WO2013064064A1 - Tm模介质滤波器 - Google Patents

Tm模介质滤波器 Download PDF

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Publication number
WO2013064064A1
WO2013064064A1 PCT/CN2012/083813 CN2012083813W WO2013064064A1 WO 2013064064 A1 WO2013064064 A1 WO 2013064064A1 CN 2012083813 W CN2012083813 W CN 2012083813W WO 2013064064 A1 WO2013064064 A1 WO 2013064064A1
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Prior art keywords
dielectric
dielectric filter
dielectric resonator
resonator
mode
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PCT/CN2012/083813
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English (en)
French (fr)
Inventor
李�浩
沈振
袁进华
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华为技术有限公司
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Priority claimed from CN2011204238843U external-priority patent/CN202333087U/zh
Priority claimed from CN2011103379092A external-priority patent/CN102368574A/zh
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2013064064A1 publication Critical patent/WO2013064064A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • H01P7/10Dielectric resonators

Definitions

  • TM Transverse Magnetic
  • the resonator has the advantages of small volume, low loss, low cost, high temperature stability, and good harmonic suppression.
  • the TM mode dielectric filter typically secures the dielectric resonator directly to the cavity, which maximizes the Q value (quality factor) of the dielectric resonator.
  • the Q value is the main parameter for measuring an inductive device. Refers to the ratio of the inductive reactance exhibited by the inductor to its equivalent loss resistance when operating at an AC voltage of a certain frequency. The higher the Q value of an inductive device, the smaller the loss and the higher the efficiency.
  • the prior art provides a solution for fixing the dielectric resonator in the filter by the pressure between the filter cavity and the filter cover, due to the medium
  • the upper and lower ends of the resonator are compacted, and the thermal expansion coefficients of the dielectric material and the filter cavity material are greatly different.
  • the dielectric material and the filter cavity material shape variables are inconsistent.
  • the temperature changes are relatively severe, the high and low temperature cycles are performed.
  • the dielectric resonator is prone to chipping or cracking, which in turn affects the overall performance of the dielectric filter.
  • the present invention provides a TM mode dielectric filter capable of preventing cracking of a dielectric resonator and also reducing adverse effects of a dielectric resonator crack on a TM mode dielectric filter, thereby extending the life of the TM mode dielectric filter.
  • An aspect of the present invention provides a TM mode dielectric filter including a dielectric filter case having an opening, a cover plate, and at least one dielectric resonator, the cover plate being disposed on an open side of the dielectric filter case,
  • the dielectric resonator is disposed between the dielectric filter housing and the cover plate, and an outer surface of the dielectric resonator is provided with a first protection structure, and the first protection structure is opposite to the dielectric resonator fit.
  • a base station comprising the TM mode dielectric filter described above, wherein the dielectric filter is configured to perform filtering processing on an input or output signal.
  • the TM mode dielectric filter provided by the present invention can prevent the crack of the dielectric resonator by providing the first protective structure on the outer surface of the dielectric resonator, and can also reduce the damage caused by the crack of the dielectric resonator to the TM mode dielectric filter. The effect can extend the life of the TM mode dielectric filter.
  • FIG. 1 is a schematic cross-sectional view of a TM mode dielectric filter according to an embodiment of the present invention
  • FIG. 2 is a perspective view of a dielectric resonator according to an embodiment of the present invention
  • FIG. 3 is a second perspective view of a dielectric resonator in an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a TM mode dielectric filter according to an embodiment of the present invention
  • FIG. 5 is a third schematic cross-sectional view of a TM mode dielectric filter according to an embodiment of the present invention.
  • the dielectric filter housing 2, the cover plate 21, the circular boss 3, the dielectric resonator 30, the hollow region 4, the first protective structure 5, the second protective structure 6, the buffer structure 7, and the elastic backing ring are embodied the way
  • the embodiment of the invention provides a TM mode dielectric filter, which can effectively prevent the crack of the dielectric resonator, and can also reduce the adverse effect of the dielectric resonator crack on the TM mode dielectric filter, thereby extending the TM mode dielectric filter. Life expectancy.
  • the present embodiment provides a TM mode dielectric filter, as shown in FIGS. 1 and 2, including a dielectric filter housing 1, a cover 2, and at least one dielectric resonator 3.
  • the dielectric filter housing 1 has an opening.
  • the cover 2 is disposed on the open side of the dielectric filter housing 1, and the dielectric resonator 3 is disposed between the dielectric filter housing 1 and the cover 2.
  • the TM mode dielectric filter of the following embodiments of the present invention The device is described in a state in which it is placed horizontally and the opening is upward, and the state in which the TM mode dielectric filter is placed does not represent the protection range of the present invention.
  • FIG. 1 As an embodiment of the present invention, as shown in FIG.
  • the dielectric resonator 3 is in the shape of a hollow cylinder, and the dielectric resonator 3 is disposed between the dielectric filter housing 1 and the cover 2, and the dielectric resonator 3
