WO2012167732A1 - Structure de dissipation thermique pour corps lumineux de lampe, dispositif d'éclairage correspondant et leur procédé de fabrication - Google Patents

Structure de dissipation thermique pour corps lumineux de lampe, dispositif d'éclairage correspondant et leur procédé de fabrication Download PDF

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Publication number
WO2012167732A1
WO2012167732A1 PCT/CN2012/076563 CN2012076563W WO2012167732A1 WO 2012167732 A1 WO2012167732 A1 WO 2012167732A1 CN 2012076563 W CN2012076563 W CN 2012076563W WO 2012167732 A1 WO2012167732 A1 WO 2012167732A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
glass casing
circuit board
conductive material
generating component
Prior art date
Application number
PCT/CN2012/076563
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English (en)
Chinese (zh)
Inventor
蔡子丰
Original Assignee
莱姆尼斯照明（亚洲）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 莱姆尼斯照明（亚洲）有限公司 filed Critical 莱姆尼斯照明（亚洲）有限公司
Publication of WO2012167732A1 publication Critical patent/WO2012167732A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0005—Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Light-emitting body heat dissipation structure corresponding illumination device and manufacturing method thereof
  • the invention relates to the field of illuminating illumination, in particular to the field of illuminating lighting equipment and manufacturing process thereof, and particularly to a illuminating body heat dissipating structure, a corresponding illuminating device and a manufacturing method thereof.
  • lighting devices With the continuous advancement of human civilization and the continuous development of science and technology, lighting devices have long been widely known.
  • such lighting devices include a housing and a lighting component disposed within the housing.
  • LEDs have been able to provide enough light energy for lighting purposes.
  • incandescent and halogen lamps have been used in order to reduce the energy consumption of lighting and reduce carbon dioxide emissions.
  • LED light sources have been It is the trend of the times that consumers need products that can achieve the light output of incandescent or halogen lamps, have lower energy consumption and longer service life, and are cheaper.
  • many different LED products are already on the market, most of them are too expensive for the average consumer, and the product performance has not achieved the desired results.
  • LEDs need to work within a certain temperature range in order to have reasonable performance and service life. Due to the compact structure, especially the illuminating device is received in the housing, the following disadvantages exist:
  • the illuminating equipment itself consumes electric energy, and the efficiency of electro-optical conversion is not 100%. Some of the heat is always generated. Since the inside of the casing is mostly sealed, heat cannot be released in time.
  • the object of the present invention is to overcome the shortcomings of the prior art mentioned above, and to provide an efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, energy saving, safety and environmental protection, significantly prolonging service life, practical structure, and convenient manufacturing process.
  • the light-emitting lamp body heat-dissipating structure, the corresponding lighting device and the manufacturing method thereof are fast, stable and reliable in work performance and widely applicable.
  • the heat-dissipating structure of the illuminating lamp body of the present invention the corresponding illuminating device and the manufacturing method thereof are as follows:
  • the heat-generating component is in close contact with the glass casing, and the area of the closely contacting portion is maximized.
  • the inner wall of the glass casing in the light-emitting body heat dissipation structure has a heat transfer contact portion in close contact with the heat generating member.
  • the heat transfer contact portion in the heat dissipation structure of the light-emitting body may be an annular boss, and the bottom surface of the annular boss is in close contact with the heat generating member.
  • the heat transfer contact portion of the light emitting body heat dissipation structure may also be at least two outer concave inner protrusions uniformly distributed on the edge of the glass housing, and the inner surface of each outer concave inner protrusion and the inner surface The heating parts are in close contact.
  • the glass casing in the light-emitting body heat dissipation structure is in close contact with the heat-generating component through a layer of heat-conductive material.
  • the layer of heat conductive material in the heat dissipation structure of the light body is a thermal grease layer.
  • the heat generating component in the light emitting body heat dissipating structure is a driving circuit board of the light emitting lamp body, and the driving circuit board is a metal base circuit board.
  • the metal-based circuit board in the heat-dissipating structure of the light-emitting body may have a single-sided exposed metal surface, and the one-side exposed metal surface is in close contact with the glass casing; or the metal-based circuit board is also It may have a double exposed metal surface, and one of the exposed metal faces is in close contact with the glass casing.
  • the metal-based circuit board in the heat-dissipating structure of the light-emitting body is an aluminum-based circuit board.
  • the space between the metal-based circuit board and the glass housing in the heat-dissipating structure of the light-emitting body is filled with a heat-conducting material body, and the heat-conducting material body is in close contact with the metal-based circuit board and the glass housing, respectively. .
