WO2012156422A1 - Multilayered printed circuit board with embedded emc capacitor - Google Patents

Multilayered printed circuit board with embedded emc capacitor Download PDF

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Publication number
WO2012156422A1
WO2012156422A1 PCT/EP2012/059067 EP2012059067W WO2012156422A1 WO 2012156422 A1 WO2012156422 A1 WO 2012156422A1 EP 2012059067 W EP2012059067 W EP 2012059067W WO 2012156422 A1 WO2012156422 A1 WO 2012156422A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
metallization layer
embedded
insulating zone
Prior art date
Application number
PCT/EP2012/059067
Other languages
German (de)
French (fr)
Inventor
Angelika Schingale
Andreas Bernhardt
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2012156422A1 publication Critical patent/WO2012156422A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Multi-layer printed circuit board with embedded EMC capacitor In electrical or electronic devices, the electrical and / or electronic components required for their function are usually arranged on one or more printed circuit boards. For the electrical connection of these components metallization layers are provided on surfaces or on intermediate layers of such a printed circuit board, which form conductor tracks by suitable structuring.
  • the multilayer printed circuit board at least one arranged in ⁇ nerrenz the PCB metallization layer and is connected with at least one connector via at least one plug pin.
  • the metallization layer has around ⁇ running around a recess for the connector pin and spaced from this on an insulating zone forming recess. Between the adjacent to the recess formed part of the metallization layer and formed around the insulating part of the metallization is at least one, the Iso ⁇ lierzone bridging, embedded in the printed circuit board capacitor.
  • This EMC capacitor requires no space on the surface of the circuit board and can be easily mounted during the production of printed circuit board without requiring too ⁇ additional drilling and insertion into this hole and soldering. It can in this way an optimal connection of the EMC capacitors to the pin on the one hand and the
  • the circuit board can be made smaller.
  • the EMC capacitors can be placed closer to the signal lead of the connector pin, so that the pa ⁇ rasitäre antenna effect can be minimized.
  • the reliabil ⁇ stechnik is increased by the embedded structure and connection ⁇ technology. In addition, there is mechanical protection over the lifetime as well as during the assembly of the plug or the housing.
  • signal-carrying printed conductors are formed on one of the surfaces and / or an intermediate layer of the printed circuit board, at least one of which is electrically connected to the plug pin. It is particularly advantageous if the part of the metallization layer surrounding the insulating zone forms a ground layer.
  • FIG. 1 shows a cross section through a multilayer printed circuit board with an EMC capacitor embedded in accordance with the invention.
  • FIG. 1 shows a printed circuit board 1 which is shown in FIG.
  • Example of three insulating layers is formed on and between which conductor tracks 3 and a metallic layer 5, 6 are formed.
  • the invention can also be applied to only two or more than three insulating layers.
  • Both on the interconnects 3 on the surfaces of the circuit board 1 and on the interconnects 3, which are arranged on intermediate layers, components 4 are mounted.
  • the individual layers of the printed circuit board 1 are thereby provided separately with metallizations in which - for example by etching - conductor tracks are structured in order to place the components 4 thereon.
  • the lying on the inner layers of the circuit board 1 components 4 are embedded in the assembly of the circuit board 1 in this.
  • 1 vias 10 are provided in the individual insulating layers of the circuit board.
  • the circuit board 1 of Figure 1 has a bore into which a plug pin 2 of a connector is inserted and electrically connected to one of the conductor tracks 3. It is a signal-carrying pin 2. This one
  • Pin 2 is merely intended to illustrate the invention, in principle, a plurality of such pins are provided within a connector, which are usually arranged in one or more rows.
  • EMC-capacitors 7, 8 connect - the other EMC capacitor 8 is shown only in broken lines - is, according to the invention by a recess in the metallization layer 5, 6, which is formed by the bore for the plug pin 2, spaced therefrom a recess. 9 in the Metallisie ⁇ insurance layer 5, 6 made or generated, so that a first part 6 of the metallization, which is surrounded by the insulating 9 forming a recess although electrically in contact with the plug pin 2, but not with the surrounding the insulating zone 9 part 5 of the metallization layer.

