WO2013039227A1 - Positive temperature coefficient (ptc) device - Google Patents

Positive temperature coefficient (ptc) device Download PDF

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Publication number
WO2013039227A1
WO2013039227A1 PCT/JP2012/073709 JP2012073709W WO2013039227A1 WO 2013039227 A1 WO2013039227 A1 WO 2013039227A1 JP 2012073709 W JP2012073709 W JP 2012073709W WO 2013039227 A1 WO2013039227 A1 WO 2013039227A1
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WIPO (PCT)
Prior art keywords
ptc
electrode
layered
cylindrical recess
ptc element
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PCT/JP2012/073709
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French (fr)
Japanese (ja)
Inventor
久 薄井
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タイコエレクトロニクスジャパン合同会社
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Application filed by タイコエレクトロニクスジャパン合同会社 filed Critical タイコエレクトロニクスジャパン合同会社
Priority to JP2013533742A priority Critical patent/JP6124793B2/en
Priority to CN201280055237.9A priority patent/CN103918040B/en
Priority to KR1020147009423A priority patent/KR101892789B1/en
Publication of WO2013039227A1 publication Critical patent/WO2013039227A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406Terminals or electrodes formed on resistive elements having positive temperature coefficient

Definitions

  • the present invention relates to a PTC device, and more particularly to a surface mount type PTC device.
  • a PTC device is used in various electrical devices as a circuit protection element, and constitutes a protection circuit for the electrical device.
  • Such a PTC device is arranged on a protection circuit board having a protection circuit.
  • a surface mount type PTC device is often used in consideration of arrangement convenience.
  • the surface mount type PTC device is placed so that its electrode is located on a tab or pad provided on the protection circuit board, and is electrically connected by soldering, thereby forming a protection circuit formed on the protection circuit board. Placed in the circuit.
  • Such a PTC device is schematically shown in a perspective view in FIG.
  • the illustrated PTC device 10 includes a PTC element 11 constituting the PTC device 10.
  • the PTC element 11 includes a PTC element and layered electrodes respectively disposed on the surfaces on both sides thereof, and an insulating layer positioned outside each layered electrode. In FIG. 1, these components are not shown, but are shown as a PTC element 11.
  • the PTC element 11 has semi-cylindrical recess portions 12 and 14 on the side end surfaces at both ends, and a side metal layer portion (for example, a conductive metal plating layer) 16 and the like on the surface of the semi-cylindrical recess portion.
  • the PTC element 11 has end metal layer portions (for example, conductive metal plating layers) 20, 22 and 24, 26 at both ends of the upper surface and the lower surface thereof.
  • the lateral metal layer portions 16 and 18 are integrally connected to the end metal layer portions 20, 22 and 24, 26 at their upper and lower ends, which constitute so-called castellation electrodes (20 + 16 + 22 and 24 + 18 + 26). ing.
  • the castellation electrode has a metal layer portion on both the upper surface and the lower surface of the PTC element 11, but the castellation electrode is generally connected to both ends of the upper surface and the lower surface of the PTC element. There may be a partial metal layer portion (that is, the end metal layer portion may not be provided at the end of the other surface). Therefore, the castellation electrode has end metal layer portions at both ends of at least one of the upper surface and the lower surface of the PTC device.
  • one castellation electrode is electrically connected to one electrode of a PTC element located in the PTC device, and the other castellation electrode is connected to the other of the PTC elements.
  • the electrodes are electrically connected to the electrodes.
  • cream solder is applied onto a pad provided on the substrate by printing, and castellation located on the lower surface of the PTC device is applied to the pad via the applied cream solder portion.
  • the PTC device is disposed so that the end metal layer portion (for example, 22) of the electrode is positioned, and the substrate on which the PTC device is disposed is placed in a reflow furnace to melt and solidify the solder.
  • a state in which the PTC device is mounted on the substrate by soldering in this manner is schematically shown in FIG. 2 in a sectional view.
  • FIG. 2 shows an end view of the PTC device 10 of FIG. 1 mounted on the substrate 28, cut along a vertical plane including the line XX.
  • a solder connection portion 32 is formed by soldering between the pad 30 on the substrate and the end metal layer portion 22 of the castellation electrode, and these are joined together and electrically connected. Solder melted in the reflow furnace also wets over the semi-cylindrical concave portion, solidifies as it is, and a solder portion 34 is also present as a fillet portion on the side metal layer portion 16 of the castellation electrode, which is a solder connection portion. 32 is integrated.
  • the problem to be solved by the present invention is to reduce as much as possible the possibility of such an electrical connection being defective.
  • the inventor has intensively studied about the suppression of stress concentration, and as a result, places where stress may concentrate are not provided in two places on both sides of the PTC device, It has been thought that by using the corner portions of the PTC device, that is, by providing them at four locations, the possibility of poor electrical connection is reduced.
  • the present invention provides a PTC device,
  • This PTC device A PTC unit comprising a layered PTC element and a first layered electrode and a second layered electrode respectively disposed on the surfaces of the layered PTC element, and an insulation located outside each layered electrode (ie outside the PTC unit) Comprising a (layered) PTC element having a layer,
  • the PTC element has a first end and a second end, the first end has a first quarter cylindrical recess at each corner, and the second end Having a second quarter cylindrical recess in the corner,
  • Each first quarter cylindrical recess has a first castellation electrode electrically connected to the first layered electrode, and each second quarter cylindrical recess is connected to the second layered electrode It has the 2nd castellation electrode.
  • the PTC device further includes the previously described semi-cylindrical recesses at the first end and the second end in addition to the first quarter-cylindrical recess and the second quadrant-cylindrical recess. You can do it.
  • a plurality of PTC units each including a PTC element and layered electrodes disposed on the surfaces on both sides thereof are laminated via an insulating layer. Also good.
  • the present invention provides another PTC device,
  • This PTC device A plurality of PTC units having a plurality of layered PTC elements, a plurality of PTC units each having a first layered electrode and a second layered electrode disposed on both sides of each PTC element, and the PTC units being spaced apart And having a PTC element as a laminate in which insulating layers arranged between PTC units are laminated,
  • the PTC element has a first end and a second end,
  • the PTC element has a first quarter cylindrical recess at each corner portion at the first end and a second quarter cylindrical recess at the corner portion at the second end.
  • Each first quarter cylindrical recess has a first castellation electrode electrically connected to the first layered electrode of each PTC element
  • each second quarter cylindrical recess has a second layered electrode And a second castellation electrode connected to the first electrode.
  • the PTC device includes the semi-cylinder described above at the first end and the second end of the PTC element stack in addition to the first quarter cylindrical recess and the second quarter cylindrical recess. You may further have a shape-like recessed part.
  • the corner portion of the PTC element or the PTC element laminate has a quarter-cylindrical concave portion, and the castellation electrode is arranged in that portion. Since there are at least four locations where concentration is likely to occur, as a result, the total amount of stress acting on each castellation electrode can be reduced, so that the solder connection portion that functions for electrical connection with the PTC device It is possible to reduce as much as possible the possibility of poor electrical connection.
  • FIG. 1 schematically shows a perspective view of a conventional PTC device.
  • FIG. 2 schematically shows a state in which a conventional PTC device is mounted on a substrate.
  • FIG. 3 schematically shows a plan view of the PTC device of the present invention.
  • FIG. 4 schematically shows a plan view of another embodiment of the PTC device of the present invention.
  • FIG. 5 schematically shows a cross section (along line YY in FIG. 4) of a PTC device of the present invention having a single PTC unit.
  • FIG. 6 schematically shows a cross section (along line YY in FIG. 4) of a PTC device of the present invention having a plurality of PTC units.
  • FIG. 7 schematically shows a perspective view of the PTC device of the present invention shown in FIG.
  • FIG. 8 schematically shows a plan view of the pressure-bonded body in order to explain the method for producing the PTC device of the present invention.
  • the PTC device 10 When mounting the PTC device of the present invention on a substrate, a plan view of the case where the PTC device is placed so that the surface facing the substrate faces upward (corresponding to the case viewed in the direction of arrow A in FIG. 1) is shown. 3 and a perspective view are schematically shown in FIG. Accordingly, the lower surface 38 of the PTC device of FIGS. 1 and 2 becomes the upper surface 38 in FIGS.
