WO2013039280A1 - Dispositif de mesure permettant d'établir un diagnostic pour un équipement à semi-conducteurs - Google Patents

Dispositif de mesure permettant d'établir un diagnostic pour un équipement à semi-conducteurs Download PDF

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Publication number
WO2013039280A1
WO2013039280A1 PCT/KR2011/008652 KR2011008652W WO2013039280A1 WO 2013039280 A1 WO2013039280 A1 WO 2013039280A1 KR 2011008652 W KR2011008652 W KR 2011008652W WO 2013039280 A1 WO2013039280 A1 WO 2013039280A1
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WO
WIPO (PCT)
Prior art keywords
particles
vibration
semiconductor equipment
main body
unit
Prior art date
Application number
PCT/KR2011/008652
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English (en)
Korean (ko)
Inventor
유영선
Original Assignee
You Young Sun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110093256A external-priority patent/KR20130029882A/ko
Priority claimed from KR1020110113319A external-priority patent/KR20130048462A/ko
Application filed by You Young Sun filed Critical You Young Sun
Publication of WO2013039280A1 publication Critical patent/WO2013039280A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Definitions

  • the present invention relates to a measuring device for diagnosing semiconductor equipment.
  • the present invention is a diagnostic measurement for semiconductor equipment that is introduced into the semiconductor equipment for processing the wafer to be transported along the work progress line of the wafer and to measure the particles floating in the workspace and vibrations within the workspace. Relates to a device.
  • the present invention enables real-time measurement of particles in a state in which a semiconductor device is driven, so that measurement data can be obtained more quickly and accurately, employing a sensor that uses optical technology to measure finer particles,
  • the present invention relates to a measurement device for diagnosing semiconductor equipment for confirming measurement information to an administrator through wireless communication.
  • the present invention measures the vibration generated in the configuration for moving the wafer in the semiconductor equipment and the configuration for forming a vacuum inside the equipment, to grasp in advance the risk of process failure and equipment failure generated during vibration
  • the present invention relates to a vibration measuring device for diagnosing semiconductor equipment for reducing the cost loss of having separate measuring equipment and minimizing the size of the semiconductor equipment to efficiently arrange a work space.
  • a wafer is a material for fabricating a semiconductor chip, and is manufactured in the form of a disk in which a thin ingot formed by circumferentially growing a material type crystal of a silicon semiconductor. Such wafers are subjected to a surface treatment or a chip cutting process in a post-production process, which is performed by a dedicated semiconductor device.
  • the semiconductor equipment for processing the wafer forms a working space inside the closed space, and maintains the working space as a clean space in order to perform a very precise work.
  • the biggest product defects during the semiconductor manufacturing process can be attributed to the fine particles and particles.
  • the semiconductor device as described above essentially measures the size and quantity of the fine particles or fine dust contained in the air or gas in the closed workspace.
  • a measurement device As a device for measuring particles existing inside the semiconductor device as described above, a measurement device called a "particle counter” has been released and used.
  • a particle counter has an air inlet formed at an upper portion thereof, and a tube is coupled to the air inlet so as to communicate with a chamber inside the semiconductor equipment, and configured to measure particles.
  • Patent Application Invention 1 Korean Patent Laid-Open Publication No. 10-2006-2177 (Name: Particle measuring equipment of a semiconductor manufacturing equipment and its measuring method, hereinafter, Patent Application Invention 1), the patent application is a chamber of semiconductor equipment for processing a wafer It is installed inside and suggests an apparatus and method for measuring particles inside the chamber.
  • Such an invention of the present invention is to measure the particles in the chamber and the degree of particle floating in the chamber more accurately to measure the particles in real time by measuring the particles inside the chamber in the state in which the semiconductor equipment is driven in real time.
  • Such a driving device such as a wafer transport device or a robot may be damaged by scratches, contamination by fine particles, or impacts from the wafer falling off the robot due to vibrations in a direction different from the traveling direction. It is a factor that can cause a defect such as (Broken), and it can cause a bigger failure if proper measures such as preventive maintenance (PM) or troubleshooting for abnormal vibration are not taken.
