WO2013029073A1 - Procédé d'intégration d'un composant dans une carte à circuit imprimé ou dans un produit intermédiaire de carte à circuit imprimé, ainsi que carte à circuit imprimé ou produit intermédiaire de carte à circuit imprimé - Google Patents

Procédé d'intégration d'un composant dans une carte à circuit imprimé ou dans un produit intermédiaire de carte à circuit imprimé, ainsi que carte à circuit imprimé ou produit intermédiaire de carte à circuit imprimé Download PDF

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Publication number
WO2013029073A1
WO2013029073A1 PCT/AT2012/000225 AT2012000225W WO2013029073A1 WO 2013029073 A1 WO2013029073 A1 WO 2013029073A1 AT 2012000225 W AT2012000225 W AT 2012000225W WO 2013029073 A1 WO2013029073 A1 WO 2013029073A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
component
integrated
layer
Prior art date
Application number
PCT/AT2012/000225
Other languages
German (de)
English (en)
Inventor
Johannes Stahr
Andreas Zluc
Friedrich Wolfsberger
Arno KRIECHBAUCH
Mike Morianz
Nikolai Haslebner
Christian GALLER
Erich SCHLAFFER
Gregor Langer
Michael Monschein
Gerhard Schmid
Original Assignee
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & S Austria Technologie & Systemtechnik Aktiengesellschaft filed Critical At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority to DE112012003597.6T priority Critical patent/DE112012003597A5/de
Publication of WO2013029073A1 publication Critical patent/WO2013029073A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Definitions

  • the present invention relates to a method for integrating at least one component into a printed circuit board or a printed circuit board intermediate product as well as to a printed circuit board or a printed circuit board intermediate product.
  • a component or component When integrating components into a printed circuit board or a printed circuit board intermediate product such a component or component was originally arranged on a layer or layer of a printed circuit board, the thickness of such a component the thickness of at least one layer or layer Sheath of the same particular.
  • a jacket was made in known embodiments of an insulating or non-conductive material, resulting in a corresponding increase in the total thickness of the printed circuit board or the printed circuit board intermediate product.
  • the present invention therefore aims to eliminate or at least minimize the above-mentioned problems in integrating or picking up a component into a printed circuit board or a printed circuit board intermediate product, and in particular aims to provide a method of the type mentioned at the beginning
  • To provide printed circuit board or a printed circuit board intermediate product in which not only a simple and reliable arrangement of such a component in a printed circuit board or in a printed circuit board intermediate product is made possible, but also for components with particular large thickness reduction or minimization the entire thickness of the printed circuit board or the printed circuit board intermediate product to be produced can be achieved. Furthermore, an improved accessibility of the component to be embedded is targeted.
  • a method of the type initially mentioned essentially comprises the following steps:
  • circuit board element having the recess for receiving the component to be integrated is formed by at least one non-conductive layer of the printed circuit board or of the intermediate printed circuit board to be produced.
  • a component to be integrated or a component to be integrated can be defined in a recess of a printed circuit board element or coupled with the printed circuit board element to be integrated in a simple and reliable manner.
  • the possibility is given, even with the use of a comparatively large thickness having components to be integrated subsequently a circuit board or to provide a printed circuit board intermediate with a correspondingly reduced overall height.
  • a component of large thickness can be reliably integrated within the printed circuit board element, consisting of at least one non-conductive layer of the printed circuit board to be produced or printed circuit board intermediate product, wherein corresponding to the component to be integrated, the printed circuit board element having the recess with a corresponding, possibly large thickness provided.
  • the component to be integrated can be reliably and positionally integrated within the surrounding printed circuit board element which consists of at least one non-conductive layer.
  • a connection or coupling of the component to be integrated with the printed circuit board element is performed.
  • the at least one additional layer be laminated with the component to be integrated and the printed circuit board element, as corresponds to a further preferred embodiment of the method according to the invention.
  • Such laminating between individual layers or layers of a multilayer printed circuit board are seen in the Production of a printed circuit board known, so that the method according to the invention for integrating a component in a printed circuit board or a printed circuit board intermediate can be implemented with known method steps.
