WO2013044096A3 - Vertical switching formations for esd protection - Google Patents
Vertical switching formations for esd protection Download PDFInfo
- Publication number
- WO2013044096A3 WO2013044096A3 PCT/US2012/056663 US2012056663W WO2013044096A3 WO 2013044096 A3 WO2013044096 A3 WO 2013044096A3 US 2012056663 W US2012056663 W US 2012056663W WO 2013044096 A3 WO2013044096 A3 WO 2013044096A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- esd protection
- vertical switching
- formations
- switching formations
- vertical
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000005755 formation reaction Methods 0.000 title 1
- 239000003989 dielectric material Substances 0.000 abstract 1
- 230000009977 dual effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0288—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1013—Thin film varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/041—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage using a short-circuiting device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/044—Physical layout, materials not provided for elsewhere
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/073—High voltage adaptations
- H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Semiconductor Integrated Circuits (AREA)
- Emergency Protection Circuit Devices (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12834081.7A EP2758992A4 (en) | 2011-09-21 | 2012-09-21 | Vertical switching formations for esd protection |
JP2014532024A JP2014535157A (en) | 2011-09-21 | 2012-09-21 | Vertical switching configuration for ESD protection |
KR1020147010416A KR101923760B1 (en) | 2011-09-21 | 2012-09-21 | Vertical switching formations for esd protection |
CN201280056095.8A CN103999217B (en) | 2011-09-21 | 2012-09-21 | For the construction of the Vertical Handover of ESD protections |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161537490P | 2011-09-21 | 2011-09-21 | |
US61/537,490 | 2011-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013044096A2 WO2013044096A2 (en) | 2013-03-28 |
WO2013044096A3 true WO2013044096A3 (en) | 2013-07-04 |
Family
ID=47915104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2012/056663 WO2013044096A2 (en) | 2011-09-21 | 2012-09-21 | Vertical switching formations for esd protection |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2758992A4 (en) |
JP (3) | JP2014535157A (en) |
KR (1) | KR101923760B1 (en) |
CN (1) | CN103999217B (en) |
TW (1) | TWI473542B (en) |
WO (1) | WO2013044096A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9214433B2 (en) * | 2013-05-21 | 2015-12-15 | Xilinx, Inc. | Charge damage protection on an interposer for a stacked die assembly |
US9401353B2 (en) | 2014-08-08 | 2016-07-26 | Qualcomm Incorporated | Interposer integrated with 3D passive devices |
US9583481B2 (en) | 2014-09-30 | 2017-02-28 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device comprising plurality of conductive portions disposed within wells and a nanowire coupled to conductive portion |
TWI558290B (en) * | 2015-08-24 | 2016-11-11 | 欣興電子股份有限公司 | Manufacturing method of circuit board |
KR102452045B1 (en) | 2017-12-28 | 2022-10-07 | (주)아모텍 | Device for protecting overvoltage and method for manufacturing the same |
KR102576106B1 (en) | 2018-06-19 | 2023-09-08 | 주식회사 아모텍 | Device for protecting overvoltag |
KR20200028622A (en) | 2018-09-07 | 2020-03-17 | 주식회사 아모텍 | Device for reducing noise |
KR102586946B1 (en) | 2018-10-23 | 2023-10-10 | 주식회사 아모텍 | Device for protecting overvoltage |
KR20200073643A (en) | 2018-12-14 | 2020-06-24 | 삼성전자주식회사 | Semiconductor package and method of manufacturing semiconductor package |
CN110055126A (en) * | 2019-05-31 | 2019-07-26 | 青岛科技大学 | A kind of MOF-Ti/TiOx core-shell type nano composite particles ER fluid and preparation method thereof |
CN110794273A (en) * | 2019-11-19 | 2020-02-14 | 哈尔滨理工大学 | Potential time domain spectrum testing system with high-voltage driving protection electrode |
IT202000016699A1 (en) * | 2020-07-09 | 2022-01-09 | Ingelva Srl | EQUIPMENT AND METHOD FOR THE PREVENTION AND DAMPING OF VOLTAGE AND CURRENT PEAKS OF EXTERNAL AND INTERNAL ORIGIN FOR MEDIUM, HIGH AND VERY HIGH VOLTAGE POWER LINES |
WO2024132320A1 (en) * | 2022-12-22 | 2024-06-27 | Belenos Clean Power Holding Ag | Bipolar solid state battery cells |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7417194B2 (en) * | 2003-02-13 | 2008-08-26 | Electronic Polymers, Inc. | ESD protection devices and methods of making same using standard manufacturing processes |
WO2008153584A1 (en) * | 2007-06-13 | 2008-12-18 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US20100187006A1 (en) * | 2009-01-27 | 2010-07-29 | Lex Kosowsky | Substrates Having Voltage Switchable Dielectric Materials |