  • the upper end surface and the lower end surface are in contact with the cover plate 2 and the dielectric filter housing 1, respectively, that is, the fixing of the dielectric resonator 3 is the upward pressure and the direction of the dielectric resonator 3 through the dielectric filter case 1 and the cover plate 2.
  • the lower pressure is achieved, and the dielectric resonator 3 does not need to be soldered to the dielectric filter housing 1, which reduces the process difficulty and saves cost.
  • the first protective structure 4 is provided on the outer surface of the dielectric resonator 3, and the first protective structure 4 is bonded to the dielectric resonator 3.
  • the first protective structure 4 can not only protect the dielectric resonator 3 from the outside.
  • the first protective structure 4 can also prevent the chipping of the dielectric resonator 3, thereby making the TM The return loss of the mode dielectric filter and the deterioration of the insertion loss are reduced.
  • the present embodiment provides a second protective structure 5 on the inner surface of the hollow region 30 of the dielectric resonator 3.
  • the material of the first protective structure 4 in this embodiment may be an organic material or the like.
  • the first protective structure 4 is an organic film having elasticity, and the elastic organic film is wrapped around the periphery of the dielectric resonator 3.
  • the elastic organic film may be a rubber film.
  • the first protective structure 4 is a high-density organic coating layer, and the high-density organic coating layer is elastically wrapped around the periphery of the dielectric resonator 3.
  • the dielectric resonator in the TM mode dielectric filter of the present embodiment, by providing a first protection structure on the outer surface of the dielectric resonator, and providing a second protection structure on the inner surface of the hollow region of the dielectric resonator, the dielectric resonator can be effectively prevented from being broken. It can reduce the adverse effects of the dielectric resonator rupture on the TM mode dielectric filter and prolong the life of the TM mode dielectric filter.
  • the fixing of the dielectric resonator in the embodiment is achieved by the upward pressure and the downward pressure of the dielectric resonator through the dielectric filter housing and the cover plate, and the dielectric resonator is not required to be soldered to the dielectric filter housing. In the above, the process is reduced and the cost is saved.
  • the present embodiment provides a TM mode dielectric filter, as shown in FIG. 4, including a dielectric filter case 1 having an opening, a cover 2 and at least one dielectric resonator 3, and the cover 2 is disposed on the dielectric filter case On the open side of the body 1, the dielectric resonator 3 is disposed between the dielectric filter housing 1 and the cover 2, the outer surface of the dielectric resonator 3 is provided with a first protective structure 4, and the first protective structure 4 and the dielectric resonator 3 Fit together.
  • the upper end surface of the dielectric resonator 3 is in contact with the cover 2, and the buffer structure 6 is disposed between the lower end surface of the dielectric resonator 3 and the dielectric filter housing 1, wherein the buffer structure The role of 6 is to prevent the dielectric resonator 3 from being broken due to excessive deformation when heated or cooled.
  • the shape of the buffer structure 6 may be a circle, and the diameter of the buffer structure 6 is equal to or larger than the diameter of the dielectric resonator 3.
  • the buffer structure 6 may be a soft metal gasket. Further, the soft metal gasket may be silver. Gasket.
  • the fixing of the dielectric resonator 3 is achieved by the upward pressure and the downward pressure of the dielectric resonator 3 through the buffer structure 6 and the cover plate 2, and it is not necessary to solder the dielectric resonator 3 to the dielectric filter. On the housing 1, the process is reduced and the cost is saved.
  • the present embodiment provides a TM mode dielectric filter, as shown in FIG. 5, including a dielectric filter case 1 having an opening, a cover 2 and at least one dielectric resonator 3, and the cover 2 is disposed on the dielectric filter case On the open side of the body 1, the dielectric resonator 3 is disposed between the dielectric filter housing 1 and the cover 2, the outer surface of the dielectric resonator 3 is provided with a first protective structure 4, and the first protective structure 4 and the dielectric resonator 3 Fit together.
  • the bottom surface of the cover plate 2 is provided with a circular boss 21, and the diameter of the circular boss 21 can be the same as the diameter of the dielectric resonator 3, and the position of the circular boss 21 and the dielectric resonator 3 -
  • an elastic backing ring 7 is disposed between the circular boss 21 and the dielectric resonator 3.
  • the function of the circular boss 21 is to better align and position the elastic backing ring 7 and the dielectric resonator 3 when the elastic backing ring 7 is installed; the elastic backing ring 7 can prevent the dielectric resonator 3 from being heated or cooled. The rupture occurs due to excessive deformation.
  • the fixing of the dielectric resonator 3 of the present embodiment is also achieved by the upward pressure and the downward pressure of the dielectric resonator 3 through the dielectric filter case 1 and the elastic backing ring 7, and the dielectric resonator 3 is not required. Welding on the dielectric filter housing 1 reduces the process difficulty and saves costs.
  • the present embodiment provides a base station comprising the TM mode dielectric filter described in any one of Embodiments 1 to 3, wherein the dielectric filter is configured to filter an input or output signal.
  • the present embodiment provides a communication system including the base station provided in the above fourth embodiment.