  • a material preventing the further layer from adhering is applied to the component to be integrated before an additional layer is arranged.
  • the portion to be subsequently exposed is supported against a firm bond with the overlaying additional layer, such that by simple process steps known in the manufacture of a printed circuit board, such as milling or the like, the overlapping additional layer can be easily removed in the area to be exposed or freed to be integrated component.
  • the component to be integrated is at least partially exposed after the formation or arrangement of the additional layer, in particular by forming apertures in the additional layer and / or by partial removal.
  • an embedding or receiving of the component to be integrated in the printed circuit board element results in a further arrangement of layers or layers and connection thereof to produce the printed circuit board.
  • the supporting layer is removed after a connection or coupling of the component to be integrated with the printed circuit board element.
  • the supporting layer is used essentially only for a provisional support, whereupon, after removal thereof, a construction of further layers or layers which cover both the embedded component and the surrounding printed circuit board element can be undertaken.
  • the supporting layer is formed by a particular multilayer film, which consists in particular of at least one conductive and at least one non-conductive layer, which after determining the component to be integrated and the printed circuit board element, a portion of forms printed circuit board or the printed circuit board intermediate product to be produced.
  • the supporting layer can be used directly as a film for further production or for further construction of the printed circuit board or of the printed circuit board intermediate to be produced, wherein, for example, the conductive layer of this supporting multilayer film can also be subjected to a corresponding structuring.
  • the component to be integrated is an active component such as an electronic component, an opto-electronic component, a chip, a sensor, a component integrated into a core element, or a passive component, such as a cooling element, a hollow body defining a passageway, in particular consisting of glass or ceramic, or the like. Is formed.
  • contacts of the component to be integrated or a particular conductive layer thereof after connection to the printed circuit board element with conductive areas of the printed circuit board to be produced or the printed circuit board intermediate to be produced is or will be coupled, as corresponds to a further preferred embodiment of the method according to the invention.
  • the component to be integrated and the printed circuit board element be mediated by an adhesive, an adhesive film, an adhesive coating Soldering or the like. Be fixed on the supporting layer.
  • the connection means to be used can take place depending on whether the supporting layer is used only for a provisional support or optionally for a further construction of the multilayer printed circuit board.
  • an adhesive layer or film or coating is formed with a thickness of at most 15 ⁇ m, in particular approximately 0.1 to 10 ⁇ m, as described in a further preferred embodiment of the according to the invention.
  • an adhesive layer is applied by ink, flex, gravure, screen or offset printing.
  • the component to be integrated is positioned on the supporting layer relative to markings on the supporting layer and / or on the printed circuit board element having the recess, as is the case of a further preferred embodiment of FIG according to the invention.
  • the inventive arrangement or embedding of a component to be integrated in a printed circuit board element formed by at least one non-conductive layer makes it possible to reduce or minimize the entire thickness of the printed circuit board to be produced even when large dimensions and in particular large thicknesses are used having components to be integrated.
  • the thickness of the printed circuit board element having the recess for receiving the component to be integrated is at least selected according to the thickness of the component to be integrated.
  • a printed circuit board or a printed circuit board intermediate product is furthermore characterized in that a component to be integrated is accommodated in a recess of a printed circuit board element, whereby the printed circuit board element comprising the recess for receiving the component to be integrated has at least a non-conductive layer of the printed circuit board or of the printed circuit board intermediate product to be produced is formed.
  • a further layer or position of the printed circuit board or the printed circuit board intermediate product is provided, so that in addition to a simple and reliable integration of the component to be integrated, a achieve reliable connection between the component and the surrounding circuit board element.
  • contacts or a conductive layer of the component to be integrated be connected or coupled to further layers of the printed circuit board or the printed circuit board intermediate product, as this is another preferred embodiment of the inventive printed circuit board or the printed circuit board intermediate according to the invention.
  • the component to be integrated of an active component such as an electronic component, an opto-electronic component, a Chip, a sensor, a component integrated in a core element, or a passive component, such as a cooling element, a passageway defining hollow body, in particular made of glass or ceramic, or the like. Is formed.
