WO2013039052A1 - Boîtier et dispositif électroluminescent - Google Patents

Boîtier et dispositif électroluminescent Download PDF

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Publication number
WO2013039052A1
WO2013039052A1 PCT/JP2012/073153 JP2012073153W WO2013039052A1 WO 2013039052 A1 WO2013039052 A1 WO 2013039052A1 JP 2012073153 W JP2012073153 W JP 2012073153W WO 2013039052 A1 WO2013039052 A1 WO 2013039052A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded body
resin molded
lead
package
portions
Prior art date
Application number
PCT/JP2012/073153
Other languages
English (en)
Japanese (ja)
Inventor
一徳 梅田
加藤　幸男
森　寛
Original Assignee
三菱化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱化学株式会社 filed Critical 三菱化学株式会社
Publication of WO2013039052A1 publication Critical patent/WO2013039052A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Definitions

  • the present invention relates to a package and a light emitting device made of a resin molded body on which a semiconductor light emitting element such as an LED element is mounted.
  • the step 102a and the sharp protrusion 102b are provided at the end of the lead frame 102, there is a slight effect on preventing the lead frame 102 from peeling, but the lead frame 102 is thin and thick. Therefore, the allowance for the stepped portion 102a and the protruding portion 102b inside the resin molded body 101 is reduced, and the lead frame 102 is prevented from peeling or floating depending on the material used for molding the resin molded body 101. I could not.
  • the cured resin molded body 101 is soft and brittle, so that the package 100 is likely to be damaged at the entrance portion of the stepped portion 102a and the protruding portion 102b. .
  • the rigidity of the package may be partially reduced, and damage due to bending or bending may occur.
  • the resin molded body is molded using a resin material having a low elastic modulus
  • the positive and negative lead frames 202A electrically connected to the electrodes of the light emitting element 201 as shown in FIG. , 202B is arranged in the center of the resin molded body 203 in a band shape, and is bent or bent at a boundary portion (XX portion in the figure) where the end portions of both lead frames 202A and 202B meet.
  • the package 200 which is easy to break, and is formed by branching the end of one lead frame 202B into a crotch shape and arranging the other lead frame 202A in a strip shape as shown in FIG. Further, chipping damage was likely to occur due to bending or bending at the corners (YY portion in the figure) of the resin molded body 203 on both sides of the belt-like lead frame 202A.
  • the present invention makes it difficult for a lead frame to peel off or float inside a resin molded body in a package for a semiconductor device formed by molding a resin molded body integrally with a lead frame.
  • the present invention is a package having a concave portion where a light emitting element is mounted on an upper surface, and a lead frame and a resin molded body are integrally molded, and the inner lead constituting the lead frame It is characterized in that an edge bent portion bent upward from the bottom of the inner lead portion is provided at the edge of the portion embedded in the resin molded body of the portion.
  • the edge bent portion bent upward is provided at the edge portion of the inner lead portion, the margin of the edge portion of the inner lead portion in the resin molded body is ensured, and the resin molded body and Bonding with the lead frame becomes strong, and the lead frame can be prevented from peeling off or floating.
  • the inner lead portion with an end bending portion that is an allowance in the resin molded body, the outer lead portion that is a terminal connecting the package and the external circuit is disposed along the bottom surface of the resin molded body, An electrode contact surface can be secured on the mounting surface of the package.
  • the end bent portion provided in the inner lead portion is formed at a position embedded in the resin molded body, and the end bent portion is the inner portion in order to strengthen the bonding between the resin molded body and the lead frame. It is preferable to form it on both side edges of the lead part.
  • End bent portions provided on both side edge portions of the lead frame of both poles are in a form that is bent integrally over the entire side edge of the inner lead portion, or bent at an appropriate width along the side edge. It is also possible to use a configuration in which two or more are provided at predetermined intervals. When a plurality of end bent portions are provided along both side edges of the inner lead portion, the end bent portions are arranged on opposite sides of the inner lead portion, that is, the end bent portions are symmetrically provided on both sides of the inner lead portion. By arranging the, it is possible to effectively prevent one side of the lead frame from peeling or floating from the resin molded body.
  • the resin molded body is formed in a substantially square shape in plan view, and the die pad portion provided integrally with the anode lead frame or the cathode lead frame is disposed in the recessed portion provided in the center thereof.
