WO2013065451A1 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
WO2013065451A1
WO2013065451A1 PCT/JP2012/076047 JP2012076047W WO2013065451A1 WO 2013065451 A1 WO2013065451 A1 WO 2013065451A1 JP 2012076047 W JP2012076047 W JP 2012076047W WO 2013065451 A1 WO2013065451 A1 WO 2013065451A1
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WIPO (PCT)
Prior art keywords
substrate
processing apparatus
roller
mask
guide member
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Application number
PCT/JP2012/076047
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English (en)
French (fr)
Japanese (ja)
Inventor
圭 奈良
正和 堀
鈴木　智也
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株式会社ニコン
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Publication of WO2013065451A1 publication Critical patent/WO2013065451A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/0204—Sensing transverse register of web
    • B65H23/0216—Sensing transverse register of web with an element utilising photoelectric effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/022—Registering, tensioning, smoothing or guiding webs transversely by tentering devices
    • B65H23/025—Registering, tensioning, smoothing or guiding webs transversely by tentering devices by rollers
    • B65H23/0258—Registering, tensioning, smoothing or guiding webs transversely by tentering devices by rollers with a bowed axis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/50—Occurence
    • B65H2511/515—Absence
    • B65H2511/516—Marks; Patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2553/00—Sensing or detecting means
    • B65H2553/40—Sensing or detecting means using optical, e.g. photographic, elements
    • B65H2553/42—Cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method.
  • This application claims priority based on Japanese Patent Application No. 2011-242787 filed on November 4, 2011, the contents of which are incorporated herein by reference.
  • roller method As display elements constituting display devices such as display devices, for example, liquid crystal display elements, organic electroluminescence (organic EL) elements, electrophoretic elements used in electronic paper, and the like are known. As one of methods for manufacturing these elements, for example, a method called a roll-to-roll method (hereinafter simply referred to as “roll method”) is known (for example, refer to Patent Document 1).
  • a single sheet-like substrate wound around a substrate supply side roller is sent out, the substrate is transported while being wound up by a substrate recovery side roller, and the substrate is sent out after being sent out.
  • a pattern such as a display circuit or a driver circuit is sequentially formed on a substrate until it is formed.
  • processing apparatuses that form highly accurate patterns have been proposed.
  • An object according to the present invention is to provide a substrate processing apparatus and a substrate processing method capable of high-precision processing.
  • a substrate processing apparatus is a substrate processing apparatus that transports a belt-shaped substrate in a first direction and processes a surface to be processed of the substrate, and first guides the substrate in the first direction.
  • a member and a second guide member that guides the substrate so that the size of the substrate in the second direction intersecting the first direction gradually increases or decreases from the first guide member toward the downstream side in the first direction;
  • a processing apparatus for processing a surface to be processed of the substrate is provided between the first guide member and the second guide member.
  • a substrate processing method is a substrate processing method for transporting a flexible substrate formed in a strip shape in a longitudinal direction of the strip and forming a device pattern on a surface to be processed of the substrate, With respect to the processing region on the substrate on which the device pattern is formed, between a first position on the upstream side in the longitudinal direction of the substrate and a second position on the downstream side with respect to the processing region, The dimension in the width direction of the substrate becomes a predetermined value between the first position and the second position by continuously expanding or reducing the dimension in the width direction intersecting the longitudinal direction of the substrate. Determining a position in the longitudinal direction, setting the region to be processed at the determined position, and forming the device pattern.
  • the schematic diagram which shows the structure of the substrate processing apparatus which concerns on this embodiment The figure which shows the structure of the processing apparatus which concerns on this embodiment.
  • the figure which shows the other structure of the processing apparatus which concerns on this embodiment The figure which shows the other structure of the processing apparatus which concerns on this embodiment.
  • the figure which shows the other structure of the processing apparatus which concerns on this embodiment The figure which shows the other structure of the processing apparatus which concerns on this embodiment.
  • the figure which shows the other structure of the processing apparatus which concerns on this embodiment The figure which shows the other structure of the processing apparatus which concerns on this embodiment.
  • the figure which shows the other structure of the processing apparatus which concerns on this embodiment. The figure which shows the other structure of the processing apparatus which concerns on this embodiment.
  • the figure which shows the other structure of the processing apparatus which concerns on this embodiment The figure which shows the other structure of the processing apparatus which concerns on this embodiment.
  • the figure which shows the other structure of the processing apparatus which concerns on this embodiment The figure which shows the other structure of the processing apparatus which concerns on this embodiment.
  • the figure which shows the other structure of the processing apparatus which concerns on this embodiment The figure which shows the other structure of the
  • FIG. 1 is a schematic diagram showing a configuration of a substrate processing apparatus 100 according to an embodiment of the present invention.
  • the substrate processing apparatus 100 performs processing on a substrate supply unit 2 that supplies a strip-shaped substrate (for example, a strip-shaped film member) S and a surface (surface to be processed) Sa of the substrate S.
  • the substrate processing unit 3, the substrate recovery unit 4 that recovers the substrate S, and a control unit CONT that controls these units are provided.
  • the substrate processing unit 3 executes various processes on the surface of the substrate S after the substrate S is sent out from the substrate supply unit 2 until the substrate S is recovered by the substrate recovery unit 4.
  • the substrate processing apparatus 100 can be used when a display element (electronic device) such as an organic EL element or a liquid crystal display element is formed on the substrate S.
