WO2012152016A1

WO2012152016A1 - Method for preparing dielectric substrate

Info

Publication number: WO2012152016A1
Application number: PCT/CN2011/084505
Authority: WO
Inventors: 刘若鹏; 赵治亚; 缪锡根
Original assignee: 深圳光启高等理工研究院; 深圳光启创新技术有限公司
Priority date: 2011-05-11
Filing date: 2011-12-23
Publication date: 2012-11-15
Also published as: CN102886344B; CN102886344A

Abstract

Disclosed is a method for preparing a dielectric substrate, comprising the steps of: using a material having a first dielectric constant as a substrate, and coating a first position of the substrate with a material having a second dielectric constant; coating the first position and the second position of the substrate with the material having the second dielectric constant, so as to obtain a dielectric substrate with a non-uniform dielectric constant.

Description

Method for preparing dielectric substrate

[Technical Field]

The present invention relates to the field of composite materials, and in particular, to a method for preparing a dielectric substrate.

【Background technique】

At present, the commonly used materials are based on the improvement and improvement of the original properties of natural materials, but as the level of material design and preparation continues to increase, the space for further improvement of various properties and functions of natural materials is becoming smaller and smaller. Based on this status quo, some composite materials with extraordinary physical properties not found in natural materials, such as metamaterials. One can achieve various physical properties by modulating the various levels of structure and key physical dimensions of the material, and obtaining the physical properties of materials that are ordered, disordered, or unstructured at that level or scale in nature.

In the prior art, for the preparation of metamaterials, the following methods are mostly employed: a uniform dielectric substrate having a fixed dielectric constant is selected, and then a microstructure is arranged on a uniform dielectric substrate having a fixed dielectric constant. However, in the research and practice of the prior art, the inventors have found that since the uniform dielectric substrate having a fixed dielectric constant has the same physical properties at each position, the physical properties of the metamaterial prepared by the prior art cannot be obtained. satisfy people's demands.

[Summary of the Invention]

The technical problem to be solved by the present invention is to provide a method for preparing a dielectric substrate, which can It is sufficient to recombine materials having different dielectric constants to obtain a dielectric substrate having a non-uniform dielectric constant.

To solve the above technical problem, an embodiment of the present invention provides a method for preparing a dielectric substrate, including:

Using a material having a first dielectric constant as a substrate, coating a material having a second dielectric constant at a first position of the substrate;

The material having the second dielectric constant is coated in the first position and the second position of the substrate to obtain a dielectric substrate having a non-uniform dielectric constant.

Compared with the prior art, the above technical solution has the following advantages: by coating a material having a second dielectric constant on a substrate having a first dielectric constant, coating a first dielectric constant at a first position of the substrate After the material, in the second position of the substrate, and the first position that has been coated, continue to apply the material having the second dielectric constant, thus coating the material having the second dielectric constant at different positions of the substrate The thickness is different, thereby obtaining a dielectric substrate having a non-uniform dielectric constant.

[Description of the Drawings]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings may be obtained from these drawings without the inventive labor.

1 is a schematic diagram of a dielectric constant gradient of a non-uniform dielectric substrate according to an embodiment of the present invention; 2 is a flow chart of a method for preparing a dielectric substrate according to Embodiment 1 of the present invention; FIG. 3 is a flow chart of a method for preparing a dielectric substrate according to Embodiment 2 of the present invention; A flow chart of a method for preparing a dielectric substrate; FIG. 5 is a flow chart of a method for preparing a dielectric substrate according to Embodiment 4 of the present invention. 【detailed description】

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

First, in order to facilitate understanding of the technical solution of the present invention by those skilled in the art, the technical solution of the present invention will be generally described below in conjunction with the schematic diagram of the dielectric constant gradient of the non-uniform dielectric substrate shown in FIG.

The present invention coats a material having a different dielectric constant on a dielectric substrate having a uniform dielectric constant, and is first coated on a predetermined position on the dielectric substrate during the coating process, and then before The coated position is continuously repeated, and the coating range is enlarged. The first applied position becomes thicker and thicker, and the final coated position is the thinnest, showing a dielectric constant gradient as shown in FIG. The case of change, thereby obtaining a dielectric substrate having a non-uniform dielectric constant.