Abstract

The invention relates to a multilayered printed circuit board (1) comprising at least one metallization layer (5, 6) arranged within the printed circuit board. The printed circuit board (1) is connected to at least one plug connector via at least one plug pin (2). The metallization layer (5, 6) has, extending around a cutout for the plug pin (2) and at a distance therefrom, a recess forming an insulating zone (9), wherein at least one capacitor (7, 8) which bridges the insulating zone (9) and is embedded into the printed circuit board is arranged between that part (6) of the metallization layer which is formed adjacent to the cutout and that part (5) of the metallization layer which is formed around the insulating zone (9).

Description

Beschreibung description
Mehrlagige Leiterplatte mit eingebettetem EMV-Kondensator In elektrischen oder elektronischen Geräten sind die für deren Funktion erforderlichen elektrischen und/oder elektronischen Bauelemente zumeist auf einer oder mehreren Leiterplatten angeordnet. Zur elektrischen Verbindung dieser Bauelemente sind auf Oberflächen oder auf Zwischenlagen einer solchen Leiter- platte Metallisierungsschichten vorgesehen, die durch geeignete Strukturierung Leiterbahnen ausbilden. Multi-layer printed circuit board with embedded EMC capacitor In electrical or electronic devices, the electrical and / or electronic components required for their function are usually arranged on one or more printed circuit boards. For the electrical connection of these components metallization layers are provided on surfaces or on intermediate layers of such a printed circuit board, which form conductor tracks by suitable structuring.
Aufgrund immer höher werdender Signalfrequenzen mit zum Teil steilen Signalflanken entstehen in solchen elektrischen und/oder elektronischen Geräten hochfrequente Signalanteile, die über die signalführenden Steckerstifte auch bei guter Abschirmung - beispielsweise mittels eines metallischen Gehäuses - nach außen dringen und dort andere Geräte oder Anlagen erheblich stören können. Aus diesem Grunde ist es üblich, zwischen einem sig- nalführenden Steckerstift und einer Masseleitung oder Masseschicht sogenannte Block- bzw. EMV-Kondensatoren anzuordnen, über die hochfrequente Signalanteile nach Masse abgeleitet werden. Diese EMV-Kondensatoren benötigen jedoch, insbesondere bei vielen Steckerstiften, einen erheblichen Platz auf der Leiterplatte. Due to ever higher signal frequencies with sometimes steep signal edges arise in such electrical and / or electronic devices high-frequency signal components that penetrate the signal-carrying connector pins even with good shielding - for example by means of a metallic housing - to the outside and there can significantly disrupt other devices or facilities , For this reason, it is customary to arrange between a sig- nalführenden connector pin and a ground line or ground layer so-called block or EMC capacitors, are derived via the high-frequency signal components to ground. However, these EMC capacitors require, especially in many connector pins, a considerable amount of space on the circuit board.
Aus der DE 32 03 021 AI ist es bekannt, in einer Leiterplatte nahe den Bohrungen für die Steckerstifte weitere Bohrungen vorzu¬ sehen, in die elektrische Bauelemente, vorzugsweise Viel- schichtkondensatoren, eingefügt sind, die auf der einen Seite der Leiterplatte mit je einer Leiterbahn, die jeweils zu einem Steckeranschlusspfosten geführt ist, kontaktiert (verlötet) sind. Auf der gegenüberliegenden Seite der Leiterplatte sind Leiterbahnen vorhanden, mit denen die andere Seite der Bau- elemente kontaktiert ist, wobei diese Leiterbahnen zu einem gemeinsamen Masseanschuss geführt sind. Diese EMV-Kondensatoren benötigen zwar keinen Platz mehr auf der