullet-type lens LED light source module is a low-illumination angle high-illuminance infrared light source and is applied to a monitor, and the bullet-type lens LED light source module comprises: a circuit substrate; And a plurality of infrared LEDs electrically connected and fixed on the circuit substrate, each of the infrared LEDs comprising: a bracket having a die pad and at least two electrodes; an LED chip, a junction Cooperating in the die pad and electrically conductively bonding with the electrodes; a silica gel filled in the die pad and covering the LED chip; and a projectile lens coupled to the bracket and covering the LED chip,
  • the infrared light LED has an exit angle between 20' and 60'.
  • the circuit substrate is a printed circuit board, an aluminum-based circuit board or a ceramic substrate.
  • the bracket has a heat conducting base, and the die seat is a part of the heat conducting base.
  • the LED chip is combined with the die pad by a silver paste.
  • the aforementioned bullet-type lens LED light source module wherein the cannonball lens is a silicone lens or a glass lens
  • the present invention has significant advantages and advantageous effects over the prior art.
  • the present invention is a monitor having a cannonball type lens LED and a cannonball type lens LED light source module thereof, comprising: a casing, a body and a cannonball type lens light source module.
  • the invention has a cannonball type lens LED monitor and a cannonball type lens LED light source module, which can achieve considerable technical progress and practicability, and has extensive industrial use value, and at least has the following advantages:
  • the light-emitting angle of the infrared light LED can be reduced to enhance the illumination of the infrared light LED light source module.
  • FIG. 1 is a schematic view of a monitor having a cannonball type lens LED according to an embodiment of the present invention.
  • 2 is a partial cross-sectional view of a monitor having a cannonball type lens LED according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of an infrared light LED according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional view taken along line A-A of Figure 3;
  • Fig. 5A is a perspective view of an infrared light LED according to an embodiment of the present invention.
  • Figure 5B is a top plan view of an infrared light LED in accordance with an embodiment of the present invention.
  • Figure 5C is a side elevational view of an infrared light LED in accordance with an embodiment of the present invention.
  • Fig. 6 is a graph showing the light distribution of an infrared light LED according to an embodiment of the present invention.
  • Body 40 Cannonball lens LED light source module
  • bracket 611 die holder
  • LED chip 621 silver glue
  • a monitor having a cannonball type lens LED and a cannonball type lens LED light source according to the present invention will be described below with reference to the accompanying drawings and preferred embodiments. The specific implementation, structure, characteristics and efficacy of the module are described in detail later.
  • FIG. 1 is a schematic view of a monitor having a cannonball type lens LED according to an embodiment of the present invention.
  • 2 is a partial cross-sectional view of a monitor having a cannonball type lens LED according to an embodiment of the present invention.
  • Fig. 3 is an exploded perspective view of an infrared light LED according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional view taken along line A-A of Figure 3.
  • Fig. 5A is a perspective view of an infrared light LED according to an embodiment of the present invention.
  • Figure 5B is a top plan view of an infrared light LED in accordance with an embodiment of the present invention.
  • Figure 5C is a side elevational view of an infrared light LED in accordance with an embodiment of the present invention.
  • Fig. 6 is a graph showing the light distribution of an infrared light LED according to an embodiment of the present invention.
  • this embodiment is a monitor 10 having a cannonball type lens LED, comprising: a housing 20; a body 30; and a cannonball type lens light source module 40.
  • the housing 20 is coupled to a rotating base 21, and the housing 20 can be adjusted by the rotating base 21 to adjust the angle of the monitoring or automatically horizontally, so that the monitor 10 can regularly monitor the desired observation.
  • the housing 20 is a hollow housing for receiving the body 30 and has an opening 22 for monitoring the screen in the direction of the monitor 10 toward the opening 11.
  • the body 30 is housed in a hollow housing, and the body 30 has a camera that can periodically capture a monitored image frame over time, wherein the camera is disposed at the opening 11 of the housing 20 and faces outward, and around the lens of the camera
  • a cannonball type lens light source module 40 is installed, and infrared light can be used as an auxiliary light source at night, so that the camera has enough light source to capture the image.
  • the cannonball type lens LED light source module 40 is an infrared light source with low illumination angle and high illumination, and can be applied to the monitor 10, so that the monitor 10 can be photographed at night by using an infrared light source with better illumination. The image is displayed, and a clearer or finer image can be captured.
  • the cannonball lens LED light source module 40 is disposed around the lens of the camera, and the cannonball lens LED light source module 40 includes: a circuit substrate 50 and a plurality of infrared light LEDs 60.
  • the circuit substrate 50 can be a printed circuit board (PCB), an aluminum-based circuit board or a ceramic substrate.
  • PCB printed circuit board
  • the circuit substrate 50 can be a modular design. That is, the circuit substrate 50 may be composed of one or more substrates.
  • the commonly used circuit substrate 50 may be an aluminum based circuit board or may be a printed circuit board (PCB).
  • a plurality of infrared LEDs 60 are electrically connected and fixed to the circuit substrate 50, and the infrared LEDs 60 can be dispersed and equally spaced on the circuit substrate 50 to achieve large-area illumination.
  • each of the infrared light LEDs 60 includes: a holder 61; an LED chip 62; a silica gel 63 and a cannonball lens 65.
  • the holder 61 has a die pad 611 and at least two electrodes 612, and the die pad 611 is for placing the LED chip 62, and the LED chip 62 can be wire-refused by means of the wire 64.
  • the 612 is electrically connected to provide power to the LED chip 62 by the external power source via the electrode 612.
  • the bracket 61 has a thermally conductive base 613 and the die pad 611 is part of the heat transfer base 613.
  • the thermally conductive base 613 can be made of a material having good heat dissipation characteristics, such as a metal shield such as copper, tin, steel or iron.
  • the LED chip 62 is bonded within the die pad 611 and electrically coupled to the electrode 612 to achieve the desired power.
  • the LED chip 62 can be combined with the die pad 611 by a silver paste 621. Since the silver paste 621 is made by incorporating silver powder into the epoxy resin, and is an adhesive having electrical conductivity and thermal conductivity, 4 In addition to the stable integration of the LED chip 62 into the die pad 611, the silicone 621 also has a heat conduction effect, and when the heat dissipation effect is improved, the life and brightness of the LED chip 62 can also be increased.
  • Silicone 63 for covering the LED chip 62 and the wire 64 which is combined with the LED chip 62 After the die pad 611, the silicone 63 is filled in the die pad 611 to cover the LED chip 62 and the wire 64.
  • the LED chip 62 and the wire 64 can be fixed. Since the silica gel 63 is a high transparency, high stability and high water resistance packaging material, it can be used to protect the LED chip 62 from moisture and dust in various environments without affecting the light output of the LED chip 62. .
  • the cannonball lens 65 is coupled to the bracket 61 and covers the LED chip 62.
  • the projectile lens 65 is coupled to the bracket 61 after the silica gel 63 is filled in the die holder 611, and the cannonball lens 65 can be a silicone lens. Or a glass lens, after a special optical design, the lens is designed as a bullet-type lens 65, so that the light-emitting angle of the infrared light LED 60 is between 20° and 60°, thereby reducing the light output of the infrared light LED 60. The angle and effectively improve the illumination of the infrared LED 60.
  • the lens made of silica gel 63 has high refractive index, high temperature resistance, high insulation, high chemical stability, high light transmittance and high reliability, so it can also avoid the material of traditional packaging materials due to high temperature. Deterioration and the phenomenon of brightness decay caused by it.
  • the light-emitting angle of the cannonball lens 65 can be obtained according to the light distribution curve 70.
  • the arc and infrared light drawn according to the relative intensity of the infrared light emitted by the infrared light LED 60 is 50%.
  • the angle between the two intersections of the illumination range illuminated by the LED 60 shows that the light angle is 30. Therefore, by passing through the cannonball lens 65, the light of the infrared light LED 60 can be concentrated to effectively increase the illuminance, so that the infrared light LED 60 having the cannonball lens 65 has a low illumination angle and high illuminance, thereby providing the monitor 10 Better lighting effects.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A bullet-shaped lens LED monitor, comprising: a housing (20), a main body (30) and a bullet-shaped lens LED light source module (40); the main body (30) is received in the housing (20) and is provided with a camera; and the bullet-shaped lens LED light source module (40) is disposed around the camera; the bullet-shaped lens LED light source module (40) comprises a circuit substrate (50) and a plurality of infrared LEDs (60), the light excident angle of the infrared LEDs (60) being between 20° and 60°. The bullet-shaped lens design reduces the light excident angle of the infrared LEDs (60) to enhance the illuminance of the infrared LEDs (60), thus providing better illumination effect for the monitor.

