WO2012164820A1 - 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法 - Google Patents
研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法 Download PDFInfo
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- WO2012164820A1 WO2012164820A1 PCT/JP2012/002826 JP2012002826W WO2012164820A1 WO 2012164820 A1 WO2012164820 A1 WO 2012164820A1 JP 2012002826 W JP2012002826 W JP 2012002826W WO 2012164820 A1 WO2012164820 A1 WO 2012164820A1
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- polishing
- polishing head
- workpiece
- head
- height direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Definitions
- the present invention relates to a method for adjusting a position in a height direction of a polishing head for holding a workpiece and a method for polishing a workpiece in a polishing apparatus used when polishing the surface of the workpiece.
- the final shape of the silicon wafer is determined by mirror polishing that is the final process.
- primary polishing is performed by double-sided polishing to satisfy strict flatness specifications, and then a single-sided surface is used to improve surface scratches and surface roughness.
- Secondary polishing and finish polishing are performed.
- One-sided surface secondary polishing and finish polishing are required to maintain the flatness created by double-sided primary polishing and to finish to a perfect mirror surface free from defects such as scratches on the surface side.
- the single-side polishing apparatus 101 includes a surface plate 106 to which a polishing cloth 107 is attached, an abrasive supply mechanism (not shown), a polishing head 120, and the like.
- the workpiece W is held by the polishing head 120
- the abrasive is supplied onto the polishing cloth 107 from the abrasive supply mechanism
- the surface plate 106 and the polishing head 120 are rotated to rotate the surface of the workpiece W. Polishing is carried out by sliding contact with the polishing cloth 107.
- a method of holding the work on the polishing head there is a method of attaching the work to a flat disk-shaped plate through an adhesive such as wax.
- a method of holding an elastic film called a backing film on the work holding disk for the purpose of suppressing the uneven shape transfer of the polishing head main body and the work holding disk, and a work film holding portion as a rubber film, on the back of the rubber film
- a so-called rubber chuck system in which a pressurized fluid such as air is poured and a rubber film is inflated with a uniform pressure to press a workpiece against a polishing cloth (see, for example, Patent Document 1).
- a polishing head in which a retainer ring is disposed as a means for pressing a polishing cloth on the outside of a workpiece has been proposed for the purpose of improving flatness by suppressing the peripheral portion sagging.
- FIG. 5 An example of the configuration of a general rubber chuck type polishing head is schematically shown in FIG.
- the polishing head 120 shown in FIG. 5 has a rubber film (rubber material) 122 attached so as to cover at least the lower surface portion and the side surface portion of the disk-shaped intermediate plate 125, and supplies a fluid to the back surface of the rubber film so
- the structure can be pressed, that is, a so-called rubber chuck structure.
- An annular guide ring 123 for holding the side surface of the workpiece W during polishing is connected to the polishing head main body 121.
- the polishing head main body 121 is connected to a height adjusting mechanism 124 and has a structure capable of changing the position of the guide ring 123 in the height direction up and down. In this way, the gap between the guide ring 123 connected to the polishing head main body 121 and the polishing cloth is kept constant, and the workpiece is stably held for polishing.
- the work pressure method of the polishing head is such that the height of the polishing head relative to the polishing cloth is fixed so that the distance between the two is constant, and the rubber film of the polishing head is expanded to apply pressure. It is a method to do.
- the position of the polishing head in the height direction relative to the polishing cloth Must be adjusted to be the same each time.
- the current method for adjusting the height of the polishing head is to measure the distance from the polishing cloth 107 using a laser displacement meter 130 installed in the vicinity of the mounting surface of the polishing head 120 and measure the distance. Based on the measured distance, the height of the polishing head is adjusted so that the desired distance between the polishing head and the polishing cloth is obtained.
- the measured value is temporally measured by the conventional method of measuring the distance using a laser displacement meter. It will vary greatly. For this reason, it is difficult to stably adjust the position in the height direction of the polishing head to a desired position for each polishing, and there arises a problem that the flatness of the work deteriorates or the flatness varies between works. .
- the present invention has been made in view of the above-described problems, and provides a method for adjusting the position in the height direction of the polishing head capable of stably and accurately adjusting the position in the height direction of the polishing head. Objective.