  • an active component such as an electronic component, an opto-electronic component, a Chip, a sensor, a component integrated in a core element, or a passive component, such as a cooling element, a passageway defining hollow body, in particular made of glass or ceramic, or the like.
  • FIG. 2a to 2b similar to the steps which are shown in Figures 1 a and 1 b, a modified embodiment of a method according to the invention for producing a printed circuit board according to the invention.
  • FIGS. 3 and 4 show different embodiments of printed circuit boards or printed circuit board intermediates to be produced according to the method of the invention
  • FIG. 7 shows schematic views of different components which can be integrated into a printed circuit board according to the invention, for defining cavities to be provided in a printed circuit board to be produced;
  • Fig. 10 in a view similar to Fig. 9 is a further partial section through a further modified embodiment of a printed circuit board intermediate according to the invention, to be produced according to a method of the invention.
  • an adhesive layer or adhesive film 2 is applied to a supporting layer 1.
  • a conductive layer for example made of copper 3, which has a recess corresponding to the component 4 to be integrated or to be integrated.
  • the component 4 to be integrated is formed, for example, by an IMS substrate, which is used, for example, for high dielectric strengths and heat dissipation for cooling of corresponding elements.
  • the component 4 to be integrated likewise has, in accordance with the height or thickness of the copper layer 3, a copper layer 5 which, as will be discussed below, is used for contacting with further conductive layers of the printed circuit board to be produced.
  • a layer 6 of a material preventing adhesion is provided on the component 4 to be integrated on the side remote from the supporting or carrier layer.
  • a reliable positioning of the component 4 to be embedded in the printed circuit board to be produced or the printed circuit board intermediate product to be produced takes place by a precisely fitting arrangement in the recess 7 of the layer 3 provided on the supporting layer.
  • markings may be provided, such as those shown in FIG the layer 3 are indicated.
  • a printed circuit board element 9 is arranged on the layer 3, wherein the printed circuit board element 9 consists of a plurality of non-conductive layers consists.
  • This printed circuit board element 9 has, according to the dimensions of the component 4 to be integrated, a recess 10, so that the component 4 to be integrated can also be reliably positioned relative to the printed circuit board element 9.
  • a further conductive layer 1 for example, in turn, of copper is additionally indicated.
  • Fig. 1 c in addition to a compound of the individual layers of the printed circuit board element 9 and a filling of free spaces, as can be seen in Fig. 1 b, by the non-conductive material of the printed circuit board element 9 also a Structuring of the conductive layer 1 1 according to the dimensions of the component to be integrated 4.
  • Fig. 1 c in addition, in the process step shown in Fig. 1 c can be seen that the provided only for a provisional support backing layer 1 as well as the adhesive layer 2 after completion of the lamination or Pressing step was removed.
  • partial removal of the conductive or copper layer 11 exposes the component 4 to be integrated at the side or surface facing away from the layer 13, corresponding to the contours of the component to be integrated 4, for example, by laser cutting according to the depressions 15 of the component 4 is exposed on its upper side.
  • a remaining covering element which is schematically indicated by 17 in FIG. 1g, can be removed in a simple manner, as is clearly evident in the method step according to FIG is apparent, so that now a Printed circuit board 18 and a printed circuit board intermediate is present, wherein a component to be integrated 4, which is formed for example by serving as a cooling element or sauceableitelement IMS substrate is accurately integrated into a printed circuit board element 9, wherein additionally at least partially structured conductive layers 1 1 and 13 are indicated.
  • such a circuit board 18, as shown in Fig. 1 h be completed by arranging or providing further layers or layers of a printed circuit board.
  • a conductive layer is formed on a support or a supporting layer 21 by means of an adhesive layer or adhesive film 22
  • Layer 23 is provided, which serves for positioning or receiving a turn, for example, formed by an IMS substrate, to be integrated component 24.