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Abstract

一种TM模介质滤波器,涉及无线通信领域,能够有效防止介质谐振器的破裂,还能够降低介质谐振器的破裂给TM模介质滤波器带来的不良影响。TM模介质滤波器,包括:具有一个开口的介质滤波器壳体(1)、盖板(2)和至少一个介质谐振器(3),所述盖板(2)设置于所述介质滤波器壳体(1)壳体的开口侧,所述介质谐振器(3)设置在所述介质滤波器壳体(1)与所述盖板(2)之间,所述介质谐振器(3)的形状为空心圆柱体,所述介质谐振器(3)的外表面设置有第一保护结构(4),所述第一保护结构(4)与所述介质谐振器(3)紧密相贴合。

Description

TM模介质滤波器
本申请要求了 2011年 10月 31 日提交的, 申请号为 201110337909.2, 发 明名称为" TM模介质滤波器"的中国专利申请以及 2011年 10月 31日提交的, 申请号为 201120423884.3 , 发明名称为" TM模介质滤波器 "的中国专利申请 的优先权, 其全部内容通过引用结合在本申请中。 技术领域 本发明涉及无线通信领域, 尤其涉及一种 TM模介质滤波器。
背景技术
随着无线通信系统对信号的高灵敏度发射 /接收的要求越来越高, TM(Transverse Magnetic ,横磁波)模介质谐振器在无线通信方面也变的 越来越重要, 它与常规的空腔谐振器相比具有体积小、 低损耗、 低成 本、 高温度稳定性、 良好的谐波抑制的优点。
TM模介质滤波器通常将介质谐振器直接固定到腔体上,这样能最 大限度地利用介质谐振器的 Q值 (品质因数) 。 Q值是衡量电感器件 的主要参数。 是指电感器在某一频率的交流电压下工作时, 所呈现的 感抗与其等效损耗电阻之比。 电感器件的 Q值越高, 其损耗越小, 效 率越高。
为使介质谐振器固定在金属空腔里, 现有技术提供了一种方案, 通 过滤波器腔体与滤波器盖板之间的压力的作用, 将介质谐振器固定在滤 波器中, 由于介质谐振器的上下两端被压紧, 介质材料与滤波器腔体材 料的热膨胀系数相差较大, 介质材料和滤波器腔体材料形变量不一致, 当温度变化比较剧烈时, 经过高低温的循环, 介质谐振器容易碎裂或出 现裂紋, 进而影响到介质滤波器的整体性能。 发明内容 本发明提供一种 TM模介质滤波器, 能够防止介质谐振器的破裂, 还能够降低介质谐振器的破裂给 TM模介质滤波器带来的不良影响, 从而可以延长 TM模介质滤波器的寿命。
本发明一方面提供一种 TM模介质滤波器, 包括具有一个开口的 介质滤波器壳体、 盖板和至少一个介质谐振器, 所述盖板设置于所述介 质滤波器壳体的开口侧,所述介质谐振器设置在所述介质滤波器壳体与 所述盖板之间, 所述介质谐振器的外表面设置有第一保护结构, 所述第 一保护结构与所述介质谐振器相贴合。