  • an XYZ coordinate system is set as shown in FIG. 1, and the following description will be given using this XYZ coordinate system as appropriate.
  • the XYZ coordinate system for example, the X axis and the Y axis are set along the horizontal plane, and the Z axis is set upward along the vertical direction.
  • the substrate processing apparatus 100 transports the substrate S from the minus side ( ⁇ side) to the plus side (+ side) along the X axis as a whole. In that case, the width direction (short direction) of the strip
  • the substrate S to be processed in the substrate processing apparatus 100 for example, a foil such as a resin film or stainless steel can be used.
  • the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.
  • the substrate S preferably has a smaller coefficient of thermal expansion so that the dimensions do not change even when subjected to heat of about 200 ° C., for example.
  • an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient.
  • the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
  • the substrate S may be a single piece of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the resin film or aluminum foil is bonded to the ultrathin glass.
  • the dimension in the width direction (short direction) of the substrate S is, for example, about 1 m to 2 m, and the dimension in the length direction (long direction) is, for example, 10 m or more.
  • this dimension is only an example and is not limited thereto.
  • the dimension in the Y direction of the substrate S may be 50 cm or less, or 2 m or more.
  • substrate S may be 10 m or less.
  • the substrate S is formed to have flexibility.
  • flexibility refers to the property that the substrate can be bent without being broken or broken even if a force of its own weight is applied to the substrate.
  • flexibility includes a property of bending by a force of about its own weight. The flexibility varies depending on the material, size, thickness, environment such as temperature, etc. of the substrate.
  • a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be used.
  • the substrate supply unit 2 supplies and supplies the substrate S wound in a roll shape to the substrate processing unit 3, for example.
  • the substrate supply unit 2 is provided with a shaft around which the substrate S is wound, a rotation drive device that rotates the shaft, and the like.
  • a configuration in which a cover portion that covers the substrate S wound in a roll shape or the like may be provided.
  • the substrate supply unit 2 is not limited to a mechanism that sends out the substrate S wound in a roll shape, and includes a mechanism (for example, a nip-type drive roller) that sequentially feeds the belt-like substrate S in the length direction. I just need it.
  • the substrate collection unit 4 collects the substrate S that has passed through the substrate processing apparatus 100, for example, in a roll shape. Similar to the substrate supply unit 2, the substrate recovery unit 4 is provided with a shaft for winding the substrate S, a rotational drive source for rotating the shaft, a cover for covering the recovered substrate S, and the like. In addition, when the substrate S is cut into a panel shape in the substrate processing unit 3, the substrate S is recovered in a state different from the state wound in a roll shape, for example, the substrate S is recovered in an overlapped state. It does not matter.
  • the substrate processing unit 3 transports the substrate S supplied from the substrate supply unit 2 to the substrate recovery unit 4 and processes the surface Sa of the substrate S during the transport process.
  • the substrate processing unit 3 includes a processing apparatus 10 (processing apparatus 10) that performs processing on the surface Sa to be processed of the substrate S, a driving roller R that sends the substrate S under conditions corresponding to the form of processing. And a conveying device 20.
  • the processing apparatus 10 has various apparatuses for forming, for example, organic EL elements on the surface Sa to be processed of the substrate S.
  • Examples of such an apparatus include, for example, a partition forming apparatus such as an imprint method for forming a partition on the surface Sa, an electrode forming apparatus for forming an electrode, and a light emitting layer forming apparatus for forming a light emitting layer. Etc.
  • a droplet coating apparatus for example, an ink jet type coating apparatus
  • a film forming apparatus for example, a plating apparatus, a vapor deposition apparatus, a sputtering apparatus
  • an exposure apparatus for example, a developing apparatus, a surface modification apparatus, a cleaning apparatus, and the like.
  • an exposure apparatus is provided as the processing apparatus 10, and apparatuses that perform processes before and after the photosensitive apparatus (photosensitive layer forming process, photosensitive layer developing process, etc.) are also provided in-line as necessary.
  • the substrate processing unit 3 is provided with an alignment camera 5 that cooperates with an exposure apparatus (processing apparatus 10).
  • the alignment camera (detection unit) 5 individually detects, for example, alignment marks (reference positions) ALM (see FIG. 3) formed along each of the ⁇ Y side edge and the + Y side edge of the substrate S. The detection result of the mark position by the alignment camera 5 is transmitted to the control unit CONT.
  • FIGS. 2 and 3 are diagrams illustrating a partial configuration of the substrate processing unit 3. 2 is a side view, and FIG. 3 is a plan view.
  • the substrate processing unit 3 includes a first roller (first guide member) 11, a second roller (second guide member) 12, a housing 13, and an exposure apparatus as the processing apparatus 10. Has EX.
  • the first roller 11 is a first guide member that guides the substrate S in the + X direction toward the housing 13 side.
  • the first roller 11 is provided on the upstream side ( ⁇ X side) in the transport direction of the substrate S with respect to the housing 13 and is arranged in parallel to the Y axis.
  • the first roller 11 is provided to be rotatable around a rotation axis parallel to the Y axis.
  • the first roller 11 supports the substrate S so that the substrate S is transported in parallel with the X direction.
  • the second roller 12 is a second guide member that guides the substrate S from the housing 13 to the + X side.