- the present invention provides a workpiece polishing method that can improve the flatness of a workpiece to be polished by adjusting the position in the height direction of the polishing head with high accuracy, and can suppress variations in the flatness between the workpieces. For the purpose.
- an abrasive cloth affixed on a surface plate an abrasive supply mechanism for supplying an abrasive to the abrasive cloth, and an annular guide ring
- a polishing head that holds the back surface of the workpiece while holding a side surface, a torque measuring mechanism that measures a load torque current of at least one of the polishing head and the surface plate, and a vertical movement of the polishing head in the height direction.
- a height adjusting mechanism for adjusting a distance between the guide ring and the polishing cloth, and the workpiece held by the polishing head adjusted to a predetermined position by the height adjusting mechanism is used as the polishing cloth.
- the load torque current of at least one of the panels is measured by the torque measuring mechanism, and the position in the height direction of the polishing head when the measured change amount of the load torque current exceeds a predetermined threshold is set as a reference position. Adjusting the position of the polishing head in the height direction to a predetermined position on the basis of the distance from the set reference position, and adjusting the position of the polishing head in the height direction Is provided.
- the polishing head can be brought into contact with the polishing pad via a sheet-like member having a known and uniform thickness. In this way, it is possible to reliably suppress damage to the polishing cloth caused by the contact between the polishing cloth and the polishing head.
- the polishing head has a disc-shaped intermediate plate at the lower part of the polishing head main body, and a rubber film that is held by the intermediate plate and covers at least a lower surface portion and a side surface portion of the intermediate plate, and the rubber A rubber chuck type polishing head that holds the back surface of the workpiece on the lower surface of the film can be used.
- the method of adjusting the position in the height direction of the polishing head of the present invention is a rubber chuck system in which the height of the polishing head with respect to the polishing cloth is fixed so that the distance between the two is constant and the workpiece is polished in a highly flat manner
- the present invention can be suitably applied to a polishing apparatus having a polishing head.
- the workpiece is held by the polishing head, and the workpiece is pressed against the polishing cloth while being supplied to the polishing cloth affixed on the surface plate to polish the workpiece.
- a method for polishing a workpiece, wherein the workpiece is polished after adjusting the position in the height direction of the polishing head by the method for adjusting the position in the height direction of the polishing head of the present invention. Provided.
- the workpiece can be polished after the position in the height direction of the polishing head is adjusted with high accuracy by the method for adjusting the position in the height direction of the polishing head of the present invention.
- Flatness can be improved, and variations in flatness between workpieces can be suppressed.
- the load torque current of at least one of the polishing head and the surface plate is brought close to the polishing head until it comes into contact with the polishing cloth by the height adjusting mechanism.
- the position in the height direction of the polishing head when the measured change amount of the load torque current exceeds a predetermined threshold is set as a reference position, and the distance from the set reference position Therefore, the position in the height direction of the polishing head is adjusted to a predetermined position, so that the position where the polishing head and the polishing cloth are in contact can be accurately measured and set as the reference position.
- the position of the polishing head in the height direction can be stably adjusted with high accuracy.
- the flatness of the workpiece can be improved, and variations in the flatness between the workpieces can be suppressed.
- the present invention is not limited to this.
- the height position of the polishing head with respect to the polishing cloth is accurately adjusted. Further, it is necessary to adjust so as to be the same for each polishing.
- the height of the polishing head is adjusted so that the distance between the polishing head and the polishing cloth is a desired distance based on the distance between the polishing head and the polishing cloth measured using a laser displacement meter.
- variations occur due to the influence of moisture on the polishing cloth and swelling of the polishing cloth as noise of distance measurement using a laser displacement meter.
- the present inventor has intensively studied to solve such problems.
- the position of the polishing head in the height direction could be adjusted stably and with high precision by setting the accurately measured contact position as a reference position and completed the present invention.
- FIG. 1 is a schematic view for explaining a method for adjusting a position in the height direction of a polishing head and a method for polishing a workpiece according to the present invention.
- the polishing apparatus 1 shown in FIG. 1 mainly includes a polishing head 2, a surface plate 6, a polishing cloth 7 affixed on the surface plate 6, and an abrasive supply for supplying the polishing agent to the polishing cloth 7.