  • the heat conductive material body in the light emitting body heat dissipation structure is a heat conductive silica gel filled in a space provided between the metal base circuit board and the glass case.
  • the rear portion of the glass casing in the heat dissipation structure of the illuminating lamp body is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with an epoxy resin potting material.
  • the material of the socket in the heat dissipation structure of the light body may be an engineering plastic or a ceramic material.
  • the metal base circuit board in the heat dissipation structure of the light emitting body is further fixed with a metal power supply pin perpendicular to the surface of the metal base circuit board, and the metal power supply guide pin penetrates through the heat conductive material body and The body of thermally conductive material is in intimate contact.
  • the material of the metal power supply pin in the heat dissipation structure of the light body is brass, and the content of copper is at least 59%.
  • the metal power supply pin surface of the light emitting body heat dissipation structure is further covered with an insulating sleeve, and the metal power supply pin is in close contact with the heat conductive material body through the insulating sleeve, and the insulating sleeve is Thermally conductive material.
  • the insulating sleeve in the heat dissipation structure of the light body may be a liquid crystal polymer LCP, polyphenylene sulfide PPS, nylon PA66 or nylon PA46.
  • the light-emitting element included in the light-emitting lamp body in the light-emitting body of the light-emitting body is a light-emitting diode LED.
  • the light emitting diode LED in the heat dissipation structure of the light emitting body may be a patch light emitting LED component, the patch light emitting LED component is attached to the driving circuit board; or the light emitting diode LED may also be an integrated LED module.
  • the integrated LED module is fixedly disposed on the driving circuit board.
  • a space between the heat-generating component and the glass casing in the heat-dissipating structure of the light-emitting lamp body is filled with a heat-conducting material body, and the heat-conducting material body is in close contact with the heat-generating component and the glass casing, respectively.
  • the heat conductive material body in the heat radiating structure of the light emitting body is a heat conductive silica gel filled in a space provided between the heat generating component and the glass casing.
  • the rear portion of the glass casing in the heat dissipation structure of the illuminating lamp body is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with an epoxy resin potting material.
  • the material of the socket in the heat dissipation structure of the light body may be an engineering plastic or a ceramic material.
  • the illuminating device having the above-mentioned heat dissipating structure is characterized in that: the front end of the glass casing is provided with a condensing and refracting lens, and the position of the condensing and refracting lens and the illuminating light in the illuminating lamp body The components correspond.
  • the condensing and refracting lens in the illuminating device is fixedly bonded to the front end of the glass casing by a photo-curable resin adhesive layer.
  • the method of manufacturing the above lighting device characterized in that the method comprises the following steps:
  • a condensing and refracting lens is attached to the front end of the glass casing, and the position of the condensing and refracting lens corresponds to the illuminating element included in the illuminating lamp body.
  • the method of manufacturing the illuminating device is such that the glass casing is in close contact with the heat generating component, and the method comprises the following steps: (21) injecting the heat conductive material into the space between the heat generating component and the glass casing through the opening at the rear end of the glass casing (22) forming a layer of thermally conductive material between the glass casing and the contact surface of the heat generating component;
  • the step (23) in the method of manufacturing the lighting device further includes the following steps:
  • the sealing of the opening at the rear end of the glass casing in the method of manufacturing the lighting device comprises the steps of: (241) inserting a plug into the heat conductive material injected into the space between the heat generating component and the glass casing, and plugging the opening of the rear end of the glass casing;
  • installing the heat generating component in the glass casing in an assembly jig includes the following steps:
  • the glass casing is sleeved outside the driving circuit board, and the metal power guiding pin penetrates the glass casing and is in close electrical contact with the conductive contact end provided at the rear end of the glass casing.
  • the step (21) in the method of manufacturing the lighting device further comprises the following steps:
  • the condensing refractive lens is mounted on the front end of the glass casing, and the method includes the following steps:
  • the light-emitting body heat-dissipating structure of the invention, the corresponding illuminating device and the manufacturing method thereof are used, and since the glass is used as the main material of the casing of the illuminating lamp body, it is not only cheap and economical, but also capable of both insulation and heat transfer.
  • the heat dissipation structure can ensure that the glass shell and the heat-generating component have the largest possible contact area, thereby becoming the main heat load transmission path, and the thermal conductive silicone potting can ensure efficient heat transfer, and the heat transfer effect is simpler than that of the simple air.