  • the second roller 12 is provided on the downstream side (+ X side) in the transport direction of the substrate S with respect to the housing 13 and is disposed in parallel to the Y axis.
  • the second roller 12 is provided to be rotatable about a rotation axis parallel to the Y axis.
  • the second roller 12 supports the substrate S so that the substrate S is transported in parallel to the X direction.
  • the second roller 12 in the present embodiment has the same diameter everywhere in the Y direction in the annular outer peripheral surface 12a in contact with the substrate S, and the rotation center line is curved in a convex shape in the + X direction within the XY plane. Yes. Therefore, the outer peripheral surface 12a of the second roller 12 is formed in a curved shape so as to protrude in the + X direction.
  • an expander roller so-called banana type roller, bow type roller
  • the 2nd roller 12 is provided so that curvature can be adjusted by control of the control part CONT.
  • the second roller 12 is provided with a curvature detection unit 12p that detects the curvature of the second roller 12.
  • the control part CONT can adjust the curvature of the 2nd roller 12 based on the detection result of the curvature detection part 12p. In the present embodiment, it is not always necessary to adjust (variable) the curvature of the second roller 12.
  • the rotation center line is curved with a predetermined constant curvature, and the width of the substrate S in the Y direction is a predetermined dimension. Any structure can be used as long as it can be widened.
  • the housing 13 is disposed between the first roller 11 and the second roller 12.
  • the housing 13 is formed in a rectangular parallelepiped shape, for example.
  • the housing 13 has a bottom portion 13B and a wall portion 13W.
  • the bottom 13B constitutes an end surface on the ⁇ Z side of the housing 13.
  • the wall portion 13W includes a + X side end surface 13Wb, a ⁇ X side end surface 13Wa, a + Y side end surface 13Wc, and a ⁇ Y side end surface 13Wd.
  • the + Z side of the housing 13 is opened.
  • a portion of the housing 13 surrounded by the wall portion 13W and the bottom portion 13B is a storage chamber 13R.
  • an opening part 13m for carrying the substrate S carried from the outside is formed on the ⁇ X side end face 13Wa of the wall part 13W.
  • An opening 13n for carrying the substrate S out of the storage chamber 13R to the outside is formed on the end surface 13Wb on the + X side of the wall 13W.
  • a moving roller (drive unit) 17 is formed on the ⁇ Z side of the bottom 13B.
  • the moving roller 17 is placed on the guide rail 16.
  • the guide rail 16 is supported by a support unit (not shown) of the substrate processing unit 3.
  • the guide rail 16 is formed along the X direction.
  • the housing 13 is provided so as to be movable in the X direction along the guide rail 16 by a moving roller 17.
  • the housing 13 is provided so as to be movable in the Y direction and moved in the ⁇ Z direction (rotation about the Z axis) by a drive mechanism (not shown).
  • the storage chamber 13R is provided with a drum-shaped substrate stage (substrate support portion) 14 and alignment cameras 18A and 18B (corresponding to the alignment camera 5 in FIG. 1).
  • the substrate stage 14 supports a portion of the substrate S between the first roller 11 and the second roller 12 (hereinafter referred to as “inter-roller portion Sr”).
  • the substrate stage 14 is formed in a shape having a cylindrical surface, such as a cylindrical shape or a columnar shape. In the present embodiment, a configuration in which the substrate stage 14 is formed in a cylindrical shape will be described as an example.
  • the substrate stage 14 supports the substrate S along the outer peripheral surface 14a, which is a cylindrical surface.
  • An air bearing or the like is formed between the outer peripheral surface 14a and the substrate S in a portion that can contact the substrate S.
  • a pad surface (having gas ejection holes, suction holes, a plurality of fine grooves, a plurality of extremely shallow depressions, etc.) is formed. Accordingly, when the substrate S is fed while applying tension in the X direction (longitudinal direction) to the substrate S, the substrate S is in a non-contact state on the pad surface of the outer peripheral surface 14a of the substrate stage 14, and the outer peripheral surface 14a. It is sent with a curvature that follows the radius of curvature.
  • a shaft portion 14 s is provided inside the substrate stage 14.
  • the shaft portion 14 s is provided on the central axis of the substrate stage 14.
  • the + Y side end portion and the ⁇ Y side end portion of the shaft portion 14 s protrude from the + Y side end portion and the ⁇ Y side end portion of the substrate stage 14, respectively, and in the ⁇ Y direction (Y axis) Around) so that it can rotate slightly.
  • the drive mechanism 15 connected to the shaft portion 14s slightly moves the entire substrate stage 14 in the Z direction (up and down direction) with respect to the housing 13, and slightly moves in the ⁇ X direction (around the X axis) in the YZ plane. Rotate or slightly rotate in the ⁇ Z direction (around the Z axis) in the XY plane.
  • the drive mechanism 15 is sequentially controlled by the control unit CONT so as to reduce the focus error and the gap error due to the inclination of the surface of the substrate S in the projection area EA and the position error in the Z direction.
  • the alignment cameras 18A and 18B detect alignment marks ALM formed on both ends of the substrate S in the Y direction (width direction).
  • the alignment marks ALM are arranged at equal pitches in the X direction along the + Y side edge and the ⁇ Y side edge of the substrate S.
  • the alignment cameras 18A and 18B are directed to a portion of the substrate S supported by the substrate stage 14, and are ⁇ with respect to the position of the slit-shaped projection area EA (see FIG. 3) set on the substrate S.