It can be understood that FIG. 1 is only an example in which the dielectric constant is high in the middle and the sides are low. In a specific implementation process, the dielectric constant prepared by the idea of the present invention may exhibit any uneven state. The technical solutions of the present invention are described in detail below by way of examples. Embodiment 1

2 is a flow chart of a method for preparing a dielectric substrate according to Embodiment 1 of the present invention. The preparation method includes the following steps:

S201: using a material having a first dielectric constant as a substrate, and coating a material having a second dielectric constant at a first position of the substrate.

For example, a polymer material having a first dielectric constant is used as a substrate, and a material having a dielectric constant greater than a first dielectric constant is coated on the substrate. The material having a dielectric constant greater than the first dielectric constant may be ceramic, mica, glass, plastic, or metal oxide.

S202: coating a material having a second dielectric constant at a first position coated with a material having a second dielectric constant, and a second position of the substrate to obtain a dielectric substrate having a non-uniform dielectric constant.

For example, a layer of ceramic material is applied to a first location on the substrate to which the ceramic material has been applied, and a second location on the substrate to which the ceramic material has not been coated.

In this embodiment, a material having a second dielectric constant is applied at different positions of the substrate by coating a substrate having a material having a different dielectric constant and different thicknesses of materials applied at different positions of the substrate. The thickness is different, thereby obtaining a dielectric substrate having a non-uniform dielectric constant.

Embodiment 2

3 is a flow chart of a method for preparing a dielectric substrate according to Embodiment 2 of the present invention. The preparation method includes the following steps:

S301: using a material having a first dielectric constant as a substrate, and removing the first position on the substrate Covered at a different location, applying a layer of adhesive to the first location.

For example, a polymer material having a first dielectric constant is used as a substrate, and a layer of epoxy resin is coated on the substrate. In a specific implementation process, the adhesive is not limited to an epoxy resin, and may be replaced with another adhesive having the same function as the epoxy resin, for example, a vinyl ester resin.

S302: coating a material having a second dielectric constant at a first position of the substrate coated with the adhesive.

For example, the ceramic powder is coated on the substrate at a first position coated with epoxy glue. In the specific implementation process, the ceramic can be replaced by mica, glass, plastic, or metal oxide.

Wherein the first dielectric constant is less than the second dielectric constant.

S303: Covering the substrate with a position other than the first position and the second position, and applying the adhesive to the first position and the second position, coating the material having the second dielectric constant.

For example, a layer of ceramic powder is continuously applied at a first position of the substrate coated with the ceramic powder, and a layer of ceramic powder is applied at a second position where the ceramic powder is not coated.

S304: covering the substrate with a position other than the first position, the second position, and the third position, and applying the adhesive to the first position, the second position, and the third position on the substrate, further coating The second dielectric constant material.

In a specific implementation process, step S304 may be continuously repeated, and finally the material having the second dielectric constant coated on the substrate changes in a gradient. The thickness of the material having the second dielectric constant applied at different positions of the substrate is different, so that the dielectric constants at different positions on the substrate are different. S305: curing the adhesive coated on the substrate such that the material having the second dielectric constant coated on the adhesive is integrated with the substrate to obtain a dielectric substrate having a non-uniform dielectric constant.

For example, the epoxy resin coated on the substrate is cured such that the ceramic material is integrated with the substrate. The curing method of the epoxy resin is a technique well known to those skilled in the art and will not be described herein.

In this embodiment, the adhesive is applied to the substrate having the first dielectric constant, and then the material having the second dielectric constant is applied at the position where the adhesive is applied, and the positions are coated at different positions. The thickness of the material having the second dielectric constant is different. In this embodiment, only the first position, the second position, and the third position of the coated substrate are listed. In a specific implementation process, the substrate may also be coated. Four positions, a fifth position, etc., so repeated, finally, the dielectric constant of the material having the second dielectric constant coated on the substrate is changed in gradient; curing the adhesive to make the substrate having the first dielectric constant Forming a unit with the material coated thereon to obtain a dielectric substrate having a non-uniform dielectric constant.

