WO2012152652A1 - Konversionselement für leuchtdioden und herstellungsverfahren - Google Patents
Konversionselement für leuchtdioden und herstellungsverfahren Download PDFInfo
- Publication number
- WO2012152652A1 WO2012152652A1 PCT/EP2012/058134 EP2012058134W WO2012152652A1 WO 2012152652 A1 WO2012152652 A1 WO 2012152652A1 EP 2012058134 W EP2012058134 W EP 2012058134W WO 2012152652 A1 WO2012152652 A1 WO 2012152652A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass
- conversion element
- phosphor
- conversion
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
- C03B37/01—Manufacture of glass fibres or filaments
- C03B37/02—Manufacture of glass fibres or filaments by drawing or extruding, e.g. direct drawing of molten glass from nozzles; Cooling fins therefor
- C03B37/025—Manufacture of glass fibres or filaments by drawing or extruding, e.g. direct drawing of molten glass from nozzles; Cooling fins therefor from reheated softened tubes, rods, fibres or filaments, e.g. drawing fibres from preforms
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
- C03B37/075—Manufacture of non-optical fibres or filaments consisting of different sorts of glass or characterised by shape, e.g. undulated fibres
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2201/00—Type of glass produced
- C03B2201/06—Doped silica-based glasses
- C03B2201/30—Doped silica-based glasses doped with metals, e.g. Ga, Sn, Sb, Pb or Bi
- C03B2201/34—Doped silica-based glasses doped with metals, e.g. Ga, Sn, Sb, Pb or Bi doped with rare earth metals, i.e. with Sc, Y or lanthanides, e.g. for laser-amplifiers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2203/00—Fibre product details, e.g. structure, shape
- C03B2203/02—External structure or shape details
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2203/00—Fibre product details, e.g. structure, shape
- C03B2203/02—External structure or shape details
- C03B2203/04—Polygonal outer cross-section, e.g. triangular, square
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
Definitions
- the present invention relates to a conversion element for light-emitting diodes, in particular a luminescence conversion element, with which light-emitting diodes of individual colors can be produced, and to an associated production method.
- DE 19638667 C2 describes a semiconductor component which emits mixed-colored light.
- a Lumineszenzkonver ⁇ sion element causes a portion of the emitted Strah lung ⁇ a wavelength of less than 520 nm is absorbed and emitted at a longer wavelength region.
- Luminescence conversion element may at least partially consist of a transparent epoxy resin. It is provided with a fluorescent phosphor, for example with
- Y 3 Al 5 Oi2 Ce 3+, Y 3 Ga 5 0 12: Ce 3+, Y (Al, Ga) 5 0 12: Ce 3+,
- La 3 Ga 5 Oi 2 Ce 3+
- La (Al, Ga) 5 12 Ce 3+
- a luminescence conversion element can also be formed from silicone. In this case, however, the problem arises that the heat generated by the light emitting diode is dissipated insufficient. In addition, phosphors which are sensitive to moisture are only of limited suitability for use in a semipermeable silicone membrane.
- the object of the invention is to provide a new conversion element for light-emitting diodes by utilizing the photoluminescence and an associated manufacturing method.
- the conversion element is for example a glass and has a photoluminescence, which is caused by the fact that the glass is luminescent or the conversion element is coated with a phosphor or the glass luminescent and the conversion element is coated with a phosphor.
- a glass is understood as meaning any glass-like material which can be brought into a suitably structured form by methods of producing glass fibers.
- the photoluminescence can in particular a
- Fluorescence that is, a very short afterglow of typically less than a millionth of a second duration as a direct consequence and concomitant of excitation of the phosphor by the photons of an incident
- the photoluminescence may be effected by having a phosphor or a dopant in the glass
- the phosphor may be formed, for example, by luminescent particles dispersed in the glass.
- luminescent particles dispersed in the glass.
- ions of one or more rare earth metals are suitable as a dopant.
- Rare earth metals are scandium, yttrium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium,
- the conversion element is a glass from the group of soda-lime glass, borosilicate glass, lead crystal glass and tellurium dioxide glass.
- a tellurium dioxide ⁇ glass may in particular contain tungsten trioxide.
- the glass of the conversion element it is possible for the glass of the conversion element to have traces of a singulation process on at least one of its main surfaces.
- the tracks may be, for example, sawdust,
- Sanding marks act on melting or the like.
- the separation of the glass to the conversion element has taken place along the main surfaces, which run perpendicular to side surfaces of the conversion element.
- roughenings may be formed, which allow a passage of electromagnetic
- a preform is formed from a glass, the preform is formed using a
- the preform is formed from a luminescent glass in which a phosphor or a dopant is present.
- the preform is made of a glass from the group of soda-lime Glass, borosilicate glass, lead crystal glass and tellurium dioxide glass formed.