  • Alignment marks ALM are individually detected in an arrangement separated by a predetermined distance in the X direction (front side). The detection result by the alignment camera 18 is transmitted to the control unit CONT.
  • the exposure apparatus EX has an illumination part IL and a mask stage MST.
  • the illumination unit IL irradiates the substrate S with slit-shaped illumination light in the ⁇ Z direction.
  • Mask stage MST holds mask M on which a predetermined pattern P is formed.
  • the mask stage MST is provided with a mask holder MH that can hold masks M having different dimensions.
  • the mask stage MST is provided so as to be movable in the X direction by a driving device (stage driving unit) (not shown), and moves at a speed synchronized with the feeding speed of the substrate S in the X direction.
  • the movement of the mask stage MST can be controlled by the control unit CONT.
  • the exposure apparatus EX projects an image of exposure light (aerial image in the case of the projection exposure method, and a shadow image in the case of the proximity exposure method) irradiated from the illumination unit IL through the mask M onto the projection area EA (see FIG. 3).
  • the shape of the projection area EA is a slit shape that is elongated in parallel with the shaft portion 14 s (rotation center line) of the substrate stage 14.
  • the substrate processing apparatus 100 manufactures the display element according to the control of recipes (processing conditions, timing, drive parameters, etc.) set in the control unit CONT.
  • recipes processing conditions, timing, drive parameters, etc.
  • the substrate S wound around a roller (not shown) is attached to the substrate supply unit 2.
  • the controller CONT rotates a roller (not shown) so that the substrate S is sent out from the substrate supply unit 2 from this state.
  • the substrate S that has passed through the substrate processing unit 3 is taken up by a roller (not shown) provided in the substrate recovery unit 4.
  • the control unit CONT appropriately transfers the substrate S in the substrate processing unit 3 by the transfer device 20 of the substrate processing unit 3 after the substrate S is sent out from the substrate supply unit 2 and taken up by the substrate recovery unit 4. Transport.
  • the control unit CONT When performing exposure processing on the substrate S transported in the substrate processing unit 3 using the exposure apparatus EX, the control unit CONT first sets the substrate S to the first roller 11, the substrate stage 14, and the second roller 12. The state is guided with a predetermined tension. Thereafter, as shown in FIG. 4, the controller CONT transports the substrate S in the + X direction by the first roller 11, the substrate stage 14, and the second roller 12.
  • control unit CONT irradiates exposure light from the illumination unit IL and moves the mask stage MST in the + X direction.
  • control unit CONT synchronizes the moving speed of the mask stage MST and the transport speed of the substrate S.
  • the exposure light through the mask M is projected onto the projection area EA on the processing surface Sa of the substrate S moving in the + X direction, and the processing surface Sa of the substrate S is processed.
  • An image of the pattern P of the mask M is formed as an exposure pattern EP by a scanning exposure method.
  • a pattern formed in advance on the substrate S and a pattern P of the mask M that is overlaid and exposed by using the widening function by the second roller 12 are used. It is possible to reduce the size error relative to the image, so-called magnification error. Hereinafter, such a magnification adjustment operation will be described.
  • the contact type rollers 11, 12 to the substrate S are orthogonal to the extending direction of the rotation axis of each roller.
  • a conveying force tension
  • a portion of the substrate S that contacts the second roller 12 tends to travel in a direction orthogonal to the extending direction of the rotation axis of the second roller 12.
  • the substrate S is in contact with the second roller 12 while the substrate S is in the longitudinal direction (X direction).
  • stress directed outward in the short direction (Y direction) also acts. Due to this stress, the inter-roller portion Sr of the substrate S is not contacted by the air bearing method or the like on the outer peripheral surface 14a of the substrate stage 14 in a state of gradually spreading in the Y direction from the first roller 11 to the second roller 12. Supported in a state (low friction state).
  • FIG. 6A is a view schematically showing the state of the exposure pattern Ep formed on the substrate S in an exaggerated manner.
  • FIG. 6A an exposure pattern Ep in a state where the + X side of the substrate S spreads in the Y direction is shown.
  • the + X side of the exposure pattern Ep is spread in the Y direction so as to correspond to the spread of the substrate S.
  • the substrate S is elastically deformed as shown in FIG. 6B. It returns to the shape before the stress (tension) in the direction is applied. That is, the + X side of the substrate S contracts in the Y direction. Therefore, as shown in FIG. 6A, after the exposure pattern is formed on the substrate S in the state where the + X side is enlarged, when the conveyance force (tension) by the second roller 12 is eliminated, the substrate S is approximately at the same ratio. The exposure pattern also shrinks in the Y direction.
  • the projection area EA has a slit shape extending in the Y direction, and is set at the highest position on the outer peripheral surface 14a of the drum-shaped substrate stage 14 in parallel with the rotary shaft 14s.
  • the relative magnification correction in the Y direction is effective only within the projection area EA.
  • the substrate S gradually widens in the Y direction between the two rollers 11 and 12, the size in the Y direction of the pattern formed in advance on the substrate S at the projection area EA, and the mask M It is possible to perform exposure by matching the size of the image of the pattern P in the Y direction.
  • control unit CONT adjusts the shrinkage amount in the Y direction of the substrate S by the second roller 12 described above, and thereby adjusts the dimension in the Y direction of the exposure pattern and the surface Sa (or the surface to be processed Sa (or the substrate S).
