WO2012163293A1 - 超小型化无源抗金属射频识别标签 - Google Patents

超小型化无源抗金属射频识别标签 Download PDF

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Publication number
WO2012163293A1
WO2012163293A1 PCT/CN2012/076388 CN2012076388W WO2012163293A1 WO 2012163293 A1 WO2012163293 A1 WO 2012163293A1 CN 2012076388 W CN2012076388 W CN 2012076388W WO 2012163293 A1 WO2012163293 A1 WO 2012163293A1
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WO
WIPO (PCT)
Prior art keywords
tag
label
layer
hole
ground layer
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PCT/CN2012/076388
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English (en)
French (fr)
Inventor
刘智佳
Original Assignee
Liu Zhijia
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Publication date
Application filed by Liu Zhijia filed Critical Liu Zhijia
Publication of WO2012163293A1 publication Critical patent/WO2012163293A1/zh

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Definitions

  • the present invention relates to an RFID (Radio Frequency Identification) tag, and more particularly to an ultra-miniature passive anti-metal radio frequency identification tag. Background technique
  • Radio Frequency Identification is a non-contact automatic identification technology. Its basic principle is to transmit energy and exchange information by using the transmission characteristics of radio frequency signals and electromagnetic coupling to achieve non-contact identification of the identified objects.
  • the RFID system contains at least two parts, an electronic tag and a reader.
  • the electronic tag is the data carrier of the radio frequency identification system, and the electronic tag is composed of a tag antenna and a tag-dedicated chip.
  • the electronic tag can be divided into an active tag, a passive tag, and a semi-passive tag.
  • the active electronic tag contains a battery, the passive radio frequency tag does not have a built-in battery, and the semi-passive tag partially relies on the battery.
  • label miniaturization is one of the research hotspots in RFID technology and application fields, especially in the field of management and tracking of medical devices (especially surgical instruments), small tools, and special-shaped tools.
  • the antennas used are mainly divided into two types: tag antennas and reader antennas. Different environments and frequencies require antennas with different characteristic parameters, and the chip is basically modular.
  • the tag antenna is the most variable part of the RFID system, and its design faces the reality of miniaturization, conformalization, low loss and low cost. Requirements, and in the premise of meeting the international standards of different reader transmit power, can have a longer read range. Therefore, optimized design tag antennas play an important role in the overall system.
  • anti-metal tags are mostly made of microstrip structures, folded structures, and short-circuit matched antennas.
  • the label with the folded structure antenna is composed of the label base, the label chip, the radiation surface layer and the ground layer.
  • the label is composed of a plurality of radiating surfaces, so that the manufacturing cost is high, and there are some parts in the process of folding. The energy loss makes the reading performance of the label poor.
  • the present invention is directed to overcoming the deficiencies of the prior art and providing an ultra-miniature passive metal-resistant radio frequency identification tag.
  • Another object of the present invention is to provide an ultra-miniature passive anti-metal radio frequency identification tag which can greatly reduce the overall size of the tag by loading the capacitance matching component and can satisfy better read distance performance.
  • An ultra-miniature passive anti-metal radio frequency identification tag comprising: a label base, a label chip disposed on the label base, a radiation surface layer and a ground layer; the radiation surface layer and the ground layer are respectively fixed on The upper surface and the lower surface of the label base; further comprising a capacitance matching component disposed on the label base; wherein one end of the radiation surface layer is electrically connected to one end of the ground layer, and two of the label chip The terminals are respectively connected in series to the ground layer and the other end of the radiation surface layer; the capacitance matching elements are connected in parallel to both ends of the label chip.
  • the tag base body is a rectangular parallelepiped;
  • the interface includes a first through hole unit and a second through hole unit, and are respectively disposed at two ends of the tag base body;
  • the first through hole unit includes at least one first connection through hole and a first connection post located in the first connection through hole,
  • the second through hole unit includes at least one second connection through hole and located at First, the second connecting post in the through hole is connected.
  • the first through-hole unit and the second through-hole unit are symmetrically disposed at two ends of the tag base.
  • one end of the radiation surface layer and one end of the ground layer are electrically connected to one end of the label base through the second through hole unit.