- Neodymium promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium, for example with Nd 3+ , Er 3+ or Ce 3+ .
- the conversion element is coated with a phosphor.
- the glass fiber is divided into individual conversion elements on at least one side surface of the component before it is divided into individual conversion elements
- the side surface is an outer surface of the glass fiber, which extends transversely, for example, perpendicular to the main surfaces of the glass fiber. For example, connect the
- the material applied to the side surface in at least one layer is, for example, a reflective material.
- the reflective material may be a metallic material.
- the reflective material can be light-scattering and / or light-reflecting particles which are introduced into a matrix material.
- the reflective material comprises, as the matrix material, a silicone in which titanium dioxide particles are incorporated. The reflective material then appears white to the viewer, for example.
- the absorbent material may be, for example, a blackened matrix material, for example
- the phosphor may be the same or different phosphor present in the glass fiber or on the major surfaces of the glass fiber.
- the conversion element comprises a glass body, which is coated on all sides with a phosphor.
- the singulation process When dividing the glass fiber into conversion elements, it is possible for the singulation process to produce traces on the main surfaces of the glass of the conversion element, along which the singulation takes place.
- the traces of the separation process may be, for example
- the main surfaces of the conversion element have a roughening due to the traces of the singulation process. This roughening can promote a radiation passage through the conversion element, since due to the
- Roughening reduces the likelihood of total reflection at the major surfaces.
- the structuring element has at least one shape.
- the structuring element may have an opening through which the glass fiber is drawn in the viscous state.
- the opening then has, for example, a basic shape, which is superimposed by the shaping.
- the opening may be rectangular or
- Forming is then generated a recess in the conversion element. That is, for example, from its base forth square or rectangular conversion element then has at one of its corners on a recess.
- the recess is sized so that it is suitable and intended for carrying out a contact means.
- the recess in the conversion element may be designed such that a connection region on the outer surface of a
- the conversion element is produced by a method described here.
- the method is detectable for example by the traces of the singulation process or the formation of a recess in the conversion element. All described for the procedure
- the light-emitting diode comprises a light-emitting diode chip and one described here
- Conversion element and the method for producing the conversion element described features are also disclosed for the light emitting diode and vice versa.
- the conversion element is arranged on a radiation exit surface of the LED chip.
- the conversion element by means of a radiation-transparent adhesive at the radiation exit surface of the
- the conversion element is attached to a housing body and is arranged at a distance from the LED chip.
- the conversion element has a cutout, through which a connection region at the radiation exit surface of the light-emitting diode chip
- connection area is this way, even if the conversion element directly on the
- LED chip is applied, still freely accessible.
- a contact means is guided through the recess, wherein the
- connection area is connected.
- the contact means is a connecting wire which may be fixed to the connection area by wire bonding.
- FIG. 1 shows a schematic representation of FIG
- FIG. 2 shows an example of a structuring element.
- a preform 4 made of glass is produced, which is then inserted into the structure by means of a structuring element 5
- a structured glass fiber 2 is brought.
- the glass fiber can then be divided into the conversion elements 1, which can be done for example in a conventional manner by means of a blade (blade dicing), by DWC (diamond wire cutting) or by water jet cutting (water jet cutting).
- the preform 4 is drawn in a viscous state through the opening 6 of the structuring element 5, which may for example have special formations 7, and thus brought into the desired shape .
- the structured glass fiber 2 has due to the production of a homogeneous cross-section, which, however, can take a variety of forms and, for example, round, angular, in particular square or with
- Webs or Kannelüren 3 can be provided, according to the shape of the opening 6 of the structuring element. 5
- FIG. 1 further shows that optionally a
- Glass fiber 2 can be done with a layer 14.
- the layer 14 can radiation-reflecting
- Comprise radiation absorbing or radiation converting material It is particularly possible that all side surfaces 2d are provided with the layer 14. A coating can also take place in the region of the web 3, which later forms the recess 7 'of the finished conversion element 1. It results
- FIG. 2 shows an example of a structuring element 5 having an opening 6 which is substantially square and has a formation 7 in a corner. It can be seen here how the structured glass fiber 2 can be provided with different shapes, so that the conversion elements 1 can be adapted to different shapes of the light emitting diodes, electrical connection surfaces or housing.
- the structured glass fiber 2 can with any of the
- Manufacture of conventional glass fibers used methods can be formed with a suitable cross section for the application in question.
- An example of a borosilicate glass, from which the convergence ⁇ sion element can be manufactured by such a method, is 81 Si0 2 - 13 B 2 0 3 - 2 A1 2 0 3 - 4 Na 2 0.
- soda-lime glass alkaline glass
- the numbers 69, 1, 3, 4, 13, 2, 5 and 3, which are prefixed to the compounds which form the glass, also indicate in each case the proportion of the relevant compound in mol%.