  • PM preventive maintenance
  • Korean Patent Application No. 10-2005-23344 name: exposure equipment for manufacturing semiconductor devices, vibration sensing and position measuring method, semiconductor device manufacturing method, hereinafter the first application of the invention
  • a method and a system for detecting a defect factor for vibration have been proposed.
  • the present invention has proposed a device for manufacturing a semiconductor device, a vibration sensing and position measuring method, and a method for manufacturing a semiconductor device, which can prevent poor patterning during an exposure process.
  • a technology for detecting vibration during the present invention "In the semiconductor device manufacturing equipment, the first beam is divided and provided to the reference mirror and the first mirror, and then the interference pattern formed by reflecting is detected to detect the vibration of the projection lens. And detecting and dividing the second beam to provide the first mirror and the second mirror, and then measuring a relative position of the wafer stage by measuring an interference pattern formed while being reflected. Is presented.
  • the measurement sensor for measuring the particles is installed in the chamber of a relatively small (narrow, high and low height) point where the wafer is transferred in the automated wafer processing process. Difficult disadvantages are exposed.
  • the above-described invention has a problem that it is impossible to precisely measure the particles floating on the entire path to convey the wafer when the particles are floated due to the measurement sensor is installed on one side of the chamber is biased on any one inside the chamber Is exposed.
  • the first application of the present invention 2 is a technology for exclusively detecting the defects of the patterning failure during the exposure process of the wafer, it is impossible to measure the failure factors for the vibration generated during the transfer of the wafer to each work process.
  • the device for measuring the vibration is that the wafer is transferred to a considerable size and when installed in the chamber where the work is performed, the size of the equipment itself must be enlarged, so that the efficiency of space for performing a plurality of work processes in a designated space is increased. Very low problems are exposed.
  • the present invention has been invented to solve the above problems.
  • the first object of the present invention by moving the transfer path of the wafer for processing inside the semiconductor equipment, it is possible to measure the size and number of particles floating throughout the work space in real time without stopping the operation of the semiconductor equipment more Accurate particle measurement data can be obtained, and in order to measure finer particles in the working space of a semiconductor device, a sensor using an optical component such as a laser diode or a photo diode is implemented, and the particle measurement information can be obtained by wireless communication. To provide a measuring instrument to obtain.
  • the second object of the present invention is to measure vibrations generated in a configuration for moving a wafer and forming a vacuum in the equipment, which are transferred along a work progress line of the wafer in a chamber of a semiconductor equipment for processing a wafer, It is to provide a wireless vibration measuring device that can be prepared in advance by grasping the bad concerns generated during vibration.
  • the present invention has the following configuration.
  • the present invention is configured to measure particles or vibrations on a main body manufactured in a shape and size corresponding to a wafer, and are configured to be transported after being introduced into the semiconductor equipment while the semiconductor equipment is being driven and to measure the particles or vibrations. do.
  • the present invention is installed on the main body and the sensor module for detecting and measuring the particles floating in the workspace after being introduced into the semiconductor equipment with the main body; And a control unit installed on the main body to receive data of particles detected by the sensor module, and convert the received data into particle size and number information.
  • the sensor module may include: a module housing coupled to a main body and having an inner space for allowing particles suspended in a work space to pass through one side to another side; A suction fan installed at one side of the module housing to suck particles into the inner space; A sensing unit installed in a passage through which particles of the module housing pass and passing the particles inside and sensing the size and quantity of the particles; And a filter for collecting particles discharged to the work space by being installed in the inner space of the module housing for discharging particles passing through the sensing unit to the outside.
  • the sensing unit the sensor housing is installed inside the tube for the particles to pass through;
  • a laser diode mounted at a point where the tube of the sensor housing is installed and irradiating a laser to penetrate a tube through which particles pass;
  • a photodiode mounted so as to face the laser diode in the sensor housing and detecting a laser beam radiated from the laser diode and passing through the tube to measure the size and quantity of particles traveling through the tube.
  • control unit the current sensing unit for the information of the size and quantity of particles detected by the sensor module to be sensed as the current value; And a control processor converting information on the size and quantity of particles detected by the current sensing unit into data and outputting the data.