  • the drive circuit board uses a metal-based circuit board, which further improves the efficiency of heat transfer, thereby achieving efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, saving energy, safety and environmental protection, due to the lamp
  • the body can maintain a relatively low temperature under long working conditions, thus significantly prolonging the service life, and the structure is simple and practical, the manufacturing process is convenient and quick, the work performance is stable and reliable, and the scope of application is wide, and it is carried out for people's work and life. It has come a lot of convenience.
  • Figure la is an internal perspective view of the heat dissipation structure of the light-emitting lamp body of the present invention.
  • Figure 1b is a longitudinal cross-sectional view of the light-emitting body heat dissipation structure of the present invention from another direction.
  • FIGS. 2a and 2b are schematic views showing two specific forms of a glass casing of the heat dissipation structure of the light-emitting lamp body of the present invention.
  • 3a and 3b are schematic views showing the structure of a driving circuit board in the heat dissipation structure of the light-emitting lamp body of the present invention.
  • FIG. 4 is a schematic view showing the overall structure of a lighting device of the present invention.
  • 5a to 5h are schematic views showing respective steps of an assembly process of a method of manufacturing a lighting device of the present invention. detailed description
  • the illuminating body heat dissipation structure includes:
  • the heat generating component 2 and the glass casing 1 are in close contact with each other, and the area of the portions in close contact with each other is maximized.
  • the inner wall of the glass casing 1 has a heat transfer contact portion 11 , and the heat transfer contact portion 11 is in close contact with the heat generating component 2; the heat transfer contact portion 11 can be at least two forms:
  • Fig. 2a which is an annular boss
  • the bottom surface of the annular boss is in close contact with the heat generating component 2; the structure is easy to manufacture and more durable;
  • FIG. 2b is at least two concave inner protrusions 12 uniformly distributed on the edge of the glass casing 1, and the inner surface of each of the concave inner protrusions 12 is
  • the heat generating component 2 is in close contact with each other. This structure not only increases the contact area with the heat generating component 2, but also increases the area in which the glass casing 1 is in contact with the outside air, improves the heat dissipation effect, and also saves raw materials.
  • the glass casing 1 in the heat dissipation structure of the illuminating lamp body can be in close contact with the heat generating component 2 through the heat conductive material layer 3, which can further improve the heat transfer effect, and the contact surface
  • the thermally conductive material layer 3 may be a thermally conductive silicone layer 3, or other materials that can provide a desired close contact effect and have good thermal conductivity.
  • the heat generating component 2 in the heat dissipation structure of the light emitting lamp body is the driving circuit board 2 of the light emitting lamp body,
  • the drive circuit board 2 is a metal base circuit board 2.
  • the metal-based circuit board 2 in the heat-dissipating structure of the light-emitting lamp body may have a single-sided exposed metal surface 21, and the one-side dew
  • the metal surface 21 is in close contact with the heat transfer contact portion 11 on the inner wall of the glass casing 1; or the metal base circuit board 2 may have a metal surface on both sides, and one side of the metal surface is exposed.
  • the metal surface 21 is in close contact with the heat transfer contact portion 11 on the inner wall of the glass casing 1; in order to obtain a good heat conduction effect and light weight, the metal base circuit board 2 may be an aluminum base circuit board 2 Of course, other suitable metal materials can also be used.
  • the space between the metal-based circuit board 2 and the glass housing 1 in the heat-dissipating structure of the light-emitting body is further filled with a heat-conducting material body 4, and the heat-conductive material body 4
  • the metal-based circuit board 2 and the glass housing 1 are in close contact with each other.
  • the heat conductive material body 4 in the heat dissipation structure of the light-emitting body can be filled and disposed on the metal-based circuit board 2
  • the rear portion of the glass casing 1 in the heat-dissipating structure of the light-emitting body is further provided with a lamp holder 5, and the heat-conductive silicone rubber 4 and the lamp holder 5 are filled with an epoxy resin potting material 51.
  • the lamp holder 5 in the heat dissipation structure of the illuminating lamp body may be integrated with the glass case 1 or may be a part detachable from the glass case 1.
  • the material of the lamp holder 5 may be engineering plastic or ceramic material. It can be other suitable materials.
  • a metal power supply lead pin 6 perpendicular to the surface of the metal base circuit board 2 is fixedly disposed on the metal base circuit board 2 in the heat dissipation structure of the light emitting lamp body, and the metal power supply guide pin 6 penetrates through the heat conductive material body. 4 and in close contact with the body 4 of thermal conductive material; in a specific embodiment of the invention, the material of the metal power supply pin 6 is brass, wherein the content of copper is at least 59%.
  • the surface of the metal power supply pin 6 is further covered with an insulating sleeve 61, and the metal power supply pin 6 is in close contact with the heat conductive material body 4 through the insulating sleeve 61, the insulation
