EP2758992A4 - Vertical switching formations for esd protection - Google Patents

Vertical switching formations for esd protection

Info

Publication number
EP2758992A4
EP2758992A4 EP12834081.7A EP12834081A EP2758992A4 EP 2758992 A4 EP2758992 A4 EP 2758992A4 EP 12834081 A EP12834081 A EP 12834081A EP 2758992 A4 EP2758992 A4 EP 2758992A4
Authority
EP
European Patent Office
Prior art keywords
esd protection
vertical switching
formations
switching formations
vertical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP12834081.7A
Other languages
German (de)
French (fr)
Other versions
EP2758992A2 (en
Inventor
Robert Fleming
Michael Glickman
Bhret Graydon
Junjun Wu
Daniel Vasquez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Littelfuse Inc
Original Assignee
Littelfuse Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Publication of EP2758992A2 publication Critical patent/EP2758992A2/en
Publication of EP2758992A4 publication Critical patent/EP2758992A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0288—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1013—Thin film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/041—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage using a short-circuiting device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/044—Physical layout, materials not provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
EP12834081.7A 2011-09-21 2012-09-21 Vertical switching formations for esd protection Pending EP2758992A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161537490P 2011-09-21 2011-09-21
PCT/US2012/056663 WO2013044096A2 (en) 2011-09-21 2012-09-21 Vertical switching formations for esd protection

Publications (2)

Publication Number Publication Date
EP2758992A2 EP2758992A2 (en) 2014-07-30
EP2758992A4 true EP2758992A4 (en) 2015-08-12

Family

ID=47915104

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12834081.7A Pending EP2758992A4 (en) 2011-09-21 2012-09-21 Vertical switching formations for esd protection

Country Status (6)

Country Link
EP (1) EP2758992A4 (en)
JP (3) JP2014535157A (en)
KR (1) KR101923760B1 (en)
CN (1) CN103999217B (en)
TW (1) TWI473542B (en)
WO (1) WO2013044096A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9214433B2 (en) * 2013-05-21 2015-12-15 Xilinx, Inc. Charge damage protection on an interposer for a stacked die assembly
US9401353B2 (en) 2014-08-08 2016-07-26 Qualcomm Incorporated Interposer integrated with 3D passive devices
US9583481B2 (en) 2014-09-30 2017-02-28 Taiwan Semiconductor Manufacturing Company Limited Semiconductor device comprising plurality of conductive portions disposed within wells and a nanowire coupled to conductive portion
TWI558290B (en) * 2015-08-24 2016-11-11 欣興電子股份有限公司 Manufacturing method of circuit board
KR102452045B1 (en) 2017-12-28 2022-10-07 (주)아모텍 Device for protecting overvoltage and method for manufacturing the same
KR102576106B1 (en) 2018-06-19 2023-09-08 주식회사 아모텍 Device for protecting overvoltag
KR102586946B1 (en) 2018-10-23 2023-10-10 주식회사 아모텍 Device for protecting overvoltage
KR20200073643A (en) 2018-12-14 2020-06-24 삼성전자주식회사 Semiconductor package and method of manufacturing semiconductor package
CN110055126A (en) * 2019-05-31 2019-07-26 青岛科技大学 A kind of MOF-Ti/TiOx core-shell type nano composite particles ER fluid and preparation method thereof
CN110794273A (en) * 2019-11-19 2020-02-14 哈尔滨理工大学 Potential time domain spectrum testing system with high-voltage driving protection electrode
IT202000016699A1 (en) * 2020-07-09 2022-01-09 Ingelva Srl EQUIPMENT AND METHOD FOR THE PREVENTION AND DAMPING OF VOLTAGE AND CURRENT PEAKS OF EXTERNAL AND INTERNAL ORIGIN FOR MEDIUM, HIGH AND VERY HIGH VOLTAGE POWER LINES
WO2024132320A1 (en) * 2022-12-22 2024-06-27 Belenos Clean Power Holding Ag Bipolar solid state battery cells