Oberfläche der Leiterplatte, sie sind jedoch relativ aufwendig zu montieren, da zunächst eine Bohrung vorgesehen werden muss, in die dann das Bauelement eingefügt wird, und dieses schließlich mit den Leiterbahnen verlötet wird. Es ist daher die Aufgabe der Erfindung, eine einfachere und kostengünstigere Montage von EMV-Kondensatoren bei einer mehrlagigen Leiterplatte vorzusehen. From DE 32 03 021 Al it is known vorzu ¬ further holes in a circuit board near the holes for the pins, in the electrical components, preferably multilayer capacitors, are inserted, on one side of the circuit board, each with a conductor track each guided to a male terminal post, contacted (soldered). On the opposite side of the circuit board tracks are present, with which the other side of the components is contacted, said tracks are guided to a common grounding. Although these EMC capacitors need no more space on the surface of the circuit board, but they are relatively expensive to install, as first a hole must be provided, in which then the component is inserted, and this is finally soldered to the conductor tracks. It is therefore an object of the invention to provide a simpler and less expensive installation of EMC capacitors in a multilayer printed circuit board.
Die Aufgabe wird gelöst durch eine mehrlagige Leiterplatte gemäß Anspruch 1. Vorteilhafte Weiterbildungen sind in den Unteransprüchen angegeben. The object is achieved by a multilayer printed circuit board according to claim 1. Advantageous further developments are specified in the subclaims.
Danach weist die mehrlagige Leiterplatte zumindest eine in¬ nerhalb der Leiterplatte angeordnete Metallisierungsschicht auf und ist mit zumindest einem Steckverbinder über wenigstens einen Steckerstift verbunden. Die Metallisierungsschicht weist um¬ laufend um eine Ausnehmung für den Steckerstift und beabstandet von dieser eine eine Isolierzone bildende Aussparung auf. Zwischen dem benachbart zu der Ausnehmung ausgebildeten Teil der Metallisierungsschicht und dem um die Isolierzone ausgebildeten Teil der Metallisierungsschicht ist zumindest ein, die Iso¬ lierzone überbrückender, in die Leiterplatte eingebetteter Kondensator angeordnet. Dieser EMV-Kondensator benötigt keinen Platz auf der Oberfläche der Leiterplatte und kann auf einfache Weise bereits bei der Herstellung der Leiterplatte montiert werden, ohne eine zu¬ sätzliche Bohrung und ein Einsetzen in diese Bohrung und Verlöten zu erfordern. Es kann auf diese Weise eine optimale Anbindung der EMV-Kondensatoren an den Steckerstift einerseits und dieThereafter, the multilayer printed circuit board, at least one arranged in ¬ nerhalb the PCB metallization layer and is connected with at least one connector via at least one plug pin. The metallization layer has around ¬ running around a recess for the connector pin and spaced from this on an insulating zone forming recess. Between the adjacent to the recess formed part of the metallization layer and formed around the insulating part of the metallization is at least one, the Iso ¬ lierzone bridging, embedded in the printed circuit board capacitor. This EMC capacitor requires no space on the surface of the circuit board and can be easily mounted during the production of printed circuit board without requiring too ¬ additional drilling and insertion into this hole and soldering. It can in this way an optimal connection of the EMC capacitors to the pin on the one hand and the
