CN103296441B - Novel metamaterial and manufacturing process thereof - Google Patents

Novel metamaterial and manufacturing process thereof Download PDF

Info

Publication number
CN103296441B
CN103296441B CN201210050499.8A CN201210050499A CN103296441B CN 103296441 B CN103296441 B CN 103296441B CN 201210050499 A CN201210050499 A CN 201210050499A CN 103296441 B CN103296441 B CN 103296441B
Authority
CN
China
Prior art keywords
layer
composite layer
photosensitive composite
photosensitive
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210050499.8A
Other languages
Chinese (zh)
Other versions
CN103296441A (en
Inventor
刘若鹏
赵治亚
方小伟
郭文鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuang Chi Institute of Advanced Technology
Original Assignee
Kuang Chi Institute of Advanced Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuang Chi Institute of Advanced Technology filed Critical Kuang Chi Institute of Advanced Technology
Priority to CN201210050499.8A priority Critical patent/CN103296441B/en
Publication of CN103296441A publication Critical patent/CN103296441A/en
Application granted granted Critical
Publication of CN103296441B publication Critical patent/CN103296441B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laminated Bodies (AREA)

Abstract

The invention relates to a novel metamaterial and a manufacturing process thereof, wherein the metamaterial comprises at least one material sheet layer, each material sheet layer comprises a medium substrate, a photosensitive composite layer and a metal layer, the photosensitive composite layer is positioned between the medium substrate and the metal layer, and the metal layer is fixed on the medium substrate through the photosensitive composite layer. The manufacturing process of the novel metamaterial comprises the following steps: s1, horizontally placing and fixing the medium substrate on the workbench; s2, coating a photosensitive material on the medium substrate to form a photosensitive composite layer; s3, covering the artificial metal microstructure on the photosensitive composite layer to form a metal layer; and S4, irradiating the photosensitive composite layer with ultraviolet light to cure the photosensitive composite layer. The manufacturing process is simple, multiple materials can be selected as the metamaterial dielectric substrate through the manufacturing process to meet the requirements of different metamaterial electromagnetic properties, and meanwhile, the dielectric substrate and the metal pattern layer are combined more firmly.