  • control unit a wireless communication unit for wireless transmission and reception of data of the size and quantity of particles output from the control processor; And a user display unit for visually confirming data of the size and quantity of particles transmitted by the wireless communication unit.
  • the present invention has the following configuration to achieve the second object.
  • the present invention includes a vibration sensing unit installed on the main body to detect and detect the vibration generated in the wafer processing process after being introduced into the semiconductor equipment together with the main body; And a control unit installed on the main body to receive the detected vibration signal detected by the vibration detection unit, and convert the received vibration signal into a current value.
  • the main body is formed with a recognition display on the surface so that it can be detected by a sensor inside the semiconductor equipment.
  • the vibration detection unit as an acceleration sensor for measuring the acceleration value in the X, Y, Z vector direction, the RMS value of the average value and the FFT value of the frequency band acceleration during the wafer transfer and processing process in the semiconductor equipment Apply.
  • control unit the current sensing unit for sensing the vibration signal detected by the vibration sensing unit as a current value
  • a control processor for converting information of the current value of the vibration sensed by the current sensing unit into data and outputting the data.
  • control unit a wireless communication unit for wireless transmission and reception of the vibration data output from the control processor; And a user display unit for visually confirming the vibration data transmitted by the wireless communication unit.
  • the present invention has the effect of obtaining accurate particle data in real time without stopping the operation of semiconductor equipment by measuring the size and number of particles floating along the transfer path of the wafer to be processed and floating in the work space. have.
  • the present invention is that the sensor is manufactured by the optical component to be able to measure the finer particles, and the measurement information of the particles can be obtained by wireless communication to manage the particle measurement more efficiently and perform work It has an effect.
  • the present invention is capable of measuring the defects of the vibration process generated during the process of the wafer and the work progress, and more accurate determination and response to the defects is performed to minimize the defect rate of the product It is possible to determine the parts or parts of the equipment that can cause the effects and vibrations, so that appropriate measures can be taken in advance for failure.
  • the present invention does not add a separate vibration measurement configuration for each processing process of the semiconductor equipment, it is possible to effectively reduce the manufacturing cost of the semiconductor equipment, thereby miniaturizing the size of the semiconductor equipment itself in the workplace There is an effect of obtaining the advantage of space utilization according to the efficient arrangement of semiconductor equipment.
  • FIG. 1 is a perspective view of a particle measuring device according to a first embodiment of the present invention.
  • Figure 2 is a perspective view of the sensor module extracting device of a first embodiment of the present invention.
  • Figure 3 is a perspective view of a sensing unit of a particle measuring device of Embodiment 1 of the present invention.
  • FIG. 4 is a view illustrating a sensing unit particle measurement of a particle measuring device according to a first embodiment of the present invention.
  • FIG. 5 is an enlarged view of a main part of a sensing unit of a particle measuring device according to a first embodiment of the present invention
  • FIG. 6 is a block diagram of a control unit of a particle measuring device according to a first embodiment of the present invention.
  • FIG. 7 is a perspective view of a vibration measuring device according to a second embodiment of the present invention.
  • Figure 8 is a perspective view of the sensor module of the vibration measuring device of a second embodiment of the present invention.
  • FIG. 9 is a block diagram of a control unit of a vibration measuring apparatus according to a second embodiment of the present invention.
  • suction fan 23 sensing unit
  • FIG. 1 is a perspective view of a particle measuring apparatus according to a first embodiment of the present invention
  • FIG. 2 is a perspective view of a sensor module of a particle measuring apparatus according to a first embodiment of the present invention.
  • the particle measuring apparatus has a basic configuration consisting of the main body 10, the sensor module 20, the control unit 30.
  • reference numeral 11 denotes a PCB for mounting the sensor module 20 and the control unit 30 on the main body 10.
  • the main body 10 is formed in a disc shape such as a wafer to be introduced into the semiconductor equipment.
  • the main body 10 is introduced into the semiconductor equipment and is transferred to a path through which wafers are processed, and the particle 10 can be measured by the configuration of the sensor module 20 installed on the main body 10. to be.