  • the PTC device 10 includes a PTC element 11, and the PTC element includes a first end 42 and a second end 44.
  • the PTC element includes a first quarter cylindrical recess (see FIG. 3) 36 or a first quarter cylindrical recess (see FIG. 7), and a second quarter cylindrical recess (see FIG. 3) 37 or second.
  • a quarter-cylindrical recess (see FIG. 7) 37 is cut out as a whole (ie, when there is no cut-out portion), and has a rectangular shape in the plan view of FIG. 3, and a rectangular parallelepiped in the perspective view of FIG. Has a shape.
  • the quarter-circular portions (or quarter-cylindrical concave portions) 36 and 37 are derived from the fact that the PTC element 10 constituting the PTC device has the quarter-cylindrical concave portions as notches at four corner portions.
  • the PTC element 11 has two first quarter cylindrical portions 36 at the first end portion 42 and two first quarter cylindrical portions 37 at the second end portion 44. .
  • the quarter-cylindrical recess 36 has a quarter shape of the cylinder (thus, in FIG. 3, a quarter-circle shape).
  • the PTC element 11 may have another cutout shape instead of the quadrant shape as long as the four corner portions are cut out.
  • the cutout shape may be a right triangle shape or a quarter ellipse shape.
  • the illustrated PTC device 10 has a side metal layer portion 16 on a side surface 40 defining each first quarter cylindrical recess 36 of the PTC element 11, and one end portion of the side surface (the embodiment shown in FIG. 7).
  • the upper end 46) has the end metal plating layer portion 22, and these metal layer portions are integrally connected to form the first castellation electrode 50.
  • the PTC device 10 has a side metal layer portion 17 on a side surface 41 that defines each second quarter cylindrical recess 37 of the PTC element 11, and one end portion of the side surface (the mode shown in FIG. 7). Then, the upper end 47) has the end metal layer portion 23, and these metal layer portions are connected together to form the second castellation electrode 52.
  • the lateral metal layer of the castellation electrode extends over the entire side surface defining the recess, and the end metal layer portions 22 and / or 23 may be annular as shown in FIG. In an aspect, as shown in FIG. 4, it may be rectangular (however, it has a notch corresponding to a quarter circle).
  • the side surface 40 and / or the side surface 41 has the end metal layer portion 20 (in FIG. 7, for example, the front side is indicated by a broken line at the other end (lower end 48 in the embodiment shown in FIG. 7).
  • These three metal layer portions ie, the end metal layer portion 22 or 23 on one end 46, the side metal layer portion 16 or 17 on the side, and the other end).
  • the end metal layer portion 20) on the portion 48 may constitute first and / or second castellation electrodes.
  • the first castellation electrode 50 is electrically connected to a first layered electrode disposed on the main surface of one or more PTC elements constituting the PTC element
  • the second castellation The electrode 52 is electrically connected to a second layered electrode disposed on the main surface of one or more PTC elements constituting the PTC element.
  • the entire castellation electrode may be formed by plating with a conductive metal.
  • the castellation electrode can be formed by masking the portion other than the portion where the castellation electrode is to be formed, plating a conductive metal (eg, copper, nickel, tin, etc.), and then removing the masking.
  • a conductive metal eg, copper, nickel, tin, etc.
  • each of the side metal layer portion and the end metal layer portion is constituted by a plating layer.
  • the end metal layer portion may be a metal foil and a plating layer formed thereon.
  • a plating process is performed.
  • the side metal layer portion is constituted by a plating layer.
  • the metal having excellent corrosion resistance is formed on the outermost layer of the castellation electrode formed by the plated layer or the castellation electrode formed by the metal foil and the plated layer formed thereon as described above.
  • the layer may be further formed by a plating process.
  • the outermost layer is made of copper, it is preferable to overlay a nickel and then tin plating layer or a nickel and then gold plating layer thereon.
  • FIG. 5 schematically shows a cross section that appears when the PTC device of the present invention is cut along line YY in FIG.
  • the illustrated PTC element 10 includes a PTC unit 60 having a layered PTC element 54 and a first layered electrode 56 and a second layered electrode 58 disposed on the surfaces of the layered PTC element 54, and outside the layered electrodes (
  • the PTC element 66 is formed as a whole having the first insulating layer 62 and the second insulating layer 64 positioned outside the PTC unit.
  • the PTC element 66 has a first end portion 42 and a second end portion. At the first end portion, the PTC element 66 has a first quarter cylindrical recess 36 at each corner portion thereof, and at the second end portion. In addition, a second quarter cylindrical recess 37 is provided at the corner.
  • a PTC unit having a layered PTC element, a layered electrode (usually a metal foil) located on both sides of the layered PTC element, and an insulating layer is a well-known member, and is described in detail, for example, in the above-mentioned patent document. Is omitted.
  • a first castellation electrode 50 electrically connected to the first layered electrode 56 at its end 68 is formed on the side surface 40 defining the first quarter cylindrical recess
  • a second castellation electrode 52 electrically connected to the second layered electrode 58 at its end 70 is formed on the side surface 41 that defines each second quadrant cylindrical recess 37.
  • each castellation electrode is located at each end of the side metal layer portion 72 (corresponding to 16 or 18 in FIG. 1) and the top and bottom surfaces of the PTC element 66, respectively.
  • Such a metal layer portion is preferably a metal plating layer from the viewpoint of efficient production as described later.
  • FIG. 6 schematically shows a cross section that appears when a PTC device according to another aspect of the present invention is cut in the same manner as in FIG.
  • a PTC device according to another aspect of the present invention is cut in the same manner as in FIG.
  • it has two layered PTC elements 78 and 80, and a first layered electrode 82 and 84 and a second layered electrode 86 and 88 respectively disposed on the surfaces on both sides of each PTC element.
  • two PTC units 90 and 92 are sandwiched between insulating layers 94, 96 and 98 so that the insulating layers are located on both sides of the PTC units, and are disposed between them.
  • These insulating layers and the PTC units disposed therebetween are laminated to form a PTC element as a laminate.
  • the PTC element has a first end 42 and a second end 44 at the first quarter cylindrical portion 36 and the second quarter cylindrical portion. 37, and a first castellation electrode 50 and a second castellation electrode 52 are formed on the side surface defining these.
  • the first layered electrodes 82 and 84 are electrically connected to the first castellation electrode 50 at their ends, and the second layered electrodes 86 and 88 are electrically connected to the second castellation electrode 52. Connected.
  • each PTC unit is laminated, but more PTC units may be laminated so that the PTC units are sandwiched between insulating layers.
  • one layered electrode of each PTC unit is connected to the first castellation electrode, and the other layered electrode is connected to the second castellation electrode, whereby the PTC units are connected in parallel.
  • the device can be configured.
  • the PTC device of the present invention can be manufactured as follows. First, a main layer on both sides of a polymer PTC sheet obtained by extruding a polymer PTC composition is pressure-bonded to a metal layer (for example, a metal foil) constituting a layered electrode, or a polymer PTC composition And a metal layer are coextruded to obtain a laminate in which the PTC sheet is sandwiched between the metal layers. Next, the obtained laminate is subjected to an etching process to remove a part of the metal layer (a part corresponding to the part 100 in FIG. 5 or FIG. 6), and then an insulating layer is formed on both sides. Insulating resin sheets (for example, prepreg sheets) are stacked, and conductive metal foils (for example, copper foils) are stacked on the outside as necessary, and these are integrally pressed to obtain a pressed body.
  • a metal layer for example, a metal foil constituting a layered electrode, or a polymer PTC composition
  • a metal layer
  • FIG. 8 drilling is performed so that a cylindrical hole is formed at a predetermined position of the crimping body. Then, the entire punched crimped body is subjected to copper plating in a lump, and thereafter, only the portions corresponding to the end metal layer portions on the upper surface and the lower surface and the cylindrical recess formed by drilling are masked. Etch the metal part. Thereafter, the masking is removed, and four portions 22 or 23 corresponding to the end metal layer portions on the upper surface and the lower surface (rectangles obtained by cutting out the 90 ° fan-shaped portion 104) are defined and defined. Two larger rectangular plating layers 106 and plating layers on the sides of the cylindrical recess formed by drilling are formed. FIG.