Description

Novel metamaterial and manufacturing process thereof
Technical Field
The invention relates to the field of metamaterials, in particular to a novel metamaterial and a manufacturing process thereof.
Background
The metamaterial is a novel artificially synthesized material and has special electromagnetic response characteristics, so that the metamaterial can be widely applied to the fields of electromagnetic communication and the like. The metamaterial comprises at least one material sheet layer, wherein each material sheet layer comprises a flat plate-shaped dielectric substrate and an artificial metal microstructure attached to the dielectric substrate, the dielectric substrate is mainly a glass fiber epoxy resin solidified sheet, and the artificial metal microstructure is generally a metal wire with a certain geometric pattern such as an I-shaped shape, a snowflake shape, an open resonant ring shape and the like.
However, because the existing metamaterial manufacturing process uses the processing process of PCB, i.e. a metal foil layer is deposited on the surface of a dielectric substrate slice layer, after exposure plate making and development, the protective film of the region to be etched is removed, and during etching, the metal in the region is contacted with a chemical solution, dissolved and corroded, and the rest is a metal wire with a certain geometric shape pattern. Therefore, most of the dielectric substrates can only be made of materials with the main component of glass fiber, and brittle dielectric substrates such as ceramics cannot be used, so that the selectivity of the metamaterial dielectric substrate is greatly reduced. In addition, the metamaterial with the glass fiber as the dielectric substrate has high dielectric constant (epsilon) and dielectric loss tangent (Tan delta) which can cause signal attenuation when electromagnetic waves pass through the metamaterial made of the dielectric substrate.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a novel metamaterial and a manufacturing process thereof, aiming at the above-mentioned defects of the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows: a novel metamaterial is constructed and comprises at least one material sheet layer, wherein each material sheet layer comprises a medium substrate, a photosensitive composite layer and a metal layer, the photosensitive composite layer is located between the medium substrate and the metal layer, and the metal layer is fixed on the medium substrate through the photosensitive composite layer.
Further, the photosensitive composite layer may be made of an epoxy resin containing a photosensitive curing agent.
Further, the epoxy resin may be bisphenol a type epoxy acrylate or urethane acrylate.
Further, the thickness of the photosensitive composite layer does not exceed 1 mm.
Further, the dielectric substrate is made of a high molecular polymer material, a ceramic material, a polytetrafluoroethylene material, a ferroelectric material, a ferrite material, or a ferromagnetic material.
Furthermore, the metal layer is composed of a plurality of artificial metal microstructures arranged in an array.
The invention also provides a manufacturing process of the novel metamaterial, which comprises the following steps:
s1, horizontally placing and fixing the medium substrate on the workbench;
s2, coating a photosensitive material on the medium substrate to form a photosensitive composite layer;
s3, covering the artificial metal microstructure on the photosensitive composite layer to form a metal layer;
and S4, irradiating the photosensitive composite layer with ultraviolet light to cure the photosensitive composite layer.
Further, in step S2, the photosensitive material is coated on the dielectric substrate by screen printing or uniform spraying.
Further, in step S3, after the artificial metal microstructure is covered on the photosensitive composite layer, an external force is applied to bond the metal layer and the dielectric substrate.
Further, the step S4 is performed under a vacuum environment, and the irradiation is continued for 2-10 minutes.
The novel metamaterial and the manufacturing process thereof have the following beneficial effects: the manufacturing process is simple, multiple materials can be selected as the metamaterial dielectric substrate through the manufacturing process to meet the requirements of different metamaterial electromagnetic properties, and meanwhile, the dielectric substrate and the metal pattern layer are combined more firmly.
Drawings
FIG. 1 is a schematic structural diagram of one embodiment of the novel metamaterial;
fig. 2 is a flow chart of a process for making the novel metamaterial of the present invention.
Detailed Description
Referring to fig. 1, the present invention relates to a novel metamaterial, which includes a material sheet, where the material sheet includes a dielectric substrate 1, a photosensitive composite layer 2 and a metal layer, and the dielectric substrate 1 may be made of a polymer material, a ceramic material, a teflon material, a ferroelectric material, a ferrite material, or a ferromagnetic material. In the present embodiment, the dielectric substrate 1 is made of a material other than glass fiber epoxy resin, such as polytetrafluoroethylene, so that a low dielectric constant (epsilon) and a low dielectric loss tangent (Tan delta) can be obtained, thereby causing no problem of signal attenuation when electromagnetic waves pass through a metamaterial made of the dielectric substrate.
The photosensitive composite layer 2 is located between the medium substrate 1 and the metal layer, and the metal layer is fixed on the medium substrate 1 through the photosensitive composite layer 2. The photosensitive composite layer 2 may be made of an epoxy resin containing a photosensitive curing agent, and the epoxy resin as a photosensitive material may be bisphenol a type epoxy acrylate or urethane acrylate, or the like. In this embodiment, the photosensitive composite layer 2 is made of bisphenol a type epoxy acrylate containing a photosensitive latent curing agent, which can be mixed with epoxy resin to form a one-liquid type complex, thereby simplifying the preparation procedure of epoxy resin application. The bisphenol A epoxy acrylate has the advantages of high curing speed, good chemical solvent resistance of a coating film, high hardness and the like.
The thickness of the photosensitive composite layer 2 is only 1mm, the total volume is small, the gravity is light, and the application to the occasions such as antenna housing is convenient. To achieve the desired physical properties, metamaterials typically include multiple material sheets, which are typically stacked together parallel to each other and then integrated by a packaging process. The stacked structure has the advantages of simple positioning and packaging.
The metal pattern layer is composed of a plurality of artificial metal microstructures 3 arranged in an array, and the artificial metal microstructures 3 are distributed on the surface of the medium substrate 1 and are usually metal wires with a certain geometric shape, such as an I-shaped shape, a snowflake shape, an open resonant ring and the like. Due to the existence of the artificial metal microstructures 3, the metamaterial formed by the medium substrate 1 and the artificial metal microstructures 3 can respond to an electric field and a magnetic field, so that the propagation direction of electromagnetic waves is changed, and the effects of converging, diverging, deflecting and the like of the electromagnetic waves are caused. In this embodiment, the artificial metal microstructure 3 is in an i shape, and the thickness of the metal layer is 1 mm.
Please refer to fig. 2. The preparation process of the novel metamaterial sequentially comprises the following steps of:
s1, horizontally placing and fixing the medium substrate 1 on a workbench;
s2, coating a photosensitive material on the medium substrate 1 to form a photosensitive composite layer 2;
s3, covering the artificial metal micro-structure 3 on the photosensitive composite layer 2 to form a metal layer;
s4, the photosensitive composite layer 2 is irradiated with ultraviolet light to cure the photosensitive composite layer 2.
In step S2, a photosensitive material is coated on the dielectric substrate 1 by screen printing or uniform spraying.
In the step S3, after the artificial metal microstructure 3 is covered on the photosensitive composite layer 2, an external force of about 0.1MPa is applied to bond the metal pattern layer and the dielectric substrate 1.
And the step S4 is carried out in a vacuum environment, the ultraviolet light irradiates other surfaces of the photosensitive material except the surface where the metal layer is positioned for 2-10 minutes, and the manufacturing process is simple and efficient, and is convenient for large-scale mass production.
In summary, the manufacturing process of the invention is simple, and various materials can be selected as the dielectric substrate 1 of the metamaterial by the manufacturing process to meet the requirements of different metamaterial electromagnetic properties, and meanwhile, the dielectric substrate 1 and the metal pattern layer are combined more firmly.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (7)