  • the material of the sleeve is a heat conductive material;
  • the insulating sleeve may be a liquid crystal polymer LCP, polyphenylene sulfide PPS, nylon PA66 or nylon PA46, wherein:
  • Liquid Crystal Polymer (LCP) – is a new type of polymer material that generally exhibits liquid crystallinity in the molten state.
  • Nylon-66 also known as polyamide-66, polyhexamethylene adipamide, its outstanding features are tough, wear-resistant, oil-resistant, water-resistant, anti-enzytic, but absorbent, suitable for production General mechanical parts, wear-reducing parts, transmission parts, and chemical, electrical, instrumentation and other parts;
  • Nylon-46 (PA46) also known as polyamide-46, which is polyadipyldiamine, its outstanding feature is High crystallinity, high temperature resistance, high rigidity, high strength.
  • PA46 polyamide-46
  • the light-emitting elements in the light-emitting lamp body in the light-emitting body of the light-emitting body may be light-emitting diodes LED 7 or other high-efficiency light.
  • the light-emitting diode LED 7 in the heat-dissipating structure of the light-emitting body may be a patch-emitting LED element 7, and the patch-emitting LED element 7 is attached to the On the driving circuit board 2; or the LEDs 7 can also be an integrated LED module, the integrated LED module is fixedly disposed on the driving circuit board, so that a better heat dissipation effect can be obtained.
  • the heat-generating component in the heat-dissipating structure of the light-emitting lamp body is in a space between the heat-generating component and the glass casing 1 without using a metal-based circuit board and other forms. It is still possible to fill the body 4 with a heat-conducting material 4 which is in close contact with the heat-generating component and the glass casing 1, respectively.
  • the heat conductive material body 4 in the heat dissipation structure of the light emitting body is filled with the heat conductive silicone 4 disposed in the space between the heat generating component and the glass housing 1; the rear portion of the glass housing 1 is further provided with the lamp holder 5
  • the thermal conductive silicone 4 and the lamp holder 5 are filled with an epoxy resin potting material 51; the material of the lamp holder 5 may be an engineering plastic or a ceramic material.
  • the illumination device having the above-mentioned heat dissipation structure, wherein the front end of the glass casing 1 is provided with a condensing and refracting lens 8, and the concentrating light
  • the position of the refractive lens 8 corresponds to the light-emitting element included in the light-emitting lamp body; the light-condensing refractive lens 8 is fixedly bonded to the front end of the glass casing 1 by a photo-curable resin adhesive layer.
  • the method of manufacturing the above lighting device includes the following steps:
  • Locating the heat generating component 2 in the glass housing 1 in the assembly jig 9, comprising the steps of: (a) locating the driving circuit board 2 in an assembly jig, and (b) arranging the glass housing 1 outside the driving circuit board 2, and causing the metal power supply pin 6 to penetrate the glass housing 1 and The conductive contact end provided at the rear end of the glass casing 1 is in close electrical contact;
  • the present invention mainly uses very inexpensive glass as the main constituent material of the lamp, and at the same time functions as an insulating and heat conductor material, and at the same time maximizes the contact area of the glass and the metal-based circuit board as the main heat load transfer.
  • thermal silica gel potting is used as an auxiliary route to ensure complete heat transfer.
  • the metal-based circuit board has the LED light-emitting element circuit and the driving circuit disposed on one side, so that the metal-based circuit board can dissipate the heat generated by the LED light-emitting element circuit and the driving circuit, thereby obtaining the maximum
  • the contact area is in contact with the surface of the glass envelope.
  • the thermal grease is placed on the bonding surface of the glass casing and the metal-based circuit board to ensure the continuity of heat conduction throughout the contact surface;
  • the metal power supply pin has two functions, one function is to connect the power from the lamp holder, and One effect is to further conduct heat from the metal-based board directly to the thermally conductive silicone or epoxy potting and then to the glass housing and air.
  • the illumination device using the heat dissipation structure of the light-emitting body of the present invention can realize an effective heat management function, so that a glass lamp, such as a GUI 0 LED spotlight, consumes 2 to 4 iL of energy, but the output light energy is equivalent to 50 watts.
  • the GU10 halogen lamp saves 90% of its energy consumption.
  • the heat dissipation structure can ensure that the glass casing 1 and the heat generating component 2 have the largest possible contact area, thereby becoming the main heat load transmission path, and the thermal conductive silicone potting can ensure efficient heat transfer and heat transfer than pure air.
  • the effect is significantly improved; not only that, the driving circuit board 2 uses the metal-based circuit board 2, further improving the efficiency of heat transfer, thereby achieving efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, saving energy, safety and environmental protection.
  • the lamp body can maintain a relatively low temperature under long working conditions, the service life is significantly prolonged, and the structure is simple and practical, the manufacturing process is convenient and quick, the work performance is stable and reliable, and the scope of application is wide, for people's work and Life has brought great convenience.