  • the passive anti-metal radio frequency identification tag of the present invention preferably, the radiation surface layer and the other end of the ground layer are oppositely disposed at the other end of the label base, and the first connection through-hole unit is located at the label
  • the ground layer on the upper surface of the substrate is electrically connected to the ground layer on the lower surface of the label substrate.
  • the number of through holes of the first through hole unit and the second through hole unit is six, respectively.
  • the capacitance matching component has a value ranging from 4.5 pF to 7.5 pF.
  • the capacitance matching component has a capacitance value of 5.5 pF, 6.0 pF or 7.0 pF.
  • the tag substrate has a length ranging from 5 to 15 mm, a width ranging from 1 to 5 mm, and a height ranging from 1 to 3 mm.
  • the passive anti-metal radio frequency identification tag of the present invention preferably has a size of 12 mm X 3 mm X 1.5 mm.
  • the capacitance matching component and the tag chip are located on a plane of the radiation surface layer.
  • the capacitance matching component and the tag chip are located on the side of the end face of the tag.
  • the invention adopts a closed structure antenna, which not only greatly reduces the size of the label, but also facilitates loading of the capacitance matching component.
  • an electromagnetic field radiates to the outside, and when the polarization direction of the electromagnetic field and the length direction of the label are in the same direction, the direction of the magnetic field in the electromagnetic field will be perpendicular and penetrate the side of the label.
  • the induced electromotive force is generated at the tag chip, and the chip, the antenna and the capacitor resonate.
  • the resonant frequency is adjusted by loading the capacitor matching component. When the resonant frequency is the same as the external electromagnetic field frequency, the induced electromotive force will become stronger until the tag chip is activated. The label starts working.
  • the label of the invention not only has a simple structure, low cost, and has an ultra-compact structure, and can achieve a read/write distance of >1 m in the UHF band (using a fixed reader) . That is to say, the present invention greatly reduces the overall size of the tag by loading the capacitance matching component, and at the same time, by adjusting the capacitance value of the capacitance matching component, it can satisfy the resonance of the UHF band in different countries without changing other components such as the tag chip. Frequency readers transmit power standard requirements.
  • Figure 1 is a schematic view of the structure of the present invention
  • Figure 2 is an exploded perspective view of the present invention
  • FIG. 3 is a circuit diagram of the present invention. detailed description
  • the ultra-miniature passive anti-metal radio frequency identification tag of the present invention is used in the field of management and tracking of medical instruments (especially surgical instruments), small tools, and special-shaped tools, and will be exemplified in detail below.
  • the ultra-miniature passive anti-metal radio frequency identification tag 10 of the present invention comprises: a tag substrate 20, a tag chip 30, a capacitance matching component 40, a radiation surface layer 50, and a ground layer 60.
  • the tag chip 30 is used for wireless transmission and reception and storage of information, and the tag chip 30 can be attached to the end side position of the tag substrate 20 in the longitudinal direction by a protective glue or other fixing means.
  • the capacitive matching component 40 can be mounted to the side of the label substrate 20 with a protective glue or other securing means.
  • Capacitor matching component 40 is typically a capacitive or similar capacitive component.
  • the label substrate 20 can be of any shape, and the radiation surface layer 50 and the ground layer 60 are respectively located on the upper and lower surface layers of the label substrate 20.
  • the radiation surface layer 50, the label substrate 20, and the ground layer 60 are tightly bonded together.
  • the radiation surface layer 50, the label substrate 20, and the ground layer 60 are sized and shaped.
  • the radiation surface layer 50 and the ground layer 60 are generally made of a conductive medium material such as copper, silver or the like. Moreover, the shape of the radiation surface layer 50 and the ground layer 60 may be any one of a circular shape, an elliptical shape, a polygonal shape, or an irregular pattern, depending on the environment and design requirements used.
  • the upper surface and the lower surface of the rectangular parallelepiped label substrate 20 are covered with a radiation surface layer 50 made of a metal material and a ground layer 60, respectively.
  • One end of the radiation surface layer 50 and one end of the ground layer 60 are electrically connected to one end of the label base 20 through an interface.
  • one end of the radiating surface layer 50 and one end of the ground layer 60 may be integrally and electrically connected without the need for an interface connection.
  • the other end of the ground layer 60 is located on the upper surface of the other end of the label base 20, and the ground layer 60 of the upper and lower surfaces is electrically connected.
  • the interface is a first through hole unit 21 and a second through hole unit 22 symmetrically disposed at two ends of the label base.