1. A novel metamaterial comprises at least one material sheet layer, and is characterized in that each material sheet layer comprises a medium substrate, a photosensitive composite layer and a metal layer, wherein the photosensitive composite layer is located between the medium substrate and the metal layer, and the metal layer is fixed on the medium substrate through the photosensitive composite layer; the metal layer is composed of a plurality of artificial metal microstructures which are arranged in an array;
the dielectric constant and the dielectric loss tangent of the dielectric substrate do not cause signal attenuation when electromagnetic waves pass through the novel metamaterial;
the photosensitive composite layer is made of bisphenol A type epoxy acrylate containing a photosensitive latent curing agent.
2. A novel metamaterial according to claim 1, wherein the photosensitive composite layer has a thickness of no more than 1 mm.
3. A novel metamaterial according to claim 1 or 2, wherein the dielectric substrate is made of a high polymer material, a ceramic material, a teflon material, a ferroelectric material, a ferrite material, or a ferromagnetic material.
4. The manufacturing process of the novel metamaterial according to claim 1, comprising the following steps:
s1, horizontally placing and fixing the medium substrate on the workbench;
s2, coating a photosensitive material on the medium substrate to form a photosensitive composite layer, wherein the thickness of the photosensitive composite layer is not more than 1mm, and the photosensitive composite layer is made of epoxy resin containing a photosensitive curing agent;
s3, covering the artificial metal microstructure on the photosensitive composite layer to form a metal layer;
and S4, irradiating the photosensitive composite layer with ultraviolet light to cure the photosensitive composite layer.
5. The manufacturing process of claim 4, wherein in step S2, the photosensitive material is coated on the dielectric substrate by silk-screen printing or uniform spraying.
6. The manufacturing process according to claim 4 or 5, wherein in step S3, after the artificial metal microstructure is covered on the photosensitive composite layer, an external force is applied to bond the metal pattern layer and the dielectric substrate.
7. The manufacturing process according to claim 4 or 5, wherein the step S4 is performed in a vacuum environment and the irradiation is continued for 2-10 minutes.
CN201210050499.8A 2012-02-29 2012-02-29 Novel metamaterial and manufacturing process thereof Active CN103296441B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210050499.8A CN103296441B (en) 2012-02-29 2012-02-29 Novel metamaterial and manufacturing process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210050499.8A CN103296441B (en) 2012-02-29 2012-02-29 Novel metamaterial and manufacturing process thereof

Publications (2)

Publication Number Publication Date
CN103296441A CN103296441A (en) 2013-09-11
CN103296441B true CN103296441B (en) 2021-10-19

Family

ID=49096971

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210050499.8A Active CN103296441B (en) 2012-02-29 2012-02-29 Novel metamaterial and manufacturing process thereof

Country Status (1)

Country Link
CN (1) CN103296441B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107057332B (en) * 2017-06-12 2020-01-24 深圳永昌和科技有限公司 3D printing metamaterial with good controllability and preparation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743919A (en) * 1986-10-07 1988-05-10 Hughes Aircraft Company Microwave frequency selective surface having fibrous ceramic body
CN1114666A (en) * 1994-02-22 1996-01-10 雷夫伦消费产品公司 Revlon consumer products corporation
CN1119176A (en) * 1994-02-22 1996-03-27 雷夫伦消费产品公司 Decorating method and products
CN101359691A (en) * 2008-09-11 2009-02-04 电子科技大学 Thin-film transistor and manufacture method thereof
CN101630122A (en) * 2008-07-16 2010-01-20 晟铭电子科技股份有限公司 Light guide plate and manufacturing method thereof
CN101765358A (en) * 2008-12-25 2010-06-30 西北工业大学 Meta-material absorber based on dendritic structure
CN102208554A (en) * 2011-04-18 2011-10-05 电子科技大学 Substrate for flexible luminous device and preparation method thereof
CN102280703A (en) * 2011-05-13 2011-12-14 东南大学 Zero-refractive index flat plate lens antenna based on electric resonance structure
CN102299422A (en) * 2011-05-18 2011-12-28 东南大学 Zero-refractive-index flat lens antenna based on magnetic resonance structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8271241B2 (en) * 2005-01-18 2012-09-18 University Of Massachusetts Lowell Chiral metamaterials
CN100537243C (en) * 2005-12-29 2009-09-09 研能科技股份有限公司 Ink cartridge having convex cylinder