  • the ratio of the pattern formed in advance on the substrate S to the dimension in the Y direction can be finely adjusted. For this reason, the relative magnification in the Y direction of the pattern image formed on the substrate S can be substantially adjusted.
  • the first method is a method of changing the widening ratio of the substrate S (the widening amount in the Y direction with respect to the unit length in the X direction) by changing the curvature of the rotation axis of the second roller 12.
  • the second method the entire width of the housing 13, the substrate stage 14, the illumination unit IL, and the mask stage MST is displaced in the X direction along the rails 16 in a state where the widening rate of the substrate S is kept substantially constant.
  • This is a method of shifting the position of the projection area EA in the X direction on the inter-roller portion Sr of the substrate S.
  • the amount of expansion of the substrate S in the Y direction is a value corresponding to the transport force (tension) in the Y direction with respect to the substrate S. That is, the enlargement amount is a value corresponding to the curvature of the second roller 12. For this reason, when controlling the amount of enlargement of the substrate S in the Y direction, the relationship between the curvature of the second roller 12 and the amount of enlargement in the Y direction is obtained in advance as data by experiments or simulations, and the control unit CONT. Controls the curvature of the second roller 12 so that a conveying force (tension) corresponding to the amount of enlargement is applied to the substrate S.
  • the control unit CONT obtains the expansion amount (or expansion ratio) of the substrate S as follows. First, the control unit CONT uses the alignment cameras 18A and 18B to align the alignment mark ALM formed on the ⁇ Y side edge of the inter-roller portion Sr and the alignment mark formed on the + Y side edge of the inter-roller portion Sr. ALM is detected. Based on the detection result and the base line length (mechanical distance in the Y direction) of the alignment cameras 18A, 18B, the control unit CONT calculates the distance (Ya) in the Y direction between the alignment marks ALM on both sides. .
  • the actual length of the substrate S from the first roller 11 to the second roller 12 (the length of the inter-roller portion Sr) is known, and the amount of bending of the rotation axis center line of the second roller 12 is measured by the bending detecting unit 12p. Therefore, the control unit CONT obtains the Y-direction widening ratio ⁇ Ys (the amount of elongation in the Y direction per unit distance in the X direction) of the substrate S in the inter-roller portion Sr in advance by calculation.
  • the distance from the detection position of the alignment cameras 18A and 18B to the position of the projection area EA is known in advance as the distance in the feeding direction (X direction) on the substrate S
  • the amount of expansion in the Y direction of the substrate S at that portion Is obtained by ⁇ Ys ⁇ Xp.
  • the distance Yb between the alignment marks ALM positioned in the ⁇ Y direction of the projection area EA is obtained by the following calculation.
  • Yb Ya + ⁇ Ys ⁇ Xp Since the alignment mark ALM is formed at a constant pitch in the X direction on the end of the substrate S, while detecting the mark ALM with the alignment cameras 18A and 18B for each pitch and repeatedly obtaining the interval distance Ya, While gradually changing the curvature rate of the second roller 12 ( ⁇ Ys changes little by little), the curvature rate of the second roller 12 is sequentially controlled by servo control or the like so that the interval distance Yb in the projection area EA is driven to a desired value. adjust. Thus, exposure in the projection area EA is performed with the relative magnification in the Y direction corrected.
  • the control unit CONT adjusts the relative magnification in the X direction by adjusting the moving speed of the mask stage MST and the transport speed of the substrate S
  • the moving speed of the mask stage MST in the + X direction is set to Mv
  • the transport speed of the substrate S the circumferential speed of the outer peripheral surface 14a of the substrate stage 14
  • the relative magnification adjustment rate (for example, ppm or%)
  • the relative magnification The adjustment rate A is -0.1%.
  • the moving speed Mv of the mask stage MST is set slower than the transport speed Sv of the substrate S by 0.1%.
  • control unit CONT makes appropriate adjustments by finely moving the housing 13 and the substrate stage 14 for fine positioning (position adjustment) of the inter-roller portion Sr in the X direction, Y direction, and ⁇ Z direction.
  • position information of the inter-roller portion Sr is obtained based on the position information of the alignment mark ALM.
  • the housing 13, the substrate stage 14, and the illumination unit IL are kept in a state where the widening rate ⁇ Ys of the substrate S is kept substantially constant, that is, while the curvature rate of the rotation center line of the second roller 12 is kept constant.
  • the entire mask stage MST and alignment camera 18 are displaced along the rail 16 in the X direction, and the position of the projection area EA on the inter-roller portion Sr of the substrate S is shifted in the X direction.
  • the alignment camera 18A, 18B measures the distance Y of the alignment mark ALM in the Y direction, and the alignment in the projection area EA is based on the read-ahead distance Xp and the widening ratio ⁇ Ys.
  • the Y-direction interval distance Yb of the mark ALM is calculated. This measurement and calculation are sequentially performed each time the alignment mark ALM is detected.
  • the second method since the widening ratio ⁇ Ys in the Y direction of the substrate S is treated as constant between the first roller 11 and the second roller 12, it is easier than the first method.
  • the relative magnification can be adjusted. Further, compared with the first method, adjustment with higher accuracy and higher resolution is possible.
