WO2013008466A1 - Substrat de capteur de courant et capteur de courant - Google Patents

Substrat de capteur de courant et capteur de courant Download PDF

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Publication number
WO2013008466A1
WO2013008466A1 PCT/JP2012/004498 JP2012004498W WO2013008466A1 WO 2013008466 A1 WO2013008466 A1 WO 2013008466A1 JP 2012004498 W JP2012004498 W JP 2012004498W WO 2013008466 A1 WO2013008466 A1 WO 2013008466A1
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WIPO (PCT)
Prior art keywords
current sensor
current
sensor substrate
primary conductor
disposed
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Application number
PCT/JP2012/004498
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English (en)
Japanese (ja)
Inventor
鈴木　健治
Original Assignee
旭化成エレクトロニクス株式会社
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Application filed by 旭化成エレクトロニクス株式会社 filed Critical 旭化成エレクトロニクス株式会社
Priority to JP2013523835A priority Critical patent/JP5695196B2/ja
Publication of WO2013008466A1 publication Critical patent/WO2013008466A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/207—Constructional details independent of the type of device used
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Definitions

  • the present invention relates to a current sensor substrate and a current sensor, and more particularly to a current sensor substrate and a current sensor provided with a primary conductor having a U-shaped current path.
  • a method of detecting a magnetic flux generated around the measurement current flowing is known.
  • a method of arranging a magnetoelectric conversion element in the vicinity of a primary conductor through which a measurement current flows is known.
  • FIG. 1 shows an example of a conventional current sensor.
  • a U-shaped current conductor portion 204a is formed in the conductive clip 204, and the Hall element 208 is disposed inside the U-shape. Since the magnetic flux density is high near the center of the U-shaped inner side, the measurement sensitivity is improved.
  • the current sensor shown in FIG. 1 requires manufacturing labor, such as requiring the conductive clip 204 to be separately provided and coupled to the lead terminals 202a to 202d, resulting in an increase in cost.
  • the present invention has been made in view of such problems, and a first object thereof is to reduce manufacturing costs in a current sensor including a primary conductor having a U-shaped current path.
  • a second object is to provide a substrate for the current sensor.
  • a first aspect of the present invention includes a primary conductor having a U-shaped current path through which a current to be measured flows, and a magnetoelectric transducer disposed in the U-shaped opening.
  • a current sensor substrate comprising: a support portion for supporting; and a lead terminal connected to the support portion, wherein the support portion is not electrically connected to the U-shaped current path.
  • the primary conductor has a primary conductor terminal connected to the U-shaped current path, and the primary conductor terminal is the U of the current path.
  • the lead terminal may extend in a direction opposite to the opening direction of the letter shape, and the lead terminal may extend in a direction opposite to the direction in which the primary conductor terminal extends.
  • the support part of the current sensor substrate includes the first support part disposed in the U-shaped opening, You may make it have a 2nd support part adjacent to a 1st support part and not arrange
  • the current sensor substrate according to any one of the first to third aspects, and the current path of the current sensor substrate disposed on the support portion of the current sensor substrate. And an IC chip having a magnetoelectric conversion element for detecting a magnetic flux generated from a current flowing through the current sensor, wherein the magnetoelectric conversion element is disposed inside the U-shape of the current path in a plan view. It is good.
  • the magnetoelectric conversion element may be arranged close to the U-shaped corner portion of the current path.
  • the current sensor substrate of the third aspect and the current path of the current sensor substrate disposed on the first support portion of the current sensor substrate flow.
  • the conversion element may be a current sensor characterized in that it is a compound semiconductor magnetic sensor disposed inside the U-shape of the current path in plan view.
  • the magnetoelectric conversion element may be a Hall element.
  • a step is provided in the support portion of the current sensor substrate, and the magnetosensitive surface of the magnetoelectric transducer is the primary You may make it provide so that it may become substantially equal to the height of a conductor.
  • a step is provided in the support portion of the current sensor substrate, and the size of the step is determined by the magnetoelectric conversion element.