Description

具有炮弹型透镜 LED的监视器及其炮弹型透镜 LED光源模组  Monitor with bullet-type lens LED and its bullet-type lens LED light source module
技术领域 Technical field
本发明涉及一种具有炮弹型透镜 LED的监视器及其炮弹型透镜 LED光 源模组， 特别是涉及一种应用红外光 LED光源的具有炮弹型透镜 LED的监 视器及其炮弹型透镜 LED光源模组。 背景技术  The invention relates to a monitor with a cannonball type lens LED and a cannonball type lens LED light source module thereof, in particular to a monitor with a cannonball type lens LED using an infrared light LED light source and a cannonball type lens LED light source module thereof group. Background technique
随着发光二极管（Light- Emi t t ing Diode, LED)技术不断进步及成本的 下降，加上其环保节能优点， LED已渐渐被广泛应用于各种不同的照明设备 中。 例如面板背光源、 仪表设备、 信号灯及监视镜头等， 尤其可以将红外 光 LED应用于夜间的影像照明。  With the continuous advancement of light-emitting diode (LED) technology and the cost reduction, coupled with its environmental protection and energy saving advantages, LED has gradually been widely used in a variety of different lighting equipment. For example, panel backlights, instrumentation, signal lights, and surveillance lenses, especially infrared light LEDs can be used for nighttime image illumination.
传统的 LED讲求的是省电、 方便、 发热度低以及使用寿命较长， 因此 习知的照明设备常会使用大量且体积小的 LED来达到这些目的。但由于 LED 体积过小的缘故， 因此 LED光的光照度通常不会太强， 导致光源较不容易 集中光照于物体上， 并使光照效果较差。  Conventional LEDs are designed to save power, convenience, low heat generation and long life. Therefore, conventional lighting equipment often uses a large number of small LEDs to achieve these goals. However, due to the small size of the LED, the illumination of the LED light is usually not too strong, which makes the light source less likely to concentrate on the object and make the illumination less effective.
举夜间用的监视器的例子来说， 由于夜间并无自然光源存在， 因此若 要能清楚地撷取到影像就必须要使用辅助性的红外光照射物体后， 才能清 楚地显示出影像。 然而， 由于一般的红外光 LED并未针对其出光角度作特 殊的设计而且光照度较低， 因此当红外光 LED发出的红外光照射在较细微 的物体时， 红外光 LED无法提供足够的光照度， 使得监视器无法拍摄到清 晰且分辨率较高的影像。 因此， 需要提供一种高照度的红外光 LED 以更有 效地增加光照度， 以使监视器在夜间拍摄到的影像画面更加清晰， 并且能 够撷取到分辨率较高的影像中更细微的部分。  For the example of a nighttime monitor, since there is no natural light source at night, it is necessary to use an auxiliary infrared light to illuminate the object in order to clearly display the image. However, since the general infrared light LED is not specially designed for its light exit angle and the illumination is low, when the infrared light emitted by the infrared light LED is irradiated on a relatively fine object, the infrared light LED cannot provide sufficient illumination, so that The monitor cannot capture sharp, high resolution images. Therefore, it is desirable to provide a high-intensity infrared light LED to more effectively increase the illuminance so that the image captured by the monitor at night is sharper and more subtle to the higher resolution image can be captured.
有鉴于上述传统的 LED存在的缺陷， 本发明人基于从事此类产品设计 制造多年丰富的实务经验及专业知识， 并配合学理的运用， 积极加以研究 创新， 以期创设一种新型结构的具有炮弹型透镜 LED 的监视器及其炮弹型 透镜 LED光源模组， 能够改进一般现有的具有炮弹型透镜 LED的监视器及 其炮弹型透镜 LED光源模组， 使其更具有实用性。 经过不断的研究、 设计， 并经反复试作样品及改进后， 终于创设出确具实用价值的本发明。 发明内容 In view of the above-mentioned defects of the conventional LED, the inventors have been engaged in the design and manufacture of such products for many years of practical experience and professional knowledge, and in conjunction with the application of the theory, actively research and innovation, in order to create a new type of structure with a cannonball type The lens LED monitor and its cannonball type lens light source module can improve the general existing monitor with a bullet-type lens LED and its cannonball type lens light source module, making it more practical. After continuous research, design, and repeated trials of samples and improvements, the invention has finally been created with practical value. Summary of the invention
本发明的目的在于， 克服传统的 LED存在的缺陷， 而提供一种新型结 构的具有炮弹型透镜 LED的监视器及其炮弹型透镜 LED光源模组， 所要解 决的技术问题是要使红外光 LED的出光角度系介于 20°至 60°间并提升红外 光 LED的光照度， 以达到更佳的红外光光照效果， 从而更加适于实用。  The object of the present invention is to overcome the defects of the conventional LED, and to provide a novel structure of a monitor with a cannonball type lens LED and a cannonball type lens light source module thereof, and the technical problem to be solved is to make the infrared light LED The light exit angle is between 20° and 60° and enhances the illuminance of the infrared LED to achieve better infrared light illumination, which is more suitable for practical use.