  • the substrate S formed in a belt shape is transported in the X direction, and the substrate S is guided in the X direction in the substrate processing unit 3 that processes the processing surface Sa of the substrate S.
  • substrate S is provided between the two rollers 12, relative magnification can be adjusted not only on the exposure apparatus EX side but on the conveyance side which conveys the substrate S. As a result, highly accurate exposure processing can be performed.
  • the exposure apparatus EX has been described as an example of the processing apparatus 10.
  • the present invention is not limited to this, and for example, an organic EL element is applied to the processing surface Sa of the substrate S as described above.
  • a precision patterning device for forming TFTs, TFTs, etc. other types of devices such as an ink jet printer, a maskless exposure machine using DMD, a laser beam printer that scans a laser spot and draws a pattern, etc.
  • DMD digital light detector
  • laser beam printer that scans a laser spot and draws a pattern, etc.
  • the portion Sr between the rollers of the substrate S on the transport side for transporting the substrate S and the portion processed by the processing device 10 (projected image or print pattern). Etc.) relative dimensional errors can be adjusted.
  • it is possible to perform highly accurate processing on the substrate S for example, alignment and overlay with an accuracy of several ⁇ m or less, expansion / contraction correction (relative magnification correction) with an accuracy of several tens of ppm or less, and the like.
  • first roller 11 and the second roller 12 are provided as the first guide member and the second guide member, respectively.
  • the present invention is not limited to this.
  • a cylindrical or columnar non-rotating rod-like member may be used as the first guide member and the second guide member.
  • the rod-shaped member may have another shape such as a rectangle, a triangle, or a plate-shaped member.
  • the configuration in which one processing apparatus 10 is provided has been described as an example.
  • the present invention is not limited to this.
  • a configuration in which a plurality of processing devices are provided in the X direction may be employed.
  • two processing apparatuses 10A and 10B having the same configuration as the exposure apparatus EX described in the above embodiment may be arranged in the X direction.
  • a tension cutting mechanism 60 that cuts (insulates) the tension of the substrate S is provided between the processing apparatus 10A and the processing apparatus 10B.
  • a slack portion SL in which the substrate S is slack is formed.
  • a mask pattern exposure area PA by the processing apparatus 10A and a mask pattern exposure area PB by the processing apparatus 10B are provided.
  • the substrates S are alternately arranged in the X direction.
  • the exposure processing can be performed at a certain interval in each of the processing apparatuses 10A and 10B.
  • the types and sizes of patterns exposed by the processing apparatuses 10A and 10B can be varied. For example, pattern exposure for a 36-inch display in the processing apparatus 10A and a 40-inch display in the processing apparatus 10B can be performed.
  • the substrate stage 14 is described as an example of a cylindrical body that can rotate while supporting the substrate S.
  • the present invention is not limited to this.
  • the substrate stage (substrate support part) 114 has a substrate support surface 114a curved in a convex shape, and a gas layer 116 is formed between the substrate support surface 114a and the substrate S.
  • the structure which has the gas layer formation part (pressurization gas supply part) 115 to perform may be sufficient.
  • the substrate stage 114 can support the substrate S via the gas layer 116 formed on the substrate support surface 114a. Even in this case, by using a tension applying mechanism (not shown), the substrate S is placed in the Y direction at a predetermined width increasing ratio ⁇ Ys in the inter-roller portion Sr between the first roller 11 and the second roller 12. And the relative magnification can be adjusted by the first method and the second method.
  • a mask support pad 118 may be provided at both ends of the substrate stage 114 in the Y direction, and the mask M may be moved while being supported on the mask support pad 118.
  • the position (height) in the Z direction of the upper surface of the mask support pad 118 is relative to the surface of the substrate S supported by the convex support surface of the substrate stage 114 via the gas layer. It is set so as to correspond to an exposure gap (for example, several 10 ⁇ m to several 100 ⁇ m).
  • each mask support pad 118 is provided at each of the ⁇ Y side end and the + Y side end of the substrate stage 114.
  • Each mask support pad 118 is held by a pad holding portion 117 so as to be finely movable in the Z direction in order to adjust the proximity gap.
  • the mask support pad 118 has a flat support surface 118a on the + Z side, and the support surface 118a is disposed to face the pattern surface side of the mask M.
  • the mask support pad 118 is configured to form a gas layer between the mask M and the support surface 118a and support the mask M in a non-contact manner through the gas layer. For this reason, there is no frictional force between the mask M and the mask support pad 118, and the mask M can be moved smoothly.
  • the substrate S is configured to be folded back via the air turn bars 131 and 132 so as to be wound as much as possible around the first roller 11 and the second roller 12.
  • the first roller 11 and the second roller 12 are in contact with the back surface of the substrate S on which the photosensitive layer is not formed, but the substrate S is folded before the first roller 11 and after the second roller 12.
  • a folding roller or the like comes into contact with the surface side of the substrate S (the surface on which the photosensitive layer is formed).
  • the photosensitive layer or the like may be damaged by contact with the roller, or a part of the layer structure may be peeled off.
  • the air turn bars 131 and 132 forming the layers the substrate S is folded back in a non-contact manner.
  • the shape of the projection area (illumination area) EA is a single rectangular slit shape corresponding to the width of the substrate S in the Y direction has been described as an example.
  • 11A and 11B are assumed to be applied to a proximity exposure apparatus as shown in FIG. 10, and a plurality of projection areas (illumination areas) EA1 to EA5 may be arranged in a staggered arrangement.