Metallisierungsschicht andererseits erfolgen. Da der benötigte Platz für die EMV-Kondensatoren auf der Oberfläche der Leiterplatte wegfällt, kann die Leiterplatte kleiner gestaltet werden. Die EMV-Kondensatoren können näher an der Signalzu- leitung des Steckerstifts platziert werden, so dass der pa¬ rasitäre Antenneneffekt minimiert werden kann. Die Zuverläs¬ sigkeit wird durch die eingebettete Aufbau- und Verbindungs¬ technik erhöht. Zusätzlich besteht ein mechanischer Schutz über die Lebenszeit ebenso wie bei der Montage des Steckers oder des Gehäuses . Metallization on the other hand done. Since the space required for the EMC capacitors on the surface of the circuit board is eliminated, the circuit board can be made smaller. The EMC capacitors can be placed closer to the signal lead of the connector pin, so that the pa ¬ rasitäre antenna effect can be minimized. The reliabil ¬ sigkeit is increased by the embedded structure and connection ¬ technology. In addition, there is mechanical protection over the lifetime as well as during the assembly of the plug or the housing.
In einer vorteilhaften Weiterbildung der Erfindung sind sig- nalführende Leiterbahnen auf einer der Oberflächen und/oder einer Zwischenschicht der Leiterplatte ausgebildet, wobei zumindest eine davon elektrisch mit dem Steckerstift verbunden ist . Besonders vorteilhaft ist es, wenn der die Isolierzone umgebende Teil der Metallisierungsschicht eine Masseschicht bildet. In an advantageous development of the invention, signal-carrying printed conductors are formed on one of the surfaces and / or an intermediate layer of the printed circuit board, at least one of which is electrically connected to the plug pin. It is particularly advantageous if the part of the metallization layer surrounding the insulating zone forms a ground layer.
Die Erfindung wird nachfolgend anhand eines Ausführungsbeispiels mit Hilfe einer Figur näher erläutert. Dabei zeigt die The invention will be explained in more detail using an exemplary embodiment with the aid of a figure. It shows the
Figur 1 einen Querschnitt durch eine mehrlagige Leiterplatte mit einem erfindungsgemäß eingebetteten EMV- Kondensator Die Figur 1 zeigt eine Leiterplatte 1, die im dargestelltenFIG. 1 shows a cross section through a multilayer printed circuit board with an EMC capacitor embedded in accordance with the invention. FIG. 1 shows a printed circuit board 1 which is shown in FIG
Beispiel aus drei isolierenden Schichten gebildet ist, auf und zwischen denen Leiterbahnen 3 und eine metallische Schicht 5, 6 gebildet sind. Die Erfindung kann auch bei nur zwei oder mehr als drei isolierenden Schichten Anwendung finden. Sowohl auf den Leiterbahnen 3 auf den Oberflächen der Leiterplatte 1 als auch auf den Leiterbahnen 3, die auf Zwischenschichten angeordnet sind, sind Bauelemente 4 montiert. Die einzelnen Schichten der Leiterplatte 1 werden dabei getrennt mit Metallisierungen versehen, in denen - beispielsweise durch Ätzen - Leiterbahnen strukturiert werden, um darauf die Bauelemente 4 zu platzieren. Die auf den inneren Schichten der Leiterplatte 1 liegenden Bauelemente 4 werden beim Zusammenfügen der Leiterplatte 1 in dieser eingebettet. Um einzelne Leiterbahnen 3 mit einer auf Bezugspotential - meistens als Masse bezeichnet - liegenden, innerhalb der mehrlagigen Leiterplatte eingebetteten Metallisierungsschicht 5 zu verbinden, sind in den einzelnen isolierenden Schichten der Leiterplatte 1 Durchkontaktierungen 10 vorgesehen. Example of three insulating layers is formed on and between which conductor tracks 3 and a metallic layer 5, 6 are formed. The invention can also be applied to only two or more than three insulating layers. Both on the interconnects 3 on the surfaces of the circuit board 1 and on the interconnects 3, which are arranged on intermediate layers, components 4 are mounted. The individual layers of the printed circuit board 1 are thereby provided separately with metallizations in which - for example by etching - conductor tracks are structured in order to place the components 4 thereon. The lying on the inner layers of the circuit board 1 components 4 are embedded in the assembly of the circuit board 1 in this. To individual interconnects 3 with an on reference potential - usually referred to as ground - lying, embedded within the multilayer printed circuit board metallization. 5 To connect, 1 vias 10 are provided in the individual insulating layers of the circuit board.