本发明的目的及解决其技术问题是采用以下的技术方案来实现的。 依 据本发明提出的一种具有炮弹型透镜 LED的监视器， 其特征在于包括： 一 壳体， 结合于一旋转基座上， 该壳体是为一中空壳体并具有一开口； 一本 体， 是容置于该中空壳体中， 该本体具有一摄影机， 其中该摄影机是设置 于该开口处并朝向外部； 以及一炮弹型透镜 LED光源模组， 设置于该本体 上并环绕该摄影机， 该炮弹型透镜 LED光源模组是为一红外光光源， 且该 炮弹型透镜 LED光源模组包括： 一电路基板； 及多数颗红外光 LED, 电性连 接且固设于该电路基板， 每一该红外光 LED 包括： 一支架， 具有一晶粒座 及至少二个电极； 一 LED芯片， 结合于该晶粒座内并与该些电极导电结合； 一硅胶， 充填于该晶粒座内且覆盖该 LED 芯片； 及一炮弹型透镜， 结合于 该支架上且覆盖该 LED芯片，使该红外光 LED的出光角度介于 20。至 60。之 间。  The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. A monitor having a cannonball type lens according to the present invention, comprising: a housing coupled to a rotating base, the housing being a hollow housing and having an opening; Is disposed in the hollow housing, the body has a camera, wherein the camera is disposed at the opening and faces outward; and a cannonball lens LED light source module is disposed on the body and surrounds the camera The bullet-type lens LED light source module is an infrared light source, and the bullet-type lens LED light source module comprises: a circuit substrate; and a plurality of infrared light LEDs, electrically connected and fixed on the circuit substrate, each The infrared light LED includes: a bracket having a die pad and at least two electrodes; an LED chip coupled to the die pad and electrically conductively coupled to the electrodes; a silica gel filled in the die pad And covering the LED chip; and a bullet-type lens, coupled to the bracket and covering the LED chip, the infrared light LED has an exit angle of 20. To 60. Between.
本发明的目的以及解决其技术问题还可以采用以下的技术措施来进一 步实现。  The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.
前述的具有炮弹型透镜 LED 的监视器， 其中于所述电路基板为一印刷 电路板、 一铝基电路板或一陶瓷基板。  The aforementioned monitor having a bullet-type lens LED, wherein the circuit substrate is a printed circuit board, an aluminum-based circuit board or a ceramic substrate.
前述的具有炮弹型透镜 LED的监视器， 其中所述支架具有一导热基座， 该晶粒座为该导热基座的一部分。  The aforementioned monitor having a cannonball type lens LED, wherein the bracket has a heat conducting base, and the die pad is a part of the heat conducting base.
前述的具有炮弹型透镜 LED的监视器， 其中所述 LED芯片是借由一银 胶与该晶粒座结合。  The aforementioned monitor having a cannonball type lens LED, wherein the LED chip is bonded to the die pad by a silver paste.
前述的具有炮弹型透镜 LED的监视器， 其中所述炮弹型透镜为一硅胶 透镜或一玻璃透镜。  The aforementioned monitor having a cannonball type lens, wherein the cannonball type lens is a silicone lens or a glass lens.
本发明的目的及解决其技术问题还采用以下技术方案来实现。 依据本 发明提出的一种炮弹型透镜 LED光源模组， 是为一低发光角度高照度的红 外光光源并应用于一监视器中， 且该炮弹型透镜 LED光源模组包括： 一电 路基板； 以及多数颗红外光 LED, 电性连接且固设于该电路基板， 每一该红 外光 LED包括： 一支架， 具有一晶粒座及至少二个电极； 一 LED芯片， 结 合于该晶粒座内并与该些电极导电结合； 一硅胶， 充填于该晶粒座内且覆 盖该 LED芯片； 及一炮弹型透镜， 结合于该支架上且覆盖该 LED芯片， 使 该红外光 LED的出光角度介于 20' 至 60' 之间。 The object of the present invention and solving the technical problems thereof are also achieved by the following technical solutions. A bullet-type lens LED light source module according to the present invention is a low-illumination angle high-illuminance infrared light source and is applied to a monitor, and the bullet-type lens LED light source module comprises: a circuit substrate; And a plurality of infrared LEDs electrically connected and fixed on the circuit substrate, each of the infrared LEDs comprising: a bracket having a die pad and at least two electrodes; an LED chip, a junction Cooperating in the die pad and electrically conductively bonding with the electrodes; a silica gel filled in the die pad and covering the LED chip; and a projectile lens coupled to the bracket and covering the LED chip, The infrared light LED has an exit angle between 20' and 60'.
本发明的目的以及解决其技术问题还可以采用以下的技术措施来进一 步实现。  The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.
前述的炮弹型透镜 LED光源模组， 其中所述电路基板为一印刷电路板、 一铝基电路板或一陶瓷基板。  In the foregoing bullet-type lens LED light source module, the circuit substrate is a printed circuit board, an aluminum-based circuit board or a ceramic substrate.
前述的炮弹型透镜 LED光源模组， 其中所述支架具有一导热基座， 该 晶粒座为该导热基座的一部分。  In the foregoing bullet-type lens LED light source module, the bracket has a heat conducting base, and the die seat is a part of the heat conducting base.
前述的炮弹型透镜 LED光源模组， 其中所述 LED芯片是借由一银胶与 该晶粒座结合。  In the foregoing bullet-type lens LED light source module, the LED chip is combined with the die pad by a silver paste.
前述的炮弹型透镜 LED光源模组， 其中所述炮弹型透镜为一硅胶透镜 或一玻璃透镜  The aforementioned bullet-type lens LED light source module, wherein the cannonball lens is a silicone lens or a glass lens