  • the thickness is t1 and the thickness of the primary conductor is t2, the value is larger than 0 and smaller than 2 ⁇ t1 + t2, and the step is a step in the direction of decreasing the height of the magnetosensitive surface of the magnetoelectric transducer. There may be.
  • the configuration of the current sensor substrate and the current sensor can be simplified with a reduced number of parts, and the manufacturing cost can be reduced.
  • FIG. 7 is a diagram showing a cross section taken along line AA ′ in the current sensor of FIG.
  • FIG. 2 shows a current sensor according to the first embodiment.
  • the current sensor 200 includes a primary conductor 210 having a U-shaped current path 210A and a primary conductor terminal 210B, a support portion 220A for supporting a magnetoelectric conversion element 230A such as a Hall element, and a signal terminal having lead terminals 220B_1 and 220B_2.
  • a side member 220 hereinafter simply abbreviated as “member 220”) and an IC chip 230 having a magnetoelectric conversion element 230A that is disposed in the support portion 220A and detects a magnetic flux generated from a current flowing through the current path 210A. .
  • the primary conductor 210, the member 220, and the IC chip 230 are molded with a resin 240 to form the current sensor 200.
  • a portion excluding the IC chip 230 and the resin 240 is a current sensor substrate.
  • the lead terminal 220B_1 represents a lead terminal connected to the support part 220A
  • the lead terminal 220B_2 represents a lead terminal not connected to the support part 220A. In the description common to the lead terminals 220B_1 and 220B_2, each lead terminal is simply referred to as the lead terminal 220B.
  • the support portion 220A is not electrically connected to the U-shaped current path 210A through which the current to be measured flows, and by configuring in this manner, a high withstand voltage between the primary conductor 210 and the IC chip 230 is ensured. can do.
  • the U-shape of the current path 210A has an opening 210C in a direction opposite to the direction in which the primary conductor terminal 210B_1 extends, and the support 220A of the member 220 is disposed in the opening 210C.
  • the lead terminal 220B_1 of the member 220 extends in a direction opposite to the direction in which the primary conductor terminal 210B extends.
  • the support 220A and the lead terminal 220B_1 are integrally formed of a metal material, not a separate member. That is, the support part 220A and the lead terminal 220B_1 are physically integrated and are physically and electrically connected.
  • the magnetoelectric conversion element 230A is disposed inside the U-shape of the current path 210A in plan view.
  • the magnetic flux density is high in the U-shaped corner portion 210A 'of the current path 210A, it is preferable to dispose the magnetoelectric conversion element 230A close to the corner portion 210A'.
  • the primary conductor 210 and the member 220 are separated, and the IC chip 230 disposed on the support portion 220A of the member 220 and the current path 210A of the primary conductor 210 do not contact each other. Clearance is obtained. The clearance ensures insulation between the primary conductor 210 and the IC chip 230, and enables a high breakdown voltage to be maintained inside the package.
  • the lead terminal 220B_1 of the member 220 extends in a direction opposite to the direction in which the primary conductor terminal 210B extends, a creepage distance necessary for insulation can be secured on the outer periphery of the resin 240, and Will improve. If the primary conductor terminal 210B and the lead terminal 220B_1 are drawn from the same end surface of the resin 240, they are adjacent to each other outside the package, and it is difficult to ensure a sufficient creepage distance.
  • the number of parts can be suppressed as compared with the conventional one, and the manufacturing cost can be reduced, and the breakdown voltage can be improved.
  • FIG. 3 shows a current sensor according to the second embodiment.
  • the current sensor 300 is different from the current sensor 200 of the first embodiment in that a magnetoelectric conversion element 330A such as a Hall element is not included in the IC chip 330 and is provided separately.
  • the support 220A includes a first support 220A ′ disposed in the U-shaped opening 210C and a second support 220A ′′ adjacent to the first support 220A ′ and not disposed in the opening 210C.
  • the first support portion 220A ′ is provided with a magnetoelectric conversion element 330A for detecting a magnetic flux generated from the current flowing through the current path 210A
  • the second support portion 220A ′′ is provided with a magnetic force from the magnetoelectric conversion element 330A.
  • An IC chip 330 for processing the output signal is arranged.