- An example of a tungsten tellurium dioxide glass from which the conversion element can be made is 71 Teu 2 - 22.5 W0 3 - 5 Na 2 O - 1.5 Nb 2 0 5 .
- the numbers 71, 22.5, 5 and 1.5, which are prefixed to the compounds which form the glass, also indicate the proportion of the compound in mol ⁇ 6 here.
- the specified glasses are only a few examples of a variety of glasses that are suitable for the conversion element and the manufacturing process.
- Particles of a phosphor preferably take place before the preparation of the preform 4.
- a phosphor can be applied as a coating on the conversion element. Subsequent coating is particularly preferred if the proposed phosphor is not suitable for the production process, for
- the structured glass fiber 2 can additionally on its
- a reflective layer for example from T1O 2
- a layer structure that causes an Inter ⁇ ference for example, with a dichroic
- the structured glass fibers 2 can be stored in a space-saving piece, so that any time any number of
- FIG. 3A shows a light-emitting diode described here in a schematic plan view.
- the light-emitting diode comprises a carrier 13, which may be, for example, the part of a housing, a printed circuit board or a base body of an insulating material such as ceramic or semiconductor material.
- the light-emitting diode further comprises connection points 12a, 12b, to which a light-emitting diode chip 1 is electrically conductively connected. In the present case, the LED chip 1 is applied to the connection point 12b.
- the LED chip 1 has a
- the conversion element 1 has a recess 7 ', on which a connection region 11, in the present case a bonding pad, is left exposed at the radiation exit surface 9.
- a connection region 11 in the present case a bonding pad
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201280022110.7A CN103503180A (zh) | 2011-05-06 | 2012-05-03 | 用于发光二极管的转换元件及制造方法 |
| US14/115,917 US9590147B2 (en) | 2011-05-06 | 2012-05-03 | Conversion element for light-emitting diodes and production method |
| KR1020137032475A KR20140030243A (ko) | 2011-05-06 | 2012-05-03 | 발광 다이오드들을 위한 변환 소자 및 제조 방법 |
| JP2014508801A JP2014513437A (ja) | 2011-05-06 | 2012-05-03 | 発光ダイオードの変換要素およびその製造方法 |
| DE112012001995.4T DE112012001995A5 (de) | 2011-05-06 | 2012-05-03 | Konversionselement für Leuchtdioden und Herstellungsverfahren |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011100710A DE102011100710A1 (de) | 2011-05-06 | 2011-05-06 | Konversionselement für Leuchtdioden und Herstellungsverfahren |
| DE102011100710.9 | 2011-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012152652A1 true WO2012152652A1 (de) | 2012-11-15 |
Family
ID=46025728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2012/058134 Ceased WO2012152652A1 (de) | 2011-05-06 | 2012-05-03 | Konversionselement für leuchtdioden und herstellungsverfahren |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9590147B2 (de) |
| JP (1) | JP2014513437A (de) |
| KR (1) | KR20140030243A (de) |
| CN (1) | CN103503180A (de) |
| DE (2) | DE102011100710A1 (de) |
| WO (1) | WO2012152652A1 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013207564A1 (de) * | 2013-04-25 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Wellenlängenkonvertierendes Element, optoelektronisches Bauelement und Druckschablone |
| DE102013106609A1 (de) * | 2013-06-25 | 2015-01-08 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7080625B2 (ja) * | 2017-12-01 | 2022-06-06 | スタンレー電気株式会社 | 発光装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE3634001A1 (de) * | 1986-02-14 | 1987-08-20 | Owens Corning Fiberglass Corp | Nicht-kreisfoermige mineralfasern und verfahren und vorrichtung zur herstellung derselben |
| DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JP2007016171A (ja) * | 2005-07-08 | 2007-01-25 | Sharp Corp | 波長変換部材、発光装置及び波長変換部材の製造方法 |
| DE102006037730A1 (de) * | 2006-08-11 | 2008-02-14 | Merck Patent Gmbh | LED-Konversionsleuchtstoffe in Form von keramischen Körpern |
| DE102007051370A1 (de) * | 2007-10-26 | 2009-04-30 | Ingo Hilgenberg | Verfahren und Vorrichtung zur Herstellung von Glaskörpern mittels Wiederziehverfahren |
| DE102008021438A1 (de) * | 2008-04-29 | 2009-12-31 | Schott Ag | Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle |
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| DE29724847U1 (de) * | 1996-06-26 | 2004-09-30 | Osram Opto Semiconductors Gmbh | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JPH111326A (ja) * | 1997-06-11 | 1999-01-06 | Mitsubishi Chem Corp | 無機ガラスの製造方法及び無機ガラス |
| DE10351349A1 (de) * | 2003-10-31 | 2005-06-16 | Osram Opto Semiconductors Gmbh | Verfahren zum Hestellen eines Lumineszenzdiodenchips |
| JP2006117857A (ja) * | 2004-10-25 | 2006-05-11 | Keiji Iimura | 蓄光性発光装置および蓄光性発光型光ファイバ |
| DE102005019375A1 (de) * | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | LED-Array |
| JP4765525B2 (ja) | 2005-06-29 | 2011-09-07 | 日本電気硝子株式会社 | 発光色変換部材 |
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| JP4971672B2 (ja) * | 2005-09-09 | 2012-07-11 | パナソニック株式会社 | 発光装置 |
| WO2007067257A2 (en) * | 2005-12-02 | 2007-06-14 | Vanderbilt University | Broad-emission nanocrystals and methods of making and using same |
| DE102006027307B4 (de) * | 2006-06-06 | 2014-08-07 | Schott Ag | Verfahren zur Herstellung einer Sinterglaskeramik und deren Verwendung |
| DE102007046348A1 (de) * | 2007-09-27 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement mit Glasabdeckung und Verfahren zu dessen Herstellung |
| TWI497747B (zh) * | 2008-06-02 | 2015-08-21 | 松下電器產業股份有限公司 | 半導體發光裝置及使用該發光裝置之光源裝置 |
| DE102008030253B4 (de) * | 2008-06-25 | 2020-02-20 | Osram Opto Semiconductors Gmbh | Konversionselement und Leuchtmittel |
| DE102008033391A1 (de) * | 2008-07-16 | 2010-01-21 | Osram Opto Semiconductors Gmbh | Leuchtvorrichtung und Verfahren zur Gruppierung von Strahlung emittierenden Halbleiterchips |
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| JP2010129300A (ja) | 2008-11-26 | 2010-06-10 | Keiji Iimura | 半導体発光ランプおよび電球形半導体発光ランプ |
| DE102009020569B4 (de) * | 2009-05-08 | 2019-02-21 | Schott Ag | Leuchtstoffe auf Basis Eu2+-(co-) dotierter Yttrium-Aluminium-Granat-Kristalle und deren Verwendung |
| DE102009035100A1 (de) * | 2009-07-29 | 2011-02-03 | Osram Opto Semiconductors Gmbh | Leuchtdiode und Konversionselement für eine Leuchtdiode |
| CN101740707B (zh) | 2009-12-11 | 2013-11-06 | 晶科电子(广州)有限公司 | 预成型荧光粉贴片及其与发光二极管的封装方法 |
-
2011
- 2011-05-06 DE DE102011100710A patent/DE102011100710A1/de not_active Withdrawn
-
2012
- 2012-05-03 JP JP2014508801A patent/JP2014513437A/ja active Pending
- 2012-05-03 KR KR1020137032475A patent/KR20140030243A/ko not_active Ceased
- 2012-05-03 CN CN201280022110.7A patent/CN103503180A/zh active Pending
- 2012-05-03 WO PCT/EP2012/058134 patent/WO2012152652A1/de not_active Ceased
- 2012-05-03 DE DE112012001995.4T patent/DE112012001995A5/de not_active Ceased
- 2012-05-03 US US14/115,917 patent/US9590147B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3634001A1 (de) * | 1986-02-14 | 1987-08-20 | Owens Corning Fiberglass Corp | Nicht-kreisfoermige mineralfasern und verfahren und vorrichtung zur herstellung derselben |
| DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JP2007016171A (ja) * | 2005-07-08 | 2007-01-25 | Sharp Corp | 波長変換部材、発光装置及び波長変換部材の製造方法 |
| DE102006037730A1 (de) * | 2006-08-11 | 2008-02-14 | Merck Patent Gmbh | LED-Konversionsleuchtstoffe in Form von keramischen Körpern |
| DE102007051370A1 (de) * | 2007-10-26 | 2009-04-30 | Ingo Hilgenberg | Verfahren und Vorrichtung zur Herstellung von Glaskörpern mittels Wiederziehverfahren |
| DE102008021438A1 (de) * | 2008-04-29 | 2009-12-31 | Schott Ag | Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013207564A1 (de) * | 2013-04-25 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Wellenlängenkonvertierendes Element, optoelektronisches Bauelement und Druckschablone |
| US9515233B2 (en) | 2013-04-25 | 2016-12-06 | Osram Opto Semiconductors Gmbh | Wavelength-converting element, optoelectronic component and printing stencil |
| DE102013106609A1 (de) * | 2013-06-25 | 2015-01-08 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102011100710A1 (de) | 2012-11-08 |
| US9590147B2 (en) | 2017-03-07 |
| KR20140030243A (ko) | 2014-03-11 |
| JP2014513437A (ja) | 2014-05-29 |
| CN103503180A (zh) | 2014-01-08 |
| US20140145231A1 (en) | 2014-05-29 |
| DE112012001995A5 (de) | 2014-02-20 |
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