本发明与现有技术相比具有明显的优点和有益效果。 借由上述技术方 案， 本发明为一种具有炮弹型透镜 LED的监视器及其炮弹型透镜 LED光源 模组， 其包括： 一壳体、 一本体以及一炮弹型透镜 LED光源模组。  The present invention has significant advantages and advantageous effects over the prior art. According to the above technical solution, the present invention is a monitor having a cannonball type lens LED and a cannonball type lens LED light source module thereof, comprising: a casing, a body and a cannonball type lens light source module.
本发明具有炮弹型透镜 LED的监视器及其炮弹型透镜 LED光源模组， 可达到相当的技术进步性及实用性， 并具有产业上的广泛利用价值， 其至 少具有下列优点：  The invention has a cannonball type lens LED monitor and a cannonball type lens LED light source module, which can achieve considerable technical progress and practicability, and has extensive industrial use value, and at least has the following advantages:
1、 可以提供监视器更佳的光照效果。  1, can provide better lighting effects of the monitor.
2、 可以缩小红外光 LED的出光角度以提升红外光 LED光源模组的光照 度。  2. The light-emitting angle of the infrared light LED can be reduced to enhance the illumination of the infrared light LED light source module.
上述说明仅是本发明技术方案的概述， 为了能更清楚了解本发明的技 术手段， 而可依照说明书的内容予以实施， 并且为让本发明的上述和其它 目的、 特征和优点能够更明显易懂， 以下特举较佳实施例，并配合附图， 详 细说明:^下。 附图的简要说明  The above description is only an overview of the technical solutions of the present invention, and the above-described and other objects, features and advantages of the present invention can be more clearly understood. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
图 1为本发明实施例的一种具有炮弹型透镜 LED的监视器的示意图。 图 2为本发明实施例的一种具有炮弹型透镜 LED的监视器的局部剖视 图 3为本发明实施例的一种红外光 LED的分解立体图。 图 4为沿图 3中 A- A剖线的剖视图。 1 is a schematic view of a monitor having a cannonball type lens LED according to an embodiment of the present invention. 2 is a partial cross-sectional view of a monitor having a cannonball type lens LED according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of an infrared light LED according to an embodiment of the present invention. Figure 4 is a cross-sectional view taken along line A-A of Figure 3;
图 5A为本发明实施例的一种红外光 LED的立体图。  Fig. 5A is a perspective view of an infrared light LED according to an embodiment of the present invention.
图 5B为本发明实施例的一种红外光 LED的俯视图。  Figure 5B is a top plan view of an infrared light LED in accordance with an embodiment of the present invention.
图 5C为本发明实施例的一种红外光 LED的侧视图。  Figure 5C is a side elevational view of an infrared light LED in accordance with an embodiment of the present invention.
图 6为本发明实施例的一种红外光 LED的配光曲线图。  Fig. 6 is a graph showing the light distribution of an infrared light LED according to an embodiment of the present invention.
10: 监视器 20: 壳体  10: Monitor 20: Housing
21： 旋转基座 22： 开口  21: Rotating base 22: Opening
30: 本体 40: 炮弹型透镜 LED光源模组  30: Body 40: Cannonball lens LED light source module
50: 电路基板 60: 红外光 LED  50: Circuit board 60: Infrared light LED
61： 支架 611 : 晶粒座  61: bracket 611 : die holder
612 电极 613: 导热基座  612 electrode 613: thermal base
62： LED芯片 621 : 银胶  62: LED chip 621 : silver glue
63: 硅胶 64 : 导线  63: Silicone 64 : Wire
65： 炮弹型透镜 70: 配光曲线图  65: Cannonball lens 70: Light distribution curve
实现发明的最佳方案 The best solution to achieve the invention
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功 效，以下结合附图及较佳实施例， 对依据本发明提出的具有炮弹型透镜 LED 的监视器及其炮弹型透镜 LED光源模组， 其具体实施方式、 结构、 特征及 其功效， 详细说明如后。  In order to further illustrate the technical means and efficacy of the present invention for achieving the intended purpose of the invention, a monitor having a cannonball type lens LED and a cannonball type lens LED light source according to the present invention will be described below with reference to the accompanying drawings and preferred embodiments. The specific implementation, structure, characteristics and efficacy of the module are described in detail later.
图 1为本发明实施例的一种具有炮弹型透镜 LED的监视器的示意图。 图 2为本发明实施例的一种具有炮弹型透镜 LED的监视器的局部剖视图。 图 3为本发明实施例的一种红外光 LED的分解立体图。图 4为沿图 3中 A-A 剖线的剖视图。 图 5A为本发明实施例的一种红外光 LED的立体图。 图 5B 为本发明实施例的一种红外光 LED的俯视图。 图 5C为本发明实施例的一种 红外光 LED的侧视图。 图 6为本发明实施例的一种红外光 LED的配光曲线 图。  1 is a schematic view of a monitor having a cannonball type lens LED according to an embodiment of the present invention. 2 is a partial cross-sectional view of a monitor having a cannonball type lens LED according to an embodiment of the present invention. Fig. 3 is an exploded perspective view of an infrared light LED according to an embodiment of the present invention. Figure 4 is a cross-sectional view taken along line A-A of Figure 3. Fig. 5A is a perspective view of an infrared light LED according to an embodiment of the present invention. Figure 5B is a top plan view of an infrared light LED in accordance with an embodiment of the present invention. Figure 5C is a side elevational view of an infrared light LED in accordance with an embodiment of the present invention. Fig. 6 is a graph showing the light distribution of an infrared light LED according to an embodiment of the present invention.