  • the outer lead portions of the lead frames of the two poles are protruded outward from the resin molded body from one opposing side wall of the four side walls of the resin molded body, When projecting the inner lead portions of the lead frames of the two electrodes embedded in the resin molded body on the bottom surface of the resin molded body, On the line segment passing through the center of the resin molded body orthogonal to the other opposing side wall of the resin molded body, the inner surface of the two poles disposed on both sides of the projection surface of the die pad portion and the die pad portion therebetween
  • the positive and negative lead frames are arranged so that there is a projection surface at the boundary portion of the lead portion and a projection surface of the anode inner lead portion or the cathode inner lead portion arranged outside the both boundary portions. It is characterized by that.
  • the resin molded body is formed in a substantially square shape in plan view, and is provided integrally with the anode lead frame or the cathode lead frame in a recessed portion provided in the center thereof.
  • the die pad portion is arranged, and the outer lead portions of the lead frames of both the poles are respectively protruded outward from the resin molded body from one opposing side wall of the four side walls of the resin molded body.
  • the positive and negative lead frames are arranged so that the projected surface of the boundary between the inner lead portions of the two poles facing the die pad portion is bent into a substantially V shape or U shape.
  • the boundary part where the ends of the inner lead part of both the positive and negative electrodes collide is either on the axis along the boundary. Since the inner lead portion of the first electrode is disposed, the rigidity along the boundary portion is increased, and bending and bending along the boundary portion are less likely to occur.
  • the inner lead part of either the positive or negative pole is arranged over the entire inside of the resin molded body, so that the rigidity of the entire resin molded body is increased and the package is damaged or bent at the corners of the package. Is less likely to occur.
  • the resin molded body is formed in a substantially square shape in plan view, and the inner lead portion is embedded in the vicinity of the four corner portions and the peripheral side wall.
  • the rigidity in the vicinity of the outer wall of the resin molded body is increased, and it is effective that the vicinity of the outer wall is broken or broken due to bending or bending. Can be prevented.
  • the light-emitting device of the present invention is formed by mounting a light-emitting element on the package having the above structure.
  • a light emitting element is mounted on a die pad portion disposed in the recessed portion of the package, and the electrode portion of the light emitting element and the electrode portion of the lead frame are electrically connected by a wire and sealed in the recessed portion.
  • the light emitting element and the wire portion can be covered with a sealing material and filled with a material.
  • Silicone resin is suitable as the molding material of the package of the present invention, and as the sealing material of the light emitting device, an epoxy resin having transparency and a sealing material made of silicone, and an inorganic filler for these. A compounded resin or the like can be used.
  • FIG. 2 is a schematic sectional view taken along line II-II in FIG. 1.
  • FIG. 2 is an external view of a lead frame constituting the package of FIG. 1.
  • FIG. 4 is an external view of a lead frame constituting plate constituting the lead frame of FIG. 3.
  • FIG. 2 is a schematic plan view showing an arrangement of lead frames in a resin molded body of the package of FIG. 1.
  • (A) to (D) are schematic cross-sectional views of a package showing a modified example of an end bent portion.
  • FIG. 5A is a schematic plan view of a package according to a second embodiment of the present invention, wherein FIGS.
  • (A), (B) is the package of 3rd Embodiment of this invention, Comprising: The schematic plan view and schematic sectional drawing which showed arrangement
  • (A), (B) is a schematic sectional drawing of the conventional package.
  • (A), (B) is the schematic plan view and sectional drawing which show arrangement
  • FIG. 1 to 9 show the case where the present invention is applied to a package of a light emitting device on which an LED element is mounted.
  • reference numeral 1 denotes a package
  • 2 denotes a resin molded body
  • 3 denotes a lead frame
  • 4 denotes an LED element
  • the illustrated package 1 has a recess 21 on the upper surface where the LED element 4 is mounted.
  • the lead frame 3 is embedded in the resin molded body 2 having a substantially square shape in plan view and integrally molded.
  • the resin molding 2 can be molded preferably using a silicone resin excellent in reflection characteristics, UV resistance characteristics, and heat resistance.
  • this invention is applicable also when shape
  • the lead frame 3 may be made of, for example, a conductive metal strip such as a copper alloy and may be formed by plating the surface with silver, a silver-palladium alloy, a gold-palladium alloy, or the like.
  • FIG. 1 to 4 show a package 1 according to a first embodiment of the present invention.
  • This package 1 is bent upward at an edge of an inner lead portion 32 embedded in a resin molded body 2 of a lead frame 3.
  • the end bent portion 32a is provided.
