WO2013075353A1 - 一种拼接背板的冲压模具和拼接背板的加工方法 - Google Patents

一种拼接背板的冲压模具和拼接背板的加工方法 Download PDF

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Publication number
WO2013075353A1
WO2013075353A1 PCT/CN2011/083336 CN2011083336W WO2013075353A1 WO 2013075353 A1 WO2013075353 A1 WO 2013075353A1 CN 2011083336 W CN2011083336 W CN 2011083336W WO 2013075353 A1 WO2013075353 A1 WO 2013075353A1
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Prior art keywords
support plate
heat dissipation
plate
splicing
processing
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PCT/CN2011/083336
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English (en)
French (fr)
Inventor
郭仪正
周革革
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/378,108 priority Critical patent/US20130133395A1/en
Publication of WO2013075353A1 publication Critical patent/WO2013075353A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/46—Fixing elements

Definitions

  • the present invention relates to the field of liquid crystal display, and more particularly to a stamping die for splicing a back sheet and a method for processing the spliced back sheet.
  • the liquid crystal display device comprises a display panel and a backlight module for providing a light source to the display panel, and a back plate is arranged at the bottom of the backlight module for supporting the internal device and the sealing module to provide necessary protection.
  • the existing backboard is generally made of the same material, and the material used is aluminum, iron or plastic. If the entire backplane is made of iron, it is necessary to add heat-dissipating components, which increases the cost. If aluminum panels are used, no additional heat-dissipating components are used. Although the heat-conducting effect is better than that of the iron plates, only the whole backplane is only partially used. The heat dissipation effect, the other part does not play the role of heat dissipation but support, so the cost is still high.
  • the specific way is: Since the price of the aluminum plate is more expensive than the price of the iron plate, the part of the back plate that does not exert the heat dissipation effect can be made of the iron plate to form the support plate; and the portion located in the heat generating area is still made of the aluminum plate to form the heat dissipation plate. , splicing the heat sink and the support plate to form a composite backing plate (as shown in Figures 1 and 2).
  • the existing splicing backboards use two sets of dies respectively, which requires two production lines.
  • Each of the two backing boards has seven projects, so the two pieces need 14 projects, plus the last splicing project. A total of 15 projects are required, which has increased the cost.
  • the technical problem to be solved by the present invention is to provide a stamping die and a splicing backing plate processing method for a splicing backboard which can be processed in a tubular process.
  • the object of the present invention is achieved by the following technical solutions:
  • a stamping die for splicing a backing plate comprising a pattern of a plurality of backing plates, the backing plate pattern comprising a plurality of sub-backing plates and sub-patterns thereof.
  • the sub-backboard includes a heat dissipation plate and a support plate.
  • This is a form of a specific backplane graphic, which is divided according to the function of the backplane, and can be selected in a targeted manner to reduce the cost.
  • the sub-patterns of the heat dissipation plate and the support plate are the same, and the same sub-pattern can be designed to reduce the design cost.
  • the sub-pattern of the splicing portion of the heat dissipation plate and the support plate includes a rib pattern. Adding ribs at the splicing area can enhance the strength of the splicing, improve the flatness of the backing plate, and ensure the image quality of the module.
  • a method for processing a spliced backboard comprising the following steps:
  • A The heat sink and the support plate are placed in the same mold for processing
  • the heat dissipation plate and the support plate are fixed by riveting.
  • the heat dissipation plate and the support plate are fixed by screw connection.