- a mechanism 5 and torque measuring mechanisms 8a and 8b for measuring load torque currents of the polishing head 2 and the surface plate 6 are provided.
- the polishing head 2 is provided with an annular guide ring 3 so as to protrude toward the polishing cloth along the outer periphery, and the guide ring 3 can hold the back surface of the workpiece W while holding the side surface of the workpiece W. It can be done.
- the polishing apparatus 1 has a height adjusting mechanism 4 that adjusts the distance between the guide ring 3 and the polishing pad 7 by moving the polishing head 2 up and down in the height direction.
- a height adjusting mechanism 4 that adjusts the distance between the guide ring 3 and the polishing pad 7 by moving the polishing head 2 up and down in the height direction.
- the polishing head 2 that holds the workpiece W for example, a rubber chuck type that will be described later can be used.
- the back surface of the workpiece W is held via a backing pad, and the workpiece W is pressurized by ejecting fluid from the back surface side of the workpiece W toward the polishing cloth through an opening provided in the polishing head.
- a polishing head can also be used.
- FIG. 2 is a schematic view showing an example of a rubber chuck type polishing head.
- the polishing head 20 mainly includes a polishing head main body 21, a rubber film 22, an annular guide ring 23, a height adjusting mechanism 24, and a disc-shaped intermediate plate 25.
- the rubber film 22 is sandwiched by the intermediate plate 25 so as to cover at least the lower surface portion and the side surface portion of the intermediate plate 25.
- the back surface of the workpiece W is held on the lower surface portion of the rubber film 22.
- the intermediate plate 25 is fixed to the polishing head main body 21 having a flange structure.
- a guide ring 23 for holding the side surface of the workpiece W during the polishing process is disposed along the outer periphery of the workpiece W, and the guide ring 23 is connected to the polishing head main body 21.
- the height adjustment mechanism 4 adjusts the polishing head 2 to a predetermined position, that is, adjusts the position of the polishing head 2 in the height direction so that the polishing pad 7 and the guide ring 3 are separated by a predetermined distance. Then, with the polishing head 2 fixed at the adjusted position, the held workpiece W is pressed against the polishing cloth 7 and polished.
- the method for adjusting the position in the height direction of the polishing head of the present invention is a method for adjusting the position in the height direction of the polishing head in such a polishing apparatus.
- the method for adjusting the position in the height direction of the polishing head of the present invention will be described in detail with reference to FIG.
- the polishing head 2 and the surface plate 6 is rotated.
- polishing head 2 and the surface plate 6 may be sufficient, and either may be sufficient.
- the polishing head 2 is brought close to contact with the polishing cloth 7 by the height adjusting mechanism 4. That is, the polishing head 2 is sent downward, and the guide ring 3 which is the lowermost part of the polishing head 2 is brought into contact with the polishing cloth 7. At this time, it is preferable to adjust the feed rate so that the polishing cloth 7 does not receive damage due to contact with the guide ring 3.
- the contact of the polishing head 2 with the polishing pad 7 can be performed via a known and uniform sheet-like member.
- the sheet-like member has a known and uniform thickness. There is no adverse effect on the adjustment of the position in the height direction.
- the load torque current of at least one of the rotated polishing head 2 and the surface plate 6 is measured by the torque measuring mechanisms 8a and 8b, respectively. Then, when the measured change amount of the load torque current exceeds a predetermined threshold, that is, the position in the height direction of the polishing head 2 at which it can be determined that the polishing head 2 and the polishing pad 7 are in contact is set as the reference position.
- a predetermined threshold that is, the position in the height direction of the polishing head 2 at which it can be determined that the polishing head 2 and the polishing pad 7 are in contact.
- whether or not the amount of change in the load torque current exceeds a predetermined threshold value may be determined by either the polishing head or the surface plate, or may be determined when both exceed the threshold value.
- the reference position which is the position where the polishing head and the polishing cloth are in contact as described above, it is possible to set the reference position accurately without causing variations in each measurement. Based on the distance from the reference position set accurately in this way, the position of the polishing head 2 in the height direction is adjusted to a predetermined position.
- the position in the height direction of the polishing head is more stable than the conventional one based on the distance from the accurate reference position measured without variation. And can be adjusted with high accuracy.