Embodiment 3

Referring to FIG. 4, a flow chart of a method for preparing a dielectric substrate according to Embodiment 3 of the present invention includes the following steps:

S401: A material having a first dielectric constant is used as a substrate, and a material having a second dielectric constant is uniformly mixed with a binder in a predetermined ratio to obtain a mixed material.

For example, the ceramic material having the second dielectric constant is mixed with the epoxy resin in a predetermined ratio, and the predetermined ratio is set without affecting the adhesion of the epoxy resin and the actual needs. In the specific implementation process, the ceramic can be replaced by mica, glass, plastic, or metal oxide.

S402: Covering the substrate on a position other than the first position, and coating the mixed material obtained in the step S401 on the first position of the substrate.

For example, a ceramic material and an epoxy resin hybrid material are applied to the first position of the substrate.

S403: covering the substrate with a position other than the first position and the second position, and coating the mixed material obtained in step S401 at the first position and the second position.

For example, in the first position of the substrate coated with the mixed material of the epoxy resin and the ceramic powder, the coating material of the epoxy resin and the ceramic powder is continuously coated, and the epoxy resin is not coated. The second position of the substrate of the ceramic powder mixed material is coated with a mixture of epoxy resin and ceramic powder.

S404: Covering the substrate with a position other than the first position, the second position, and the third position, and coating the mixed material obtained in step S401 at the first position, the second position, and the third position.

In a specific implementation process, step S404 may be continuously repeated, and the mixed material obtained in step S401 which is finally coated on the substrate changes in a gradient. The thickness of the mixed material obtained in step S401 applied at different positions of the substrate is different, so that the dielectric constants at different positions on the substrate are different.

S405: curing the mixed material coated on the substrate such that the mixed material coated on the substrate is integrated with the substrate to obtain a dielectric base having a non-uniform dielectric constant Board.

For example, a mixture of epoxy resin and ceramic powder coated on a substrate is cured. The curing method of the epoxy resin is a technique well known to those skilled in the art and will not be described herein.

In this embodiment, a material having a different dielectric constant from the substrate is uniformly mixed with the binder to obtain a mixed material, the mixed material is coated on the first position on the substrate, and then the coating is repeated at the first position. The material is coated with the mixed material at the second position of the substrate. In this embodiment, only the first position, the second position, and the third position of the coated substrate are listed. In a specific implementation process, the substrate can be coated. The fourth position, the fifth position, etc., are repeated, and finally the dielectric constant of the mixed material is gradiently changed on the substrate; the adhesive is cured, and the substrate having the first dielectric constant is coated with The above mixed material is formed into a whole, thereby obtaining a dielectric substrate having a non-uniform dielectric constant.

Embodiment 4

5 is a flow chart of a method for preparing a dielectric substrate according to Embodiment 4 of the present invention. The preparation method includes the following steps:

S501: a material having a first dielectric constant is used as a substrate, and a material having a second dielectric constant is uniformly mixed with the ultraviolet curable adhesive in a predetermined ratio to obtain a mixed material.

For example, a ceramic material having a second dielectric constant is mixed with a UV curable adhesive in a predetermined ratio, which is set so as not to affect the adhesion of the UV curable adhesive, and actual needs.

In the specific implementation process, ceramics can be made of mica, glass, plastic, or metal. S502: Covering the substrate on a position other than the first position, and coating the mixed material obtained in step S501 on the first position of the substrate.

For example, a mixed material of a ceramic material and an ultraviolet curable paste is applied to the first position of the substrate.

S503: The mixed material applied to the first position of the substrate is irradiated with ultraviolet rays to be cured.

For example, a mixture of a ceramic material and a UV curable gel applied to the first position of the substrate is irradiated with ultraviolet rays to be cured.

S504: covering the substrate with a position other than the first position and the second position, and coating the mixed material obtained in step S501 at the first position and the second position.