Die Leiterplatte 1 der Figur 1 weist eine Bohrung auf, in die ein Steckerstift 2 eines Steckverbinders eingesteckt und elektrisch mit einer der Leiterbahnen 3 verbunden ist. Es handelt sich dabei um einen signalführenden Steckerstift 2. Dieser eine The circuit board 1 of Figure 1 has a bore into which a plug pin 2 of a connector is inserted and electrically connected to one of the conductor tracks 3. It is a signal-carrying pin 2. This one
Steckerstift 2 soll lediglich die Erfindung verdeutlichen, prinzipiell sind eine Vielzahl solcher Steckerstifte innerhalb eines Steckverbinders vorgesehen, die zumeist in einer oder mehreren Reihen angeordnet sind. Pin 2 is merely intended to illustrate the invention, in principle, a plurality of such pins are provided within a connector, which are usually arranged in one or more rows.
Um diesen signalführenden Steckerstift 2 hochfrequenzmäßig an die auf Bezugspotential liegende Metallisierungsschicht 5 innerhalb der Leiterplatte 1 mittels eines oder mehrere To this signal-carrying connector pin 2 high frequency to the reference potential lying on the metallization layer 5 within the circuit board 1 by means of one or more
EMV-Kondensatoren 7, 8 anzubinden - der weitere EMV Kondensator 8 ist nur strichliert dargestellt -, ist in erfindungsgemäßer Weise um eine Ausnehmung in der Metallisierungsschicht 5, 6, die durch die Bohrung für den Steckerstift 2 entstanden ist, beabstandet zu dieser eine Aussparung 9 in der Metallisie¬ rungsschicht 5, 6 vorgenommen oder erzeugt worden, so dass ein erster Teil 6 der Metallisierungsschicht, der von der eine Isolierzone 9 bildenden Aussparung umgeben ist zwar mit dem Steckerstift 2 elektrisch in Kontakt steht jedoch nicht mit dem die Isolierzone 9 umgebenden Teil 5 der Metallisierungsschicht. EMC-capacitors 7, 8 connect - the other EMC capacitor 8 is shown only in broken lines - is, according to the invention by a recess in the metallization layer 5, 6, which is formed by the bore for the plug pin 2, spaced therefrom a recess. 9 in the Metallisie ¬ insurance layer 5, 6 made or generated, so that a first part 6 of the metallization, which is surrounded by the insulating 9 forming a recess although electrically in contact with the plug pin 2, but not with the surrounding the insulating zone 9 part 5 of the metallization layer.
Zur Anbindung des Steckerstifts 2 an den auf Bezugspotential liegenden Teil 5 der Metallisierungsschicht sind die To connect the connector pin 2 to the reference potential lying on the part 5 of the metallization are the
EMV-Kondensatoren 7 - und gegebenenfalls 8 - die Isolierzone 9 überbrückend auf den Teilen 5, 6 der Metallisierungsschicht angeordnet, beispielsweise angelötet oder mit Leitkleber ge¬ klebt . EMC capacitors 7 - and possibly 8 - the insulating zone 9 bridging arranged on the parts 5, 6 of the metallization, for example, soldered or glued with conductive adhesive ge ¬ .
Auf diese Weise kann auf sehr einfache und kostengünstige Weise eine optimale Anbindung von signalführenden Steckerstiften 2 an das Bezugspotential mittels EMV-Kondensatoren 7 erfolgen, ohne das zusätzlicher, erheblicher Platzbedarf auf der Leiterplatte 1 nötig wäre. In this way, an optimal connection of signal-carrying connector pins 2 to the reference potential by means of EMC capacitors 7 can be done in a very simple and cost-effective manner, without the additional, significant space requirement on the circuit board 1 would be necessary.