- the reference position is set according to the method for adjusting the position in the height direction of the polishing head of the present invention described above. After setting the reference position, the workpiece W to be polished by the polishing head 2 is held. Then, the position of the polishing head 2 in the height direction is adjusted to a predetermined position based on the set distance from the reference position.
- the predetermined position in the height direction of the polishing head 2 can be set, for example, such that the distance between the guide ring and the polishing cloth is 25 to 45% of the thickness of the workpiece. By doing so, it is possible to prevent a decrease in the polishing rate caused by insufficient supply of the abrasive that occurs when the distance between the guide ring and the polishing cloth is too short, and polishing processing when the distance is too long It is possible to prevent the workpiece from being unable to be held inside. Thereafter, the polishing head and the surface plate are rotated under predetermined polishing conditions, and the workpiece W is pressed against the polishing cloth while being supplied to the polishing cloth attached to the surface plate, and is polished.
- This polishing condition is not particularly limited, and may be any condition generally employed.
- a rubber chuck type polishing head as shown in FIG. 2 can be used as the polishing head.
- the polishing head is fixed to a position in the desired height direction to stably hold the workpiece, and the polishing head of the rubber chuck system that can polish the workpiece by applying a uniform polishing load to the entire workpiece
- the method for adjusting the position in the height direction of the polishing head of the present invention that can adjust the position in the height direction stably and with high accuracy, it is possible to stably perform polishing on a workpiece with improved flatness.
- the workpiece was polished according to the method for adjusting the position in the height direction of the polishing head and the workpiece polishing method of the present invention, and the flatness was evaluated.
- a silicon wafer having a diameter of 300 mm is polished by using a polishing apparatus as shown in FIG. 1 having a rubber chuck type as a polishing head as shown in FIG. 2, and the maximum value, minimum value, and average value of flatness are polished.
- Each of the variations was evaluated.
- the flatness was evaluated by GBIR (Global Backside Ideal Range) in a region excluding the outer peripheral portion of 2 mm using KLA's Wafersight.
- FIG. 3 is a view showing the measured change amount of the load torque current and the position of the polishing head in the height direction when the set reference position is zero. As shown in FIG. 3, the position in the height direction of the polishing head when the amount of change in the load torque current changes abruptly and exceeds a threshold value 2 (arbitrary unit) was taken as the reference position.
- the polishing conditions were as follows. An alkaline solution containing colloidal silica was used as an abrasive, and a non-woven fabric impregnated with urethane having a groove structure was used as the abrasive cloth.
- the polishing head and the surface plate were each rotated at 30 rpm, the polishing load was 25 kPa, and the polishing time was 100 seconds.
- the adjustment of the position of the polishing head in the height direction and the polishing of the silicon wafer were repeated for 100 silicon wafers, and the flatness was evaluated.
- GBIR has a maximum value of 120 nm, a minimum value of 88 nm, and an average value of 103 nm, which is improved as compared with a maximum value of 164 nm, a minimum value of 91 nm, and an average value of 120 nm in a comparative example described later.
- the difference between the maximum value and the minimum value was 32 nm, whereas in the comparative example described later, the variation was 73 nm, which was improved. This is considered to be because when the position in the height direction of the polishing head was adjusted for each polishing, the position could be stably adjusted to a predetermined position with high accuracy.
- the position in the height direction of the polishing head can be stably adjusted with high accuracy by the method for adjusting the position in the height direction of the polishing head and the method for polishing the work of the present invention. It was confirmed that the flatness could be improved and the variation in flatness between workpieces could be suppressed.
- FIG. 4 shows the result of measuring the distance between the polishing head and the polishing cloth using a laser displacement meter.
- FIG. 4 shows the change over time of the distance between the polishing head and the polishing cloth measured for each polishing. As shown in FIG. 4, it can be seen that the distance changes greatly with the passage of time.
- Table 1 the measurement results of flatness are shown in Table 1.
- Table 1 GBIR was worse than the examples, with a maximum value of 164 nm, a minimum value of 91 nm, and an average value of 120 nm. This is presumably because the polishing head could not be adjusted to an appropriate position with high accuracy due to the measurement error of the distance between the polishing head and the polishing cloth by the laser displacement meter.