  • FIG. 8 is a schematic plan view showing the crimp body 102 formed as described above.
  • the part corresponding to the edge part metal layer part 22 or 23 of the upper surface and lower surface formed in this way is comprised by copper foil and the copper plating layer formed on it, for example, FIG. In FIG. 6 and FIG. 7, these are shown as an integrated object.
  • the pressure-bonded body 102 may be subjected to a metal plating process (for example, a nickel or tin plating process) as necessary.
  • a metal plating process for example, a nickel or tin plating process
  • the thickness portion of the layered metal disposed on the PTC element is exposed on the side surface portion of the cylindrical recess, and such side surface portion is plated so that the castellation electrode is formed on the side surface. Since the side metal plating layer is formed, the end portion of the layer metal is electrically connected to the side metal plating layer.
  • the individual PTC devices 10 of the present invention can be obtained by cutting the pressure-bonded body 102 thus plated, along the dividing line 110 in the vertical direction and the dividing line 112 in the horizontal direction.
  • a PTC device can be efficiently manufactured by forming the press-bonded body in a state where the PTC devices are adjacent to each other in the vertical and horizontal directions, and then dividing them.
  • a method of manufacturing a PTC device having a structure in which an electrode is electrically connected to a castellation electrode is basically known, and can be referred to, for example, Patent Document 1 described above.
  • the PTC device of the present invention is particularly effective when the PTC element is hard. That is, when the conductive polymer composition constituting the PTC element includes a relatively hard polymer, for example, when it includes polyvinylidene fluoride resin (PVDF), compared to a softer resin (for example, polyethylene), PTC Since it is difficult to relieve the stress generated by the expansion / contraction of the element, it is effective to provide a quarter cylindrical recess in the PTC device and form a castellation electrode there.
  • PVDF polyvinylidene fluoride resin
  • a softer resin for example, polyethylene

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  • Thermistors And Varistors (AREA)

Abstract

A PTC device, which reduces the potential of an electrical connection of a solder connection formed to be connected to a substrate from becoming defective as much as possible, is provided. The PTC device comprises a PTC element having: a PTC unit comprising a layered PTC component and a first layered electrode and a second layered electrode, which are each positioned on a surface on either side of the layered PTC component; and insulating layers positioned on the outside of each layered electrode. The PTC element has a first end and a second end, and, at the first end, has a first quarter cylindrical recess in each corner, and at the second end, has second quarter cylindrical recesses in the corners. Each first quarter cylindrical recess has a first castellated electrode that is electrically connected to the first layered electrode, and each second quarter cylindrical recess has a second castellated electrode that is electrically connected to the second layered electrode.

Description

PTCデバイスPTC device
 本発明は、PTCデバイス、詳しくは表面実装型のPTCデバイスに関する。 The present invention relates to a PTC device, and more particularly to a surface mount type PTC device.
 例えば、PTCデバイスは、回路保護素子として種々の電気装置において用いられ、電気装置の保護回路を構成している。そのようなPTCデバイスは、保護回路を有する保護回路基板に配置される。その場合、配置の便宜を考慮して、表面実装型のPTCデバイスがしばしば使用される。 For example, a PTC device is used in various electrical devices as a circuit protection element, and constitutes a protection circuit for the electrical device. Such a PTC device is arranged on a protection circuit board having a protection circuit. In that case, a surface mount type PTC device is often used in consideration of arrangement convenience.
 表面実装型のPTCデバイスは、その電極が保護回路基板上に設けたタブまたはパッド上に位置するように載置され、ハンダ付けによって電気的に接続することによって、保護回路基板上に形成した保護回路に配置される。 The surface mount type PTC device is placed so that its electrode is located on a tab or pad provided on the protection circuit board, and is electrically connected by soldering, thereby forming a protection circuit formed on the protection circuit board. Placed in the circuit.
 そのようなPTCデバイスを図1に斜視図にて模式的に示す。図示したPTCデバイス10は、それを構成するPTC素子11を有して成る。PTC素子11は、PTC要素およびその両側の表面上にそれぞれ配置された層状電極、ならびに各層状電極の外側に位置する絶縁層を有して成る。図1では、これらの構成要素を図示せず、PTC素子11として一体に示している。 Such a PTC device is schematically shown in a perspective view in FIG. The illustrated PTC device 10 includes a PTC element 11 constituting the PTC device 10. The PTC element 11 includes a PTC element and layered electrodes respectively disposed on the surfaces on both sides thereof, and an insulating layer positioned outside each layered electrode. In FIG. 1, these components are not shown, but are shown as a PTC element 11.
 PTC素子11は、両側の端部にて側方端面に半円筒状凹部分12および14を有し、半円筒状凹部分の表面に側方金属層部分(例えば導電性金属メッキ層)16および18を有する。他方、PTC素子11は、その上面および下面のそれぞれの両端部にも端部金属層部分(例えば導電性金属メッキ層)20、22および24、26を有する。側方金属層部分16および18は、その上端および下端にて端部金属層部分20、22および24、26と一体につながり、これらがいわゆるキャスタレーション(castellation)電極(20+16+22および24+18+26)を構成している。 The PTC element 11 has semi-cylindrical recess portions 12 and 14 on the side end surfaces at both ends, and a side metal layer portion (for example, a conductive metal plating layer) 16 and the like on the surface of the semi-cylindrical recess portion. 18 On the other hand, the PTC element 11 has end metal layer portions (for example, conductive metal plating layers) 20, 22 and 24, 26 at both ends of the upper surface and the lower surface thereof. The lateral metal layer portions 16 and 18 are integrally connected to the end metal layer portions 20, 22 and 24, 26 at their upper and lower ends, which constitute so-called castellation electrodes (20 + 16 + 22 and 24 + 18 + 26). ing.
 尚、図示した態様では、キャスタレーション電極は、PTC素子11の上面および下面の双方に金属層部分を有するが、一般的にキャスタレーション電極は、PTC素子の上面および下面の一方の両端部に端部金属層部分を有してもよい(即ち、他方の面の端部に端部金属層部分を有さなくてもよい)。従って、キャスタレーション電極は、PTCデバイスの上面および下面の少なくとも一方の面の両端部に端部金属層部分を有する。 In the illustrated embodiment, the castellation electrode has a metal layer portion on both the upper surface and the lower surface of the PTC element 11, but the castellation electrode is generally connected to both ends of the upper surface and the lower surface of the PTC element. There may be a partial metal layer portion (that is, the end metal layer portion may not be provided at the end of the other surface). Therefore, the castellation electrode has end metal layer portions at both ends of at least one of the upper surface and the lower surface of the PTC device.
 図示していないが、このようなPTCデバイスにおいて、一方のキャスタレーション電極は、PTCデバイス内に位置するPTC素子の一方の電極に電気的に接続され、他方のキャスタレーション電極は、PTC素子の他方の電極に電気的に接続されている。このようなPTCデバイスは、例えば下記特許文献1に開示されている。 Although not shown, in such a PTC device, one castellation electrode is electrically connected to one electrode of a PTC element located in the PTC device, and the other castellation electrode is connected to the other of the PTC elements. Are electrically connected to the electrodes. Such a PTC device is disclosed in Patent Document 1 below, for example.
 このようなPTCデバイスの基板への実装は、基板上に設けたパッド上にクリームハンダを印刷により塗布し、塗布されたクリームハンダ部分を介してパッド上に、PTCデバイスの下面に位置するキャスタレーション電極の端部金属層部分(例えば22)が位置するように、PTCデバイスを配置し、そのようにPTCデバイスが配置された基板をリフロー炉に入れてハンダを溶融・固化させることによって実施する。このようにハンダ付けによってPTCデバイスを基板上に実装した様子を、断面図にて模式的に図2に示す。 In mounting such a PTC device on a substrate, cream solder is applied onto a pad provided on the substrate by printing, and castellation located on the lower surface of the PTC device is applied to the pad via the applied cream solder portion. The PTC device is disposed so that the end metal layer portion (for example, 22) of the electrode is positioned, and the substrate on which the PTC device is disposed is placed in a reflow furnace to melt and solidify the solder. A state in which the PTC device is mounted on the substrate by soldering in this manner is schematically shown in FIG. 2 in a sectional view.