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061925A1 (en) * 2004-09-17 2006-03-23 Shrier Karen P Devices and systems for electrostatic discharge suppression
US20060152334A1 (en) * 2005-01-10 2006-07-13 Nathaniel Maercklein Electrostatic discharge protection for embedded components
EP1990834A2 (en) * 2007-05-10 2008-11-12 Texas Instruments France Local Integration of Non-Linear Sheet in Integrated Circuit Packages for ESD/EOS Protection
US20110211289A1 (en) * 2010-02-26 2011-09-01 Lex Kosowsky Embedded protection against spurious electrical events

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US2953309A (en) 1958-05-29 1960-09-20 Harry W Moore Apparatus for and method of winding stator coils
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
AU6531600A (en) * 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US20120195018A1 (en) * 2005-11-22 2012-08-02 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
JP2001237586A (en) * 2000-02-25 2001-08-31 Matsushita Electric Ind Co Ltd Circuit board, module incorporating circuit part, and manufacturing method thereof
DE10392524B4 (en) * 2002-04-08 2008-08-07 OTC Littelfuse, Inc., Des Plaines Devices with voltage variable material for direct application
US6981319B2 (en) * 2003-02-13 2006-01-03 Shrier Karen P Method of manufacturing devices to protect election components
KR100576872B1 (en) * 2004-09-17 2006-05-10 삼성전기주식회사 Nitride semiconductor light emitting diode with esd protection capacity
WO2006089272A2 (en) * 2005-02-16 2006-08-24 Sanmina-Sci Corporation Selective deposition of embedded transient protection for printed circuit boards
CN101507129B (en) * 2005-11-22 2013-03-27 肖克科技有限公司 Wireless communication device using voltage switchable dielectric material
US7968014B2 (en) 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
EP2067145A2 (en) * 2006-09-24 2009-06-10 Shocking Technologies, Inc. Technique for plating substrate devices using voltage switchable dielectric material and light assistance
WO2008036423A2 (en) 2006-09-24 2008-03-27 Shocking Technologies, Inc. Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
US20100065785A1 (en) * 2008-09-17 2010-03-18 Lex Kosowsky Voltage switchable dielectric material containing boron compound
US9226391B2 (en) * 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
CN102550132A (en) * 2009-03-26 2012-07-04 肖克科技有限公司 Components having voltage switchable dielectric materials
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061925A1 (en) * 2004-09-17 2006-03-23 Shrier Karen P Devices and systems for electrostatic discharge suppression
US20060152334A1 (en) * 2005-01-10 2006-07-13 Nathaniel Maercklein Electrostatic discharge protection for embedded components
EP1990834A2 (en) * 2007-05-10 2008-11-12 Texas Instruments France Local Integration of Non-Linear Sheet in Integrated Circuit Packages for ESD/EOS Protection
US20110211289A1 (en) * 2010-02-26 2011-09-01 Lex Kosowsky Embedded protection against spurious electrical events

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013044096A2 *

Also Published As

Publication number Publication date
JP2020080419A (en) 2020-05-28
JP2017152711A (en) 2017-08-31
TWI473542B (en) 2015-02-11
JP2014535157A (en) 2014-12-25
TW201330710A (en) 2013-07-16
CN103999217A (en) 2014-08-20
CN103999217B (en) 2017-06-06
EP2758992A2 (en) 2014-07-30
KR101923760B1 (en) 2018-11-29
KR20140110838A (en) 2014-09-17
WO2013044096A2 (en) 2013-03-28
WO2013044096A3 (en) 2013-07-04
JP6860718B2 (en) 2021-04-21

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20140417

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RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LITTELFUSE, INC.

RIN1 Information on inventor provided before grant (corrected)

Inventor name: GLICKMAN, MICHAEL

Inventor name: VASQUEZ, DANIEL

Inventor name: GRAYDON, BHRET

Inventor name: FLEMING, ROBERT

Inventor name: WU, JUNJUN

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20150714

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Ipc: H05K 1/02 20060101AFI20150708BHEP

Ipc: H01L 23/60 20060101ALI20150708BHEP

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