  • the illumination areas EA1 to EA5 on the mask M are each formed in a trapezoidal shape.
  • the illumination areas EA1 to EA5 are arranged side by side so that the oblique sides of the trapezoid overlap when viewed in the X direction.
  • the three illumination areas EA1, EA3, and EA5 are arranged side by side on a straight line parallel to the Y direction, and the two illumination areas EA2 and EA4 are straight lines parallel to the Y direction. They are arranged side by side.
  • a straight line in the Y direction passing through the centers of the illumination areas EA1, EA3, EA5 located on the downstream side in the feeding direction of the substrate S and a center of each of the illumination areas EA2, EA4 located on the upstream side in the feeding direction of the substrate S are passed.
  • the distance in the X direction from the straight line in the Y direction is set to Gx.
  • the exposure apparatus EX includes projection optical systems PL1 to PL5 that project illumination light with a uniform illuminance distribution onto the illumination areas EA1 to EA5 on the mask M, and the projection optical system PL1.
  • illumination systems IL1 to IL5 including a semiconductor light source for supplying illumination light to PL5.
  • a blind BL is formed between the projection optical systems PL1 to PL5 and the mask M.
  • trapezoidal openings OP1 to OP5 that allow illumination light to pass therethrough are formed as shown in FIG. 11A.
  • the illumination systems IL1 to IL5 the projection optical systems PL1 to PL5, the openings OP1 to OP5 of the blind BL, and the illumination areas EA1 to EA5 are arranged in a straight line in the Z direction. .
  • the proximity exposure is performed while maintaining the lower surface (pattern surface) of the mask M and the substrate S at a predetermined gap, and therefore, in each of the illumination areas EA2 and EA4 located on the upstream side. It is desirable that the gaps are substantially uniform in the illumination areas EA1, EA3, and EA5 located on the downstream side.
  • the gap Gx shown in FIG. 11A and the width of each illumination area EA1 to EA5 in the X direction are set as small as possible, and the illumination areas EA1 to EA5 are set among the convex cylindrical surfaces on the upper surface of the substrate stage 114. It is desirable to set the radius of curvature of the portion as large as possible.
  • the widening ratio ⁇ Ys obtained by the widening action by the second roller 12 is set so as not to increase so much but to take into account the gap Gx.
  • the relative magnification error when the relative magnification error is set to be ⁇ 0 at the midpoint position in the X direction of the interval Gx, the relative magnification error (maximum dimension error) at the positions of the upstream illumination areas EA2 and EA4 is ⁇
  • the relative magnification error (maximum dimension error) at the position of 4 ⁇ m and the downstream illumination areas EA1, EA3, EA5 can be distributed to +4 ⁇ m.
  • the widening ratio ⁇ Ys may be set generally according to the following relationship. ⁇ Ys ⁇ 2 (Lm / 5) / Gx
  • the interval Gx shown in FIG. 11A is made as narrow as possible.
  • the interval Gx is determined by the physical dimensions of the projection optical systems PL1 to PL5. You will be ruled.
  • a microprism array MPA as shown in FIG. 12A is arranged in the optical path of the illumination light.
  • the illumination light incident on the microprism array MPA is deflected and emitted at an angle corresponding to the apex angle of the prism.
  • the microprism array MPA having such a configuration is disposed in each of the openings OP1 to OP5 of the blind BL, so that the optical axes of the upstream projection optical systems PL2P and L4 and the downstream side are arranged.
  • the optical axes of the projection optical systems PL1, PL3, and PL5 can be tilted in opposite directions, and the rule of the interval Gx due to the physical dimensions of the projection optical systems PL1 to PL5 is relaxed, and the interval Gx is reduced. Can do.
  • the deflection angle of the illumination light changed by the microprism array MPA is obtained in advance, and the illumination systems IL1 to IL5 and the projection optical systems PL1 to PL1 are set so that the traveling direction of the illumination light after deflection is parallel to the Z direction. Place PL5 at an angle.
  • the alignment camera 18 is used to detect the projection area (illumination area) EA on the ⁇ X side (of the substrate S).
  • the configuration for detecting the alignment mark ALM on the upstream side in the transport direction has been described as an example, but is not limited thereto.
  • the alignment cameras 18C and 18D may be arranged so as to detect the alignment mark ALM arranged at the same X coordinate as the projection area (illumination area) EA.
  • the alignment marks ALM arranged at the same X coordinate as the projection area (illumination area) EA.
  • the enlargement in the Y direction of the substrate S in the projection area EA since the dimension in the Y direction of the substrate S in the projection area EA (a processing area in a processing apparatus different from the exposure apparatus) can be detected, the enlargement in the Y direction of the substrate S in the projection area EA. The amount or magnification can be detected directly.
  • the substrate S is arranged through the light transmission part at the periphery of the mask M if the proximity exposure apparatus is used.
  • the alignment mark ALM may be detected.
  • the configuration may be such that alignment marks ALM arranged on a plurality of locations in the X direction on the substrate S are detected.
  • four alignment cameras 18A to 18D (mark position detection systems) are provided in the housing 13.
  • the alignment cameras 18A and 18B detect the alignment mark ALM at a position (prefetch position) on the ⁇ X side (upstream side in the transport direction of the substrate S) of the projection area (illumination area) EA, and the alignment cameras 18C and 18D
  • the alignment mark ALM is detected at the same X coordinate as the area (illumination area) EA.