 図2には、基板28上に実装された図1のPTCデバイス10を、その線X-Xを含む垂直面で切断した端面図にて示す。尚、図2では、図1のPTCデバイスの右側の端部のみを図示し、キャスタレーション電極は、容易に理解できるように、その厚さを誇張して図示している。基板上のパッド30とキャスタレーション電極の端部金属層部分22との間には、ハンダ付けによってハンダ接続部32が形成され、これらを一体に結合すると共に電気的に接続している。リフロー炉において溶融したハンダは、半円筒状凹部分上にも濡れ上がり、そのまま固化してキャスタレーション電極の側方金属層部分16上にもハンダ部分34がフィレット部として存在し、これがハンダ接続部32と一体になっている。 FIG. 2 shows an end view of the PTC device 10 of FIG. 1 mounted on the substrate 28, cut along a vertical plane including the line XX. In FIG. 2, only the right end of the PTC device of FIG. 1 is illustrated, and the castellation electrode is exaggerated for easy understanding. A solder connection portion 32 is formed by soldering between the pad 30 on the substrate and the end metal layer portion 22 of the castellation electrode, and these are joined together and electrically connected. Solder melted in the reflow furnace also wets over the semi-cylindrical concave portion, solidifies as it is, and a solder portion 34 is also present as a fillet portion on the side metal layer portion 16 of the castellation electrode, which is a solder connection portion. 32 is integrated.
米国特許第6377467号明細書US Pat. No. 6,377,467
 上述のようにPTCデバイスをハンダ付けした基板を使用していると、PTCデバイスと基板との間の電気的接続が不良になるという問題点に気づいた。より具体的には、端部金属層部分22とパッド30との間でハンダ接続部32の一部分が剥離することがあり、その結果、これらの間の電気的接続が不十分になることに気付いた。そこで、本発明が解決しようとする課題は、そのような電気的接続が不良になる可能性を可及的に減らすことに存する。 As described above, I noticed the problem that the electrical connection between the PTC device and the substrate becomes poor when the substrate on which the PTC device is soldered is used. More specifically, a part of the solder connection portion 32 may be peeled off between the end metal layer portion 22 and the pad 30, and as a result, the electrical connection between them is insufficient. It was. Therefore, the problem to be solved by the present invention is to reduce as much as possible the possibility of such an electrical connection being defective.
 上述の電気的接続が不良になる基板について詳細に検討したところ、ハンダ接続部32においてクラックが発生したり、あるいはハンダ接続部が端部金属層部分22および/または側方金属層部分16からのハンダ接続部32の一部分の剥離の発生が見られることが分かった。 When the above-described substrate having poor electrical connection is examined in detail, cracks are generated in the solder connection portion 32, or the solder connection portion comes from the end metal layer portion 22 and / or the side metal layer portion 16. It was found that a part of the solder connection portion 32 was peeled off.
 このような現象を更に検討すると、PTCデバイスが作動する場合に、その温度が上昇してPTC要素が膨張し、その後、PTC要素の温度が低下して収縮して元の形状に戻るという、膨張・収縮という過程を経る。また、基板を有する電気装置の環境(例えば自動車の室内)が温度上昇・温度降下を繰り返す場合にも、PTC要素が膨張・収縮という過程を繰り返す。 Further examination of this phenomenon reveals that when the PTC device operates, the temperature rises and the PTC element expands, and then the temperature of the PTC element decreases and contracts to return to its original shape.・ It goes through a process called contraction. In addition, when the environment of the electric device having the substrate (for example, the interior of an automobile) repeatedly increases and decreases in temperature, the PTC element repeats the process of expansion and contraction.
 PTC要素が膨張・収縮を繰り返すと、その体積変化によって応力が発生し、そのような応力によって、クラック・剥離等の発生をもたらす可能性が大きいことに帰着した。特に、上述のようにPTCデバイスの側方に半円筒状凹部を有する場合、膨張・収縮によって生じる応力がその部分に応力が集中する傾向にあり、その結果、クラック・剥離等の現象が起こり易いとの判断に到った。従って、そのように応力が集中するのを抑制することによって、より詳細には、応力が集中する可能性がある箇所を増やすことによって、そのような箇所の各々に集中する応力の総量を減らすことによって、クラック・剥離等の発生を抑制でき、電気的接続の不良の発生の可能性を減らすことができるとの考えに到った。 When the PTC element repeatedly expands and contracts, a stress is generated due to the volume change, and this results in a large possibility of causing cracks and peeling. In particular, when the PTC device has a semi-cylindrical concave portion on the side as described above, the stress caused by expansion / contraction tends to concentrate on the portion, and as a result, a phenomenon such as crack / peeling is likely to occur. It came to the judgment. Therefore, by reducing the concentration of stress in such a way, more specifically, by increasing the number of locations where stress can be concentrated, reducing the total amount of stress concentrated at each such location. As a result, the inventors have thought that it is possible to suppress the occurrence of cracks, separation, etc., and to reduce the possibility of occurrence of poor electrical connection.
 上述の考えに基づいて、発明者が、応力の集中の抑制について、鋭意検討した結果、応力が集中する可能性がある箇所を、PTCデバイスの両側の側方の2箇所に設けるのではなく、PTCデバイスの角部分とすることによって、即ち、4箇所に設けることによって、電気的接続の不良の可能性が減るとの考えに到った。 Based on the above-mentioned idea, the inventor has intensively studied about the suppression of stress concentration, and as a result, places where stress may concentrate are not provided in two places on both sides of the PTC device, It has been thought that by using the corner portions of the PTC device, that is, by providing them at four locations, the possibility of poor electrical connection is reduced.
 従って、第1の要旨において、本発明はPTCデバイスを提供し、
 このPTCデバイスは、
 層状PTC要素およびその両側の表面上にそれぞれ配置された第1層状電極および第2層状電極を有して成るPTCユニット、ならびに各層状電極の外側に(即ち、PTCユニットの外側に)位置する絶縁層を有する(層状の)PTC素子を有して成り、
 PTC素子は、第1端部および第2端部を有し、第1端部にて、その各角部分に第1四半分円筒状凹部を有し、また、第2端部にて、その角部分に第2四半分円筒状凹部を有し、
 各第1四半分円筒状凹部は、第1層状電極に電気的に接続された第1キャスタレーション電極を有し、また、各第2四半分円筒状凹部は、第2層状電極に接続された第2キャスタレーション電極を有する
ことを特徴とする。
Accordingly, in a first aspect, the present invention provides a PTC device,
This PTC device
A PTC unit comprising a layered PTC element and a first layered electrode and a second layered electrode respectively disposed on the surfaces of the layered PTC element, and an insulation located outside each layered electrode (ie outside the PTC unit) Comprising a (layered) PTC element having a layer,
The PTC element has a first end and a second end, the first end has a first quarter cylindrical recess at each corner, and the second end Having a second quarter cylindrical recess in the corner,
Each first quarter cylindrical recess has a first castellation electrode electrically connected to the first layered electrode, and each second quarter cylindrical recess is connected to the second layered electrode It has the 2nd castellation electrode.
 1つの態様では、このPTCデバイスは、第1四半分円筒状凹部および第2四半分円筒状凹部に加えて、先に説明した半円筒状凹部を第1端部および第2端部に更に有してよい。 In one aspect, the PTC device further includes the previously described semi-cylindrical recesses at the first end and the second end in addition to the first quarter-cylindrical recess and the second quadrant-cylindrical recess. You can do it.
 上述の第1の要旨のPTCデバイスは、1つの好ましい態様において、PTC要素およびその両側の表面上に配置された層状電極を有して成るPTCユニットが複数、絶縁層を介して積層されていてもよい。 In the PTC device according to the first aspect described above, in one preferred embodiment, a plurality of PTC units each including a PTC element and layered electrodes disposed on the surfaces on both sides thereof are laminated via an insulating layer. Also good.