如 1图 1及图 2所示， 本实施例为一种具有炮弹型透镜 LED的监视器 10， 其包括： 一壳体 20; —本体 30以及炮弹型透镜 LED光源模组 40。  As shown in FIG. 1 and FIG. 2, this embodiment is a monitor 10 having a cannonball type lens LED, comprising: a housing 20; a body 30; and a cannonball type lens light source module 40.
壳体 20， 其结合于一旋转基座 21上， 壳体 20可以藉由旋转基座 21来 调整监看的角度或是自动水平转动， 使得监视器 10可以定时监看欲观察的 区域， 而壳体 20是为一中空壳体用以容置本体 30 , 并且具有一开口 22以 使监视器 10朝向开口 11的方向来监视画面。 The housing 20 is coupled to a rotating base 21, and the housing 20 can be adjusted by the rotating base 21 to adjust the angle of the monitoring or automatically horizontally, so that the monitor 10 can regularly monitor the desired observation. The housing 20 is a hollow housing for receiving the body 30 and has an opening 22 for monitoring the screen in the direction of the monitor 10 toward the opening 11.
本体 30是容置于中空壳体中， 并且本体 30具有一摄影机， 可以随时 间定期拍摄监视的影像画面， 其中摄影机是设置于壳体 20的开口 11处并 朝向外部， 并且摄影机的镜头周围装设有炮弹型透镜 LED光源模组 40， 可 在夜间使用红外光当辅助光源， 以使摄影机有足够的光源来撷取影像画面。  The body 30 is housed in a hollow housing, and the body 30 has a camera that can periodically capture a monitored image frame over time, wherein the camera is disposed at the opening 11 of the housing 20 and faces outward, and around the lens of the camera A cannonball type lens light source module 40 is installed, and infrared light can be used as an auxiliary light source at night, so that the camera has enough light source to capture the image.
炮弹型透镜 LED光源模组 40, 是为一具有低发光角度且高照度的红外 光光源， 并可以应用于监视器 10中， 使得监视器 10可以在夜间利用光照 度较佳的红外光光源来拍摄影像画面， 且能拍摄到较为清晰或细微的影像。 而炮弹型透镜 LED光源模组 40是环绕摄影机的镜头而设置， 又炮弹型透镜 LED光源模组 40包括： 一电路基板 50及多数颗红外光 LED 60。  The cannonball type lens LED light source module 40 is an infrared light source with low illumination angle and high illumination, and can be applied to the monitor 10, so that the monitor 10 can be photographed at night by using an infrared light source with better illumination. The image is displayed, and a clearer or finer image can be captured. The cannonball lens LED light source module 40 is disposed around the lens of the camera, and the cannonball lens LED light source module 40 includes: a circuit substrate 50 and a plurality of infrared light LEDs 60.
电路基板 50可以为一印刷电路板（PCB)、 一铝基电路板或是一陶瓷基 板， 为了方便生产时电路基板 50的检测或者以后的维修， 电路基板 50可 以为模组化的设计， 也就是电路基板 50可以由一块或多块基板所组成。 一 般常用的电路基板 50可以是铝基电路板或者可以是印刷电路板 ( PCB )。  The circuit substrate 50 can be a printed circuit board (PCB), an aluminum-based circuit board or a ceramic substrate. In order to facilitate the detection or subsequent maintenance of the circuit substrate 50 during production, the circuit substrate 50 can be a modular design. That is, the circuit substrate 50 may be composed of one or more substrates. The commonly used circuit substrate 50 may be an aluminum based circuit board or may be a printed circuit board (PCB).
多数颗红外光 LED 60, 其是电性连接且固设于电路基板 50， 并且红外 光 LED 60 可以分散且等间距地设置在电路基板 50上， 以达到大区域照射 的功效。  A plurality of infrared LEDs 60 are electrically connected and fixed to the circuit substrate 50, and the infrared LEDs 60 can be dispersed and equally spaced on the circuit substrate 50 to achieve large-area illumination.
如图 3至图 5C所示， 每一红外光 LED 60包括： 一支架 61 ; — LED芯 片 62; —硅胶 63及一炮弹型透镜 65。  As shown in FIGS. 3 to 5C, each of the infrared light LEDs 60 includes: a holder 61; an LED chip 62; a silica gel 63 and a cannonball lens 65.
支架 61 , 具有一晶粒座 611及至少二个电极 612， 而晶粒座 611是用 以置放 LED芯片 62，且 LED芯片 62可以借由导线 64以打线（wi re bonding) 方式与电极 612电性连接， 以通过电极 612使外部电源对 LED芯片 62提供 电力。 大部分的情况下， 支架 61具有一导热基座 613， 又晶粒座 611为导 热基座 613的一部份。 导热基座 613可以由具有良好散热特性的材质制成， 例如铜、 锡、 钢或铁等金属材盾。  The holder 61 has a die pad 611 and at least two electrodes 612, and the die pad 611 is for placing the LED chip 62, and the LED chip 62 can be wire-refused by means of the wire 64. The 612 is electrically connected to provide power to the LED chip 62 by the external power source via the electrode 612. In most cases, the bracket 61 has a thermally conductive base 613 and the die pad 611 is part of the heat transfer base 613. The thermally conductive base 613 can be made of a material having good heat dissipation characteristics, such as a metal shield such as copper, tin, steel or iron.