  • the component 24 to be integrated has a layer 25 of a conductive material, in particular copper, similar to the preceding embodiment, wherein the dimensions of the recess 26 formed in the conductive layer 23 are matched to the dimensions of the component 24 to be integrated.
  • a printed circuit board element 27 formed from a plurality of non-conductive layers or layers is provided, wherein an adhesion-preventing layer 28 having the dimensions exceeding the dimensions of the component to be integrated 24 is provided.
  • a printed circuit board or a printed circuit board intermediate product is again provided, in which (m) a component 24 to be integrated is contained in a precisely fitting manner.
  • Fig. 3 and 4 respectively printed circuit boards or printed circuit board intermediates are shown, in which a component has been integrated, with possibilities of contacting such an integrated component are indicated.
  • a component to be integrated formed by a cooling element 32 is integrated in a printed circuit board element 33, for example similar to the method guides according to FIGS. 1 and 2, wherein an additional layer or layer is provided for good heat conduction Layer 34 contains a thermally highly conductive material.
  • the component 32 serves for a heat dissipation of heat generated by a chip, for example an SMD component 35, with additional connection points or contacts of the chip 35 being indicated at 36.
  • the component 32 to be integrated in the printed circuit board 31 for heat dissipation or cooling protrudes on the side facing away from the chip 35, as indicated by the projecting region 37, a corresponding improvement of the heat dissipation can be achieved.
  • a circuit board 41 is shown, wherein a turn formed by a cooling element 42 to be integrated component is integrated or incorporated in a circuit board element 43.
  • the component 42 similar to the previous embodiment, has an additional layer 44 which is electrically insulating and provides good heat conduction.
  • the component 42 serves for heat dissipation of heat generated by an example unhoused chip, such as a LED 45, wherein electrically conductive regions 46 for contacting contacts not shown in detail and a bonding wire 47 are additionally indicated.
  • a supporting or carrier layer 51 is provided similar to the embodiments according to FIGS. 1 and 2, this carrier layer 51 being formed, for example, by a metallic, in particular copper carrier, on which a metallic foil 52, which is also made of copper, for example.
  • an adhesive layer 53 is provided, in particular according to the dimensions of the component to be integrated.
  • a component to be integrated formed for example, by a sensor 54, is fixed on the carrier layer or supporting layer 51 by the adhesive 53 through the intermediary of the conductive layer 52.
  • an active sensor surface 56 is also indicated.
  • a printed circuit board element 57 which consists of a nonconductive material, is carried out, this printed circuit board element being formed, for example, by a prepreg with a recess or relief 58 corresponding to the dimensions of the component to be integrated or sensor is provided.
  • an adhesion preventing layer 59 is deposited prior to placing another layer 60 of the printed circuit board to be fabricated, as shown in FIG. 5d indicated method step is indicated.
  • the supporting layer 51 can be used in particular for the formation of further conductive layers of the printed circuit board or of the intermediate printed circuit board to be produced.
  • FIG. 6 a further modified embodiment of a printed circuit board 71 to be produced is shown, wherein on a supporting Layer 72 is a component 73 to be integrated in a recess 74 of the component 73 surrounding the circuit board element 75 is arranged.
  • components which define a cavity can be used in a further production of the printed circuit board, as is indicated schematically in FIG. 7.
  • the components 73 ', 73 "and 73"' indicated in FIG. 7 have a special shape corresponding to a desired cavity which is to be defined in the region of the component 73 to be accommodated.
  • the components defining a cavity, to be integrated 73 or 73 ', 73 "and 73"' can be made for example of glass or ceramic.
  • a two-layer supporting layer 81 is provided according to the method step illustrated in FIG. 8a, wherein this two-layer supporting layer or carrier layer, for example consists of a first layer or layer 81 'having a comparatively large thickness and a second layer or layer 81 "having a comparatively smaller thickness,
  • this two-layer supporting layer or carrier layer for example consists of a first layer or layer 81 'having a comparatively large thickness and a second layer or layer 81 "having a comparatively smaller thickness
  • the two-layer supporting layer 81 is respectively made of metallic layers, in particular of copper, on this two-layer supporting layer 81, in particular according to the method step illustrated in FIG Considering the size or dimensions of the subsequently to be determined component, an adhesive layer 82 is provided.