 即ち、第2の要旨において、本発明は、別のPTCデバイスを提供し、
 このPTCデバイスは、
 複数の層状PTC要素および各PTC要素の両側の表面上にそれぞれ配置された第1層状電極および第2層状電極を有して成る複数のPTCユニット、ならびにこれらのPTCユニットを間に挟んで離隔するようにPTCユニットの間に配置された絶縁層が積層された積層体としてのPTC素子を有して成り、
 PTC素子は、第1端部および第2端部を有し、
 PTC素子は、第1端部にて、その各角部分に第1四半分円筒状凹部を有し、また、第2端部にて、その角部分に第2四半分円筒状凹部を有し、
 各第1四半分円筒状凹部は、各PTC要素の第1層状電極に電気的に接続された第1キャスタレーション電極を有し、また、各第2四半分円筒状凹部は、第2層状電極に接続された第2キャスタレーション電極を有する
ことを特徴とする。
That is, in the second aspect, the present invention provides another PTC device,
This PTC device
A plurality of PTC units having a plurality of layered PTC elements, a plurality of PTC units each having a first layered electrode and a second layered electrode disposed on both sides of each PTC element, and the PTC units being spaced apart And having a PTC element as a laminate in which insulating layers arranged between PTC units are laminated,
The PTC element has a first end and a second end,
The PTC element has a first quarter cylindrical recess at each corner portion at the first end and a second quarter cylindrical recess at the corner portion at the second end. ,
Each first quarter cylindrical recess has a first castellation electrode electrically connected to the first layered electrode of each PTC element, and each second quarter cylindrical recess has a second layered electrode And a second castellation electrode connected to the first electrode.
 1つの態様では、このPTCデバイスは、第1四半分円筒状凹部および第2四半分円筒状凹部に加えて、PTC素子積層体の第1端部および第2端部に先に説明した半円筒状凹部を更に有してよい。 In one aspect, the PTC device includes the semi-cylinder described above at the first end and the second end of the PTC element stack in addition to the first quarter cylindrical recess and the second quarter cylindrical recess. You may further have a shape-like recessed part.
 本発明のPTCデバイスでは、PTC素子またはPTC素子積層体の角部分に四半分円筒状凹部を有し、その部分にキャスタレーション電極が配置されているので、PTC要素の膨張・収縮によって生じる応力が集中し易い箇所が少なくとも4箇所存在することになり、その結果、キャスタレーション電極1つ当たりに作用する応力の総量を少なくすることができるので、PTCデバイスとの電気的接続に機能するハンダ接続部の電気的接続が不良になる可能性を可及的に減らすことができる。 In the PTC device of the present invention, the corner portion of the PTC element or the PTC element laminate has a quarter-cylindrical concave portion, and the castellation electrode is arranged in that portion. Since there are at least four locations where concentration is likely to occur, as a result, the total amount of stress acting on each castellation electrode can be reduced, so that the solder connection portion that functions for electrical connection with the PTC device It is possible to reduce as much as possible the possibility of poor electrical connection.
図1は、従来のPTCデバイスの斜視図を模式的に示す。FIG. 1 schematically shows a perspective view of a conventional PTC device. 図2は、従来のPTCデバイスを基板に実装した状態を模式的に示す。FIG. 2 schematically shows a state in which a conventional PTC device is mounted on a substrate. 図3は、本発明のPTCデバイスの平面図を模式的に示す。FIG. 3 schematically shows a plan view of the PTC device of the present invention. 図4は、本発明のPTCデバイスの別の態様の平面図を模式的に示す。FIG. 4 schematically shows a plan view of another embodiment of the PTC device of the present invention. 図5は、単一のPTCユニットを有する本発明のPTCデバイスの(図4の線Y-Yに沿った)断面を模式的に示す。FIG. 5 schematically shows a cross section (along line YY in FIG. 4) of a PTC device of the present invention having a single PTC unit. 図6は、複数のPTCユニットを有する本発明のPTCデバイスの(図4の線Y-Yに沿った)断面を模式的に示す。FIG. 6 schematically shows a cross section (along line YY in FIG. 4) of a PTC device of the present invention having a plurality of PTC units. 図7は、図3に示す本発明のPTCデバイスの斜視図を模式的に示す。FIG. 7 schematically shows a perspective view of the PTC device of the present invention shown in FIG. 図8は、本発明のPTCデバイスの製造法を説明するために圧着体の平面図を模式的に示す。FIG. 8 schematically shows a plan view of the pressure-bonded body in order to explain the method for producing the PTC device of the present invention.
 本発明のPTCデバイスを基板に実装する時に、基板に対向する面が上向きとなるようにPTCデバイスを載置した場合(図1において矢印Aの方向で見た場合に相当)の平面図を図3に、また、斜視図を図7に模式的に示す。従って、図1および図2のPTCデバイスの下面38は、図3および図7では、上面38となる。図示した態様では、PTCデバイス10は、PTC素子11を有して成り、PTC素子は、第1端部42および第2端部44を有して成る。 When mounting the PTC device of the present invention on a substrate, a plan view of the case where the PTC device is placed so that the surface facing the substrate faces upward (corresponding to the case viewed in the direction of arrow A in FIG. 1) is shown. 3 and a perspective view are schematically shown in FIG. Accordingly, the lower surface 38 of the PTC device of FIGS. 1 and 2 becomes the upper surface 38 in FIGS. In the illustrated embodiment, the PTC device 10 includes a PTC element 11, and the PTC element includes a first end 42 and a second end 44.
 PTC素子は、第1四半分円筒状凹部(図3参照)36または第1四半分円筒状凹部(図7参照)36を、および第2四半分円筒状凹部(図3参照)37または第2四半分円筒状凹部(図7参照)37切り欠いた、全体として(即ち、切り欠き部分が無いとした場合に)、図3の平面図では矩形形状を、また、図7の斜視図では直方体形状を有する。この四半分円形部分(または四半分円筒状凹部)36および37は、PTCデバイスを構成するPTC素子10が四半分円筒状凹部を4つの角部分に切り欠き部として有することに由来する。 The PTC element includes a first quarter cylindrical recess (see FIG. 3) 36 or a first quarter cylindrical recess (see FIG. 7), and a second quarter cylindrical recess (see FIG. 3) 37 or second. A quarter-cylindrical recess (see FIG. 7) 37 is cut out as a whole (ie, when there is no cut-out portion), and has a rectangular shape in the plan view of FIG. 3, and a rectangular parallelepiped in the perspective view of FIG. Has a shape. The quarter-circular portions (or quarter-cylindrical concave portions) 36 and 37 are derived from the fact that the PTC element 10 constituting the PTC device has the quarter-cylindrical concave portions as notches at four corner portions.
 より詳細には、PTC素子11は、第1端部42において、2つの第1四半分円筒状部36を有し、第2端部44において、2つの第1四半分円筒状部37を有する。別の態様では、2つの第1または第2四半分円筒状部36および/または37の間に、図1に示すような半円筒状凹部12を有してよい。 More specifically, the PTC element 11 has two first quarter cylindrical portions 36 at the first end portion 42 and two first quarter cylindrical portions 37 at the second end portion 44. . In another aspect, there may be a semi-cylindrical recess 12 as shown in FIG. 1 between the two first or second quadrants 36 and / or 37.
 尚、四半分円筒状凹部36は、円筒の4分の1の形状(従って、図3では、四半分円の形状)を有するのが特に好ましい。しかしながら、PTC素子11は、その4つの角部分が切り欠かれている限り、四半分円の形状に代えて、他の切り欠き形状を有してもよい。平面図において、切り欠き形状が直角三角形形状であっても、4分の1の楕円の形状であってもよい。 In addition, it is particularly preferable that the quarter-cylindrical recess 36 has a quarter shape of the cylinder (thus, in FIG. 3, a quarter-circle shape). However, the PTC element 11 may have another cutout shape instead of the quadrant shape as long as the four corner portions are cut out. In the plan view, the cutout shape may be a right triangle shape or a quarter ellipse shape.