本发明另一方面提供一种基站, 所述基站包括上述 TM模介质滤 波器, 所述介质滤波器用于对输入或输出的信号进行滤波处理。 本发明提供的 TM模介质滤波器 ,通过在介质谐振器的外表面设置 第一保护结构, 能够防止介质谐振器的破裂, 还能够降低介质谐振器 的破裂给 TM模介质滤波器带来的不良影响,可以延长 TM模介质滤波 器的寿命。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案, 下面将对 实施例描述中所需要使用的附图作简单地介绍, 显而易见地, 下面描述中的 附图仅仅是本发明的一些实施例, 对于本领域普通技术人员来讲, 在不付出 创造性劳动的前提下, 还可以根据这些附图获得其他的附图。
图 1为本发明实施例中 TM模介质滤波器的剖面示意图之一; 图 2为本发明实施例中介质谐振器的立体示意图之一;
图 3为本发明实施例中介质谐振器的立体示意图之二;
图 4为本发明实施例中 TM模介质滤波器的剖面示意图之二; 图 5为本发明实施例中 TM模介质滤波器的剖面示意图之三。 附图标记说明: 1、 介质滤波器壳体 2、 盖板 21、 圓形凸台 3、 介质 谐振器 30、 空心区域 4、 第一保护结构 5、 第二保护结构 6、 緩冲结构 7、 弹性垫环 具体实施方式
本发明实施例提供一种 TM模介质滤波器, 能够有效防止介质谐 振器的破裂,还能够降低介质谐振器的破裂给 T M模介质滤波器带来的 不良影响, 从而延长了 TM模介质滤波器的寿命。
下面结合附图对本发明实施例做详细描述。
实施例一
本实施例提供一种 TM模介质滤波器, 如图 1和图 2所示, 包括 介质滤波器壳体 1、 盖板 2和至少一个介质谐振器 3 , 介质滤波器壳体 1具有一个开口, 盖板 2设置于介质滤波器壳体 1的开口侧, 介质谐振 器 3设置在介质滤波器壳体 1与盖板 2之间, 需要说明的是, 本发明以 下各实施例的 TM 模介质滤波器是以水平放置且开口朝上的状态来进 行描述的, TM模介质滤波器的放置状态不代表本发明的保护范围。 作 为本发明的一种实施方式, 如图 1所示, 介质谐振器 3的形状为空心圓 柱体, 介质谐振器 3设置在介质滤波器壳体 1与盖板 2之间, 且介质谐 振器 3的上端面和下端面分别与盖板 2和介质滤波器壳体 1相接触,即 介质谐振器 3的固定是通过介质滤波器壳体 1和盖板 2给介质谐振器 3 向上的压力与向下的压力来实现的,不需要将介质谐振器 3焊接在介质 滤波器壳体 1上, 降低了工艺难度, 节约了成本。
为防止介质谐振器 3发生破裂或者裂紋, 本实施例在介质谐振器 3的外表面设置第一保护结构 4 , 且第一保护结构 4与介质谐振器 3相 贴合。 第一保护结构 4不仅能够保护介质谐振器 3免受外界的侵害, 当 介质谐振器 3因意外情况发生破裂时,第一保护结构 4还可以防止介质 谐振器 3的碎片的剥落,从而使 TM模介质滤波器的回损和插损的恶化 降低。 进一步的, 如图 3 所示, 为更好的保护介质谐振器 3 , 本实施例 在介质谐振器 3的空心区域 30的内表面设置第二保护结构 5。
为尽量不影响介质谐振器 3的 Q值, 本实施例中第一保护结构 4 的材料可以选用有机材料等。
作为本发明的一种实施方式, 第一保护结构 4为具有弹性的有机 膜, 所述具有弹性的有机膜包裹在介质谐振器 3的外围。 例如, 具有弹 性的有机膜可以为橡胶膜。
作为本发明的另一种实施方式, 第一保护结构 4为高密度有机涂 层, 高密度有机涂层弹性的包裹在在介质谐振器 3的外围。