  • a component 83 is fixed on the layer or carrier layer 81 to be supported by the intermediary of the adhesive layer 82.
  • a printed circuit board element 84 is arranged or fixed, which consists of a non-conductive layer consists, according to the dimensions of the component 83, a recess or exemption 85 is provided.
  • a structuring of the core element 86 is indicated here by structured regions 88 and vias 89.
  • FIG. 8f an arrangement of further layers of the printed circuit board intermediate or circuit board to be produced is subsequently carried out, wherein in the embodiment shown in FIG Core element 86 is a layer 90 of a non-conductive element, in particular a prepreg layer is arranged, on which a conductive layer, such as a Cu film 91 is provided.
  • the individual layers or layers are subsequently also pressed in the embodiment according to FIG. 8, whereupon further processing or processing steps are subsequently required if necessary ,
  • further processing or processing steps are subsequently required if necessary ,
  • a printed circuit board intermediate product 92 is shown, wherein, in particular according to the method steps according to one of the above different methods, pressing or bonding of different layers or layers has already been carried out.
  • a component formed, for example, by an optoelectronic component 93 in a printed circuit board element or a layer 94 is made of a nonconductive material Material is embedded, wherein in the embodiment shown in Fig. 9, a support or support layer 95 is formed of a conductive material, such as copper.
  • the opto-electronic component 93 is contacted with the supporting and conductive layer 95 via contacts 96.
  • an optical window 97 is indicated, wherein an additional, in particular structured, layer 98 of a conductive material is also shown.
  • a layer 101 of conductive material, for example copper, and an additional layer or layer 102 of non-conductive material, for example a prepreg material, are provided as supporting or carrier layer.
  • a comparatively large thickness having to be integrated component 103 is arranged, which is formed for example by a shunt.
  • a printed circuit board element or a layer or layer of a non-conductive material is provided in addition to the component to be integrated 103 on the supporting layers, wherein in accordance with Fig.
  • this layer or layer of non-conductive material according to To be produced printed circuit board intermediate product 100 at different side regions of the component to be integrated 103 has a different thickness.
  • a partial region 104 'of the printed circuit board element can be seen which essentially has a thickness corresponding to the thickness or height of the component 103 to be integrated, while on the right side according to the illustration of FIG. 10, the non-conductive layer or the printed circuit board element 104 "has a comparatively small thickness, which in any case is less than the thickness or height of the component 103 to be integrated.
  • the layer or layer 104 'and 104 "of nonconductive material surrounding the component to be integrated 103 has a recess or release 105 corresponding to the dimensions of the component 103 to be integrated.
  • an additional component 106 is accommodated in the printed circuit board intermediate product 100 to be produced, wherein the component 106 to be integrated in particular has a core component indicated schematically at 107.
  • Element includes integrated component 108, which is formed for example by a MOSFET. Further layers or layers of the component 108 containing the component 106 are indicated by 109 and 1 10.
  • At least one further layer or layer 11 is additionally provided. Moreover, it is indicated in FIG. 10, in particular on the right-hand side, that, in particular according to the height of the component 106 to be integrated, a further layer or layer or a printed circuit board element 12 is also arranged of non-conductive material, which, taking into account the Dimensions of the component 106 to be integrated with a recess or exemption 1 13 is provided.
  • components 103 and 106 or 108 of different thickness or of generally different dimensions can be integrated into a printed circuit board or a printed circuit board intermediate product 100 to be produced.
  • different dimensions or thicknesses having printed circuit board elements or layers or layers 104 ', 104 "and 1 12 of non-conductive material use, which in each case with recesses or exemptions 105 or 1 13 are formed according to the components to be integrated or to be included 103 and 106 and 108, respectively.
  • a cooling element such as a cooling element, a sensor, an opto-electronic component, a component integrated in a core element, or a component defining a cavity, other, in a circuit board to be integrated components such as chips, other electronic, in particular active components and the like. Embedded or integrated.