  • the lead frame 3 includes an outer lead portion 31 connected to an external circuit, an inner lead portion 32 to which a wiring with the LED element 4 is connected, and a die pad portion 34 to which the LED element 4 is attached and supported. ing. Specifically, as shown in FIGS. 2 and 3, the lead frame 3 includes an anode lead frame 3 ⁇ / b> A and a cathode lead frame 3 ⁇ / b> B that are electrically connected to both the positive and negative electrodes of the LED element 4.
  • the leg pieces 32c are arranged on the left side via the end bent portions 32a, and the leg pieces 32b of the lead frames of both poles are provided in a shape extending in a band shape to a position close to the leg pieces 32c of the other pole lead frame.
  • a terminal lead portion 33 is provided in the surface of the leg piece 32b of the inner lead portion 32 to be electrically connected to the electrode of the LED element 4 by wire bonding.
  • the anode lead frame 3A is provided with a die pad portion 34 attached to and supported by the other end portion facing the outer lead portion 31, which is connected to the inner lead portion 32 in a band shape and is attached to the LED element 4.
  • the package 1 is provided with a lead frame constituting plate 3C formed by punching the conductive metal strip shown in FIG. 4 in the shape of the lead frame 3 in a plurality of vertical and horizontal rows in a molding die.
  • the outer lead portions 31, 31 that are formed by injecting resin into the cavities of each lead frame and curing them, and molding the resin molded body 2 integrally with each lead frame 3 and projecting outward from the peripheral surface of the package 1. By cutting from the lead frame constituting plate 3C, it is handled as an individual package 1.
  • the molded package 1 has terminal lead portions 33, 33 of the lead frames 3 ⁇ / b> A, 3 ⁇ / b> B of the bipolar electrodes in a recessed portion 21 formed on the upper surface of the resin molded body 2.
  • the die pad part 34 to which the LED element 4 is mounted is arranged, and the outer lead parts 31, 31 are externally attached from one opposing side wall 2 a, 2 a of the four side walls of the resin molded body 2 having a substantially square shape in plan view.
  • the inner lead parts 32, 32 of both poles, in which the leg pieces 32b, 32c are continuously provided via the end bent parts 32a, 32a, are embedded in the resin molded body 2.
  • the outer lead portions 31 are arranged along the bottom surface of the resin molded body 2 that becomes the mounting surface of the package.
  • the arrangement of the lead frames 3A and 3B of the two poles in the resin molded body 2 of the package 1 is such that the leg pieces 32b and 32b are arranged on both sides of the die pad portion 34 disposed at the center of the recessed portion 21 of the resin molded body 2. Is arranged in parallel with an appropriate interval. Specifically, as shown in FIG. 5, when the inner lead portions 32 and 32 of the bipolar lead frames 3A and 3B embedded in the resin molded body 2 are projected onto the bottom surface of the resin molded body 2, On the line Y passing through the center O of the resin molded body 2 orthogonal to the other opposite side walls 2b, 2b of the resin molded body 2, the projection surface of the die pad part 34 and the both sides of the die pad part 34 are arranged.
  • the leg pieces 32b and 32c of the inner lead portions 32 and 32 of both poles are arranged so as to be embedded at positions close to the four corners and the peripheral side wall of the resin molded body 2.
  • the package 1 thus formed includes, for example, a step of mounting the LED element 4 on the die pad portion 34, a step of connecting the electrode of the LED element 4 and the terminal lead portions 33 and 33 with wires, and a sealing material in the recessed portion 21. Can be processed into a light emitting device through each step of covering the terminal lead portions 33, 33 connected to the LED element 4 by wires.
  • the end bent portions 32a and 32a bent upward are provided on both side edges of the inner lead portions 32 and 32 of the positive and negative lead frames 3A and 3B.
  • the margin of the edge portion of the inner lead portions 32, 32 in the molded body 2 is ensured, and the bonding strength between the resin molded body 2 and the lead frames 3A, 3B of both electrodes is increased. 3B becomes difficult to peel off.
  • the boundary portion where the end portions of the inner lead portions 32, 32 of the lead frames 3 ⁇ / b> A, 3 ⁇ / b> B of the two poles meet in the resin molded body 2 is either on the axis along the boundary.
  • the inner lead portions 32 and 32 of the poles are arranged, the rigidity along the boundary portion is increased, and bending and folding are hardly generated along the boundary portion, and the inner lead portions 32 and 32 are further brought close to the outer peripheral wall of the resin molded body 2. Since the inner lead portions 32 and 32 are embedded at the positions, the rigidity of the resin molded body 2 near the outer wall is increased, and the vicinity of the outer wall can be effectively prevented from being broken or broken due to bending or breaking. And the yield of the light-emitting device which processed this can be improved, and reliability can be improved.
  • FIG. 6 shows a modification of the end bent portion 32 a provided at the edge of the inner lead portion 32.
  • the end bent portion 32a is formed in a shape in which the end portion of the inner lead portion 32 of the lead frame 3 is bent by punching and lifted upward.