Claims

Patentansprüche claims
1. Mehrlagige Leiterplatte (1) mit zumindest einer innerhalb der Leiterplatte (1) angeordneten Metallisierungsschicht (5, 6), wobei die Leiterplatte (1) mit zumindest einem Steckverbinder über wenigstens einen Steckerstift (2) verbunden ist, 1. Multilayer printed circuit board (1) with at least one metallization layer (5, 6) arranged within the printed circuit board (1), wherein the printed circuit board (1) is connected to at least one plug connector via at least one plug pin (2),
wobei die Metallisierungsschicht (5, 6) umlaufend um eine Ausnehmung für den Steckerstift (5) und beabstandet von dieser eine eine Isolierzone (9) bildende Aussparung aufweist, wobei zwischen dem benachbart zu der Ausnehmung ausgebildeten Teil (6) der Metallisierungsschicht und dem um die Isolierzone (9) ausgebildeten Teil (5) der Metallisierungsschicht zumindest ein, die Isolierzone (9) überbrückender, in die Leiterplatte eingebetteter Kondensator (7, 8) angeordnet ist. wherein the metallization layer (5, 6) circumferentially around a recess for the plug pin (5) and spaced therefrom, an insulating zone (9) forming recess, wherein between the adjacently to the recess formed part (6) of the metallization layer and the Insulating zone (9) formed part (5) of the metallization at least one, the insulating zone (9) bridging, embedded in the printed circuit capacitor (7, 8) is arranged.
2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, dass signalführende Leiterbahnen (3) auf einer der Oberflächen und/oder einer Zwischenschicht der Leiterplatte (1) ausgebildet sind und zumindest eine davon elektrisch mit dem Steckerstift (5) verbunden ist. 2. Printed circuit board according to claim 1, characterized in that signal-carrying conductor tracks (3) on one of the surfaces and / or an intermediate layer of the printed circuit board (1) are formed and at least one of which is electrically connected to the plug pin (5).
3. Leiterplatte nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass der die Isolierzone (9) umgebende Teil (5) der Metallisierungsschicht eine Masseschicht bildet. 3. Printed circuit board according to one of claims 1 or 2, characterized in that the insulating zone (9) surrounding part (5) of the metallization layer forms a ground layer.
PCT/EP2012/059067 2011-05-16 2012-05-15 Multilayered printed circuit board with embedded emc capacitor WO2012156422A1 (en)

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Citations (5)

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DE3203021A1 (en) 1982-01-29 1983-08-04 Harting Elektronik Gmbh, 4992 Espelkamp CONNECTOR WITH INTERFERENCE DEVICE
US20020185303A1 (en) * 2001-03-12 2002-12-12 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
EP1437930A2 (en) * 2003-01-07 2004-07-14 Delphi Technologies, Inc. Filtered electrical connector assembly for an overmolded electronic package
US20050218502A1 (en) * 2004-03-31 2005-10-06 Shinko Electric Industries Co., Ltd. Capacitor-mounted wiring board and method of manufacturing the same
US20090215231A1 (en) * 2008-02-25 2009-08-27 Shinko Electric Industries Co., Ltd Method of manufacturing electronic component built-in substrate

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JP2001023849A (en) * 1999-07-13 2001-01-26 Hitachi Ltd Circuit with capacitor and wiring board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3203021A1 (en) 1982-01-29 1983-08-04 Harting Elektronik Gmbh, 4992 Espelkamp CONNECTOR WITH INTERFERENCE DEVICE
US20020185303A1 (en) * 2001-03-12 2002-12-12 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
EP1437930A2 (en) * 2003-01-07 2004-07-14 Delphi Technologies, Inc. Filtered electrical connector assembly for an overmolded electronic package
US20050218502A1 (en) * 2004-03-31 2005-10-06 Shinko Electric Industries Co., Ltd. Capacitor-mounted wiring board and method of manufacturing the same
US20090215231A1 (en) * 2008-02-25 2009-08-27 Shinko Electric Industries Co., Ltd Method of manufacturing electronic component built-in substrate

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