 図示したPTCデバイス10は、PTC素子11の各第1四半分円筒状凹部36を規定する側面40上に側方金属層部分16を有し、その側面の一方の端部(図7に示す態様では上端46)にて端部金属メッキ層部分22を有し、これらの金属層部分は一体に接続され、第1キャスタレーション電極50を構成する。また、PTCデバイス10は、PTC素子11の各第2四半分円筒状凹部37を規定する側面41上に側方金属層部分17を有し、その側面の一方の端部(図7に示す態様では上端47)にて端部金属層部分23を有し、これらの金属層部分は一体に接続され、第2キャスタレーション電極52を構成する。 The illustrated PTC device 10 has a side metal layer portion 16 on a side surface 40 defining each first quarter cylindrical recess 36 of the PTC element 11, and one end portion of the side surface (the embodiment shown in FIG. 7). The upper end 46) has the end metal plating layer portion 22, and these metal layer portions are integrally connected to form the first castellation electrode 50. The PTC device 10 has a side metal layer portion 17 on a side surface 41 that defines each second quarter cylindrical recess 37 of the PTC element 11, and one end portion of the side surface (the mode shown in FIG. 7). Then, the upper end 47) has the end metal layer portion 23, and these metal layer portions are connected together to form the second castellation electrode 52.
 キャスタレーション電極の側方金属層は、凹部を規定する側面の全面にわたって延在し、端部金属層部分22および/または23は、図3に示すように円環状であってもよく、別の態様では、図4に示すように、矩形状(但し、四半分円形に対応する切り欠き部を有する)であってもよい。 The lateral metal layer of the castellation electrode extends over the entire side surface defining the recess, and the end metal layer portions 22 and / or 23 may be annular as shown in FIG. In an aspect, as shown in FIG. 4, it may be rectangular (however, it has a notch corresponding to a quarter circle).
 尚、側面40および/または側面41は、他方の端部(図7に示す態様では下端48)にても端部金属層部分20(図7にて、例として手前側のものを破線にて示す)を有してよく、これらの3つの金属層部分(即ち、一方の端部46上の端部金属層部分22または23、側面上の側方金属層部分16または17、および他方の端部48上の端部金属層部分20)が第1および/または第2キャスタレーション電極を構成してよい。図示していないが、第1キャスタレーション電極50は、PTC素子を構成する1または複数のPTC要素の主表面上に配置された第1層状電極に電気的に接続され、また、第2キャスタレーション電極52は、PTC素子を構成する1または複数のPTC要素の主表面上に配置された第2層状電極に電気的に接続されている。 Note that the side surface 40 and / or the side surface 41 has the end metal layer portion 20 (in FIG. 7, for example, the front side is indicated by a broken line at the other end (lower end 48 in the embodiment shown in FIG. 7). These three metal layer portions (ie, the end metal layer portion 22 or 23 on one end 46, the side metal layer portion 16 or 17 on the side, and the other end). The end metal layer portion 20) on the portion 48 may constitute first and / or second castellation electrodes. Although not shown, the first castellation electrode 50 is electrically connected to a first layered electrode disposed on the main surface of one or more PTC elements constituting the PTC element, and the second castellation The electrode 52 is electrically connected to a second layered electrode disposed on the main surface of one or more PTC elements constituting the PTC element.
 尚、キャスタレーション電極は、その全体を導電性金属によるメッキ処理によって形成してもよい。その場合、キャスタレーション電極を形成する部分以外の部分をマスキングした後に導電性金属(例えば銅、ニッケル、錫等)のメッキ処理し、その後、マスキングを除去することによってキャスタレーション電極を形成できる。この場合、側方金属層部分および端部金属層部分はいずれもメッキ層によって構成される。 Note that the entire castellation electrode may be formed by plating with a conductive metal. In that case, the castellation electrode can be formed by masking the portion other than the portion where the castellation electrode is to be formed, plating a conductive metal (eg, copper, nickel, tin, etc.), and then removing the masking. In this case, each of the side metal layer portion and the end metal layer portion is constituted by a plating layer.
 別の態様では、端部金属層部分は、金属箔およびその上に形成したメッキ層であってもよい。この場合、後述するようにPTC素子の最外層としての絶縁層を形成する絶縁性樹脂シート上に金属箔を重ねた圧着体を形成し、エッチングにより所定箇所の金属箔を残した後に、メッキ処理することによって、そのような端部金属層部分を形成できる。この態様でも、側方金属層部分はメッキ層によって構成される。 In another aspect, the end metal layer portion may be a metal foil and a plating layer formed thereon. In this case, as will be described later, after forming a pressure-bonded body in which a metal foil is stacked on an insulating resin sheet for forming an insulating layer as an outermost layer of the PTC element, and leaving a metal foil at a predetermined position by etching, a plating process is performed. By doing so, such an end metal layer portion can be formed. Also in this aspect, the side metal layer portion is constituted by a plating layer.
 更に、別の態様では、上述のように形成した、メッキ層により構成されるキャスタレーション電極、または金属箔およびその上のメッキ層により構成されるキャスタレーション電極の最外層上に耐食性に優れた金属層をメッキ処理によって更に形成してよい。例えば最外層が銅で構成されている場合に、ニッケル、次いで錫のメッキ層を、またはニッケル、次いで金のメッキ層をその上に重ねるのが好ましい。 Furthermore, in another aspect, the metal having excellent corrosion resistance is formed on the outermost layer of the castellation electrode formed by the plated layer or the castellation electrode formed by the metal foil and the plated layer formed thereon as described above. The layer may be further formed by a plating process. For example, when the outermost layer is made of copper, it is preferable to overlay a nickel and then tin plating layer or a nickel and then gold plating layer thereon.
 図5に、本発明のPTCデバイスを図4の線Y-Yに沿って切断した場合に現れる断面を模式的に示す。図示したPTC素子10は、層状PTC要素54およびその両側の表面上にそれぞれ配置された第1層状電極56および第2層状電極58を有して成るPTCユニット60、ならびに各層状電極の外側に(即ち、PTCユニットの外側に)位置する第1絶縁層62および第2絶縁層64を有する、全体として層状のPTC素子66を有して成る。PTC素子66は、第1端部42および第2端部を有し、第1端部にて、その各角部分に第1四半分円筒状凹部36を有し、また、第2端部にて、その角部分に第2四半分円筒状凹部37を有する。 FIG. 5 schematically shows a cross section that appears when the PTC device of the present invention is cut along line YY in FIG. The illustrated PTC element 10 includes a PTC unit 60 having a layered PTC element 54 and a first layered electrode 56 and a second layered electrode 58 disposed on the surfaces of the layered PTC element 54, and outside the layered electrodes ( In other words, the PTC element 66 is formed as a whole having the first insulating layer 62 and the second insulating layer 64 positioned outside the PTC unit. The PTC element 66 has a first end portion 42 and a second end portion. At the first end portion, the PTC element 66 has a first quarter cylindrical recess 36 at each corner portion thereof, and at the second end portion. In addition, a second quarter cylindrical recess 37 is provided at the corner.
 尚、層状PTC要素、その両側に位置する層状電極(通常、金属箔)および絶縁層を有して成るPTCユニットは周知の部材であり、例えば上記特許文献にも開示されているので詳細な説明は省略する。 Note that a PTC unit having a layered PTC element, a layered electrode (usually a metal foil) located on both sides of the layered PTC element, and an insulating layer is a well-known member, and is described in detail, for example, in the above-mentioned patent document. Is omitted.
 図示するように、第1四半分円筒状凹部を規定する側面40上に、第1層状電極56にその端部68にて電気的に接続された第1キャスタレーション電極50が形成され、また、各第2四半分円筒状凹部37を規定する側面41上に、第2層状電極58にその端部70にて電気的に接続された第2キャスタレーション電極52が形成されている。 As shown in the figure, a first castellation electrode 50 electrically connected to the first layered electrode 56 at its end 68 is formed on the side surface 40 defining the first quarter cylindrical recess, A second castellation electrode 52 electrically connected to the second layered electrode 58 at its end 70 is formed on the side surface 41 that defines each second quadrant cylindrical recess 37.