LED芯片 62 , 结合于晶粒座 611 内并与电极 612导电结合以获得所需 的电力。 LED芯片 62可藉由一银胶 621与晶粒座 611结合， 由于银胶 621 是在环氧树脂内掺入银粉所制成， 并且是一种具有导电性及导热性的粘着 剂， 因此 4艮胶 621除了可将 LED芯片 62稳定结合至晶粒座 611内， 亦具有 导热效果， 当散热效果提升后，同时也可以增加 LED芯片 62的寿命与亮度。  The LED chip 62 is bonded within the die pad 611 and electrically coupled to the electrode 612 to achieve the desired power. The LED chip 62 can be combined with the die pad 611 by a silver paste 621. Since the silver paste 621 is made by incorporating silver powder into the epoxy resin, and is an adhesive having electrical conductivity and thermal conductivity, 4 In addition to the stable integration of the LED chip 62 into the die pad 611, the silicone 621 also has a heat conduction effect, and when the heat dissipation effect is improved, the life and brightness of the LED chip 62 can also be increased.
硅胶 63， 用以覆盖于 LED芯片 62及导线 64 , 其是于 LED芯片 62结合 于晶粒座 611后再将硅胶 63充填于晶粒座 611内， 以覆盖 LED芯片 62及 导线 64， 如此可以使 LED芯片 62及导线 64被固定。 由于硅胶 63是一种高 透明度、 高稳定性及高耐水性的封装材料， 因此可以用以保护 LED芯片 62 在各种环境下不受水气及尘埃的污染且不影响 LED芯片 62的光输出。 Silicone 63 for covering the LED chip 62 and the wire 64, which is combined with the LED chip 62 After the die pad 611, the silicone 63 is filled in the die pad 611 to cover the LED chip 62 and the wire 64. Thus, the LED chip 62 and the wire 64 can be fixed. Since the silica gel 63 is a high transparency, high stability and high water resistance packaging material, it can be used to protect the LED chip 62 from moisture and dust in various environments without affecting the light output of the LED chip 62. .
炮弹型透镜 65， 其是结合于支架 61上且覆盖 LED芯片 62， 炮弹型透 镜 65是在硅胶 63充填于晶粒座 611后再结合于支架 61上， 且炮弹型透镜 65可以为一硅胶透镜或是一玻璃透镜， 在经过特殊的光学设计后将透镜设 计成炮弹型透镜 65， 使红外光 LED 60的出光角度是介于 20°至 60°之间， 借此缩小红外光 LED 60的出光角度并有效提高红外光 LED60的光照度。 硅 胶 63材质的透镜具有高折射率、 高耐温性、 高绝缘性、 高化学稳定性、 高 透光性与高可靠度等特性， 因此同样的也可以避免传统封装材料因高温而 产生的材料劣化及其引发的亮度衰减现象。  The cannonball lens 65 is coupled to the bracket 61 and covers the LED chip 62. The projectile lens 65 is coupled to the bracket 61 after the silica gel 63 is filled in the die holder 611, and the cannonball lens 65 can be a silicone lens. Or a glass lens, after a special optical design, the lens is designed as a bullet-type lens 65, so that the light-emitting angle of the infrared light LED 60 is between 20° and 60°, thereby reducing the light output of the infrared light LED 60. The angle and effectively improve the illumination of the infrared LED 60. The lens made of silica gel 63 has high refractive index, high temperature resistance, high insulation, high chemical stability, high light transmittance and high reliability, so it can also avoid the material of traditional packaging materials due to high temperature. Deterioration and the phenomenon of brightness decay caused by it.
如图 6所示， 炮弹型透镜 65的出光角度可根据配光曲线图 70得知， 根据红外光 LED 60所照射出来的红外光的相对强度为 50%时所画出来的圆 弧与红外光 LED 60照射出来的照射范围的两交点间的角度， 可知出光角度 为 30。， 因此借由透过炮弹型透镜 65， 可集中红外光 LED 60的光线以有效 提高光照度， 使得具有炮弹型透镜 65的红外光 LED 60具有低发光角度高 照度的特性， 借此提供监视器 10更佳的光照效果。  As shown in FIG. 6, the light-emitting angle of the cannonball lens 65 can be obtained according to the light distribution curve 70. The arc and infrared light drawn according to the relative intensity of the infrared light emitted by the infrared light LED 60 is 50%. The angle between the two intersections of the illumination range illuminated by the LED 60 shows that the light angle is 30. Therefore, by passing through the cannonball lens 65, the light of the infrared light LED 60 can be concentrated to effectively increase the illuminance, so that the infrared light LED 60 having the cannonball lens 65 has a low illumination angle and high illuminance, thereby providing the monitor 10 Better lighting effects.
以上所述， 仅是本发明的较佳实施例而已， 并非对本发明作任何形式 上的限制， 虽然本发明已以较佳实施例揭露如上， 然而并非用以限定本发 明，任何熟悉本专业的技术人员， 在不脱离本发明技术方案范围内，当可利 用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但 凡是未脱离本发明技术方案的内容， 依据本发明的技术实质对以上实施例 所作的任何简单修改、 等同变化与修饰，均仍属于本发明技术方案的范围 内。  The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. The skilled person can make some modifications or modifications to the equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention, but without departing from the technical solution of the present invention, according to the present invention. Technical Substantials Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