US20100243302A1 (en) * | 2009-03-26 | 2010-09-30 | Lex Kosowsky | Components having voltage switchable dielectric materials |
US20110211319A1 (en) * | 2010-02-26 | 2011-09-01 | Lex Kosowsky | Electric discharge protection for surface mounted and embedded components |
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US2953309A (en) | 1958-05-29 | 1960-09-20 | Harry W Moore | Apparatus for and method of winding stator coils |
US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
AU6531600A (en) * | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US7695644B2 (en) * | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US20120195018A1 (en) * | 2005-11-22 | 2012-08-02 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
JP2001237586A (en) * | 2000-02-25 | 2001-08-31 | Matsushita Electric Ind Co Ltd | Circuit board, module incorporating circuit part, and manufacturing method thereof |
WO2003088356A1 (en) * | 2002-04-08 | 2003-10-23 | Littelfuse, Inc. | Voltage variable material for direct application and devices employing same |
US7218492B2 (en) | 2004-09-17 | 2007-05-15 | Electronic Polymers, Inc. | Devices and systems for electrostatic discharge suppression |
KR100576872B1 (en) * | 2004-09-17 | 2006-05-10 | 삼성전기주식회사 | Nitride semiconductor light emitting diode with esd protection capacity |
US20060152334A1 (en) * | 2005-01-10 | 2006-07-13 | Nathaniel Maercklein | Electrostatic discharge protection for embedded components |
US7593203B2 (en) * | 2005-02-16 | 2009-09-22 | Sanmina-Sci Corporation | Selective deposition of embedded transient protection for printed circuit boards |
CN101578710B (en) * | 2005-11-22 | 2013-05-22 | 肖克科技有限公司 | A light-emitting device using voltage switchable dielectric material |
US7981325B2 (en) | 2006-07-29 | 2011-07-19 | Shocking Technologies, Inc. | Electronic device for voltage switchable dielectric material having high aspect ratio particles |
US20080073114A1 (en) * | 2006-09-24 | 2008-03-27 | Lex Kosowsky | Technique for plating substrate devices using voltage switchable dielectric material and light assistance |
KR20090055017A (en) | 2006-09-24 | 2009-06-01 | 쇼킹 테크놀로지스 인코포레이티드 | Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same |
US20120119168A9 (en) * | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
EP1990834B1 (en) | 2007-05-10 | 2012-08-15 | Texas Instruments France | Local integration of non-linear sheet in integrated circuit packages for ESD/EOS protection |
US8203421B2 (en) * | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
US20100047535A1 (en) * | 2008-08-22 | 2010-02-25 | Lex Kosowsky | Core layer structure having voltage switchable dielectric material |
US20100065785A1 (en) * | 2008-09-17 | 2010-03-18 | Lex Kosowsky | Voltage switchable dielectric material containing boron compound |
US9226391B2 (en) * | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
US9224728B2 (en) * | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
-
2012
- 2012-09-21 TW TW101134632A patent/TWI473542B/en active
- 2012-09-21 CN CN201280056095.8A patent/CN103999217B/en active Active
- 2012-09-21 JP JP2014532024A patent/JP2014535157A/en active Pending
- 2012-09-21 EP EP12834081.7A patent/EP2758992A4/en active Pending
- 2012-09-21 WO PCT/US2012/056663 patent/WO2013044096A2/en active Application Filing
- 2012-09-21 KR KR1020147010416A patent/KR101923760B1/en active IP Right Grant
-
2017
- 2017-03-28 JP JP2017062476A patent/JP2017152711A/en active Pending
-
2020
- 2020-02-10 JP JP2020020870A patent/JP6860718B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7417194B2 (en) * | 2003-02-13 | 2008-08-26 | Electronic Polymers, Inc. | ESD protection devices and methods of making same using standard manufacturing processes |
WO2008153584A1 (en) * | 2007-06-13 | 2008-12-18 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US20100187006A1 (en) * | 2009-01-27 | 2010-07-29 | Lex Kosowsky | Substrates Having Voltage Switchable Dielectric Materials |
US20100243302A1 (en) * | 2009-03-26 | 2010-09-30 | Lex Kosowsky | Components having voltage switchable dielectric materials |
US20110211319A1 (en) * | 2010-02-26 | 2011-09-01 | Lex Kosowsky | Electric discharge protection for surface mounted and embedded components |
Non-Patent Citations (1)
Title |
---|
See also references of EP2758992A4 * |
Also Published As
Publication number | Publication date |
---|---|
TWI473542B (en) | 2015-02-11 |
EP2758992A4 (en) | 2015-08-12 |
WO2013044096A2 (en) | 2013-03-28 |
JP6860718B2 (en) | 2021-04-21 |
KR20140110838A (en) | 2014-09-17 |
JP2020080419A (en) | 2020-05-28 |
EP2758992A2 (en) | 2014-07-30 |
KR101923760B1 (en) | 2018-11-29 |
JP2014535157A (en) | 2014-12-25 |
TW201330710A (en) | 2013-07-16 |
JP2017152711A (en) | 2017-08-31 |
CN103999217B (en) | 2017-06-06 |
CN103999217A (en) | 2014-08-20 |
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