- the difference between the maximum value and the minimum value was 73 nm, which was worse than that of the example. This is thought to be due to variations in the position adjustment of the polishing head every polishing.
- the present invention is not limited to the above embodiment.
- the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits the same function and effect. Are included in the technical scope.
Abstract
Description
研磨ヘッド本体121には研磨加工中にワークWの側面を保持するための環状のガイドリング123が連結されている。また、研磨ヘッド本体121は高さ調整機構124に連結されており、ガイドリング123の高さ方向の位置を上下に変化させることができる構造となっている。このように、研磨ヘッド本体121に連結されたガイドリング123と研磨布との間の隙間を一定に保ち、安定にワークを保持して研磨を行う。
このようにすれば、研磨布と研磨ヘッドが接触することによって発生する研磨布へのダメージを確実に抑制することができる。
本発明の研磨ヘッドの高さ方向の位置の調整方法は、研磨布に対しての研磨ヘッドの高さを両者の間隔が一定となるように固定して高平坦にワークを研磨するラバーチャック方式の研磨ヘッドを有する研磨装置に好適に適用されることができる。
上記したように、ワークの研磨に、研磨ヘッドと研磨布の間を固定させたままで行う方式の研磨ヘッドを用いる場合には、研磨布に対しての研磨ヘッドの高さ位置を正確に調整し、さらに研磨毎に同じになるように調整する必要がある。
しかし、従来の調整方法では、レーザー変位計を用いて測定した研磨ヘッドと研磨布との距離を基準にして、研磨ヘッドと研磨布の間が所望の距離となるように研磨ヘッドの高さを調整しており、研磨布上の水分や研磨布の膨潤等の影響がレーザー変位計を用いた距離の測定のノイズとなってばらつきが発生してしまうという問題がある。
図1は本発明の研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法を説明する概略図である。
研磨ヘッド2には外周部に沿って研磨布側に突出するように環状のガイドリング3が設けられており、ガイドリング3でワークWの側面を保持しながらワークWの裏面を保持することができるようになっている。
このとき、ワークWを保持する研磨ヘッド2として、例えば後述するラバーチャック方式のものを用いることができる。或いは、ワークWの裏面をバッキングパッドを介して保持し、ワークWの裏面側から研磨布側に向かって研磨ヘッドに設けられた開口を介して流体を噴出することでワークWを加圧するような研磨ヘッドを用いることもできる。
この研磨ヘッド20は主に、研磨ヘッド本体21、ラバー膜22、環状のガイドリング23、高さ調整機構24、円盤状の中板25を有している。ラバー膜22は中板25によって、少なくとも中板25の下面部と側面部とを覆うように挟持される。このラバー膜22の下面部にワークWの裏面が保持される。
以下、図1を参照して本発明の研磨ヘッドの高さ方向の位置の調整方法について詳細に説明する。
まず、ワークWが保持されていない状態で、研磨ヘッド2を研磨布7と接触しない高さ方向の位置に位置決めする。その後、研磨ヘッド2と定盤6の少なくとも一方を回転させる。ここで、回転させるのは後述する負荷トルク電流を測定する側に対応していれば、研磨ヘッド2と定盤6の両方でも良いし、どちらか一方でも良い。
このように正確に設定した基準位置からの距離に基づいて、研磨ヘッド2の高さ方向の位置を所定位置に調整する。このような本発明の研磨ヘッドの高さ方向の位置の調整方法であれば、ばらつきなく測定した正確な基準位置からの距離に基づいて、研磨ヘッドの高さ方向の位置を従来に比べより安定して高精度に調整できる。
まず、上記した本発明の研磨ヘッドの高さ方向の位置の調整方法に従って、基準位置の設定までを行う。この基準位置の設定後、研磨ヘッド2で研磨するワークWを保持する。そして、設定した基準位置からの距離に基づいて、研磨ヘッド2の高さ方向の位置を所定位置に調整する。