 容易に理解できるように、図示した態様では、各キャスタレーション電極は、側方金属層部分72(図1の16または18に対応)、ならびにPTC素子66の上面および下面のそれぞれの両端部に位置する端部金属層部分74(図1の20または24に対応)および76(図1の22または26に対応)により構成されている。このような金属層部分は、後述するように効率的な製造の観点から、金属メッキ層であるのが好ましい。 As can be readily appreciated, in the illustrated embodiment, each castellation electrode is located at each end of the side metal layer portion 72 (corresponding to 16 or 18 in FIG. 1) and the top and bottom surfaces of the PTC element 66, respectively. End metal layer portions 74 (corresponding to 20 or 24 in FIG. 1) and 76 (corresponding to 22 or 26 in FIG. 1). Such a metal layer portion is preferably a metal plating layer from the viewpoint of efficient production as described later.
 図6に、本発明の別の態様のPTCデバイスを、図3と同様に切断した場合に現れる断面を模式的に示す。図示した態様では、複数の例として2つの層状PTC要素78および80、ならびに各PTC要素の両側の表面上にそれぞれ配置された第1層状電極82および84ならびに第2層状電極86および88を有して成る2つのPTCユニット90および92を有して成る。これらのPTCユニットは、その両側に絶縁層が位置するように、絶縁層94、96および98によって挟まれ、これらの間に配置されている。これらの絶縁層およびその間に配置されたPTCユニットが積層されて積層体としてのPTC素子が形成されている。 FIG. 6 schematically shows a cross section that appears when a PTC device according to another aspect of the present invention is cut in the same manner as in FIG. In the illustrated embodiment, as an example, it has two layered PTC elements 78 and 80, and a first layered electrode 82 and 84 and a second layered electrode 86 and 88 respectively disposed on the surfaces on both sides of each PTC element. And two PTC units 90 and 92. These PTC units are sandwiched between insulating layers 94, 96 and 98 so that the insulating layers are located on both sides of the PTC units, and are disposed between them. These insulating layers and the PTC units disposed therebetween are laminated to form a PTC element as a laminate.
 図5の態様と同様に、PTC素子は、第1端部42および第2端部44を有し、これらの端部には、第1四半分円筒状部36および第2四半分円筒状部37を有、これらを規定する側面上に第1キャスタレーション電極50および第2キャスタレーション電極52が形成されている。図示した態様では、第1層状電極82および84はその端部にて第1キャスタレーション電極50に電気的に接続され、また、第2層状電極86および88は、第2キャスタレーション電極52に電気的に接続されている。 Similar to the embodiment of FIG. 5, the PTC element has a first end 42 and a second end 44 at the first quarter cylindrical portion 36 and the second quarter cylindrical portion. 37, and a first castellation electrode 50 and a second castellation electrode 52 are formed on the side surface defining these. In the illustrated embodiment, the first layered electrodes 82 and 84 are electrically connected to the first castellation electrode 50 at their ends, and the second layered electrodes 86 and 88 are electrically connected to the second castellation electrode 52. Connected.
 図6に示した態様では、PTCユニットが2つ積層されているが、PTCユニットが絶縁層によって挟まれるように、より多くのPTCユニットを積層してもよい。この場合、各PTCユニットの一方の層状電極が第1キャスタレーション電極に接続され、他方の層状電極が第2キャスタレーション電極に接続されるように構成することによって、PTCユニットが並列に接続されたデバイスを構成することができる。 In the embodiment shown in FIG. 6, two PTC units are laminated, but more PTC units may be laminated so that the PTC units are sandwiched between insulating layers. In this case, one layered electrode of each PTC unit is connected to the first castellation electrode, and the other layered electrode is connected to the second castellation electrode, whereby the PTC units are connected in parallel. The device can be configured.
 例えば、本発明のPTCデバイスは、次のようにして製造することができる。最初に、ポリマーPTC組成物を押出成形することによって得られるポリマーPTCシートの両側の主表面に、層状電極を構成することになる金属層(例えば金属箔)に圧着して、あるいはポリマーPTC組成物と金属層とを同時押出することによって、PTCシートが金属層に挟まれた状態の積層体を得る。次に、得られた積層体をエッチング処理に付して、金属層の一部分(図5または図6の部分100に対応する箇所)を除去し、その後、両側に絶縁層を構成することになる絶縁性樹脂シート(例えばプリプレグシート)を重ね、更に、必要に応じて外側に導電性金属箔(例えば銅箔)を重ね、これらを一体に圧着して圧着体を得る。 For example, the PTC device of the present invention can be manufactured as follows. First, a main layer on both sides of a polymer PTC sheet obtained by extruding a polymer PTC composition is pressure-bonded to a metal layer (for example, a metal foil) constituting a layered electrode, or a polymer PTC composition And a metal layer are coextruded to obtain a laminate in which the PTC sheet is sandwiched between the metal layers. Next, the obtained laminate is subjected to an etching process to remove a part of the metal layer (a part corresponding to the part 100 in FIG. 5 or FIG. 6), and then an insulating layer is formed on both sides. Insulating resin sheets (for example, prepreg sheets) are stacked, and conductive metal foils (for example, copper foils) are stacked on the outside as necessary, and these are integrally pressed to obtain a pressed body.
 その後、図8に示すように、圧着体の所定の箇所に円筒状の孔が形成されるように穿孔する。そして、穿孔した圧着体全体に対し一括に銅メッキ処理を施し、その後、上面および下面の端部金属層部分に対応する部分および穿孔することによって形成される円筒状凹部のみマスキングし、それ以外の金属部分をエッチング処理する。その後、マスキングを除去して、上面および下面の端部金属層部分に対応する部分22または23(それぞれ、90°の扇形状部分104を切り欠いた矩形)が4つ集合して規定される1つのより大きい矩形のメッキ層106、および穿孔することによって形成される円筒状凹部の側面上のメッキ層を形成する。このように形成した圧着体102を模式的平面図にて図8に示す。尚、このように形成される、上面および下面の端部金属層部分22または23に対応する部分は、銅箔およびその上に形成された銅メッキ層により構成されるが、例えば図5、図6および図7においては、これらを一体物として示している。その後、必要に応じて、圧着体102を金属メッキ処理(例えばニッケル、錫のメッキ処理)してよい。 Then, as shown in FIG. 8, drilling is performed so that a cylindrical hole is formed at a predetermined position of the crimping body. Then, the entire punched crimped body is subjected to copper plating in a lump, and thereafter, only the portions corresponding to the end metal layer portions on the upper surface and the lower surface and the cylindrical recess formed by drilling are masked. Etch the metal part. Thereafter, the masking is removed, and four portions 22 or 23 corresponding to the end metal layer portions on the upper surface and the lower surface (rectangles obtained by cutting out the 90 ° fan-shaped portion 104) are defined and defined. Two larger rectangular plating layers 106 and plating layers on the sides of the cylindrical recess formed by drilling are formed. FIG. 8 is a schematic plan view showing the crimp body 102 formed as described above. In addition, although the part corresponding to the edge part metal layer part 22 or 23 of the upper surface and lower surface formed in this way is comprised by copper foil and the copper plating layer formed on it, for example, FIG. In FIG. 6 and FIG. 7, these are shown as an integrated object. Thereafter, the pressure-bonded body 102 may be subjected to a metal plating process (for example, a nickel or tin plating process) as necessary.
 尚、穿孔することによって、PTC要素上に配置された層状金属の厚さ部分が円筒状凹部の側面部に露出することになり、そのような側面部がメッキ処理されて側面にキャスタレーション電極の側方金属メッキ層が形成されるので、層状金属の端部が側方金属メッキ層に電気的に接続されることになる。 By drilling, the thickness portion of the layered metal disposed on the PTC element is exposed on the side surface portion of the cylindrical recess, and such side surface portion is plated so that the castellation electrode is formed on the side surface. Since the side metal plating layer is formed, the end portion of the layer metal is electrically connected to the side metal plating layer.
 このようにメッキ処理が済んだ圧着体102を縦方向の分割線110および横方向の分割線112に沿って切断することによって、個々の本発明のPTCデバイス10を得ることができる。このようにPTCデバイスが縦・横で相互に隣接した状態の圧着体を形成し、その後、分割することによって、PTCデバイスを効率よく製造できる。 The individual PTC devices 10 of the present invention can be obtained by cutting the pressure-bonded body 102 thus plated, along the dividing line 110 in the vertical direction and the dividing line 112 in the horizontal direction. Thus, a PTC device can be efficiently manufactured by forming the press-bonded body in a state where the PTC devices are adjacent to each other in the vertical and horizontal directions, and then dividing them.