  • the first through hole unit 21 includes a first connecting through hole 211 and a first connecting post 212.
  • the first connecting through hole 211 has a plurality of connecting through holes arranged in parallel with the edge of the label substrate 20. Preferably, the number of through holes is six.
  • the first connecting post 212 is tightly embedded in the first connecting through hole 211 and corresponds to the first connecting through hole 211.
  • the first connecting post 212 extends from the inside of the tag base 20 to the upper and lower surfaces thereof, the first connection
  • the column 212 is usually made of a conductor material, such as a metal material such as copper or silver, and has a columnar shape, and the columnar shape may be any one of a columnar shape, an elliptical column shape, a polygonal column shape, and an irregular pattern column shape.
  • the second through hole unit 22 includes a second connecting through hole 221 and a second connecting post 222.
  • the second connecting through hole 221 has a plurality of connecting through holes arranged in parallel with the edge of the label substrate 20. Preferably, the number of through holes is 6.
  • the second connecting post 222 is tightly embedded in the second connecting through hole 221 and corresponds to the second connecting through hole 221 in size and quantity;
  • the second connecting post 222 extends from the inside of the label base 20 to the upper and lower surfaces thereof, and the second connecting post 222 is usually made of a conductive material, such as a metal material such as copper or silver, and has a columnar shape, wherein the columnar shape may be a cylindrical shape or an elliptical column shape. Any of a polygonal columnar shape and an irregular graphic columnar shape.
  • the radiation surface layer 50 and the ground layer 60 are each provided with a plurality of holes corresponding to the first connection through holes 21 1 and the second connection through holes 221, and are generally the first connection through holes 211 and the second connection through holes 221 Extended hole.
  • the first connecting post 212 and the second connecting post 222 electrically connect the upper surface and the lower surface of the label base 20 with a layer of the radiation surface layer 50 made of a metal material and one end of the ground layer 60 to each other to form a closed Circuit.
  • the ground layer 60 covers the lower surface of the tag chip 20, while the other ends of the radiation mask layer 50 and the ground layer 60 are respectively located on the upper surface of the tag chip 20.
  • the radiating surface The other end of the layer 50 and the ground layer 60 are opposed to each other with a gap therebetween.
  • Both ends of the tag chip 30 are connected in series with the other end of the ground layer 60 and the radiation surface layer 50 at a gap between the radiation surface layer 50 of the upper surface of the label chip 20 and the other end of the ground layer 60; the capacitor matching element 40 is also stringed.
  • the other end of the ground layer 60 and the radiation surface layer 50 is connected in parallel with the tag chip 30.
  • the tag chip 30 and the capacitor matching component 40 are both located on the plane of the radiation surface layer 50.
  • the tag chip 30 and the capacitor matching component 40 are bound to the right side of the label substrate 20 by a protective glue, adjacent to the first through hole.
  • the distance between the capacitor matching component 40 and the tag chip 30 may range from 1 mm to 10 mm.
  • the radio frequency identification tag of the present invention can be equivalent to an LC resonant circuit based on the microstrip line transmission line theory, as shown in the figure.
  • L e is the equivalent inductance of the resonant tank
  • C t is the equivalent capacitance of the entire loop
  • C t C p + C .
  • R p and C P are the resistance and capacitance of the tag chip used, and these two values are provided by the manufacturer of the tag chip. If f c is in the UHF band and is within the international standard of the corresponding design, the tag will have a far read response in the international band.
  • the label base may have a length ranging from 5 to 15 mm, a width ranging from 1 to 5 mm, and a height ranging from 1 to 3 mm.
  • the label base has a size of 12 mm X 3 mm X 1.5 mm.
  • the capacitance value of the set capacitor matching component 40 can range from 4.5 pF to 7.5 pF, and can be adjusted according to different national standards in this range to meet the national reader transmit power standards. In the test, capacitor matching components with parallel capacitance values of 5.5pF, 6.0pF, and 7.0pF achieved very good results, that is, the tag will have a far-reaching read response in the UHF band, below 4.5. The effect of pF or above 7.5 pF is significantly poor.
  • the present invention adjusts the value of the component in the resonant tank by setting the value and position of the capacitive matching component 40 to achieve the purpose of reducing the size of the tag and maintaining the read/write distance.