For example, in the first position of the substrate coated with the mixed material of the ultraviolet glue and the ceramic powder, the coating material of the ultraviolet glue and the ceramic powder is continuously coated, and the mixed material of the ultraviolet glue and the ceramic powder is not coated. The second position of the substrate is coated with a layer of a mixture of UV glue and ceramic powder.

S505: The mixed material applied to the first position and the second position of the substrate is irradiated with ultraviolet rays to be cured.

S506: covering the substrate with a position other than the first position, the second position, and the third position, and coating the mixed material obtained in step S501 on the first position, the second position, and the third position on the substrate.

S507: using a ultraviolet ray to irradiate a mixed material coated on the first position, the second position, and the third position of the substrate to be cured to obtain a dielectric base having a non-uniform dielectric constant Board.

For example, a mixture of the ultraviolet curable gel and the ceramic powder coated in the first position, the second position, and the third position of the substrate is cured.

In this embodiment, only the first position, the second position, and the third position of the coated substrate are listed. In a specific implementation, steps S506 and S507 may be continuously repeated, for example, the fourth position of the coated substrate. The fifth position or the like, the mixed material obtained in the step S501 finally coated on the substrate changes in a gradient. The thickness of the mixed material obtained in step S501 applied at different positions of the substrate is different, so that the dielectric constants at different positions on the substrate are different.

In this embodiment, a material having a different dielectric constant from the substrate is uniformly mixed with the ultraviolet curing glue to obtain a mixed material, and the mixed material is coated on the first position on the substrate, and is coated with the ultraviolet light in the first position. Mixing the material to cure it; then repeatedly applying the mixed material in the first position while coating the mixed material in the second position of the substrate, irradiating the mixed material coated in the first position and the second position with ultraviolet rays, The curing is repeated; finally, the dielectric constant of the mixed material is gradiently changed on the substrate, thereby obtaining a dielectric substrate having a non-uniform dielectric constant.

The embodiments of the present invention have been described in detail above, and the principles and implementations of the present invention are described in detail herein. The description of the above embodiments is only used to help understand the method of the present invention and its core ideas; The present invention is not limited by the scope of the present invention, and the details of the present invention are not limited by the scope of the present invention.

Claims

Claim

A method of preparing a dielectric substrate, comprising:

The method according to claim 1, wherein the coating the material having the second dielectric constant at the first position of the substrate comprises:

Covering the substrate on a position other than the first position;

Applying a layer of adhesive to the first location;

A material having a second dielectric constant is applied to the first location coated with the adhesive.

The method according to claim 2, further comprising: after coating the material having the second dielectric constant in the first position and the second position of the substrate, further comprising:

The adhesive is cured.

Mixing the material having the second dielectric constant uniformly with the binder in a predetermined ratio to obtain a mixed material;

Covering the substrate on a position other than the first position;

The mixed material is coated in the first position.

5. The method according to claim 4, wherein the adhesive is an ultraviolet curable adhesive.

The method according to claim 5, wherein after the coating the first material of the substrate, the method further comprises:

The mixed material applied to the first position of the substrate is irradiated with ultraviolet rays to be cured.

The method according to claim 6, wherein the coating the material having the second dielectric constant in the first position and the second position of the substrate comprises:

Shielding the substrate from the position other than the first position and the second position of the substrate,

Coating the mixed material in the first position and the second position;

The mixed material coated in the first position and the second position is irradiated with ultraviolet rays to be cured.

8. The method according to claim 4, wherein the adhesive is a binder other than the ultraviolet curable adhesive,

Correspondingly, coating the material having the second dielectric constant in the first position and the second position of the substrate, specifically comprising:

The mixed material is applied in the first position and the second position.

The method according to claim 8, wherein the method further comprises: All of the mixed materials coated on the substrate are cured.

10. The method of claim 1 further comprising: coating said second dielectric with said first location, said second location, and a third location of said substrate Constant material.

11. The method of claim 1 wherein said first dielectric constant is less than said second dielectric constant.