  • the heat dissipation plate and the support plate are fixed by means of super glue bonding.
  • the heat dissipation plate and the support plate are fixed by a bite manner, and the heat dissipation plate and the support plate are folded at a joint to form a card slot and a card plate, and the card plate of the heat dissipation plate is embedded in the The card slot of the support plate, at the same time, the card plate of the support plate is also embedded in the card slot of the heat dissipation plate to form the undercut connection.
  • This embodiment eliminates the need for additional fixing materials, reduces assembly steps, and improves assembly efficiency.
  • FIG. 1 is a schematic view showing a heat dissipation plate and a support plate
  • FIG. 2 is a schematic view of the heat sink and the support plate assembled
  • FIG. 3 is a schematic view of a conventional heat sink processing method
  • FIG. 4 is a schematic view showing a conventional processing method of the support plate
  • FIG. 5 is a schematic view of the processing mode of the present invention.
  • FIG. 6 is a schematic view showing the fixing of the heat dissipation plate and the support plate of the present invention by using a rivet-free riveting manner
  • FIG. 7 is a schematic view showing the fixing of the heat dissipation plate and the support plate of the present invention by rivet riveting
  • FIG. 8 is a schematic view showing the fixing of the heat dissipation plate and the support plate of the present invention by a strong adhesive bonding method
  • FIG. 9 is a schematic view showing the fixing of the heat dissipation plate and the support plate of the present invention by screw connection;
  • Figure 10 is a schematic view showing the fixing of the heat dissipation plate and the support plate of the present invention by means of a snap joint;
  • a stamping die for splicing a backing plate comprising a pattern of a plurality of backing plates, the backing plate pattern comprising a plurality of sub-backing plates and sub-patterns thereof.
  • the sub-backboard includes a heat dissipation board 1 and a support board 2, so that the backboard material can be selected in a targeted manner, which is advantageous for reducing the cost.
  • the sub-patterns of the heat dissipation plate 1 and the support plate 2 are the same, and the same sub-pattern can be designed in a tubular shape to further reduce the design cost.
  • the sub-pattern of the splicing portion of the heat dissipating plate 1 and the supporting plate 2 includes a rib 6 pattern.
  • a method for processing a spliced backboard includes:
  • A The plates of the heat dissipation plate 1 and the support plate 2 are placed in the same mold for processing;
  • B The processed heat dissipation plate 1 and the support plate 2 are spliced and fixed.
  • the heat dissipation plate 1 and the support plate 2 may be connected by riveting (as shown in FIG. 6 and FIG. 7 ), super glue 4 (as shown in FIG. 8 ), and screw 5 (shown in FIG. 9 ).
  • the splicing joints (as shown in FIG. 10) are fixed; the rivets may include riveting without rivets 3 (as shown in FIG. 6) and riveting of rivets 3 (as shown in FIG. 7).
  • the heat dissipation plate 1 and the support plate 2 can also be fixed by a bite manner, and the heat dissipation plate 1 and the support plate 2 are folded at a joint to form a card slot and a card board.
  • the card plate of the heat dissipation plate 1 is embedded in the card slot of the support plate 2, and the card plate of the support plate 2 is also embedded in the card slot of the heat dissipation plate 1 to form the undercut connection.
  • the heat dissipation plate 1 and the support plate 2 are simultaneously stamped and formed in the same mold, so that the processing process of the original two plates can be combined, and each project requires 7 projects as an example.
  • the heat dissipation plate 1 and the support Board 2 requires 7 projects, a total of 14 projects, plus the last splicing project, a total of 15 projects, which adds a lot of cost; if you use the cylinder process of the invention, only 8 projects are needed. , greatly reducing the number of projects, improving efficiency and reducing costs.
  • simultaneous processing in the same mold the consistency of the two boards is good, and the flatness is better when splicing.