  • the end bending portion 32a and the leg pieces 32b and 32c are deeply embedded in the resin molded body 2 as shown in FIG. May be.
  • the end bent portion 32a bent obliquely upward at the edge of the inner lead portion 32, As shown in FIG. 4D, even in the end bent portion 32a in which the edge portion of the inner lead portion 32 is bent upward at a right angle, a large allowance for the resin molded body 2 is secured, and the lead frame 3 is peeled off. It is effective for prevention.
  • FIG. 7 shows a package 1 according to the second embodiment of the present invention and its modification, and the illustrated package 1 is embedded almost completely in the resin molded body 2 as positive and negative lead frames 3A and 3B.
  • the frame is formed integrally with the resin molded body 2 having the same shape as that of the above-described form, and the inner lead portions 32 and 32 embedded in the resin molded body 2 are formed similarly to the above-described form.
  • End bent portions 32a are provided on both side edges.
  • end bent portions 32a, 32a are provided over the entire side edges of the inner lead portions 32, 32 of the lead frames 3A, 3B of both poles.
  • FIG. 3A end bent portions 32a, 32a are provided over the entire side edges of the inner lead portions 32, 32 of the lead frames 3A, 3B of both poles.
  • end bent portions 32a and 32a are provided with appropriate widths only on both side edges of the inner lead portions 32 and 32 near the center of the resin molded body 2.
  • end bent portions 32a and 32a are provided with appropriate widths only on both side edges of the inner lead portions 32 and 32 near both ends of the resin molded body 2.
  • end bent portions 32a and 32a are arranged on both side edges of the inner lead portions 32 and 32 near the center and near both ends of the resin molded body 2.
  • the end bent portions 32a and 32a are provided at symmetrical positions on both side edges of the inner lead portions 32 and 32, respectively.
  • FIG. 8 shows a package 1 according to a third embodiment of the present invention.
  • the illustrated package 1 includes positive and negative lead frames 3A and 3B, and four corners of the resin molded body 2 of the resin molded body 2.
  • a wide one is used so as to be embedded in the vicinity of the peripheral side wall, and end bent portions 32a and 32a bent upward are provided at both side edges of the inner lead portions 32 and 32, respectively.
  • the projection surface at the boundary between the inner lead portions 32, 32 of the two poles facing the die pad portion 34 is substantially V-shaped to U-shaped.
  • Lead frames 3A and 3B are arranged so as to be bent into a letter shape. In FIGS.
  • the boundary portions of the inner lead portions 32 and 32 are both provided obliquely in plan view, and the inner lead portions 32 and 32 of either one of the two poles on the axis along the boundary. Accordingly, the rigidity along the boundary portion is increased, and the inner lead portions 32 and 32 are embedded at positions close to the outer peripheral wall of the resin molded body 2. Therefore, the rigidity in the vicinity of the outer wall of the resin molded body 2 is increased, and chipping damage in the vicinity of the outer wall can be made difficult to occur.
  • FIG. 9 shows a package 1 according to a fourth embodiment of the present invention, which is an edge portion of the inner lead portions 32 and 32 of the positive and negative lead frames 3A and 3B, and its leg pieces.
  • 32b and 32c are provided with end bent portions 32a bent upward, and the resin molded body 2 can also be provided by providing the end bent portions 32a inside the leg pieces 32c and 32c in this way. It is possible to secure a large allowance for joining, to increase the joining strength between the resin molded body 2 and the lead frames 3A, 3B of both poles, and to effectively prevent the lead frames 3A, 3B from peeling off.
  • the package 1, the resin molded body 2, and the lead frame 3 shown in the figure are examples of the embodiment of the present invention, and the present invention is not limited to this, and can be configured in other appropriate forms. It is.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention a trait à un boîtier destiné à un dispositif électroluminescent qui est moins sujet à la fissuration et à la cassure causées par la desquamation et/ou le montage d'une grille de connexion à l'intérieur d'un corps moulé de résine, et qui améliore la fiabilité du boîtier. Le boîtier (1) selon la présente invention comprend, dans la surface supérieure, une partie en retrait (21) sur laquelle un élément électroluminescent (4) doit être monté et qui est constituée par moulage d'une seule pièce d'une grille de connexion (3) et d'un corps moulé de résine (2). Le boîtier (1) est structuré de sorte que les deux bords latéraux d'une portion d'une partie de broche de raccordement intérieure (32), qui constitue la grille de connexion (3), qui est logée dans le corps moulé de résine (2) soient pourvus de parties courbées de borne (32a, 32a) respectives qui sont courbées vers le haut à partir du fond de la partie de broche de raccordement intérieure (32).
PCT/JP2012/073153 2011-09-15 2012-09-11 Boîtier et dispositif électroluminescent WO2013039052A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011201661 2011-09-15
JP2011-201661 2011-09-15