  • the upper surface of the main body 10, the sensor module 20 and the control unit 30 is connected to the PCB 11 having the electrical, electronic pattern is formed to be electrically connected and interlocked as described above.
  • the size of the flat plate is about 300mm, 200mm, 150mm, 450mm in diameter and the same as the semiconductor wafer, the thickness is about 8mm ⁇ 15mm to pass through each space inside the semiconductor equipment Is produced.
  • the flat plate has a recognition display unit 12 formed in the form of Notch or Flatzone based on the 'SEMI-STD Wafer standard technology' in order to be detected in the same manner as the wafer inside the semiconductor equipment.
  • the sensor module 20 is installed on the PCB 11 of the main body 10.
  • the sensor module 20 is configured to detect and measure particles floating in the working space after being introduced into the semiconductor equipment together with the main body 10.
  • the sensor module 20 includes a module housing 21, a suction fan 22, a sensing unit 23, and a filter 24.
  • the module housing 21 is coupled to the PCB 11 of the main body 10 and is formed in the inner space for the particles suspended in the working space after passing through any one side is introduced into the semiconductor equipment to proceed to the other side.
  • the module housing 21 is configured to form a passage through which particles suspended in the working space pass.
  • the suction fan 22 is installed at one side (inlet) of a passage through which particles of the module housing 21 pass.
  • a suction fan 22 is composed of a micro motor, an impeller, a propeller, and the like to suck and move particles.
  • the suction fan 22 may be replaced by a vacuum ejector or a small vacuum pump for performing the same function.
  • the sensing unit 23 is installed in a passage through which particles inside the module housing 21 pass.
  • the sensing unit 23 is configured to pass the particles inside and detect the size and quantity of the particles.
  • the specific configuration of the sensing unit 23 for this is the same as in Figures 3 to 5 will be described later.
  • the filter 24 is installed in the inner space (outlet of the passage) of the module housing 21 for discharging the particles passing through the sensing unit 23 to the outside.
  • a filter 24 is configured to collect the particles discharged to the work space to perform the filtration function.
  • the particle measuring device according to the present invention is configured to simultaneously perform the function of particle filtration.
  • FIG. 3 is a perspective view of a sensing unit of a particle measuring apparatus according to a first embodiment of the present invention
  • FIG. 4 is a view illustrating a sensing unit particle measurement of a particle measuring apparatus according to a first embodiment of the present invention
  • FIG. 5 is a particle measuring apparatus according to a first embodiment of the present invention. An enlarged view of the main part of the sensing unit.
  • the sensing unit 23 is composed of a sensor housing 25, a laser diode 26, a photodiode 27.
  • the sensor housing 25 has each component installed therein, and a tube 28 is installed to allow particles to enter one side and pass to the other side, and both sides of the sensor housing 25 are centered around the tube 28.
  • the laser diode 26 and the photodiode 27 are disposed in the configuration.
  • the laser diode 26 is mounted on one side of the tube 28 of the sensor housing 25. Such a laser diode 26 is configured to irradiate a laser to penetrate the tube 28 through which particles pass.
  • the focus lens 29 for arranging the diameter of the laser is arranged in front of the laser diode 26, the laser is emitted is configured.
  • the photodiode 27 is mounted so as to face the laser diode 26 about the tube 28 in the sensor housing 25.
  • the photodiode 27 is configured to measure the size and quantity of particles that pass through the tube 28 by sensing the laser beam radiated from the laser diode 26 and passing through the tube 28.
  • a mirror 28a is coupled to the outer surface of the tube 28, which is a photodiode when a laser passing through the tube 28 is diffusely reflected by a particle. It is a structure for proceeding to (27).
  • FIG. 6 is a block diagram of a control unit of a particle measuring apparatus according to a first embodiment of the present invention.
  • control unit 30 is a configuration of a chip or element mounted on the PCB 11 of the main body 10.
  • the control unit 30 is configured to receive the data of the particles detected by the sensor module 20, convert the received data into the size and number information of the particles and outputs.
  • control unit 30 includes a wireless communication unit 33 and a user display unit 34 using the current sensing unit 31 and the control processor 32 as a basic configuration.