その後、研磨ヘッド及び定盤を所定の研磨条件で回転させ、定盤上に貼り付けられた研磨布に研磨剤を供給しながらワークWを研磨布に対して押圧して研磨する。この研磨条件は特に限定されず、一般に採用されるいずれの条件であってもよい。
本発明の研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法に従ってワークを研磨し、その平坦度を評価した。
研磨ヘッドとして図2に示すようなラバーチャック方式のものを有した図1に示すような研磨装置を用いて直径300mmのシリコンウェーハを100枚研磨し、平坦度の最大値、最小値、平均値、ばらつきをそれぞれ評価した。また、平坦度は、KLA社のWafersightを用いて外周部2mmを除外した領域でのGBIR(Global Backside Ideal Range)にて評価を行った。
この際、定盤のみを回転させて定盤の負荷トルク電流を測定した。図3はこの測定した負荷トルク電流の変化量と設定した基準位置を0としたときの研磨ヘッドの高さ方向の位置を示す図である。図3に示すように、負荷トルク電流の変化量が急激に変化し、閾値2(任意単位)を超えた時点の研磨ヘッドの高さ方向の位置を基準位置とした。
上記した研磨ヘッドの高さ方向の位置の調整とシリコンウェーハの研磨を100枚のシリコンウェーハに対して繰り返し、その平坦度を評価した。
従来の図5に示すような研磨装置で、レーザー変位計を用いて研磨ヘッドの高さ方向の位置を調整した後、実施例と同様の研磨条件でシリコンウェーハを研磨し、これを100枚のシリコンウェーハに対して繰り返し、実施例と同様に評価した。
図4にレーザー変位計を用いて研磨ヘッドと研磨布との距離を測定した結果を示す。図4は研磨毎に測定した研磨ヘッドと研磨布との距離の経時変化の様子を示したものである。図4に示すように、時間の経過によって距離が大きく変化していることが分かる。
Claims (4)
- 定盤上に貼り付けられた研磨布と、該研磨布に研磨剤を供給するための研磨剤供給機構と、環状のガイドリングでワークの側面を保持しながら前記ワークの裏面を保持する研磨ヘッドと、該研磨ヘッドと前記定盤のうち少なくとも一方の負荷トルク電流を測定するトルク測定機構と、前記研磨ヘッドを高さ方向に上下動させて前記ガイドリングと前記研磨布との間の距離を調整する高さ調整機構とを具備し、前記高さ調整機構で所定位置に調整された前記研磨ヘッドに保持された前記ワークを前記研磨布に対して押圧して研磨する研磨装置における、前記研磨ヘッドの高さ方向の位置の調整方法であって、
前記ワークが保持されていない前記研磨ヘッドを前記研磨布と接触しない高さ方向の位置に位置決めした後、前記研磨ヘッドと前記定盤のうち少なくとも一方を回転させる工程と、
前記高さ調整機構によって前記研磨ヘッドを前記研磨布に接触させるまで近づけながら、前記回転させた研磨ヘッドと前記定盤のうち少なくとも一方の負荷トルク電流を前記トルク測定機構によって測定し、該測定した負荷トルク電流の変化量が所定の閾値を超えた時点の前記研磨ヘッドの高さ方向の位置を基準位置として設定する工程と、
前記設定した基準位置からの距離に基づいて、前記研磨ヘッドの高さ方向の位置を所定位置に調整する工程とを有することを特徴とする研磨ヘッドの高さ方向の位置の調整方法。 - 前記基準位置を設定する工程における前記研磨ヘッドの前記研磨布への接触を、既知で均一な厚さを有するシート状部材を介して行うことを特徴とする請求項1に記載の研磨ヘッドの高さ方向の位置の調整方法。
- 前記研磨ヘッドとして、研磨ヘッド本体の下部に円盤状の中板と、該中板に保持され少なくとも前記中板の下面部と側面部とを覆うラバー膜とを有し、該ラバー膜の下面部に前記ワークの裏面を保持するラバーチャック方式の研磨ヘッドを用いることを特徴とする請求項1又は請求項2に記載の研磨ヘッドの高さ方向の位置の調整方法。
- 研磨ヘッドでワークを保持し、定盤上に貼り付けられた研磨布に研磨剤を供給しながら前記ワークを前記研磨布に対して押圧して研磨するワークの研磨方法であって、請求項1乃至3のいずれか1項に記載の研磨ヘッドの高さ方向の位置の調整方法によって前記研磨ヘッドの高さ方向の位置を調整した後、前記ワークの研磨を行うことを特徴とするワークの研磨方法。
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