  • the capacitive matching component 40 can also be a tunable capacitor.

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  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种超小型化无源抗金属射频识别标签(10),其包括:标签基体(20)、设置在标签基体(20)上的标签芯片(30)、辐射面层(50)及接地层(60);辐射面层(50)和接地层(60)分别固定于标签基体(20)的上表面和下表面;还包括设置在标签基体(20)上的电容匹配元件(40)。其中,辐射面层(50)的一端与接地层(60)的一端通过一接口电连接,标签芯片(30)的两端分别串接于接地层(60)和辐射面层(50)的另一端;电容匹配元件(40)并联于标签芯片(30)的两端。本发明通过加载电容匹配元件(40)使得标签整体尺寸大大减小,同时通过调整电容匹配元件(40)的电容值,在不改变标签芯片(30)等其它元件性能的情况下,能满足不同国家所需的发射功率标准,并在UHF频段具有较好的读距性能。

Description

超小型化无源抗金属射频识别标签
技术领域
本发明涉及一种 RFID (Radio Frequency Identification, 无线射频识别)标签, 尤其涉 及一种超小型化无源抗金属射频识别标签。 背景技术
无线射频识别 ( Radio Frequency Identification, RFID ) 是一种非接触的自动识别 技术, 其基本原理是利用射频信号和电磁耦合的传输特性来传递能量和交换信息, 实 现对被识别物体的非接触识别。
RFID系统至少包含电子标签和阅读器两部分。 电子标签是射频识别系统的数据 载体, 电子标签由标签天线和标签专用芯片组成。 依据电子标签供电方式的不同, 电 子标签可以分为有源电子标签 (Active tag)、无源电子标签 (Passive tag)和半无源电子标 签 (Semi— passive tag)。 有源电子标签内装有电池, 无源射频标签没有内装电池, 半 无源电子标签 (Semi— passive tag)部分依靠电池工作。
目前标签小型化是 RFID 技术和应用领域的研究热点之一,尤其应用在医疗器械 (特别是手术器械) 、 小型工具、 异形工具的管理与追踪领域中。 由于在 RFID 系统 中, 所采用的天线主要分为标签天线和读写器天线两种。不同的环境和频率要求具有 不同特性参数的天线,而芯片基本已模块化,标签天线是 RFID系统中最易变的部分, 其设计面临着小型化、 共形化、 低损耗和低成本的实际要求, 且在满足读写器发射功 率不同的国际标准前提下, 能有较远读距的需求。 因此, 优化设计标签天线在整个系 统中占有重要地位。
例如, 市场上抗金属标签多采用微带结构、 折合结构和短路匹配式天线等。 具有 折合结构天线的标签由标签基体、 标签芯片、 辐射面层及接地层组成, 通常情况下, 这种标签由多层辐射面组成, 使得制作成本较高, 另外折合的过程中会有部分的能量 损失, 使得标签的读距性能较差。
另外, 目前各国的读写器发射功率标准是不同的, 例如, 在 1000M频段左右, 美国使用 915M, 欧洲使用 866M。
因此, 目前迫切需要设计出一种超小型化, 并且读写器发射功率在不同国际标准 下可以调节并具有较远读距的无源抗金属射频识别标签来满足市场的需要。 发明内容
本发明目的在于克服现有技术的存在的不足之处,提供一种超小型化无源抗金属 射频识别标签。
本发明另一目的在于提供了一种超小型化无源抗金属射频识别标签,其通过加载 电容匹配元件使得标签整体尺寸大大减小, 并能满足较好的读距性能。
为实现上述目的, 本发明的技术方案如下:
一种超小型化无源抗金属射频识别标签, 所述标签包括: 标签基体、 设置于所述标签 基体上的标签芯片、辐射面层及接地层; 所述辐射面层和接地层分别固定于所述标签基体 的上表面和下表面; 还包括设置于所述标签基体上的电容匹配元件; 其中, 所述辐射面层 的一端与所述接地层的一端电连接,所述标签芯片的两端分别串接于所述接地层和所述辐 射面层另一端; 所述电容匹配元件并联于所述标签芯片的两端。