  • the magnetoelectric conversion element 330A is disposed inside the U shape of the current path 210A in plan view.
  • the magnetoelectric conversion element 330A is disposed, the first support portion 220A ′ disposed in the opening 210C of the current path 210A, and the IC chip 330 for signal processing are disposed. It is divided into the second support portion 220A ′′ not disposed in the opening 210C, and a compound semiconductor magnetic sensor with high sensitivity such as InSb, InAs, GaAs, etc. is used as the magnetoelectric conversion element 330A. Thereby, the current flowing through the current path 210A Measurement sensitivity can be improved.
  • the U-shaped current path 210A can be made small and the overall length can be shortened.
  • the current path 210A is reduced in size, the magnetic field concentration inside the U-shape is increased, and the current detection sensitivity is improved.
  • the current path 210A is thinner than the other parts of the primary conductor 210 and has high resistance, so heat generation is concentrated. However, the downsizing of the current path 210A shortens the length of the current path 210A and reduces the amount of heat generation. .
  • a current path having a C-shape, a V-shape, or a similar shape may be used for the current path 210A as one form of the U-shaped current path.
  • FIGS. 4A, 4B, and 5A to 5C a method of manufacturing the current sensor 300 according to the second embodiment will be described.
  • a lead frame on which a desired pattern is formed is produced from a single metal plate.
  • FIG. 4A shows a portion corresponding to one current sensor.
  • the magnetoelectric conversion element 330A is die-bonded to the first support portion 220A ′, and the IC chip 330 is die-bonded to the second support portion 220A ′′, and then wire bonding is performed (FIG. 4B).
  • FIG. 5A is a plan view
  • FIG. 5B is a front view
  • FIG. 5C is a right side view.
  • FIG. 6 is a perspective view showing the positional relationship between the primary conductor 210 and the magnetoelectric transducer 330A in the current sensor according to the second embodiment.
  • FIG. 7 is a view showing a cross section AA ′ in the current sensor 300 of FIG.
  • the magnetosensitive surface 331 is provided so as to be substantially equal to the height of the primary conductor 210.
  • the first support portion 220A ′ is provided with a step by, for example, a method such as half-edge processing, and the exposed portion of the first support portion 220A ′ has a magnetoelectric conversion.
  • the element 330A is installed. As a result, a magnetic flux generated by the current flowing through the primary conductor 210 is generated so as to pass in a direction perpendicular to the magnetosensitive surface 331. Therefore, the magnetic flux density on the magnetosensitive surface 331 of the magnetoelectric conversion element 330A is increased, and the measurement sensitivity of the current sensor 300 is improved.
  • the size of the step is preferably larger than 0 and smaller than 2 ⁇ t1 + t2 when the thickness of the magnetoelectric transducer is t1 and the thickness of the primary conductor is t2.
  • the magnetic flux density on the magnetic sensitive surface 331 of the magnetoelectric transducer 330A becomes the highest, and the current sensor 300 measures. Sensitivity is improved.
  • the method of providing a step in the support portion is not limited to half-edge processing, and other methods such as a method of crushing by coining to mechanically thin or a bending method can also be applied.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

L'invention vise à réduire les coûts de fabrication d'un capteur de courant, qui comporte un conducteur primaire ayant un chemin de courant en forme de U. Ce capteur de courant (200) comporte un conducteur primaire (210) ayant un chemin de courant en forme de U (210A), une unité de support (220A) destinée à supporter un élément de conversion magnétoélectrique (230A), et des bornes conductrices (220B_1) reliées à l'unité de support (210A). L'unité de support (220A) est formée de manière à ne pas être reliée électriquement au chemin de courant (210A).
PCT/JP2012/004498 2011-07-13 2012-07-12 Substrat de capteur de courant et capteur de courant WO2013008466A1 (fr)

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JP2011154659 2011-07-13
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WO2015015539A1 (fr) * 2013-07-30 2015-02-05 旭化成エレクトロニクス株式会社 Capteur de courant
WO2015050253A1 (fr) 2013-10-04 2015-04-09 日産化学工業株式会社 Dérivés d'aniline et leurs utilisations

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WO2015015539A1 (fr) * 2013-07-30 2015-02-05 旭化成エレクトロニクス株式会社 Capteur de courant
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JPWO2013008466A1 (ja) 2015-02-23
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TW201307865A (zh) 2013-02-16

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