  • an error in the detection result of the mark position by the alignment cameras 18A and 18B is detected based on the detection result of the mark position by the alignment cameras 18C and 18D, and the detection result of the alignment cameras 18A and 18B is detected based on the error. Correction can be performed. Thereby, the position information of the substrate S transported on the substrate stage 14 can be detected more accurately.
  • the four alignment cameras 18A to 18D simultaneously detect the corresponding alignment marks ALM (simultaneously sample the mark image in response to the trigger signal or the like), whereby the substrate on the upstream side of the projection area (illumination area) EA.
  • the S widening state (deformed state) and the displacement in the XY direction can also be measured in real time.
  • a linear motor mechanism LM as shown in FIGS. 15 to 17 may be used as a driving mechanism for driving the mask stage MST of the exposure apparatus EX.
  • the linear motor mechanism LM has a stator LMa and a mover LMb.
  • the stator LMa extends along the X direction. On the stator LMa, a plurality of coils (not shown) are arranged side by side along the X direction. A pair of stators LMa are provided in the Y direction with the mask stage MST interposed therebetween. The pair of stators LMa has a groove on the mask stage MST side. The groove is formed along the X direction.
  • the mover LMb is provided on each of the + Y side surface and the ⁇ Y side surface of the mask stage MST. Each mover LMb has a magnet.
  • the movers LMb are inserted into the grooves of the corresponding stator LMa.
  • the mover LMb is movable in the X direction along the groove. As the mover LMb moves in the X direction, the mask stage MST moves in the X direction.
  • the width of the substrate S on the upstream side of the first roller 11 (the dimension in the Y direction) is w0
  • the width of the substrate S on the downstream side of the second roller 12 is w3
  • the arrangement of the first roller 11 and the second roller 12 is not changed, and the entire exposure apparatus EX (the housing 13, the substrate stage 14, the illumination system IL, the stator LMa of the linear motor mechanism LM, etc.) X It is possible to control so that the position of the projection area (illumination area) is arranged at a desired position in the X direction according to the relative magnification error to be corrected. In this way, by combining the enlargement of the dimension of the substrate S in the Y direction by the second roller 12 and the movement of the entire exposure apparatus EX in the X direction, the desired relative magnification adjustment can be performed with high accuracy at the exposure position. .
  • This method is the same as the second method described above, and a desired amount of the Y direction can be obtained in a state where the amount of curvature of the rotation center line of the second roller 12 is constant, that is, in a state where the widening amount ⁇ Ys is constant. Since the exposure position in the X direction is searched such that the relative magnification adjustment is performed, the resolution of the relative magnification adjustment can be increased.
  • substrate S expanded toward the 2nd roller 12 from the 1st roller 11 was mentioned as an example, it is not restricted to this, Processing is not limited to this. Depending on the type of apparatus and the content of processing, for example, as shown in FIG. 18, the Y-direction dimension of the substrate S may decrease from the first roller 11 toward the second roller 12.
  • the first roller 11A, the second roller 12A, the transport roller R, the first roller 11B, and the second roller 12B are provided in this order from the upstream side to the downstream side in the transport direction of the substrate S.
  • 11 A of 1st rollers are formed in linear form, and are arrange
  • the second roller 12A is configured to be curved toward the downstream side in the transport direction of the substrate S. In the portion Sr1 between the rollers from the first roller 11A to the second roller 12A in the substrate S, the substrate S gradually expands in the orthogonal direction of the transport direction toward the downstream side in the transport direction of the substrate S.
  • the first roller 11B has a configuration curved toward the upstream side in the transport direction of the substrate S.
  • the 2nd roller 12B is formed in linear form, and is arrange
  • the substrate S is given a transport force (tension) in the first roller 11B in a direction orthogonal to the extending direction of the first roller 11B.
  • the substrate S is gradually reduced in the direction orthogonal to the transport direction toward the downstream side in the transport direction of the substrate S. .
  • the portion Sr1 or Sr2 between the rollers of the substrate S and the processing apparatus 10 are processed.
  • the relative dimension (relative magnification in the Y direction) between the regions (images and patterns to be patterned) can be adjusted. Thereby, processing with higher accuracy can be performed on the substrate S.

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JP2016065979A (ja) * 2014-09-25 2016-04-28 東レエンジニアリング株式会社 基材処理方法および基材処理装置
WO2017094770A1 (ja) * 2015-11-30 2017-06-08 株式会社ニコン 露光装置、露光システム、基板処理方法、および、デバイス製造装置

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CN108040500B (zh) * 2015-09-29 2022-04-08 株式会社尼康 制造系统

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JP2003181365A (ja) * 2001-12-13 2003-07-02 Tohoku Ricoh Co Ltd 塗布装置
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JP2016065979A (ja) * 2014-09-25 2016-04-28 東レエンジニアリング株式会社 基材処理方法および基材処理装置
WO2017094770A1 (ja) * 2015-11-30 2017-06-08 株式会社ニコン 露光装置、露光システム、基板処理方法、および、デバイス製造装置
JPWO2017094770A1 (ja) * 2015-11-30 2018-09-20 株式会社ニコン 露光装置、露光システム、基板処理方法、および、デバイス製造装置

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