本发明的无源抗金属射频识别标签, 优选地, 所述标签基体为一长方体; 所述接 口包括第一通孔单元和第二通孔单元, 并分别设置于所述标签基体的两端; 所述第一 通孔单元包括至少一个第一连接通孔和位于所述第一连接通孔中的第一连接柱,所述 第二通孔单元包括至少一个第二连接通孔和位于所述第而连接通孔中的第二连接柱。
本发明的无源抗金属射频识别标签, 优选地, 所述第一通孔单元和第二通孔单元 对称设置于所述标签基体的两端。
本发明的无源抗金属射频识别标签, 优选地, 所述辐射面层的一端与所述接地层 的一端通过所述的第二通孔单元在所述标签基体的一端电连接。
本发明的无源抗金属射频识别标签, 优选地, 所述辐射面层和所述接地层的另一 端在所述标签基体的另一端相对设立,通过所述第一连接通孔单元将位于标签基体上 表面的接地层和位于标签基体下表面的接地层电连接。
本发明的无源抗金属射频识别标签, 优选地, 所述第一通孔单元和第二通孔单元 的通孔数分别为 6个。
本发明的无源抗金属射频识别标签, 优选地, 所述电容匹配元件数值范围为 4.5pF-7.5pF。
本发明的无源抗金属射频识别标签, 优选地, 所述电容匹配元件的电容值 5.5pF、 6.0pF或 7.0pF。 本发明的无源抗金属射频识别标签,优选地,所述标签基体长度范围为 5-15mm, 宽度范围为 l-5mm, 高度范围为 l-3mm。
本发明的无源抗金属射频识别标签,优选地,所述标签基体的尺寸为 12mm X 3mm X 1.5mm。
本发明的无源抗金属射频识别标签, 优选地, 所述电容匹配元件与标签芯片均位 于辐射面层的平面上。
本发明的无源抗金属射频识别标签, 优选地, 所述电容匹配元件与标签芯片均位 于所述标签的端面侧部。
本发明采用了闭合式结构的天线, 不仅大幅度降低了标签的尺寸, 而且较易加载 电容匹配元件。 根据电磁感应原理, 本发明标签在 UHF频段工作时, 外界有电磁场 向它辐射, 并且电磁场的极化方向和标签的长度方向在同一方向时, 电磁场中的磁场 方向将会垂直并贯穿标签侧面, 在标签芯片处产生感生电动势, 芯片、 天线及电容产 生谐振,通过加载电容匹配元件来调整谐振频率,当谐振频率和外界电磁场频率相同, 感生电动势将会变强, 直至激活标签芯片, 使标签开始工作。
本发明技术方案的有益之处在于: 本发明的标签不仅结构简单、 成本较低、 具有 超小型化结构, 且能达到在 UHF频段时其读写距离 >1米 (使用固定式读写器) 。 也就是说, 本发明通过加载电容匹配元件使得标签整体尺寸大大减小, 同时通过调整 电容匹配元件的电容值, 在不改变标签芯片等其它元件的情况下, 能满足不同国家在 UHF频段对谐振频率读写器发射功率标准的要求。 附图说明
下面根据附图和实施例对本发明作进一步详细说明。
图 1是本发明的结构示意图;
图 2是本发明的分解立体图;
图 3是本发明的电路图。 具体实施方式
以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书 所揭示的内容轻易地了解本发明的其它优点与功效。本发明也可通过其它不同的具体 实例加以实施或应用, 本说明书中的各项细节亦可基于不同观点与应用, 在不背离本 发明的目的下进行各种修饰与变更。
本发明的超小型化无源抗金属射频识别标签,用于医疗器械(特别是手术器械)、 小型工具、 异形工具的管理与追踪领域中, 以下将详细举例说明。
如图 1所示, 本发明的超小型化无源抗金属射频识别标签 10, 其包括: 标签基 体 20、 标签芯片 30、 电容匹配元件 40、 辐射面层 50及接地层 60。
标签芯片 30用于无线收发和存贮信息,标签芯片 30可以用保护胶或者其它固定 装置来安装于标签基体 20的长度方向的端面侧部位置。
电容匹配元件 40可以用保护胶或者其它固定装置来安装于标签基体 20的侧部位 置。 电容匹配元件 40—般为电容或者类似电容特性的元件。