Abstract

一种拼接背板的冲压模具和拼接背板的加工方法，所述拼接背板的加工方法，包括将散热板（1）和支撑板（2）的板材放到同一模具中进行加工；然后将加工好的所述散热板（1）和所述支撑板（2）进行拼接固定。由于在一套模具上同时加工散热板（1）和支撑板（2），这样两块板的加工过程就能合并，缩减了一半的加工步骤。另外，在同一模具中同时加工，两块板的一致性好，拼接的时候平整度更好。

Description

一种拼接背板的冲压模具和拼接背板的加工方法
【技术领域】
本发明涉及液晶显示领域， 更具体的说， 涉及一种拼接背板的沖压模具和 拼接背板的加工方法。
【背景技术】
液晶显示装置包括显示面板以及给显示面板提供光源的背光模组， 背光模 组底部设有背板， 用于支撑内部器件以及密封模组， 提供必要的防护。 现有背 板一般是由同一种材料制作而成， 所用的材料是铝板、 铁板或塑胶。 如果整个 背板采用铁板来制作， 还需要增加散热元件， 这样增加成本； 如果采用铝板来 制作， 不额外增加使用散热元件， 虽然其导热效果比铁板的好， 但是整个背板 只有一部分发挥散热作用， 另外一部分没有发挥散热作用而是支撑作用， 因此 成本仍然较高。
为了解决背板成本过高的问题， 本申请人于 10月 12 日申请了一种背光模 组的背板、 背光模组及液晶显示装置， 申请号为 201110308489.5 , 该申请公开 了以散热板和支撑板形成的背板结构。 具体方式是： 由于铝板价格比铁板的价 格贵， 可以将背板中没有发挥散热作用的部分用铁板来制作， 形成支撑板； 而 位于发热区域的部分仍然用铝板来制作， 形成散热板， 将散热板和支撑板拼接， 形成复合材料的拼接背板（如图 1、 2所示）。
但现有的拼接背板分别采用两套模具， 那就需要占据两条生产线， 两片背 板中每片有 7个工程，那么这两片就需要 14个工程，再加上最后一道拼接工程， 总共需要 15个工程， 这样以来增加了大量成本。
【发明内容】
本发明所要解决的技术问题是提供一种可以筒化加工步骤的拼接背板的沖 压模具和拼接背板的加工方法。 本发明的目的是通过以下技术方案来实现的：
一种拼接背板的沖压模具， 包括多个背板的图形， 所述背板图形包括多个 子背板及其拼接处的子图形。
优选的， 所述子背板包括散热板和支撑板。 此为一种具体的背板图形的组 成形式， 按背板的功能来划分， 可以有针对性的选择背板材料， 有利于降低成 本。
优选的， 所述散热板和支撑板的子图形相同， 相同的子图形可以筒化设计， 降低设计成本。
优选的， 所述散热板和所述支撑板的拼接处的子图形包括加强筋图形。 在 拼接处增加加强筋， 可以增强拼接处的强度， 提高背板的平整度， 保障模组的 影像质量。
一种拼接背板的加工方法， 包括以下步骤：
A:将散热板和支撑板的板材放到同一模具中进行加工；
B:将加工好的所述散热板和所述支撑板进行拼接固定。
优选的， 所述散热板和所述支撑板通过铆接方式固定。 此为所述散热板和 所述支撑板一种具体实施方式。
优选的， 所述散热板和所述支撑板通过螺釘连接的方式固定。 此为所述散 热板和所述支撑板另外一种具体实施方式。
优选的， 所述散热板和所述支撑板通过强力胶粘贴的方式固定。 此为所述 散热板和所述支撑板第三种具体实施方式。
优选的， 所述散热板和所述支撑板通过咬缝方式固定， 所述散热板和所述 支撑板在连接处折边， 形成卡槽和卡板， 所述散热板的卡板嵌入所述支撑板的 卡槽， 同时， 所述支撑板的卡板也嵌入所述散热板的卡槽， 形成所述的咬缝连 接。 该实施方式中无需采用额外的固定材料， 减少组装步骤， 提高组装效率。
本发明由于在一套模具上同时加工散热板和支撑板， 这样原来两块板的加 工过程就能合并， 缩减了一半的加工步骤。 另外， 在同一模具中同时加工， 两 块板的一致性好， 拼接的时候平整度更好 c
【附图说明】
图 1是散热板和支撑板分列示意图；
图 2是散热板和支撑板拼装后的示意图；
图 3是现有的散热板加工方式示意图；
图 4是现有的支撑板加工方式示意图；
图 5是本发明加工方式示意图；
图 6是本发明散热板和支撑板采用无铆釘的铆接方式固定示意图； 图 7是本发明散热板和支撑板采用铆釘铆接方式固定示意图；
图 8是本发明散热板和支撑板采用强力胶黏结方式固定示意图；
图 9是本发明散热板和支撑板采用螺釘连接方式固定示意图；
图 10是本发明散热板和支撑板采用咬缝连接方式固定示意图；
其中： 1、 散热板； 2、 支撑板； 3、 铆釘； 4、 强力胶； 5、 螺釘； 6、 加强 筋。
【具体实施方式】
下面结合附图和较佳的实施例对本发明作进一步说明。
一种拼接背板的沖压模具， 包括多个背板的图形， 所述背板图形包括多个 子背板及其拼接处的子图形。 按背板的功能来划分， 所述子背板包括散热板 1 和支撑板 2, 这样可以有针对性的选择背板材料， 有利于降低成本。 进一步的， 所述散热板 1和支撑板 2的子图形相同， 相同的子图形可以筒化设计， 进一步 降低设计成本。 为了增强拼接背板的强度、 提升平整度， 所述散热板 1 和所述 支撑板 2的拼接处的子图形包括加强筋 6图形。