  • the current sensing unit 31 is configured in a chip form mounted on the PCB 11 so that information on the size and quantity of particles detected by the sensing unit 23 of the sensor module 20 is detected as a current value. It is a structure for doing so.
  • the control processor 32 also has a chip form mounted on the PCB 11 and is a signal processing device that converts and outputs information on the size and quantity of particles detected by the current sensing unit 31 into data.
  • the wireless communication unit 33 is a PC or laptop which is interlocked with the PCB 11 and the user display unit 34 of the main body 10 to wirelessly transmit and receive data of the size and quantity of particles output from the control processor 32. It consists of a transmission and reception module installed divided into terminals.
  • the user display unit 34 may be applied as a monitor such as a separate LCD, and a display monitor such as a PC or a notebook held by an administrator is applied.
  • the user display unit 34 is configured to visually confirm the data of the size and quantity of particles transmitted by the wireless communication unit 33.
  • Reference numeral 35 in the figure is a battery for supplying power to the circuit configuration of the control unit 30, 36 is a temperature sensor for checking the temperature conditions of the point where the particles are measured.
  • FIG. 7 is a perspective view of a vibration measuring device according to a second embodiment of the present invention
  • FIG. 8 is a perspective view of a sensor module extracted from a vibration measuring device according to a second embodiment of the present invention.
  • the vibration measuring apparatus has a basic configuration consisting of the main body 10, the vibration sensing unit 120, the control unit 130.
  • reference numeral 11 denotes a PCB for mounting the vibration sensing unit 120 and the control unit 130 on the main body 10.
  • the main body 10 is formed in a disc shape such as a wafer to be introduced into the semiconductor equipment.
  • the main body 10 is introduced into the semiconductor equipment and is transferred to a path through which the wafer is processed, so that the vibration can be measured by the configuration of the vibration sensing unit 120 or the like installed on the main body 10. Configuration.
  • the upper surface of the main body 10, the vibration sensing unit 120 and the control unit 130 is electrically connected to the PCB 11 is formed as described above in order to be connected and interlocked as described above.
  • the size of the flat plate is about 300mm, 200mm, 150mm, 450mm in diameter and the same as the semiconductor wafer, the thickness is about 8mm ⁇ 15mm to pass through each space inside the semiconductor equipment Is produced.
  • a recognition display unit 12 is formed to allow the flat plate to be detected in a semiconductor device in the same manner as a wafer, and the recognition display unit 12 is based on 'SEMI-STD Wafer standard technology'. It is formed in the form of Notch or Flatzone.
  • the vibration detecting unit 120 is installed on the PCB 11 of the main body 10. Such a vibration detecting unit 120 is configured to detect and detect a vibration applied when the wafer is transferred into the work space and the work is inserted into the semiconductor equipment together with the main body 10.
  • the vibration detection unit 120 is applied as an acceleration sensor (21, Acceleration sensor).
  • an acceleration sensor 121 is a configuration for measuring the acceleration (shock) of the moving object or the impact.
  • the acceleration sensor 121 is employed as a micro sensor manufactured by MEMS (micro electro mechanical systems) technology, the specification of which can measure the acceleration of ⁇ 2G that can measure the acceleration of the semiconductor robot, Resolution ⁇ 0.01G is suitable.
  • the acceleration sensor 121 as described above may measure the RMS (average) value and the FFT (Fast Furier Transform) value, which are acceleration values in the X, Y, and Z directions when the wafer is transferred and processed. Will be.
  • RMS average
  • FFT Fast Furier Transform
  • FIG. 9 is a block diagram of a control unit of a vibration measuring apparatus according to a second embodiment of the present invention.
  • control unit 130 is a configuration of a chip or element mounted on the PCB 11 of the main body 10.
  • Such a control unit 130 is a configuration for receiving the vibration signal detected by the vibration detection unit 120, converts the received vibration signal into vibration data and outputs.
  • control unit 130 includes a wireless communication unit 133 and a user display unit 134 using the current sensing unit 131 and the control processor 132 as a basic configuration.
  • the current sensing unit 131 is configured in a chip form mounted on the PCB 11, and is configured to allow the vibration signal sensed by the sensing unit 123 of the vibration sensing unit 120 to be sensed as a current value. .