Abstract

La présente invention concerne une structure de dissipation thermique destinée au corps lumineux d'une lampe, laquelle comprend une coque en verre (1) et un composant chauffant (2) disposé sur la coque en verre (1), le composant chauffant (2) étant en contact étroit avec la coque en verre (1), la superficie de la zone de contact étroit étant maximisée. Le dispositif d'éclairage pourvu de ladite structure de dissipation thermique et son procédé de fabrication sont peu coûteux et se caractérisent par leur double fonction d'isolation et de transfert thermique. De plus, ils assurent la plus grande superficie de contact possible entre la coque en verre et le composant chauffant de manière à garantir un passage principal au transfert de la charge thermique. Le joint en silice colloïdale coulée thermoconductrice garantit un haut rendement de transfert thermique. La carte de circuit imprimé métallique améliore davantage l'efficacité du transfert thermique, évite efficacement la surchauffe à l'intérieur du corps lumineux de la lampe, ce qui assure la protection de l'environnement, prolonge la durée de vie utile, rend la structure plus simple et pratique et accélère la fabrication, tout en stabilisant le rendement.
PCT/CN2012/076563 2011-06-07 2012-06-07 Structure de dissipation thermique pour corps lumineux de lampe, dispositif d'éclairage correspondant et leur procédé de fabrication WO2012167732A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110151518.1A CN102818234B (zh) 2011-06-07 2011-06-07 发光灯体散热结构、相应的照明装置及其制造方法
CN201110151518.1 2011-06-07

Publications (1)

Publication Number Publication Date
WO2012167732A1 true WO2012167732A1 (fr) 2012-12-13

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CN (1) CN102818234B (fr)
WO (1) WO2012167732A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3118512A1 (fr) * 2015-07-14 2017-01-18 Civilight GmbH Spot led

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015074188A1 (fr) * 2013-11-20 2015-05-28 李坤 Lampe à quartz cob à del et son procédé de fabrication
CN104654084A (zh) * 2015-02-17 2015-05-27 浙江生辉照明有限公司 一种高效散热led灯

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5967653A (en) * 1997-08-06 1999-10-19 Miller; Jack V. Light projector with parabolic transition format coupler
CN201011442Y (zh) * 2007-01-30 2008-01-23 黄志高 一种带国标反射定向玻壳的大功率led定向灯
CN102016394A (zh) * 2010-02-05 2011-04-13 马士科技有限公司 Led荧光灯
CN201851918U (zh) * 2010-09-28 2011-06-01 深圳市朗孚照明科技有限公司 Led蜡烛灯
CN202065966U (zh) * 2011-06-07 2011-12-07 蔡子丰 发光灯体散热结构及相应的照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5967653A (en) * 1997-08-06 1999-10-19 Miller; Jack V. Light projector with parabolic transition format coupler
CN201011442Y (zh) * 2007-01-30 2008-01-23 黄志高 一种带国标反射定向玻壳的大功率led定向灯
CN102016394A (zh) * 2010-02-05 2011-04-13 马士科技有限公司 Led荧光灯
CN201851918U (zh) * 2010-09-28 2011-06-01 深圳市朗孚照明科技有限公司 Led蜡烛灯
CN202065966U (zh) * 2011-06-07 2011-12-07 蔡子丰 发光灯体散热结构及相应的照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3118512A1 (fr) * 2015-07-14 2017-01-18 Civilight GmbH Spot led

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Publication number Publication date
CN102818234B (zh) 2016-12-07
CN102818234A (zh) 2012-12-12

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