如图 2所示, 标签基体 20可以为任何形状, 辐射面层 50和接地层 60分别位于 标签基体 20的上、 下表面层。 辐射面层 50、 标签基体 20以及接地层 60紧紧地结合 在一起, 通常情况下, 辐射面层 50、 标签基体 20以及接地层 60的大小形状相一致。
辐射面层 50和接地层 60—般为导电介质材料制成, 比如铜、 银等金属材料。 并 且, 针对所使用的环境和设计的要求, 辐射面层 50和接地层 60的形状可以为圆形、 椭圆形、 多边形或者不规则图形当中任意一种。
在本实施例中, 在长方体形状的标签基体 20的上表面和下表面, 分别覆盖有一 层由金属材料制成的辐射面层 50和接地层 60。辐射面层 50的一端与接地层 60的一 端于标签基体 20的一端通过一接口电连接。在一些实施例中, 辐射面层 50的一端和 接地层 60的一端可以为一整体并电连接, 无需再用接口连接。接地层 60的另一端位 于标签基体 20的另一端的上表面, 上、 下表面的接地层 60之间电连接。
如图 2所示, 所述接口为对称设置于标签基体两端的第一通孔单元 21和第二通孔单 元 22, 第一通孔单元 21包括第一连接通孔 211和第一连接柱 212, 第一连接通孔 211具 有多个与标签基材 20边缘平行排列的连接通孔, 优选地, 通孔数为 6个。第一连接柱 212 紧密嵌入在第一连接通孔 211内, 并与第一连接通孔 211相对应尺寸和数量, 第一连接柱 212自标签基体 20内部延伸至其的上下表面,第一连接柱 212通常为导体材料制成, 比如 铜, 银等金属材料, 呈柱状, 这里柱状可以是圆柱状、 椭圆柱状、 多边形柱状和不规则图 形柱状中的任意一种。
第二通孔单元 22包括第二连接通孔 221和第二连接柱 222, 第二连接通孔 221 具有多个与标签基材 20边缘平行排列的连接通孔, 优选地, 通孔数为 6个; 第二连 接柱 222紧密嵌入在第二连接通孔 221内,并与第二连接通孔 221相对应尺寸和数量; 第二连接柱 222自标签基体 20内部延伸至其的上下表面, 第二连接柱 222通常为导 体材料制成, 比如铜, 银等金属材料, 呈柱状, 这里柱状可以是圆柱状、 椭圆柱状、 多边形柱状和不规则图形柱状中的任意一种。
辐射面层 50和接地层 60上均设置有多个孔,其与第一连接通孔 21 1和第二连接 通孔 221相对应, 通常为第一连接通孔 211和第二连接通孔 221的延伸孔。
根据上述结构, 第一连接柱 212和第二连接柱 222使在标签基体 20的上表面和 下表面分别覆盖有一层金属材料制成的辐射面层 50和接地层 60的一端相互电连接成 一闭合电路。
如图 1和图 2所示, 接地层 60覆盖标签芯片 20的下表面, 同时辐射面层 50和 接地层 60的另一端分别位于标签芯片 20的上表面上, 在本实施例中, 辐射面层 50 和接地层 60的另一端相对设立, 中间相隔一个缝隙。
标签芯片 30的两端于标签芯片 20的上表面的辐射面层 50和接地层 60的另一端 相对设立的缝隙处串接接地层 60和辐射面层 50的另一端; 电容匹配元件 40同样串 接于接地层 60的和辐射面层 50的另一端, 呈与标签芯片 30并联的形态。
在本实施例中, 标签芯片 30和电容匹配元件 40均位于辐射面层 50的平面上, 标签芯片 30和电容匹配元件 40通过保护胶绑定在标签基体 20右侧上面, 靠近第一 通孔单元 21, 电容匹配元件 40 与标签芯片 30 之间的间隔距离范围可以为 lmm〜 10mm之间。
结合图 3说明本发明的工作原理。
本发明的射频识别标签基于微带线传输线理论可将其等效为 LC谐振回路, 如图
3所示。 该谐振回路的谐振频率为 f£ = l/(2 r Z^)。 式中 Le为谐振回路的等效电感, Ct为整个回路的等效电容, Ct = Cp + C 。 上述结构形成等效电感 Le。 Rp和 CP为所采 用的标签芯片的电阻和电容,这两个值由标签芯片的生产厂商提供。如果 fc是在 UHF 频段内, 并且在对应设计的国际标准的频段内, 标签将会在国际频段内有较远的读距 响应。