本实施例的 TM模介质滤波器, 通过在介质谐振器的外表面设置 第一保护结构, 在介质谐振器的空心区域的内表面设置第二保护结构, 能够有效防止介质谐振器的破裂, 还能够降低介质谐振器的破裂给 TM 模介质滤波器带来的不良影响,延长了 TM模介质滤波器的寿命。此外, 本实施例中介质谐振器的固定是通过介质滤波器壳体和盖板给介质谐 振器向上的压力与向下的压力来实现的,不需要将介质谐振器焊接在介 质滤波器壳体上, 降低了工艺难度, 节约了成本。
实施例二
本实施例提供一种 TM模介质滤波器, 如图 4所示, 包括具有一 个开口的介质滤波器壳体 1、 盖板 2和至少一个介质谐振器 3 , 盖板 2 设置于介质滤波器壳体 1的开口侧,介质谐振器 3设置在介质滤波器壳 体 1与盖板 2之间, 介质谐振器 3的外表面设置第一保护结构 4 , 且第 一保护结构 4与介质谐振器 3相贴合。 与实施例一不同的是, 介质谐振 器 3的上端面与盖板 2相接触,介质谐振器 3的下端面与介质滤波器壳 体 1之间设置有緩冲结构 6 , 其中, 緩冲结构 6的作用是防止介质谐振 器 3受热或降温时因过度形变而发生破裂。
緩冲结构 6的形状可以为圓形, 緩冲结构 6的直径等于或者大于 介质谐振器 3的直径。
緩冲结构 6可以为软金属垫片, 进一步的, 软金属垫片可以为银 垫片。
本实施例中, 介质谐振器 3的固定是通过緩冲结构 6和盖板 2给 介质谐振器 3向上的压力与向下的压力来实现的,不需要将介质谐振器 3焊接在介质滤波器壳体 1上, 降低了工艺难度, 节约了成本。
实施例三
本实施例提供一种 TM模介质滤波器, 如图 5所示, 包括具有一 个开口的介质滤波器壳体 1、 盖板 2和至少一个介质谐振器 3 , 盖板 2 设置于介质滤波器壳体 1的开口侧,介质谐振器 3设置在介质滤波器壳 体 1与盖板 2之间, 介质谐振器 3的外表面设置第一保护结构 4 , 且第 一保护结构 4与介质谐振器 3相贴合。 与实施例二不同的是, 盖板 2的 底面上设置有圓形凸台 21 , 圓形凸台 21的直径与介质谐振器 3的直径 可以一致, 圓形凸台 21的位置与介质谐振器 3——对应, 圓形凸台 21 与介质谐振器 3之间设置有弹性垫环 7。 其中, 圓形凸台 21 的作用是 在安装弹性垫环 7时, 能够让弹性垫环 7和介质谐振器 3更好的对准、 定位;弹性垫环 7可以防止介质谐振器 3受热或降温时因过度形变而发 生破裂。
此外, 本实施例的介质谐振器 3 的固定同样是通过介质滤波器壳 体 1和弹性垫环 7给介质谐振器 3向上的压力与向下的压力来实现的, 不需要将介质谐振器 3焊接在介质滤波器壳体 1上, 降低了工艺难度, 节约了成本。
实施例四
本实施例提供一种基站, 包括实施例一至实施例三任一实施例所 描述的 TM模介质滤波器,所述介质滤波器用于对输入或输出的信号进 行滤波处理。
实施例五
本实施例提供一种通信系统, 其包括上述实施例四中所提供的基 站。
以上所述, 仅为本发明的具体实施方式, 但本发明的保护范围并不 局限于此, 任何熟悉本技术领域的技术人员在本发明揭露的技术范围 内, 可轻易想到变化或替换, 都应涵盖在本发明的保护范围之内。 因此, 本发明的保护范围应以所述权利要求的保护范围为准。