 四半分円筒状凹部をPTC素子の所定の箇所に形成することを除いて、上述のような圧着体の形成、穿孔およびメッキ処理等によって、図5および図6に示すように、PTC素子の層状電極がキャスタレーション電極に電気的に接続された構造を有するPTCデバイスを製造する方法は基本的には既知であり、例えば上記特許文献1等と参照できる。 Except for forming a quarter-cylindrical recess at a predetermined location of the PTC element, the layered structure of the PTC element as shown in FIGS. A method of manufacturing a PTC device having a structure in which an electrode is electrically connected to a castellation electrode is basically known, and can be referred to, for example, Patent Document 1 described above.
 尚、本発明のPTCデバイスは、PTC要素が硬質である場合に特に効果的である。即ち、PTC要素を構成する導電性ポリマー組成物が比較的硬質のポリマーを含んで成る場合、例えばポリフッ化ビニリデン樹脂(PVDF)を含む場合、より軟質な樹脂(例えばポリエチレン)と比較して、PTC要素の膨張・収縮によって発生する応力を緩和し難いので、PTCデバイスにおいて四半分円筒状凹部を設け、そこにキャスタレーション電極を形成するのが有効である。 The PTC device of the present invention is particularly effective when the PTC element is hard. That is, when the conductive polymer composition constituting the PTC element includes a relatively hard polymer, for example, when it includes polyvinylidene fluoride resin (PVDF), compared to a softer resin (for example, polyethylene), PTC Since it is difficult to relieve the stress generated by the expansion / contraction of the element, it is effective to provide a quarter cylindrical recess in the PTC device and form a castellation electrode there.
10…PTCデバイス、11…PTC素子、12,14…半円筒状凹部分、
16,18…側方金属層部分、20,22,24,26…端部金属層部分、28…基板、
30…パッド、32…ハンダ接続部、34…ハンダ部分、36…第1四半分円筒状凹部、
37…第2四半分円筒状凹部、40,41…側面、42…第1端部、44…第2端部、
46…一方の端部、48…他方の端部、50…第1キャスタレーション電極、
52…第2キャスタレーション電極、54…層状PTC要素、56…第1層状電極、
58…第2層状電極、60…PTCユニット、62…第1絶縁層、64…第2絶縁層、
66…PTC素子、68…第1層状電極の端部、70…第2層状電極の端部、
72…側方金属層部分、74,76…端部金属層部分、78,80…層状PTC要素、
82,84…第1層状電極、86,88…第2層状電極、90,92…PTCユニット、
94,96,98…絶縁層、100…金属層の一部分、102…圧着体、
104…扇形状部分、106…より大きい矩形のメッキ層。 
10 ... PTC device, 11 ... PTC element, 12, 14 ... Semi-cylindrical concave portion,
16, 18 ... Side metal layer portion, 20, 22, 24, 26 ... End metal layer portion, 28 ... Substrate,
30 ... Pad, 32 ... Solder connection part, 34 ... Solder part, 36 ... First quarter cylindrical recess,
37 ... 2nd quarter cylindrical recessed part, 40, 41 ... Side surface, 42 ... 1st edge part, 44 ... 2nd edge part,
46 ... one end, 48 ... the other end, 50 ... the first castellation electrode,
52 ... second castellation electrode, 54 ... layered PTC element, 56 ... first layer electrode,
58 ... second layered electrode, 60 ... PTC unit, 62 ... first insulating layer, 64 ... second insulating layer,
66 ... PTC element, 68 ... end of the first layered electrode, 70 ... end of the second layered electrode,
72 ... side metal layer part, 74, 76 ... end metal layer part, 78, 80 ... layered PTC element,
82, 84 ... first layered electrode, 86, 88 ... second layered electrode, 90, 92 ... PTC unit,
94, 96, 98 ... insulating layer, 100 ... part of the metal layer, 102 ... pressure-bonded body,
104 ... Fan-shaped part, 106 ... Larger rectangular plating layer.

Claims (6)

  1.  層状PTC要素およびその両側の表面上にそれぞれ配置された第1層状電極および第2層状電極を有して成るPTCユニット、ならびに各層状電極の外側に位置する絶縁層を有するPTC素子を有して成るPTCデバイスであって、
     PTC素子は、第1端部および第2端部を有し、第1端部にて、その各角部分に第1四半分円筒状凹部を有し、また、第2端部にて、その角部分に第2四半分円筒状凹部を有し、
     各第1四半分円筒状凹部は、第1層状電極に電気的に接続された第1キャスタレーション電極を有し、また、各第2四半分円筒状凹部は、第2層状電極に接続された第2キャスタレーション電極を有する
    ことを特徴とするPTCデバイス。
    A PTC unit having a layered PTC element and a first layered electrode and a second layered electrode respectively disposed on the surfaces of the layered PTC element, and a PTC element having an insulating layer positioned outside each layered electrode A PTC device comprising:
    The PTC element has a first end and a second end, the first end has a first quarter cylindrical recess at each corner, and the second end Having a second quarter cylindrical recess in the corner,
    Each first quarter cylindrical recess has a first castellation electrode electrically connected to the first layered electrode, and each second quarter cylindrical recess is connected to the second layered electrode A PTC device comprising a second castellation electrode.
  2.  複数の層状PTC要素および各PTC要素の両側の表面上にそれぞれ配置された第1層状電極および第2層状電極を有して成る複数のPTCユニット、ならびにこれらのPTCユニットを間に挟んで離隔するようにPTCユニットの間に配置された絶縁層が積層された積層体としてのPTC素子を有して成り、
     PTC素子は、第1端部および第2端部を有し、
     PTC素子は、第1端部にて、その各角部分に第1四半分円筒状凹部を有し、また、第2端部にて、その角部分に第2四半分円筒状凹部を有し、
     各第1四半分円筒状凹部は、各PTC要素の第1層状電極に電気的に接続された第1キャスタレーション電極を有し、また、各第2四半分円筒状凹部は、第2層状電極に接続された第2キャスタレーション電極を有する
    ことを特徴とするPTCデバイス。
    A plurality of PTC units having a plurality of layered PTC elements, a plurality of PTC units each having a first layered electrode and a second layered electrode disposed on both sides of each PTC element, and the PTC units being spaced apart And having a PTC element as a laminate in which insulating layers arranged between PTC units are laminated,
    The PTC element has a first end and a second end,
    The PTC element has a first quarter cylindrical recess at each corner portion at the first end and a second quarter cylindrical recess at the corner portion at the second end. ,
    Each first quarter cylindrical recess has a first castellation electrode electrically connected to the first layered electrode of each PTC element, and each second quarter cylindrical recess has a second layered electrode And a second castellation electrode connected to the PTC device.
  3.  各キャスタレーション電極は、四半分円筒状凹部を規定する側面に形成した側方金属層部分およびPTC素子の一方の主表面の端部上に延在する端部金属層部分を有して成ることを特徴とする請求項1または2に記載のPTCデバイス。 Each castellation electrode has a side metal layer portion formed on a side surface defining a quarter-cylindrical concave portion and an end metal layer portion extending on an end portion of one main surface of the PTC element. The PTC device according to claim 1, wherein:
  4.  端部金属層部分は、金属箔部分およびその上に形成された金属メッキ層部分を有して成ることを特徴とする請求項3に記載のPTCデバイス。 The PTC device according to claim 3, wherein the end metal layer portion includes a metal foil portion and a metal plating layer portion formed thereon.
  5.  側方金属層部分は、金属メッキ層により形成されていることを特徴とする請求項3または4に記載のPTCデバイス。 5. The PTC device according to claim 3, wherein the side metal layer portion is formed of a metal plating layer.
  6.  層状PTC要素は、ポリフッ化ビニリデンを含んで成る導電性ポリマー組成物から形成されていることを特徴とする請求項1~5のいずれかに記載のPTCデバイス。 The PTC device according to any one of claims 1 to 5, wherein the layered PTC element is formed of a conductive polymer composition containing polyvinylidene fluoride.
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CN103918040A (en) 2014-07-09
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KR20140067107A (en) 2014-06-03
KR101892789B1 (en) 2018-08-28

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