Publications (1)

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WO2013039052A1 true WO2013039052A1 (fr) 2013-03-21

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TW (1) TW201324879A (fr)
WO (1) WO2013039052A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3000579B1 (fr) 2014-09-29 2019-04-17 Nichia Corporation Procédé de fabrication de boîtier, procédé de fabrication de dispositif émetteur de lumière, boîtier et dispositif émettant de la lumière
JP6260593B2 (ja) 2015-08-07 2018-01-17 日亜化学工業株式会社 リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法
JP6337873B2 (ja) 2015-11-30 2018-06-06 日亜化学工業株式会社 パッケージ、パッケージ中間体、発光装置及びそれらの製造方法
JP6332251B2 (ja) 2015-12-09 2018-05-30 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
JP6332253B2 (ja) 2015-12-09 2018-05-30 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
JP6394634B2 (ja) 2016-03-31 2018-09-26 日亜化学工業株式会社 リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法

Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2000195894A (ja) * 1998-12-24 2000-07-14 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2003174200A (ja) * 2001-12-07 2003-06-20 Hitachi Cable Ltd 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
JP2004214380A (ja) * 2002-12-27 2004-07-29 Polyplastics Co リードフレーム形成用金属箔、電子部品用パッケージ、その製造方法、及び表面実装型発光部品
JP2010226011A (ja) * 2009-03-25 2010-10-07 C I Kasei Co Ltd 発光装置用リードフレーム、発光装置用パッケージ、および発光装置
JP2011003935A (ja) * 2006-04-17 2011-01-06 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージ及びその製造方法
JP2012084810A (ja) * 2010-10-14 2012-04-26 Toppan Printing Co Ltd Ｌｅｄ素子用リードフレーム基板及び発光素子

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195894A (ja) * 1998-12-24 2000-07-14 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2003174200A (ja) * 2001-12-07 2003-06-20 Hitachi Cable Ltd 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
JP2004214380A (ja) * 2002-12-27 2004-07-29 Polyplastics Co リードフレーム形成用金属箔、電子部品用パッケージ、その製造方法、及び表面実装型発光部品
JP2011003935A (ja) * 2006-04-17 2011-01-06 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージ及びその製造方法
JP2010226011A (ja) * 2009-03-25 2010-10-07 C I Kasei Co Ltd 発光装置用リードフレーム、発光装置用パッケージ、および発光装置
JP2012084810A (ja) * 2010-10-14 2012-04-26 Toppan Printing Co Ltd Ｌｅｄ素子用リードフレーム基板及び発光素子

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TW201324879A (zh) 2013-06-16

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