如图 5所示， 一种拼接背板的加工方法， 包括：
A:将散热板 1和支撑板 2的板材放到同一模具中进行加工； B:将加工好的所述散热板 1和所述支撑板 2进行拼接固定。
所述散热板 1和支撑板 2之间可以通过铆接（如图 6、 图 7所示）、 强力胶 4黏结 （如图 8中所示；)、 螺釘 5 (如图 9中所示）连接、 咬缝连接（如图 10中 所示）等方式进行固定； 所述铆接可以包括无铆釘 3的铆接（如图 6中所示） 和铆釘 3铆接（如图 7中所示）。 下面以咬缝方式进一步阐释本发明中散热板 1 和支撑板 2的固定方式：
如图 10所示， 所述散热板 1和所述支撑板 2还可以通过咬缝方式固定， 所 述散热板 1和所述支撑板 2在连接处折边， 形成卡槽和卡板， 所述散热板 1的 卡板嵌入所述支撑板 2的卡槽， 同时， 所述支撑板 2的卡板也嵌入所述散热板 1 的卡槽， 形成所述的咬缝连接。 该实施方式中无需采用额外的固定材料， 减少 组装步骤， 提高组装效率。
散热板 1和支撑板 2在同一模具中同时沖压成型， 这样原来两块板的加工 过程就能合并， 以每块板需要 7个工程为例， 在现有的工序中， 散热板 1和支 撑板 2分别需要 7个工程， 总计需要 14个工程， 再加上最后一道拼接工程， 总 共需要 15个工程， 这样以来增加了大量成本； 如果采用本发明的筒化工艺制程 就仅需要 8 个工程， 大大减少了工程数， 提高效率并降低成本。 另外， 在同一 模具中同时加工， 两块板的一致性好， 拼接的时候平整度更好。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不 能认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通 技术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干筒单推演或替 换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、 一种拼接背板的沖压模具， 包括： 多个背板的图形， 所述背板图形 包括多个子背板及其拼接处的子图形。
2、 如权利要求 1所述的一种拼接背板的沖压模具， 其特征在于， 所述 子背板包括散热板和支撑板。
3、 如权利要求 1所述的一种拼接背板的沖压模具， 其特征在于， 所述 散热板和支撑板的子图形相同。
4、 如权利要求 1所述的一种拼接背板的沖压模具， 其特征在于， 所述 散热板和所述支撑板的拼接处的子图形包括加强筋图形。
5、 一种拼接背板的加工方法， 包括以下步骤：
A:将散热板和支撑板的板材放到同一模具中进行加工；
B:将加工好的所述散热板和所述支撑板进行拼接固定。
6、 如权利要求 5所述的一种拼接背板的加工方法， 其特征在于， 所述 散热板和所述支撑板通过铆接方式固定。
7、 如权利要求 5所述的一种拼接背板的加工方法， 其特征在于， 所述 散热板和所述支撑板通过螺釘连接的方式固定。
8、 如权利要求 5所述的一种拼接背板的加工方法， 其特征在于， 所述 散热板和所述支撑板通过强力胶粘贴的方式固定。
9、 如权利要求 5所述的一种拼接背板的加工方法， 其特征在于， 所述 散热板和所述支撑板通过咬缝方式固定， 所述散热板和所述支撑板在连接 处折边， 形成卡槽和卡板， 所述散热板的卡板嵌入所述支撑板的卡槽， 同 时， 所述支撑板的卡板也嵌入所述散热板的卡槽， 形成所述的咬缝连接。
PCT/CN2011/083336 2011-11-25 2011-12-02 一种拼接背板的冲压模具和拼接背板的加工方法 WO2013075353A1 (zh)

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US13/378,108 US20130133395A1 (en) 2011-11-25 2011-12-02 Stamping Die of Joining Backplane and Processing Method of Joining Backplane

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CN2011103822748A CN102489603A (zh) 2011-11-25 2011-11-25 一种拼接背板的冲压模具和拼接背板的加工方法
CN201110382274.8 2011-11-25

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