  • the control processor 132 also has a chip form mounted on the PCB 11 and is a signal processing device for converting and outputting a current value for the vibration signal detected by the current sensing unit 131 into data.
  • the wireless communication unit 133 is divided into a terminal such as a PC or a notebook, which is connected to the PCB 11 and the user display unit 134 of the main body 10 to wirelessly transmit and receive the vibration data output from the control processor 132 It consists of installed transmission and reception modules.
  • the user display unit 134 may be applied as a monitor such as a separate LCD, a display monitor such as a PC or a notebook held by the administrator is applied.
  • the user display unit 134 is configured to visually check the vibration data by the wireless communication unit 133.
  • Reference numeral 35 in the figure is a battery for supplying power to the circuit configuration of the control unit 130, 136 is a temperature sensor for checking the temperature conditions of the point where the vibration is measured.
  • each measuring device for measuring particles or vibrations is manufactured in a shape and a standard corresponding to the size of the wafer.
  • Such a measuring device is introduced into a space of a semiconductor device to measure particles or vibrations in a workspace in real time.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne un dispositif de mesure permettant d'établir un diagnostic pour un équipement à semi-conducteurs, capable de mesurer : des particules qui sont introduites à l'intérieur de l'équipement à semi-conducteurs pour le traitement de tranches, se déplacent le long des lignes de traitement des tranches et flottent dans un espace de travail; et des vibrations dans l'espace de travail. A cette fin, l'invention comprend un élément monté sur un corps principal, d'une forme et d'une taille correspondant à la tranche, en vue de la mesure des particules et des vibrations. En outre, l'élément est conçu pour être introduit dans l'équipement à semi-conducteurs, et mesure les particules et les vibrations pendant son transport dans l'état dans lequel fonctionne l'équipement à semi-conducteurs.
PCT/KR2011/008652 2011-09-16 2011-11-14 Dispositif de mesure permettant d'établir un diagnostic pour un équipement à semi-conducteurs WO2013039280A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020110093256A KR20130029882A (ko) 2011-09-16 2011-09-16 반도체 장비용 파티클 측정장치
KR10-2011-0093256 2011-09-16
KR1020110113319A KR20130048462A (ko) 2011-11-02 2011-11-02 반도체 장비 진단용 진동 측정장치
KR10-2011-0113319 2011-11-02

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Publication Number Publication Date
WO2013039280A1 true WO2013039280A1 (fr) 2013-03-21

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102026733B1 (ko) * 2018-05-11 2019-09-30 엘지전자 주식회사 플라즈마 공정 측정 센서 및 그 제조 방법
CN111323076A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 检测装置及工艺腔室检测方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206235A (ja) * 1992-01-24 1993-08-13 Oki Electric Ind Co Ltd パーティクルの測定方法
KR20010058840A (ko) * 1999-12-30 2001-07-06 박종섭 웨이퍼 검사 장치
KR20070021802A (ko) * 2005-08-19 2007-02-23 삼성전자주식회사 웨이퍼 이송용 로봇암
KR20080095248A (ko) * 2006-02-08 2008-10-28 램 리써치 코포레이션 챔버 입자 검출 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206235A (ja) * 1992-01-24 1993-08-13 Oki Electric Ind Co Ltd パーティクルの測定方法
KR20010058840A (ko) * 1999-12-30 2001-07-06 박종섭 웨이퍼 검사 장치
KR20070021802A (ko) * 2005-08-19 2007-02-23 삼성전자주식회사 웨이퍼 이송용 로봇암
KR20080095248A (ko) * 2006-02-08 2008-10-28 램 리써치 코포레이션 챔버 입자 검출 시스템

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102026733B1 (ko) * 2018-05-11 2019-09-30 엘지전자 주식회사 플라즈마 공정 측정 센서 및 그 제조 방법
WO2019216493A1 (fr) * 2018-05-11 2019-11-14 엘지전자 주식회사 Capteur de mesure de processus à plasma et son procédé de fabrication
CN111323076A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 检测装置及工艺腔室检测方法

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