WO2013085054A3 - 切断装置 - Google Patents

切断装置 Download PDF

Info

Publication number
WO2013085054A3
WO2013085054A3 PCT/JP2012/081859 JP2012081859W WO2013085054A3 WO 2013085054 A3 WO2013085054 A3 WO 2013085054A3 JP 2012081859 W JP2012081859 W JP 2012081859W WO 2013085054 A3 WO2013085054 A3 WO 2013085054A3
Authority
WO
WIPO (PCT)
Prior art keywords
flux
die
cutting device
cutting
base
Prior art date
Application number
PCT/JP2012/081859
Other languages
English (en)
French (fr)
Other versions
WO2013085054A2 (ja
Inventor
光広 高橋
Original Assignee
株式会社高橋型精
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社高橋型精 filed Critical 株式会社高橋型精
Publication of WO2013085054A2 publication Critical patent/WO2013085054A2/ja
Publication of WO2013085054A3 publication Critical patent/WO2013085054A3/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/06—Severing by using heat
    • B26F3/08—Severing by using heat with heated members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B26F2001/4463—Methods and devices for rule setting, fixation, preparing cutting dies

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Details Of Cutting Devices (AREA)
  • General Induction Heating (AREA)

Abstract

　打抜き部材の刃の真下のみを効率よく加熱でき、かつ、加熱抜き型の作成時間を短縮できる切断装置を提供する。　切断装置９は、上定盤５１または下定盤５２に配置され、両定盤間に移送された打抜き対象６を上下定盤を近接させることで打ち抜くもので、磁束を一方の盤面から放射する磁束生成基盤１１と、磁束生成基盤１１の盤面側に取り付けられ、磁束により誘導加熱される打抜刃部材１２とを備え、磁束生成基盤１１の盤面に、複数のフェライトＵ字溝部材２２に収容された高周波用電線２１からなる磁束生成回路２が設けられている。
PCT/JP2012/081859 2011-12-09 2012-12-07 切断装置 WO2013085054A2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011269488 2011-12-09
JP2011-269488 2011-12-09

Publications (2)

Publication Number Publication Date
WO2013085054A2 WO2013085054A2 (ja) 2013-06-13
WO2013085054A3 true WO2013085054A3 (ja) 2013-09-26

Family

ID=48575024

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/081859 WO2013085054A2 (ja) 2011-12-09 2012-12-07 切断装置

Country Status (2)

Country Link
JP (1) JPWO2013085054A1 (ja)
WO (1) WO2013085054A2 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104960034B (zh) * 2015-07-08 2017-02-01 张伟飞 一种快速成型的模切机
JP2019147228A (ja) * 2018-02-28 2019-09-05 株式会社▲高▼橋型精 打ち抜き刃加熱システム
CN113442231A (zh) * 2020-03-25 2021-09-28 昊佰电子科技（上海）有限公司 一种热冲切五金模具
CN111452135B (zh) * 2020-04-09 2021-11-05 杭州揽廉科技有限公司 一种利用细纤维遇热收缩量大面膜裁剪装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104219A1 (ja) * 2008-02-20 2009-08-27 有限会社ダルトン 加熱溶断装置
WO2010018703A1 (ja) * 2008-08-12 2010-02-18 株式会社高橋型精 抜き型および抜き型温度制御システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104219A1 (ja) * 2008-02-20 2009-08-27 有限会社ダルトン 加熱溶断装置
WO2010018703A1 (ja) * 2008-08-12 2010-02-18 株式会社高橋型精 抜き型および抜き型温度制御システム

Also Published As

Publication number Publication date
JPWO2013085054A1 (ja) 2015-04-27
WO2013085054A2 (ja) 2013-06-13

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