Claims

权 利 要 求 Rights request
1、 一种具有炮弹型透镜 LED的监视器， 其特征在于包括：  A monitor having a cannonball type lens, characterized by comprising:
一壳体， 结合于一旋转基座上， 该壳体是为一中空壳体并具有一开 ρ；  a housing, coupled to a rotating base, the housing is a hollow housing and has an opening ρ;
一本体， 是容置于该中空壳体中， 该本体具有一摄影机， 其中该摄 影机是设置于该开口处并朝向外部； 以及  a body is housed in the hollow housing, the body having a camera, wherein the camera is disposed at the opening and facing outward;
一炮弹型透镜 LED光源模组， 设置于该本体上并环绕该摄影机， 该 炮弹型透镜 LED光源模组是为一红外光光源， 且该炮弹型透镜 LED光源 模组包括：  A projectile lens type LED light source module is disposed on the body and surrounds the camera. The cannonball type lens light source module is an infrared light source, and the cannonball type lens LED light source module comprises:
一电路基板； 及  a circuit substrate; and
多数颗红外光 LED, 电性连接且固设于该电路基板， 每一该红外 光 LED包括：  A plurality of infrared LEDs are electrically connected and fixed on the circuit substrate, and each of the infrared LEDs includes:
一支架， 具有一晶粒座及至少二个电极；  a bracket having a die pad and at least two electrodes;
一 LED芯片， 结合于该晶粒座内并与该些电极导电结合； 一硅胶， 充填于该晶粒座内且覆盖该 LED芯片； 及 一炮弹型透镜， 结合于该支架上且覆盖该 LED芯片， 使该红外 光 LED的出光角度介于 20°至 60°之间。  An LED chip is coupled to the die pad and electrically conductively coupled to the electrodes; a silica gel filled in the die pad and covering the LED chip; and a cannonball lens coupled to the bracket and covering the LED The chip is such that the infrared light LED has an exit angle of between 20° and 60°.
2、 根据权利要求所述 1的具有炮弹型透镜 LED的监视器， 其特征在于 所述电路基板为一印刷电路板、 一铝基电路板或一陶瓷基板。  2. A monitor having a bullet-type lens LED according to claim 1, wherein said circuit substrate is a printed circuit board, an aluminum-based circuit board or a ceramic substrate.
3、 根据权利要求所述 1的具有炮弹型透镜 LED的监视器， 其特征在于 所述支架具有一导热基座， 该晶粒座为该导热基座的一部分。  3. A monitor having a bullet-type lens LED according to claim 1 wherein said bracket has a thermally conductive base, said die pad being part of said thermally conductive base.
4、 根据权利要求 1所述的具有炮弹型透镜 LED的监视器， 其特征所述 LED芯片是借由一银胶与该晶粒座结合。  4. A monitor having a cannonball type lens according to claim 1, wherein said LED chip is bonded to said die pad by a silver paste.
5、 根据权利要求 1所述的具有炮弹型透镜 LED的监视器， 其特征在所 述炮弹型透镜为一硅胶透镜或一玻璃透镜。  A monitor having a cannonball type lens according to claim 1, wherein said cannonball type lens is a silicone lens or a glass lens.
6、 一种炮弹型透镜 LED光源模组， 是为一低发光角度高照度的红外光 光源并应用于一监视器中， 其特征在于该炮弹型透镜 LED光源模组包括： 一电路基板； 以及  6. A cannonball type lens LED light source module is a low illumination angle high illumination infrared light source and is applied to a monitor, wherein the cannonball type lens LED light source module comprises: a circuit substrate;
多数颗红外光 LED, 电性连接且固设于该电路基板， 每一该红外光 LED包括：  A plurality of infrared LEDs are electrically connected and fixed on the circuit substrate, and each of the infrared LEDs includes:
一支架， 具有一晶粒座及至少二个电极；  a bracket having a die pad and at least two electrodes;
一 LED芯片， 结合于该晶粒座内并与该些电极导电结合； 一硅胶， 充填于该晶粒座内且覆盖该 LED芯片； 及 一炮弹型透镜， 结合于该支架上且覆盖该 LED芯片， 使该红外光 LED的出光角度介于 20°至 60。之间。 An LED chip is coupled in the die pad and electrically conductively coupled to the electrodes; a silica gel is filled in the die holder and covers the LED chip; and a cannonball lens is coupled to the bracket and covers the LED chip, so that the infrared light LED has an exit angle of 20° to 60°. between.
7、 根据权利要求 6所述的炮弹型透镜 LED光源模组， 其特征在于所述 电路基板为一印刷电路板、 一铝基电路板或一陶瓷基板。  7. The cannonball type lens LED light source module according to claim 6, wherein the circuit substrate is a printed circuit board, an aluminum based circuit board or a ceramic substrate.
8、 根据权利要求 6所述的炮弹型透镜 LED光源模组， 其特征在于所述 支架具有一导热基座， 该晶粒座为该导热基座的一部分。  8. The cannonball lens LED light source module of claim 6, wherein the bracket has a thermally conductive base, the die pad being part of the thermally conductive base.
9、 根据权利要求 6所述的炮弹型透镜 LED光源模组， 其特征在于所述 LED芯片是借由一银胶与该晶粒座结合。  9. The cannonball type lens LED light source module according to claim 6, wherein the LED chip is bonded to the die pad by a silver paste.
10、 根据权利要求 6所述的炮弹型透镜 LED光源模组， 其特征在于所 述炮弹型透镜为一硅胶透镜或一玻璃透镜。  10. The cannonball type lens LED light source module according to claim 6, wherein the cannonball type lens is a silicone lens or a glass lens.
PCT/CN2011/002064 2011-12-12 2011-12-12 Bullet-shape lens led monitor and bullet-shape lens led light source module WO2013086650A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/002064 WO2013086650A1 (en) 2011-12-12 2011-12-12 Bullet-shape lens led monitor and bullet-shape lens led light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/002064 WO2013086650A1 (en) 2011-12-12 2011-12-12 Bullet-shape lens led monitor and bullet-shape lens led light source module