  • an adhesion-preventing layer is accordingly dispensed with.
  • Applying an adhesive layer can be applied in a manner known per se, for example by a printing process, in particular an ink, flex, gravure, screen or offset printing process.
  • a printing process in particular an ink, flex, gravure, screen or offset printing process.
  • the Ausmaschine be found whose thickness, for example, a maximum of 15 ⁇ , in particular about 0.1 to 10 ⁇ .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Procédé d'intégration d'un composant dans une carte à circuit imprimé ou dans un produit intermédiaire de carte à circuit imprimé, qui comporte les étapes suivantes consistant à préparer une couche (1) pour le support, au moins temporaire, du composant à intégrer (4), à fixer le composant à intégrer (4) sur la couche de support (1), à préparer un élément de carte à circuit imprimé (9) pourvu d'un évidement (10) présentant des dimensions dont au moins la taille et la forme correspondent à celles du composant à intégrer (4), et à fixer l'élément de carte à circuit imprimé (9) sur la couche de support (1), le composant à intégrer (4) étant reçu dans l'évidement (10), et l'élément de carte à circuit imprimé (9) comportant l'évidement (10) destiné à recevoir le composant à intégrer (4) étant constitué d'au moins une couche non conductrice de la carte à circuit imprimé à fabriquer ou du produit intermédiaire de carte à circuit imprimé à fabriquer. La présente invention concerne en outre une carte à circuit imprimé ou un produit intermédiaire de carte à circuit imprimé.
PCT/AT2012/000225 2011-08-31 2012-08-29 Procédé d'intégration d'un composant dans une carte à circuit imprimé ou dans un produit intermédiaire de carte à circuit imprimé, ainsi que carte à circuit imprimé ou produit intermédiaire de carte à circuit imprimé WO2013029073A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112012003597.6T DE112012003597A5 (de) 2011-08-31 2012-08-29 Verfahren zur integration eines bauteils in eine leiterplatte oder ein leiterplatten-zwischenprodukt sowie leiterplatte oder leiterplatten-zwischenprodukt

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATGM481/2011U AT13432U1 (de) 2011-08-31 2011-08-31 Verfahren zur integration eines bauteils in eine leiterplatte oder ein leiterplatten-zwischenprodukt sowie leiterplatte oder leiterplatten-zwischenprodukt
ATGM481/2011 2011-08-31

Publications (1)

Publication Number Publication Date
WO2013029073A1 true WO2013029073A1 (fr) 2013-03-07

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Country Status (3)

Country Link
AT (1) AT13432U1 (fr)
DE (1) DE112012003597A5 (fr)
WO (1) WO2013029073A1 (fr)

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AT515101B1 (de) * 2013-12-12 2015-06-15 Austria Tech & System Tech Verfahren zum Einbetten einer Komponente in eine Leiterplatte
WO2015127486A1 (fr) * 2014-02-28 2015-09-03 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de fabrication d'un circuit imprimé à puce de capteur incorporée ainsi que circuit imprimé
WO2015149097A1 (fr) * 2014-03-31 2015-10-08 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de fabrication d'une carte de circuit imprimé équipée d'au moins un composant optoélectronique
AT519891A1 (de) * 2017-05-09 2018-11-15 Hitzinger Gmbh Leiterplatte
US10187997B2 (en) 2014-02-27 2019-01-22 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
US10219384B2 (en) 2013-11-27 2019-02-26 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Circuit board structure
US11049778B2 (en) 2018-06-11 2021-06-29 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board

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WO2003065778A1 (fr) 2002-01-31 2003-08-07 Imbera Electronics Oy Procede d'enrobage d'un composant dans une base et de formation d'un plot de contact
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WO2003065778A1 (fr) 2002-01-31 2003-08-07 Imbera Electronics Oy Procede d'enrobage d'un composant dans une base et de formation d'un plot de contact
WO2004077902A1 (fr) 2003-02-26 2004-09-10 Imbera Electronics Oy Procede de fabrication d'un module electronique
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