如果在需满足天线尺寸超小型化的前提下, Le将会很小, fc很难满足在设定的频 段内正常工作的要求, 因此需要通过调节 Ce的大小, 使 fC进入设定的频段, 并且, 此时标签将在设定的频段内具有较远的读距响应。
本发明中, 标签基体的长度范围可以选择为 5-15mm, 宽度范围为 l-5mm, 高度 范围为 l-3mm, 优选地, 所述标签基体的尺寸为 12mm X 3mmX 1.5mm。 设定的电容匹配元件 40的电容数值范围可以为 4.5pF-7.5pF, 在此范围内可以根 据各国不同的标准进行调节, 以满足各国读写器发射功率标准。 在测试中, 并联电容 数值为 5.5pF、 6.0pF、 7.0pF的电容匹配元件, 都达到非常好的效果, 即此时标签将 会在 UHF频段内有较远的读距响应,在低于 4.5 pF或者高于 7.5 pF效果就明显不佳。
本发明通过设置电容匹配元件 40的数值和位置,来调节谐振回路中的元件数值, 以达到缩小标签尺寸并能保持读写距离的目的。 在实际的应用中, 电容匹配元件 40 还可以是可调电容。
至此己结合实施例对本发明进行了描述。熟悉本领域的人员应当理解, 在不脱离 本发明的范围和精神的情况下, 可以容易地对所述实施例作出各种其它修改。 因此, 附属权利要求的范围并不限于上述说明, 而是要广义地解释权利要求。

Claims

权利要求
1、 一种超小型化无源抗金属射频识别标签, 所述标签包括:
标签基体、 设置于所述标签基体上的标签芯片、 辐射面层及接地层;
所述辐射面层和接地层分别固定于所述标签基体的上表面和下表面;其特征在于:还 包括设置于所述标签基体上的电容匹配元件;
其中,所述辐射面层的一端与所述接地层的一端电连接,所述标签芯片的两端分别串 接于所述接地层的和所述辐射面层的另一端;所述电容匹配元件并联于所述标签芯片的两
W o
2、 根据权利要求 1所述的标签, 其特征在于: 所述标签基体为一长方体; 所述辐射 面层的一端与所述接地层的一端在通过一接口电连接,所述接口包括第一通孔单元和第二 通孔单元,并分别设置于所述标签基体的两端;所述第一通孔单元包括至少一个第一连接 通孔和位于所述第一连接通孔中的第一连接柱,所述第二通孔单元包括至少一个第二连接 通孔和位于所述第二连接通孔中的第二连接柱。
3、 根据权利要求 2所述的标签, 其特征在于: 所述第一通孔单元和第二通孔单元对 称设置于所述标签基体的两端。
4、 根据权利要求 2所述的标签, 其特征在于: 所述辐射面层的一端与所述接地 层的一端通过所述的第二通孔单元在所述标签基体的一端电连接。
5、 根据权利要求 4所述的标签, 其特征在于: 所述辐射面层和所述接地层的另 一端在所述标签基体的另一端相对设立, 通过所述第一连接通孔单元将位于标签基 体上表面的接地层和位于标签基体下表面的接地层电连接。
6、 根据权利要求 2所述的标签, 其特征在于: 所述第一通孔单元和第二通孔单元的 通孔数分别为 6个。
7、 根据权利要求 1所述的标签, 其特征在于: 所述电容匹配元件的电容数值范围为 4.5pF-7.5pF
8、 根据权利要求 7所述的标签, 其特征在于: 所述电容匹配元件的电容值为 5.5pF
6.0pF或 7.0pF
9、 根据权利要求 1所述的标签, 其特征在于: 所述标签基体长度范围为 5-15mm 宽度范围为 l-5mm, 高度范围为 l-3mm
10、根据权利要求 9所述的标签, 其特征在于: 所述标签基体的尺寸为 12mmX 3mm X 1.5mm
11、 根据权利要求 1至 10任一所述的标签, 其特征在于: 所述电容匹配元件与标签 芯片均位于所述辐射面层的平面上。
12、根据权利要求 1的标签, 其特征在于: 所述电容匹配元件与标签芯片均位于所述 标签基体的端面侧部。
PCT/CN2012/076388 2011-06-03 2012-06-01 超小型化无源抗金属射频识别标签 WO2012163293A1 (zh)

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