Publications (1)

Publication Number Publication Date
WO2013086650A1 true WO2013086650A1 (en) 2013-06-20

Family

ID=48611773

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/002064 WO2013086650A1 (en) 2011-12-12 2011-12-12 Bullet-shape lens led monitor and bullet-shape lens led light source module

Country Status (1)

Country Link
WO (1) WO2013086650A1 (en)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2751492Y (en) * 2004-12-08 2006-01-11 邓智明 Camera
JP2006339653A (en) * 2005-06-03 2006-12-14 Samsung Electro-Mechanics Co Ltd High power led package, and method of manufacturing high power led package
CN201142711Y (en) * 2007-12-10 2008-10-29 深圳市通宝莱科技有限公司 High-resolution night viewing spherical video camera
CN101382722A (en) * 2008-10-13 2009-03-11 李峰 Wide-angle infrared night vision cam
CN201232978Y (en) * 2008-07-24 2009-05-06 东莞市邦臣光电有限公司 High power LED infrared emission tube
CN201256415Y (en) * 2008-07-09 2009-06-10 林欣欣 Improved construction of monitor
CN201773866U (en) * 2010-05-12 2011-03-23 鹤山丽得电子实业有限公司 High-power LED package structure
CN201780989U (en) * 2009-10-21 2011-03-30 陆亮 Light-emitting diode
CN201805486U (en) * 2010-09-11 2011-04-20 莱阳市科盾通信设备有限责任公司 Anti-explosion infrared integral video camera
CN201812123U (en) * 2010-07-30 2011-04-27 胡团 Infrared dome camera
US20110101397A1 (en) * 2009-11-03 2011-05-05 Theleds Co., Ltd. Light emitting diode package having lens
CN201869284U (en) * 2010-11-16 2011-06-15 邓志明 Monitoring video camera
CN202009035U (en) * 2011-03-30 2011-10-12 铜陵科海光电技术有限公司 Wide-angle LED packaging device
CN202040579U (en) * 2011-01-12 2011-11-16 东莞巨扬电器有限公司 LED lamp with camera
CN202067832U (en) * 2011-05-24 2011-12-07 湖北云川光电科技有限公司 High-power LED (light-emitting diode) light source

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2751492Y (en) * 2004-12-08 2006-01-11 邓智明 Camera
JP2006339653A (en) * 2005-06-03 2006-12-14 Samsung Electro-Mechanics Co Ltd High power led package, and method of manufacturing high power led package
CN201142711Y (en) * 2007-12-10 2008-10-29 深圳市通宝莱科技有限公司 High-resolution night viewing spherical video camera
CN201256415Y (en) * 2008-07-09 2009-06-10 林欣欣 Improved construction of monitor
CN201232978Y (en) * 2008-07-24 2009-05-06 东莞市邦臣光电有限公司 High power LED infrared emission tube
CN101382722A (en) * 2008-10-13 2009-03-11 李峰 Wide-angle infrared night vision cam
CN201780989U (en) * 2009-10-21 2011-03-30 陆亮 Light-emitting diode
US20110101397A1 (en) * 2009-11-03 2011-05-05 Theleds Co., Ltd. Light emitting diode package having lens
CN201773866U (en) * 2010-05-12 2011-03-23 鹤山丽得电子实业有限公司 High-power LED package structure
CN201812123U (en) * 2010-07-30 2011-04-27 胡团 Infrared dome camera
CN201805486U (en) * 2010-09-11 2011-04-20 莱阳市科盾通信设备有限责任公司 Anti-explosion infrared integral video camera
CN201869284U (en) * 2010-11-16 2011-06-15 邓志明 Monitoring video camera
CN202040579U (en) * 2011-01-12 2011-11-16 东莞巨扬电器有限公司 LED lamp with camera
CN202009035U (en) * 2011-03-30 2011-10-12 铜陵科海光电技术有限公司 Wide-angle LED packaging device
CN202067832U (en) * 2011-05-24 2011-12-07 湖北云川光电科技有限公司 High-power LED (light-emitting diode) light source

Similar Documents

Publication Publication Date Title
US20130033195A1 (en) Light source apparatus
TWM498387U (en) Light emitting diode module package structure having thermal-electric separated function and electrical connection module
TW201508951A (en) LED lighting device
CN201149869Y (en) LED encapsulation structure
CN202032396U (en) LED road lighting lamp module
CN207262093U (en) A kind of LED light high heat dissipation aluminum
CN208076878U (en) A kind of solar energy can be automatically controled the liquid crystal screen backlight of adjusting
TWM426957U (en) Cannon type lens LED monitor and light source the same
WO2013086650A1 (en) Bullet-shape lens led monitor and bullet-shape lens led light source module
TWM443935U (en) Light source structure
CN202455464U (en) Monitor with shell-type lens light emitting diode (LED) and light source module thereof
CN103322436B (en) Structure of LED lamp
CN103888649A (en) Low-cost laser camera
KR20140139956A (en) Light source device adapted to a direct-type backlight module and display device therewith
CN208349084U (en) A kind of bulkhead lamp of copper pipe radiator structure
CN206802819U (en) A kind of LED light bar
KR101929256B1 (en) Lighting device
KR20160131447A (en) LED Light Source, Backlight and Liquid Crystal Display Apparatus
CN207425910U (en) Water proof type LED package modules
CN103761929A (en) Silica-based unit board of LED display screen
CN201739810U (en) High power LED lighting source
CN208589462U (en) A kind of LED lamp
CN208735593U (en) A kind of radiator structure of rapidly and efficiently rate LDD lamp bead
TWI806218B (en) Electronic device and circuit board module thereof
CN203797388U (en) Dustproof and waterproof LED lamp

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11877487

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11877487

Country of ref document: EP

Kind code of ref document: A1