Claims

权利 要求
1、 一种横磁波 (TM )模介质滤波器, 其特征在于, 包括具有一 个开口的介质滤波器壳体、 盖板和至少一个介质谐振器, 所述盖板设置 于所述介质滤波器壳体的开口侧,所述介质谐振器设置在所述介质滤波 器壳体与所述盖板之间, 所述介质谐振器的外表面设置有第一保护结 构, 所述第一保护结构与所述介质谐振器相贴合。
2、 根据权利要求 1所述的 TM模介质滤波器, 其特征在于, 所述 介质谐振器的一端与所述盖板相接触,所述介质谐振器的另一端与所述 介质滤波器壳体之间设置有緩冲结构, 所述緩冲结构的形状为圓形, 所 述緩冲结构的直径等于或者大于所述介质谐振器的直径。
3、 根据权利要求 2所述的 TM模介质滤波器, 其特征在于, 所述 緩冲结构为软金属垫片, 所述软金属垫片为银垫片。
4、 根据权利要求 1至 3任意一项所述的 TM模介质滤波器, 其特 征在于, 所述盖板的底面上设置有圓形凸台, 所述圓形凸台的直径与所 述介质谐振器的直径一致,所述圓形凸台的位置与所述介质谐振器—— 对应, 所述圓形凸台与所述介质谐振器之间设置有弹性垫环。
5、 根据权利要求 1至 3任意一项所述的 TM模介质滤波器, 其特 征在于, 所述第一保护结构为具有弹性的有机膜, 所述具有弹性的有机 膜包裹在所述介质谐振器的外围。
6、 根据权利要求 1至 3任意一项所述的 TM模介质滤波器, 其特 征在于, 所述介质谐振器的形状为空心圓柱体。
7、 根据权利要求 6所述的 TM模介质滤波器, 其特征在于, 所述 介质谐振器的空心区域的内表面设置有第二保护结构。
8、 根据权利要求 1至 3任意一项所述的 TM模介质滤波器, 其特 征在于, 所述第一保护结构为高密度有机涂层。
9、 根据权利要求 1至 3任意一项所述的 TM模介质滤波器, 其特 征在于, 所述介质谐振器的上端面与所述盖板相接触, 所述介质谐振器 的下端面和所述介质滤波器壳体相接触。
10、 一种基站, 其特征在于, 包括权利要求 1至 9任意一项所述的 TM 模介质滤波器, 所述介质滤波器用于对输入或输出的信号进行滤波 处理。
PCT/CN2012/083813 2011-10-31 2012-10-31 Tm模介质滤波器 WO2013064064A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN1330430A (zh) * 2000-06-15 2002-01-09 松下电器产业株式会社 谐振器及高频滤波器
US20100090785A1 (en) * 2008-10-15 2010-04-15 Antonio Panariello Dielectric resonator and filter with low permittivity material
CN101826649A (zh) * 2010-04-27 2010-09-08 江苏江佳电子股份有限公司 一种tm模介质谐振器
CN102368574A (zh) * 2011-10-31 2012-03-07 华为技术有限公司 Tm模介质滤波器
CN202333087U (zh) * 2011-10-31 2012-07-11 华为技术有限公司 Tm模介质滤波器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1330430A (zh) * 2000-06-15 2002-01-09 松下电器产业株式会社 谐振器及高频滤波器
US20100090785A1 (en) * 2008-10-15 2010-04-15 Antonio Panariello Dielectric resonator and filter with low permittivity material
CN101826649A (zh) * 2010-04-27 2010-09-08 江苏江佳电子股份有限公司 一种tm模介质谐振器
CN102368574A (zh) * 2011-10-31 2012-03-07 华为技术有限公司 Tm模介质滤波器
CN202333087U (zh) * 2011-10-31 2012-07-11 华为技术有限公司 Tm模介质滤波器

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