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743919A (en) * 1986-10-07 1988-05-10 Hughes Aircraft Company Microwave frequency selective surface having fibrous ceramic body
CN1114666A (en) * 1994-02-22 1996-01-10 雷夫伦消费产品公司 Revlon consumer products corporation
CN1119176A (en) * 1994-02-22 1996-03-27 雷夫伦消费产品公司 Decorating method and products
CN101630122A (en) * 2008-07-16 2010-01-20 晟铭电子科技股份有限公司 Light guide plate and manufacturing method thereof
CN101359691A (en) * 2008-09-11 2009-02-04 电子科技大学 Thin-film transistor and manufacture method thereof
CN101765358A (en) * 2008-12-25 2010-06-30 西北工业大学 Meta-material absorber based on dendritic structure
CN102208554A (en) * 2011-04-18 2011-10-05 电子科技大学 Substrate for flexible luminous device and preparation method thereof
CN102280703A (en) * 2011-05-13 2011-12-14 东南大学 Zero-refractive index flat plate lens antenna based on electric resonance structure
CN102299422A (en) * 2011-05-18 2011-12-28 东南大学 Zero-refractive-index flat lens antenna based on magnetic resonance structure

Also Published As

Publication number Publication date
CN103296441A (en) 2013-09-11

Similar Documents

Publication Publication Date Title
Akamatsu et al. Site-selective direct silver metallization on surface-modified polyimide layers
TWI695226B (en) Composition for forming layer to be plated, film with precursor layer to be plated, film with patterned layer to be plated, conductive film and touch panel
JPS61168291A (en) Roughing for surface of substrate
JP2016213435A (en) Manufacturing method for conductive laminate, conductive laminate, and touch sensor
CN113897163B (en) Adhesive, chip bonding film and preparation method thereof
TWI661339B (en) Conductive laminated body for touch panel, touch panel, transparent conductive laminated body
TWI696098B (en) Touch sensor panel and substrate
CN1327255C (en) Three dimensional periodic structure and method of producing the
TW593196B (en) Photosensitive ceramics composition and multi-layer substrate using it
CN109041425B (en) Method for manufacturing COF double-sided flexible substrate fine circuit and product thereof
CN108884568B (en) Method for producing conductive laminate, and conductive laminate
US20210059042A1 (en) Electromagnetic Shielding Film and Shielded Printed Wiring Board Including the Same
CN103296441B (en) Novel metamaterial and manufacturing process thereof
CN108778710B (en) Film with plated precursor layer, film with patterned plated layer, conductive film, and touch panel
US11414554B2 (en) Conductive coating material and production method for shielded package using conductive coating material
TW201542052A (en) Method of fabricating substrate structure and substrate structure fabricated by the same method
JP2010077322A (en) Composition for forming plated layer, production method for metal pattern material and metal pattern material obtained thereby, and production method for surface metal film material and surface metal film material obtained thereby
JP2019077097A (en) Transparent conductive film
KR101238966B1 (en) Method for manufacturing circuit board, and circuit board obtained using the manufacturing method
JP2019083347A (en) Method for manufacturing conductive pattern substrate
KR101351619B1 (en) Mold for forming optical pattern and method for manufacturing the same
CN108738236B (en) Method for manufacturing COF single-side flexible substrate fine circuit and product thereof
KR101311450B1 (en) Soft-mold and fabricating method of the same, and fabricating method of optical flim using the same
WO2023189250A1 (en) Conductive film and display device
CN105974730A (en) Preparation method of SU8 array micro-reaction pool

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: SHENZHEN KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOG

Free format text: FORMER OWNER: SHENZHEN KUANG-CHI INNOVATION TECHNOLOGY CO., LTD.

Effective date: 20141030

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518034 SHENZHEN, GUANGDONG PROVINCE TO: 518057 SHENZHEN, GUANGDONG PROVINCE

TA01 Transfer of patent application right

Effective date of registration: 20141030

Address after: 518057 Guangdong City, Nanshan District province high tech Zone in the middle of a high tech building, building No. 2, No. 9, building

Applicant after: Shenzhen Kuang-Chi Institute of Advanced Technology

Address before: 518034 A international business center, No. 1061, Xiang Mei Road, Guangdong, Shenzhen, Futian District, China 18B

Applicant before: Shenzhen Kuang-Chi Innovation Technology Co., Ltd.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant